With Shielding Structure Patents (Class 361/800)
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Patent number: 6621708Abstract: An electronics assembly comprises: (i) a frame (1); (ii) a motherboard (16) that is located within the frame; and (iii) one or more daughterboards (20) that extend in a plane generally perpendicular to the plane of the motherboard. The motherboard has a protective shield (40, 52) that extends over the major surface of the motherboard that is oriented toward the or each daughterboard. The shield has one or more apertures (54) therein to allow electrical connection between the motherboard and the or each daughterboard.Type: GrantFiled: June 10, 2002Date of Patent: September 16, 2003Assignee: Sun Microsystems, Inc.Inventors: Stephen David Sparkes, Gary Simon Rumney
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Patent number: 6620999Abstract: A method and apparatus is provided for reducing electromagnetic radiation emissions. The method and apparatus of the present invention also reduce or prevent electromagnetic radiation generated by sources outside of a system assembly from interfering with and adversely affecting electrical circuits in the assembly. An electromagnetic compatibility (EMC) solution uses a lossy element, and/or an element comprised of a combination of lossy and conductive material.Type: GrantFiled: June 15, 2001Date of Patent: September 16, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: David Pommerenke, David Dickey, James J. deBlanc, Victoria Tsang Tam, Kenneth K. Tang
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Publication number: 20030169580Abstract: A keyed filler panel with removably-coupleable airflow resistive filler card assembly is disclosed. In one embodiment, the present invention is comprised of a filler panel body. The present embodiment is further comprised of an airflow resistive filler portion removably-coupleable with said filler panel body. The airflow resistive filler portion adapted to couple with the filler panel body without additional hardware.Type: ApplicationFiled: March 7, 2002Publication date: September 11, 2003Inventors: Michael A. Brooks, Glenn C. Simon, Sean A. Cerniglia
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Patent number: 6618271Abstract: An EMI shield for ports providing access to expansion cards received in the chassis of an electronic device comprises a gasket suitable for being disposed between the chassis and the expansion card bracket. The gasket includes an aperture overlying each of the ports and a plurality of generally flattened U shape fingers formed in the gasket adjacent to each aperture for engaging the bracket to provide EMI grounding between the bracket and the chassis.Type: GrantFiled: April 1, 2002Date of Patent: September 9, 2003Assignee: Gateway, Inc.Inventors: Vernon D. Erickson, David R. Davis, Cesar D. Castillo, Richard A. Gibson, Armando Rocha
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Patent number: 6618270Abstract: An EMI shielded system in which a motherboard is permanently shielded behind a shielding plate defining an aperture for each corresponding connector carried by the motherboard so as to allow expansion cards or the like to be connected to the motherboard without having to unshield the latter. The expansion cards are preferably separately mounted and shielded within respective loading cartridges.Type: GrantFiled: February 27, 2001Date of Patent: September 9, 2003Assignee: Trioniq Inc.Inventors: André Babin, Daniel Bindley
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Patent number: 6614665Abstract: A cable management bracket for a telecommunications rack. The bracket includes an elongated member having a length sized to extend across a width of the rack. A plurality of fingers project outwardly from the elongated member. The fingers are spaced apart along the length of the elongated member. Gaps sized to receive telecommunications cables are positioned between the fingers. Bend radius limiters are preferably connected to the fingers to prevent cables passing through the gaps from being bent beyond predetermined bend radius requirements.Type: GrantFiled: April 16, 2001Date of Patent: September 2, 2003Assignee: ADC Telecommunications, Inc.Inventors: Amy J. Witty, Todd Michael Bade
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Patent number: 6614661Abstract: The covering device covers a ceramic module with electronic components arranged between a ceramic substrate and an upper covering plate of the covering device. The covering device is spaced apart by spacers from the surface of the ceramic substrate fitted with components. The covering device is fixed on the ceramic module by snap-in elements which engage in lateral cutouts in the ceramic substrate.Type: GrantFiled: July 5, 2001Date of Patent: September 2, 2003Assignee: Infineon Technologies AGInventors: Christian Gottswinter, Bernd Stadler, Oskar Neuhoff
