Abstract: A converter comprises: a housing comprising a refrigerant flow path; a printed circuit board disposed on top of the housing and on the upper surface of which an electronic component is disposed; and a cover disposed on top of the printed circuit board and which covers the upper surface of the electronic component, wherein a heat transfer layer filled with a thermal interface material is disposed on the upper surface of the housing or the lower surface of the cover overlapping the electronic component in the vertical direction.

Abstract: An electronic device includes: a first printed circuit board (PCB) including a first plate and a first hole formed in the first plate, a second PCB including a second plate, an interposer including a third plate positioned between the first plate and the second plate, a plurality of first vias connecting the first plate and the third plate, a plurality of second vias connecting the second plate and the third plate, and a first reinforcement portion positioned in the first hole to bond the first plate and the third plate.

Abstract: Techniques and mechanisms for coupling packaged devices with a dual-sided socket device. In an embodiment, two interfaces of the socket device comprise, respectively, first metallization structures and second metallization structures on opposite sides of a socket body structure. The first metallization structures each form a respective corrugation structure to electrically couple with a corresponding conductive contact of a first packaged device. The corrugation structures facilitate such electrical coupling each via a vertical wipe of the corresponding conductive contact. In another embodiment, a pitch of the first metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm. One such metallization structure has a vertical span in a range of between 0.05 mm and 2.0 mm, where a portion of a side of the metallization structure forms a corrugation structure, and has a horizontal span which is at least 5% of the vertical span.

Abstract: In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.

Abstract: A wiring module includes: a sheet which is a member extending planarly and including an easy-fracture part sectioning the sheet into a plurality of areas and capable of dividing the sheet into the areas; and a transmission member including one of or both a power line supplying an electrical power to at least one apparatus provided in one or more of the plurality of areas and a signal line enabling communication with the apparatus, wherein, in a case where the transmission member is disposed over at least two areas, a part of a middle portion of the transmission member in relation to an end portion connected to the apparatus is fixed to a first area in the two areas, and the transmission member is laid without being fixed to a second area in the two areas.

Abstract: An electrical connector includes a first set of conductors, a first overmolding in physical contact with a body portion of each of the first set of conductors, a second set of conductors, a second overmolding in physical contact with the body portion of each of the second set of conductors, and a spacer in contact with the first overmolding and the second overmolding. A gap is present between the spacer and at least one of the first set of conductors and a gap between the spacer and at least one of the second set of conductors.

Abstract: A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.

Abstract: A communication system includes a first circuit card assembly having a first PCB and a first electrical connector having a receptacle housing and a mating housing received in the receptacle housing and being movable in the receptacle housing in a connector mating direction along a connector mating axis. The second circuit card assembly includes a second PCB and a second electrical connector having a header housing holding second contacts. The first PCB and/or the second PCB includes a slot receiving the other PCB in a board loading direction. The receptacle housing is coupled to the header housing in the board loading direction and the mating housing is movable within the receptacle housing toward the header housing in a connector mating direction generally perpendicular to the board loading direction.

Abstract: A communication system includes a first circuit card assembly having a first PCB and a first electrical connector with first contacts and a second circuit card assembly having a second PCB and a second electrical connector with second contacts. At least one of the PCBs include a slot configured to receive the other PCB when mated in a board mating direction. The first electrical connector is mated to the second electrical connector in a connector mating direction perpendicular to the board mating direction. The first contacts are mated to the second contacts in a contact mating direction as the first PCB and the second PCB are mated in the board mating direction and as the first electrical connector and the second electrical connector are mated in the connector mating direction. The contact mating direction is non-parallel to the board mating axis and non-parallel to the connector mating axis.

