Abstract: A display device includes a substrate including a display area to display an image and a pad area positioned around the display area; a first pad unit disposed on the pad area, and including a first terminal region having a plurality of first pad terminals arranged in a first direction; and a printed circuit board including a base film and a second pad unit positioned at one side of the base film, the second pad unit being coupled with the first pad unit by electrically connecting with the plurality of first pad terminals.

Abstract: A display device includes a display panel. A flexible printed circuit board is electrically connected to the display panel. A first pad is disposed on the display panel. A second pad is disposed on the flexible printed circuit board and overlaps the first pad. A first anisotropic conductive film is disposed between the first pad and the second pad. The first anisotropic conductive film is configured to bond the first pad to the second pad. The first anisotropic conductive film includes a conductive polymer. The first anisotropic conductive film includes at least one first conductive region that electrically connects the first pad and the second pad and at least one first insulating region.

Abstract: A display apparatus and the flexible circuit board thereof are provided. A flexible circuit board, includes: a flexible substrate; a driving chip disposed on the flexible substrate, wherein the driving chips is configured to form a driving signal; a plurality of binding pins disposed on at least one side of the flexible substrate, wherein the binding pins are configured to bind and connect an external signal line to the driving chip; and a binding mark disposed on the flexible substrate and positioned at a pin area within two outermost binding pins of the binding pins, wherein the binding mark is configured to perform an alignment operation of the flexible substrate being applied with a binding operation.

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

Abstract: An electronic apparatus (100) has an electronic device (151), a power supply plane (121) and a power supply plane (122) disposed with a gap (123) therebetween, a connection member (152) that electrically connects the power supply plane (122) and the electronic device (151), a ground plane (141) facing the power supply plane (121) or the power supply plane (122), a connection member (153) that electrically connects the ground plane (141) and the electronic device (151), a plurality of conductor elements (131) that is repeatedly arrayed, and open stubs (111) formed at a location overlapping the gap (123) included in an area surrounded by the conductor elements (131). In addition, at least some of the open stubs (111) face the power supply plane (122) which is not in contact with the open stubs (111).

Abstract: An electronic device includes a first component electrically coupled to a second component. The first component and the second component are coupled by the base of a spring loaded connector.

Abstract: A cover panel is disposed on a surface of an electronic apparatus and is made of sapphire. A flexible printed wiring board extends in a state of being curved in the electronic apparatus. A gap reduction member is in contact with at least a curved portion of the flexible printed wiring board from the cover panel side.

Abstract: A substantially cable-free board connection assembly may include a plurality of printed circuit boards (PCBs) forming an interconnect plane for a plurality of electronic devices respectively attached to a plurality of plane boards included in the interconnect plane. An insertion direction for substantially all connectors is substantially perpendicular to a face of the interconnect plane. At least a portion of the board connection assembly is mounted to a support structure via a flexible connection.

Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.

Abstract: A memory module includes persistent-storage memory chips and an auxiliary voltage connector for powering the persistent-storage memory chips. An auxiliary power cable has a first end coupled to an electronic power source on the system board and has a second end having connector that plugs in to the auxiliary voltage connector on the memory module to provide power to the persistent-storage memory chips. The auxiliary power cable also resists movement of a latch lever to require disconnecting the auxiliary power cable before ejecting the memory module.

Abstract: A signal test apparatus for a serial attached Small Computer System Interface (SAS) device includes an SAS female connector to be connected to the SAS device, an SAS male connector to be connected to a server, first and second pairs of subminiature version A (SMA) connectors, and first and second groups of switches. When the first pair of SMA connectors is connected to an oscillograph to test a pair of output signals from the SAS device, the second group of switches are turned on and the first group of switches are turned off to communicate the SAS device with the server. When the second pair of SMA connector is connected to the oscillograph to test another pair of output signals from the SAS device, the first group of switches are turned on and the second group of switches are turned off to communicate the SAS device with the server.

Abstract: A signal detection apparatus for a serial attached SCSI (SAS) device includes an SAS female connector to be connected to a SAS device, an SAS male connector to be connected to a system, and first to fourth pairs of subminiature version A (SMA) connectors. When the first pair of SMA connectors is connected to an oscillograph to detect a pair of output signals from the SAS device, the second and third pairs of SMA connectors connect the SAS device with the system. When the second pair of SMA connector is connected to the oscillograph to detect another pair of output signals from the SAS device, the first and fourth pairs of SMA connectors connect the SAS device with the system.

