Emi Patents (Class 361/818)
  • Patent number: 11412608
    Abstract: A flexible printed circuit board comprises a conducting layer that includes a first signal line, a first ground plane and a second ground plane. A first shielding via extends from a third ground plane to a fourth ground plane and extends through the first ground plane to electrically connect the first ground plane, the third ground plane and the fourth ground plane. A second shielding via extends from the third ground plane to the fourth ground plane. The first ground plane, the second ground plane, the third ground plane, the fourth ground plane, the first shielding via and the second shielding via, together, circumferentially surround the first signal line to minimize electromagnetic interference with the first signal line.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: August 9, 2022
    Assignee: Nortech Systems, Inc.
    Inventor: Scott G. Blanc
  • Patent number: 11328850
    Abstract: A magnetic film includes one or more magnetically conductive layers. Each magnetically conductive layer is cracked to form a plurality of first through-cracks defining a plurality of magnetically conductive segments. The first through-cracks extend along a first direction and form a first regular pattern along an orthogonal second direction at a first pitch P1, such that a Fourier transform of the first regular pattern has a first peak along the second direction at a first spatial frequency corresponding to the first pitch P1. The first through-cracks have an average length L1 along the first direction. L1/P1 is greater than or equal to 5.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: May 10, 2022
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Jinwook Kim, Seong-Woo Woo, Jung Ju Suh, Matthew R.C. Atkinson
  • Patent number: 11316241
    Abstract: An electrical device adapted to operate at a high operating ambient temperature includes an electrical component mounted inside a casing, a transmission/reception antenna and at least one electrical and mechanical connection between the electrical component and the antenna. The electrical and mechanical connection comprises a metal pad positioned under the casing, the antenna being connected to the pad; an electrical connection tab having a first end connected to the electrical component; and fixing means adapted to secure the pad and a second end of the connection tab of the component. The device is applicable to, for example, temperature sensors of the surface guided elastic wave type.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: April 26, 2022
    Assignee: FREC |N| SYS
    Inventors: Sylvain Ballandras, Alexandre Raveski, Florent Bernard, Julien Garcia, Emilie Courjon, Thierry LaRoche
  • Patent number: 11302593
    Abstract: An electronic component package (100) includes a resin layer (40), an electronic component (10), a grounding member (30), and a conductor film (50). The grounding member (30) includes a multilayer body (31) and an outer conductor (32) disposed at an end portion of the multilayer body (31) in a lamination direction. The multilayer body (31) includes at least one resin film (31a) and at least one pattern conductor (31b) laminated one on another, and at least one via conductor (31c) extending in the lamination direction and connected to the outer conductor (32). In the multilayer body (31), at least one of the pattern conductor (31b) has at least part of a circumference connected to a conductor film (50) and electrically connected to the via conductor (31c). Part of an external terminal and part of the outer conductor (32) are exposed from an identical surface of the resin layer (40).
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: April 12, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshitaka Matsukawa, Yoichi Takagi, Akio Katsube, Yoshitaka Echikawa
  • Patent number: 11294128
    Abstract: An optical module includes a housing, at least one optical assembly and at least one sealing member. The housing includes a housing body, a cover and at least one vent hole therein. At least part of each optical assembly is located in the housing body. Each sealing member is located at a respective one of the at least one vent hole. The sealing member has a central axis and includes a first cylinder, a truncated cone, and a second cylinder, a diameter of the first cylinder is greater than a diameter of the second cylinder. Each vent hole is a stepped hole including a portion with a first aperture and a portion with a second aperture, the first aperture is greater than the second aperture. The first cylinder fits the portion with the first aperture, and the second cylinder fits the portion with the second aperture.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: April 5, 2022
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Guangchao Du, Dan Li, Yongzheng Tang, Yunpeng Jiang
  • Patent number: 11277948
    Abstract: A circuit assembly includes a printed circuit board (PCB), and a power management arrangement positioned on and electrically coupled to the PCB. The power management arrangement includes a substrate, a power management circuit chip positioned on and electrically coupled to the substrate, and a shield can positioned over the substrate and providing electromagnetic shielding for the power management chip. The circuit assembly further includes a self-shielded coil positioned on and electrically coupled to the PCB, wherein the self-shielded coil is positioned adjacent to the power management arrangement.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: March 15, 2022
    Assignee: Apple Inc.
