Emi Patents (Class 361/818)
  • Patent number: 10674646
    Abstract: An electromagnetic interference shield includes a housing having an opening formed by a peripheral flange, and a base heat sink engaged onto the housing, the base heat sink includes an aperture formed the base heat sink and includes one or more folds for increasing a surface size of the base heat sink, a conductive member is engaged with the peripheral flange of the housing, and the conductive member includes a fastener engaged through the opening of the housing and engaged with the aperture of the base heat sink, and one or more heat sinks are further attached onto the base heat sink for increasing a surface size of the heat sinks.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: June 2, 2020
    Assignee: Aliner Industries Inc.
    Inventors: Meng Chieh Wu, Yun Sheng Chen
  • Patent number: 10661668
    Abstract: A power conversion apparatus capable of cheaply securing safety and achieving watertightness. The power conversion apparatus (100) has: a charging device (14) for charging from an external power source (20) to a cell (30); an inverter (13) for converting the current of the cell (30) from direct current to alternating current and supplying the current to a motor (40); and a junction box (15) for relaying an electrical connection. The inverter (13), the charging device (14), and the junction box (15) are contained in a single housing. Also, the charging device (14) and the junction box (15) are electrically connected, and the junction box (15) and the inverter (13) are electrically connected. Also, the junction box (15) and the inverter (13) are connected by a bus bar (16).
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: May 26, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryota Hosaka, Kazushige Kakutani, Kenji Taguchi, Takashi Kamiya, Nobuo Yamamoto
  • Patent number: 10643952
    Abstract: A semiconductor device has a plurality of first semiconductor die mounted over an interface layer formed over a temporary carrier. An encapsulant is deposited over the first die and carrier. A flat shielding layer is formed over the encapsulant. A channel is formed through the shielding layer and encapsulant down to the interface layer. A conductive material is deposited in the channel and electrically connected to the shielding layer. The interface layer and carrier are removed. An interconnect structure is formed over conductive material, encapsulant, and first die. The conductive material is electrically connected through the interconnect structure to a ground point. The conductive material is singulated to separate the first die. A second semiconductor die can be mounted over the first die such that the shielding layer covers the second die and the conductive material surrounds the second die or the first and second die.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: May 5, 2020
    Assignee: JCET Semiconductor (Shaoxing) Co., Ltd.
    Inventors: Reza A. Pagaila, Flynn Carson, Seung Uk Yoon
  • Patent number: 10629530
    Abstract: According to one embodiment, a semiconductor device 1 includes an Si substrate 11, an inductor 12 formed in wiring layers disposed above the Si substrate 11, and a shield 13 formed so as to surround the inductor 12, in which the shield 13 includes metals 105 to 109 formed in, among the wiring layers, a layer in which the inductor 12 is formed and a layer above that layer, and a silicide 104 formed between the Si substrate 11 and the wiring layers above the Si substrate 11.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: April 21, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Shinichi Uchida, Keiichiro Tanaka, Takafumi Kuramoto
  • Patent number: 10602612
    Abstract: Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: March 24, 2020
    Assignee: Apple Inc.
    Inventors: Lan H. Hoang, Takayoshi Katahira, Leilei Zhang, Raghunandan R. Chaware
  • Patent number: 10558904
    Abstract: An electronic commerce protection system enables a person to safely carry credit, debit, gift cards or the like. The system prevents access to the data on the credit card from physical theft by attaching the system to a persons' boot or other article of clothing. The system prevents electronic or wireless reading of the data by shielding the card from malicious attacks.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: February 11, 2020
    Inventor: Lance Richard Dewbre
  • Patent number: 10553569
    Abstract: A device includes a semiconductor structure comprising a top package stacked on a bottom package, wherein the bottom package comprises a plurality of bottom package bumps on a bottom surface of the bottom package, a front side contact metal, a molding compound layer and a backside contact metal, and wherein the front side contact metal is between the plurality of bottom package bumps and the molding compound layer and a metal shielding layer on a top surface, sidewalls of the semiconductor structure and portions of a bottom surface of the bottom package, wherein the metal shielding layer is in direct contact with an edge of at least one of the front side contact metal and the backside contact metal.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: February 4, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Po-Hao Tsai, Jing-Cheng Lin, Li-Hui Cheng
  • Patent number: 10542644
    Abstract: This disclosure relates to a two-piece shield comprising a fence having integrally formed sidewalls and an upper frame, and a lid. The lid attaches to the fence, which is attached to the circuit board. The fence is a relatively thick, flexible material for supporting the lid. The fence has a recess so that the lid can be recessed into the fence to position the lid closer to the circuit for enhanced heat absorption. The lid could be made of a thicker heat absorbing material than the fence, again to facilitate heat absorption. The lid can be press-fit into the recess of the fence. The fence and lid can have a dovetail configuration to retain the lid in the fence.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: January 21, 2020
    Assignee: A.K. Stamping Company, Inc.
