Abstract: A door assembly is described. The door assembly includes a door structure that is mounted over an opening of an enclosure. The door structure includes a body that includes a first surface and a second surface opposite to the first surface. The first surface may face an inside of the enclosure when the door structure is closed. The door structure includes a number of finger bracket structures mounted on the first surface. Each one of the finger bracket structures includes a bracket and one or more finger gaskets coupled to the bracket. The finger gaskets of the finger bracket structures may contact enclosure brackets mounted around an edge of the opening of the enclosure when the door structure is closed. A combination of the finger gaskets in contact with enclosure brackets may create an electromagnetic interference (EMI) shield at the edge of the opening of the enclosure.

Abstract: According to an aspect, a display device includes: a light source provided on a back surface side of a display panel; a printed circuit board provided on a back surface side of the light source; a shielding cover that covers the printed circuit board; a screwing member; and a projecting portion. A surface of the printed circuit board facing the shielding cover is provided with a ground pattern electrically coupled to the shielding cover. The ground pattern has a pattern-side through-hole therein, and the pattern-side through-hole penetrates the ground pattern and allows a screw member to pass therethrough. The shielding cover has a cover-side through-hole therein, and the cover-side through-hole overlaps the ground pattern and allows the screw member to pass therethrough. The screwing member is screwed onto the screw member. The projecting portion is provided in an area surrounding the cover-side through-hole and projects toward the ground pattern.

Abstract: A portable communication device is provided. The portable communication device includes a window having a flat window area and a curved window area extending from the flat window area. In addition, the portable communication device includes a display disposed beneath the window and including a flat display area, a curved display area extending from the flat display area, and a wiring area extending from the curved display area. Additionally, the portable communication device includes a fixed part supporting at least one portion of the flat display area and at least one portion of the curved display area, and a bracket supporting at least one portion of the curved display area and at least one portion of the wiring area.

Abstract: A printed circuit assembly includes a printed circuit board, a processor, an oscillator and a noise reduction device. The printed circuit board has a ground connecting portion. The processor is disposed on the printed circuit board. The oscillator is disposed on the printed circuit board. The noise reduction device includes a wave absorber, a blocking sheet and an electrically conductive member. The wave absorber includes a processor covering part and an oscillator covering part. The oscillator covering part protrudes from one side of the processor covering part. The processor covering part and the oscillator covering part respectively cover the processor and the oscillator. The blocking sheet is stacked on the oscillator covering part to cover the oscillator. One end of the electrically conductive member is connected to the blocking sheet, and another end of the printed circuit board is connected to the ground connecting portion.

Abstract: An optical module includes an electronic assembly and an optical component. The electronic assembly includes a chip component and a circuit board. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers extend to the bottom of the bracket and are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.

Abstract: Electronic devices may be provided having internal components mounted to a structural glass support member. The structural glass support member may have a planar front surface that forms a front surface of the device. The structural glass support member may have bent portions that form sidewall surfaces of the device. Portions of the structural glass support member may form a transparent display cover layer. A rigid or flexible display may be mounted to the structural glass support member. Additional internal device components may be mounted to the display. A thin enclosure for enclosing the internal components in the device may be mounted to the structural glass support member. The thin enclosure may be mounted to the structural glass support member using a peripheral member. The thin enclosure may be free from attachments to internal components or may be adhesively bonded to one or more internal components.

Abstract: Systems, electronic devices, and methods are directed to a self-adjustable heat spreader. A spring system may include one or more spring members and a contact surface adapted to contact a circuit board component. Each spring member may include a thermally conductive material. A thermal spreader plate may be coupled to the one or more spring members. The spring system and the thermal spreader plate may be configured to allow movement, with respect to the thermal spreader plate along multiple axes, of one or more portions of the one or more spring members proximate to the thermal spreader plate when the contact surface is pressed against the circuit board component and the spring system transitions from a first state to a compressed state. The contact surface and the spring system may be configured to transfer heat between the circuit board component and the thermal spreader plate.