    Inventors: Stephan Henzler, Eckehard Plaettner
  • Patent number: 11252851
    Abstract: According to various embodiments of the present invention, an electronic device comprises: a connector comprising a conductive shell and at least one terminal arranged inside the conductive shell; a capacitor; and a circuit board comprising a first board layer at least partially facing the connector, a second board layer formed beneath the first board layer, and at least one third board layer formed between the first board layer and the second board layer.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: February 15, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Heiseong Kwak, Woohee Park, Min Cho, Byoungil Son, Youngjin Kang, Myeonggeun Kim, Ungryeol Lee
  • Patent number: 11233278
    Abstract: Conventional internal combustion engine technology has been around for decades and historically has been the primary power source for virtually all industrial equipment. It relies on carbon-based fuels, is loud, polluting, and the machines it powers are expensive to operate and maintain. A self-contained, rechargeable battery system is provided that possesses improved power than comparable diesel and gas engines and it generates zero emissions, is virtually maintenance free, is quiet, and recharges overnight via a standard electrical outlet. The rechargeable battery power system can be installed in new and used construction equipment and may be used wherever a source of power is required including smart grid application. It can be safely used indoors, in neighborhoods and other locations sensitive to the side effects of internal combustion engines. There is a battery management system that controls sequential shutdown system and a power reserve system to control operation of the battery.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: January 25, 2022
    Assignee: GREEN MACHINE EQUIPMENT, INC.
    Inventor: Noah Podolefsky
  • Patent number: 11227909
    Abstract: According to one embodiment, a display device includes a first substrate, a second substrate opposing the first substrate, a wiring substrate connected to the first substrate, a cover member located on an opposite side to the first substrate so as to interpose the second substrate therebetween and a conductive layer maintained at a predetermined potential, and the first substrate includes an extension portion extending further from the second substrate, the wiring substrate is connected to the extension portion, the cover member includes a first surface opposing the extension portion, and the conductive layer overlaps the extension portion in plan view.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: January 18, 2022
    Assignee: Japan Display Inc.
    Inventor: Hirokazu Seki
  • Patent number: 11217941
    Abstract: An electrical connector set includes a socket and two plugs. The socket includes a connector casing forming two adjacent insertion slots. The two insertion slots are arranged in an arrangement direction and extend parallel to an insertion direction. The connector casing includes a dividing wall, separating the two insertion slots. The dividing wall has an indentation at the insertion openings of the two insertion slots. The two plugs can be inserted into the two insertion slots in the insertion direction respectively. Each plug has two protrusions at two opposite sides thereof in the arrangement direction. The two protrusions are staggered in a vertical direction perpendicular to the arrangement direction and the insertion direction. When the two plugs are inserted into the two insertion slots, the two protrusions between the two plugs are located in the indentation and staggered in the vertical direction.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: January 4, 2022
    Assignee: ALL BEST PRECISION TECHNOLOGY CO., LTD.
    Inventor: Haven Yang
  • Patent number: 11212910
    Abstract: A high frequency signal cross-layer transmission structure in a multi-layer printed circuit board includes a bottom metal layer, a middle metal layer and a top metal layer. The bottom metal layer includes a bottom ground plane and a bottom conductive area. The middle metal layer includes a middle ground plane. The top metal layer includes a top ground plane and a top conductive area. The bottom ground plane defines and surrounds a bottom annular clearance area. The middle ground plane defines and surrounds a middle clearance area. The top ground plane defines and surrounds a top annular clearance area. The bottom annular clearance area surrounds at least one part of the bottom conductive area. The top annular clearance area surrounds at least one part of the top conductive area. A size-shape of the top annular clearance area is different from a size-shape of the middle clearance area.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: December 28, 2021
    Assignee: WANSHIH ELECTRONIC CO., LTD.
