Abstract: A method for deploying a lightweight, flexible Faraday cage around a device can include the step of directing the conductive fluid flow in a manner that causes a shroud to form over the device. In some embodiments, a flexible material such as canvas can be deployed over the device and the conductive fluid can be sprayed onto the flexible material to form the shroud. In other embodiments, a plurality of nozzles can be placed around the perimeter of the device, and the nozzles can be directed at a predetermined point over the device. The streams can meet at the predetermined point, collide and thereby provide the conductive shroud for the device. The shroud can have a skin depth, which can be chosen according to the desired frequency of electromagnetic radiation to be blocked, typically from one to one hundred millimeters (1-100 mm).

Abstract: A modular enclosure configurable to achieve one of a plurality of environmental ratings is disclosed. The modular enclosure includes a base having a substantially open upper portion and a substantially open lower portion. The base further includes at least one top interlocking feature. The modular enclosure further includes a bottom cap including a bottom interlocking feature and a top cap including at least one top cap interlocking feature. The bottom cap is configured to couple to the lower portion of the base using the bottom interlocking feature and the top cap is configured to couple to the upper portion of the base using at least one top interlocking feature. The at least one top interlocking feature configured to engage a corresponding at least one top cap interlocking feature.

Abstract: Systems and methods for improving the reception and delivery of an In-Trail Procedures (ITP) altitude change request. An example system located on board a host aircraft includes a communication component, a display device and a processor unit that is in signal communication with the communication component and the display device. The processor unit presents a user interface on the display device. The user interface includes a plurality of fields for receiving In-Trail Procedures (ITP) altitude change request information. The processor sends the ITP altitude change request information received within the plurality of fields to an Air Traffic Control (ATC) facility via the communication component. An ITP unit having a display receives an altitude selection and presents ITP altitude change request information if the received altitude selection is determined to be valid.

Abstract: An electromagnetic interference (EMI) shielded device and a method for making an EMI shield device are disclosed. The EMI shielded device may include an electrical circuit and an encapsulation layer disposed on a portion of the electrical circuit. The encapsulant layer having a plurality of particles dispersed therein, wherein the plurality of particles are suitable for shielding electrical circuitry from EMI. The method for making an EMI shielded device may include providing an electrical circuit, and depositing an encapsulant material upon a portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material. An additional method may include depositing a dielectric material upon a portion of the electrical circuit and depositing an encapsulant material upon a portion of the dielectric material and the portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material.

Abstract: A magnetic shielding mechanism for preventing penetration of metallic objects through an aperture, towards the open bore of an magnetic resonance imaging device, where the magnetic field is maximized. The magnetic resonance imaging device produces a fringing magnetic field that decreases with increasing distance (L) from the aperture. The mechanism includes at least one magnet with a magnetic field. The mechanism is affixed at a distance from the aperture of magnetic resonance imaging device.

Abstract: A multiband internal antenna apparatus and methods of tuning and utilizing the same. In one embodiment, the antenna configuration is used within a handheld mobile device (e.g., cellular telephone or smartphone). The device enclosure is fabricated from a conductive material and has two parts: the main portion, housing the device electronics and ground plane, and the antenna cap, which substantially envelops a directly fed radiator structure of the antenna. Electromagnetic coupling of the cap portion to the device feed effects formation of a parasitic antenna radiator in a lower frequency band. The cap portion is separated from the main portion by a narrow gap, extending along circumference of the device, and is grounded at a location selected to cause desired resonance and to widen antenna bandwidth. In one implementation, a second parasitic radiator is disposed proximate the directly feed radiator to further expand antenna frequency bands of operation.

Abstract: This invention relates to a solid-state drive housing, a solid-state disk using the same and an assembling process thereof. More particularly, the present invention is capable of preventing the unauthorized disassembly of the consumer. The solid-state drive housing comprising a upper cover and a basement, where the lower casing has a plurality of first hollows, the upper cover has a second base and a plurality of fastening structures one pieced formed therewith, part of the end of the fastening structures are bent and disposed in the corresponding first hollows so as to secure the second member with the first member. By the novelty assembling process provided by the present invention, the user may secures the upper cover and the lower casing without the screw liked fasteners and completes the assembly in only a few quick steps, meanwhile, the present invention is also capable of preventing the unauthorized disassembly of the consumer.

