Emi Patents (Class 361/818)
  • Patent number: 11894316
    Abstract: A semiconductor package may include a substrate, an application-specific integrated circuit (ASIC) provided on a first portion of a surface of the substrate, a memory device provided on a second portion of the surface of the substrate, and a stiffener plate provided on a third portion of the surface of the substrate. The stiffener plate may be spaced from and may surround the ASIC and the memory device. The semiconductor package may include an electromagnetic interference (EMI) absorber provided on a fourth portion of the surface of the substrate. The EMI absorber may be provided between the stiffener plate and the ASIC and the memory device. The EMI absorber may surround the ASIC and the memory device and may block EMI radiation generated by the ASCI and the memory device.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: February 6, 2024
    Assignee: Juniper Networks, Inc.
    Inventors: Mokshith Tejasvi, Saravanan Govindasamy, Girish Muddenahalli Haleshappa, Raveen Jagadeesan
  • Patent number: 11885955
    Abstract: A circuit board includes a flexible circuit board layer, a rigid circuit board layer, a chip connection portion, and a bending portion. The chip connection portion includes at least part of the flexible circuit board layer and at least part of the rigid circuit board layer overlapping the flexible circuit board layer. The bending portion includes at least part of the flexible circuit board layer and at least part of the rigid circuit board layer overlapping the flexible circuit board layer. The bending portion is connected to the chip connection portion in an invertible manner, after the bending portion is inverted to the rear side of the chip connection portion, a part of the flexible circuit board layer of the bending portion and a part of the flexible circuit board layer of the chip connection portion are arranged face-to-face.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: January 30, 2024
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventor: Yinbo Zhang
  • Patent number: 11869858
    Abstract: Microwave packaging uses signal vias and interposers, such as metal lead frame interposers. For example, the microwave circuit die includes signal vias that electrically connect the top side and the bottom side of the die. Microwave signal circuitry on the die have signal paths that are electrically connected to the top side of the signal vias. The microwave signal circuitry typically may have an operating frequency of 300 MHz or faster. The bottom side of the signal vias are electrically connected to corresponding areas on the top side of the interposer. The bottom side of the die may also include a ground plane, with ground vias that electrically connect the top side of the die to the ground plane.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: January 9, 2024
    Assignee: Marki Microwave, Inc.
    Inventors: Christopher Ferenc Marki, Jeff Luu, Douglas Ryan Jorgesen
  • Patent number: 11864356
    Abstract: An electronic device having an aluminum or copper foil heat dissipator includes a casing, an electronic structure disposed in the casing, and an aluminum or copper foil heat dissipator. A surface of the electronic structure has a heat source element. The aluminum or copper foil heat dissipator is a 3D aluminum or copper foil structure formed by stamping and includes a bottom, a surrounding portion, and a 3D space formed between the bottom and the surrounding portion. The bottom is thermal conductively coupled to the heat source element. A surface of the aluminum or copper foil heat dissipator is partially/entirely thermal conductively coupled to an inner surface of the casing. With the characteristics of aluminum or copper foil that is easy to expand into a 3D shape during processing and could closely fit the inner surface, the heat generated by the heat source element could be dissipated from the 3D aluminum or copper foil with a large contact area, achieving better heat dissipation effect.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: January 2, 2024
    Assignee: ALPHA NETWORKS INC.
    Inventor: Tzu-Chih Lin
  • Patent number: 11849526
    Abstract: A microwave cooking appliance for increasing visibility into the cooking cavity. The microwave cooking appliance may include a door. The door may include a conductive mesh layer. The door may include a frame supporting the conductive mesh layer. The door may include a conductive and/or sealing engagement between the conductive mesh layer and the frame.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: December 19, 2023
    Assignee: MIDEA GROUP CO., LTD.
    Inventors: Daniel J. Trice, Brian Langness, Pierce Woodling
  • Patent number: 11822395
    Abstract: An information handling system EMI shield system couples to a circuit board to enclose an electronic device in a Faraday cage and includes a surface painted with a graphene paint to aid in dissipation of excess thermal energy from the electronic device. The EMI shield system has a frame that couples to the circuit board and interfaces with ground to define a boundary around an electronic device connector and has a shield that couples as a separate piece over the frame to enclose the electronic device. Graphene paint applied to some or all of the shield encourages rejection of excess thermal energy from within shield.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: November 21, 2023
    Assignee: Dell Products L.P.
