Abstract: An earphone jack is fixed on a printed circuit board by soldering as well as a first holding rib and a second holding rib for holding in the horizontal direction and a third holding rib for holding in the perpendicular direction with respect to the printed circuit board are provided on a shield case. The shield case is held in the perpendicular direction with respect to the printed circuit board by a fourth holding rib provided on the case.

Abstract: An electromagnetic shielding system for a printed circuit board includes a shielding enclosure having a plurality of side walls and an integral top surface, the top surface including a scored line for allowing removal of an interior portion of the top surface to thereby define a remaining perimeter rim, and a replacement cover for attachment to the remaining cover rim. The replacement cover includes a metal foil having an adhesive surface or a sheet metal material.

Abstract: An electromagnetic isolation apparatus for an electronic device such as a portable telephone is provided which includes first and second shield cases and elastic members such as rubber cushions. The first and second shield cases are disposed within a casing of the electronic device to surround at least part of both surfaces of a printed circuit board mounted within the electronic device. The elastic members are interposed between an inner wall of the casing of the electronic device and an outer surface of the first shield case and between the inner wall of the casing and an outer surface of the second shield case to produce elastic pressures urging the first and second shield cases into conductive engagement with the printed circuit board.

Abstract: A CPCI system is adapted to reliably detect the presence of all front cards, whether hot swappable or not. The system includes a line that is used to detect the presence of a front card. The line is connected to a connector-pin of a slot. The line is also connected to a pull-up resistor so that when a front card is not inserted in the slot, the line has a high value. When a front card is inserted in the slot, the connector-pin mates with a corresponding connector-pin in the front card. The corresponding connector-pin is connected to a ground layer of the front card so that the line becomes grounded. The voltage level on the line is input to a register that outputs a high or low to a circuit for detecting the presence of a front card. The circuit may be a hot swap controller, a CPU or a status indicator. Accordingly, depending on the output of the register, the circuit reliably determines whether a front card is present in the particular slot.

Abstract: The present invention provides a cellular phone comprising: a housing having front and rear casings wherein the rear casing comprises a metallic layer coated on an inner side of the rear casing for insulating electromagnetic radiation, a circuit board installed in the housing having a board surface and an antenna connector installed at an upper end of the board surface, an antenna installed at an upper end of the housing and electrically connected with the antenna connector at the upper end of the board surface for receiving or emitting electromagnetic radiation, and an elastic conductor.

Abstract: An entertainment device has a metal shielding member that covers the CPU and image processing unit and a flexible sheet that is interposed between the CPU and metal shielding member. The metal shielding member contains metal oxide magnetic particles for cutting off electromagnetic radiation generated from the CPU and image processing unit, while the flexible sheet is positioned to radiate heat away from the CPU and image processing unit.

Abstract: Method and system for shielding a circuit board from electrostatic discharge and from mechanical damage. A circuit board shield of dimensions roughly equivalent to those of the circuit board that the circuit board shield is designed to protect is manufactured to contain apertures complementary in shape, size, and position to heat-producing components affixed to the surface of a circuit board. When the circuit board shield is placed on top of the circuit board, the heat-producing components of the circuit board remain exposed to an external environment via the apertures, while other parts of the circuit board are protected from electrostatic discharge and mechanical damage by the overlying circuit board shield.

Abstract: A contact arrangement for an electrically contactable module that is arranged on a card-shaped carrier, having a first contact bank with a plurality of contact areas, of which at least one is disposed outside of a predefined region. A second contact bank is provided having at least one contact area within the predefined region, and the contact areas of the first contact bank that are arranged outside of the predefined region are in each case electrically connected to contact areas of the second contact bank. Consequently, for example, both chip cards according to ISO 7816 and multimedia card modules can be evaluated by a chip-card reader provided for evaluating ISO-7816 chip cards. At the same time, the ability of the MMC modules to be evaluated by an MMC-module reader provided for that purpose is retained.