    Inventors: Arthur Kurz, Michael Schneider
  • Patent number: 10502868
    Abstract: A unitary radome layer assembly is provided and includes a first nanocomposite formulation and a second nanocomposite formulation. The first and second nanocomposite formulations are provided together in a unitary radome layer with respective distribution gradients.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: December 10, 2019
    Assignee: RAYTHEON COMPANY
    Inventors: Catherine Trent, Gary A. Frazier
  • Patent number: 10506344
    Abstract: An amplifying device includes first and second substrates. The first substrate has a first mounting surface, and the second substrate has a second mounting surface. The first mounting surface of the first substrate that is opposite the second substrate is provided with: a first ground line; a first signal line configured to transfer an audio signal; and a first amplifier configured to amplify the audio signal. The second mounting surface of the second substrate that is opposite the first substrate is provided with: a second grounded line; a second signal line configured to transfer an audio signal; and a second amplifier configured to amplify the audio signal. The first and second grounded lines correspond to each other in position and shape, and overlap in planar view. The first and second signal lines correspond to each other in position and shape, and overlap in planar view.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: December 10, 2019
    Assignee: YAMAHA CORPORATION
    Inventor: Shinichi Fujita
  • Patent number: 10485119
    Abstract: A display device includes a display member configured to display an image; and a window member including a transmission area configured to transmit the image, and a bezel area having a color and arranged adjacent to the transmission area in a plan view, the window member including a base member in which a plurality of air gaps are defined in an area of the base member corresponding to the bezel area; and a color member in the air gaps to define the color of the bezel area.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: November 19, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yunseon Do, Byungchoon Yang, Hyesog Lee, Jaejoong Kwon
  • Patent number: 10484522
    Abstract: A utility case for electronic devices that has an exterior case, a shield having a concave face and a convex face, a magnet, a housing, a plate, an insert, an interior case, and an exterior case ring. The exterior case has a lock assembly at an interior face, which has a containing wall inner side. The lock assembly comprises an interior edge, and a containing wall interior face. The housing has a lip defined at the locking face. The insert fits within the magnet, the magnet adheres to the plate, and the lip contains the plate, when the housing is placed onto the lock assembly. The shield is positioned in between the insert and the exterior case, and the housing is positioned in between the interior case and the exterior case when the housing is placed onto the lock assembly.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: November 19, 2019
    Inventor: Hamid McHatet
  • Patent number: 10447902
    Abstract: The invention relates to a camera (2) for a motor vehicle (1) including a housing (5) configured to shield electromagnetic radiation at least in certain areas, including a circuit board (16) disposed in the housing (5), and including an interface device (11) for connecting the camera (2) to the motor vehicle (1), wherein the interface device (11) is electrically connected to the circuit board (16), wherein the interface device (11) includes a coaxial plug (12) with an inner conductor (13) and an outer conductor (14) and the camera (2) has a connecting device (17) for electrically connecting the outer conductor (14) to the housing (5).
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: October 15, 2019
    Assignee: Connaught Electronics Ltd.
