Abstract: A computer system with an EMI prevention structure includes a housing for covering a main board. The housing has leading grooves formed on two opposite inside surfaces. The main board includes a ground layer formed on the periphery, attached shielding devices corresponding to the leading grooves, a thickness of the main board and a shielding device being substantially equal to a gap formed by a leading groove. Each shielding device has a pair of substantially parallel metal plates and a metal side plate forming an open rectangular channel, the open side allowing the shielding device to fit over the ground layer of the main board. A spring latch is installed on a plate of each shielding device to allow the shielding device to remain firmly fixed to the main board.

Abstract: A radio-frequency apparatus is constructed such that peripheral edge portions of a printed circuit board provided with a radio-frequency circuit is enclosed by a frame-shaped shield case. Both openings of the shield case are closed by shield covers. The apparatus has a holding mechanism for holding the shield cover in a state that a predetermined distance is kept between the shield cover and terminal edges of the shield case.

Abstract: A shielded interconnect bus crossover useful in interconnecting MEM devices with control signal sources or the like and a method of fabricating such a shielded interconnect bus crossover are disclosed. In one embodiment, a shielded interconnect bus crossover (10) includes a plurality of base pads (44A-C) and a plurality of support columns (74) extending upward from the base pads (44A-C) through holes formed in an interconnect bus shield (78) overlying a plurality of interconnect bus lines (42). The support columns (74) support a two layer elevated crossing line (92/112) in a spaced relation above the interconnect bus shield (78). The two layer elevated crossing line (92/112) is oriented transverse to the direction of the interconnect bus lines (42) and is located within the perimeter of a two layer rectangular crossing line shield wall (96/116).

Abstract: A string with conductive filaments is placed across an opening of an electronic cage at a point between two devices to be installed in the electronic cage. A cage for a personal computer is positioned within the personal computer and the string is positioned at a point to fill a gap between two drives when installed in the cage. The string comprises a twisted metal wire with multiple conductive filaments woven into the wire. The filaments are of sufficient length to contact both drives.

Abstract: Shielding for a blade server style computer wherein each individual blade is surrounded with shielding.

Abstract: The object of the invention is a device and an elongated EMI gasket (20) made for an electroconductive wire, used for its EMI shiekding (electromagnetic interference). The EMI gasket (20) comprises, on a first plane, a bending portion (23a, 23b) that forms a first flat part (23) for attaching the EMI gasket (20) to a device to be EMI shielded so that the EMI gasket touches the device to be EMI shielded with its surface, which is according to said first plane. Typically, the attachment is carried out by pushing the EMI gasket (20) into a groove (26) adapted in connection with the joint to be EMI sealed. EMI tightness is achieved by pressing together parts (21, 22) of the device to be EMI shielded, whereupon the EMI gasket (20) attached in between them forms an electric contact at short distances between said parts.

Abstract: A shield and a method for shielding are provided for preventing radio frequency energy from entering or exiting an electronic device. The shield includes a frame surrounding the electronic device. The frame has a first frame wall and a second frame wall arranged with a first gap in between that extends along the first frame wall. The first frame wall is arranged in a first plane, the second frame wall is arranged in a second plane, and the first plane intersects the second plane. The shield also includes a cover surrounding the frame. The cover has a first cover wall and a second cover wall arranged with a second gap in between that extends along the second cover wall. The arrangements of the first gap and the second gap prevent radio frequency energy from entering or escaping the electronic device.

Abstract: In a connection structure of a radio frequency circuit of the invention, a jumper line of a jumper member is positioned by an insulating base, and the jumper line has a base part that is located inside a cover to be electrically shielded and terminals that are protruded downward from a lower side of the insulating base. In a state that the jumper line of the jumper member intersects a third conductor, the terminals are inserted through a circuit board to be connected to first and second conductors. Therefore, the base part of the jumper line is electrically shielded by the cover, which achieves satisfactory RF characteristics.