Abstract: An integrated circuit device as a first IC chip, a second IC chip, and a circuit board having a hole formed therein that is large enough to permit the second IC chip to be accommodated therein. The first and second IC chips are bonded together so as to be electrically connected together, and the first IC chip is mounted on the circuit board with the second IC chip accommodated in the hole formed in the circuit board. Here, one of the IC chips forming a chip-on-chip structure is accommodated in the hole formed in the circuit board, making further thickness reduction possible. Moreover, the obverse surfaces of the IC chips are located closer to the circuit board, making possible wireless mounting of the IC chips, despite forming a chip-on-chip structure, on the circuit board through connection using bumps. This helps reduce trouble due to inductance in a circuit that handles a high-frequency signal.

Abstract: An apparatus and method for shielding electrical components mounted on a printed circuit board (PCB) from electromagnetic and radio frequency interference by reducing the dissipation of heat away from solder joints. In an embodiment of the invention a radio frequency (RF) shield for a printed circuit board comprises a shield for RF shielding a portion of the PCB having electronic components mounted thereon. The shield has a first portion and a second portion, wherein the first portion has a reduced cross sectional area, for reducing heat conduction between the first and the second portion when the first portion of the shield is inserted into a first plurality of holes in the PCB, for soldering the first portion of the shield to a copper foil of the PCB.

Abstract: An invention relates to an apparatus for shielding an electronic circuit situated on a printed circuit board in an electrically conductive housing which has at least one opening and/or bushing, in which a shielding tube extends from the printed circuit board as far as the housing and encompasses the opening and/or the bushing, and a device for length equalization of the shielding tube forms an electrical contact of the shielding tube independently of tolerances between the printed circuited board and the housing.

Abstract: An EMI shield that utilzes perforated dimples or other features configured to reflect electromagnetic radiation while simultaneously permitting air flow through the shielding material.

Abstract: A method and implementing electronic tri-plate connection system are provided including a nested set of RF Faraday cages within the system with integrated circuit packages containing the core drivers and receivers as the innermost Faraday cage, and additional Faraday cages being implemented at each outward level through card, board, backplane and unit level and into the network level. There is no distinction between power ground, signal ground or shield ground. All grounds throughout the system are at the same level and all package ground levels are interconnected.

Abstract: The present invention is directed to electronic components shielded from electromagnetic interference through the use of conforming shield enclosures. Conforming shield enclosures are flexible metalized thermoformed thin-wall polycarbonate polymer film substrates used to shield a radiation source. The present invention relates to conforming shielded forms for electronic component assemblies and specifically to electronic component assemblies which are shielded to protect against electromagnetic and radiofrequency interference. Specifically, the shielded electronic component assembly comprises (a) a semiconductor device to be shielded from electromagnetic frequencies; (b) a reference potential source; (c) a housing enclosing the semiconductor device within the assembly; and (d) a conforming shield enclosure electrically connected to the reference potential source.

Abstract: Metal spring gaskets for EMI shielding in linecard plug-in units are improved by coverings of conductive fabric adhered to the springs with conductive adhesive.

Abstract: A VCR having a preamplifier circuit which is physically incorporated with its main circuit board. The VCR includes a deck (31) for picking up a video signal, a connector cable (33) for supplying the video signal picked up by the deck to the preamplifier, a main board (35) on which the preamplifier is incorporated, and a shield case (34) for shielding the preamplifier and electrically contacting a wide portion of the deck (31). It is possible to improve manufacturing productivity with such an arrangement where the preamplifier is incorporated onto the main circuit board, because the process steps for assembling the separate preamplifier board (25) are omitted. It is also possible to reduce noise interference since the shielding case (34) for shielding the preamplifier is installed level with the deck portion (31), thus enlarging the electrical contact area between the shielding case (34) and the deck (31) to provide enhanced grounding.

Abstract: Optoelectric mounting and interconnect apparatus includes housing designed to be engaged in receiving equipment. An optoelectric module is mounted in the housing and includes a ferrule with a lens assembly engaged in the ferrule along the optical axis. One end of the ferrule is formed to receive an optical fiber positioned adjacent the lens assembly and an optoelectric device is affixed to a second end of the ferrule so that light traveling along the optical axis appears at the optoelectric device. A printed circuit board is attached to the housing and electrically coupled to the optoelectric device and has external equipment connections and at least one ground potential connection. A metal can surrounds the module and the printed circuit board so as to extend from receiving equipment to external equipment.