Abstract: A circuit card assembly for a communication system includes a PCB having a slot receiving a second PCB of a second circuit card assembly in a board loading direction. An electrical connector is mounted to the PCB having a receptacle housing and a mating housing movable within the receptacle housing in a connector loading direction along a connector loading axis parallel to the board loading direction. The mating housing is movable in the receptacle housing in a connector mating direction along a connector mating axis perpendicular to the connector loading axis. Contacts of the electrical connector are mated with contacts of the second electrical connector in a contact mating direction parallel to the connector mating axis.

Abstract: A connector for electrically connecting a first printed circuit board (PCB) with a second PCB wherein, in one example, the connector includes a housing having a keyed feature adapted to mate with a correspondingly keyed feature provided to each of the first and second PCBs and at least one connecting terminal carried by the housing having at least partially exposed opposed ends each of which electrically engages a contact pad formed on an underside of the respective PCBs. The connecting terminal may be arranged to accept a conductor and to thereby electrically couple the conductor to the first and second PCBs.

Abstract: A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

Abstract: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.

Abstract: A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.

Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.

Abstract: An expansion apparatus includes a first connector having first power pins and first signal pins, and a second connector having second power pins and second signal pins. A power circuit is connected to the first and second power pins. A serial advanced technology attachment (SATA) expansion controller is connected to the first and second signal pins. First control chips are connected to the SATA expansion controller and the power circuit. First storage chips are connected to the first control chips and the power circuit. A third connector has third power pins corresponding to second power pins, and third signal pins corresponding to second signal pins. Second control chips are connected to the third power pins and the third signal pins. Second storage chips are connected to the second control chips and the third power pins.

Abstract: The present invention provides a DC-DC power converter that comprises two or more Printed Wiring Boards (PWB) mounted parallel to one another and without encapsulation. Electronic components can be mounted on both sides of each board. The open design and parallel orientation of the PWBs allow airflow over components mounted on the PWBs. The PWBs are preferable made of FR-4 with copper foils, with one thicker board being comprised of more copper layers and the other boards comprised of less copper layers. In the preferred embodiment, the power processing elements are housed in the thicker PWB, while the thinner boards house the control circuitry.

Abstract: A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.

Abstract: A direct-connect orthogonal electrical connection system with improved high frequency performance is provided. A conductive member is provided between first and second components, each having signal and ground conductors. The conductive member is electrically coupled to ground conductors of both the first and second components and may also have openings through which signal conductors of the first and second components may connect. As such, signal conductors may be positioned relative to the conductive member such that a uniform impedance is maintained along a signal path throughout the interconnection, reducing noise and reflections. The signal conductors may be formed with multiple beams of different lengths to create multiple points of contact distributed along an elongated dimension. For example, a third beam may be fused to a mating portion to allow a tolerance for deviations in alignment between two directly connected connectors.

Abstract: A semiconductor module system includes a substrate, at least one semiconductor chip, and a number of at least two electrically conductive first connecting elements. The substrate has a bottom side and a top side spaced apart from the bottom side in a vertical direction. The at least one semiconductor chip is arranged on the top side. Each one of the first connecting elements has a first end which protrudes away from an insulation carrier of the substrate in a direction perpendicular to the vertical direction. The semiconductor system further includes a connecting system with a number of N?1 connectors. A first one of the connectors includes at least two electrically conductive second connecting elements. Each one of the second connecting elements has a first end. The first end of each one of the first connecting elements is electrically conductively connectable to the first end of one of the second connecting elements.

Abstract: An electronic device includes a main body and a port connector. The main body includes a printed circuit board, a bottom plate and a side plate cooperatively defining a opening. The printed circuit board is fixed parallelly to the bottom plate. The port connector includes an outer angled plate having a first wall, a second wall, and first pins and second pins. The first wall is attached to the bottom plate and defines first ports. The second wall is attached to the side plate and defines second ports. Each of the first pins is retained within one of the first ports and contacting the printed circuit board. Each of the second pins is retained within one of the second ports and contacting the printed circuit board.

Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a first circuit board, an expansion slot, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, and first ground pins. A second edge connector is arranged on a top edge of the second circuit board and includes second power pins connected to a power unit, and second ground pins. A third edge connector is arranged on a bottom edge of the second circuit board and includes third power pins connected to the power unit, third ground pins, and signal pins connected to a display unit.

Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a first circuit board, an expansion slot, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, and first ground pins. A second edge connector connected to the expansion slot is arranged on a top edge of the first circuit board and includes second power pins connected to the first power pins, second ground pins, and four first signal pins connected to the control chip. A third edge connector engaged in the expansion slot is arranged on a bottom edge of the second circuit board and includes third power pins and four second signal pins connected to the second storage chips, and third ground pins.

Abstract: A Printed Circuit Assembly has a multiplicity of connectors with each connector containing insulating matrices with each matrix containing a multiplicity of conducting or non-conducting standoffs with each standoff contacting one or more printed circuit boards. The standoffs permit controlled-impedance electrical connections, thermal management and mechanical rigidity of the overall assembly making the assembly suitable for use in any environment including the most harsh extremes.

Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a first circuit board, an expansion slot, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, and first ground pins. A second edge connector is arranged on a top edge of the second circuit board and includes second power pins connected to a power unit, and second ground pins. A third edge connector is arranged on a bottom edge of the second circuit board and includes third power pins connected to the power unit, third ground pins, and signal pins connected to a display unit.

Abstract: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.

Abstract: A serial advanced technology attachment (SATA) dual-in-line memory module (DIMM) includes a circuit board. A control chip and a number of storage chips are arranged on the circuit board. First and second extending boards extend from an end of the circuit board and are coplanar with the circuit board. A space is defined between the first and the second extending boards. A first edge connector is arranged on the first extending board and connected to the control chip. A second edge connector is arranged on bottom edges of the second extending board and the circuit board. A third edge connector is arranged on a top edge of the circuit board opposite to the bottom edge of the circuit board.

Abstract: A wiring board has a wiring member, a first reinforcing member and a second reinforcing member. The wiring member has wiring layers and insulating layers which are stacked, and the wiring layers include a first connecting electrode formed on a surface of the wiring member and a second connecting electrode formed on a back surface of the wiring member. A pin is formed on the second connecting electrode. The second reinforcing member is formed by a resin and serves to reinforce the wiring member. The first reinforcing member is formed on the whole back surface of the wiring member except for the pin provided on the second connecting electrode.

Abstract: A mounting apparatus fixing an expansion card includes an expansion slot, two locking members connected to opposite ends of the expansion slot, for clamping the expansion card, and two latching members pivotably mounted to opposite ends of the expansion card, respectively. A latching portion protrudes from each of the latching members, for latching the corresponding locking member.

Abstract: A circuit board assembly includes two external circuit boards, at least one electrical connector, at least one electronic component, and at least one hollow substrate. Each external circuit board includes an external electromagnetic shielding layer, a circuit layer and a dielectric layer. In each external circuit board, the dielectric layer is located between the external electromagnetic shielding layer and the circuit layer. The electrical connector is connected between the circuit layers located between the external electromagnetic shielding layers. The electronic component is disposed between the external circuit boards and connected with one of the circuit layers. The hollow substrate with plural openings is disposed between the external circuit boards. The electronic component and the electrical connector are located in the openings. Both a thickness of the electronic component and a height of the electrical connector are smaller than or equal to a thickness of the hollow substrate.

Abstract: There is provided a communication device that includes a first circuit board which includes a first ground pattern (GND) and a first signal line formed on a substrate, a ground pin electrically coupled with the first GND, where the ground pin protrudes from an end of the substrate, and a signal pin formed in the substrate and electrically coupled with the first signal line, where the signal pin protrudes from the end. The communication device further includes a send circuit board which includes a second GND and a second signal line, wherein when an end of the circuit board is inserted into a space between the ground pin and the signal pin, the first signal line and the second signal line are electrically coupled with each other via the signal pin and the first GND and the second GND are electrically coupled with each other via the ground pin.