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Publication number: 20030161132Abstract: The conventional communication device has a problem in that it is difficult to efficiently lower the temperature of a heat generating element mounted on a printed substrate and also to lower a surface temperature of a housing.Type: ApplicationFiled: March 25, 2003Publication date: August 28, 2003Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Mihoko Shimoji, Eiichi Ozaki, Kazushige Nakao, Tetsurou Ogushi, Koichi Hirao, Manabu Hasegawa, Takashi Kobayashi, Jiro Yoshizawa
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Patent number: 6608758Abstract: A computer chassis in accordance with the present invention is disclosed. The chassis includes a first body, a second body, and an electromagnetic shield coupled between the first body and the second body. The shield includes a plurality of dimples and a plurality of valleys for providing an electromechanical seal when the shield is placed in an interference condition. The chassis shielding system utilizes a shield with a design that is inexpensive to manufacture, is structurally sturdy, and simple to implement in an interference environment. In a preferred embodiment, the shield is provided for inserting between a circuit card mounting bracket and a computer chassis. The improved shield design incorporates special features including a plurality of dimples and a plurality of valleys, strategically located for providing improved adjacent surface contact and enhanced shielding from unwanted radiation.Type: GrantFiled: September 7, 2000Date of Patent: August 19, 2003Assignee: International Business Machines CorporationInventors: Daniel Joseph Hunt, Edward N. Dials, Joseph Francis Xavier Doman, William Drummond Owsley
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Patent number: 6606252Abstract: An encased electrical assembly includes a housing, a printed circuit board (PCB) and a cover. The housing includes a plurality of receiving apertures and the PCB includes a plurality of securing apertures shaped to receive a conductive fastener for securing the PCB to the housing. The PCB includes a plurality of conductive traces with two of the conductive traces having first ends electrically connected to a different one of two electrical contacts that are electrically accessible from outside the housing and second ends routed to different ones of the securing apertures. Each of the remaining conductive traces are routed between a different pair of the securing apertures such that when each of the securing apertures receives a secured conductive fastener, continuity is achieved between all of the conductive traces. The cover, when attached to the housing, obscures at least one of the conductive fasteners.Type: GrantFiled: July 17, 2002Date of Patent: August 12, 2003Assignee: Delphi Technologies, Inc.Inventor: Chris R. Snider
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Patent number: 6603657Abstract: Data storage systems are provided. Preferably, a data storage system includes a chassis and a carrier. The chassis is configured to mount at least one data storage device. The carrier incorporates a housing and a handle assembly. The housing is configured to receive at least a portion of a data storage device. The handle assembly includes a handle that facilitates secure mounting of the carrier to the chassis and removal of the carrier from the chassis. Other systems and devices also are provided.Type: GrantFiled: June 29, 2001Date of Patent: August 5, 2003Assignee: Hewlett-Packard Development CompanyInventors: Herbert J. Tanzer, Brian Tsuyuki, Richard B. Nelson
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Patent number: 6600663Abstract: A shielding can for a printed circuit board which includes a frame with side walls and a lid with apparatus to increase flexibility of the lid. The flexibility apparatus are slits on the sides of the lid. These slits enable a flexible contraction, when soldering the shielding can onto the printed circuit board. The invention also includes a method for mounting the shielding can onto printed circuit boards. The shielding can is placed onto the printed circuit board and heated slowly to melt the solder paste to solder the shielding can to the printed circuit board. The heating phase is followed by a fast cooling phase, and the flexible apparatus (the slits on the shielding can) reduces the internal stress, which occurs when the shielding can is exposed to different temperatures at the same time, without any permanent deformations.Type: GrantFiled: June 19, 2000Date of Patent: July 29, 2003Assignee: Nokia Mobile Phones Ltd.Inventor: Eugen Koleda
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Patent number: 6600664Abstract: A housing of a switchgear cabinet for a printing machine, with housing elements formed of electrically conductive material having an electrically insulating surface layer, includes at least one door, one body and one electrically conductive elastic seal disposed therebetween, respective mutually allocated elements of the housing elements having corresponding electrically conductive contact locations at electrically conductive strip material connected to the conductive material of the housing elements; each of the contact locations being covered by a protective layer which is removable during assembly of the cabinet, for the purpose of electrically conductively connecting the housing elements and the seal.Type: GrantFiled: May 16, 2001Date of Patent: July 29, 2003Assignee: Heidelberger Druckmaschinen AGInventors: Wolfgang Dürr, Georg Glaunsinger, Johann Schunn