    Inventors: Carol Grimes, Colin Patrick Hehir
  • Patent number: 10433417
    Abstract: An electronic apparatus includes a conductive member and a printed circuit board, wherein the printed circuit board includes a printed wiring board having a signal wiring formed thereon, a first semiconductor device configured to output a digital signal to the signal wiring, and a second semiconductor device configured to input the digital signal output from the first semiconductor device via the signal wiring, wherein the signal wiring has a signal wiring pattern formed on a surficial layer located opposite the conductive member in the printed wiring board, and wherein the conductive member has an aperture formed therein and located opposite the signal wiring pattern or includes a flat plate portion and a recessed portion recessed in a direction more away from the printed wiring board than the flat plate portion.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: October 1, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Hirai, Yasuhito Tatara
  • Patent number: 10424545
    Abstract: The present disclosure provides for a semiconductor package device and a method for manufacturing the same. The semiconductor package device includes a substrate, a shielding wall and a package body. The substrate has a top surface. The shielding wall is disposed on the top surface. The shielding wall has a conductive main body and a plurality of protruding portions extending from the conductive main body. The package body encapsulates the shielding wall.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: September 24, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: JR-Wei Lin
  • Patent number: 10418838
    Abstract: According to various embodiments of the present disclosure, disclosed is a wireless power charging apparatus that includes a transparent dielectric body including a cavity for accommodating an electronic device, a transparent conductor provided on a wall of transparent dielectric configured to substantially block wireless power to outside the cavity, and at least one frequency filtering region disposed in the transparent conductor configured to perform at least one of pass a communication frequency of the electronic device and substantially block the wireless power to outside the cavity.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: September 17, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jungyub Lee, Dohyuk Ha, Junsig Kum, Youngju Lee
  • Patent number: 10383266
    Abstract: Apparatuses, systems and methods associated isolation to avoid interference from wireless signals in a circuit assembly are disclosed herein. In embodiments, a wireless signal isolation assembly may include an outer shield enclosure, the outer shield enclosure to enclose circuitry of a circuit board that is to be isolated from interference, wherein the outer shield enclosure is to attenuate wireless signals. The wireless signal isolation assembly may further include a first inner shield enclosure located within the outer shield enclosure, the first inner shield enclosure to enclose first circuitry, wherein the first inner shield enclosure is to attenuate wireless signals. The wireless signal isolation assembly may further include a second inner shield enclosure located within the outer shield enclosure, the second inner shield enclosure to enclose second circuitry, wherein the second inner shield enclosure is to attenuate wireless signals. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: August 13, 2019
    Assignee: Audio Precision, Inc.
    Inventors: William Bunnell, Fredrick Capell, Jr., William Noelcke
  • Patent number: 10345936
    Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: July 9, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Shingo Ogura, Takaharu Hondo, Takeshi Shiojiri
  • Patent number: 10292317
    Abstract: An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: May 14, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jung-Sik Park, Seung-Ki Choi, Joon Heo, Hyun-Ju Hong
  • Patent number: 10272646
    Abstract: Provided is an electromagnetic shielding material having improved electromagnetic shielding properties. The present invention relates to an electromagnetic shielding material having a structure in which at least two metal foils are laminated via at least one insulating layer, the electromagnetic shielding material comprising at least one metal oxide layer on at least one boundary surface over which each metal foil is in contact with the insulating layer, the metal oxide layer having a thickness of from 1 to 30 nm.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: April 30, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Koichiro Tanaka
  • Patent number: 10271468
    Abstract: A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The side wall and ceiling portions are forming accommodation space to accommodate electronic component, the ceiling portion has a first surface facing the space and a second surface on the opposite side, the side wall portion has a third surface facing the ceiling portion, a fourth surface on the opposite side, a fifth surface facing the space, and a sixth surface on the opposite side, and the side wall portion is formed such that the sixth surface has a first inclined portion increasing distance to the space from the third toward fourth surfaces and a second inclined portion increasing distance to the space from the fourth toward third surfaces.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: April 23, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Toshiki Furutani, Takema Adachi, Hidetoshi Noguchi, Shota Tachibana