Abstract: An electronic part includes an electronic part body, an electrode terminal that protrudes from the electronic part body, and that electrically connects the electronic part to an external electrode when a flexible conductor is joined to an electrode surface, and a holder made of an insulating material, and joined to the electronic part body. The holder is interposed between a mounting plate and the electronic part body when the electronic part is mounted to the mounting plate, and the holder is in contact with a surface of the electrode terminal opposite from the electrode surface.

Abstract: A semiconductor module system includes a substrate, at least one semiconductor chip, and a number of at least two electrically conductive first connecting elements. The substrate has a bottom side and a top side spaced apart from the bottom side in a vertical direction. The at least one semiconductor chip is arranged on the top side. Each one of the first connecting elements has a first end which protrudes away from an insulation carrier of the substrate in a direction perpendicular to the vertical direction. The semiconductor system further includes a connecting system with a number of N?1 connectors. A first one of the connectors includes at least two electrically conductive second connecting elements. Each one of the second connecting elements has a first end. The first end of each one of the first connecting elements is electrically conductively connectable to the first end of one of the second connecting elements.

Abstract: A memory unit for a computing device is described. The memory device can include a number of memory chips, such as flash nand chips, linked together via a flexible circuit connector. During installation of the memory device, portions of the flexible circuit connector can be bent or folded in different locations to allow an orientation of the memory chips to be changed relative to one another. In one embodiment, a memory device with a number of chips can be provided in a flat configuration and then can be folded to allow the chips to be installed in a stacked configuration. In another embodiment, the flexible circuit connector can be grounded to other conductive components to allow the flexible circuit connector to be used as part of a faraday cage surrounding the memory chips.

Abstract: Aspects of the disclosure are directed to an apparatus that is used to provide a circuit layer via a supportive substrate or material layer having an upper surface and having edge surfaces configured and arranged to define patterned aperture channels. The material layer includes an array of patterned islands which provide an upper surface of the material layer for securing and supporting circuitry. The patterned islands are flexible due, for example, to patterned flexures located between and connecting the islands.

Abstract: Some embodiments of the inventive subject matter are directed to a first circuit board configured to include an electronic component. The electronic component includes a plurality of leads. The first circuit board includes first wires configured to connect to a first portion of the plurality of leads. The second circuit board is affixed to the first circuit board. The second circuit board includes second wires. The second circuit board is smaller in size than the first circuit board. A plurality of electrical connectors extend through a thickness of the first circuit board and are configured to connect a second portion of the plurality of leads to the second wires.

Abstract: Provided herein are methods, devices, and systems that relate to electromagnetic interference (EMI) filters that, in certain embodiments, comprise: (a) a housing comprising a substantially enclosed first compartment and a substantially enclosed second compartment; (b) a first circuit card located in the first compartment of the housing that converts a signal transmitted on a conductive based medium to a signal transmitted on a non-conductive based medium; (c) a second circuit card located in the second compartment of the housing that converts a signal transmitted on a non-conductive based medium to a signal transmitted on a conductive based medium; (d) at least one non-conductive based medium that transmits a signal from the first circuit card to the second circuit card; and (e) at least one waveguide through which the non-conductive based medium passes from the first compartment to the second compartment.

Abstract: An overfill probe is utilized in each compartment of a multi-compartment transport tanker and has a depending sensing tube for detecting liquid overfill conditions. An overfill detector is within the bottom end of the probe tube and is thus protected from damage. Internal damage to the probe and malfunction of the system also precluded by connecting the exposed cap of the probe to the detector by a longitudinally extensible, stretchable cable extending through the tube to the detector, or a circuit board may be retained within the depending tube. Additionally, a thermistor socket and an optic socket are provided which are part of the overfill protection system, each having contact connections that may be readily replaced when worn without removing or replacing the wiring within the socket assembly.

Abstract: A system to mate logic nodes may include a connector to secure at least one of an inter-nodal circuit and a fabric bus, where the inter-nodal circuit provides communications between any connected logic nodes, and the fabric bus provides logical connections to a first logic node and any other logic node. The system may also include an element carried by the connector configured to provide an appropriate actuation force to mate the connector and at least one of the inter-nodal circuit and the fabric bus.