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Patent number: 6597053Abstract: An integrated circuit arrangement having a number of structural elements, at least one of which is surrounded by a metallic shielding structure. This structural element is thus protected against interference due to disturbing impulses from its environment. In particular, the structural elements of the circuit arrangement can be arranged next to or on top of one another. To produce the metallic shielding structure of a structural element of the circuit arrangement, at least one depression which surrounds the structural element is created and then lined with metal. The contacts and electrical connections of the structural element are electrically insulated from the metal of the shielding structure.Type: GrantFiled: October 15, 1999Date of Patent: July 22, 2003Assignee: Siemens AktiengesellschaftInventors: Anton Anthofer, Holger Hübner
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Patent number: 6594156Abstract: A circuit protection device for protection of sensitive components during high energy radiation sterilization that includes a support substrate and a protective housing. The substrate supports the sensitive components. The protective housing is hermetically coupled to the support substrate to seal the sensitive components within the protective housing. Preferably, the protective housing stops high energy used in the high energy sterilization from damaging the sensitive components from a predetermined exposure level of high energy sterilization. The circuit protection device may further include a protective conductor that is coupled to the support substrate on a side which is opposite the protective housing to prevent high energy from entering the opposite side of the support substrate.Type: GrantFiled: April 24, 2000Date of Patent: July 15, 2003Assignee: MiniMed Inc.Inventors: William P. Van Antwerp, Sheana Karre, Adrian Prokop, Sara Akiko Stinson, Jason Fong, James J. Rosenberg
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Publication number: 20030128533Abstract: An electromagnetic shield system for cartridge-based printed circuit cards inserted into a printed circuit mother board comprises a card level system and a board level system which are electrically connected upon card insertion to provide more effective EMI shielding system. Prongs on a card level tab provide continuous EMI shielding even as card insertion operations are taking place. The principal linkage between the card level and board level systems is provided by a flexible shield strip which mates with apertures in a conductive board stiffener and simultaneously contacts not only a conductive cartridge bezel, but also contacts an EMI shield plate disposed on the printed circuit card.Type: ApplicationFiled: January 16, 2003Publication date: July 10, 2003Applicant: International Business Machines CorporationInventors: Dennis R. Barringer, Harold M. Toffler
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Patent number: 6590153Abstract: An electronic circuit card includes a circuit board and a faceplate attached to the circuit board. A connector is mounted on the faceplate such that the electronic circuit card occupies substantially one slot of a housing when the electronic circuit card is contained in the housing. The connector is also mounted on the faceplate to enable contact between the faceplate and a faceplate of an adjacent electronic circuit card for shielding against electromagnetic interference leakage when the electronic circuit card is contained in the housing. A ribbon cable electrically interconnects the connector and the circuit board. A strap is attached to the faceplate. The strap is adapted to secure a mating connector to the connector.Type: GrantFiled: March 25, 2002Date of Patent: July 8, 2003Assignee: ADC DSL Systems, Inc.Inventor: Kamran Kohan
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Patent number: 6590783Abstract: An electronic circuit includes an outer shielding mounted on a main printed circuit board. To prevent electronic components from affecting one another, at least one inner shielding is arranged within the outer shielding. The outer shielding has an opening bounded by spring tongues which rest on the inner shielding.Type: GrantFiled: May 24, 2001Date of Patent: July 8, 2003Assignee: Mannesmann VDO AGInventors: Joachim Spratte, Jörg Reinhardt