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Abstract: A butt joined electronic module has first and second coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on respective first and second electrical elements that are secured on respective independently positioned and mechanically joined carrier and housing. The first and second coplanar transmission structures are electrically coupled together via substantially flat electrical conductors. The carrier and housing are bonded together as a single module.

Abstract: A method of producing an electronic component including the steps of applying solder paste to both a connection land electrode, to which a surface-mount part is to be electrically and mechanically connected, and a case-fixing electrode, to which an engaging portion of a shield case is to be electrically and mechanically connected and affixed; mounting the surface-mount part and the shield case onto predetermined locations of a printed board, the shield case being mounted so as to accommodate the surface-mount part therein; and after the mounting step, soldering the surface-mount part and the shield case onto the printed board at the same time by putting printed board, having the surface-mount part and the shield case mounted thereon, into a reflow oven. The electronic component production method makes it possible to efficiently produce an electronic component having a structure in which a surface-mount part is accommodated in a shield case.

Abstract: An enclosure for electronic circuitry includes a container that is formed to define an enclosed volume. An open end of the container is sealed by a printed circuit board which also provides electrical connection to the enclosed electronic circuitry by means of connectors mounted to its inside and outside surface.

Abstract: Disclosed herein is an enclosure for mounting one or more electronic units to a substrate, such as a printed circuit board.

Abstract: A card-mounting rack for electronic part-mounting cards is disclosed by which a housing of a rack or the like produced in accordance with standard specifications can be used to mount a plurality of large cards in high density therein to achieve overall densification and miniaturization of a system such as a computer system. Cooling fans are provided on a front and rear faces of a housing of a rack. A mother board is horizontally placed at the center of the inside of the housing. A plurality of cards are mounted perpendicularly on top and bottom faces of the mother board using gondolas and driving mechanisms having a function for moving the cards upwardly or downwardly through a plurality of connector provided on the top and bottom faces of the motherboard. Further, spacers for stabilizing the cards are inserted on rear faces of the cards.

Abstract: A circuit board programming/debugging arrangement and method includes a circuit board and frame assembly and a programming/debugging device. The assembly includes a printed circuit board, a first frame section coupled to the circuit board and at least one second frame section coupled to at least one of the circuit board and the first frame section. The second frame section is movable from an operational position to a non-interfering programming/debugging position wherein the second section would interfere with coupling of the programming/debugging device to the circuit board. The programming/debugging device is coupled to the circuit board while the at least one second frame section is in the programming/debugging position.

Abstract: The present invention provides an electronic component with high positional accuracy for attaching a shield case to a substrate while being excellent in shielding performance and having high reliability for mounting, wherein engaging recesses are provided on the side face of the substrate mounting the surface mounted component, and a plurality of engaging pins to be inserted into the engaging recesses of the substrate are provided on the shield case, the engaging pin of the shield case being so configured as to engage with the engaging recess while applying an enhanced elastic force to the engaging pin, thereby allowing the shield case to be securely held on the substrate by the plural engaging pin inserted into the engaging recesses of the substrate.

Abstract: The present invention relates to packages for peripheral devices such as memory media and input/output (I/O) devices. The package comprises a top cover and a bottom cover secured to a frame. The covers are secured to the frame through a locking mechanism wherein hooks on the covers lock with and conform around latches on the frame. Methods of making and assembling the package are also disclosed.

Abstract: An electronic control module (20) comprising a housing (30), a printed circuit board (40), and a rigidizer (50). The housing (30) has an opening or window (34) for a removable connector (22). The printed circuit board (40) has a first side (42), a second side (44), and a plurality of contact pads (46). The first side (42) of the board (40) is used to retain components and circuitry. The plurality of contact pads (46) is positioned on the first side (42) of the printed circuit board (40). The rigidizer (50) is attached to the second side (44) of the printed circuit board (40) and provides structural backing for the printed circuit board (40) to compensate for any pressure induced to the first side (42) of the printed circuit board (40) by the removable connector (22). The window (34) in the housing (30) is positioned adjacent to the plurality of contact pads (46) on the first side (42) of the printed circuit board (40) to provide a single opening to each of the contact pads (46).

