Emi Patents (Class 361/818)
  • Patent number: 10292317
    Abstract: An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: May 14, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jung-Sik Park, Seung-Ki Choi, Joon Heo, Hyun-Ju Hong
  • Patent number: 10272646
    Abstract: Provided is an electromagnetic shielding material having improved electromagnetic shielding properties. The present invention relates to an electromagnetic shielding material having a structure in which at least two metal foils are laminated via at least one insulating layer, the electromagnetic shielding material comprising at least one metal oxide layer on at least one boundary surface over which each metal foil is in contact with the insulating layer, the metal oxide layer having a thickness of from 1 to 30 nm.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: April 30, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Koichiro Tanaka
  • Patent number: 10271468
    Abstract: A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The side wall and ceiling portions are forming accommodation space to accommodate electronic component, the ceiling portion has a first surface facing the space and a second surface on the opposite side, the side wall portion has a third surface facing the ceiling portion, a fourth surface on the opposite side, a fifth surface facing the space, and a sixth surface on the opposite side, and the side wall portion is formed such that the sixth surface has a first inclined portion increasing distance to the space from the third toward fourth surfaces and a second inclined portion increasing distance to the space from the fourth toward third surfaces.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: April 23, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Toshiki Furutani, Takema Adachi, Hidetoshi Noguchi, Shota Tachibana
  • Patent number: 10270210
    Abstract: Communications connectors are provided that include a printed circuit board having a plurality of input terminals, a plurality of output terminals, and a plurality of conductive paths that connect each input terminal to a respective output terminal. The conductive paths are arranged as a plurality of differential transmission lines, and a solenoid inductor is implemented along at least one of the conductive paths.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: April 23, 2019
    Assignee: CommScope, Inc. of North Carolina
    Inventor: Richard A. Schumacher
  • Patent number: 10264717
    Abstract: Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: April 16, 2019
    Assignee: INTEL CORPORATION
    Inventor: Robert Sankman
  • Patent number: 10231369
    Abstract: A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves, and a metal layer formed on a portion of the side wall portion such that the metal layer is interposed between the conductive film and the portion of the side wall portion. The side wall and ceiling portions are forming an accommodation space to accommodate an electronic component, and the metal layer is formed on a surface of the side wall portion on the opposite side of a surface of the side wall portion facing the ceiling portion and interposed between the conductive film and the side wall portion.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: March 12, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Toshiki Furutani, Takema Adachi, Hidetoshi Noguchi, Shota Tachibana
  • Patent number: 10178758
    Abstract: A printed wiring board includes a digital circuit, an analog circuit, and a power supply path that is disposed on an insulating layer between the digital circuit and the analog circuit. A plurality of open stub EBG structures are disposed at an end of a bridge section in a power supply plane. The open stub EBG structure is an open stub state whose one end is connected to the power supply path and other end is in an open state.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: January 8, 2019
    Assignees: NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY, KYOCERA CORPORATION
    Inventors: Yoshitaka Toyota, Kengo Iokibe, Yuki Yamashita, Toshiyuki Kaneko, Masanori Naito, Kiyohiko Kaiya, Toshihisa Uehara, Koichi Kondo
  • Patent number: 10147685
    Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: December 4, 2018
    Assignee: Apple Inc.
    Inventors: Phillip R. Sommer, Shankar Pennathur, Meng Chi Lee, Shakti S. Chauhan, Yanfeng Chen
  • Patent number: 10141631
    Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include an antenna. The electronic device may have a housing in which control circuitry and radio-frequency transceiver circuitry is mounted. The transceiver circuitry may be used to transmit and receive radio-frequency signals with the antenna. The housing may have a housing wall with a locally thinned portion aligned with the antenna. The antenna may have a sheet metal layer attached to a plastic cavity with a layer of adhesive. Recesses in a printed circuit may receive prongs formed from a sheet metal layer. The plastic carrier may have cavities separated by ribs. The sheet metal layer may form a planar inverted-F antenna resonating element, a ground plane, a return path between the resonating element and ground plane, and a feed path that extends along one of the ribs and into an opening in the printed circuit.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: November 27, 2018
    Assignee: Apple Inc.
