Abstract: A first circuit board connectable to a second circuit board is disclosed. The first circuit board includes at least one set of contacts, a detection circuit, and a voltage generator. Each set of contacts is configured to receive an electrically conductive keypin for bridging a set of the contacts. The detection circuit is in signal communication with the contacts and produces a logic signal in response to a set of the contacts being bridged. The voltage generator is responsive to the logic signal and produces a voltage signal at a connector connectable to the second circuit board. The voltage signal at the connector has a first voltage in response to the keypin being disposed at a first location, and a second different voltage in response to the keypin being disposed at a second location, wherein at least one of the pin locations results in a set of the contacts being bridged.

Abstract: A printed circuit board includes circuit lines having different transmission characteristics. In the printed circuit board, mounted components are connected to each other at a plurality of points by an anisotropic conductive film (ACF) adhesion by using a flexible circuit board (FPC) which includes transmission lines formed of circuit line patterns having transmission characteristics optimal to signals. This structure enables the printed circuit board to be easily designed, and be also made smaller.

Abstract: To prevent the peeling-off of a drive circuit chip from an insulation substrate of a display device attributed to a residual stress between terminals formed on the insulation substrate and bumps formed on a mounting surface of a drive circuit chip, as well as to stabilize the connection resistance therebetween, the present invention provides an auxiliary bump for one of the bumps on the mounting surface of the drive circuit chip at an end edge side thereof with respect to the one of the bumps and arranges the auxiliary bump electrically in contact with one of the terminals formed on the insulation substrate of the display device with which the one of the bumps also is in electrical contact.

Abstract: A self-contained and encapsulated AC to Voltage supplying module containing a complete set of AC circuitry components therein and directly connecting the components to the AC voltage source, an inrush protection circuit, a DC-DC converter and power control circuits which enable the encapsulation of AC and DC components within a module being directly mountable and DC electrically connected to a printed circuit board assembly.

Abstract: A printed circuit board (PCB) assembly includes a PCB. An integrated circuit (IC) carrier defines a receiving zone to receive an IC. The carrier has a plurality of island portions about the receiving zone. Each island portion includes a solder member for contacting the PCB. A plurality of resilient serpentine members interconnect neighboring island portions so that at least some relative displacement of the PCB and the carrier is accommodated by the serpentine member, thereby alleviating strain imparted to the solder member.

Abstract: The present invention provides a system and method that mounts integrated circuit devices onto substrates and a system and method for employing the method in stacked modules. The contact pads of a packaged integrated circuit device are substantially exposed. A solder paste that includes higher temperature solder paste alloy is applied to a substrate or to the integrated circuit device to be mounted. The integrated circuit device is positioned to contact the contacts of the substrate. Heat is applied to create high temperature joints between the contacts of the substrate and the integrated circuit device resulting in a device-substrate assembly with high temperature joints. The formed joints are less subject to re-melting in subsequent processing steps. The method may be employed in devising stacked module constructions such as those disclosed herein as preferred embodiments in accordance with the invention. Typically, the created joints are low in profile.

Abstract: A structure is disclosed for preventing stacking connectors on a first and a second boards from coming apart that are fitted to each other. The first and second boards connected by said stacking connectors being fitted to each other are clamped by a clamping member. The clamping member is connected to surfaces on the first and second boards that connect to ground.

Abstract: An expansible interface for expanding different kinds of data from a primary printed circuit board (PCB) (1) to a subsidiary PCB (2), the primary PCB is fixed with board-to-board connectors (13, 14) and flexible printed circuit (FPC) connectors (11, 12), and the subsidiary PCB is fixed with the corresponding board-to-board connectors (23, 24) and the corresponding FPC connectors (21, 22). The board-to-board connectors are directly electrically connected with each other for transmitting a data that is not a Peripheral Component Interconnect (PCI) data from the primary PCB to the subsidiary PCB; the FPC connectors are electrically connected with each other via cables (31, 32) for transmitting the PCI data from the primary PCB to the subsidiary PCB.

