Shielding Patents (Class 361/816)
  • Patent number: 9999159
    Abstract: An electronic device includes a circuit board, a heat sink and thermal gel. The circuit board has an electronic component, which is mounted to a first principal surface of the circuit board. The heat sink has an opposing surface, which is opposed to the first principal surface of the circuit board. The thermal gel is filled between the circuit board and the heat sink to cover the electronic component. The circuit board has through-holes. At least a portion of each through-hole is formed in a bonding range, to which the thermal gel is bonded. The through-holes enable visual recognition of the thermal gel through the through-holes.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: June 12, 2018
    Assignee: DENSO CORPORATION
    Inventors: Takahiro Yamanaka, Toshiro Nishimura
  • Patent number: 9780458
    Abstract: Methods and apparatus for a dual polarized thumbtack radiator having enhanced dissipation. In embodiments, a power divider resistor for a balun is coupled directly to ground plane blocks that provide a RF shield. An attachment mechanism, such as a screw secures the thumbtack assembly to an aperture plate and provides thermal and electrical connection.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: October 3, 2017
    Assignee: Raytheon Company
    Inventors: Alberto F. Viscarra, Jayna J. Shah, Robert S. Isom, Christopher R. Koontz
  • Patent number: 9699944
    Abstract: Novel assemblies for use in conjunction with RF shielded enclosures and the like include one or more RF power and signal filters connectibly inserted, attached to, or otherwise made a part of optimized cavities or receptacles formed within an optimized frame of the assembly. The use of optimized cavities or receptacles greatly reduces the number of exterior fasteners needed to connect filters to the assembly or the assembly to an enclosure which, in turn, reduces leakage. The optimized cavities or receptacles may be arranged in a compact manner in order to make optimum use of the available space on an optimized frame of the assembly.
    Type: Grant
    Filed: August 23, 2014
    Date of Patent: July 4, 2017
    Inventors: Marc Cordes, Paul LaHaye
  • Patent number: 9690407
    Abstract: A cover plate used for an electronic device is provided. The cover plate includes a plate and a conductive layer. The plate has two surfaces opposite to each other and a lateral surface connected between the two surfaces. The lateral surface of the plate is framed by the conductive layer which is electrically connected to a ground end of the electronic device. The disclosure further provides an electronic device including the cover plate and a main body. The main body is disposed within the electronic device and electrically connected to the conductive layer.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: June 27, 2017
    Assignee: HTC Corporation
    Inventors: Shih-Po Chien, Yi-Ting Liu, Yu-Jing Liao, I-Cheng Chuang, Chia-Huan Chang
  • Patent number: 9674991
    Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: June 6, 2017
    Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: Jen-Chun Chen, Pai-Sheng Shih
  • Patent number: 9661791
    Abstract: An RF interference suppressor for satellite receivers and more specifically those that employ the MOCA standard is provided. The RF interference suppressor shields the connection point of the center conductor of the F-connector to the PC board from spurious signals emanating from the high speed digital portions of the receiver. In addition, the RF interference suppressor shield includes a tab portion that encompasses the threaded portion of the F-connector and operates to shield the path for RF interference resulting from the gap between the F-connector body and the inner shield wall of the receiver.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: May 23, 2017
    Assignee: THOMSON Licensing DTV
    Inventors: Max Ward Muterspaugh, William John Testin, Darin Bradley Ritter, Mickey Jay Hunt
  • Patent number: 9628678
    Abstract: A camera module according to an exemplary embodiment of the present invention includes a PCB (Printed Circuit Board) mounted with an image sensor, a housing mounted therein with camera parts and configured to protect the image sensor, and one or more sheets of lenses mounted at the housing, wherein the a window of the one or more sheets of lenses is formed with an IR (infrared) filter.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: April 18, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Sun Joo Kim
  • Patent number: 9552847
    Abstract: An electronic device including a metal casing and a covering structure is provided. The metal casing has a first opening. The covering structure includes a cover and a conductive component. The cover is assembled to the metal casing and covers the first opening, wherein the cover has at least one hole. The conductive component is fixed to the cover and has at least one contacting portion, wherein the contacting portion passes through the hole and contacts the metal casing, and an electromagnetic wave is adapted to pass through the conductive component to be transmitted to the metal casing.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: January 24, 2017
    Assignee: Wistron Corporation
    Inventor: Jim-Da Lin
  • Patent number: 9509088
    Abstract: A connection assembly is described. The connection assembly has a substrate having at least two electrically conductive structures, a housing, which is connected to the substrate on the bottom by an adhesive fastening, the housing has a plug receptacle having at least two plug contacts, the plug contacts are connected to at least two contact pads via electrical conductors, and the contact pads connected in an electrically conducting fashion to the electrically conductive structures, the angle between the plug-in direction into the plug receptacle and the bottom of the housing lying between 15° to 90°.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: November 29, 2016
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventor: Alwin Timmermann
  • Patent number: 9489019
    Abstract: An electrostatic discharge (ESD) blocking component is set forth for a computing device. The computing device can include a housing formed of non-conducting material and an overlaying display assembly supported by the housing. The display assembly can further include a plurality of display elements such as thin film transistors (TFTs) interconnected by corresponding metallic traces. The ESD block is used to block static charges associated with an ESD event so that essentially no ESD event related static charge is accumulated on the metallic traces thereby preventing ESD related damage to the plurality of TFTs.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: November 8, 2016
    Assignee: Apple Inc.