    Inventor: Hung-Hsuan Lin
  • Patent number: 11195652
    Abstract: A coil component includes: a body having one surface and the other surface opposing each other in one direction; a coil portion including a coil pattern having at least one turn around the one direction, and embedded in the body; an external electrode disposed on the one surface of the body and connected to the coil portion; a shielding layer disposed on the other surface of the body; and an insulating layer disposed between the body and the shielding layer.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: December 7, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tai Yon Cho, Tae Jun Choi, Jung Young Cho, Chang Hak Choi, Byeong Cheol Moon, Seung Hee Oh
  • Patent number: 11177694
    Abstract: One embodiment provides a non-contact power transmitter device including a sealed housing provided at least partially within a surface, and a transmitter coil within the sealed housing configured to inductively transfer power to a power receiver device. The power transmitter device also includes a transmitter control unit coupled to the transmitter coil, a transceiver configured to communicate with the power receiver device, and an electronic processor coupled to the transmitter control unit and the transceiver. The electronic processor is configured to establish, using the transceiver, communication with the power receiver device, and negotiate power transfer requirements between the power transmitter device and the power receiver device. The electronic processor is also configured to control the transmitter coil unit to transfer power to the power receiver device.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: November 16, 2021
    Assignee: Hubbell Incorporated
    Inventors: John Brower, Matthew Samojeden, Shadi AbuGhazaleh, Robert Simon
  • Patent number: 11177223
    Abstract: Disclosed is an apparatus and methods for making same. The apparatus includes a substrate, a set of electrical contacts disposed on the surface of the substrate, and an electromagnetic interference (EMI) shield pedestal structure, disposed between an outer periphery of the set of electrical contacts and an outer portion of the substrate.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: November 16, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Aniket Patil, Hong Bok We, Brigham Navaja
  • Patent number: 11152331
    Abstract: An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a reduced size.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: October 19, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Lung-Yuan Wang, Feng Kao, Mao-Hua Yeh
  • Patent number: 11143682
    Abstract: A data processing device includes an internal volume that is electromagnetic interference (EMI) isolated. The data processing device further includes an electromagnetic radiation (EMR) suppressing vent that defines one wall of the internal volume. The data processing device further includes a wireless system. The wireless system includes a first portion that is disposed in the internal volume. The first portion receives network data units from EMI emitting devices disposed in the internal volume and a second portion of the wireless system. The second portion is disposed outside of the internal volume and obtains the network data units from the first portion using a wireless connection that utilizes a transmission path that traverses through the EMR suppressing vent.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: October 12, 2021
    Assignee: DELL PRODUCTS L.P.
    Inventors: Steven Embleton, Ben John Sy, Eric Michael Tunks
  • Patent number: 11147195
    Abstract: A Faraday enclosure apparatus and method for manufacturing same are disclosure. The enclosure may comprise one or more sewn seam portions constructed to prevent signal leakage through stitch apertures in the seam. A vestibule section facilitates signal-shielded movement of electronic devices between the ambient environment and the main cavity of the enclosure. A connector filter may be mounted to extend through a wall of the enclosure to manage wired power and signal communications entering and exiting the main cavity of the enclosure. Foldable side walls facilitate the collapsibility of the enclosure for compact transport and storage.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: October 12, 2021
    Assignee: Merakai, LLC
    Inventor: Ryan Judy
  • Patent number: 11059954
    Abstract: A composition for preparing an article including a polyimide or poly(imide-amide) copolymer, the composition including (1) at least one of (i) a polyimide, a polyamic acid, or a poly(imide-amic acid) including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2; and (ii) a poly(imide-amide) copolymer, a poly(amic acid-amide) copolymer, or a poly(imide and amic acid-amide) copolymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a structural unit represented by Chemical Formula 3, and (2) a compound having a maximum absorption wavelength at about 570 nm or more in a visible radiation region: wherein in Chemical Formulae 1 to 3, A, B, D, and E are the same as defined in the detailed description.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: July 13, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: A Ra Jo, Chanjae Ahn, Byunghee Sohn, Kyeong-sik Ju
  • Patent number: 11013131
    Abstract: A shielding cover is provided. The shielding cover is adapted to be disposed on a circuit board and covers at least one electronic element. The shielding cover includes a cover body and a first spacer. The cover body includes a top sheet and a plurality of sidewalls, wherein a plurality of sidewall connecting portions are formed on the sidewalls. The first spacer includes a first spacer body, a first connection portion and a second connection portion, wherein the first connection portion and the second connection portion are formed on two ends of the first spacer body, and the first connection portion and the second connection portion are detachably connected to the sidewall connecting portions.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 18, 2021
    Assignee: WISTRON NEWEB CORP.
