Multiple Contact Pins Patents (Class 361/791)
  • Patent number: 10522925
    Abstract: A communication system includes a first circuit card assembly having a first PCB and a first electrical connector with first contacts and a second circuit card assembly having a second PCB and a second electrical connector with second contacts. At least one of the PCBs include a slot configured to receive the other PCB when mated in a board mating direction. The first electrical connector is mated to the second electrical connector in a connector mating direction perpendicular to the board mating direction. The first contacts are mated to the second contacts in a contact mating direction as the first PCB and the second PCB are mated in the board mating direction and as the first electrical connector and the second electrical connector are mated in the connector mating direction. The contact mating direction is non-parallel to the board mating axis and non-parallel to the connector mating axis.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: December 31, 2019
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Matthew Jeffrey Sypolt, Chad William Morgan, John Joseph Consoli, Margaret Mahoney Fernandes
  • Patent number: 10461470
    Abstract: A circuit card assembly for a communication system includes a PCB having a slot receiving a second PCB of a second circuit card assembly in a board loading direction. An electrical connector is mounted to the PCB having a receptacle housing and a mating housing movable within the receptacle housing in a connector loading direction along a connector loading axis parallel to the board loading direction. The mating housing is movable in the receptacle housing in a connector mating direction along a connector mating axis perpendicular to the connector loading axis. Contacts of the electrical connector are mated with contacts of the second electrical connector in a contact mating direction parallel to the connector mating axis.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: October 29, 2019
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: John Joseph Consoli, Matthew Jeffrey Sypolt
  • Patent number: 9160086
    Abstract: A connector for electrically connecting a first printed circuit board (PCB) with a second PCB wherein, in one example, the connector includes a housing having a keyed feature adapted to mate with a correspondingly keyed feature provided to each of the first and second PCBs and at least one connecting terminal carried by the housing having at least partially exposed opposed ends each of which electrically engages a contact pad formed on an underside of the respective PCBs. The connecting terminal may be arranged to accept a conductor and to thereby electrically couple the conductor to the first and second PCBs.
    Type: Grant
    Filed: January 7, 2015
    Date of Patent: October 13, 2015
    Assignee: IDEAL Industries, Inc.
    Inventor: Benjamin David Swedberg
  • Patent number: 9106020
    Abstract: A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: August 11, 2015
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, Marc Benard Cartier, Jr., Mark W. Gailus
  • Patent number: 9029713
    Abstract: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: May 12, 2015
    Assignee: Ibiden Co., Ltd.
    Inventor: Michimasa Takahashi
  • Patent number: 8937390
    Abstract: A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: January 20, 2015
    Assignee: PS4 Luxco S.a.r.l.
    Inventors: Nae Hisano, Shigeo Ohashi, Yasuo Osone, Yasuhiro Naka, Hiroyuki Tenmei, Kunihiko Nishi, Hiroaki Ikeda, Masakazu Ishino, Hideharu Miyake, Shiro Uchiyama
  • Patent number: 8923003
    Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: December 30, 2014
    Assignee: Apple Inc.
    Inventors: Alexander D. Schlaupitz, Joshua G. Wurzel
  • Patent number: 8897030
    Abstract: An expansion apparatus includes a first connector having first power pins and first signal pins, and a second connector having second power pins and second signal pins. A power circuit is connected to the first and second power pins. A serial advanced technology attachment (SATA) expansion controller is connected to the first and second signal pins. First control chips are connected to the SATA expansion controller and the power circuit. First storage chips are connected to the first control chips and the power circuit. A third connector has third power pins corresponding to second power pins, and third signal pins corresponding to second signal pins. Second control chips are connected to the third power pins and the third signal pins. Second storage chips are connected to the second control chips and the third power pins.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: November 25, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Meng-Liang Yang
  • Patent number: 8749990
    Abstract: The present invention provides a DC-DC power converter that comprises two or more Printed Wiring Boards (PWB) mounted parallel to one another and without encapsulation. Electronic components can be mounted on both sides of each board. The open design and parallel orientation of the PWBs allow airflow over components mounted on the PWBs. The PWBs are preferable made of FR-4 with copper foils, with one thicker board being comprised of more copper layers and the other boards comprised of less copper layers. In the preferred embodiment, the power processing elements are housed in the thicker PWB, while the thinner boards house the control circuitry.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: June 10, 2014
    Inventors: Sun-Wen Cyrus Cheng, Carl Milton Wildrick, Jeffrey John Boylan
  • Patent number: 8704352
    Abstract: A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.