Abstract: In a method for jetting droplets of viscous medium on a workpiece, a jetting machine iteratively jets the droplets of viscous medium from a jetting nozzle onto a first surface of the workpiece to form a single continuous mass of material at an edge of the first surface of the workpiece. At least a portion of the single continuous mass of material extends past the edge of the first surface and adheres to a second surface of the workpiece.

Abstract: A shield reinforcing apparatus is provided. The shield reinforcing apparatus includes a printed circuit board, a shield member that covers the printed circuit board, and at least one shield reinforcing part provided in the printed circuit board and configured to contact the shield member to be pressed.

Abstract: Discussed is a display device and a method of manufacturing the same, wherein the display comprises an upper substrate; a lower substrate provided under the upper substrate, wherein the lower substrate extends to be longer than the upper substrate so as to expose a pad region provided at one side of the lower substrate; a panel driver on the pad region of the lower substrate; an exposure prevention member formed on the panel driver, for preventing the panel driver from being exposed to the external; and an upper film formed on the exposure prevention member.

Abstract: The purpose of the present invention is to provide: a magnetic element for wireless power transmission, which is capable of feeding power with high power transmission efficiency, while increasing the heat dissipation performance; and a method for manufacturing the magnetic element for wireless power transmission magnetic element for wireless power transmission have configurations that respectively comprise planar coils through which an alternating current passes and magnetic parts which are arranged in parallel in the intervals between the copper wires of the planar coils when viewed in cross section. The magnetic parts comprise an epoxy resin in which iron-based amorphous particles FINEMET® serving as magnetic particles are dispersed, and the magnetic parts are integrated with the planar coils by being bonded to the planar coils in an electrically insulated state by means of the epoxy resin.

Abstract: An EMI shield for an electronic system enclosure is disclosed. The EMI shield may include an electrically conductive panel with a plurality of air ventilation channels, which has an upstream airflow side and a downstream airflow side. The EMI shield may also include a first air ventilation channel with a first cross-sectional shape having a first cross-sectional area and a first depth. The EMI shield may further include a second air ventilation channel with a second cross-sectional shape, having a cross-sectional area greater than the first cross-sectional area, and a second depth larger than the first depth.

Abstract: A box-frame housing for the installation of electronic modules has frame elements and side walls and provides a subdivision into sub-regions, which are limited by dividing walls. The frame elements and the side walls and dividing walls provide at least one recess and/or at least one edge projection. A projection engages in a recess and both are connected to one another by welding.

Abstract: A latching assembly comprises a bracket, and a hook. The hook comprises: a top; a base having a first portion proximate to a first end and a second portion proximate to a second end. The second portion is inclined or sloped towards the top. A front surface extends from the first end to the second end. The front surface is substantially parallel to the surface of the second part at the first end, forming a first portion of the base for engaging the bracket. The front surface is further inclined or sloped toward the surface of the second part at the second end. When the bracket and the hook are engaged and the first part and the second part are separated by force, the bracket slides on the second portion of the base and the inclined or sloped front surface at the second end, thereby disengaging the bracket from the hook.

Abstract: Electromagnetic radiation (“EMR”) dissipating devices. One example embodiment includes an electrical circuit including an EMR source configured to generate an output signal at an operating bit rate. The output signal may include an EMR component. The electrical circuit may also include an EMR dissipating device electrically coupled to the EMR source and configured to have a resonance frequency corresponding to the operating bit rate.

Abstract: A multi-layer printed circuit board structure, a connector module and a memory storage device are provided. The multi-layer printed circuit board structure includes a first layout layer and a second layout layer. The first layout layer includes a shielding element and at least one pad. The shielding element provides the grounding voltage. The second layout layer is disposed corresponding to the first layout layer and includes at least one wire, and one end of each wire is coupled to one of the pads. A predefined proportion of the wire is covered by a projection plane of the shielding element projected on the second layout layer.