Abstract: An array of contact pads on a semiconductor structure has a pitch less than twice an overlay tolerance of a bonding process employed to vertically stack semiconductor structures. A set of contact pads within the area of overlay variation for a matching contact pin may be electrically connected to an array of programmable contacts such that one programmable contact is connected to each contact pad within the area of overlay variation. One contact pad may be provided with a plurality of programmable contacts. The variability of contacts between contact pins and contact pads is accommodated by connecting or disconnecting programmable contacts after the stacking of semiconductor structures. Since the pitch of the array of contact pins may be less than twice the overlay variation of the bonding process, a high density of interconnections is provided in the vertically stacked structure.

Abstract: A motherboard includes a main body and two relay devices attached on the main body. The main body includes a signal output terminal, a signal input terminal, a first connector module, and a second connector module. Each relay device includes a circuit board, a relay, and a third connector module. The input terminal outputs an input signal to the corresponding relay via the first and the third connector modules in turn. The relay corresponding to the signal input terminal outputs the input signal to the signal output terminal via the third connector module corresponding to the signal input terminal, the first connector module, the second connector module and the third connector module corresponding to the signal output terminal in turn.

Abstract: A printed circuit board (PCB) includes a substrate having a first group of at least two via holes and a second group of at least two via holes formed therein, a first pad set of terminal pads and a second pad set of terminal pads formed on the substrate, and a first group of conductive connection members and a second group of conductive connection members formed in the substrate. The first group of the via holes are surrounded by the first pad set of the terminal pads and the second group of the via holes are surrounded by the second pad set of the terminal pads. The first and the second groups of conductive connection members fill up the first and second groups of the via holes. The first group of the conductive connection members are connected to the first pad set of the terminal pads and the second group of the conductive connection members are connected to the second pad set of the terminal pads.

Abstract: An electronic gaming machine interface system including a first circuit board, a bracket coupled to the first circuit board, a fan coupled to the bracket and disposed over the first circuit board, a second circuit board coupled to the bracket, a first cable coupled between a connector of the first circuit board and a connector of the second circuit board; and a second cable coupled between a connector of the first circuit board and a connector of the second circuit board.

Abstract: A printed circuit board includes a reference layer, at least one first hole defined in the reference layer and adjacent from a first pin in a first column of pins of an electronic component, and at least one second hole defined in the reference layer and adjacent from a second pin of the electronic component. The at least one second hole is defined in the reference layer and opposite to the at least one first hole. The second pin is in a neighboring second column of pins from the first column of pins. A diameter of the at least one first hole is greater than a diameter of the at least one second hole such that a difference in current flowing through the first pin and the second pin is reduced.

Abstract: In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

Abstract: A circuit board interconnection system is disclosed according to the embodiments of the present invention. The system includes a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector. The first connector and the second connector are mounted at two sides of the first circuit board respectively so that the second circuit board mounted on the first connector is perpendicular to the third circuit board on the second connector. The first connector and the second connector mounted respectively at two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board. Another circuit board interconnection system, a circuit board, a connector assembly and a method for manufacturing a circuit board are disclosed according to the present invention.

Abstract: Interconnect substrate (1) that connects at least the first circuit board and the second circuit board. Interconnect substrate (1) includes housing (1) and connecting terminal electrodes for connecting the top and bottom faces of housing (10). Housing (10) has protrusion (11) on its outer periphery and opening (13) in its inner periphery.

Abstract: A motherboard includes a main body and two relay devices attached on the main body. The main body includes a signal output terminal, a signal input terminal, a first connector module, and a second connector module. Each relay device includes a circuit board, a relay, and a third connector module. The input terminal outputs an input signal to the corresponding relay via the first and the third connector modules in turn. The relay corresponding to the signal input terminal outputs the input signal to the signal output terminal via the third connector module corresponding to the signal input terminal, the first connector module, the second connector module and the third connector module corresponding to the signal output terminal in turn.