    Type: Grant
    Filed: January 6, 2010
    Date of Patent: April 22, 2014
    Inventors: Nae Hisano, Shigeo Ohashi, Yasuo Osone, Yasuhiro Naka, Hiroyuki Tenmei, Kunihiko Nishi, Hiroaki Ikeda, Masakazu Ishino, Hideharu Miyake, Shiro Uchiyama
  • Publication number: 20140098508
    Abstract: A direct-connect orthogonal electrical connection system with improved high frequency performance is provided. A conductive member is provided between first and second components, each having signal and ground conductors. The conductive member is electrically coupled to ground conductors of both the first and second components and may also have openings through which signal conductors of the first and second components may connect. As such, signal conductors may be positioned relative to the conductive member such that a uniform impedance is maintained along a signal path throughout the interconnection, reducing noise and reflections. The signal conductors may be formed with multiple beams of different lengths to create multiple points of contact distributed along an elongated dimension. For example, a third beam may be fused to a mating portion to allow a tolerance for deviations in alignment between two directly connected connectors.
    Type: Application
    Filed: October 9, 2013
    Publication date: April 10, 2014
    Applicant: Amphenol Corporation
    Inventor: John Robert Dunham
  • Patent number: 8643188
    Abstract: A semiconductor module system includes a substrate, at least one semiconductor chip, and a number of at least two electrically conductive first connecting elements. The substrate has a bottom side and a top side spaced apart from the bottom side in a vertical direction. The at least one semiconductor chip is arranged on the top side. Each one of the first connecting elements has a first end which protrudes away from an insulation carrier of the substrate in a direction perpendicular to the vertical direction. The semiconductor system further includes a connecting system with a number of N?1 connectors. A first one of the connectors includes at least two electrically conductive second connecting elements. Each one of the second connecting elements has a first end. The first end of each one of the first connecting elements is electrically conductively connectable to the first end of one of the second connecting elements.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: February 4, 2014
    Assignee: Infineon Technologies AG
    Inventors: Thilo Stolze, Olaf Kirsch
  • Patent number: 8625303
    Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a first circuit board, an expansion slot, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, and first ground pins. A second edge connector is arranged on a top edge of the second circuit board and includes second power pins connected to a power unit, and second ground pins. A third edge connector is arranged on a bottom edge of the second circuit board and includes third power pins connected to the power unit, third ground pins, and signal pins connected to a display unit.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: January 7, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiao-Gang Yin, Guo-Yi Chen
  • Patent number: 8625302
    Abstract: An electronic device includes a main body and a port connector. The main body includes a printed circuit board, a bottom plate and a side plate cooperatively defining a opening. The printed circuit board is fixed parallelly to the bottom plate. The port connector includes an outer angled plate having a first wall, a second wall, and first pins and second pins. The first wall is attached to the bottom plate and defines first ports. The second wall is attached to the side plate and defines second ports. Each of the first pins is retained within one of the first ports and contacting the printed circuit board. Each of the second pins is retained within one of the second ports and contacting the printed circuit board.
    Type: Grant
    Filed: January 22, 2011
    Date of Patent: January 7, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yung-Hung Chu, Fu-Fa Le, Song-Ling Yang
  • Patent number: 8611097
    Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a first circuit board, an expansion slot, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, and first ground pins. A second edge connector connected to the expansion slot is arranged on a top edge of the first circuit board and includes second power pins connected to the first power pins, second ground pins, and four first signal pins connected to the control chip. A third edge connector engaged in the expansion slot is arranged on a bottom edge of the second circuit board and includes third power pins and four second signal pins connected to the second storage chips, and third ground pins.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: December 17, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiao-Gang Yin, Wei-Min He, Guo-Yi Chen
  • Publication number: 20130258631
    Abstract: A Printed Circuit Assembly has a multiplicity of connectors with each connector containing insulating matrices with each matrix containing a multiplicity of conducting or non-conducting standoffs with each standoff contacting one or more printed circuit boards. The standoffs permit controlled-impedance electrical connections, thermal management and mechanical rigidity of the overall assembly making the assembly suitable for use in any environment including the most harsh extremes.