Abstract: A computer interface card including a circuit board, a first connector, a second connector, several first conductors, a second conductor, a third conductor, a cover and a base is provided. The first connector is disposed on one side of the circuit board to be electrically connecting to a cable. The second connector, which is disposed on the opposite side of the circuit board, is electrically connected to the first connector and a third connector of a computer. The signal transmitting interface between the second connector and the third connector includes a PCMCIA, a Card Bus or an Express Card Bus interface. The cover and the bottom cover are buckled together to retain the circuit board. The cover and the base have a metal cover and a metal base respectively, wherein the metal cover is electrically connected to the first conductors and the metal base.

Abstract: An integrated circuit carrier is claimed comprising at least one receiving zone for an integrated circuit. A plurality of island-defining portions, having electrical terminals, is arranged about each of the receiving zones. Rigidity-reducing arrangements are disposed between neighbouring island-defining portions.

Abstract: A system and method are disclosed in which flex cables are affixed to PCBs, for providing high-speed signaling paths between ICs disposed upon the PCBs. The flex cables are fixably attached to the PCBs so as to substantially mimic their structural orientation. Where the configuration includes more than one PCB, the flex cables include multiple portions which are temporarily separable from one another and from the die, using flex-to-flex and flex-to-package connectors, allowing field maintenance of the configuration. By routing the high-speed signals between ICs onto the flex cable, single-layer PCBs can be used for non-critical and power delivery signals, at substantial cost savings. By disposing the flex cables onto the PCB rather than allowing the cables to float freely, the configuration is thermally managed as if the signals were on the PCB and cable routing problems are avoided.

Abstract: A transponder assembly for use with fiber optic digital communication cables having multiple parallel optic fiber elements. The transponder assembly features a transmitter port and receiver port for connection with separate parallel optic cables for separately transmitting and receiving data and an electrical connector for connecting with computer or communication systems. The transponder assembly includes a parallel optic transmitter module and a parallel optic receiver module having pluggable edge connectors. The assembly also includes a circuit board on which a semiconductor chip useful for signal processing and the electrical connector are mounted. A flex circuit is used in connecting the circuit board to the parallel optic modules. The semiconductor chip and electrical connector are mounted directly across from one another on opposite surfaces of the circuit board.

Abstract: According to some embodiments, a system includes a holder to hold an electrical module, the module having an electrical circuit and a conductive module pad electrically coupled to the electrical circuit. A system may also include a flexible circuit coupled to the holder and having a conductive pad to contact the conductive module pad.

Abstract: A memory system has a circuit board provided with a first slot connector into which a first memory module is inserted. A second slot connector is provided into which a second memory module is inserted. The first and the second memory modules are connected via a flexible bridge. The flexible bridge extends from respective ends of the memory modules opposite to that ends thereof which are inserted into the connector slots. The flexible bridge provides a signal bus between the memory modules.

Abstract: The invention relates to an electrical connector that can be used to electrically connect a daughtercard to a backplane.

Abstract: Disclosed is an LCD driver integrated circuit package and a chip on glass type LCD device using the package. The LCD driver integrated circuit package includes a mold that has signal output bumps and signal input bumps formed thereon, wherein the signal output bumps and the signal input bumps have different surface areas that contact the mold and an adjacent conductive film. Due to the different contact surface areas, different amounts of pressure are applied to different parts on the conductive film when a force is applied to the mold. One or more bump pressure control patterns are formed on the mold compensate for the difference in pressure caused by this difference between the total contact areas. Accordingly, the LCD driver integrated circuit package can be mounted on a chip on glass type LCD panel without causing device failure.

Abstract: The present invention is a kit for adapting a tube lamp fixture made for a first size of lamp tubes into a fixture that accommodates smaller lamp tubes. The kit comprises a conversion apparatus that itself comprises a bar in which are disposed one or more plugs for connecting to the sockets in the existing tube lamp fixture, said plugs being slidably disposed on the bar to adapt to the position of the sockets in the fixture. The conversion apparatus further comprises one or more slidably disposed sockets on the opposite side of the bar that may be positioned independently from the plugs. Appropriate wiring permits the supply of electrical energy to the tube lamps. The invention further comprises a master-slave ballast conversion assembly. The ballast conversion assembly comprises a chain of circuit boards connected by cables and connectors that enable a single ballast to control two or more tubes through a chain of circuit boards.