  • Patent number: 10270210
    Abstract: Communications connectors are provided that include a printed circuit board having a plurality of input terminals, a plurality of output terminals, and a plurality of conductive paths that connect each input terminal to a respective output terminal. The conductive paths are arranged as a plurality of differential transmission lines, and a solenoid inductor is implemented along at least one of the conductive paths.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: April 23, 2019
    Assignee: CommScope, Inc. of North Carolina
    Inventor: Richard A. Schumacher
  • Patent number: 10264717
    Abstract: Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: April 16, 2019
    Assignee: INTEL CORPORATION
    Inventor: Robert Sankman
  • Patent number: 10231369
    Abstract: A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves, and a metal layer formed on a portion of the side wall portion such that the metal layer is interposed between the conductive film and the portion of the side wall portion. The side wall and ceiling portions are forming an accommodation space to accommodate an electronic component, and the metal layer is formed on a surface of the side wall portion on the opposite side of a surface of the side wall portion facing the ceiling portion and interposed between the conductive film and the side wall portion.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: March 12, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Toshiki Furutani, Takema Adachi, Hidetoshi Noguchi, Shota Tachibana
  • Patent number: 10178758
    Abstract: A printed wiring board includes a digital circuit, an analog circuit, and a power supply path that is disposed on an insulating layer between the digital circuit and the analog circuit. A plurality of open stub EBG structures are disposed at an end of a bridge section in a power supply plane. The open stub EBG structure is an open stub state whose one end is connected to the power supply path and other end is in an open state.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: January 8, 2019
    Assignees: NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY, KYOCERA CORPORATION
    Inventors: Yoshitaka Toyota, Kengo Iokibe, Yuki Yamashita, Toshiyuki Kaneko, Masanori Naito, Kiyohiko Kaiya, Toshihisa Uehara, Koichi Kondo
  • Patent number: 10147685
    Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: December 4, 2018
    Assignee: Apple Inc.
    Inventors: Phillip R. Sommer, Shankar Pennathur, Meng Chi Lee, Shakti S. Chauhan, Yanfeng Chen
  • Patent number: 10141631
    Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include an antenna. The electronic device may have a housing in which control circuitry and radio-frequency transceiver circuitry is mounted. The transceiver circuitry may be used to transmit and receive radio-frequency signals with the antenna. The housing may have a housing wall with a locally thinned portion aligned with the antenna. The antenna may have a sheet metal layer attached to a plastic cavity with a layer of adhesive. Recesses in a printed circuit may receive prongs formed from a sheet metal layer. The plastic carrier may have cavities separated by ribs. The sheet metal layer may form a planar inverted-F antenna resonating element, a ground plane, a return path between the resonating element and ground plane, and a feed path that extends along one of the ribs and into an opening in the printed circuit.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: November 27, 2018
    Assignee: Apple Inc.
    Inventors: Francesco Merli, Yi Jiang, Boon W. Shiu, Carlo Di Nallo, Javier Gomez Tagle, Mattia Pascolini
  • Patent number: 10098237
    Abstract: Electrical components may be mounted on a printed circuit or other substrate. The electrical components may be covered with a conformal coating containing a wavelength-tuned-light-absorption-enhancement additive. The additive may be a dye or other additive that creates a light absorption peak at a given wavelength. To form openings in the conformal coating in alignment with the electrical components without damaging the components, a laser ablation tool may apply laser light at the given wavelength to the conformal coating. Openings may also be formed by placing tape over the components before the con form at coating is applied. The tape may have a color with a light absorption peak at the given wavelength to facilitate the formation of openings without damaging sensitive components.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: October 9, 2018
    Assignee: Apple Inc.
    Inventors: Ferdinand S. Toting, Arpit K. Akkinepalli, Goran S. Diminich, Xiaoyi Zhou
  • Patent number: 10079458
    Abstract: The invention relates to a camera (2) for a motor vehicle (1) including a housing (5) configured to shield electromagnetic radiation at least in certain areas, including a circuit board (16) disposed in the housing (5), and including an interface device (11) for connecting the camera (2) to the motor vehicle (1), wherein the interface device (11) is electrically connected to the circuit board (16), wherein the interface device (11) includes a coaxial plug (12) with an inner conductor (13) and an outer conductor (14) and the camera (2) has a connecting device (17) for electrically connecting the outer conductor (14) to the housing (5).
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: September 18, 2018
    Assignee: Connaught Electronics Ltd.