    Type: Application
    Filed: April 2, 2012
    Publication date: October 3, 2013
    Inventor: Robert Winston Carter
  • Publication number: 20130155637
    Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a first circuit board, an expansion slot, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, and first ground pins. A second edge connector is arranged on a top edge of the second circuit board and includes second power pins connected to a power unit, and second ground pins. A third edge connector is arranged on a bottom edge of the second circuit board and includes third power pins connected to the power unit, third ground pins, and signal pins connected to a display unit.
    Type: Application
    Filed: December 29, 2011
    Publication date: June 20, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: XIAO-GANG YIN, GUO-YI CHEN
  • Patent number: 8431829
    Abstract: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.
    Type: Grant
    Filed: May 18, 2009
    Date of Patent: April 30, 2013
    Assignee: Ibiden Co., Ltd.
    Inventor: Michimasa Takahashi
  • Publication number: 20130094167
    Abstract: A serial advanced technology attachment (SATA) dual-in-line memory module (DIMM) includes a circuit board. A control chip and a number of storage chips are arranged on the circuit board. First and second extending boards extend from an end of the circuit board and are coplanar with the circuit board. A space is defined between the first and the second extending boards. A first edge connector is arranged on the first extending board and connected to the control chip. A second edge connector is arranged on bottom edges of the second extending board and the circuit board. A third edge connector is arranged on a top edge of the circuit board opposite to the bottom edge of the circuit board.
    Type: Application
    Filed: October 30, 2011
    Publication date: April 18, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHUN-PO CHEN, CHIA-MING YEH
  • Patent number: 8410375
    Abstract: A wiring board has a wiring member, a first reinforcing member and a second reinforcing member. The wiring member has wiring layers and insulating layers which are stacked, and the wiring layers include a first connecting electrode formed on a surface of the wiring member and a second connecting electrode formed on a back surface of the wiring member. A pin is formed on the second connecting electrode. The second reinforcing member is formed by a resin and serves to reinforce the wiring member. The first reinforcing member is formed on the whole back surface of the wiring member except for the pin provided on the second connecting electrode.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: April 2, 2013
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Yoshitaka Matsushita, Kazuhiro Oshima, Akio Horiuchi
  • Publication number: 20120275129
    Abstract: A mounting apparatus fixing an expansion card includes an expansion slot, two locking members connected to opposite ends of the expansion slot, for clamping the expansion card, and two latching members pivotably mounted to opposite ends of the expansion card, respectively. A latching portion protrudes from each of the latching members, for latching the corresponding locking member.
    Type: Application
    Filed: August 25, 2011
    Publication date: November 1, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: WEN-TANG PENG, GUANG-YI ZHANG, XIAO-ZHENG LI
  • Publication number: 20120195017
    Abstract: A circuit board assembly includes two external circuit boards, at least one electrical connector, at least one electronic component, and at least one hollow substrate. Each external circuit board includes an external electromagnetic shielding layer, a circuit layer and a dielectric layer. In each external circuit board, the dielectric layer is located between the external electromagnetic shielding layer and the circuit layer. The electrical connector is connected between the circuit layers located between the external electromagnetic shielding layers. The electronic component is disposed between the external circuit boards and connected with one of the circuit layers. The hollow substrate with plural openings is disposed between the external circuit boards. The electronic component and the electrical connector are located in the openings. Both a thickness of the electronic component and a height of the electrical connector are smaller than or equal to a thickness of the hollow substrate.
    Type: Application
    Filed: April 18, 2011
    Publication date: August 2, 2012
    Inventors: Hsiang-Chao LEE, Yun-Chih CHEN
  • Publication number: 20120120619
    Abstract: There is provided a communication device that includes a first circuit board which includes a first ground pattern (GND) and a first signal line formed on a substrate, a ground pin electrically coupled with the first GND, where the ground pin protrudes from an end of the substrate, and a signal pin formed in the substrate and electrically coupled with the first signal line, where the signal pin protrudes from the end. The communication device further includes a send circuit board which includes a second GND and a second signal line, wherein when an end of the circuit board is inserted into a space between the ground pin and the signal pin, the first signal line and the second signal line are electrically coupled with each other via the signal pin and the first GND and the second GND are electrically coupled with each other via the ground pin.