    Inventors: Geroncio Tan, Changsoo Kim, Suresh Ramasamy, Timothy C. Shaw, Salvador D. Jimenez, III, Pomin Shih, Deeder M. Aurongzeb
  • Patent number: 11775119
    Abstract: Systems, methods, and computer-readable media are disclosed for capacitive touch sensing using system-in-package components. In one embodiment, a device may include a flexible printed circuit, and a first system-in-package disposed on a first side of the flexible printed circuit. The first system-in-package may include a first molding compound, and a first electromagnetic interference shield disposed around an outer surface of the first molding compound. The device may include a first capacitive touch sensor, and a first stiffener disposed on a second side of the flexible printed circuit, where the first stiffener can be formed of a conductive material, and can be electrically coupled to both the flexible printed circuit and the first capacitive touch sensor. The first capacitive touch sensor may be configured to detect a change in capacitance via a change in electric field at the first electromagnetic interference shield.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: October 3, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Fubin Song, Chaoran Yang, Shoubao Wang, Lixin Wu, Cheng Xue
  • Patent number: 11747580
    Abstract: An optical port shielding and fastening apparatus is configured to be installed in the optical module. The optical module includes a housing assembly and an optical component located in the housing assembly. The optical port shielding and fastening apparatus includes a fastener and an electromagnetic wave absorbing piece. The fastener is fastened in the housing assembly. The electromagnetic wave absorbing piece is fastened on a side that is of the fastener and that faces an outside of the housing assembly. A first mounting hole and a second mounting hole are correspondingly provided on the fastener and the electromagnetic wave absorbing piece. The optical component passes through the first mounting hole and the second mounting hole in sequence. This application provides an optical port shielding and fastening apparatus, an optical module, and a communications device, to resolve poor optical port shielding performance of an optical module in the related technology.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: September 5, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Song Yang, Sufei Miao, Zhigang Wang, Liang Xu, Yu Huang
  • Patent number: 11744019
    Abstract: A component includes a main member that includes a first surface that opposes a circuit board, the component being mounted to the circuit board during an assembly procedure, and a plurality of legs that protrude from the first surface, the plurality of legs having ends, wherein the component is mounted on the circuit board with the ends of the plurality of legs fixed to the circuit board, each of the ends of the plurality of legs includes an end surface that opposes the circuit board at time of the assembly procedure, and also includes a bevel that is continuous with the end surface and inclined with respect to the end surface, and an interior angle formed between the end surface and the bevel is larger than or equal to 120° and smaller than or equal to 170°.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: August 29, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shigeyuki Kamio, Makoto Takeoka, Sho Suzuki
  • Patent number: 11723182
    Abstract: A method for manufacturing a shielding film is provided. The method includes providing a band of an amorphous soft magnetic alloy; thermally treating the band at a temperature of 500° C. to 600° C. for 1 minute to 1 hour under an N2- or H2-containing atmosphere and under the Earth's magnetic field, thereby creating a nanocrystalline soft magnetic band with a round hysteresis loop; applying an adhesive layer to at least one side of the band; and wherein the band is first applied to a substrate, then thermally treated, after which an adhesive film is applied to the band and, finally, the band is structured by breaking.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: August 8, 2023
    Assignee: VACUUMSCHMELZE GMBH & CO. KG
    Inventors: Christian Polak, Matthias Schmidt
  • Patent number: 11711898
    Abstract: There is provided a method which includes placing a component on a substrate and extending an alignment member through an opening in the substrate. Once the alignment member is extended through the opening, the component is moved to abut against the alignment member to align the component relative to the substrate. After the component is aligned relative to the substrate, the component is secured to the substrate and the alignment member is retracted through the opening.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: July 25, 2023
    Assignee: GOOGLE LLC
    Inventor: Douglas Raymond Dykaar
  • Patent number: 11678444
    Abstract: Examples described herein relate to a tool-less manner of forming an assembly with a circuit board carrier enclosure that provide leaf springs that provide a force against a circuit board to maintain a level surface of the circuit board. Multiple leaf springs can be used to apply a desired force to the circuit board. A heat sink can be mounted in the enclosure at a distance from the circuit board. The circuit board with carrier can be inserted without tools into an electrical connection for communications with other devices.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: June 13, 2023
    Assignee: Intel Corporation