Abstract: A folded interposer used to achieve a high density semiconductor package is disclosed. The folded interposer is comprised of a thin, flexible material that can be folded around one or multiple semiconductor dice in a serpentine fashion. The semiconductor dice are then attached to a substrate through electrical contacts on the interposer. The folded interposer allows multiple semiconductor dice to be efficiently stacked in a high density semiconductor package by reducing the unused or wasted space between stacked semiconductor dice. Vias extending through the folded interposer provide electrical communication between the semiconductor dice and the substrate. The present invention also relates to a method of packaging semiconductor dice in a high density arrangement and a method of forming the high density semiconductor package.

Abstract: A circuit card is disclosed. In one embodiment, the circuit card comprises a first connector to connect the circuit card to a first mating connector, a second connector movable between first and second positions, to connect the circuit card to a second mating connector, and a mechanism to move the second connector between the first and second positions along a defined path.

Abstract: Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates.

Abstract: The present invention discloses a computer expansion device with a universal serial bus (USB) interface, comprising: a housing having an installation space; a circuit board, disposed in the housing and having a USB port and a power supply terminal; the USB port electrically coupled to a first USB interface signal IC by a circuit, and such IC being electrically coupled to three first connecting ends by circuits, and electrically coupled to a second USB interface signal IC by another circuit, and such IC being electrically coupled to four second connecting ends; wherein the three first connecting ends and a second connecting end selectively coupled to a peripheral device with a USB interface conversion function by an electric connection such that the USB interface signals are transmitted, and the rest of the three second connecting ends are respectively coupled to a USB interface socket.

Abstract: A method and apparatus for connecting circuit boards together in a sensor assembly includes a connector that allows the circuit boards to be positioned generally perpendicular to each other. The connector includes a first end that is received within an opening formed at one edge of a main circuit board. A second end of the connector includes a resilient hook or clip that grippingly engages opposing sides of an auxiliary circuit board. The connector comprises an electrical contact between the main and auxiliary circuit boards. The perpendicular orientation of the auxiliary circuit board to the main circuit board allows for more compact packaging.

Abstract: One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a flexible substrate having contactors on a first side and pads on a second side; (b) a rigid substrate having vias aligned with the pads on the second side of the flexible substrate; (c) an adhesive layer comprised of a compliant adhesive material having vias aligned with the pads on the second side of the flexible substrate; the adhesive layer being affixed to the flexible substrate and the rigid substrate; (d) a card; (e) electrical connectors that are retained in the vias of the rigid substrate and the adhesive layer, which electrical connectors have first and second retractable ends, wherein the first retractable ends contact pads on the substrate, and the second retractable ends contact pads on the card; and (f) a clamp that is adapted to fit over the substrate and the adhesive layer, the clamp having an opening to provide access to the contactors, wherein the clamp is connected to the card.

Abstract: A switch assembly is described having one or more switches and a holder. The switches are preferably of a pushbutton type having an outwardly extending flange. The holder includes a cover and base with a pair of upright arms. The cover includes a three-sided opening. As assembled, the upright arms receive a switch and the combination is received in the three-sided opening of the cover. A switch subassembly is further described having a circuit board and quick-disconnect unit. Such improved switch and switch subassembly allow a technician to quickly change out a defunct alarm system switch.

Abstract: An electronic device includes a first chassis, a second chassis, and at least one flexible circuit extending therebetween. The first chassis is oriented along a first axis and comprises at least one first microprocessor. The second chassis is oriented along a second axis and comprises at least one power generating component. The flexible circuit comprises a first end and a second end, wherein the first end is connectable to the first chassis and the second end is connectable to the second chassis. The first chassis is movable relative to the second chassis between a position wherein the first axis is substantially perpendicular to the second axis and a position wherein the first axis is substantially parallel to the second axis.