    Type: Application
    Filed: September 23, 2011
    Publication date: May 17, 2012
    Applicant: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventor: Eiichi KODERA
  • Patent number: 8174841
    Abstract: An array of contact pads on a semiconductor structure has a pitch less than twice an overlay tolerance of a bonding process employed to vertically stack semiconductor structures. A set of contact pads within the area of overlay variation for a matching contact pin may be electrically connected to an array of programmable contacts such that one programmable contact is connected to each contact pad within the area of overlay variation. One contact pad may be provided with a plurality of programmable contacts. The variability of contacts between contact pins and contact pads is accommodated by connecting or disconnecting programmable contacts after the stacking of semiconductor structures. Since the pitch of the array of contact pins may be less than twice the overlay variation of the bonding process, a high density of interconnections is provided in the vertically stacked structure.
    Type: Grant
    Filed: April 27, 2009
    Date of Patent: May 8, 2012
    Assignee: International Business Machines Corporation
    Inventors: Leland Chang, Matthew R. Wordeman, Albert M. Young
  • Patent number: 8164919
    Abstract: A motherboard includes a main body and two relay devices attached on the main body. The main body includes a signal output terminal, a signal input terminal, a first connector module, and a second connector module. Each relay device includes a circuit board, a relay, and a third connector module. The input terminal outputs an input signal to the corresponding relay via the first and the third connector modules in turn. The relay corresponding to the signal input terminal outputs the input signal to the signal output terminal via the third connector module corresponding to the signal input terminal, the first connector module, the second connector module and the third connector module corresponding to the signal output terminal in turn.
    Type: Grant
    Filed: December 13, 2009
    Date of Patent: April 24, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Ming-Chih Hsieh
  • Patent number: 8116093
    Abstract: A printed circuit board (PCB) includes a substrate having a first group of at least two via holes and a second group of at least two via holes formed therein, a first pad set of terminal pads and a second pad set of terminal pads formed on the substrate, and a first group of conductive connection members and a second group of conductive connection members formed in the substrate. The first group of the via holes are surrounded by the first pad set of the terminal pads and the second group of the via holes are surrounded by the second pad set of the terminal pads. The first and the second groups of conductive connection members fill up the first and second groups of the via holes. The first group of the conductive connection members are connected to the first pad set of the terminal pads and the second group of the conductive connection members are connected to the second pad set of the terminal pads.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: February 14, 2012
    Assignee: Samsung Electronics Co. Ltd.
    Inventors: Kwang-Soo Park, Jong-Hoon Kim
  • Patent number: 8107240
    Abstract: An electronic gaming machine interface system including a first circuit board, a bracket coupled to the first circuit board, a fan coupled to the bracket and disposed over the first circuit board, a second circuit board coupled to the bracket, a first cable coupled between a connector of the first circuit board and a connector of the second circuit board; and a second cable coupled between a connector of the first circuit board and a connector of the second circuit board.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: January 31, 2012
    Assignee: San Pasqual Casino Development Group Inc.
    Inventor: David Alan Spence, Jr.
  • Patent number: 8089007
    Abstract: A printed circuit board includes a reference layer, at least one first hole defined in the reference layer and adjacent from a first pin in a first column of pins of an electronic component, and at least one second hole defined in the reference layer and adjacent from a second pin of the electronic component. The at least one second hole is defined in the reference layer and opposite to the at least one first hole. The second pin is in a neighboring second column of pins from the first column of pins. A diameter of the at least one first hole is greater than a diameter of the at least one second hole such that a difference in current flowing through the first pin and the second pin is reduced.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: January 3, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ying-Tso Lai, Tsung-Sheng Huang, Shou-Kuo Hsu
  • Patent number: 8063316
    Abstract: In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.