Abstract: A substantially planar, laminated electromagnetic interference shield for use around I/O ports in electronic equipment enclosures such as computer cabinets and other electronics includes a resilient foam core, a metallized fabric or cover laminated to the core, and a stiffener bonded to at least one of the core and the fabric. The shield may be manufactured on a process line which laminates and bonds the elements together, die cuts the I/O port apertures, and prints identifying indicia on the shield.

Abstract: An electrical apparatus includes a circuit board received in a housing and mounted removably with an electronic component thereon. The circuit board has a set of ground contacts disposed around the electronic component. The housing has a wall portion formed with an access opening to permit access to the electronic component on the circuit board. A cover member includes a dielectric cover plate mounted detachably on the housing so as to cover the access opening. The cover plate is mounted with a conductive grounding plate that is formed integrally with a set of contacts extending into the housing via the access opening so as to establish electrical contact with the ground contacts on the circuit board when the cover member covers the access opening. The ground contacts and the grounding plate cooperate to provide electromagnetic interference shielding to the electronic component.

Abstract: A unique solar shield and a solar-ray shielding method are disclosed. The solar shield of the present invention is divided essentially into two parts—a wrapping member and a mounting plate. The wrapping member wraps around an electronic device. The mounting plate holds the wrapping member around the electronic device. The electronic device is fixedly attached to the mounting plate using known fasteners such as bolts. The solar shield shields the electronic device from solar rays and prevents unwanted heat absorption due to the solar rays.

Abstract: According to the invention, an electromagnetic radiation shielding cap is located over an electronic cartridge substrate. The electromagnetic radiation shielding cap includes an electromagnetic radiation shielding plate and an electromagnetic radiation shielding rim extending around a periphery of the electronic cartridge substrate. An edge of the electromagnetic radiation shielding rim contacts a thermally and electrically conductive heat plate located on an opposing side of the electronic cartridge substrate. The heat plate and the electromagnetic radiation shielding cap jointly define an electromagnetic radiation shielding enclosure around the electronic cartridge substrate.

Abstract: An electronic device having a cabinet formed from two halves that are joined together have provided therein multiple boards that are stacked and housed. The joining of the cabinet halves secures the boards in position within the cabinet and assures electrical continuity between boards, such that the positioning and arrangement of the boards within the cabinet upon assembly of the cabinet is not compromised by the cabinet being moved or flipped over.

Abstract: In order to obtain electromagnetic shielding and hermetic shielding for a high frequency circuit easily and surely, a complex adhesive sheet is provided at the joint between a metal stem (1) and a metal cap. The complex adhesive sheet comprises an electromagnetic shielding adhesive sheet (21) and a hermetically sealing adhesive sheet (22) that have been joined by thermo-compression bonding into inside and outside ring shapes, respectively.

Abstract: An electromagnetic interference shielding arrangement, includes a duplex optical transceiver having a light-emitter and a light-receiver disposed adjacent to each other and at an end of the optical transceiver. A first electromagnetic interference shield covers a major portion of the optical transceiver. A tailstock has an aperture disposed in alignment with the end of the optical transceiver. A second electromagnetic interference shield is positionable to shield the end of the optical transceiver. The second electromagnetic interference shield includes a pipe formed from a conductive material. The pipe has two opposing openings, and an axis extending from one of the openings to the other of the openings. The pipe has a profile that corresponds to a profile of the end of the optical transceiver. A septum is attached to the pipe. The septum is formed from a conductive material. The septum is arranged to extend in a direction that is at an angle to the axis.

Abstract: A modular support and casing is provided with a selected circuit breadboard and circuit testing module for circuit construction and testing. Electrical and electronic components may be removably and interchangeably mounted on the circuit breadboard for constructing an electrical or electronic circuit in circuit development. A plurality of selective side plates are slidably and securely mounted on the longitudinal side edge portions of the support base. Auxiliary components such as switches and connectors may be conveniently provided in pre-formed openings on these side plates for ease in the circuit construction. A top cover is provided to maintain the side plates securely in place. The side plates form the side panels of the cover to provide a complete enclosure for protecting the electrical or electronic circuit thus constructed.

Abstract: An electronic apparatus comprises a box-like casing. A substrate mounting section to which a wiring substrate is mounted is arranged within the casing. The substrate mounting section includes a guide section for determining the installing position of the wiring substrate. The wiring substrate is covered with a flexible insulator. Further, the insulator includes a fixed end fixed to the casing and a free end that is caught in the casing. The free end of the insulator is caught on the casing so as to have the wiring substrate held between the insulator and the substrate mounting section.