    Inventors: Miguel C. Christophy, Silvio Grespan, Richard Hung Minh Dinh, John O. Ceideburg, Kingsuk Brahma
  • Patent number: 9462732
    Abstract: Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In this example, the shielding apparatus generally includes a cover and a frame. The cover includes one or more openings. The frame includes a top surface and sidewalls configured to be disposed generally about one or more electrical components on a substrate. The frame is partly drawn in construction such that the frame includes one or more drawn latching features or portions configured to be engaged within the one or more openings of the cover to thereby releasably attach the cover to the frame.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: October 4, 2016
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventors: Kenneth M. Robinson, Marc Fucci, Paul W. Crotty, Jr.
  • Patent number: 9374933
    Abstract: A shielding device and an electronic device having the same are disclosed. The shielding device is disposed on a circuit board for covering an electronic component. The shielding device comprises a first case and a second case. The first case comprises a first limiting structure and a second limiting structure. The second case is mounted on the circuit board and includes a frame and a first slot. The frame forms an opening. When the first case is connected with the second case, the second limiting structure can move along a first direction to a bottom of the frame and is prevented from moving along a second direction. The first slot corresponds to the first limiting structure to allow the first limiting structure to be inserted into the first slot along the first direction and the first limiting structure is prevented from moving along the second direction.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: June 21, 2016
    Assignee: WISTRON CORPORATION
    Inventors: Hou-Chun Huang, Tzu-Chieh Huang
  • Patent number: 9370130
    Abstract: A casing for containing electronic equipment includes a casing member of the metal plate having an opening; a closing member for closing the opening; a first inclined plate portion provided at an edge of the opening, the first inclined plate portion being inclined relative to a plate portion of the casing member and being provided by bending the casing member; a second inclined plate portion provided at a edge of the closing member, the second inclined plate portion being provided by bending the closing member, and the second inclined plate portion being opposed to the first inclined plate portion when the closing member is mounted to close the opening; and an elastic member having an electroconductivity and provided compressed between the first inclined plate portion and the second inclined plate portion.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: June 14, 2016
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Yoshimasu Yamaguchi
  • Patent number: 9324663
    Abstract: A semiconductor device includes a semiconductor chip having a first main surface, a second main surface opposite to the first main surface, a side surface arranged between the first main surface and the second main surface, and a magnetic storage device, a first magnetic shield overlaying on the first main surface, a second magnetic shield overlaying on the second main surface, and a third magnetic shield overlaying on the side surface. The first and second magnetic shields are mechanically connected via the third magnetic shield.
    Type: Grant
    Filed: May 8, 2014
    Date of Patent: April 26, 2016
    Assignee: Renesas Electronics Corporation
    Inventors: Takahito Watanabe, Shintaro Yamamichi, Yoshitaka Ushiyama
  • Patent number: 9287207
    Abstract: A method for forming conductive vias in a substrate of a semiconductor device component includes forming one or more holes, or apertures or cavities, in the substrate so as to extend only partially through the substrate. A barrier layer, such as an insulative layer, may be formed on surfaces of each hole. Surfaces within each hole may be coated with a seed layer, which facilitates adhesion of conductive material within each hole. Conductive material is introduced into each hole. Introduction of the conductive material may be effected by deposition or plating. Alternatively, conductive material in the form of solder may be introduced into each hole.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: March 15, 2016
    Assignee: Micron Technology, Inc.