Abstract: An electromechanical device for mounting an electronic assembly on a mounting rack, in particular for mounting a display instrument recessed in a dashboard. There is at least one conductive Velcro-type connector between the electronic assembly (6) and the mounting rack (7), the conductive Velcro-type connector serving both for the mechanical fastening and the electrical contacting of the assembly (6) on the mounting rack (7).

Abstract: Methods are disclosed for fabricating spring structures in which a passive, conductive coating is deposited onto the spring structure before release. A release layer is deposited on a substrate and then a spring metal layer is formed thereon. A first mask is used to form a spring metal finger from these layers. A second mask defines a window exposing a tip of the finger. The release layer under the tip is etched through the window, and then a passive-conductive coating material (which may also have spring characteristics) is deposited on the tip. The second mask and residual coating material are then lifted off, and a third (release) mask is formed that is used to release a free end of the spring metal finger. The release mask is then stripped. When the passive-conductive coating includes spring characteristics, the stress variations of the coating help to lift the free end if the finger during release.

Abstract: An electronic device comprises a first chassis, a second chassis, and at least one flexible circuit extending therebetween. The first chassis is oriented along a first axis and comprises at least one first microprocessor. The second chassis is oriented along a second axis and comprises at least one power generating component. The flexible circuit comprises a first end and a second end, wherein the first end is connectable to the first chassis and the second end is connectable to the second chassis. The first chassis is movable relative to the second chassis between a position wherein the first axis is substantially perpendicular to the second axis and a position wherein the first axis is substantially parallel to the second axis.

Abstract: An insertion extraction device (IED) (100) is suitable for use in attaching a movable object (40) to a fixed structure (20) with a limited amount of force. The IED (100) includes a mandrel (120) and a flexible sleeve (140). The mandrel (120) is constructed of a relatively hard material such as a metal and has a first section (126) with an elliptical, oval, or similar shape and a second section (128) for attaching to the fixed structure (20). The flexible sleeve (140) is constructed of a material such as nylon or urethane plastic. An operator is able to turn the mandrel (120) by turning the sleeve (140) with less than a certain amount of torque. When the operator applies an excessive amount of torque to the sleeve (140), the sleeve (140) slips over the mandrel (120), thereby limiting the maximum amount of force that can be applied to insert the movable component (40) into the fixed structure (20).

Abstract: A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g.

Abstract: The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.

Abstract: A multichip module that utilizes an angled interconnect to electrically interconnect chips in the module that are positioned at an angle relative to each other. The multichip module may comprise a first and second chips that are positioned in an orthogonal manner. The first and second chips are electrically interconnected via an interconnect structure comprising a first conductive pillar that extends from an outer surface of the first chip. A distal end of the first pillar is electrically connected to an outer surface of the second chip via a solder ball or another conductive pillar that is interposed between the distal end of the first conductive pillar and the second chip.

Abstract: An apparatus is provided, which includes a memory interface circuit, a clock signal generating circuit, and a plurality of memory circuits. The memory circuits are operatively coupled and arranged in an order on a plurality of memory modules, such that the memory module positioned at the beginning of the order is coupled to an output of the clock signal generating circuit and the memory interface circuit. The memory module that is positioned at the end of the order is unique in that it includes a clock signal terminating circuit connected to the last memory integrated circuit. With this configuration, a clock loop is formed by directly routing the clock signal from the output of the clock signal generating circuit through each of the memory modules in the order (without connecting to any of the intervening memory integrated circuits) to the memory integrated circuit positioned at the end of the order.

Abstract: An electronic circuit card includes a circuit board and a faceplate attached to the circuit board. A connector is mounted on the faceplate such that the electronic circuit card occupies substantially one slot of a housing when the electronic circuit card is contained in the housing. The connector is also mounted on the faceplate to enable contact between the faceplate and a faceplate of an adjacent electronic circuit card for shielding against electromagnetic interference leakage when the electronic circuit card is contained in the housing. A ribbon cable electrically interconnects the connector and the circuit board. A strap is attached to the faceplate. The strap is adapted to secure a mating connector to the connector.