Abstract: An enclosure for outside plant equipment includes a base unit and first Printed Circuit Board (PCB) carried by the base unit and having a circuit side and opposing component side on which electronic components are mounted. A heat sink is connected to the first PCB at the circuit side and configured to dissipate heat from any electronic components mounted on the first PCB at the component side. A cover is attached to the base unit and has an inside surface covering the enclosure. A second PCB has a circuit side and opposing component side on which electronic components are mounted. The second PCB is supported by the inside surface of the cover. A heat sink is connected to the second circuit board at the circuit side and configured to dissipate heat from any electronic components mounted on the second PCB. A PCB finger connector interconnects the first and second PCB's at the component side.

Abstract: A display device includes a substrate, a display region having pixels on the substrate, a drive circuit element mounted on a peripheral portion of the substrate, a plurality of terminal portions formed on the peripheral portion and arranged on a mounting portion of the drive circuit element, and a plurality of wiring lines prolonged from the terminal portions to the outside of the mounting portion of the substrate. The terminal parts are arranged to two lines of the plurality of wiring lines along one end of the mounting portion, a plurality of bumps connected to each of the terminal portions by an anisotropic conductive film are formed on the plane facing the terminal portion of the drive circuit element, a part of the plurality bumps include a first bump and a second bump which is adjoined close to the first bump.

Abstract: A liquid crystal display module includes: a liquid crystal display panel; a backlight light source; a casing enclosing the liquid crystal display panel and the backlight light source; a first flexible printed wiring board electrically connected to the liquid crystal display panel and a second flexible printed wiring board connected to the backlight light source, the first flexible printed wiring board and the second flexible printed wiring board being led out from an exit formed in an identical side of the casing to an outside of the casing in a state of being superposed on each other and being bent to a rear surface side of the casing; and a connecting part for electrically connecting the second flexible printed wiring board to the first flexible printed wiring board, the connecting part being formed on the outside of the casing.

Abstract: A connection structure for connecting a wiring board to a to-be-connected body having electric contacts, the wiring board including: a base having board-side contacts provided on its facing surface that is to face the to-be-connected body; and a cover film which covers the facing surface except the board-side contacts and a non-covered partial region of the facing surface, the connection structure including: conduction portions formed of electrically conductive resin, for bonding the electric contacts and the board-side contacts to permit electrical conduction therebetween; and a reinforcement portion formed of the same resin as the conduction portions and disposed at a position which is different from positions of the conductive portions and at which the reinforcement portion extends across both of a surface of the cover film and a surface of the non-covered partial region of the base, the reinforcement portion bonding the to-be-connected body and the wiring board for reinforcing connection therebetween.

Abstract: A tape carrier package (TCP) includes a base film, an integrated circuit (IC) chip and an output pad group. The IC chip is formed on the base film. The output pad group is formed on a first end of the base film. The output pad group includes a plurality of output blocks having a plurality of output pads, wherein the plurality of output pads in an output block have substantially the same width as each other. The widths of the output pads from one output block to another output block are different from each other.

Abstract: The invention relates to a protective device for an electronic component including at least one pin to be electrically connected to an electronic system. The device includes at least one flexible printed circuit including first and second opposite surfaces, a central portion including a through opening for receiving the pin, and flaps connected to the central portion. The printed circuit is made of two insulation layers and includes at least one first conducting track between the two insulating layers, connecting the pin to the electronic system, a second conducting track extending on the first surface, and a third conducting track extending on the second surface. The flaps are folded back at least partially onto each other in order to encapsulate the pin and to electrically connect the second and third conducting tracks.

Abstract: An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.

Abstract: A printed circuit board comprising a hard portion of at least one main hard PCB, and at least one secondary hard PCB; and a flexible portion to connect the main hard PCB to the secondary hard PCB both physically and electrically and enabling the secondary hard PCB to move in relation to the main hard PCB.

Abstract: A junction structure and a joining method of substrates are provided that stably can join the substrates and achieve high workability during joining. A second substrate 2 to be joined with solder to a first substrate 1 is bent with elasticity generated by a bending portion 9, and first joints 5 on the first substrate 1 and second joints 6 on the second substrate 2 are joined with solder in a state in which the first substrate 1 is brought into contact with, in a direction that increases the bending angle of the bending portion 9, a part where the joints 6 are formed on the second substrate 2.

Abstract: A conductor carrier includes a base insulating film, a contact insulating film, at least one first printed conductor and one second printed conductor. The contact insulating film includes at least one first recess and one second recess. The printed conductors are embedded between the two insulating films and each forms a first overlapping region with the first or second recess of the contact insulating film. The conductor carrier also includes an insulating region which separates the first printed conductor from the second printed conductor in an insulating manner due to the contact insulating film being less raised than outside the insulating region, and extends between the first and second recesses of the contact insulating film in a meandering manner. A configuration having the conductor carrier is also provided.