Abstract: A shield cap and a semiconductor package including a shield cap provide protection for passive components mounted on a substrate of a semiconductor package. The shield cap provides a means for manufacturing a semiconductor package that includes a semiconductor die and passive components without encapsulating the passive components within the encapsulation protecting the semiconductor die. The shield cap provides electromagnetic shielding and physical protection for the passive components and may provide thermal conduction from a semiconductor die by contacting the semiconductor die. The shield cap may be perforated to permit air circulation through the shield cap for providing improved thermal performance or may be a solid metal shield, providing improved electromagnetic shielding.

Abstract: A communication apparatus including a metallic shelf having a pair of side plates, a back wiring board mounted in the shelf on the back side thereof and having a plurality of first connectors and a solid ground pattern, and upper and lower guide plates mounted in the shelf, each guide plate having a plurality of guide rails and a plurality of vent holes. A first shield board having numerous openings is mounted on the upper guide plate, and a second shield board having numerous openings is mounted on the lower guide plate. A plurality of plug-in units are mounted in the shelf so as to be inserted along the guide rails of the upper and lower guide plates.

Abstract: An apparatus for containing electromagnetic interference (EMI). The apparatus includes an enclosure for an EMI producing component. The enclosure has a set of springable tabs extending from a top edge of the enclosure and a set of pins extending from a bottom edge of the enclosure. The pins are placed through a grounding ring and a printed circuit board to align and ground the enclosure. The tabs contact a heatsink disposed over the enclosure.

Abstract: A shielding apparatus for containing electromagnetic energy is disclosed. In one embodiment, a shield includes a plurality of sides, each side having a top and a bottom. A flange may extend from the top of the sides. A plurality of tabs extend from the flanges. The tabs include a first, second, and third portions. The first portion extends directly from the flange. The second portion extends at an angle from the first portion relative to the plane of the first portion and the flange. The longitudinal axis of the second portion is parallel to its associated flange or side. A third portion extends from the second portion, at an angle relative, to the second portion. A heat sink coated with an electrically conductive material may be mounted such that a bottom side of the heat sink is in contact with the plurality of tabs.

Abstract: An electromagnetic shield system for cartridge-based printed circuit cards inserted into a printed circuit mother board comprises a card level system and a board level system which are electrically connected upon card insertion to provide more effective EMI shielding system. Prongs on a card level tab provide continuous EMI shielding even as card insertion operations are taking place. The principal linkage between the card level and board level systems is provided by a flexible shield strip which mates with apertures in a conductive board stiffener and simultaneously contacts not only a conductive cartridge bezel, but also contacts an EMI shield plate disposed on the printed circuit card.

Abstract: In a shielding scheme for circuit boards, conductive shields have contoured mating surfaces that become flat, or co-planar, at the circuit board-shield interface when the shields are fastened to opposite sides of the circuit board. The contoured mating surfaces compensate for deformation of the shields resulting from the fastening so that uniform mechanical pressure is applied at all designated points along the circuit board-shield interface even though fastening points are intermittently spaced throughout the shields. When compressible conductive gaskets are optionally interposed between the shields and the circuit board, stops are included to accommodate for the thickness of the gasket. High signal isolation is achieved without correspondingly high contact area on the circuit board and without closely-spaced fastening points. Low assembly time and manufacturing cost results for shielded circuit board assemblies incorporating the shielding scheme.

Abstract: An integrated shield wrap suitable for use in an electronic device including electronic circuitry. The integrated shield wrap includes an insulator section composed of an electrically insulative material, as well as a shield section joined to the insulator section and composed of an electrically conductive material. The integrated shield wrap can be configured as necessary to suit a particular application and, in general, serves to electrically insulate the electronic circuitry from other circuitry and components within the electronic device while simultaneously implementing a shielding functionality that permits management of electromagnetic emissions from some or all of the electronic circuitry.