Abstract: A flexible first circuit member (10) includes conductors (11) wired thereto. The conductors (11) include a first conductor group (12). The first circuit member defines an opening (14) having a first edge part (14d). The first conductor group (12) terminates at the first edge part (14d). A flexible second circuit member (13) is electrically connected to first conductor group (12) at the first edge part (14d).

Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, a pair of CSPs is stacked, with one CSP above the other. The two CSPs are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower CSP of the module. The flex circuit pair connects the upper and lower CSPs and provides a thermal and electrical connection path between the module and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of CSPs in modules provided for high-density memories or high capacity computing.

Abstract: Disclosed is an electronics packaging system, which provides for a high density assembly of groups of similar solid state part packages. The system provides a novel method for interconnecting the signal paths, structurally assembling and supporting the parts, and removing heat generated within the components. The system approach disclosed typically starts at the level of assembling pre-packaged parts into modules, and permeates through to the printed circuit board and box levels of assembly. The system is applicable, but not limited to, solid state memory device packaging, which typically consists of many similar parts interconnected in a matrix bus type configuration. The assembly of a building block of numerous memory components allows for the modular construction of large amounts of solid state memory.

Abstract: There is provided a technology for realizing an PCI expansion adapter for a PC card which is connectable to a desktop type personal computer PCI expansion connector using a low profile PCI. The PCI expansion adapter includes an expansion unit which is provided with an electrical connector to a PCI bus, a low profile PCI expansion board provided with a PC card control element and an electrical connector to the PC card, wherein the low profile PCI expansion board and the expansion unit are connected by the electrical connectors mounted on the respective boards.

Abstract: A set of modules from which custom passive backplanes can be assembled coplanarly couple together and are mounted on a rigid base plate which holds them coupled and coplanar. Each module has a plurality of orthogonally oriented card connectors. Preferably there is a CPU module into which is plugged a CPU card from which an ISA and a PCI originates. On one edge of the CPU module is an connector communicating with the ISA bus. This connector is for chaining together one or more ISA modules, each of which expands the ISA bus to three more ISA connectors. On an opposite edge of the CPU module is an connector communicating with the PCI bus. This connector is for chaining together one or more PCI modules, either 32-bit or 64-bit, each of which expands the PCI bus to three more PCI connectors. Power and ground can be jumpered from module to module or can be directly connected to any module.

Abstract: A contact arrangement for an electrically contactable module that is arranged on a card-shaped carrier, having a first contact bank with a plurality of contact areas, of which at least one is disposed outside of a predefined region. A second contact bank is provided having at least one contact area within the predefined region, and the contact areas of the first contact bank that are arranged outside of the predefined region are in each case electrically connected to contact areas of the second contact bank. Consequently, for example, both chip cards according to ISO 7816 and multimedia card modules can be evaluated by a chip-card reader provided for evaluating ISO-7816 chip cards. At the same time, the ability of the MMC modules to be evaluated by an MMC-module reader provided for that purpose is retained.

Abstract: A test socket connecting an integrated circuit chip to a printed circuit board is disclosed. The test socket includes a horizontal upper portion connected to the integrated circuit chip, a horizontal lower portion connected to the printed circuit board, and an intermediate portion connected between the horizontal upper portion and the horizontal lower portion.

Abstract: A printed circuit board connection for connecting printed circuit boards provided with conductor tracks and arranged at a right angle with respect to each other consists of a first plug connector having an isolating housing and a plug-in portion provided with contact sleeves, and a second plug connector having an isolating housing and a plug-in portion provided with contact pins, each of the plug connectors being mounted at one of the printed circuit boards. A conductor foil is mounted at the isolating housing of the first plug connector, the conductor foil being provided with contact tracks.

Abstract: A connector element for connecting microelectronic elements includes a dielectric sheet having pairs of elongated, flexible leads in registry on opposite surfaces of the sheet. The leads are connected at their terminal ends which are in registry with each other. The terminal ends are offset from the tip ends in a horizontal direction. The tip ends are releasably attached to the surfaces of the dielectric sheet. The tip ends may be connected to microelectronic elements, which may be displaced relative to each other in a vertical direction.