    Inventors: Olaotan Elenitoba-Johnson, Mark Hemmeyer, Mengqi Liu
  • Patent number: 11666167
    Abstract: A method of allowing access to a receptacle for securing a package includes: sensing an opening and closing of the lid; activating, in response to determining the lid is sufficiently closed, the lock mechanism to transition from the unlocked state to the locked state; scanning an email message in a user's email account to identify a reference or tracking number of a second package; parsing the email message to obtain a delivery code; receiving entry of the delivery code; activating the lock mechanism based on entry of the delivery code to transition from the locked state to the unlocked state; sensing a second opening and closing of the lid; activating the lock mechanism to transition from the unlocked state to the locked state; receiving information corresponding to entry of an access code; activating the lock mechanism to transition from the locked state to the unlocked state.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: June 6, 2023
    Inventors: James B. Dehner, Mark Soderberg
  • Patent number: 11652500
    Abstract: A container for communication devices and communication systems used in cellular networks. There is a need for resilient systems that can withstand extreme weather events. Cellular network infrastructure located close to coastal regions is particularly prone to disruptive failures. A container for an electronic communications device is also provided including: a housing that surrounds at least one mounting plate on which electrical devices and electronic devices are supported. The housing is received around a top edge by a recess in a top plate and around a bottom edge by a recess in a bottom plate. The top and bottom plates are clamped to seal the housing. In some embodiments the housing is connected to a sea borne infrastructure such as buoy. Node frames enable a communications infrastructure that has no single point of failure.
    Type: Grant
    Filed: February 15, 2021
    Date of Patent: May 16, 2023
    Assignee: Resilicom Ltd.
    Inventor: Jonathan Peter David Andrew
  • Patent number: 11563836
    Abstract: According to an embodiment, an electronic device includes a processor, a frame disposed at a rear side of the processor, a cylindrical battery disposed at a rear side of the frame, a composite sheet having at least one heat insulating member surrounding an outer peripheral surface of the cylindrical battery and at least one thermally conductive member surrounding the heat insulating member, and a heat sink disposed at a rear side of the composite sheet.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: January 24, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Kyungui Park, Sunggu Kang, Sanggyu Kim
  • Patent number: 11479014
    Abstract: The invention concerns a cushion or cushioning comprising, a cover an outer covering layer, a middle foam layer and an inner mesh layer. The cushion also includes an electric circuit connected to an electric generator, the circuit being made from conductive ink deposited on a support layer. The circuit extends opposite the complex; a block of elastically compressible padding, the support layer being formed either by the inner layer, or by an additional mesh layer interposed between the inner layer and the block.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: October 25, 2022
    Assignee: TESCA France
    Inventors: Santiago Sanchez, Lluis Puig
  • Patent number: 11452227
    Abstract: A power phase module has at least one first DC terminal pair on a face of the power phase module with respective connection elements for connection to a current bar pair. The power phase module further has a first DC capacitor terminal pair on the face being spaced apart from the first DC terminal pair and connected in parallel with it and having respective connection elements for connection to an intermediate circuit capacitor module associated with the power phase module. The power phase module further has a first AC terminal on another side of the power phase module and a switching device connected with the first AC terminal and the first DC terminal pair for converting a direct voltage. The power phase module further has a cooling device to carry heat out of the power phase module. Further proposed are a converter and a rail vehicle with a converter.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: September 20, 2022
    Assignee: Bombardier Transportation GmbH
    Inventors: Roland Schmid, Stefan Lagger, Reinhard Reichelt, Klaus Schwichtenberg, Adrian Laudan
  • Patent number: 11445645
    Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: September 13, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
  • Patent number: 11412608
    Abstract: A flexible printed circuit board comprises a conducting layer that includes a first signal line, a first ground plane and a second ground plane. A first shielding via extends from a third ground plane to a fourth ground plane and extends through the first ground plane to electrically connect the first ground plane, the third ground plane and the fourth ground plane. A second shielding via extends from the third ground plane to the fourth ground plane. The first ground plane, the second ground plane, the third ground plane, the fourth ground plane, the first shielding via and the second shielding via, together, circumferentially surround the first signal line to minimize electromagnetic interference with the first signal line.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: August 9, 2022
    Assignee: Nortech Systems, Inc.