    Inventors: Francesco Merli, Yi Jiang, Boon W. Shiu, Carlo Di Nallo, Javier Gomez Tagle, Mattia Pascolini
  • Patent number: 10098237
    Abstract: Electrical components may be mounted on a printed circuit or other substrate. The electrical components may be covered with a conformal coating containing a wavelength-tuned-light-absorption-enhancement additive. The additive may be a dye or other additive that creates a light absorption peak at a given wavelength. To form openings in the conformal coating in alignment with the electrical components without damaging the components, a laser ablation tool may apply laser light at the given wavelength to the conformal coating. Openings may also be formed by placing tape over the components before the con form at coating is applied. The tape may have a color with a light absorption peak at the given wavelength to facilitate the formation of openings without damaging sensitive components.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: October 9, 2018
    Assignee: Apple Inc.
    Inventors: Ferdinand S. Toting, Arpit K. Akkinepalli, Goran S. Diminich, Xiaoyi Zhou
  • Patent number: 10079458
    Abstract: The invention relates to a camera (2) for a motor vehicle (1) including a housing (5) configured to shield electromagnetic radiation at least in certain areas, including a circuit board (16) disposed in the housing (5), and including an interface device (11) for connecting the camera (2) to the motor vehicle (1), wherein the interface device (11) is electrically connected to the circuit board (16), wherein the interface device (11) includes a coaxial plug (12) with an inner conductor (13) and an outer conductor (14) and the camera (2) has a connecting device (17) for electrically connecting the outer conductor (14) to the housing (5).
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: September 18, 2018
    Assignee: Connaught Electronics Ltd.
    Inventors: Colin Patrick Hehir, Carol Grimes
  • Patent number: 10076069
    Abstract: An electronic circuit module includes a circuit board and a metal cover. The metal cover includes a top plate and attachment legs. Electrode lands are provided on the circuit board, each of the electrode lands being joined to a corresponding one of the attachment legs. Each of the attachment legs includes a fixing portion joined to a corresponding one of the electrode lands, an insertion portion that extends so as to project from the fixing portion, a clearance portion provided near a base of the insertion portion, and a contact portion that is in contact with a surface of the circuit board. An insertion hole in which the insertion portion is inserted is provided in each of the electrode lands and in the circuit board, and the circuit board includes a non-electrode portion at a location at which the contact portion is in contact with the circuit board.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: September 11, 2018
    Assignee: ALPS ELECTRIC CO., LTD.
    Inventor: Tatsuo Saito
  • Patent number: 9992900
    Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: June 5, 2018
    Assignee: International Business Machines Corporation
    Inventors: Michael S. Good, Curtis E. Larsen, Kevin M. O'Connell
  • Patent number: 9974202
    Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: May 15, 2018
    Assignee: International Business Machines Corporation
    Inventors: Michael S. Good, Curtis E. Larsen, Kevin M. O'Connell
  • Patent number: 9960860
    Abstract: Provided is a cover accessory for a wireless communication device, including an electromagnetic suppressing pattern layer on a surface adjoining at least one surface on which an electromagnetic wave is irradiated from the wireless communication device, wherein the electromagnetic suppressing pattern layer includes a first dielectric layer and a frequency selective surface (FSS) pattern with a unit cell having electromagnetic surface resistance periodically repeated thereon, and the FSS pattern is provided by etching the first dielectric layer to inject an FSS pattern material or by printing the FSS pattern material on the first dielectric layer.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: May 1, 2018
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Dong-Uk Sim, Sang il Kwak, Jong Hwa Kwon
  • Patent number: 9936618
    Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields that include film and/or foil (e.g., electrically-conductive plastic film, metallized or metal plated film, metal foil, reinforced foil, poly-foil, etc.) covers or lids. Also disclosed are exemplary embodiments of methods relating to making EMI shielding apparatus or assemblies. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: April 3, 2018
    Assignee: Laird Technologies, Inc.