    Inventor: Nishant Sinha
  • Patent number: 9277666
    Abstract: According to one embodiment, a display device includes a display, a circuit substrate, connector terminals, a first cover, a second cover, and a fastening member. The circuit substrate includes a first side and a second side adjacent to the first side, and overlaps a second face of the display. The connector terminals are disposed at a vicinity of each of the first side and the second side. The first cover includes a first opening exposing the connector terminals therethrough, and covers the second face. The second cover includes a linking portion and a noncircular through hole, and covers the first opening across the first side and the second side. The linking portion is positioned in between the first side and the second side. The fastening member is inserted through the through hole so as to fix the second cover, the circuit substrate, and the display.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: March 1, 2016
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventor: Keisuke Harita
  • Patent number: 9258928
    Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing. In an exemplary embodiment, a thermally-conductive structure which comprises graphite may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally-conductive structure which comprises graphite.
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: February 9, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Richard F. Hill, Shahi Riaz
  • Patent number: 9250662
    Abstract: A holding frame and a housing assembly for an electronic device. The holding frame is used to hold a motherboard and at least one peripheral device. The holding frame includes a main holder, a linkage member, and a rotational holder. The motherboard is mounted onto the main holder via the linkage member. The peripheral device is mounted onto the rotational holder. The rotational holder is pivoted to the main holder to rotate on the main holder. The installation of the motherboard or the peripheral device will not be interfered by the structure of the holding frame. The housing assembly includes a case body and the holding frame. The holding frame is disposed within the case body. The installation of mounting the motherboard and the peripheral device onto the holding frame can be performed outside the case body without being interfered by the case body.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: February 2, 2016
    Assignees: GIGAZONE INTERNTIONAL CO., LTD., GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventor: Dong Jie Tang
  • Patent number: 9226434
    Abstract: An electrically-conducting assembly for conducting a first housing and a second housing of an electronic device. The first housing is detachably combined with the second housing. The electrically-conducting assembly includes a retaining wall and a lapping part. The retaining wall is perpendicularly provided at the first housing, and a surface of the retaining wall has an electrically-conducting layer. The lapping part is perpendicularly provided at the second housing, and a surface of the lapping part has another electrically-conducting layer. The lapping part and the retaining wall contact with each other when the first housing and the second housing are combined so that the electrically-conducting layer and the another electrically-conducting layer are mutually conductive.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: December 29, 2015
    Assignee: PEGATRON CORPORATION
    Inventors: Su-Tai Huang, Dun-Wei Su
  • Patent number: 9163775
    Abstract: A magnetic stand for a tablet device is disclosed. The magnetic stand is configured to rigidly hold a portion of the tablet device in place and to shield the magnetic field from adversely affecting nearby devices susceptible to strong magnetic fields. The shielding portion of the magnetic stand allows for significant increases in magnetic field strength when compared to similarly configured, unshielded products.
    Type: Grant
    Filed: August 14, 2014
    Date of Patent: October 20, 2015
    Assignee: Apple Inc.
    Inventor: Matthew D. Rohrbach
  • Patent number: 9167733
    Abstract: A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive, fluid-permeable planar core layer defined between generally parallel first and second surfaces and a first face sheet laminated to the first surface of the core layer with rigidity properties superior to the rigidity properties of the core layer. The thickness of the first face sheet is substantially less than the thickness of the core layer. The core layer is made of metallic foam or a metal coating on an electrically-nonconductive, porous, nonmetallic substrate chosen from among nonwoven fibrous matting, paper, and open-cell nonmetallic foam. Also, the core layer may also may be made up of liberated branching metal nanostrands or a plurality of electrically-coupled, electrically-conductive particles, each taking the from of an electrically-nonconductive, nonmetallic substrate with a metal coating.