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Patent number: 6586058Abstract: The invention provides novel equipment packages, principally for portable equipment such as laptop computers, which provide decoupling, damping and shock isolation of acceleration sensitive components within the packages. Two principal embodiments are disclosed. In the flexible shell embodiment, a plurality of flexible fillers are attached to a flexible shell and a plurality of objects or components are attached to the fillers. In the flexible chassis embodiment, a plurality of objects or components are mounted to the flexible chassis to form an assembly and a plurality of flexible fillers are attached to the chassis to form the complete package. One design methodology employs a decoupled simple harmonic oscillator (SHO) model to optimize the shock response behavior. A second design methodology uses a deterministic method (finite element method) to establish the parameters for the filler and shell materials.Type: GrantFiled: January 13, 1997Date of Patent: July 1, 2003Assignee: International Business Machines CorporationInventor: Karl-Friedrich Etzold
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Patent number: 6587355Abstract: A liquid crystal display module that is adaptive for improving a ground connection between a printed circuit board and a ground plate. In the module, a top case is provided with a horizontal plane part and a vertical plane part bent vertically from the horizontal plane part to enclose the edge of the liquid crystal display panel. A ground plate is provided with an outer vertical supporting member being in contact with the outside of the vertical plane part of the top case to earth a printed circuit board. Accordingly, the plate is in double contact with the inside and the outside of the top case, so that the plate can be in contact with the top case in spite of a movement of the top case.Type: GrantFiled: June 29, 2001Date of Patent: July 1, 2003Assignee: LG. Philips LCD Co., Ltd.Inventors: Jong Dae Park, Jae Ho Hwang
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Patent number: 6576832Abstract: An electronic device molded cover is disclosed with a releasable EMI shield to facilitate removal to separate the EMI shield and the cover into respective individual parts for reuse as raw material in the production of similar product applications. The EMI shield is made of an electrically conductive fabric sheet having glue drops in a spaced relation on one face for attachment to the interior of the cover. In an alternate embodiment, a conductive polymer paint coating is applied to the interior of the cover.Type: GrantFiled: March 7, 2001Date of Patent: June 10, 2003Assignee: Nokia Mobile Phones Ltd.Inventors: Bror Svarfvar, Matti Uusimaki
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Patent number: 6574103Abstract: An enclosure includes spaced apart sidewalls and a bottom wall, rear wall, and top cover each forming an RF tight seal with the sidewalls, and defining separate chambers for a plurality of circuit packs. The edges of the sidewalls, bottom wall and top cover at the entrance to each chamber are configured to form an RF tight seal with the faceplate of an installed circuit pack. A fluid for cooling the circuit pack enters each chamber and a baffle allows the fluid to escape while being resistant to the transmission of RF energy. Surfaces of the sidewalls that are interior to each chamber are able to disrupt and absorb a substantial portion of the RF energy radiating from the enclosed circuit pack and thereby minimize the level of RF energy within the chamber.Type: GrantFiled: March 8, 2002Date of Patent: June 3, 2003Assignee: Lucent Technologies Inc.Inventor: Stephen Joseph Hinterlong
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Patent number: 6570776Abstract: A circuit shielding structure includes a circuitry package and a layer of conductive polymer material coating at least a portion of the circuitry package. The layer of conductive polymer material may include a metal filled polymer such as a silver particle filled fluoroelastomer.Type: GrantFiled: June 20, 2001Date of Patent: May 27, 2003Assignee: Ericsson, Inc.Inventors: James D. MacDonald, Jr., Walter M. Marcinkiewicz
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Patent number: 6570772Abstract: A portable terminal device having: a circuit board having electronic component mounted thereon; a frame for receiving said circuit board therein; a reinforcement member in contact with the frame and for reinforcing the frame; and a cover fitted to the frame. For the device, improvement in the rigidity of the frame can prevent its breakage and resulting kinks or bends of the circuit board, and thus improve reliability of the microconnection between the electronic component and circuit board.Type: GrantFiled: May 18, 2001Date of Patent: May 27, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazumi Kawano, Takashi Yamaguchi, Naoki Koga