    Inventors: Shelby Ball, Gerald R. English
  • Patent number: 9875911
    Abstract: A semiconductor device has an interposer mounted over a carrier. The interposer includes TSV formed either prior to or after mounting to the carrier. An opening is formed in the interposer. The interposer can have two-level stepped portions with a first vertical conduction path through a first stepped portion and second vertical conduction path through a second stepped portion. A first and second semiconductor die are mounted over the interposer. The second die is disposed within the opening of the interposer. A discrete semiconductor component can be mounted over the interposer. A conductive via can be formed through the second die or encapsulant. An encapsulant is deposited over the first and second die and interposer. A portion of the interposer can be removed to that the encapsulant forms around a side of the semiconductor device. An interconnect structure is formed over the interposer and second die.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: January 23, 2018
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Reza A. Pagaila, Yaojian Lin, Jun Mo Koo, HeeJo Chi
  • Patent number: 9832859
    Abstract: A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: November 28, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Won Lee, Hyun-Tae Jang, Jung Je Bang
  • Patent number: 9772520
    Abstract: The present invention discloses a touch control device, which is addressed to the rimple problem resulting from the full-lamination design of the touch control panel and the liquid crystal display module. The present invention compensates for the elevation drop of the slightly lower control circuit region of the liquid crystal display module in a thickness-increasing way to make the entire liquid crystal display module have an identical elevation. In some embodiments, the present invention increases the thickness of a portion of a ground tape or an optical adhesion layer to compensate for the elevation drop of the liquid crystal display module with respect to the touch control panel. Thereby, the rimple problem is effectively solved.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: September 26, 2017
    Assignees: Interface Optoelectronics (Shenzhen) Co., Ltd., General Interface Solution Limited
    Inventors: Yu-Chen Kuo, Chia-Jung Fan, Kuo-Tung Liao
  • Patent number: 9761924
    Abstract: An antenna can be in a computing device. A connector can be in the computing device and adjacent to the antenna for a wired connection. In one implementation the antenna is connector to a controller to monitor the antenna for wireless signal degradation and compensate for the wireless signal degradation.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: September 12, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Isaac Lagnado, Timothy Neill
  • Patent number: 9756155
    Abstract: A housing wall for a data communications device includes a metallic and electrically conductive main body. A slotted area having a number of slots is provided in a region of the housing wall, in such a way that in a region of the slotted area the housing wall is permeable to magnetic fields for inductively coupling-in signals for wireless communication.
    Type: Grant
    Filed: July 4, 2014
    Date of Patent: September 5, 2017
    Assignees: Seibersdorf Labor GmbH, AIT Austrian Institute of Technology GmbH
    Inventors: Walter Ettel, Manfred Bammer, Gernot Schmidt
  • Patent number: 9723766
    Abstract: An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example, such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shielding specified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if the module components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: August 1, 2017
    Assignee: INTERSIL AMERICAS LLC
    Inventors: Jian Yin, Nikhil Vishwanath Kelkar, Michael Althar
  • Patent number: 9668377
    Abstract: A storage device includes: a first semiconductor device mounted on a substrate; a housing accommodating the substrate, with the substrate fixed on a first fixing unit that is coupled to a first surface of the housing; and a first thermal conductive plate disposed between the first semiconductor device and the housing, with the first thermal conductive plate thermally connected to the housing, wherein the first thermal conductive plate has a thermal conductivity that is higher than that of the substrate. Thus, the storage device may dissipate heat generated by the semiconductor device rapidly to the outside or away from the storage device.
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: May 30, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gwang-Man Lim, Jae-bum Byun
  • Patent number: 9654046
    Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: May 16, 2017
    Assignee: Hitachi, Ltd.
    Inventors: Kenichiro Nakajima, Haruki Hamada, Hideyo Suzuki
  • Patent number: 9620908
    Abstract: Previously available elastomeric EMI gaskets provided for multiport RF connector assemblies have performance limiting drawbacks. Consequently, EM isolation provided by a previously available elastomeric EMI gasket is often inadequate. Various implementations disclosed herein include multiport RF connection arrangements that use a metal gasket arranged within at least a portion of an isolation space provided by a multiport RF connector. In some implementations, a multiport connection arrangement includes a substrate, a multiport RF connector and a fitted metal gasket. The substrate includes a first surface and a first plurality of connection ports. The multiport connector has a body that includes a second surface, a second plurality of connection ports, and includes an electromagnetic isolation boundary that defines an isolation space between at least two of the second plurality of connection ports terminating at the second surface.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: April 11, 2017
    Assignee: Cisco Technology, Inc.