Abstract: An electronic retainer for preventing electromagnetic interference and capable of being absorbed mechanically is disclosed. The retainer has a through hole therein, and a temperature tolerant rubber piece is matched in the through hole. The temperature tolerant rubber piece is filled in the through hole of the retainer so that the retainer has a solid center. Therefore, the retainer can be absorbed by a robotic arm so that material-taking and assembly of the retainer is performed automatically. Thus, the manufacturing process is rapid and mass production can be achieved. Moreover, a screw passes through the through hole of the retainer and the fixing hole of the circuit board so that the retainer is fixed to a casing. By contacting of the screw 30 with the retainer 10, the circuit board may be electrically grounded through the tin ring, retainer, screw and the casing for achieving the object of preventing electromagnetic interference and thus the object of electromagnetic shielding is achieved.

Abstract: A shield member for an electronic apparatus comprises a contact portion that extends outwardly from the shield member. The shield member is attached to an electronic apparatus slot unit and spans between the slot unit and a radiation unit via the contact portion. The contact portion creates a grounding potential between the slot unit and the radiation member.

Abstract: Methods and apparatus for adding additional circuitry (19) to a circuit board (11) having a radiation shield (14) associated therewith include the additional circuitry (19) mounted onto a flex circuit (21) which in turn is mounted on the radiation shield (14). A conductor (32) containing portion (24) of the flex circuit (21) extends therefrom and is routed around and through a cutout (18) in the bottom surface of the radiation shield (14). The conductor (32) is connected to the printed circuit board (11) at the location of the cutout (18) in the radiation shield (14).

Abstract: A method for forming a telecommunications modular cardholder comprises providing a generally flat workpiece; cutting a handle in the workpiece while leaving the handle attached to the workpiece; and forming a front portion from the workpiece. The front portion is substantially perpendicular to a body portion of the workpiece. The front portion and the body portion of the workpiece form a modular face plate. The method also includes bending the handle with respect to the workpiece and the front portion to form a handle facing a desired direction.

Abstract: A construction and method are provided for electronically shielding an electronic component and for removing heat generated by the component. The construction and method involve the use of a shielding can, formed with EMI shielding material that surrounds the electronic component and a lid or cap that both contacts and forms a heat sink with the component and also provides a shielding effect as it acts as the cap for the shielding can.

Abstract: The invention provides a substrate layout method and structure of a ball grid array to reduce cross talk of adjacent signals. The substrate comprises a plurality of signal pads formed on a die, a ring around the die, and a plurality of signal fingers around the ring. The substrate layout method for reducing cross talk of adjacent signals is as follows: First, forming a guard pad between two adjacent signal pads. Second, forming a guard finger between two adjacent signal fingers. Next, forming a bonding wire to connect the guard pad to the ring. Then, forming another bonding wire to connect the ring to the guard finger. Subsequently, forming a guard trace to connect the guard finger to a via at the edge of the substrate, and connecting the guard trace to a short-circuiting place through the via.

Abstract: A apparatus and a method of isolating two cavities within an electrical equipment by using a S-shaped plate having fingers on opposite sides such that the S-shaped plate may be installed between two open ended inner walls.

Abstract: A shielded housing for accommodating electronic circuits or components which are sensitive to electromagnetic interference fields or radiate interference fields, is fitted with an electrical connection in the form of a connecting cable, connecting plug or the like. This housing includes a shielding in the form of a closed metallic coating (of a conductive material) and, moreover, includes filter devices which are active against interference fields in particular in the area where the connection enters or penetrates the housing. In accordance with this invention, at least in the area of entry or lead-in, filter devices with capacitors are provided which are embodied as integral components of the connecting elements and of the shielding and, possibly, of the housing walls, also.

Abstract: Disclosed is an electromagnetic wave shielding apparatus for shielding electromagnetic waves generated from a circuit so as to prevent the electromagnetic waves from being leaked to the outside of the circuit. The apparatus includes a metal member disposed in such a manner as to be opposed to the circuit, and an electromagnetic wave absorbing member disposed on the metal member, wherein the electromagnetic absorbing member is composed of a carbon layer and coil-like carbon fiber structures. The apparatus is allowed to simply obtain an electromagnetic wave absorbing function without increasing the weight of the apparatus.