Abstract: An electromagnetic interference shield includes a housing having an opening formed by a peripheral flange, and a base heat sink engaged onto the housing, the base heat sink includes an aperture formed the base heat sink and includes one or more folds for increasing a surface size of the base heat sink, a conductive member is engaged with the peripheral flange of the housing, and the conductive member includes a fastener engaged through the opening of the housing and engaged with the aperture of the base heat sink, and one or more heat sinks are further attached onto the base heat sink for increasing a surface size of the heat sinks.

Abstract: A power conversion apparatus capable of cheaply securing safety and achieving watertightness. The power conversion apparatus (100) has: a charging device (14) for charging from an external power source (20) to a cell (30); an inverter (13) for converting the current of the cell (30) from direct current to alternating current and supplying the current to a motor (40); and a junction box (15) for relaying an electrical connection. The inverter (13), the charging device (14), and the junction box (15) are contained in a single housing. Also, the charging device (14) and the junction box (15) are electrically connected, and the junction box (15) and the inverter (13) are electrically connected. Also, the junction box (15) and the inverter (13) are connected by a bus bar (16).

Abstract: A semiconductor device has a plurality of first semiconductor die mounted over an interface layer formed over a temporary carrier. An encapsulant is deposited over the first die and carrier. A flat shielding layer is formed over the encapsulant. A channel is formed through the shielding layer and encapsulant down to the interface layer. A conductive material is deposited in the channel and electrically connected to the shielding layer. The interface layer and carrier are removed. An interconnect structure is formed over conductive material, encapsulant, and first die. The conductive material is electrically connected through the interconnect structure to a ground point. The conductive material is singulated to separate the first die. A second semiconductor die can be mounted over the first die such that the shielding layer covers the second die and the conductive material surrounds the second die or the first and second die.

Abstract: According to one embodiment, a semiconductor device 1 includes an Si substrate 11, an inductor 12 formed in wiring layers disposed above the Si substrate 11, and a shield 13 formed so as to surround the inductor 12, in which the shield 13 includes metals 105 to 109 formed in, among the wiring layers, a layer in which the inductor 12 is formed and a layer above that layer, and a silicide 104 formed between the Si substrate 11 and the wiring layers above the Si substrate 11.

Abstract: Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.

Abstract: An electronic commerce protection system enables a person to safely carry credit, debit, gift cards or the like. The system prevents access to the data on the credit card from physical theft by attaching the system to a persons' boot or other article of clothing. The system prevents electronic or wireless reading of the data by shielding the card from malicious attacks.

Abstract: A device includes a semiconductor structure comprising a top package stacked on a bottom package, wherein the bottom package comprises a plurality of bottom package bumps on a bottom surface of the bottom package, a front side contact metal, a molding compound layer and a backside contact metal, and wherein the front side contact metal is between the plurality of bottom package bumps and the molding compound layer and a metal shielding layer on a top surface, sidewalls of the semiconductor structure and portions of a bottom surface of the bottom package, wherein the metal shielding layer is in direct contact with an edge of at least one of the front side contact metal and the backside contact metal.

Abstract: This disclosure relates to a two-piece shield comprising a fence having integrally formed sidewalls and an upper frame, and a lid. The lid attaches to the fence, which is attached to the circuit board. The fence is a relatively thick, flexible material for supporting the lid. The fence has a recess so that the lid can be recessed into the fence to position the lid closer to the circuit for enhanced heat absorption. The lid could be made of a thicker heat absorbing material than the fence, again to facilitate heat absorption. The lid can be press-fit into the recess of the fence. The fence and lid can have a dovetail configuration to retain the lid in the fence.

Abstract: A unitary radome layer assembly is provided and includes a first nanocomposite formulation and a second nanocomposite formulation. The first and second nanocomposite formulations are provided together in a unitary radome layer with respective distribution gradients.

Abstract: An amplifying device includes first and second substrates. The first substrate has a first mounting surface, and the second substrate has a second mounting surface. The first mounting surface of the first substrate that is opposite the second substrate is provided with: a first ground line; a first signal line configured to transfer an audio signal; and a first amplifier configured to amplify the audio signal. The second mounting surface of the second substrate that is opposite the first substrate is provided with: a second grounded line; a second signal line configured to transfer an audio signal; and a second amplifier configured to amplify the audio signal. The first and second grounded lines correspond to each other in position and shape, and overlap in planar view. The first and second signal lines correspond to each other in position and shape, and overlap in planar view.