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Patent number: 6570770Abstract: A handle for electronic components is provided that retains the mechanical function of prior art handles and provides for integration of electronic features, such as indicator lights and associated labels, on a portion of the handle. The present handle is mechanically attached to its associated electronic package, and is also electrically connected to the electronics within the package to provide for operation of the handle's integrated electronic features. Electronic features, for example, status indicators and adjustment features, are positioned on the handle so that the features are available at the front of the component, without using space on the front panel of the electronic package. The handle is especially useful for compact, rack-mounted electronics units.Type: GrantFiled: June 5, 2000Date of Patent: May 27, 2003Assignee: Power-One, Inc.Inventors: Stanton W. Ross, Terry Lee Erskine
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Patent number: 6567276Abstract: An EMI shield that utilzes perforated dimples or other features configured to reflect electromagnetic radiation while simultaneously permitting air flow through the shielding material.Type: GrantFiled: April 20, 2001Date of Patent: May 20, 2003Assignee: Hewlett-Packard Development Company L.P.Inventors: Dale R Kopf, Jay D Reeves
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Patent number: 6563715Abstract: The invention relates to microchip card readers in mobile telephones. A device for inserting and retaining a microchip card consists in a partial depression of the upper portion of the shielding cover, with the exception of a tongue. The depression has an opening for the spring contacts to pass through. The distance between the plane of the spring contacts and the tongue allows the microchip card to pass through it in order to insert it and retain it in the depression.Type: GrantFiled: January 25, 2002Date of Patent: May 13, 2003Assignee: AlcatelInventors: Jean-Christophe Villain, Bertrand Cupif, Claire Guillon
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Patent number: 6560124Abstract: In a display device, attached to a plate-type chassis (2) is a PDP (1) having a display screen on which videos are displayed and a circuit board (9) on which a circuit driving the PDP (1) is arranged. The circuit board (9) is shielded with respect to the PDP (1) thanks to the chassis (2), and thus does not receive any unwanted radiation noise radiated by the PDP (1). The display device further includes a back cover (6) and a cabinet (7) each having conductivity. The back cover (6) and the cabinet (7) house therein the PDP (1) and the circuit board (9) attached to the chassis (2). The back cover (6) and the cabinet (7) are both electrically insulated from the chassis (2). Therefore, any unwanted radiation noise from the PDP (1) and the circuit on the circuit board (9) is stopped leaking to the outside.Type: GrantFiled: April 30, 2001Date of Patent: May 6, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoichi Irie, Kazunobu Kojima
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Patent number: 6558578Abstract: Conductive paste for the electrical industry based on at least one elastomer (10) and on an admixture of conducting particles in the form of fibers (20), in which the fibers (20) are flexible and have been embedded in the elastomer (10) in random orientation and with formation of a large number of contact points.Type: GrantFiled: February 13, 2001Date of Patent: May 6, 2003Assignee: Laird Technologies, Inc.Inventors: Jean-Alec Ducros, Mohamed Aït El Cadi
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Publication number: 20030081395Abstract: In portable electronic equipment, a liquid crystal display panel is mounted on the front face side of a casing of the display section, and a thin type battery section is removably fitted to a fitting portion on the rear face side of the casing. The thin type battery section is fixed to a high-strength support plate with flat portions of thin type batteries in close contact therewith. The thin type batteries are put into close contact with the thin high-strength support plate to back up the support plate. Thus, the support plate hardly flexes or dents, and the thin type batteries are free from occurrence of bending deformation.Type: ApplicationFiled: October 25, 2002Publication date: May 1, 2003Applicant: Sharp Kabushiki KaishaInventor: Masayuki Katagiri
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Patent number: 6555743Abstract: A computer system including a number of option bays that accommodate optional peripheral equipment, such as CD-ROM drives, DVD drives, magnetic tape backup systems and Zip drives. An unpopulated bay is segmented into compartments by a divider that extends through substantially the entire depth of the bay so that each of the compartments operates as a waveguide beyond frequency cutoff (WBFC). The resulting compartments are characterized by cross-sectional dimensions that are less than the cross-sectional dimensions of the bay, so that the compartmentalization effects substantially enhanced attenuation of electromagnetic signals having a frequency at the highest expected operating frequency of the computer system.Type: GrantFiled: August 4, 2000Date of Patent: April 29, 2003Assignee: Dell Products L.P.Inventors: Richard N. Worley, Steve L. Williams, Leroy Jones, Jr.