Abstract: An EMI shield that utilizes a waveguide structure in which all or part of the air flow opening has a non-uniform three dimensional shape.

Abstract: A design for constructing an input circuit to receive and process an electrical signal, such as a voltage signal from a voltage source, where the input circuit has an extremely high resistance of at least 1011 ohms and is located on a printed circuit board. A first area of the printed circuit board carrying components of the input circuit is separated from a second area surrounding or contiguous to it by a channel-shaped recess to preserve the high resistance of the circuit even under operating conditions and at high relative humidity. The circuit is configured in such a way that the channel-shaped recess terminates in the interior of the printed circuit board and is extended in the direction of the thickness of the printed circuit board immediately up to a moisture-impermeable barrier layer which underlies the first area of the printed circuit board. The channel-shaped recess and the first area are filled and surrounded by a cohesive moisture-impermeable material.

Abstract: Electronic equipment has two electronic circuit boards in a casing, which is constructed of a base and a cover. Two electronic circuit boards are piled up in the casing. A first electronic circuit board is, for example, for a radio communication unit, and a second electronic circuit board is, for example, for a control unit. The first board has a portion that does not face the second board. The first board is attached to the base. Heat, which is generated by the first board, conducts by heat contact from the first board to the base and the case of the casing through the contact portion of the first board with the base.

Abstract: In a substrate-stacking structure, a substrate, having heat-generating parts mounted thereon, and a control substrate, having control parts mounted thereon, are held spaced a predetermined distance from each other. The substrate and the control substrate are held spaced the predetermined distance from each other through a holding plate, and a heat shielding plate is interposed between these substrates, and an air layer is formed between the heat shielding plate and the control substrate.

Abstract: An EMC shield is provided for electronic components on a printed circuit board, which has a housing which surrounds the electronic components at least on the sides not facing the printed circuit board and shields them against electromagnetic radiation, with the housing having a number of electrically conductive spring contacts which make electrically conductive contact with the printed circuit board, and the housing being pressed against the printed circuit board by means of at least one pressure contact-making device.

Abstract: A gasket (50) provides an EMI shield between part of a frame (1) of an electronics assembly and a component (2) of the assembly. The gasket is formed from a resiliently deformable electrically conductive sheet e.g. from spring stainless steel, and has an array of resiliently deformable fingers that extends along an edge region thereof for contacting either the frame (1) and the component, and a plurality of clips (60) that can engage corresponding attachment elements in the component or the frame respectively to form a mechanical connection therewith. The gasket is easy to locate in position and does not require the use of adhesive to retain it in position.

Abstract: A component cage for detachable mounting an ancillary component such as a hard disc drive in a housing for an electronic circuit is described. The cage has internal step surfaces to engage support runners of the component. The formation of elongated slots in the cage to accommodate support runners is avoided, improving the electromagnetic shielding ability of the cage.

Abstract: An assembly for use in providing EMI shielding for a circuit card. The assembly comprises a circuit card; a fastener; and, a shielding apparatus. The shielding apparatus comprises: a body providing EMI shielding and includes an attaching portion extending therefrom, wherein the attaching portion has a segment at a proximal end portion thereof which blocks an opening in the body for controlling EMI leakage and positions the attaching portion so that a fastener can fasten the attaching portion to a circuit card such that a first fastener end portion is engageable in juxtaposed relationship with a first card surface and a second fastener end portion terminates so as not to extend generally beyond a predetermined distance from a second card surface of the card.

Abstract: A protective shielding device includes a circuit board having a notch and one or more holes formed in one side, and a shielding member engaged onto the circuit board for shielding the circuit board and having a leg extended from one side for engaging through the notch and for extending toward the lower portion of the circuit board. The leg includes one or more catches for engaging into the holes and for latching the shielding member to the circuit board. The other sides of the shielding member and the circuit board may then be secured together with fasteners.