    Inventor: Scott G. Blanc
  • Patent number: 11328850
    Abstract: A magnetic film includes one or more magnetically conductive layers. Each magnetically conductive layer is cracked to form a plurality of first through-cracks defining a plurality of magnetically conductive segments. The first through-cracks extend along a first direction and form a first regular pattern along an orthogonal second direction at a first pitch P1, such that a Fourier transform of the first regular pattern has a first peak along the second direction at a first spatial frequency corresponding to the first pitch P1. The first through-cracks have an average length L1 along the first direction. L1/P1 is greater than or equal to 5.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: May 10, 2022
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Jinwook Kim, Seong-Woo Woo, Jung Ju Suh, Matthew R.C. Atkinson
  • Patent number: 11316241
    Abstract: An electrical device adapted to operate at a high operating ambient temperature includes an electrical component mounted inside a casing, a transmission/reception antenna and at least one electrical and mechanical connection between the electrical component and the antenna. The electrical and mechanical connection comprises a metal pad positioned under the casing, the antenna being connected to the pad; an electrical connection tab having a first end connected to the electrical component; and fixing means adapted to secure the pad and a second end of the connection tab of the component. The device is applicable to, for example, temperature sensors of the surface guided elastic wave type.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: April 26, 2022
    Assignee: FREC |N| SYS
    Inventors: Sylvain Ballandras, Alexandre Raveski, Florent Bernard, Julien Garcia, Emilie Courjon, Thierry LaRoche
  • Patent number: 11302593
    Abstract: An electronic component package (100) includes a resin layer (40), an electronic component (10), a grounding member (30), and a conductor film (50). The grounding member (30) includes a multilayer body (31) and an outer conductor (32) disposed at an end portion of the multilayer body (31) in a lamination direction. The multilayer body (31) includes at least one resin film (31a) and at least one pattern conductor (31b) laminated one on another, and at least one via conductor (31c) extending in the lamination direction and connected to the outer conductor (32). In the multilayer body (31), at least one of the pattern conductor (31b) has at least part of a circumference connected to a conductor film (50) and electrically connected to the via conductor (31c). Part of an external terminal and part of the outer conductor (32) are exposed from an identical surface of the resin layer (40).
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: April 12, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshitaka Matsukawa, Yoichi Takagi, Akio Katsube, Yoshitaka Echikawa
  • Patent number: 11294128
    Abstract: An optical module includes a housing, at least one optical assembly and at least one sealing member. The housing includes a housing body, a cover and at least one vent hole therein. At least part of each optical assembly is located in the housing body. Each sealing member is located at a respective one of the at least one vent hole. The sealing member has a central axis and includes a first cylinder, a truncated cone, and a second cylinder, a diameter of the first cylinder is greater than a diameter of the second cylinder. Each vent hole is a stepped hole including a portion with a first aperture and a portion with a second aperture, the first aperture is greater than the second aperture. The first cylinder fits the portion with the first aperture, and the second cylinder fits the portion with the second aperture.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: April 5, 2022
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Guangchao Du, Dan Li, Yongzheng Tang, Yunpeng Jiang
  • Patent number: 11277948
    Abstract: A circuit assembly includes a printed circuit board (PCB), and a power management arrangement positioned on and electrically coupled to the PCB. The power management arrangement includes a substrate, a power management circuit chip positioned on and electrically coupled to the substrate, and a shield can positioned over the substrate and providing electromagnetic shielding for the power management chip. The circuit assembly further includes a self-shielded coil positioned on and electrically coupled to the PCB, wherein the self-shielded coil is positioned adjacent to the power management arrangement.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: March 15, 2022
    Assignee: Apple Inc.
    Inventors: Stephan Henzler, Eckehard Plaettner
  • Patent number: 11252851
    Abstract: According to various embodiments of the present invention, an electronic device comprises: a connector comprising a conductive shell and at least one terminal arranged inside the conductive shell; a capacitor; and a circuit board comprising a first board layer at least partially facing the connector, a second board layer formed beneath the first board layer, and at least one third board layer formed between the first board layer and the second board layer.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: February 15, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Heiseong Kwak, Woohee Park, Min Cho, Byoungil Son, Youngjin Kang, Myeonggeun Kim, Ungryeol Lee
  • Patent number: 11233278
    Abstract: Conventional internal combustion engine technology has been around for decades and historically has been the primary power source for virtually all industrial equipment. It relies on carbon-based fuels, is loud, polluting, and the machines it powers are expensive to operate and maintain. A self-contained, rechargeable battery system is provided that possesses improved power than comparable diesel and gas engines and it generates zero emissions, is virtually maintenance free, is quiet, and recharges overnight via a standard electrical outlet. The rechargeable battery power system can be installed in new and used construction equipment and may be used wherever a source of power is required including smart grid application. It can be safely used indoors, in neighborhoods and other locations sensitive to the side effects of internal combustion engines. There is a battery management system that controls sequential shutdown system and a power reserve system to control operation of the battery.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: January 25, 2022
    Assignee: GREEN MACHINE EQUIPMENT, INC.