Abstract: The invention relates to a circuit substrate assembly comprising a left-hand (1) and a right-hand (1′) circuit substrate mirror-symmetrical thereto, each including electrical and/or electronic and/or electromechanical components (2-6 or 2′-6′) and circuitry (7 or 7′) electrical connecting said components. All components (2-6) are positioned symmetrically mirrored on the left-hand (1) and right-hand (1′) circuit substrate respectively when the left-hand (1) and right-hand (1′) circuit substrate is oriented mirror-symmetrical along a mirror plane (P). However, the circuit functional plug assignments (A-F) of at least one circuit functional mirror-invariant component 2 or 2′) on the left-hand (1) and on the right-hand (1′) circuit substrate are not mirror-symmetrical to each other.

Abstract: A printed circuit board is disclosed which has conductive pads located near an edge of a board main body on its upper and lower surfaces to reduce the width in the direction of contact sliding and to provide for a smoother connection between electrical contacts of an electrical connector and the conductive pads despite a powdered substance produced as a result of friction between the conductive pads and the electrical contacts. The printed circuit board (1) has conductive pads (14a, 14b) on upper and lower surfaces of the board main body (2) near the edge (3) of the main body (2). Electrical contacts (20) slide over the conductive pads (14a, 14b) from the edge (3) of the board main body (2). The conductive pads (14a, 14b) are connected together by via holes (15a) that are located in the paths of the contacts (20).

Abstract: A circuit board module comprises a battery case 101 storing a battery of which external terminals 4 have a laminated members 8 made of different metal material for each other, a circuit board 102 for carrying out charge and discharge of the above-mentioned battery and a joint member 103 for connecting the battery case 101 and the circuit board 102 electrically and/or mechanically, wherein the joint body 103 is constructed by clad material that a first metal layer 111 and a second metal layer 112 made of different metal materials each other are laminated.

Abstract: A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit board to the contact area of the second printed circuit board. The conductive band may be selected from the group consisting essentially of a band formed from solder, a band coupled by a weld, a band coupled by a wire bond, a band comprising conductive adhesive, a band comprising conductive film, a band comprising conductive tape, and a band comprising conductive rope. The conductive band may couple the first printed circuit board and the second printed circuit board in a substantially coplanar position.

Abstract: In an electronic control unit, a drive element liable to generate heat and a control processing element liable to be affected by heat are respectively mounted on a drive circuit board and a control circuit board different from each other, and the two boards are connected to each other by a flexible printed circuit board. The bonding portion of the flexible printed circuit board to the control circuit board is a back side portion of a connector mounted on the control circuit board at the same side as the control processing element. Therefore, heat generated by the drive element is suppressed from being transferred to the control processing element without causing layout hindrances.

Abstract: A power semiconductor module in which at least one semiconductor chip with which contact is made by pressure is electrically connected via a contact element to a main connection. The contact element has two planar contact surfaces, between which a spring element is located. Irrespective of the individual position and height of a chip, the respective spring element ensures a standard contact force. Overloading of the semiconductor chips when the module is being clamped in is prevented by ceramic supporting elements.

Abstract: A printed-circuit board module comprises: a flexible printed-circuit (FPC) sheet (25) with its two opposite end portions bent toward the side on which parts (24) are mounted and having connection terminals (29) formed side by side along marginal edges of the bend end portions; a printed-wiring board (22) having an opening (26) for receiving the parts (24) and connecting conductor patterns (27) formed in the neighborhood of the opening (26); and a fixing frame (23). The FPC sheet (25) is fixedly held by the fixing frame (23) and is mounted on the printed-wiring board (22) with the fixing frame (23) held therebetween. The FPC sheet (25) makes direct electrical connections to the printed-wiring board (22), and the amount of extension of the parts (24) into the opening (26) can be adjusted by changing the thickness of the fixing frame (23).