Abstract: A housing, in particular a housing for electronic components, which includes a housing part which is made of plastic and has at least one opening, and a lid part for closing off the opening. It is proposed that the lid part is produced as a metal punched part, the punched edge of the lid part having a punch ridge on a first side of the lid part and a punch indentation on a second side opposite the first side, and the lid part being pressed into the opening of the housing part via the second side so that the lid part comes to rest against assigned sections of the inner wall of the opening via at least two edge sections that are distributed around the perimeter of the lid part and bites into the assigned sections of the inner wall in a barb-like manner via the punch ridge.

Abstract: A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit card and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a housing bezel, disposed relative to the cassette housing so as to be associated with the cable opening, the housing bezel includes an outer bezel having a first plurality of openings and an inner bezel having a second plurality of apertures, the inner bezel in electrical communication with the printed circuit card, wherein said housing bezel is removable, and an EMC gasket disposed between the outer and inner bezels of said housing bezel, the EMC gasket configured to provide a removable EMC seal proximate the cable opening while still allowing airflow through the first and second plurality of apertures having the

Abstract: The invention relates to a metal housing 1, especially for an airbag control device, comprising a bottom plate and a cover plate, a rear wall and two side walls 5, 6, having mounting elements in the interior of the housing for at least one printed circuit board, and with a terminal element arranged at the front side of the housing for at least one connection element. According to the invention, the bottom—and/or the cover plate is/are connected with an installation plate 22, 23 which is attachable to a support. In this arrangement, projections are being utilized which are embeddable in and can be pressed into recesses of the installation plate.

Abstract: An electromagnetic interference (EMI) shield fills an aperture in a wall of a system unit housing. The electromagnetic interference shield is integrally formed from sheet metal (e.g. stainless steel). It comprises a perforated substantially planar portion with fingers defined around the periphery thereof. A plurality of first fingers are preformed to define abutments to abut against an outer surface of the wall and a plurality of second fingers are preformed to define sprung latches for latching within the aperture. The combination of first and second fingers means that the EMI shield can be located in the aperture in a removable manner without the use of tools. The perforations are configured to permit ventilation of the interior system housing while preventing EMI interference radiating from the system housing. A handle portion is also formed at the periphery of the substantially planar portion for facilitating the insertion and removal of the shield.

Abstract: A noise protection sheet 1 is stuck on an IC chip C loaded on a circuit board 31 to control the noise generated from the IC chip C. The noise protection sheet 1 includes a metallic sheet 2 and insulating films 3 sandwiching the metallic sheet from both front and rear surfaces thereof. The metallic sheet 2 has, at its one end, an extending portion 7 to be connected to a land 32 serving as a grounding terminal on the circuit board 31. In this configuration, the noise protection sheet can effectively solve a noise problem in an electronic component.

Abstract: A Faraday cage enclosing an optical device extends between a metalized plate and an upper enclosure. The upper enclosure is vertically spaced from the metalized plate. The Faraday cage includes one or more ceramic wall portions that extend from the metalized plate to the upper enclosure and limit the passage of EMI through the ceramic wall portions. The ceramic wall portions include a plurality of laminated ceramic layers, each one of the laminated ceramic layers extending substantially parallel to the metalized plate, and a plurality of vias extending substantially perpendicular to the metalized plate through the laminated ceramic layers, each one of the plurality of vias extending substantially from the metalized plate to the upper enclosure. The plurality of vias are configured to form a pattern that limits the passage of EMI through the vias, wherein the metalized plate, the upper enclosure, and the ceramic wall portions define a Faraday cage that surrounds the optical device.

Abstract: A radio frequency shield enclosure (100) is mounted on a printed circuit board and is adapted to allow optical checking of the components enclosed by the shield enclosure (100). A cover (402) is removably attached to a frame (102) on the printed circuit board for access to the printed circuit board components therein. Material and spring forces are selected to minimize the forces on the printed circuit board when attaching or removing the shield enclosure cover (402). Any openings or gaps in the radio frequency shield enclosure cover (402) are small enough to prevent radio frequency energy at the highest anticipated frequency from being radiated outside of the radio frequency shield enclosure (100).