Abstract: A hub assembly for an electric machine includes a rotor hub and a machine rotor. Rotation of the machine rotor generates an electromagnetic (EM) field. The hub assembly includes a resolver rotor that encodes an angular position of the machine rotor as a set of resolver signals. An EM field barrier ring between the resolver rotor and the rotor hub adds a magnetic barrier between the machine rotor and the resolver rotor to reduce noise in the resolver signals. The resolver rotor may be bonded to the EM field barrier ring. The EM field barrier ring may have an L-shaped cross section, and may be press-fitted into a pocket of the rotor hub. A vehicle includes a transmission having an input member and an electric machine having a rotor shaft connected to the input member of the transmission. The electric machine includes the hub assembly noted above.

Abstract: A shielded semiconductor device is made by mounting semiconductor die to a first substrate. An encapsulant is formed over the semiconductor die and first substrate. A dicing channel is formed through the encapsulant between the semiconductor die. A hole is drilled in the first substrate along the dicing channel on each side of the semiconductor die. A shielding layer is formed over the encapsulant and semiconductor die. The hole is lined with the shielding layer. The first substrate is singulated to separate the semiconductor die. The first substrate is mounted to a second substrate. A metal pillar is formed in the opening to electrically connect the shielding layer to a ground plane in the second substrate. The metal pillar includes a hook for a mechanically secure connection to the shielding layer. An interconnect structure is formed on the first substrate to electrically connect the semiconductor die to the second substrate.

Abstract: Electronic devices may be provided with conductive structures such as displays and conductive housing walls. Conductive gaskets may be used to form electrical paths between opposing conductive structures in an electronic device. During device assembly, a conductive gasket may be compressed between opposing conductive structures. The conductive gasket may be formed from a conductive gasket wall structure. The conductive gasket wall structure may surround and at least partly enclose an air-filled cavity. Conductive gasket wall structures may be formed from conductive fabric, dielectric sheets coated with metal, or other conductive wall materials. The interior of a conductive gasket may be hollow and completely devoid of supporting structures or may contain internal structures for biasing the conductive gasket wall outwards. Planar gaskets and gaskets with other cross sections may be provided.

Abstract: Provided is an electronic controller which enables visual identification of a portion applied with a small amount of a sealing material, which has a high possibility of air leakage from an area in which a joint is to be established. The electronic controller includes: an electronic circuit board; and a casing including a cover (1), a base (4), and a lid sealed with a sealing material (20) applied to surfaces thereof at which the cover (1), the base (4), and the lid are to be joined together. An area in which the cover (1), the base (4), and the lid are to joined together is provided with a space (16) thereto for enabling an application state of the sealing material (20) to be observed with a naked eye.

Abstract: This invention provides an Electro-Static shielding apparatus, an electronic device, and a method for manufacturing said Electro-Static shielding apparatus. Said Electro-Static shielding apparatus comprises: a base layer; a printed circuit block embedded into the base layer; an Electro-Static shielding layer located on an upper surface of the base layer and at least covering sensitive areas, the sensitive areas are those corresponding to the areas required to be shielded on the printed circuit block; and an insulating layer for at least covering the Electro-Static shielding layer. According to the technical solution of this invention, an effective shielding effect can be achieved, moreover, the manufacture cost can be reduced and a good flatness will be reached.

Abstract: An electromagnetic interference blocking device is provided for blocking electromagnetic interference between transmission lines formed on a surface of a circuit board. The electromagnetic interference blocking device includes a body configured to be inserted into a slot formed in the surface of the circuit board between the transmission lines, the body including a bottom portion having a comb shape insertable within the slot.

Abstract: The semiconductor device package includes a conformal shield layer applied to the exterior surface of the encapsulant, and an internal fence or separation structure embedded in the encapsulant. The fence separates the package into various compartments, with each compartment containing at least one die. The fence thus suppresses EMI between adjacent packages. The package further includes a ground path connected to the internal fence and conformal shield.

Abstract: An attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.

Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.

Abstract: An assembly for shielding an aircraft from electromagnetic energy may include a window mounting configured to be conductively coupled to an aperture in a fuselage of an aircraft. The window mounting may include a window pane having an electromagnetically-reflective coating for reflecting electromagnetic energy. The window pane may remain electrically isolated from the fuselage prior to the electromagnetic energy exceeding a frequency of approximately 1 GHz. The window mounting may further include a capacitive gasket capacitively coupling the window pane to the fuselage after the frequency of the electromagnetic energy reflected by the window pane exceeds approximately 1 GHz.