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Patent number: 6556456Abstract: Of the electronic components used for a video monitor installed in an aircraft, components 14 radiating electromagnetic waves are covered with a case formed by combining first and second metal plates 16,17, and part of the case is connected to a frame ground. By connecting the case to the frame ground, the radiation of electromagnetic waves is suppressed.Type: GrantFiled: October 18, 1999Date of Patent: April 29, 2003Assignee: Minebea Co., Ltd.Inventor: Takao Takehara
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Patent number: 6552916Abstract: The present invention relates to an arrangement and methods for protection against electrical interference in a control computer (1) adapted to control at least one external unit (2). The invention in characterized in that the control computer (1) comprises hardware modules (4) designed to personal computer standards. In addition at least one of the modules (4) is operatively connected to means (8) adapted to prevent at least the interference which is harmful to the modules from reaching the latter and vice-versa. The interference-preventing means (8) are further operatively connected to the external unit (2). The arrangement comprises means adapted to shield the modules and the connection between the modules and the interference-preventing means in order to prevent capacitive/inductive transmission of the interference.Type: GrantFiled: November 20, 2000Date of Patent: April 22, 2003Inventor: Jan-Erik Stromberg
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Patent number: 6549426Abstract: An electronics assembly 10 is provided, including a base element 16 and a cover element 18. The base element 16 includes a perimeter mating groove 20 and the cover element 18 including a perimeter tongue element 26. A plurality of crush ribs 34 are formed into the perimeter tongue element 26 such that when the perimeter tongue element 26 is positioned within the perimeter mating groove 20 during assembly, the plurality of crush ribs 34 establish conductive contact between the base element 16 and the cover element 18.Type: GrantFiled: May 31, 2002Date of Patent: April 15, 2003Assignee: Delphi Tecnologies, IncInventors: Daniel A. Lawlyes, Roy A. Visser
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Patent number: 6542383Abstract: Systems for mounting electronic components are provided. An exemplary system includes a module that is configured to mount to a chassis at a first pitch. The module incorporates a housing, which is adapted to at least partially encase an electronic component, and spring fingers that are arranged at least partially about an exterior of the housing. The spring fingers are configured to deflect in response to a displacement force so that the module can be mounted to a chassis. The module can be mounted to a first chassis that accommodates a predetermined pitch of modules. In some embodiments, the module also can be mounted at a different pitch. Other systems also are provided.Type: GrantFiled: October 3, 2001Date of Patent: April 1, 2003Assignee: Hewlett-Packard CompanyInventors: Brian Tsuyuki, Herbert J. Tanzer, Kwang H. Kim, Tanya Schneider
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Patent number: 6542381Abstract: Vibrator attaching structure is provided in which the working efficiency at the assembly time and the disassembly time is good, the required arrangement space is made small, and a device can be miniaturized. A vibrator-attaching base (20) has at its lower portion a shield case (22) that is a box-shaped base member functioning also as a shield member on a print circuit board (10). At the upper portion of this shield case (22), a holder (26) that is a holding member is integrally formed.Type: GrantFiled: March 16, 2001Date of Patent: April 1, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Junichiro Sei, Tsukasa Kobayashi, Makoto Noto
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Patent number: 6542384Abstract: A shielded riser card assembly for reducing electromagnetic radiation from a computer enclosure is disclosed. The riser card assembly comprises a four-layer riser card having a connector adjacent its lower edge, such as a connector for an NLX system board. A cable connection socket is on the riser card a first distance away from the connector, and a plurality of traces on a surface of the riser card run between the cable connection socket and the connector. A sheet of conductive material covers the plurality of traces and is spaced a second distance apart from the surface of the riser card. At least one fastener connected is to the sheet and attached to the riser card. The fastener conductively connects the sheet of conductive material to a ground layer of the riser card. A plurality of non-conductive spacers are disposed between and in contact with both of the sheet and the riser card, for maintaining the sheet a predetermined distance away from the riser card.Type: GrantFiled: December 14, 2001Date of Patent: April 1, 2003Assignee: Sun Microsystems, Inc.Inventors: Sergiu Radu, Russel K. Brovald, Randall C. Luckenbihl
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Patent number: 6542382Abstract: An apparatus for supporting a plurality of densely arranged electrically shielded communication panels includes a rack that supports at least two panels. The panels are supported adjacent to each other by the rack, and each panel includes at least two sides with a printed circuit on one side and a conductive sheet on the other side. In addition, the conductive sheet on each of the panels is coupled to an electrical connection point on the rack when the panel is placed in the rack. The two panels are placed in the rack such that the printed circuit of one of the panels is electrically shielded by the conductive sheet on another, closely aligned other one of the panels.Type: GrantFiled: September 5, 2001Date of Patent: April 1, 2003Assignee: Marconi Communications, Inc.Inventors: George H. BuAbbud, John W. Matthes, Janet A. Bradshaw, Muneer Zuhdi