Abstract: The present invention relates to an electronic module which has a honeycomb material held within a solid metal frame as the top and bottom of the module. This structure provides increased capacity for convective cooling and increased electromagnetic radiation shielding over previous options.

Abstract: The present invention is to provide a fastening mechanism for a cover of an electronic device enclosed in a housing having a substantially parallelepiped cavity for receiving a peripheral. The fastening mechanism comprises a peripheral flange disposed around an opening of the cavity and having engagement holes and a lock thereon; and a cover shaped to fit on the opening having an upper cover plate, a lower metal plate releasably coupled to the upper cover plate, a plurality of spaced tabs disposed thereon for being snapped into the corresponding engagement holes to fasten the cover onto the flange, and a locking hole so that a turning of the lock will cause a lock member thereof to insert into the locking hole for locking the cover.

Abstract: A transmission apparatus which is capable of maintaining excellent EMC performances even if the number of cables to be connected thereto is increased. An electronic circuit unit is plugged into a subrack from the front of the subrack. A connector unit-receiving block is arranged on the rear surface of the subrack. A connector unit connectable with an external cable to be connected to the electronic circuit unit is plugged into the rear of the subrack at the rear of the electronic circuit unit, for being received within the connector unit-receiving block. The connector unit is configured such that a metal shield case covers a connector board having a connector mounted thereon.

Abstract: In one embodiment of the present invention, a carrier plate assembly for use in an electrical system is disclosed, comprising a carrier plate capable of securing at least one system board. Each system board is capable of being inserted and removed from the carrier plate assembly without disturbing another system board connected to the carrier plate assembly. The carrier plate assembly is capable of releasable attachment to the electronic system and is capable of being inserted and removed from the electronic system without disturbing another assembly connected to the electronic system.

Abstract: A casing for an electronic control unit is composed of an upper case having a bottom opening and a bottom plate closing the bottom opening. The upper case is so formed that plural upper cases are easily stacked up and picked up one by one by an automated vacuum sucker. The sidewalls of the upper case facing each other are slanted, and a fringe portion is formed at a bottom end of each slanted sidewall. A U-shaped portion or a protrusion is formed on the fringe portion to prevent the upper case from sticking to another upper case when plural upper cases are vertically stacked up.

Abstract: A shielded case includes a plurality of walls. At least one of the walls is formed by at least first and second separate sections which abut one another along an interface. A depression is formed in at least one of the first and second sections so as to cause at least one of said sections to expand toward the other of section thereby pressure-welding said first and second sections to one another along at least part of said interface.

Abstract: A cartridge, including a housing, a substrate, a semiconductor element (e.g., a memory), and a shielding element, is detachably mountable to a game machine having a connector and a grounding terminal, and a recess. The substrate within the housing has an external connection terminal exposed through the open end, a circuit pattern, and a ground electrode. The shielding element within the housing substantially covers at least one principal face of the substrate and electrically connected to the ground electrode. The housing has an opening in a principal face facing the ground electrode on the substrate and the shielding element, through which the shielding element is partly exposed. The shielding element has a protruding shield convex exposed through the opening. When the cartridge is mounted in the recess, the shield convex is electrically connected to the ground electrode through the opening to remove unwanted radiation of electromagnetic waves on the substrate.

Abstract: A method and packaging device which provide a magnetically permeable shield for integrated circuits containing magnetic field sensitive circuit elements are disclosed. One or more magnetic shields are provided on, or embedded within, a printed circuit board and additional shielding elements are provided over the printed circuit board.

Abstract: An electromagnetic shield system for cartridge-based printed circuit cards inserted into a printed circuit mother board comprises a card level system and a board level system which are electrically connected upon card insertion to provide more effective EMI shielding system. Prongs on a card level tab provide continuous EMI shielding even as card insertion operations are taking place. The principal linkage between the card level and board level systems is provided by a flexible shield strip which mates with apertures in a conductive board stiffener and simultaneously contacts not only a conductive cartridge bezel, but also contacts an EMI shield plate disposed on the printed circuit card.