    Type: Grant
    Filed: June 14, 2007
    Date of Patent: November 22, 2011
    Assignee: Flextronics AP LLC
    Inventor: Dan Gorcea
  • Patent number: 8018731
    Abstract: Interconnect substrate (1) that connects at least the first circuit board and the second circuit board. Interconnect substrate (1) includes housing (1) and connecting terminal electrodes for connecting the top and bottom faces of housing (10). Housing (10) has protrusion (11) on its outer periphery and opening (13) in its inner periphery.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: September 13, 2011
    Assignee: Panasonic Corporation
    Inventors: Daisuke Sakurai, Masato Mori, Yoshihiko Yagi
  • Patent number: 8018733
    Abstract: A circuit board interconnection system is disclosed according to the embodiments of the present invention. The system includes a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector. The first connector and the second connector are mounted at two sides of the first circuit board respectively so that the second circuit board mounted on the first connector is perpendicular to the third circuit board on the second connector. The first connector and the second connector mounted respectively at two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board. Another circuit board interconnection system, a circuit board, a connector assembly and a method for manufacturing a circuit board are disclosed according to the present invention.
    Type: Grant
    Filed: December 10, 2010
    Date of Patent: September 13, 2011
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Gongxian Jia
  • Publication number: 20110096520
    Abstract: A motherboard includes a main body and two relay devices attached on the main body. The main body includes a signal output terminal, a signal input terminal, a first connector module, and a second connector module. Each relay device includes a circuit board, a relay, and a third connector module. The input terminal outputs an input signal to the corresponding relay via the first and the third connector modules in turn. The relay corresponding to the signal input terminal outputs the input signal to the signal output terminal via the third connector module corresponding to the signal input terminal, the first connector module, the second connector module and the third connector module corresponding to the signal output terminal in turn.
    Type: Application
    Filed: December 13, 2009
    Publication date: April 28, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: MING-CHIH HSIEH
  • Patent number: 7911805
    Abstract: A method of forming contacts for an interconnection element, includes (a) joining a conductive element to an interconnection element having multiple wiring layers, (b) patterning the conductive element to form conductive pins, and (c) electrically interconnecting the conductive pins with conductive features of the interconnection element. A multiple wiring layer interconnection element having an exposed pin interface, includes an interconnection element having multiple wiring layers separated by at least one dielectric layer, the wiring layers including a plurality of conductive features exposed at a first face of the interconnection element, a plurality of conductive pins protruding in a direction away from the first face, and metal features electrically interconnecting the conductive features with the conductive pins.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: March 22, 2011
    Assignee: Tessera, Inc.
    Inventor: Belgacem Haba
  • Patent number: 7813142
    Abstract: A portable electronic device (20) includes a circuit board (21) and at least one conducting pole (22). The conducting pole is mounted on the circuit board and includes a breakable portion (2224), the breakable portion is configured to be the part that breaks when the conducting pole is crumpled.
    Type: Grant
    Filed: December 7, 2007
    Date of Patent: October 12, 2010
    Assignee: Chi Mei Communication Systems, Inc.
    Inventors: Kuan-Chang Lin, Ting-Chang Chang
  • Patent number: 7791185
    Abstract: An electrically conductive pin comprising a pin stern and a pin head attached to the pin stem. The pin head is adapted to be mounted onto a surface of a microelectronic substrate to support the pin stem. The pin head has an underside surface defining a continuous curve configured to allow gases to escape from a pin-attach solder region adjacent the underside surface.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: September 7, 2010
    Assignee: Intel Corporation
    Inventor: Mengzhi Pang
  • Patent number: 7619181
    Abstract: A control system suitable for use with a bathing unit system having a water receptacle is provided. The control system comprises a heating module, a power source and a controller in communication with the heating module and the power source. The power source includes an energy storage member for storing energy collected from a solar panel, and is operative for supplying power generated from solar energy to the heating module. The controller is operative for causing the power source to supply power to the heating module at least in part based on first information derived from a temperature of the water within the water receptacle and second information derived from a condition associated with the power source. The controller is further operative for selecting between a first power source and a second power source for supplying power to the heating module.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: November 17, 2009
    Assignee: Gecko Alliance Group Inc.
    Inventor: Michel Authier
  • Publication number: 20090244871
    Abstract: A light-emitting module for a lighting apparatus comprises at least two substrates, each provided with a printed circuit having an LED, and plural matching terminal blocks and buckles so that the substrates can be structured into a planar light-emitting module having a relatively large area by assembly of the terminal blocks and the buckles. The light-emitting module is adaptive to be used in a billboard, a traffic sign, a three-dimensional lighting apparatus or a lighting display screen.