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Patent number: 6538902Abstract: A modem shelf is described in which internal dividers separate the interior of the shelf into individually isolated Faraday cages that effectively suppress EMI generated by circuit cards mounted within the shelf and isolate the circuit cards from EMI originating outside the shelf and from cards mounted within the shelf. The shelf enables high-speed data communications over a twisted pair network of about 10 Mbps or more. The top and bottom of the shelf are made of relatively thin sheet material, which maximizes the vertical dimension of the circuit cards mounted in the shelf and thus the area on which circuitry can be placed.Type: GrantFiled: December 30, 1998Date of Patent: March 25, 2003Assignee: Nortel Networks LimitedInventor: James Lamar Beard
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Patent number: 6538903Abstract: A method and apparatus for reducing electromagnetic radiation emanating from a computer enclosure are disclosed, for application to computer enclosure enclosing at least one source of electromagnetic radiation of a computer system, where the enclosure includes an unshielded opening in the computer enclosure through which an undesirable amount of electromagnetic radiation from the source is capable of passing to an exterior of the computer enclosure. The apparatus includes a system board mounted to a frame of the computer enclosure, and a riser card connected to the system board within the computer enclosure. The riser card is a PCB having at least one ground layer and a signal layer, and extends transversely from the system board. The riser card divides an interior space of the computer enclosure into two compartments, a source compartment containing the source of electromagnetic radiation, and an unshielded compartment having the unshielded opening in it.Type: GrantFiled: December 14, 2001Date of Patent: March 25, 2003Assignee: Sun Microsystems, Inc.Inventors: Sergiu Radu, Russel K. Brovald, Randall C. Luckenbihl
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Publication number: 20030053303Abstract: A circuit board device includes a secondary circuit board supported on a primary circuit board and parallel to the primary circuit board for forming a compact structure. The secondary circuit board includes one end coupler for coupling to another coupler of the primary circuit board, and the other end having one or more rods supported on a frame for allowing the secondary circuit board to be stably supported on the primary circuit board. A housing may prevent the secondary circuit board from being interfered by the electromagnetic field of the primary circuit board.Type: ApplicationFiled: September 20, 2001Publication date: March 20, 2003Inventor: Chia Ching Lai
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Publication number: 20030043563Abstract: An electronic device having a printed circuit board having a ground, an electrically insulating layer provided on a face of the printed circuit board, and an electromagnetic shielding layer adhered to the face of the printed circuit board through the electrically insulating layer. The ground of the printed circuit board and the electromagnetic shielding layer are conducted electrically.Type: ApplicationFiled: August 23, 2002Publication date: March 6, 2003Inventors: Yutaka Igarashi, Tadao Kishimoto
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Publication number: 20030043562Abstract: An electromagnetic shield system for cartridge-based printed circuit cards inserted into a printed circuit mother board comprises a card level system and a board level system which are electrically connected upon card insertion to provide more effective EMI shielding system. Prongs on a card level tab provide continuous EMI shielding even as card insertion operations are taking place. The principal linkage between the card level and board level systems is provided by a flexible shield strip which mates with apertures in a conductive board stiffener and simultaneously contacts not only a conductive cartridge bezel, but also contacts an EMI shield plate disposed on the printed circuit card.Type: ApplicationFiled: August 29, 2001Publication date: March 6, 2003Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dennis R. Barringer, Harold M. Toffler
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Patent number: 6529383Abstract: A cartridge is provided for the insertion and removal of printed circuit cards from a printed circuit board. The cartridges are self-contained and employ board level guides for establishing a position from which the force of card insertion can be withstood. The cartridges include an external actuating lever which also preferably operates a portion of an EMI shield system which is integrated with the circuit board. The cartridge tops also interlock to provide additional overall structural rigidity.Type: GrantFiled: August 29, 2001Date of Patent: March 4, 2003Assignee: International Business Machines CorporationInventors: Dennis R. Barringer, Edward J. Seminaro, Harold M. Toffler