Abstract: An electronics housing enabled to compensate for the accumulation of dimensional tolerances to enable reliable connection between one or more connectors mounted to internal electronic components and external connectors from one or more external devices. An alignment plate is provided that adapts an aperture in the housing to the connectors. The alignment plate is adapted to account for tolerance accumulation by being positional within the housing while substantially covering the space between the connectors and the housing aperture. The alignment plate in cooperation with an EMI a shield provides electromagnetic shielding about the connectors.

Abstract: The circuit board of the present invention makes the length of the conductor patterns shorter and improves the electric performance for the high speed signal processing. The circuit board of the present invention, which comprises a substrate, is characterized in that the substrate includes: a first face on which conductor patterns, which will be connected to a semiconductor chip, are formed; a second face on which a plurality of pads, on which terminals are formed, are matrically formed; and plated through holes whose one end are respectively opened in the conductor patterns and whose the other ends are respectively opened in the pads, wherein inner faces of the plated through holes are coated with plating layers so as to respectively electrically connect the conductor patterns with the pad.

Abstract: A shielding gasket is affixed to a shield housing for interposition between the shield housing and a circuit board of an electronic device. The circuit board includes a plurality of electronic components and related circuitry and the arrangement of the shield housing and the shielding gasket provide for inter-component shielding of the plural electronic components from one another, together with corresponding related circuitry, as well as overall shielding of the plural electronic components on the circuit board. To that end, the shielding gasket includes partitions integral with the shielding gasket for extending between the electronic components, the partitions engaging the shield housing such that the shield housing and the partitions complete inter-component shielding of the electronic components and related circuitry from one another.

Abstract: A variable size bracket is provided for use with a low profile card mounted in either a low profile computer chassis, or a standard profile computer chassis. The bracket is a multi-portion bracket adjustable between a first bracket size and a second bracket size. A first bracket portion is of the first bracket size and covers a first size opening. A low profile card is attached to the first bracket portion. A second bracket portion is attached to the first bracket portion for extending the bracket to the second bracket size to cover a second size opening, greater than the first size opening, and for reducing the multi-portion bracket to the first bracket size to cover the first size opening.

Abstract: An exemplary embodiment is a method and apparatus for a multiple card enclosure. The multiple card enclosure is arranged for mounting a mother card enclosure and a daughter card enclosure and at least another daughter card enclosure. The mother card enclosure has a first and second daughter card enclosure removably inserted into the mother card enclosure for connecting the first and second daughter card with the mother card. The first daughter card enclosure and the second daughter card enclosure are independently removable to facilitate interchanging the first daughter card and the second daughter card. The daughter card enclosures connected to the mother card enclosure are enclosed in the multiple card enclosure and a mother card connects to a back plane connector of a logic board.

Abstract: A computer system housing for providing an attenuating barrier for electromagnetic interference (EMI) noise. The computer system housing includes a backplane wall having a plurality of connectors for receiving PCB's, and a bulkhead wall coupled to the backplane wall. The bulkhead wall defines a plurality of bulkhead slots through which connector receptacles of printed circuit boards (PCB's) can extend. An EMI bulkhead gasket is positioned on the bulkhead wall. A conductive metal impregnated, elastomer EMI gasket is positioned on a mounting flange of the bulkhead wall. The computer system housing also includes a plurality of bulkhead plates. The bulkhead plates contact the EMI bulkhead gasket and the elastomer EMI gasket along their entire peripheral edges so that EMI noise is conducted through these gaskets to the bulkhead wall. The computer system housing further includes a bulkhead plate alignment and mounting system that does not employ separable fasteners.

Abstract: An integrated computer module having an EMI shielding plate which doubles as a mechanical retainer for a disk drive within the module and as an shield to insulate the disk drive's electronics from electromagnetic interference (EMI) emanating from a main PCBA located nearby. The module is adapted for removable insertion into a docking bay within a host assembly, and upon such insertion for connecting to a host connector and thereby controlling a display device.