    Inventor: Noah Podolefsky
  • Patent number: 11227909
    Abstract: According to one embodiment, a display device includes a first substrate, a second substrate opposing the first substrate, a wiring substrate connected to the first substrate, a cover member located on an opposite side to the first substrate so as to interpose the second substrate therebetween and a conductive layer maintained at a predetermined potential, and the first substrate includes an extension portion extending further from the second substrate, the wiring substrate is connected to the extension portion, the cover member includes a first surface opposing the extension portion, and the conductive layer overlaps the extension portion in plan view.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: January 18, 2022
    Assignee: Japan Display Inc.
    Inventor: Hirokazu Seki
  • Patent number: 11217941
    Abstract: An electrical connector set includes a socket and two plugs. The socket includes a connector casing forming two adjacent insertion slots. The two insertion slots are arranged in an arrangement direction and extend parallel to an insertion direction. The connector casing includes a dividing wall, separating the two insertion slots. The dividing wall has an indentation at the insertion openings of the two insertion slots. The two plugs can be inserted into the two insertion slots in the insertion direction respectively. Each plug has two protrusions at two opposite sides thereof in the arrangement direction. The two protrusions are staggered in a vertical direction perpendicular to the arrangement direction and the insertion direction. When the two plugs are inserted into the two insertion slots, the two protrusions between the two plugs are located in the indentation and staggered in the vertical direction.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: January 4, 2022
    Assignee: ALL BEST PRECISION TECHNOLOGY CO., LTD.
    Inventor: Haven Yang
  • Patent number: 11212910
    Abstract: A high frequency signal cross-layer transmission structure in a multi-layer printed circuit board includes a bottom metal layer, a middle metal layer and a top metal layer. The bottom metal layer includes a bottom ground plane and a bottom conductive area. The middle metal layer includes a middle ground plane. The top metal layer includes a top ground plane and a top conductive area. The bottom ground plane defines and surrounds a bottom annular clearance area. The middle ground plane defines and surrounds a middle clearance area. The top ground plane defines and surrounds a top annular clearance area. The bottom annular clearance area surrounds at least one part of the bottom conductive area. The top annular clearance area surrounds at least one part of the top conductive area. A size-shape of the top annular clearance area is different from a size-shape of the middle clearance area.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: December 28, 2021
    Assignee: WANSHIH ELECTRONIC CO., LTD.