    Inventors: Jen-Yung Chang, Tiao-Ming Hsu
  • Patent number: 10993311
    Abstract: A display device is capable of preventing electro-static discharge by attaching a driving integrated circuit cover to a driving integrated circuit and a flexible printed circuit board, the display device including a display panel including a display area and a non-display area, a driving integrated circuit for providing signals, data, and voltages to the display area, a flexible printed circuit board coupled to the driving integrated circuit, and including an open ground portion at one side of the flexible printed circuit board, and an integrated circuit cover portion overlapping the driving integrated circuit and at least a portion of the flexible printed circuit board, and including a cut portion at an area corresponding to the open ground portion.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: April 27, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventor: Cheoloh Lim
  • Patent number: 10959356
    Abstract: A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive core layer of metallic foam having generally parallel opposed surfaces and a face sheet having rigidity properties superior to the rigidity properties of the core layer laminated to a surface of the core layer. Alternatively, a panel for a broadband electromagnetic shield includes a composite fiber-reinforced core having opposed surfaces and a layered electrically-conductive composite cover disposed on a surface of the core. The cover includes a first stratum of porous metal exhibiting pronounced low-frequency electromagnetic shielding properties and a second stratum of electrically-conductive elements exhibiting pronounced high-frequency electromagnetic shielding properties secured in an overlapping electrically-continuous relationship to the first stratum, the first stratum being a metallic lattice, and the electrically-conductive elements being a non-woven veil of electrically-nonconductive metal-coated fibers.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: March 23, 2021
    Assignee: Conductive Composites Company IP, LLC
    Inventors: George Clayton Hansen, Nathan D. Hansen
  • Patent number: 10938161
    Abstract: A device includes a printed circuit board (PCB) and a shield for the PCB. The shield can reduce high frequency electromagnetic frequency (EMF) noise generated by one or more components of the PCB. The PCB includes pads to interface with a corresponding connector. For example, for a dual inline memory module (DIMM) PCB, the PCB includes pads to insert into a DIMM connector. The shield includes a gap in its perimeter that aligns with clips in the corresponding connector. The gaps will correspond to similar features of the PCB that interface with the corresponding connector to allow the shield to attach to the PCB. The shield includes lock fingers to extend from a connector-facing edge of the shield to interface with the corresponding connector to align the shield with the corresponding connector.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: March 2, 2021
    Assignee: Intel Corporation
    Inventors: Jaejin Lee, Jun Liao, Xiang Li, Christopher E. Cox
  • Patent number: 10893637
    Abstract: An electronic device including a shield structure is provided. The electronic device includes a first device including a first magnetic substance, a second device including a second magnetic substance, and a shield structure configured to shield at least part of a magnetic force generated between the first magnetic substance and the second magnetic substance, wherein the shield structure includes a shield member disposed between the first device and the second device and including a property of a magnetic substance, and a connecting member physically connected to at least part of the shield member and including a property of a nonmagnetic substance, wherein at least part of the connecting member is physically connected to a circuit board.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: January 12, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gihoon Lee, Seunggoo Kang, Yonghwa Kim, Hongjun Kim, Wangik Son, Jaehwan Lee, Seungbum Choi, Jaedeok Lim
  • Patent number: 10884209
    Abstract: An optical fiber distribution cabinet comprising a housing having a front opening for accessing an interior of the cabinet, a high density distribution field including a bulkhead having a plurality of faceplates configured to receive a plurality of high density adapters, and a staging area configured to receive a staging plate including a frame having a plurality of pins configured to couple to latchless adapters.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: January 5, 2021
    Assignee: Clearfield, Inc.