Abstract: The memory module includes a plurality of memory devices, a first connector and a second connector. The first connector is disposed at a first position on the memory module. The first connector is configured to carry low-speed signals for the memory devices. The second connector is disposed at a second position on the memory module, different from the first position. The second connector is configured to carry high-speed signals for at least one of the memory devices. The high-speed signals are a higher speed form of signaling than the low-speed signals. The memory system may include at least one slot electrically connected to a chip set and at least one memory module electrically connected to the slot via the first connector. A transmission line such as a fiber optic cable electrically connects the second connector and the chip set.

Abstract: The FPC that is designed to have the special shape, an elastic portion, can shorten its length by elastic force after it is turned over to the reverse side of the light source unit for achieving the purposes without wasting any space of the LCD module and incurring the inconvenience of user.

Abstract: A carrier assembly for an integrated circuit is disclosed. The carrier assembly has a retainer with electrical contacts for receiving the integrated circuit, and island defining portions arranged about the retainer. Each island defining portion is connected to neighboring island defining portions through a serpentine member. This connection allows resilient deflection between the island defining portions.

Abstract: An embodiment of a printed circuit board according to the present invention is provided with an insulating layer, a conductive layer that is laminated on the insulating layer and that has a connecting portion and a circuit pattern portion formed connected to the connecting portion, and a film cover layer that covers the insulating layer and the conductive layer via an adhesive layer and that has an opening for connecting a mounted component to the connecting portion. The circuit pattern portion is provided with a recessed portion that is concave with respect to the connecting portion.

Abstract: A carrier assembly for an integrated circuit is described. The assembly includes a retainer for receiving the integrated circuit, and island defining portions surrounding the retainer. Each island defining portion is connected to neighboring island defining portions through a serpentine member. This arrangement allows resilient deflection between the island defining portions.

Abstract: A display device is arranged such that a voice device is laminated on a liquid crystal panel so as to be confined in a planar area of the liquid crystal panel, and a voice-system circuit block which drives the voice device is formed on the thin film substrate of the liquid crystal panel. A signal is inputted into the voice-system circuit block through an FPC which is connected to the thin film substrate and which inputs a video signal, and the signal processed at the voice-system circuit block is conducted through the FPC. A connecting terminal part is provided in a middle portion of the FPC and adhered to an FPC. One end of the FPC is connected to the voice device. In this way, a multifunctional display device can be achieved at low cost by efficiently using a limited space around the display element without sacrificing the advantages of a lightweight and thin-shaped flat display device.

Abstract: Electronic devices may be provided with one or more electrical components that may be coupled to one or more circuit boards by flexible circuits that can have reduced ground lengths. Each flexible circuit can include at least one ground conductor that may run along its length and that may have at least one portion exposed for coupling to a grounding element that may also be coupled to a ground plane.

Abstract: A circuit board apparatus of a battery pack in which tape is attached to low priced flexible printed circuit boards (FPCB) so that it is possible to prevent cracks from being generated in the FPCBs when the FPCBs are bent. The circuit board apparatus includes a first board, a second board, and a bendable third board with one side electrically connected to one side of the first board, and the other side electrically connected to one side of the second board. The first board is oblique to the second board, or the first board is substantially perpendicular to the second board. Protective tape is provided on a first region where the first board and the third board overlap, and in a second region where the second board and the third board overlap.

Abstract: Apparatus and method for communicating high-speed signals between a primary printed circuit board and one or more secondary printed circuit boards. The high-speed signals are communicated between the primary printed circuit boards and the secondary printed circuit boards through multi-layer flexible conductors.

Abstract: A connecting substrate includes a first conductive member; an insulating layer; and a second conductive member, the first conductive member and the second conductive member facing each other via the insulating layer, in which wherein an end portion of either one of the first conductive member and the second conductive member extends past an end portion of the other conductive member and past an end portion of the insulating layer.

Abstract: Multiple fully buffered DIMM circuits or instantiations are presented in a single module. In a preferred embodiment, memory integrated circuits (preferably CSPs) and accompanying AMBs are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete FB-DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile.

Abstract: An IC die and a flexible circuit structure are integrated into a lower stack element that can be stacked with either further integrated lower stack element iterations or with pre-packaged ICs in any of a variety of package types. The present invention may be employed to stack similar or dissimilar integrated circuits and may be used to create modularized systems. In a preferred embodiment, a die is positioned above the surface of portions of a pair of flex circuits. Connection is made between the die and the flex circuitry. A protective layer such as a molded plastic, for example, is formed to protect the flex-connected die and its connection to the flex. Connective elements are placed along the flex circuitry to create an array of module contacts along the second side of the flex circuitry. The flex circuitry is positioned above the body-protected die to create an integrated lower stack element.