    Inventor: Hung-Hsuan Lin
  • Patent number: 11195652
    Abstract: A coil component includes: a body having one surface and the other surface opposing each other in one direction; a coil portion including a coil pattern having at least one turn around the one direction, and embedded in the body; an external electrode disposed on the one surface of the body and connected to the coil portion; a shielding layer disposed on the other surface of the body; and an insulating layer disposed between the body and the shielding layer.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: December 7, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tai Yon Cho, Tae Jun Choi, Jung Young Cho, Chang Hak Choi, Byeong Cheol Moon, Seung Hee Oh
  • Patent number: 11177694
    Abstract: One embodiment provides a non-contact power transmitter device including a sealed housing provided at least partially within a surface, and a transmitter coil within the sealed housing configured to inductively transfer power to a power receiver device. The power transmitter device also includes a transmitter control unit coupled to the transmitter coil, a transceiver configured to communicate with the power receiver device, and an electronic processor coupled to the transmitter control unit and the transceiver. The electronic processor is configured to establish, using the transceiver, communication with the power receiver device, and negotiate power transfer requirements between the power transmitter device and the power receiver device. The electronic processor is also configured to control the transmitter coil unit to transfer power to the power receiver device.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: November 16, 2021
    Assignee: Hubbell Incorporated
    Inventors: John Brower, Matthew Samojeden, Shadi AbuGhazaleh, Robert Simon
  • Patent number: 11177223
    Abstract: Disclosed is an apparatus and methods for making same. The apparatus includes a substrate, a set of electrical contacts disposed on the surface of the substrate, and an electromagnetic interference (EMI) shield pedestal structure, disposed between an outer periphery of the set of electrical contacts and an outer portion of the substrate.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: November 16, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Aniket Patil, Hong Bok We, Brigham Navaja
  • Patent number: 11152331
    Abstract: An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a reduced size.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: October 19, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Lung-Yuan Wang, Feng Kao, Mao-Hua Yeh
  • Patent number: 11143682
    Abstract: A data processing device includes an internal volume that is electromagnetic interference (EMI) isolated. The data processing device further includes an electromagnetic radiation (EMR) suppressing vent that defines one wall of the internal volume. The data processing device further includes a wireless system. The wireless system includes a first portion that is disposed in the internal volume. The first portion receives network data units from EMI emitting devices disposed in the internal volume and a second portion of the wireless system. The second portion is disposed outside of the internal volume and obtains the network data units from the first portion using a wireless connection that utilizes a transmission path that traverses through the EMR suppressing vent.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: October 12, 2021
    Assignee: DELL PRODUCTS L.P.
    Inventors: Steven Embleton, Ben John Sy, Eric Michael Tunks
  • Patent number: 11147195
    Abstract: A Faraday enclosure apparatus and method for manufacturing same are disclosure. The enclosure may comprise one or more sewn seam portions constructed to prevent signal leakage through stitch apertures in the seam. A vestibule section facilitates signal-shielded movement of electronic devices between the ambient environment and the main cavity of the enclosure. A connector filter may be mounted to extend through a wall of the enclosure to manage wired power and signal communications entering and exiting the main cavity of the enclosure. Foldable side walls facilitate the collapsibility of the enclosure for compact transport and storage.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: October 12, 2021
    Assignee: Merakai, LLC
    Inventor: Ryan Judy
  • Patent number: 11059954
    Abstract: A composition for preparing an article including a polyimide or poly(imide-amide) copolymer, the composition including (1) at least one of (i) a polyimide, a polyamic acid, or a poly(imide-amic acid) including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2; and (ii) a poly(imide-amide) copolymer, a poly(amic acid-amide) copolymer, or a poly(imide and amic acid-amide) copolymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a structural unit represented by Chemical Formula 3, and (2) a compound having a maximum absorption wavelength at about 570 nm or more in a visible radiation region: wherein in Chemical Formulae 1 to 3, A, B, D, and E are the same as defined in the detailed description.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: July 13, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: A Ra Jo, Chanjae Ahn, Byunghee Sohn, Kyeong-sik Ju
  • Patent number: 11013131
    Abstract: A shielding cover is provided. The shielding cover is adapted to be disposed on a circuit board and covers at least one electronic element. The shielding cover includes a cover body and a first spacer. The cover body includes a top sheet and a plurality of sidewalls, wherein a plurality of sidewall connecting portions are formed on the sidewalls. The first spacer includes a first spacer body, a first connection portion and a second connection portion, wherein the first connection portion and the second connection portion are formed on two ends of the first spacer body, and the first connection portion and the second connection portion are detachably connected to the sidewall connecting portions.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 18, 2021
    Assignee: WISTRON NEWEB CORP.