Abstract: A utility case for electronic devices that has an exterior case, a shield having a concave face and a convex face, a magnet, a housing, a plate, an insert, an interior case, and an exterior case ring. The exterior case has a lock assembly at an interior face, which has a containing wall inner side. The lock assembly comprises an interior edge, and a containing wall interior face. The housing has a lip defined at the locking face. The insert fits within the magnet, the magnet adheres to the plate, and the lip contains the plate, when the housing is placed onto the lock assembly. The shield is positioned in between the insert and the exterior case, and the housing is positioned in between the interior case and the exterior case when the housing is placed onto the lock assembly.

Abstract: A display device includes a display member configured to display an image; and a window member including a transmission area configured to transmit the image, and a bezel area having a color and arranged adjacent to the transmission area in a plan view, the window member including a base member in which a plurality of air gaps are defined in an area of the base member corresponding to the bezel area; and a color member in the air gaps to define the color of the bezel area.

Abstract: The invention relates to a camera (2) for a motor vehicle (1) including a housing (5) configured to shield electromagnetic radiation at least in certain areas, including a circuit board (16) disposed in the housing (5), and including an interface device (11) for connecting the camera (2) to the motor vehicle (1), wherein the interface device (11) is electrically connected to the circuit board (16), wherein the interface device (11) includes a coaxial plug (12) with an inner conductor (13) and an outer conductor (14) and the camera (2) has a connecting device (17) for electrically connecting the outer conductor (14) to the housing (5).

Abstract: An electronic apparatus includes a conductive member and a printed circuit board, wherein the printed circuit board includes a printed wiring board having a signal wiring formed thereon, a first semiconductor device configured to output a digital signal to the signal wiring, and a second semiconductor device configured to input the digital signal output from the first semiconductor device via the signal wiring, wherein the signal wiring has a signal wiring pattern formed on a surficial layer located opposite the conductive member in the printed wiring board, and wherein the conductive member has an aperture formed therein and located opposite the signal wiring pattern or includes a flat plate portion and a recessed portion recessed in a direction more away from the printed wiring board than the flat plate portion.

Abstract: The present disclosure provides for a semiconductor package device and a method for manufacturing the same. The semiconductor package device includes a substrate, a shielding wall and a package body. The substrate has a top surface. The shielding wall is disposed on the top surface. The shielding wall has a conductive main body and a plurality of protruding portions extending from the conductive main body. The package body encapsulates the shielding wall.

Abstract: According to various embodiments of the present disclosure, disclosed is a wireless power charging apparatus that includes a transparent dielectric body including a cavity for accommodating an electronic device, a transparent conductor provided on a wall of transparent dielectric configured to substantially block wireless power to outside the cavity, and at least one frequency filtering region disposed in the transparent conductor configured to perform at least one of pass a communication frequency of the electronic device and substantially block the wireless power to outside the cavity.

Abstract: Apparatuses, systems and methods associated isolation to avoid interference from wireless signals in a circuit assembly are disclosed herein. In embodiments, a wireless signal isolation assembly may include an outer shield enclosure, the outer shield enclosure to enclose circuitry of a circuit board that is to be isolated from interference, wherein the outer shield enclosure is to attenuate wireless signals. The wireless signal isolation assembly may further include a first inner shield enclosure located within the outer shield enclosure, the first inner shield enclosure to enclose first circuitry, wherein the first inner shield enclosure is to attenuate wireless signals. The wireless signal isolation assembly may further include a second inner shield enclosure located within the outer shield enclosure, the second inner shield enclosure to enclose second circuitry, wherein the second inner shield enclosure is to attenuate wireless signals. Other embodiments may be described and/or claimed.

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

Abstract: An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.