Abstract: An optical transceiver that attenuates the EMI radiation leaked therefrom is disclosed. The optical transceiver includes a top cover and the bottom base to form a cavity into which a TOSA, a ROSA, and a circuit are set. At least one of the top cover and the bottom base provides a combed structure in a rear portion of the optical transceiver, where the combed structure has a plurality of T-shaped fins to attenuate the EMI radiation.

Abstract: A mobile wireless communications device may include a housing, an antenna carried by the housing, and a circuit board carried by the housing. The mobile wireless communications device may also include a power amplifier carried by the circuit board, an antenna switch carried by the circuit board and configured to selectively couple the power amplifier to the antenna, a first radio frequency (RF) shield covering the power amplifier and the antenna switch, and a second RF shield within the first RF shield and covering the antenna switch.

Abstract: An electromagnetically shielded enclosure that is portable and lightweight with a double perimeter entry seal. The electromagnetically shielded enclosure can be used for applications such as testing and security and can be scaled from a bench top unit to a large field deployed enclosure. The electromagnetically shielded enclosure has a novel entry seal that eliminates the electromagnetic leakage that is common around the entry areas of such enclosures. The entry seal of the electromagnetically shielded enclosure is made up of a door having a first perimeter closure material and a second perimeter closure material and an enclosure opening having a first perimeter closure and a second perimeter closure where the first perimeter closure material aligns with the first perimeter closure and the second perimeter closure material aligns with the second perimeter closure. This double perimeter entry seal provides for electromagnetic isolation within the electromagnetically shielded enclosure.

Abstract: A low profile, space efficient circuit shield is disclosed. The shield includes top and bottom metal layers disposed on the top of and below an integrated circuit. In one embodiment the shield can include edge plating arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In another embodiment, the shield can include through vias arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In yet another embodiment, passive components can be disposed adjacent to the integrated circuit within the shield.

Abstract: An apparatus may be provided. The apparatus may comprise a core and a covering material disposed on a portion of the core. At least one opening may be disposed in the core. The at least one opening may expose at least one interior surface on the core. The at least one interior surface may be devoid of the covering material.

Abstract: Methods are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.

Abstract: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.

Abstract: Disclosed is a hard-framed housing that provides a cover for electronic hardware components. According to one example, the housing may include a front cover portion that includes at least two spring loaded friction inducing side arms extending from a faceplate portion of the front cover portion at approximately a 90 degree angle. The housing may also include a rear cover portion that includes at least two receiving plates which provide a planar surface for the at least two spring loaded friction inducing side arms to rest when the front cover portion is engaged with the rear cover portion.

Abstract: An apparatus for distributing electromagnetic waves comprising a first plurality of plates coupled to a first rod. A second plurality of plates coupled to a second rod, wherein at least one of either the first or the second plurality of plates is capable of reflecting an electromagnetic wave. A portion of the second rod is situated inside the first rod. A first motor mechanically connected to the first rod, such that the first motor is capable of rotating the first rod. A second motor mechanically connected to the second rod, such that the second motor is capable of rotating the second rod, wherein rotational direction and speed of the second rod, when rotated by the second motor is independent of rotational direction and speed of the first rod, when rotated by the first motor.

Abstract: A field device for automation technology, wherein the field device has a metal housing for accommodating a field device electronics, an RFID chip and a first RFID antenna for wireless communication and/or energy transmission between an RFID reading device arranged outside of the field device. The first RFID antenna is spaced from a neighboring wall of the metal housing, wherein shielding is provided between the first RFID antenna and the neighboring wall of the metal housing. The separation between the first RFID antenna and the wall of the metal housing and the shielding between the first RFID antenna and the neighboring wall of the metal housing are so dimensioned, that the metal housing does not prevent wireless communication and/or energy transmission between the RFID reading device and the field device.

Abstract: An electric propulsion system of an electric vehicle according to one exemplary embodiment of the present disclosure includes a housing having an inside partitioned into a plurality of spaces, power conversion devices disposed in the partitioned spaces of the housing, respectively, a connection bar formed on one surface of the housing to electrically interconnect the power conversion devices and a battery, and adapters configured to connect the connection bar to the power conversion devices, wherein each of the adaptors comprises an inner side and an outer side, wherein the inner side of the adaptor is provided with conductor members formed to be electrically connected to electrodes of the power conversion devices when the electrodes are inserted therein, wherein the outer side of the adaptor is provided with shielding members covering the conductor members for shielding noise generated from the power conversion devices.