    Inventors: Jen-Yung Chang, Tiao-Ming Hsu
  • Patent number: 10993311
    Abstract: A display device is capable of preventing electro-static discharge by attaching a driving integrated circuit cover to a driving integrated circuit and a flexible printed circuit board, the display device including a display panel including a display area and a non-display area, a driving integrated circuit for providing signals, data, and voltages to the display area, a flexible printed circuit board coupled to the driving integrated circuit, and including an open ground portion at one side of the flexible printed circuit board, and an integrated circuit cover portion overlapping the driving integrated circuit and at least a portion of the flexible printed circuit board, and including a cut portion at an area corresponding to the open ground portion.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: April 27, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventor: Cheoloh Lim
  • Patent number: 10959356
    Abstract: A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive core layer of metallic foam having generally parallel opposed surfaces and a face sheet having rigidity properties superior to the rigidity properties of the core layer laminated to a surface of the core layer. Alternatively, a panel for a broadband electromagnetic shield includes a composite fiber-reinforced core having opposed surfaces and a layered electrically-conductive composite cover disposed on a surface of the core. The cover includes a first stratum of porous metal exhibiting pronounced low-frequency electromagnetic shielding properties and a second stratum of electrically-conductive elements exhibiting pronounced high-frequency electromagnetic shielding properties secured in an overlapping electrically-continuous relationship to the first stratum, the first stratum being a metallic lattice, and the electrically-conductive elements being a non-woven veil of electrically-nonconductive metal-coated fibers.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: March 23, 2021
    Assignee: Conductive Composites Company IP, LLC
    Inventors: George Clayton Hansen, Nathan D. Hansen
  • Patent number: 10938161
    Abstract: A device includes a printed circuit board (PCB) and a shield for the PCB. The shield can reduce high frequency electromagnetic frequency (EMF) noise generated by one or more components of the PCB. The PCB includes pads to interface with a corresponding connector. For example, for a dual inline memory module (DIMM) PCB, the PCB includes pads to insert into a DIMM connector. The shield includes a gap in its perimeter that aligns with clips in the corresponding connector. The gaps will correspond to similar features of the PCB that interface with the corresponding connector to allow the shield to attach to the PCB. The shield includes lock fingers to extend from a connector-facing edge of the shield to interface with the corresponding connector to align the shield with the corresponding connector.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: March 2, 2021
    Assignee: Intel Corporation
    Inventors: Jaejin Lee, Jun Liao, Xiang Li, Christopher E. Cox
  • Patent number: 10893637
    Abstract: An electronic device including a shield structure is provided. The electronic device includes a first device including a first magnetic substance, a second device including a second magnetic substance, and a shield structure configured to shield at least part of a magnetic force generated between the first magnetic substance and the second magnetic substance, wherein the shield structure includes a shield member disposed between the first device and the second device and including a property of a magnetic substance, and a connecting member physically connected to at least part of the shield member and including a property of a nonmagnetic substance, wherein at least part of the connecting member is physically connected to a circuit board.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: January 12, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gihoon Lee, Seunggoo Kang, Yonghwa Kim, Hongjun Kim, Wangik Son, Jaehwan Lee, Seungbum Choi, Jaedeok Lim
  • Patent number: 10884209
    Abstract: An optical fiber distribution cabinet comprising a housing having a front opening for accessing an interior of the cabinet, a high density distribution field including a bulkhead having a plurality of faceplates configured to receive a plurality of high density adapters, and a staging area configured to receive a staging plate including a frame having a plurality of pins configured to couple to latchless adapters.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: January 5, 2021
    Assignee: Clearfield, Inc.
    Inventors: John P. Hill, Randy T. VanHorn, Walter E. Power, II
  • Patent number: 10827257
    Abstract: An in-vehicle audio system, including a sounding module mounted inside a vehicle. The sounding module includes a housing having receiving space, and a sounding unit mounted in the receiving space. The sounding unit divides the receiving space into a back coupling cavity and a front sounding cavity. The housing includes a body fixing the sounding unit, and an upper cover plate and a lower cover plate mounted at two sides of the body. The back coupling cavity is formed between the lower cover plate and the body. The front sounding cavity is formed between the upper cover plate and the body. The sounding side of the sounding unit is facing toward the upper cover plate. The side wall of the body is provided with a side sounding outlet communicated with the front sounding cavity. The side sounding outlet is facing toward the interior of the vehicle.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: November 3, 2020
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Shuyuan Sun, Hao Yin, Rongguan Zhou
  • Patent number: 10796157
    Abstract: A processor of an apparatus plays a video on a display device and receives a command one or more times. In response to receiving the command, the processor performs object detection in a hierarchical manner with respect to objects in the video. The processor displays a video image from the video. Upon receiving the command for a first time, the processor detects in the video image a first set of one or more objects at a first hierarchical level and highlights the first set of one or more objects. Upon receiving the command for a second time, the processor detects in the video image a second set of one or more objects at a second hierarchical level below the first hierarchical level and highlights the second set of one or more objects.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: October 6, 2020
    Assignee: MediaTek Inc.