Abstract: A method of forming contacts for an interconnection element, includes (a) joining a conductive element to an interconnection element having multiple wiring layers, (b) patterning the conductive element to form conductive pins, and (c) electrically interconnecting the conductive pins with conductive features of the interconnection element. A multiple wiring layer interconnection element having an exposed pin interface, includes an interconnection element having multiple wiring layers separated by at least one dielectric layer, the wiring layers including a plurality of conductive features exposed at a first face of the interconnection element, a plurality of conductive pins protruding in a direction away from the first face, and metal features electrically interconnecting the conductive features with the conductive pins.

Abstract: A portable electronic device (20) includes a circuit board (21) and at least one conducting pole (22). The conducting pole is mounted on the circuit board and includes a breakable portion (2224), the breakable portion is configured to be the part that breaks when the conducting pole is crumpled.

Abstract: An electrically conductive pin comprising a pin stern and a pin head attached to the pin stem. The pin head is adapted to be mounted onto a surface of a microelectronic substrate to support the pin stem. The pin head has an underside surface defining a continuous curve configured to allow gases to escape from a pin-attach solder region adjacent the underside surface.

Abstract: A control system suitable for use with a bathing unit system having a water receptacle is provided. The control system comprises a heating module, a power source and a controller in communication with the heating module and the power source. The power source includes an energy storage member for storing energy collected from a solar panel, and is operative for supplying power generated from solar energy to the heating module. The controller is operative for causing the power source to supply power to the heating module at least in part based on first information derived from a temperature of the water within the water receptacle and second information derived from a condition associated with the power source. The controller is further operative for selecting between a first power source and a second power source for supplying power to the heating module.

Abstract: A light-emitting module for a lighting apparatus comprises at least two substrates, each provided with a printed circuit having an LED, and plural matching terminal blocks and buckles so that the substrates can be structured into a planar light-emitting module having a relatively large area by assembly of the terminal blocks and the buckles. The light-emitting module is adaptive to be used in a billboard, a traffic sign, a three-dimensional lighting apparatus or a lighting display screen.

Abstract: An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals.

Abstract: Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias that link respective power and ground planes. The shielding conductors' presence in positions around a signal via is made possible through the employment of power plane and ground plane conductive grids that are laid out in rhomboid patterns. The power plane and ground plane grids possess a left-right mirror relation to one another and are displaced to place the rhomboid's corners to avoid overlapping any of the grid lines.

Abstract: Techniques are provided for placing and routing vias that conduct signals through a connector between two electrical units. Vias that conduct a first set of signals are placed next to vias that provide return paths for the first set of signals to reduce cross-talk or impedance. Vias that conduct input or output signals can be placed next to vias that provide return paths for the input or output signals to reduce cross-talk. The vias that provide the return paths can conduct, for example, ground signals, power supply signals, or both. Vias that conduct power supply signals can be placed next to vias that provide return paths for the power supply signals to reduce impedance. The vias that provide the return paths for the power supply signals can conduct, for example, ground signals. The via configurations reduce cost and increase yield, and the via configurations are modular.

Abstract: An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is connected to the common power source wiring via a via-hole va having an impedance larger than that of the exclusive source line. Similarly, the electronic control apparatus includes an exclusive ground line for the charge pump circuit which is discriminated from a common ground line. The exclusive ground line is connected to the common ground via an additional via-hole vb. Furthermore, a noise-suppressing capacitor C is connected between the exclusive power source and around lines.

Abstract: A patch panel includes a back plane having front mounted pairs of termination locations, and an interconnect location electrically connected to each pair of termination locations. The termination locations connect to two patch cords. The interconnect location defines an access device for selectively accessing the termination locations. An interconnect module interfaces with the interconnect location. The module can include test access, power over Ethernet, or circuit protection features.