Abstract: An electronics assembly incorporating an interconnect includes a conductive gasket disposed between a first printed circuit board and a second printed circuit board. The gasket surrounds, and thereby shields, the interconnect while providing an RF ground connection between the two boards with a controlled RF impedance. The second printed circuit board may serve as a connector board for a plurality of modules, or other printed circuit boards, to be coupled thereto. Each module is individually covered with a separate lid. Methods for manufacturing and assembling structures according to the invention are also provided.

Abstract: A chip package includes a die having an active surface and an inactive surface. An adhesive is formed on the inactive surface where the adhesive has a low Young's modulus of elasticity. The low Young's modulus of elasticity may be 10,000 psi or less; 1,000 psi or less; or, preferably, about 1,000 psi. Further, the adhesive may include a thermal conducting material. A protective plate is coupled to the inactive surface using the adhesive and a chip carrier is coupled to the active surface of the die.

Abstract: An enclosure and method of making the same provides mounting provisions for shields of expansion cards in a general purpose computer that reduce the number of components and manufacturing steps to produce the enclosure, as well as reducing the time required to add or remove expansion cards. In particular, a housing of an enclosure incorporates a shield mount to receive a shield having an extending tongue and a lateral tab. A specific example of such a shield is tail stock for a Peripheral Component Interconnection (PCI) expansion card. In particular, a receptor is formed into the housing for receiving the extending tongue of the shield. A support member extends outward from the enclosure to abut an outwardly bent tab of the shield that projects out of the panel through a tab opening adjacent to the support member. The support member includes a locking detent that fits within a locking recess in the tab of the shield.

Abstract: An electronic device has a chassis having a plurality of structural members with slots located therebetween. The slots serve as conduits between electronic components located within the electronic device and peripheral devices. The structural members are folded to provide reinforcement. The reinforcement allows the structural members to be relatively small and to have a plurality of ventilation holes formed therein. A gasket is placed between the chassis and the electronic components to attenuate EMI passing through the chassis. The gasket has a plurality of tabs formed thereon that serve to bias the gasket against the electronic components and to electrically connect the electronic devices to the chassis.

Abstract: An electronic component is described and has a dielectric layer which is constructed on a substrate, conductive surfaces that are constructed on the dielectric layer, and an electrically conductive guard structure. The guard structure is disposed in a plane above the conductive surfaces such that the conductive surfaces are not completely covered by the guard structure.

Abstract: An integrated circuit socket assembly including a frame and a contact assembly has EMI shielding integral with the socket frame. In one embodiment, the integrated circuit socket includes a cocket for a Land Grid Array (LGA) or Ball Grid Array (BGA) device. EMI shielding in the form of a conductive shielding member is disposed in opening that extend through side portions one each of the sides of the frame. The conductive shielding members extend slightly below the lower surface of the the frame so as to make contact with cooperative conductive areas on a printed circuit board when the socket assembly is mounted to the printed circuit board in amounting position. The conductive shielding members may extend above the upper surface of the frame so as to contact a conductive heat sink mounted above the socket assembly. In a preferred embodiment, the conductive members comprise resilient conductive shielding members.

Abstract: The invention relates to a subrack (9) for a composite subrack (14) for receiving modules. Furthermore, the tow subracks (9) arranged one vertically above the other. The invention is distinguished by the fact that the composite subrack (14) contains at least two subracks (9), the upper side (20) and underside (24) of which are respectively provided with at least one clearance (13) over a large area, and two shielding plates (7) are provided, shielding the upper side (20) of the upper subrack (9) and the underside (24) of the lower subrack (9).

Abstract: An apparatus for aligning a bracket member of a circuit board assembly as the bracket member is positioned against and secured to an electronic chassis is provided. A circuit board assembly includes a circuit board operatively attached to a bracket member. The bracket member includes a first end, a second end, an outer surface and an inner surface. A gasket is longitudinally oriented along the outer surface of the bracket member. A first pin extends from the inner surface adjacent the first end, and a second pin extends from the inner surface adjacent the second end. An electronic chassis includes a top flange and a bottom flange. The top flange includes a top flange opening and the bottom flange includes a bottom flange opening. The first pin is aligned with and extends through the top flange opening and the second pin is aligned with and extends through the bottom flange opening to align the bracket member as the bracket member is positioned against and secured to the electronic chassis.