Abstract: A flexible circuit is populated with integrated circuits. Integrated circuits populated on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. In a preferred embodiment, the overall module profile does not, consequently, include the thickness of the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flex circuit may be aligned using tooling holes in the flex circuit and substrate. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers. Other embodiments may stagger or offset the ICs.

Abstract: Provided is a carrier assembly for an integrated circuit. The assembly includes a carrier having a matrix of island contacts interconnected by respective serpentine members to allow resilient deflection between such contacts, said matrix surrounding a passage defined through the carrier. The assembly also includes a retainer for operatively locating the integrated circuit within said passage so that the integrated circuit is electrically connected to the carrier.

Abstract: A transponder assembly for use with fiber optic digital communication cables having multiple parallel optic fiber elements. The transponder assembly features a transmitter port and receiver port for connection with separate parallel optic cables for separately transmitting and receiving data and an electrical connector for connecting with computer or communication systems. The transponder assembly includes a parallel optic transmitter module and a parallel optic receiver module having pluggable edge connectors. The assembly also includes a circuit board on which a semiconductor chip useful for signal processing and the electrical connector are mounted. A flex circuit is used in connecting the circuit board to the parallel optic modules. The semiconductor chip and electrical connector are mounted directly across from one another on opposite surfaces of the circuit board.

Abstract: A display device is arranged such that a voice device (2) is laminated on a liquid crystal panel (1) so as to be confined in a planar area of the liquid crystal panel (1), and a voice-system circuit block which drives the voice device (2) is formed on the thin film substrate (10) of the liquid crystal panel (1). A signal is inputted into the voice-system circuit block through an FPC (4) which is connected to the thin film substrate (10) and which inputs a video signal, and the signal processed at the voice-system circuit block is conducted through the FPC (4). A connecting terminal part (4a) is provided in a middle portion of the FPC (4) and adhered to an FPC (5). One end of the FPC (5) is connected to the voice device (2). In this way, a multifunctional display device can be achieved at low cost by efficiently using a limited space around the display element without sacrificing the advantages of a lightweight and thin-shaped flat display device.

Abstract: An improved printed circuit board (PCB) includes first and second substrates, which are disposed being distanced or spaced mutually and in which at least one or more semiconductor chips are mounted, and a signal transmission part for providing a signal transmission path between the first and second substrates, the signal transmission part being extended out of a region having a size smaller than a maximum size of the first substrate within the first substrate, and being extended in the second substrate. In disposing two substrates in a spaced-apart structure of upper and lower positions, a length of flexible printed circuit (FPC) connecting the two substrates can be reduced, and an impedance mismatching caused in use of the FPC can be reduced.

Abstract: An electronic control device includes a multilayered flexible substrate and first to fourth spacers disposed in a casing. The multilayered flexible substrate, including first to third rigid substrate portions, is folded in a multilayered arrangement in such a manner that each rigid substrate portion is sandwiched between two spacers. The first rigid substrate portion is disposed at the lowest position to arrange a lowermost layer. The second rigid substrate portion is folded upward relative to the first flexible portion by 180 degrees to arrange an intermediate layer. The third rigid substrate portion is folded upward relative to the second flexible portion by 180 degrees to arrange an uppermost layer. The card edge connectors are laminated or layered with predetermined gaps and positioned in a case opening.

Abstract: A flexible display device includes: a flexible substrate which constitutes at least part of an envelope of the flexible display device; a plurality of pixels disposed on the flexible substrate; a group of terminals which is formed at a first portion on one surface of the flexible substrate and supplies signals to the plurality of pixels; and a reinforcing member attached to at least a second portion on another surface of the flexible substrate which faces the first portion across a thickness of the flexible substrate.

Abstract: An integrated circuit (IC) carrier assembly includes a printed circuit board (PCB). A carrier is soldered to the PCB. The carrier includes a grid of electrical contact islands surrounding a receiving zone for receiving an IC. Pairs of adjacent islands are interconnected by respective resilient suspension means. The IC is received in the receiving zone and is electrically coupled to a number of the plurality of islands adjacent to the receiving zone. The IC is fast to a retainer, and the retainer is fast with the number of the plurality of islands and the IC.