    Inventors: Christopher Eugene Zieman, Denis Gerard Downey
  • Patent number: 9609791
    Abstract: A method for deploying a lightweight, flexible Faraday cage around a device can include the step of directing the conductive fluid flow in a manner that causes a shroud to form over the device. In some embodiments, a flexible material such as canvas can be deployed over the device and the conductive fluid can be sprayed onto the flexible material to form the shroud. In other embodiments, a plurality of nozzles can be placed around the perimeter of the device, and the nozzles can be directed at a predetermined point over the device. The streams can meet at the predetermined point, collide and thereby provide the conductive shroud for the device. The shroud can have a skin depth, which can be chosen according to the desired frequency of electromagnetic radiation to be blocked, typically from one to one hundred millimeters (1-100 mm).
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: March 28, 2017
    Assignee: The United States of America, as Represented by the Secretary of the Navy
    Inventors: Daniel Wing Shum Tam, Lu Xu, Diana Arceo
  • Patent number: 9603269
    Abstract: A modular enclosure configurable to achieve one of a plurality of environmental ratings is disclosed. The modular enclosure includes a base having a substantially open upper portion and a substantially open lower portion. The base further includes at least one top interlocking feature. The modular enclosure further includes a bottom cap including a bottom interlocking feature and a top cap including at least one top cap interlocking feature. The bottom cap is configured to couple to the lower portion of the base using the bottom interlocking feature and the top cap is configured to couple to the upper portion of the base using at least one top interlocking feature. The at least one top interlocking feature configured to engage a corresponding at least one top cap interlocking feature.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: March 21, 2017
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Ahmad Omari, Jeffrey A Kilburn, Jordan Rogers
  • Patent number: 9558668
    Abstract: Systems and methods for improving the reception and delivery of an In-Trail Procedures (ITP) altitude change request. An example system located on board a host aircraft includes a communication component, a display device and a processor unit that is in signal communication with the communication component and the display device. The processor unit presents a user interface on the display device. The user interface includes a plurality of fields for receiving In-Trail Procedures (ITP) altitude change request information. The processor sends the ITP altitude change request information received within the plurality of fields to an Air Traffic Control (ATC) facility via the communication component. An ITP unit having a display receives an altitude selection and presents ITP altitude change request information if the received altitude selection is determined to be valid.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: January 31, 2017
    Assignee: Honeywell International Inc.
    Inventors: Emmanuel Letsu-Dake, Dave Pepitone, Craig Schimmel, Joe Rakolta, John Fugedy
  • Patent number: 9545043
    Abstract: An electromagnetic interference (EMI) shielded device and a method for making an EMI shield device are disclosed. The EMI shielded device may include an electrical circuit and an encapsulation layer disposed on a portion of the electrical circuit. The encapsulant layer having a plurality of particles dispersed therein, wherein the plurality of particles are suitable for shielding electrical circuitry from EMI. The method for making an EMI shielded device may include providing an electrical circuit, and depositing an encapsulant material upon a portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material. An additional method may include depositing a dielectric material upon a portion of the electrical circuit and depositing an encapsulant material upon a portion of the dielectric material and the portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: January 10, 2017
    Assignee: Rockwell Collins, Inc.
    Inventors: Brandon C. Hamilton, Guy N. Smith, Alan P. Boone
  • Patent number: 9535141
    Abstract: A magnetic shielding mechanism for preventing penetration of metallic objects through an aperture, towards the open bore of an magnetic resonance imaging device, where the magnetic field is maximized. The magnetic resonance imaging device produces a fringing magnetic field that decreases with increasing distance (L) from the aperture. The mechanism includes at least one magnet with a magnetic field. The mechanism is affixed at a distance from the aperture of magnetic resonance imaging device.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: January 3, 2017
    Assignee: Aspect Imaging Ltd.