    Inventors: John P. Hill, Randy T. VanHorn, Walter E. Power, II
  • Patent number: 10827257
    Abstract: An in-vehicle audio system, including a sounding module mounted inside a vehicle. The sounding module includes a housing having receiving space, and a sounding unit mounted in the receiving space. The sounding unit divides the receiving space into a back coupling cavity and a front sounding cavity. The housing includes a body fixing the sounding unit, and an upper cover plate and a lower cover plate mounted at two sides of the body. The back coupling cavity is formed between the lower cover plate and the body. The front sounding cavity is formed between the upper cover plate and the body. The sounding side of the sounding unit is facing toward the upper cover plate. The side wall of the body is provided with a side sounding outlet communicated with the front sounding cavity. The side sounding outlet is facing toward the interior of the vehicle.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: November 3, 2020
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Shuyuan Sun, Hao Yin, Rongguan Zhou
  • Patent number: 10796157
    Abstract: A processor of an apparatus plays a video on a display device and receives a command one or more times. In response to receiving the command, the processor performs object detection in a hierarchical manner with respect to objects in the video. The processor displays a video image from the video. Upon receiving the command for a first time, the processor detects in the video image a first set of one or more objects at a first hierarchical level and highlights the first set of one or more objects. Upon receiving the command for a second time, the processor detects in the video image a second set of one or more objects at a second hierarchical level below the first hierarchical level and highlights the second set of one or more objects.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: October 6, 2020
    Assignee: MediaTek Inc.
    Inventors: Tsun-Shan Chan, Shao-Nung Chiu
  • Patent number: 10790239
    Abstract: A semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, an encapsulant disposed to cover at least a portion of the semiconductor chip, and a connection member including a redistribution layer. The redistribution layer includes a plurality of first pads, a plurality of second pads surrounding the plurality of first pads, and a plurality of third pads surrounding the plurality of second pads. Each of the plurality of second pads and each of the plurality of third pads have shapes different from a shape of each of the plurality of first pads. Gaps between the plurality of second pads and gaps between the plurality of third pads are staggered with each other.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 29, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Hyun Lim, Chul Kyu Kim, Kyung Moon Jung, Han Kim, Yoon Seok Seo
  • Patent number: 10788868
    Abstract: An information handling system housing vents air at a grid of openings formed in a wall with a member extending outward from each intersection of the grid to define air channels. Each member terminates with a polished planar surface that reflects light against a flat underlying material. Variable angles of the polished planar surface relative to the plane of the wall creates a presentation of isolated reflections against the flat background that vary based upon a viewing angle of the housing wall.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: September 29, 2020
    Assignee: Dell Products L.P.
    Inventors: Richard Andrew Crisp, Richard William Guzman
  • Patent number: 10785899
    Abstract: A door assembly is described. The door assembly includes a door structure that is mounted over an opening of an enclosure. The door structure includes a body that includes a first surface and a second surface opposite to the first surface. The first surface may face an inside of the enclosure when the door structure is closed. The door structure includes a number of finger bracket structures mounted on the first surface. Each one of the finger bracket structures includes a bracket and one or more finger gaskets coupled to the bracket. The finger gaskets of the finger bracket structures may contact enclosure brackets mounted around an edge of the opening of the enclosure when the door structure is closed. A combination of the finger gaskets in contact with enclosure brackets may create an electromagnetic interference (EMI) shield at the edge of the opening of the enclosure.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: September 22, 2020
    Assignee: CAREFUSION 303, INC.
    Inventors: Michael Rahilly, Edward Stephen Ferner, Jr., Brendan John Burgess, Scott Riley, Michael Dugan Joyce, Noe Arroyo, Chris Pedersen
  • Patent number: 10757847
    Abstract: According to an aspect, a display device includes: a light source provided on a back surface side of a display panel; a printed circuit board provided on a back surface side of the light source; a shielding cover that covers the printed circuit board; a screwing member; and a projecting portion. A surface of the printed circuit board facing the shielding cover is provided with a ground pattern electrically coupled to the shielding cover. The ground pattern has a pattern-side through-hole therein, and the pattern-side through-hole penetrates the ground pattern and allows a screw member to pass therethrough. The shielding cover has a cover-side through-hole therein, and the cover-side through-hole overlaps the ground pattern and allows the screw member to pass therethrough. The screwing member is screwed onto the screw member. The projecting portion is provided in an area surrounding the cover-side through-hole and projects toward the ground pattern.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: August 25, 2020
    Assignee: Japan Display Inc.