    Inventors: Colin Patrick Hehir, Carol Grimes
  • Patent number: 10076069
    Abstract: An electronic circuit module includes a circuit board and a metal cover. The metal cover includes a top plate and attachment legs. Electrode lands are provided on the circuit board, each of the electrode lands being joined to a corresponding one of the attachment legs. Each of the attachment legs includes a fixing portion joined to a corresponding one of the electrode lands, an insertion portion that extends so as to project from the fixing portion, a clearance portion provided near a base of the insertion portion, and a contact portion that is in contact with a surface of the circuit board. An insertion hole in which the insertion portion is inserted is provided in each of the electrode lands and in the circuit board, and the circuit board includes a non-electrode portion at a location at which the contact portion is in contact with the circuit board.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: September 11, 2018
    Assignee: ALPS ELECTRIC CO., LTD.
    Inventor: Tatsuo Saito
  • Patent number: 9992900
    Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: June 5, 2018
    Assignee: International Business Machines Corporation
    Inventors: Michael S. Good, Curtis E. Larsen, Kevin M. O'Connell
  • Patent number: 9974202
    Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: May 15, 2018
    Assignee: International Business Machines Corporation
    Inventors: Michael S. Good, Curtis E. Larsen, Kevin M. O'Connell
  • Patent number: 9960860
    Abstract: Provided is a cover accessory for a wireless communication device, including an electromagnetic suppressing pattern layer on a surface adjoining at least one surface on which an electromagnetic wave is irradiated from the wireless communication device, wherein the electromagnetic suppressing pattern layer includes a first dielectric layer and a frequency selective surface (FSS) pattern with a unit cell having electromagnetic surface resistance periodically repeated thereon, and the FSS pattern is provided by etching the first dielectric layer to inject an FSS pattern material or by printing the FSS pattern material on the first dielectric layer.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: May 1, 2018
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Dong-Uk Sim, Sang il Kwak, Jong Hwa Kwon
  • Patent number: 9936618
    Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields that include film and/or foil (e.g., electrically-conductive plastic film, metallized or metal plated film, metal foil, reinforced foil, poly-foil, etc.) covers or lids. Also disclosed are exemplary embodiments of methods relating to making EMI shielding apparatus or assemblies. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: April 3, 2018
    Assignee: Laird Technologies, Inc.
    Inventors: Shelby Ball, Gerald R. English
  • Patent number: 9875911
    Abstract: A semiconductor device has an interposer mounted over a carrier. The interposer includes TSV formed either prior to or after mounting to the carrier. An opening is formed in the interposer. The interposer can have two-level stepped portions with a first vertical conduction path through a first stepped portion and second vertical conduction path through a second stepped portion. A first and second semiconductor die are mounted over the interposer. The second die is disposed within the opening of the interposer. A discrete semiconductor component can be mounted over the interposer. A conductive via can be formed through the second die or encapsulant. An encapsulant is deposited over the first and second die and interposer. A portion of the interposer can be removed to that the encapsulant forms around a side of the semiconductor device. An interconnect structure is formed over the interposer and second die.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: January 23, 2018
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Reza A. Pagaila, Yaojian Lin, Jun Mo Koo, HeeJo Chi
  • Patent number: 9832859
    Abstract: A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: November 28, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Won Lee, Hyun-Tae Jang, Jung Je Bang
  • Patent number: 9772520
    Abstract: The present invention discloses a touch control device, which is addressed to the rimple problem resulting from the full-lamination design of the touch control panel and the liquid crystal display module. The present invention compensates for the elevation drop of the slightly lower control circuit region of the liquid crystal display module in a thickness-increasing way to make the entire liquid crystal display module have an identical elevation. In some embodiments, the present invention increases the thickness of a portion of a ground tape or an optical adhesion layer to compensate for the elevation drop of the liquid crystal display module with respect to the touch control panel. Thereby, the rimple problem is effectively solved.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: September 26, 2017
    Assignees: Interface Optoelectronics (Shenzhen) Co., Ltd., General Interface Solution Limited
    Inventors: Yu-Chen Kuo, Chia-Jung Fan, Kuo-Tung Liao
  • Patent number: 9761924
    Abstract: An antenna can be in a computing device. A connector can be in the computing device and adjacent to the antenna for a wired connection. In one implementation the antenna is connector to a controller to monitor the antenna for wireless signal degradation and compensate for the wireless signal degradation.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: September 12, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Isaac Lagnado, Timothy Neill
  • Patent number: 9756155
    Abstract: A housing wall for a data communications device includes a metallic and electrically conductive main body. A slotted area having a number of slots is provided in a region of the housing wall, in such a way that in a region of the slotted area the housing wall is permeable to magnetic fields for inductively coupling-in signals for wireless communication.