    Type: Grant
    Filed: April 5, 2013
    Date of Patent: October 20, 2015
    Assignee: Conductive Composites Company
    Inventors: George Clayton Hansen, Nathan D. Hansen
  • Patent number: 9165608
    Abstract: A hard disk securing structure for an industrial computer is disclosed. The industrial computer includes a case, the hard disk securing structure is served to accommodate a hard disk and includes a securing member and a tray. The securing member is installed in the case and includes a buckling unit; the tray is installed in the case and includes a carrying plate and a pair of lateral plates respectively extended from two ends of the carrying plate, an accommodation space used for accommodating the hard disk is defined by the carrying plate and the pair of lateral plates, a locking unit is extended from one end of the carrying plate which is adjacent to the pair of the lateral plates, and the locking unit is mutually locked with the buckling unit. Accordingly, an advantage of easily installing/detaching the hard disk from the case is achieved.
    Type: Grant
    Filed: May 22, 2013
    Date of Patent: October 20, 2015
    Assignee: AIC INC.
    Inventor: Lin-Kuei Tsai
  • Patent number: 9130408
    Abstract: A manufacturing method for a non-contact power receiving/transmitting device that transmits or receives electric power in a non-contact manner and that includes a coil unit and an electromagnetic shield, wherein the coil unit includes a self-resonance coil that is configured to receive or transmit electric power via an electromagnetic field generated through electromagnetic resonance and an adjusting unit that adjusts a resonance frequency of the self-resonance coil, the manufacturing method including: installing the coil unit; arranging the electromagnetic shield around the self-resonance coil except a direction in which electric power is received or transmitted; and adjusting the adjusting unit in accordance with a distance between the coil unit and a surface of the electromagnetic shield vertical to a direction of the electromagnetic field inside the self-resonance coil so that the resonance frequency becomes a predetermined frequency.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: September 8, 2015
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Shinji Ichikawa
  • Patent number: 9119311
    Abstract: An electronic device includes a housing including an opening-portion and an annular-projection provided in the vicinity of the opening-portion from the housing, the annular-projection projecting so as to surround a periphery of the opening-portion, a frame member including a tubular-portion having an outer surface that faces the annular-projection to be fitted with the annular-projection, a top plate exposed from the opening-portion with the tubular-portion fitted with the annular-projection, an extension-portion extending from the outer surface of the tubular-portion, the tubular-portion being expanded toward the annular-projection when a pressing force is applied to a surface of the top plate exposed from the opening-portion with the annular-projection and the tubular-portion fitted with each other, and an O-ring that contacts entire peripheries of the outer surface of the tubular-portion and an inner surface of the annular-projection.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: August 25, 2015
    Assignee: FUJITSU LIMITED
    Inventors: Masaki Yamanaka, Hiroshi Kubo, Takeshi Komuro, Manabu Hongo, Masahiro Fukuhara, Hiroyuki Takita
  • Patent number: 9119314
    Abstract: A flexible printed circuit connector structure and assembly method. A panel with a back side that is parallel to a first plane and a flexible printed circuit backer that has a base and a backing structure. The base is attached to the back side of the panel. The backing structure depends from the base and extends along a second plane that forms an angle with the first plane. A first flexible circuit side of the flexible printed circuit is attached to a first side and an opposite second side of the backing structure. The flexible printed circuit has exposed conductors on a second flexible circuit side that is opposite the first flexible circuit side.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: August 25, 2015
    Assignee: BlackBerry Limited
    Inventors: Rohit Krishna Koppal, Martin Earl Holman, IV, Patrick Yves Mas, Douglas Wayne Moskowitz
  • Patent number: 9101044
    Abstract: A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: August 4, 2015
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Masaya Shimamura, Kenzo Kitazaki, Yutaka Nagai, Hiroshi Nakamura, Tetsuo Saji, Eiji Mugiya
  • Patent number: 9066437
    Abstract: Electronic module, such as a small footprint pluggable (SFP) connector module, including a housing, an electroconductive cage for shielding the module and a latch for the cage to the housing. The latch includes a separate latch member accommodated between the housing and the cage, and at least one resiliently protruding tip. The cage is provided with an opening for receiving the resiliently protruding tip.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: June 23, 2015
    Assignee: FCI
    Inventor: Jeroen De Bruijn
  • Patent number: 9048585
    Abstract: An electrical connector assembly (600) comprising a shielding housing (20) and a socket (40), and a buckle (60) assembled to the shielding housing. The shielding housing has a horizontal passage (22) and an entrance (220) backwardly communicating the passage and forwardly opening for receiving a plug (80). The socket is used for mating with a front end of a plug inserted therein. The buckle has a front latch (62) movable between an open position where a plug inside the shielding housing is permitted to be pulled out and a closed position where the front latch blocks the entrance of the shielding housing so that a plug inside the shielding housing is blocked from being pulled out.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: June 2, 2015
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Yuan-Chieh Lin, Jun-Bin Huang, Gang Paul Chen, Wei Nong Chou, Terrance F. Little, Jie Zheng, An-Jen Yang, Jim Zhao
  • Patent number: 9042096