    Inventors: Masanori Maemuko, Keiichi Kishida
  • Patent number: 10732672
    Abstract: A portable communication device is provided. The portable communication device includes a window having a flat window area and a curved window area extending from the flat window area. In addition, the portable communication device includes a display disposed beneath the window and including a flat display area, a curved display area extending from the flat display area, and a wiring area extending from the curved display area. Additionally, the portable communication device includes a fixed part supporting at least one portion of the flat display area and at least one portion of the curved display area, and a bracket supporting at least one portion of the curved display area and at least one portion of the wiring area.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: August 4, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Woon Geun Kwak, Jung Sik Park, Do Hun Cha
  • Patent number: 10706832
    Abstract: A printed circuit assembly includes a printed circuit board, a processor, an oscillator and a noise reduction device. The printed circuit board has a ground connecting portion. The processor is disposed on the printed circuit board. The oscillator is disposed on the printed circuit board. The noise reduction device includes a wave absorber, a blocking sheet and an electrically conductive member. The wave absorber includes a processor covering part and an oscillator covering part. The oscillator covering part protrudes from one side of the processor covering part. The processor covering part and the oscillator covering part respectively cover the processor and the oscillator. The blocking sheet is stacked on the oscillator covering part to cover the oscillator. One end of the electrically conductive member is connected to the blocking sheet, and another end of the printed circuit board is connected to the ground connecting portion.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: July 7, 2020
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventor: Mu-Chi Chen
  • Patent number: 10692905
    Abstract: An optical module includes an electronic assembly and an optical component. The electronic assembly includes a chip component and a circuit board. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers extend to the bottom of the bracket and are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: June 23, 2020
    Assignee: AZUREWAVE TECHNOLOGIES, INC.
    Inventors: Kung-An Lin, Chung-Che Yang, Ming-Chun Lu
  • Patent number: 10691165
    Abstract: Electronic devices may be provided having internal components mounted to a structural glass support member. The structural glass support member may have a planar front surface that forms a front surface of the device. The structural glass support member may have bent portions that form sidewall surfaces of the device. Portions of the structural glass support member may form a transparent display cover layer. A rigid or flexible display may be mounted to the structural glass support member. Additional internal device components may be mounted to the display. A thin enclosure for enclosing the internal components in the device may be mounted to the structural glass support member. The thin enclosure may be mounted to the structural glass support member using a peripheral member. The thin enclosure may be free from attachments to internal components or may be adhesively bonded to one or more internal components.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: June 23, 2020
    Assignee: APPLE INC.
    Inventors: Jeremy C. Franklin, Fletcher R. Rothkopf, John P. Ternus, Kevin D. Gibbs
  • Patent number: 10681844
    Abstract: Systems, electronic devices, and methods are directed to a self-adjustable heat spreader. A spring system may include one or more spring members and a contact surface adapted to contact a circuit board component. Each spring member may include a thermally conductive material. A thermal spreader plate may be coupled to the one or more spring members. The spring system and the thermal spreader plate may be configured to allow movement, with respect to the thermal spreader plate along multiple axes, of one or more portions of the one or more spring members proximate to the thermal spreader plate when the contact surface is pressed against the circuit board component and the spring system transitions from a first state to a compressed state. The contact surface and the spring system may be configured to transfer heat between the circuit board component and the thermal spreader plate.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: June 9, 2020
    Assignee: DISH Technologies L.L.C.
    Inventors: Svitlana Trygubova, Morgan Kirby
  • Patent number: 10674646
    Abstract: An electromagnetic interference shield includes a housing having an opening formed by a peripheral flange, and a base heat sink engaged onto the housing, the base heat sink includes an aperture formed the base heat sink and includes one or more folds for increasing a surface size of the base heat sink, a conductive member is engaged with the peripheral flange of the housing, and the conductive member includes a fastener engaged through the opening of the housing and engaged with the aperture of the base heat sink, and one or more heat sinks are further attached onto the base heat sink for increasing a surface size of the heat sinks.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: June 2, 2020
    Assignee: Aliner Industries Inc.