Abstract: Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.

Abstract: An optical transceiver that reduces the EMI noise leaked therefrom is disclosed. The optical transceiver provides a metal housing, an optical subassembly, and an electronic circuit. The metal housing includes a first space to install the electronic circuit, and a second space to install the optical subassembly. At least the first space has inner surfaces having a corrugated shape to reduce the resonance of the electromagnetic waves.

Abstract: A mobile terminal includes a terminal body; and a printed circuit board (PCB) assembly mounted to the terminal body. The PCB assembly includes a first PCB, a first electronic device mounted on the first PCB, a second PCB spaced from the first PCB in a first direction, a second electronic device mounted on the second PCB. The first electronic device is disposed to overlap the second electronic device in the first direction. A first shield can may be mounted on the first PCB so as to cover the first electronic device, and configured to shield Electro Magnetic Interference (EMI) between the first electronic device and the outside. A shield block may be disposed at a space between the first and second PCBs, accommodating therein the first and second electronic devices, and shielding EMI between the first electronic device and the outside, and between the second electronic device and the outside.

Abstract: An electronic device including a metal casing and a covering structure is provided. The metal casing has a first opening. The covering structure includes a cover and a conductive component. The cover is assembled to the metal casing and covers the first opening, wherein the cover has at least one hole. The conductive component is fixed to the cover and has at least one contacting portion, wherein the contacting portion passes through the hole and contacts the metal casing, and an electromagnetic wave is adapted to pass through the conductive component to be transmitted to the metal casing.

Abstract: A test carrier 10A comprises: a base board 21A which holds a die 90; and a cover board 31A which is laid over the base board 21A so as to cover the die 90. The test carrier 10A comprises a seal member 24 which is interposed between the base board 21A and the cover board 31A and which surrounds the die 90.

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, a radio-frequency shielding structure may be mounted over the electrical components. The radio-frequency shielding structure may be formed from a printed circuit that includes a ground plane such as a flex circuit or rigid printed circuit board that includes at least one blanket layer of metal. The printed circuit board to which the electrical components are mounted may include a recess in which the electrical components are mounted. Additional components may be mounted to the interior and exterior surface of the radio-frequency shielding structure. The radio-frequency shielding structure may be formed from a flex circuit that has slits at its corners to accommodate folding.

Abstract: An electromagnetic interference shield includes a shell body and a magnetic material layer formed on the shell body. A number of holes are defined in the shell body. A number of through holes are defined in the magnetic material layer aligned with the holes. An electronic device having the electromagnetic interference shield is also provided.

Abstract: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.

Abstract: An electronic module with EMI protection is disclosed. The electronic module comprises a component (1) with contact terminals (2) and conducting lines (4) in a first wiring layer (3). There is also a dielectric (5) between the component (1) and the first wiring layer (3) such that the component (1) is embedded in the dielectric (5). Contact elements (6) provide electrical connection between at least some of the contact terminals (2) and at least some of the conducting lines (4). The electronic module also comprises a second wiring layer (7) inside the dielectric (5). The second wiring layer (7) comprises a conducting pattern (8) that is at least partly located between the component (1) and the first wiring layer (3) and provides EMI protection between the component (1) and the conducting lines (4).

Abstract: A device for screening an electronic module which has electronic components fixed to a printed circuit board and which is connected to a heat sink. The heat sink comprises an electrically conductive material. The printed circuit board has at least one layer composed of electrically conductive material. The heat sink and the printed circuit board serve as screening elements.

Abstract: An electromagnetic interference (EMI) absorber includes an EMI conductive sheet having first and second portions, the first portion absorbing EMI from an EMI absorption target and the second portion for conducting EMI to an EMI discharge target, and an elastic member covered by the first portion.

Abstract: An enclosure includes a sidewall defining an opening through which a connector is to extend and a through hole, a resilient piece, and a sliding member slidably received in the through hole. The resilient piece includes a connecting piece slantingly extending from the sidewall between the opening and the through hole and a contacting piece connected to a distal end of the connecting piece. When the connector extends through the opening, The sliding member is slid toward the resilient piece to force the contacting piece to contact the connector.