    Abstract: Disclosed herein are various systems and methods relating to communication devices that include modular transceivers, such as small form pluggable transceivers. According to one embodiment, a communication device may include a chassis defining an interior and an exterior of the communication device. The chassis includes a top, a bottom, and a plurality of sides that together with the top and the bottom form an enclosure. One of the sides may include a first segment disposed in a first plane and a second segment disposed in a second plane. The second segment includes an outwardly extending communication transceiver housing configured to receive a communication transceiver. The communication transceiver may extend through an aperture in the second segment and into interior of the communication device to contact an electrical connector, while a second portion of the communication transceiver in the communication transceiver housing remains on the exterior of the communication device.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: May 26, 2015
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventors: Mark A. Thomas, Dennis Gammel, Shankar V. Achanta
  • Patent number: 9036337
    Abstract: An enclosure is provided for a device comprising one or more electronic assemblies where the enclosure deforms under a shock in one or more selected manners to dissipate the shock energy. The deformation, which is elastic deformation, occurs at selected parts of the enclosure and/or in selected translations and/or rotations where those selections are made by the designer of the enclosure. By being able to define where and how the deformations will occur, the electronic assemblies can be located, mounted and interconnect within the enclosure such that the deformation does not adversely affect the assemblies or device.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: May 19, 2015
    Assignee: PSION INC.
    Inventors: Gregory Ian Smyth, Nicholas John James
  • Patent number: 9029714
    Abstract: An electromagnetically shielded enclosure that is portable and lightweight with a double perimeter entry seal. The electromagnetically shielded enclosure can be used for applications such as testing and security and can be scaled from a bench top unit to a large field deployed enclosure. The electromagnetically shielded enclosure has a novel entry seal that eliminates the electromagnetic leakage that is common around the entry areas of such enclosures. The entry seal of the electromagnetically shielded enclosure is made up of a door having a first perimeter closure material and a second perimeter closure material and an enclosure opening having a first perimeter closure and a second perimeter closure where the first perimeter closure material aligns with the first perimeter closure and the second perimeter closure material aligns with the second perimeter closure. This double perimeter entry seal provides for electromagnetic isolation within the electromagnetically shielded enclosure.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: May 12, 2015
    Assignee: Select Fabricators, Inc.
    Inventors: Gary William Winch, Brian Donald Smith
  • Patent number: 9019700
    Abstract: Methods are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.
    Type: Grant
    Filed: June 26, 2012
    Date of Patent: April 28, 2015
    Assignee: Bloom Energy Corporation
    Inventors: Arne Ballantine, KR Sridhar, Jon Christopher Motta, Peter Light, Carl Cottuli, Jessica Mahler
  • Patent number: 9018542
    Abstract: A shield can of a mobile terminal is provided. The shield can of the mobile terminal includes: at least one shield can installed in a main circuit board of the mobile terminal, and at least one separation wall formed between electronic elements in which electromagnetic interference occurs within the shield can. Hence, shield ability can be improved and simplified manufacturing process of the separation wall can reduce cost.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: April 28, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Oh Hyuck Kwon, Kyung Jin Oh
  • Patent number: 9013889
    Abstract: Provided is an electronic controller which enables visual identification of a portion applied with a small amount of a sealing material, which has a high possibility of air leakage from an area in which a joint is to be established. The electronic controller includes: an electronic circuit board; and a casing including a cover (1), a base (4), and a lid sealed with a sealing material (20) applied to surfaces thereof at which the cover (1), the base (4), and the lid are to be joined together. An area in which the cover (1), the base (4), and the lid are to be joined together is provided with a space (16) thereto for enabling an application state of the sealing material (20) to be observed with a naked eye.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: April 21, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Masako Tamura, Yasuhiro Takahashi, Toru Kubo, Seiji Kato, Takaaki Tanaka, Hideki Umemoto
  • Patent number: 9006581
    Abstract: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: April 14, 2015
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Hiroyuki Yasuda
  • Patent number: 9007776
    Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: April 14, 2015
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Chien-Hung Chen, Chih-Hung Li, Cheng-Te Chen
  • Patent number: 9007780
    Abstract: According to one embodiment, an electronic apparatus includes a first housing, a second housing, a third housing between the first housing and the second housing, the third housing being rotatably connected to the first housing and the second housing, and an antenna in the third housing.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: April 14, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Mitsuhiro Murakami
  • Patent number: 9000306
    Abstract: An electronic apparatus (100) has an electronic device (151), a power supply plane (121) and a power supply plane (122) disposed with a gap (123) therebetween, a connection member (152) that electrically connects the power supply plane (122) and the electronic device (151), a ground plane (141) facing the power supply plane (121) or the power supply plane (122), a connection member (153) that electrically connects the ground plane (141) and the electronic device (151), a plurality of conductor elements (131) that is repeatedly arrayed, and open stubs (111) formed at a location overlapping the gap (123) included in an area surrounded by the conductor elements (131). In addition, at least some of the open stubs (111) face the power supply plane (122) which is not in contact with the open stubs (111).