    Inventors: Meng Chieh Wu, Yun Sheng Chen
  • Patent number: 10661668
    Abstract: A power conversion apparatus capable of cheaply securing safety and achieving watertightness. The power conversion apparatus (100) has: a charging device (14) for charging from an external power source (20) to a cell (30); an inverter (13) for converting the current of the cell (30) from direct current to alternating current and supplying the current to a motor (40); and a junction box (15) for relaying an electrical connection. The inverter (13), the charging device (14), and the junction box (15) are contained in a single housing. Also, the charging device (14) and the junction box (15) are electrically connected, and the junction box (15) and the inverter (13) are electrically connected. Also, the junction box (15) and the inverter (13) are connected by a bus bar (16).
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: May 26, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryota Hosaka, Kazushige Kakutani, Kenji Taguchi, Takashi Kamiya, Nobuo Yamamoto
  • Patent number: 10643952
    Abstract: A semiconductor device has a plurality of first semiconductor die mounted over an interface layer formed over a temporary carrier. An encapsulant is deposited over the first die and carrier. A flat shielding layer is formed over the encapsulant. A channel is formed through the shielding layer and encapsulant down to the interface layer. A conductive material is deposited in the channel and electrically connected to the shielding layer. The interface layer and carrier are removed. An interconnect structure is formed over conductive material, encapsulant, and first die. The conductive material is electrically connected through the interconnect structure to a ground point. The conductive material is singulated to separate the first die. A second semiconductor die can be mounted over the first die such that the shielding layer covers the second die and the conductive material surrounds the second die or the first and second die.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: May 5, 2020
    Assignee: JCET Semiconductor (Shaoxing) Co., Ltd.
    Inventors: Reza A. Pagaila, Flynn Carson, Seung Uk Yoon
  • Patent number: 10629530
    Abstract: According to one embodiment, a semiconductor device 1 includes an Si substrate 11, an inductor 12 formed in wiring layers disposed above the Si substrate 11, and a shield 13 formed so as to surround the inductor 12, in which the shield 13 includes metals 105 to 109 formed in, among the wiring layers, a layer in which the inductor 12 is formed and a layer above that layer, and a silicide 104 formed between the Si substrate 11 and the wiring layers above the Si substrate 11.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: April 21, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Shinichi Uchida, Keiichiro Tanaka, Takafumi Kuramoto
  • Patent number: 10602612
    Abstract: Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: March 24, 2020
    Assignee: Apple Inc.
    Inventors: Lan H. Hoang, Takayoshi Katahira, Leilei Zhang, Raghunandan R. Chaware
  • Patent number: 10558904
    Abstract: An electronic commerce protection system enables a person to safely carry credit, debit, gift cards or the like. The system prevents access to the data on the credit card from physical theft by attaching the system to a persons' boot or other article of clothing. The system prevents electronic or wireless reading of the data by shielding the card from malicious attacks.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: February 11, 2020
    Inventor: Lance Richard Dewbre
  • Patent number: 10553569
    Abstract: A device includes a semiconductor structure comprising a top package stacked on a bottom package, wherein the bottom package comprises a plurality of bottom package bumps on a bottom surface of the bottom package, a front side contact metal, a molding compound layer and a backside contact metal, and wherein the front side contact metal is between the plurality of bottom package bumps and the molding compound layer and a metal shielding layer on a top surface, sidewalls of the semiconductor structure and portions of a bottom surface of the bottom package, wherein the metal shielding layer is in direct contact with an edge of at least one of the front side contact metal and the backside contact metal.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: February 4, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Po-Hao Tsai, Jing-Cheng Lin, Li-Hui Cheng
  • Patent number: 10542644
    Abstract: This disclosure relates to a two-piece shield comprising a fence having integrally formed sidewalls and an upper frame, and a lid. The lid attaches to the fence, which is attached to the circuit board. The fence is a relatively thick, flexible material for supporting the lid. The fence has a recess so that the lid can be recessed into the fence to position the lid closer to the circuit for enhanced heat absorption. The lid could be made of a thicker heat absorbing material than the fence, again to facilitate heat absorption. The lid can be press-fit into the recess of the fence. The fence and lid can have a dovetail configuration to retain the lid in the fence.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: January 21, 2020
    Assignee: A.K. Stamping Company, Inc.