    Type: Application
    Filed: March 28, 2008
    Publication date: October 1, 2009
    Inventor: Chi-Hsin Lin
  • Patent number: 7505284
    Abstract: An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: March 17, 2009
    Assignee: International Business Machines Corporation
    Inventors: Bert J. Offrein, Stefano S. Oggioni, Mauro Spreafico
  • Patent number: 7465882
    Abstract: Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias that link respective power and ground planes. The shielding conductors' presence in positions around a signal via is made possible through the employment of power plane and ground plane conductive grids that are laid out in rhomboid patterns. The power plane and ground plane grids possess a left-right mirror relation to one another and are displaced to place the rhomboid's corners to avoid overlapping any of the grid lines.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: December 16, 2008
    Assignee: International Business Machines Corporation
    Inventors: Wiren D. Becker, Zhaoqing Chen, George Katopis
  • Patent number: 7405473
    Abstract: Techniques are provided for placing and routing vias that conduct signals through a connector between two electrical units. Vias that conduct a first set of signals are placed next to vias that provide return paths for the first set of signals to reduce cross-talk or impedance. Vias that conduct input or output signals can be placed next to vias that provide return paths for the input or output signals to reduce cross-talk. The vias that provide the return paths can conduct, for example, ground signals, power supply signals, or both. Vias that conduct power supply signals can be placed next to vias that provide return paths for the power supply signals to reduce impedance. The vias that provide the return paths for the power supply signals can conduct, for example, ground signals. The via configurations reduce cost and increase yield, and the via configurations are modular.
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: July 29, 2008
    Assignee: Altera Corporation
    Inventors: Hong Shi, Yuanlin John Xie
  • Patent number: 7385792
    Abstract: An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is connected to the common power source wiring via a via-hole va having an impedance larger than that of the exclusive source line. Similarly, the electronic control apparatus includes an exclusive ground line for the charge pump circuit which is discriminated from a common ground line. The exclusive ground line is connected to the common ground via an additional via-hole vb. Furthermore, a noise-suppressing capacitor C is connected between the exclusive power source and around lines.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: June 10, 2008
    Assignee: Denso Corporation
    Inventors: Mitsuhiro Kanayama, Toru Itabashi
  • Patent number: 7362590
    Abstract: A patch panel includes a back plane having front mounted pairs of termination locations, and an interconnect location electrically connected to each pair of termination locations. The termination locations connect to two patch cords. The interconnect location defines an access device for selectively accessing the termination locations. An interconnect module interfaces with the interconnect location. The module can include test access, power over Ethernet, or circuit protection features.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: April 22, 2008
    Assignee: ADC Telecommunications, Inc.
    Inventors: Joseph C. Coffey, John D. Schmidt
  • Patent number: 7347736
    Abstract: A USB device in which all of the devices ICs are located on a lower surface of a PCB (i.e., opposite to the metal contacts) to minimize the device's thickness, and at least one of the ICs is positioned on a relatively narrow portion of the USB plug to minimize the device's length. A card-like carrier for protecting the USB device when not in use includes a frame-like base portion having peripheral walls surrounding a relatively wide main chamber, and an end portion that is attached to the base portion and includes end walls that define a relatively narrow slot communicating with the main chamber. The USB device plug structure is inserted through the main chamber into the slot until a front edge of the handle structure abuts the end walls, and then the device is rotated downward into the main chamber.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: March 25, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventor: Jim Ni
  • Patent number: 7349225
    Abstract: A composite sandwich structure with embedded electronics, that in one embodiment includes two multilayered composite facesheet laminates, a central core, embedded electronic components within the central core region, embedded electrical conductors within the central core region, and two multilayer printed circuit laminates that are secondarily bonded or cured to the inner surface of the sandwich facesheet laminates. The electronic components and electrical conductors, which are located in the central core region of the sandwich element, are attached to one or both of the two circuit laminates.