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: April 7, 2015
    Assignee: NEC Corporation
    Inventors: Hiroshi Toyao, Manabu Kusumoto, Naoki Kobayashi, Noriaki Ando
  • Patent number: 9001528
    Abstract: A shielded electronic component including a wiring board, at least one semiconductor chip mounted on a main surface of the wiring board, a sealant which seals the whole of an upper surface of the wiring board, and a nickel (Ni) plating film formed on an upper surface of the sealant is provided. The Ni plating film is formed on a palladium (Pd) pretreatment layer formed on the upper surface of the sealant with using high-pressure CO2 in a state of protecting a back surface of the wiring board, and is electrically connected with an end portion of a ground wiring layer of the wiring board or a ground (GND) connection through-hole connected with the end portion of the ground wiring layer.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: April 7, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Chiko Yorita, Yoshihide Yamaguchi, Yuji Shirai, Yu Hasegawa
  • Patent number: 8993886
    Abstract: Disclosed is a hard-framed housing that provides a cover for electronic hardware components. According to one example, the housing may include a front cover portion that includes at least two spring loaded friction inducing side arms extending from a faceplate portion of the front cover portion at approximately a 90 degree angle. The housing may also include a rear cover portion that includes at least two receiving plates which provide a planar surface for the at least two spring loaded friction inducing side arms to rest when the front cover portion is engaged with the rear cover portion.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: March 31, 2015
    Assignee: AMX LLC
    Inventor: Phong Le
  • Patent number: 8987872
    Abstract: One feature pertains to a multi-chip package that includes a substrate and an electromagnetic interference (EMI) shield coupled to the substrate. At least one integrated circuit is coupled to a first surface of the substrate. The EMI shield includes a metal casing configured to shield the package from radio frequency radiation, a dielectric layer coupled to at least a portion of an inner surface of the metal casing, and a plurality of signal lines. The signal lines are coupled to the dielectric layer and electrically isolated from the metal casing by the dielectric layer. At least one other integrated circuit is coupled to an inner surface of the EMI shield, and at least a portion of the inner surface of the EMI shield faces the first surface of the substrate. The signal lines are configured to provide electrical signals to the second circuit component.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: March 24, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Kyu-Pyung Hwang, Young Kyu Song, Dong Wook Kim, Changhan Hobie Yun
  • Patent number: 8988896
    Abstract: A field device for automation technology, wherein the field device has a metal housing for accommodating a field device electronics, an RFID chip and a first RFID antenna for wireless communication and/or energy transmission between an RFID reading device arranged outside of the field device. The first RFID antenna is spaced from a neighboring wall of the metal housing, wherein shielding is provided between the first RFID antenna and the neighboring wall of the metal housing. The separation between the first RFID antenna and the wall of the metal housing and the shielding between the first RFID antenna and the neighboring wall of the metal housing are so dimensioned, that the metal housing does not prevent wireless communication and/or energy transmission between the RFID reading device and the field device.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: March 24, 2015
    Assignee: Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG
    Inventors: Detlev Wittmer, Ulrich Kaiser
  • Patent number: 8988885
    Abstract: An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: March 24, 2015
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Tatsuro Sawatari, Masashi Miyazaki, Yoshiki Hamada, Yuichi Sugiyama, Kazuaki Ida
  • Patent number: 8982580