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Patent number: 6525266Abstract: An Electromagnetic Interference (EMI) shielding system including a conductive clip for electrically coupling a printed circuit board (PCB) to a grounding structure. The clip includes a first contact section attached to a side rather than an edge of the PCB, and a second contact section for contacting the grounding structure. The clip is compressible to ensure a tight fit of the second contact section to the grounding structure. The clip may be formed as a unitary structure and includes transition regions between the first and second contact sections that provide flexibility to the structure. Edge flaps may optionally be included to enhance surface contact of the clip to the PCB. The second contact region is preferably designed with a flat top surface to enable automated surface mounting.Type: GrantFiled: July 17, 2001Date of Patent: February 25, 2003Assignee: Enterasys Networks, Inc.Inventors: William M. Ferland, Martin Q. Thornton, Edward J. Wilson, John M. Devine
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Patent number: 6522552Abstract: A wireless memory card reader comprises a card insertion read/write device and a host unit read/write device. The card insertion read/write device further comprises a casing with a card slot and an inner card socket for being inserted with a memory card, a printed circuit board received in the casing with a required circuit thereon, a wireless transmission driver fixed to the printed circuit board for a signal being wave-mixed, demodulated and amplified, a battery seat with at least a battery arranged at a lateral side of the casing for supplying the power needed by the circuit, a card socket fixed to the printed circuit board and connecting with the circuit for being inserted with the memory card, and an antenna connected to the printed circuit board for sending and receiving radio signals.Type: GrantFiled: November 16, 2001Date of Patent: February 18, 2003Assignee: Power Quotient International Co., Ltd.Inventor: Chung-Liang Lee
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Patent number: 6515870Abstract: An integrated circuit (IC) includes a package-integrated Faraday cage assembly to reduce the level of electromagnetic radiation emanating from the IC during operation. The IC uses a number of appropriately spaced leads on the IC package to form part of a Faraday cage surrounding a semiconductor chip within the IC. In one approach, the selected leads are coupled by a conductive member to a conductive cover plate of the IC package that forms an upper boundary of the Faraday cage. When the IC is installed in an external circuit, some or all of the selected leads are coupled together outside of the IC package (e.g., to an electrical ground) to form the lower boundary of the Faraday cage.Type: GrantFiled: November 27, 2000Date of Patent: February 4, 2003Assignee: Intel CorporationInventors: Harry G. Skinner, Sam E. Calvin
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Patent number: 6515871Abstract: A shield for an electronic cartridge which has a pin that attaches a thermal element to a substrate. One edge of the substrate may have a plurality of conductive pads. The shield may have a base located adjacent to the conductive pads. The shield may include an arm which extends from the base and a finger which extends from the arm. The shield can be installed by sliding the arm toward the thermal element so that the pin engages and deflects the finger. The shield is moved toward the thermal element until the pin snaps into a notch located at the end of the finger. The finger may exert a spring force which pushes the base into the thermal element and secures the shield to the cartridge.Type: GrantFiled: February 17, 1998Date of Patent: February 4, 2003Assignee: Intel CorporationInventors: Michael Stark, Michael Rutigliano, Bill Lieska, Peter A. Davison
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Patent number: 6509523Abstract: A switchgear cabinet with two profiled frame sections, assigned to one side of the switchgear cabinet, wherein the open side of the switchgear cabinet is partially closed or can be partially closed by at least one wall element. A horizontal cross brace is arranged between the vertical profiled frame sections, against which the wall element rests in an area of one of its horizontal lateral edges. An open transition area in the side of the switchgear cabinet between the cross brace and the cover and/or the bottom area of the switchgear cabinet is covered by a shield. For simplification, the shield is fastened on a fastening section of a holder from the direction of the interior of the switchgear cabinet. With the shield in an unmounted position, the holder is maintained by a locking element in a prepared mounting position.Type: GrantFiled: March 15, 2001Date of Patent: January 21, 2003Assignee: Rittal GmbH & Co. KGInventors: Martin Ramdohr, Frank Küster
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Patent number: 6507499Abstract: A microprocessor EMI shield is configured for isolating EMI emissions from the microprocessor, and grounding any electric potential caused by EMI emissions detected by the microprocessor heat sink. The microprocessor EMI shield includes a low-impedance conductive surface sufficient for conducting electric potential induced based on EMI emissions from the microprocessor. The microprocessor EMI shield also includes an array of apertures for accommodating the respective microprocessor pins. The array of apertures includes a first group of apertures for accommodating the microprocessor non-ground pins, each having a spaced diameter for avoiding contact with the corresponding non-ground microprocessor pin, and a second group of apertures for accommodating the microprocessor ground pins.Type: GrantFiled: May 2, 2001Date of Patent: January 14, 2003Assignee: Advanced Micro Devices, Inc.Inventor: Bernd Willer