    Type: Grant
    Filed: October 22, 2003
    Date of Patent: March 25, 2008
    Assignee: Odyssian Technology, LLC
    Inventor: Barton E Bennett
  • Patent number: 7310240
    Abstract: An apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard. The apparatus comprises a printed circuit board, a connector on the printed circuit board, and at least one capacitor on the printed circuit board. The connector is configured to fit into one of the expansion slots on the motherboard, and comprises at least one power pin and at least one ground pin. The at least one capacitor is connected to the power and ground pins of the connector and has sufficient capacitance to buffer power transients within the supply power to the expansion slots.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: December 18, 2007
    Assignee: OCZ Technology Group, Inc.
    Inventor: Ryan M. Petersen
  • Patent number: 7307354
    Abstract: An integrated circuit (IC) carrier assembly includes a printed circuit board (PCB). A carrier is soldered to the PCB. The carrier includes a grid of electrical contact islands surrounding a receiving zone for receiving an IC. Pairs of adjacent islands are interconnected by respective resilient suspension means. The IC is received in the receiving zone and is electrically coupled to a number of the plurality of islands adjacent to the receiving zone. The IC is fast to a retainer, and the retainer is fast with the number of the plurality of islands and the IC.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: December 11, 2007
    Assignee: Silverbrook Research Pty Ltd
    Inventor: Kia Silverbrook
  • Patent number: 7290330
    Abstract: A system including a circuit board and several pluggable modules coupled to the circuit board. The several pluggable modules are insertable through side-by-side slots in an enclosure in which the circuit board resides. A first pluggable module is coupled to the circuit board via a first connector, while a second pluggable module is coupled to the circuit board via a second connector such that the second pluggable module is laterally offset from the first pluggable module. The first and second connectors are right angle connectors, and the second right angle connector is inverted relative to the first right angle connector. The first and second pluggable modules are I/O modules for transporting high speed differential signals, and wherein the first pluggable module includes several XFP connectors, and wherein the second pluggable module includes several SFP connectors. The second pluggable module includes several SFP connectors arranged on both sides of the pluggable module.
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: November 6, 2007
    Assignee: EMC Corporation
    Inventors: Steven D. Sardella, Stephen E. Strickland, Bassem N. Bishay, Thomas J. Connor, Jr.
  • Patent number: 7289333
    Abstract: A first circuit board connectable to a second circuit board is disclosed. The first circuit board includes at least one set of contacts, a detection circuit, and a voltage generator. Each set of contacts is configured to receive an electrically conductive keypin for bridging a set of the contacts. The detection circuit is in signal communication with the contacts and produces a logic signal in response to a set of the contacts being bridged. The voltage generator is responsive to the logic signal and produces a voltage signal at a connector connectable to the second circuit board. The voltage signal at the connector has a first voltage in response to the keypin being disposed at a first location, and a second different voltage in response to the keypin being disposed at a second location, wherein at least one of the pin locations results in a set of the contacts being bridged.
    Type: Grant
    Filed: September 9, 2004
    Date of Patent: October 30, 2007
    Assignee: General Electric Company
    Inventors: William Arthur Warner, II, David Shannon Slaton
  • Patent number: 7249978
    Abstract: A USB device in which all of the devices ICs are located on a lower surface of a PCB (i.e., opposite to the metal contacts) to minimize the device's thickness, and at least one of the ICs is positioned on a relatively narrow portion of the USB plug to minimize the device's length. A card-like carrier for protecting the USB device when not in use includes a frame-like base portion having peripheral walls surrounding a relatively wide main chamber, and an end portion that is attached to the base portion and includes end walls that define a relatively narrow slot communicating with the main chamber. The USB device plug structure is inserted through the main chamber into the slot until a front edge of the handle structure abuts the end walls, and then the device is rotated downward into the main chamber.
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: July 31, 2007
    Assignee: Super Talent Electronics, Inc.
    Inventor: Jim Ni
  • Patent number: 7247941
    Abstract: A printed circuit board (PCB) assembly includes a PCB. An integrated circuit (IC) carrier defines a receiving zone to receive an IC. The carrier has a plurality of island portions about the receiving zone. Each island portion includes a solder member for contacting the PCB. A plurality of resilient serpentine members interconnect neighboring island portions so that at least some relative displacement of the PCB and the carrier is accommodated by the serpentine member, thereby alleviating strain imparted to the solder member.
    Type: Grant
    Filed: November 3, 2006
    Date of Patent: July 24, 2007
    Assignee: Silverbrook Research Pty Ltd
    Inventor: Kia Silverbrook