Abstract: Provided is an electromagnetic shielding material having improved electromagnetic shielding properties. The present invention relates to an electromagnetic shielding material having a structure in which at least two metal foils are laminated via at least one insulating layer, the electromagnetic shielding material comprising at least one metal oxide layer on at least one boundary surface over which each metal foil is in contact with the insulating layer, the metal oxide layer having a thickness of from 1 to 30 nm.

Abstract: A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The side wall and ceiling portions are forming accommodation space to accommodate electronic component, the ceiling portion has a first surface facing the space and a second surface on the opposite side, the side wall portion has a third surface facing the ceiling portion, a fourth surface on the opposite side, a fifth surface facing the space, and a sixth surface on the opposite side, and the side wall portion is formed such that the sixth surface has a first inclined portion increasing distance to the space from the third toward fourth surfaces and a second inclined portion increasing distance to the space from the fourth toward third surfaces.

Abstract: Communications connectors are provided that include a printed circuit board having a plurality of input terminals, a plurality of output terminals, and a plurality of conductive paths that connect each input terminal to a respective output terminal. The conductive paths are arranged as a plurality of differential transmission lines, and a solenoid inductor is implemented along at least one of the conductive paths.

Abstract: Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate.

Abstract: A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves, and a metal layer formed on a portion of the side wall portion such that the metal layer is interposed between the conductive film and the portion of the side wall portion. The side wall and ceiling portions are forming an accommodation space to accommodate an electronic component, and the metal layer is formed on a surface of the side wall portion on the opposite side of a surface of the side wall portion facing the ceiling portion and interposed between the conductive film and the side wall portion.

Abstract: A printed wiring board includes a digital circuit, an analog circuit, and a power supply path that is disposed on an insulating layer between the digital circuit and the analog circuit. A plurality of open stub EBG structures are disposed at an end of a bridge section in a power supply plane. The open stub EBG structure is an open stub state whose one end is connected to the power supply path and other end is in an open state.

Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.

Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include an antenna. The electronic device may have a housing in which control circuitry and radio-frequency transceiver circuitry is mounted. The transceiver circuitry may be used to transmit and receive radio-frequency signals with the antenna. The housing may have a housing wall with a locally thinned portion aligned with the antenna. The antenna may have a sheet metal layer attached to a plastic cavity with a layer of adhesive. Recesses in a printed circuit may receive prongs formed from a sheet metal layer. The plastic carrier may have cavities separated by ribs. The sheet metal layer may form a planar inverted-F antenna resonating element, a ground plane, a return path between the resonating element and ground plane, and a feed path that extends along one of the ribs and into an opening in the printed circuit.

Abstract: Electrical components may be mounted on a printed circuit or other substrate. The electrical components may be covered with a conformal coating containing a wavelength-tuned-light-absorption-enhancement additive. The additive may be a dye or other additive that creates a light absorption peak at a given wavelength. To form openings in the conformal coating in alignment with the electrical components without damaging the components, a laser ablation tool may apply laser light at the given wavelength to the conformal coating. Openings may also be formed by placing tape over the components before the con form at coating is applied. The tape may have a color with a light absorption peak at the given wavelength to facilitate the formation of openings without damaging sensitive components.

Abstract: The invention relates to a camera (2) for a motor vehicle (1) including a housing (5) configured to shield electromagnetic radiation at least in certain areas, including a circuit board (16) disposed in the housing (5), and including an interface device (11) for connecting the camera (2) to the motor vehicle (1), wherein the interface device (11) is electrically connected to the circuit board (16), wherein the interface device (11) includes a coaxial plug (12) with an inner conductor (13) and an outer conductor (14) and the camera (2) has a connecting device (17) for electrically connecting the outer conductor (14) to the housing (5).

Abstract: An electronic circuit module includes a circuit board and a metal cover. The metal cover includes a top plate and attachment legs. Electrode lands are provided on the circuit board, each of the electrode lands being joined to a corresponding one of the attachment legs. Each of the attachment legs includes a fixing portion joined to a corresponding one of the electrode lands, an insertion portion that extends so as to project from the fixing portion, a clearance portion provided near a base of the insertion portion, and a contact portion that is in contact with a surface of the circuit board. An insertion hole in which the insertion portion is inserted is provided in each of the electrode lands and in the circuit board, and the circuit board includes a non-electrode portion at a location at which the contact portion is in contact with the circuit board.

Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.

Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.

Abstract: Provided is a cover accessory for a wireless communication device, including an electromagnetic suppressing pattern layer on a surface adjoining at least one surface on which an electromagnetic wave is irradiated from the wireless communication device, wherein the electromagnetic suppressing pattern layer includes a first dielectric layer and a frequency selective surface (FSS) pattern with a unit cell having electromagnetic surface resistance periodically repeated thereon, and the FSS pattern is provided by etching the first dielectric layer to inject an FSS pattern material or by printing the FSS pattern material on the first dielectric layer.

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields that include film and/or foil (e.g., electrically-conductive plastic film, metallized or metal plated film, metal foil, reinforced foil, poly-foil, etc.) covers or lids. Also disclosed are exemplary embodiments of methods relating to making EMI shielding apparatus or assemblies. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.

Abstract: A semiconductor device has an interposer mounted over a carrier. The interposer includes TSV formed either prior to or after mounting to the carrier. An opening is formed in the interposer. The interposer can have two-level stepped portions with a first vertical conduction path through a first stepped portion and second vertical conduction path through a second stepped portion. A first and second semiconductor die are mounted over the interposer. The second die is disposed within the opening of the interposer. A discrete semiconductor component can be mounted over the interposer. A conductive via can be formed through the second die or encapsulant. An encapsulant is deposited over the first and second die and interposer. A portion of the interposer can be removed to that the encapsulant forms around a side of the semiconductor device. An interconnect structure is formed over the interposer and second die.

Abstract: A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.

Abstract: The present invention discloses a touch control device, which is addressed to the rimple problem resulting from the full-lamination design of the touch control panel and the liquid crystal display module. The present invention compensates for the elevation drop of the slightly lower control circuit region of the liquid crystal display module in a thickness-increasing way to make the entire liquid crystal display module have an identical elevation. In some embodiments, the present invention increases the thickness of a portion of a ground tape or an optical adhesion layer to compensate for the elevation drop of the liquid crystal display module with respect to the touch control panel. Thereby, the rimple problem is effectively solved.

Abstract: An antenna can be in a computing device. A connector can be in the computing device and adjacent to the antenna for a wired connection. In one implementation the antenna is connector to a controller to monitor the antenna for wireless signal degradation and compensate for the wireless signal degradation.

Abstract: A housing wall for a data communications device includes a metallic and electrically conductive main body. A slotted area having a number of slots is provided in a region of the housing wall, in such a way that in a region of the slotted area the housing wall is permeable to magnetic fields for inductively coupling-in signals for wireless communication.

Abstract: An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example, such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shielding specified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if the module components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components.

Abstract: A storage device includes: a first semiconductor device mounted on a substrate; a housing accommodating the substrate, with the substrate fixed on a first fixing unit that is coupled to a first surface of the housing; and a first thermal conductive plate disposed between the first semiconductor device and the housing, with the first thermal conductive plate thermally connected to the housing, wherein the first thermal conductive plate has a thermal conductivity that is higher than that of the substrate. Thus, the storage device may dissipate heat generated by the semiconductor device rapidly to the outside or away from the storage device.

Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.

Abstract: Previously available elastomeric EMI gaskets provided for multiport RF connector assemblies have performance limiting drawbacks. Consequently, EM isolation provided by a previously available elastomeric EMI gasket is often inadequate. Various implementations disclosed herein include multiport RF connection arrangements that use a metal gasket arranged within at least a portion of an isolation space provided by a multiport RF connector. In some implementations, a multiport connection arrangement includes a substrate, a multiport RF connector and a fitted metal gasket. The substrate includes a first surface and a first plurality of connection ports. The multiport connector has a body that includes a second surface, a second plurality of connection ports, and includes an electromagnetic isolation boundary that defines an isolation space between at least two of the second plurality of connection ports terminating at the second surface.