    Type: Grant
    Filed: July 4, 2014
    Date of Patent: September 5, 2017
    Assignees: Seibersdorf Labor GmbH, AIT Austrian Institute of Technology GmbH
    Inventors: Walter Ettel, Manfred Bammer, Gernot Schmidt
  • Patent number: 9723766
    Abstract: An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example, such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shielding specified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if the module components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: August 1, 2017
    Assignee: INTERSIL AMERICAS LLC
    Inventors: Jian Yin, Nikhil Vishwanath Kelkar, Michael Althar
  • Patent number: 9668377
    Abstract: A storage device includes: a first semiconductor device mounted on a substrate; a housing accommodating the substrate, with the substrate fixed on a first fixing unit that is coupled to a first surface of the housing; and a first thermal conductive plate disposed between the first semiconductor device and the housing, with the first thermal conductive plate thermally connected to the housing, wherein the first thermal conductive plate has a thermal conductivity that is higher than that of the substrate. Thus, the storage device may dissipate heat generated by the semiconductor device rapidly to the outside or away from the storage device.
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: May 30, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gwang-Man Lim, Jae-bum Byun
  • Patent number: 9654046
    Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: May 16, 2017
    Assignee: Hitachi, Ltd.
    Inventors: Kenichiro Nakajima, Haruki Hamada, Hideyo Suzuki
  • Patent number: 9620908
    Abstract: Previously available elastomeric EMI gaskets provided for multiport RF connector assemblies have performance limiting drawbacks. Consequently, EM isolation provided by a previously available elastomeric EMI gasket is often inadequate. Various implementations disclosed herein include multiport RF connection arrangements that use a metal gasket arranged within at least a portion of an isolation space provided by a multiport RF connector. In some implementations, a multiport connection arrangement includes a substrate, a multiport RF connector and a fitted metal gasket. The substrate includes a first surface and a first plurality of connection ports. The multiport connector has a body that includes a second surface, a second plurality of connection ports, and includes an electromagnetic isolation boundary that defines an isolation space between at least two of the second plurality of connection ports terminating at the second surface.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: April 11, 2017
    Assignee: Cisco Technology, Inc.
    Inventors: Christopher Eugene Zieman, Denis Gerard Downey
  • Patent number: 9609791
    Abstract: A method for deploying a lightweight, flexible Faraday cage around a device can include the step of directing the conductive fluid flow in a manner that causes a shroud to form over the device. In some embodiments, a flexible material such as canvas can be deployed over the device and the conductive fluid can be sprayed onto the flexible material to form the shroud. In other embodiments, a plurality of nozzles can be placed around the perimeter of the device, and the nozzles can be directed at a predetermined point over the device. The streams can meet at the predetermined point, collide and thereby provide the conductive shroud for the device. The shroud can have a skin depth, which can be chosen according to the desired frequency of electromagnetic radiation to be blocked, typically from one to one hundred millimeters (1-100 mm).