    Inventor: Uri Rapoport
  • Patent number: 9531058
    Abstract: A multiband internal antenna apparatus and methods of tuning and utilizing the same. In one embodiment, the antenna configuration is used within a handheld mobile device (e.g., cellular telephone or smartphone). The device enclosure is fabricated from a conductive material and has two parts: the main portion, housing the device electronics and ground plane, and the antenna cap, which substantially envelops a directly fed radiator structure of the antenna. Electromagnetic coupling of the cap portion to the device feed effects formation of a parasitic antenna radiator in a lower frequency band. The cap portion is separated from the main portion by a narrow gap, extending along circumference of the device, and is grounded at a location selected to cause desired resonance and to widen antenna bandwidth. In one implementation, a second parasitic radiator is disposed proximate the directly feed radiator to further expand antenna frequency bands of operation.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: December 27, 2016
    Assignee: PULSE FINLAND OY
    Inventor: Anne Isohätälä
  • Patent number: 9504175
    Abstract: This invention relates to a solid-state drive housing, a solid-state disk using the same and an assembling process thereof. More particularly, the present invention is capable of preventing the unauthorized disassembly of the consumer. The solid-state drive housing comprising a upper cover and a basement, where the lower casing has a plurality of first hollows, the upper cover has a second base and a plurality of fastening structures one pieced formed therewith, part of the end of the fastening structures are bent and disposed in the corresponding first hollows so as to secure the second member with the first member. By the novelty assembling process provided by the present invention, the user may secures the upper cover and the lower casing without the screw liked fasteners and completes the assembly in only a few quick steps, meanwhile, the present invention is also capable of preventing the unauthorized disassembly of the consumer.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: November 22, 2016
    Assignee: FOURTE INTERNATINAL, LTD.
    Inventor: James Farquhar
  • Patent number: 9398697
    Abstract: In a method for jetting droplets of viscous medium on a workpiece, a jetting machine iteratively jets the droplets of viscous medium from a jetting nozzle onto a first surface of the workpiece to form a single continuous mass of material at an edge of the first surface of the workpiece. At least a portion of the single continuous mass of material extends past the edge of the first surface and adheres to a second surface of the workpiece.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: July 19, 2016
    Assignee: MYCRONIC AB
    Inventors: Gustaf Martensson, Mattias Allberg, Per Lundell
  • Patent number: 9338930
    Abstract: A shield reinforcing apparatus is provided. The shield reinforcing apparatus includes a printed circuit board, a shield member that covers the printed circuit board, and at least one shield reinforcing part provided in the printed circuit board and configured to contact the shield member to be pressed.
    Type: Grant
    Filed: April 24, 2014
    Date of Patent: May 10, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Won-Jea Jang, Dong-In Ha, Jin-Young Kwak, Gi-Heung Kim, Jung-Yoon Seo, Jae-Joon Yoo, Byoung-Hee Lee, Sung-Jin Choi
  • Patent number: 9282666
    Abstract: Discussed is a display device and a method of manufacturing the same, wherein the display comprises an upper substrate; a lower substrate provided under the upper substrate, wherein the lower substrate extends to be longer than the upper substrate so as to expose a pad region provided at one side of the lower substrate; a panel driver on the pad region of the lower substrate; an exposure prevention member formed on the panel driver, for preventing the panel driver from being exposed to the external; and an upper film formed on the exposure prevention member.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: March 8, 2016
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Chang Soo Jang, Jin Ha Lee, Jong Young Park, Jae Hyung Lee
  • Patent number: 9251950
    Abstract: The purpose of the present invention is to provide: a magnetic element for wireless power transmission, which is capable of feeding power with high power transmission efficiency, while increasing the heat dissipation performance; and a method for manufacturing the magnetic element for wireless power transmission magnetic element for wireless power transmission have configurations that respectively comprise planar coils through which an alternating current passes and magnetic parts which are arranged in parallel in the intervals between the copper wires of the planar coils when viewed in cross section. The magnetic parts comprise an epoxy resin in which iron-based amorphous particles FINEMET® serving as magnetic particles are dispersed, and the magnetic parts are integrated with the planar coils by being bonded to the planar coils in an electrically insulated state by means of the epoxy resin.