    Inventors: Arthur Kurz, Michael Schneider
  • Patent number: 10506344
    Abstract: An amplifying device includes first and second substrates. The first substrate has a first mounting surface, and the second substrate has a second mounting surface. The first mounting surface of the first substrate that is opposite the second substrate is provided with: a first ground line; a first signal line configured to transfer an audio signal; and a first amplifier configured to amplify the audio signal. The second mounting surface of the second substrate that is opposite the first substrate is provided with: a second grounded line; a second signal line configured to transfer an audio signal; and a second amplifier configured to amplify the audio signal. The first and second grounded lines correspond to each other in position and shape, and overlap in planar view. The first and second signal lines correspond to each other in position and shape, and overlap in planar view.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: December 10, 2019
    Assignee: YAMAHA CORPORATION
    Inventor: Shinichi Fujita
  • Patent number: 10502868
    Abstract: A unitary radome layer assembly is provided and includes a first nanocomposite formulation and a second nanocomposite formulation. The first and second nanocomposite formulations are provided together in a unitary radome layer with respective distribution gradients.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: December 10, 2019
    Assignee: RAYTHEON COMPANY
    Inventors: Catherine Trent, Gary A. Frazier
  • Patent number: 10485119
    Abstract: A display device includes a display member configured to display an image; and a window member including a transmission area configured to transmit the image, and a bezel area having a color and arranged adjacent to the transmission area in a plan view, the window member including a base member in which a plurality of air gaps are defined in an area of the base member corresponding to the bezel area; and a color member in the air gaps to define the color of the bezel area.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: November 19, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yunseon Do, Byungchoon Yang, Hyesog Lee, Jaejoong Kwon
  • Patent number: 10484522
    Abstract: A utility case for electronic devices that has an exterior case, a shield having a concave face and a convex face, a magnet, a housing, a plate, an insert, an interior case, and an exterior case ring. The exterior case has a lock assembly at an interior face, which has a containing wall inner side. The lock assembly comprises an interior edge, and a containing wall interior face. The housing has a lip defined at the locking face. The insert fits within the magnet, the magnet adheres to the plate, and the lip contains the plate, when the housing is placed onto the lock assembly. The shield is positioned in between the insert and the exterior case, and the housing is positioned in between the interior case and the exterior case when the housing is placed onto the lock assembly.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: November 19, 2019
    Inventor: Hamid McHatet
  • Patent number: 10447902
    Abstract: The invention relates to a camera (2) for a motor vehicle (1) including a housing (5) configured to shield electromagnetic radiation at least in certain areas, including a circuit board (16) disposed in the housing (5), and including an interface device (11) for connecting the camera (2) to the motor vehicle (1), wherein the interface device (11) is electrically connected to the circuit board (16), wherein the interface device (11) includes a coaxial plug (12) with an inner conductor (13) and an outer conductor (14) and the camera (2) has a connecting device (17) for electrically connecting the outer conductor (14) to the housing (5).
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: October 15, 2019
    Assignee: Connaught Electronics Ltd.
    Inventors: Carol Grimes, Colin Patrick Hehir
  • Patent number: 10433417
    Abstract: An electronic apparatus includes a conductive member and a printed circuit board, wherein the printed circuit board includes a printed wiring board having a signal wiring formed thereon, a first semiconductor device configured to output a digital signal to the signal wiring, and a second semiconductor device configured to input the digital signal output from the first semiconductor device via the signal wiring, wherein the signal wiring has a signal wiring pattern formed on a surficial layer located opposite the conductive member in the printed wiring board, and wherein the conductive member has an aperture formed therein and located opposite the signal wiring pattern or includes a flat plate portion and a recessed portion recessed in a direction more away from the printed wiring board than the flat plate portion.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: October 1, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Hirai, Yasuhito Tatara
  • Patent number: 10424545
    Abstract: The present disclosure provides for a semiconductor package device and a method for manufacturing the same. The semiconductor package device includes a substrate, a shielding wall and a package body. The substrate has a top surface. The shielding wall is disposed on the top surface. The shielding wall has a conductive main body and a plurality of protruding portions extending from the conductive main body. The package body encapsulates the shielding wall.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: September 24, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: JR-Wei Lin