    Abstract: In an electronic device according to the present invention, a shield case is disposed at a surface of a main board so as to cover at least a part of a region of the surface of the main board; and an auxiliary board is disposed at a surface of the shield case. The shield case is comprised of a metallic frame that is fixed at the surface of the main board and extends in such a manner as to surround at least the part of the region, and a metallic cover fitted into the metallic frame to cover at least the part of the region. A projecting piece is formed in the metallic frame of the shield case, and penetrates the metallic cover and projects toward the auxiliary board. An end face of the auxiliary board abuts against the projecting piece, so as to position the auxiliary board.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: March 17, 2015
    Assignee: KYOCERA Corporation
    Inventor: Akito Iwai
  • Patent number: 8983399
    Abstract: Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: March 17, 2015
    Assignee: Sony Corporation
    Inventors: Hirofumi Kawamura, Yasuhiro Okada
  • Publication number: 20150070868
    Abstract: A shielding element is provided for medium voltage switchgears with vacuum interrupters having at least two contacts, which are movable along a switching path between closed and open contact positions. The shielding element is positioned around the contact position region in the vacuum interrupter. To reduce the use of material and to optimize the energy absorbance behavior of the shielding element, the inner surface of the shielding element is applied with a topographic structure which is aligned parallel to the switching path of the contacts. The present disclosure also provides a method of manufacturing such a shielding element.
    Type: Application
    Filed: November 17, 2014
    Publication date: March 12, 2015
    Applicant: ABB Technology AG
    Inventors: Wenkai SHANG, Dietmar GENTSCH
  • Publication number: 20150070236
    Abstract: A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.
    Type: Application
    Filed: April 25, 2014
    Publication date: March 12, 2015
    Applicant: Apple Inc.
    Inventors: Derek J. Walters, Michael Eng, Brian S. Tryon, Connor R. Duke, Kieran Poulain, Nicholas J. Kunst, Shaohai Chen, Shaoqing Xiang, Sung Woo Yoo, Chun Cheng Teo, Paul Nangeroni, Eric Steven Jol
  • Patent number: 8976010
    Abstract: A security system includes an integrated circuit and a transceiver/transponder circuit. The integrated circuit includes an antenna for communicating with the transceiver/transponder circuit. An inhibiting element is associated with the integrated circuit for inhibiting communications with the transceiver/transponder circuit and for securing the data contained in the integrated circuit. The inhibiting element is an electromagnetic inhibiting element. The security system further includes a coupling element associated with the antenna of the integrated circuit for temporarily deactivating the electromagnetic inhibiting element to allow communications between the integrated circuit and the transceiver/transponder circuit.
    Type: Grant
    Filed: February 10, 2013
    Date of Patent: March 10, 2015
    Assignee: STMicroelectronics S.R.L.
    Inventors: Alberto Pagani, Giovanni Girlando
  • Patent number: 8976540
    Abstract: A mobile terminal includes a terminal body; and a printed circuit board (PCB) assembly mounted to the terminal body. The PCB assembly includes a first PCB, a first electronic device mounted on the first PCB, a second PCB spaced from the first PCB in a first direction, a second electronic device mounted on the second PCB. The first electronic device is disposed to overlap the second electronic device in the first direction. A first shield can may be mounted on the first PCB so as to cover the first electronic device, and configured to shield Electro Magnetic Interference (EMI) between the first electronic device and the outside. A shield block may be disposed at a space between the first and second PCBs, accommodating therein the first and second electronic devices, and shielding EMI between the first electronic device and the outside, and between the second electronic device and the outside.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: March 10, 2015
    Assignee: LG Electronics Inc.
    Inventor: Mansung Yoo
  • Patent number: 8976539
    Abstract: An optical transceiver that reduces the EMI noise leaked therefrom is disclosed. The optical transceiver provides a metal housing, an optical subassembly, and an electronic circuit. The metal housing includes a first space to install the electronic circuit, and a second space to install the optical subassembly. At least the first space has inner surfaces having a corrugated shape to reduce the resonance of the electromagnetic waves.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: March 10, 2015
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Phillip J. Edwards, Jignesh H. Shah, Lance R. Thompson, Nhan Huynh