    Type: Grant
    Filed: March 6, 2012
    Date of Patent: February 2, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Takezo Hatanaka, Chisato Goto
  • Patent number: 9173331
    Abstract: An EMI shield for an electronic system enclosure is disclosed. The EMI shield may include an electrically conductive panel with a plurality of air ventilation channels, which has an upstream airflow side and a downstream airflow side. The EMI shield may also include a first air ventilation channel with a first cross-sectional shape having a first cross-sectional area and a first depth. The EMI shield may further include a second air ventilation channel with a second cross-sectional shape, having a cross-sectional area greater than the first cross-sectional area, and a second depth larger than the first depth.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: October 27, 2015
    Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
    Inventors: James D. Gerken, David B. Johnson, David G. Lund, Timothy L. McMillan
  • Patent number: 9167713
    Abstract: A box-frame housing for the installation of electronic modules has frame elements and side walls and provides a subdivision into sub-regions, which are limited by dividing walls. The frame elements and the side walls and dividing walls provide at least one recess and/or at least one edge projection. A projection engages in a recess and both are connected to one another by welding.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: October 20, 2015
    Assignee: ROHDE & SCHWARZ GMBH & CO. KG
    Inventors: Hermann Muhr, Andreas Fischl, Wolfgang Kufer, Hans-Dieter Koenig, Helmut Hingrainer
  • Patent number: 9161472
    Abstract: A latching assembly comprises a bracket, and a hook. The hook comprises: a top; a base having a first portion proximate to a first end and a second portion proximate to a second end. The second portion is inclined or sloped towards the top. A front surface extends from the first end to the second end. The front surface is substantially parallel to the surface of the second part at the first end, forming a first portion of the base for engaging the bracket. The front surface is further inclined or sloped toward the surface of the second part at the second end. When the bracket and the hook are engaged and the first part and the second part are separated by force, the bracket slides on the second portion of the base and the inclined or sloped front surface at the second end, thereby disengaging the bracket from the hook.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: October 13, 2015
    Assignee: BlackBerry Limited
    Inventor: Chao Chen
  • Patent number: 9155189
    Abstract: A multi-layer printed circuit board structure, a connector module and a memory storage device are provided. The multi-layer printed circuit board structure includes a first layout layer and a second layout layer. The first layout layer includes a shielding element and at least one pad. The shielding element provides the grounding voltage. The second layout layer is disposed corresponding to the first layout layer and includes at least one wire, and one end of each wire is coupled to one of the pads. A predefined proportion of the wire is covered by a projection plane of the shielding element projected on the second layout layer.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: October 6, 2015
    Assignee: PHISON ELECTRONICS CORP.
    Inventors: Yun-Chieh Chen, Shih-Kung Lin, Ta-Chuan Wei, Hsiang-Hsiung Yu
  • Patent number: 9154019
    Abstract: A hub assembly for an electric machine includes a rotor hub and a machine rotor. Rotation of the machine rotor generates an electromagnetic (EM) field. The hub assembly includes a resolver rotor that encodes an angular position of the machine rotor as a set of resolver signals. An EM field barrier ring between the resolver rotor and the rotor hub adds a magnetic barrier between the machine rotor and the resolver rotor to reduce noise in the resolver signals. The resolver rotor may be bonded to the EM field barrier ring. The EM field barrier ring may have an L-shaped cross section, and may be press-fitted into a pocket of the rotor hub. A vehicle includes a transmission having an input member and an electric machine having a rotor shaft connected to the input member of the transmission. The electric machine includes the hub assembly noted above.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: October 6, 2015
    Assignee: GM Global Technology Operations LLC
    Inventors: Brian Gallert, Khwaja M. Rahman, Matthew D. Laba, Paul F. Turnbull, Brian Schulze
  • Patent number: 9154124
    Abstract: Electromagnetic radiation (“EMR”) dissipating devices. One example embodiment includes an electrical circuit including an EMR source configured to generate an output signal at an operating bit rate. The output signal may include an EMR component. The electrical circuit may also include an EMR dissipating device electrically coupled to the EMR source and configured to have a resonance frequency corresponding to the operating bit rate.
    Type: Grant
    Filed: January 27, 2012
    Date of Patent: October 6, 2015
    Assignee: FINISAR CORPORATION
    Inventor: Yongshan Zhang
  • Patent number: 9123663
    Abstract: A shielded semiconductor device is made by mounting semiconductor die to a first substrate. An encapsulant is formed over the semiconductor die and first substrate. A dicing channel is formed through the encapsulant between the semiconductor die. A hole is drilled in the first substrate along the dicing channel on each side of the semiconductor die. A shielding layer is formed over the encapsulant and semiconductor die. The hole is lined with the shielding layer. The first substrate is singulated to separate the semiconductor die. The first substrate is mounted to a second substrate. A metal pillar is formed in the opening to electrically connect the shielding layer to a ground plane in the second substrate. The metal pillar includes a hook for a mechanically secure connection to the shielding layer. An interconnect structure is formed on the first substrate to electrically connect the semiconductor die to the second substrate.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: September 1, 2015
    Assignee: STATS ChipPAC, Ltd.