    Inventors: Tsun-Shan Chan, Shao-Nung Chiu
  • Patent number: 10788868
    Abstract: An information handling system housing vents air at a grid of openings formed in a wall with a member extending outward from each intersection of the grid to define air channels. Each member terminates with a polished planar surface that reflects light against a flat underlying material. Variable angles of the polished planar surface relative to the plane of the wall creates a presentation of isolated reflections against the flat background that vary based upon a viewing angle of the housing wall.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: September 29, 2020
    Assignee: Dell Products L.P.
    Inventors: Richard Andrew Crisp, Richard William Guzman
  • Patent number: 10790239
    Abstract: A semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, an encapsulant disposed to cover at least a portion of the semiconductor chip, and a connection member including a redistribution layer. The redistribution layer includes a plurality of first pads, a plurality of second pads surrounding the plurality of first pads, and a plurality of third pads surrounding the plurality of second pads. Each of the plurality of second pads and each of the plurality of third pads have shapes different from a shape of each of the plurality of first pads. Gaps between the plurality of second pads and gaps between the plurality of third pads are staggered with each other.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 29, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Hyun Lim, Chul Kyu Kim, Kyung Moon Jung, Han Kim, Yoon Seok Seo
  • Patent number: 10785899
    Abstract: A door assembly is described. The door assembly includes a door structure that is mounted over an opening of an enclosure. The door structure includes a body that includes a first surface and a second surface opposite to the first surface. The first surface may face an inside of the enclosure when the door structure is closed. The door structure includes a number of finger bracket structures mounted on the first surface. Each one of the finger bracket structures includes a bracket and one or more finger gaskets coupled to the bracket. The finger gaskets of the finger bracket structures may contact enclosure brackets mounted around an edge of the opening of the enclosure when the door structure is closed. A combination of the finger gaskets in contact with enclosure brackets may create an electromagnetic interference (EMI) shield at the edge of the opening of the enclosure.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: September 22, 2020
    Assignee: CAREFUSION 303, INC.
    Inventors: Michael Rahilly, Edward Stephen Ferner, Jr., Brendan John Burgess, Scott Riley, Michael Dugan Joyce, Noe Arroyo, Chris Pedersen
  • Patent number: 10757847
    Abstract: According to an aspect, a display device includes: a light source provided on a back surface side of a display panel; a printed circuit board provided on a back surface side of the light source; a shielding cover that covers the printed circuit board; a screwing member; and a projecting portion. A surface of the printed circuit board facing the shielding cover is provided with a ground pattern electrically coupled to the shielding cover. The ground pattern has a pattern-side through-hole therein, and the pattern-side through-hole penetrates the ground pattern and allows a screw member to pass therethrough. The shielding cover has a cover-side through-hole therein, and the cover-side through-hole overlaps the ground pattern and allows the screw member to pass therethrough. The screwing member is screwed onto the screw member. The projecting portion is provided in an area surrounding the cover-side through-hole and projects toward the ground pattern.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: August 25, 2020
    Assignee: Japan Display Inc.
    Inventors: Masanori Maemuko, Keiichi Kishida
  • Patent number: 10732672
    Abstract: A portable communication device is provided. The portable communication device includes a window having a flat window area and a curved window area extending from the flat window area. In addition, the portable communication device includes a display disposed beneath the window and including a flat display area, a curved display area extending from the flat display area, and a wiring area extending from the curved display area. Additionally, the portable communication device includes a fixed part supporting at least one portion of the flat display area and at least one portion of the curved display area, and a bracket supporting at least one portion of the curved display area and at least one portion of the wiring area.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: August 4, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Woon Geun Kwak, Jung Sik Park, Do Hun Cha
  • Patent number: 10706832
    Abstract: A printed circuit assembly includes a printed circuit board, a processor, an oscillator and a noise reduction device. The printed circuit board has a ground connecting portion. The processor is disposed on the printed circuit board. The oscillator is disposed on the printed circuit board. The noise reduction device includes a wave absorber, a blocking sheet and an electrically conductive member. The wave absorber includes a processor covering part and an oscillator covering part. The oscillator covering part protrudes from one side of the processor covering part. The processor covering part and the oscillator covering part respectively cover the processor and the oscillator. The blocking sheet is stacked on the oscillator covering part to cover the oscillator. One end of the electrically conductive member is connected to the blocking sheet, and another end of the printed circuit board is connected to the ground connecting portion.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: July 7, 2020
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventor: Mu-Chi Chen