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: March 28, 2017
    Assignee: The United States of America, as Represented by the Secretary of the Navy
    Inventors: Daniel Wing Shum Tam, Lu Xu, Diana Arceo
  • Patent number: 9603269
    Abstract: A modular enclosure configurable to achieve one of a plurality of environmental ratings is disclosed. The modular enclosure includes a base having a substantially open upper portion and a substantially open lower portion. The base further includes at least one top interlocking feature. The modular enclosure further includes a bottom cap including a bottom interlocking feature and a top cap including at least one top cap interlocking feature. The bottom cap is configured to couple to the lower portion of the base using the bottom interlocking feature and the top cap is configured to couple to the upper portion of the base using at least one top interlocking feature. The at least one top interlocking feature configured to engage a corresponding at least one top cap interlocking feature.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: March 21, 2017
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Ahmad Omari, Jeffrey A Kilburn, Jordan Rogers
  • Patent number: 9558668
    Abstract: Systems and methods for improving the reception and delivery of an In-Trail Procedures (ITP) altitude change request. An example system located on board a host aircraft includes a communication component, a display device and a processor unit that is in signal communication with the communication component and the display device. The processor unit presents a user interface on the display device. The user interface includes a plurality of fields for receiving In-Trail Procedures (ITP) altitude change request information. The processor sends the ITP altitude change request information received within the plurality of fields to an Air Traffic Control (ATC) facility via the communication component. An ITP unit having a display receives an altitude selection and presents ITP altitude change request information if the received altitude selection is determined to be valid.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: January 31, 2017
    Assignee: Honeywell International Inc.
    Inventors: Emmanuel Letsu-Dake, Dave Pepitone, Craig Schimmel, Joe Rakolta, John Fugedy
  • Patent number: 9545043
    Abstract: An electromagnetic interference (EMI) shielded device and a method for making an EMI shield device are disclosed. The EMI shielded device may include an electrical circuit and an encapsulation layer disposed on a portion of the electrical circuit. The encapsulant layer having a plurality of particles dispersed therein, wherein the plurality of particles are suitable for shielding electrical circuitry from EMI. The method for making an EMI shielded device may include providing an electrical circuit, and depositing an encapsulant material upon a portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material. An additional method may include depositing a dielectric material upon a portion of the electrical circuit and depositing an encapsulant material upon a portion of the dielectric material and the portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: January 10, 2017
    Assignee: Rockwell Collins, Inc.
    Inventors: Brandon C. Hamilton, Guy N. Smith, Alan P. Boone
  • Patent number: 9535141
    Abstract: A magnetic shielding mechanism for preventing penetration of metallic objects through an aperture, towards the open bore of an magnetic resonance imaging device, where the magnetic field is maximized. The magnetic resonance imaging device produces a fringing magnetic field that decreases with increasing distance (L) from the aperture. The mechanism includes at least one magnet with a magnetic field. The mechanism is affixed at a distance from the aperture of magnetic resonance imaging device.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: January 3, 2017
    Assignee: Aspect Imaging Ltd.
    Inventor: Uri Rapoport
  • Patent number: 9531058
    Abstract: A multiband internal antenna apparatus and methods of tuning and utilizing the same. In one embodiment, the antenna configuration is used within a handheld mobile device (e.g., cellular telephone or smartphone). The device enclosure is fabricated from a conductive material and has two parts: the main portion, housing the device electronics and ground plane, and the antenna cap, which substantially envelops a directly fed radiator structure of the antenna. Electromagnetic coupling of the cap portion to the device feed effects formation of a parasitic antenna radiator in a lower frequency band. The cap portion is separated from the main portion by a narrow gap, extending along circumference of the device, and is grounded at a location selected to cause desired resonance and to widen antenna bandwidth. In one implementation, a second parasitic radiator is disposed proximate the directly feed radiator to further expand antenna frequency bands of operation.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: December 27, 2016
    Assignee: PULSE FINLAND OY
    Inventor: Anne Isohätälä
  • Patent number: 9504175
    Abstract: This invention relates to a solid-state drive housing, a solid-state disk using the same and an assembling process thereof. More particularly, the present invention is capable of preventing the unauthorized disassembly of the consumer. The solid-state drive housing comprising a upper cover and a basement, where the lower casing has a plurality of first hollows, the upper cover has a second base and a plurality of fastening structures one pieced formed therewith, part of the end of the fastening structures are bent and disposed in the corresponding first hollows so as to secure the second member with the first member. By the novelty assembling process provided by the present invention, the user may secures the upper cover and the lower casing without the screw liked fasteners and completes the assembly in only a few quick steps, meanwhile, the present invention is also capable of preventing the unauthorized disassembly of the consumer.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: November 22, 2016
    Assignee: FOURTE INTERNATINAL, LTD.
    Inventor: James Farquhar