    Inventors: OhHan Kim, SeungWon Kim, JoungUn Park
  • Patent number: 9119285
    Abstract: Electronic devices may be provided with conductive structures such as displays and conductive housing walls. Conductive gaskets may be used to form electrical paths between opposing conductive structures in an electronic device. During device assembly, a conductive gasket may be compressed between opposing conductive structures. The conductive gasket may be formed from a conductive gasket wall structure. The conductive gasket wall structure may surround and at least partly enclose an air-filled cavity. Conductive gasket wall structures may be formed from conductive fabric, dielectric sheets coated with metal, or other conductive wall materials. The interior of a conductive gasket may be hollow and completely devoid of supporting structures or may contain internal structures for biasing the conductive gasket wall outwards. Planar gaskets and gaskets with other cross sections may be provided.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: August 25, 2015
    Assignee: Apple Inc.
    Inventors: David P. Tarkington, Michelle R. Goldberg, Nicholas A. Rundle, Peter N. Jeziorek, Jonathan Haylock, Jerzy Guterman
  • Patent number: 9078367
    Abstract: Provided is an electronic controller which enables visual identification of a portion applied with a small amount of a sealing material, which has a high possibility of air leakage from an area in which a joint is to be established. The electronic controller includes: an electronic circuit board; and a casing including a cover (1), a base (4), and a lid sealed with a sealing material (20) applied to surfaces thereof at which the cover (1), the base (4), and the lid are to be joined together. An area in which the cover (1), the base (4), and the lid are to joined together is provided with a space (16) thereto for enabling an application state of the sealing material (20) to be observed with a naked eye.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: July 7, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Masako Tamura, Yasuhiro Takahashi, Toru Kubo, Seiji Kato, Takaaki Tanaka, Hideki Umemoto
  • Patent number: 9072168
    Abstract: An electromagnetic interference blocking device is provided for blocking electromagnetic interference between transmission lines formed on a surface of a circuit board. The electromagnetic interference blocking device includes a body configured to be inserted into a slot formed in the surface of the circuit board between the transmission lines, the body including a bottom portion having a comb shape insertable within the slot.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: June 30, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Jin Jeong, William Lam, Chris Chung
  • Patent number: 9072161
    Abstract: This invention provides an Electro-Static shielding apparatus, an electronic device, and a method for manufacturing said Electro-Static shielding apparatus. Said Electro-Static shielding apparatus comprises: a base layer; a printed circuit block embedded into the base layer; an Electro-Static shielding layer located on an upper surface of the base layer and at least covering sensitive areas, the sensitive areas are those corresponding to the areas required to be shielded on the printed circuit block; and an insulating layer for at least covering the Electro-Static shielding layer. According to the technical solution of this invention, an effective shielding effect can be achieved, moreover, the manufacture cost can be reduced and a good flatness will be reached.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: June 30, 2015
    Assignee: ERICSSON (CHINA) COMMUNICATIONS CO., LTD.
    Inventors: Qingqing He, Yuanna Hu, Jin Jin
  • Patent number: 9070793
    Abstract: The semiconductor device package includes a conformal shield layer applied to the exterior surface of the encapsulant, and an internal fence or separation structure embedded in the encapsulant. The fence separates the package into various compartments, with each compartment containing at least one die. The fence thus suppresses EMI between adjacent packages. The package further includes a ground path connected to the internal fence and conformal shield.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: June 30, 2015
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Kuo-Hsien Liao, Chi-Hong Chan, Jian-Cheng Chen, Chian-Her Ueng, Yu-Hsiang Sun
  • Patent number: 9039301
    Abstract: An optical transceiver that attenuates the EMI radiation leaked therefrom is disclosed. The optical transceiver includes a top cover and the bottom base to form a cavity into which a TOSA, a ROSA, and a circuit are set. At least one of the top cover and the bottom base provides a combed structure in a rear portion of the optical transceiver, where the combed structure has a plurality of T-shaped fins to attenuate the EMI radiation.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: May 26, 2015
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Daisuke Kawase, Kuniyuki Ishii, Hiroyasu Oomori, Hiromi Kurashima
  • Patent number: 9042120
    Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: May 26, 2015
    Assignee: International Business Machines Corporation
    Inventors: Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere, Eric Salvas, Luc Tousignant