Abstract: An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane. The electronic components are mounted on the first plane and electrically connected with the circuit board. The molding layers cover the electronic components and the first plane. The trench appears between two adjacent molding layers. The grounding pad is positioned at the bottom of the trench. The first conductive layer covers the sidewall of the trench and the grounding pad. The grounding pad electrically connected with the first conductive layer. The insulating filler is positioned in the trench. The second conductive layer covers the molding layers and the insulating filler, and electrically connects with the first conductive layer.

Abstract: A method for producing an EMI/RF absorbing material including dispersing metallic flakes in a resin. The method also includes providing a first coat of the resin containing dispersed metallic flake to form a first layer. The method further includes providing a second coat of the resin containing dispersed metallic flake to the first layer to form a second layer. At least one of the first or second layers has a substantially uniform distribution of metallic flake throughout a thickness of the first or second layers.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.

Abstract: Provided is portable terminal. The portable terminal includes: a front housing forming a frame of the portable terminal: a rear housing disposed beneath the front housing, a shield can interposed between the front housing and the rear housing for shielding electromagnetic waves and coupled with the front housing; wherein the rear housing is coupled with the shield can, and wherein the front housing and the rear housing are coupled through the shield can.

Abstract: To suppress the noise caused by an inductor leaks to the outside, and also to be configured such that magnetic field intensity change reaches the inductor. An inductor surrounds an internal circuit in a planar view and also is coupled electrically to the internal circuit. The upper side of the inductor is covered by an upper shield part and the lower side of the inductor is covered by a lower shield part. The upper shield part is formed by the use of a multilayered wiring layer. The upper shield part has plural first openings. The first opening overlaps the inductor in the planar view.

Abstract: An electronic device may include subassemblies such as battery structures, electromagnetic shielding structures, and button structures. The electromagnetic shielding structures may include a conductive fence and a flexible shielding layer that covers electronic components. The electromagnetic shielding structure may be formed with a recess that receives a protruding portion of a battery. The recess may be formed from a multi-level shielding structure that includes rigid and flexible portions. The button structures may be mounted to a ledge that is formed as an integral part of a device housing. An electronic device battery may be enclosed in a protective battery sleeve. The battery sleeve may include a center portion that encloses the battery and peripheral portions that are folded and coupled to the center portion by adhesive material interposed between opposing surfaces of the folded peripheral portions and the center portion of the battery sleeve.

Abstract: A cage assembly is provided for receiving a pluggable module. The cage assembly includes a cage having a front end, a mounting side, and an internal compartment. The front end is open to the internal compartment of the cage. The internal compartment is configured to receive the pluggable module therein through the front end. A heat sink is mounted to the mounting side of the cage. The heat sink has a module side that is configured to thermally communicate with the pluggable module. An electromagnetic interference (EMI) gasket extends along at least a portion of an interface between the mounting side of the cage and the module side of the heat sink.

Abstract: A computer including an undiced semiconductor wafer having a multitude of microchips. The computer also including an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. The multitude of microchips on the wafer are configured to allow the microchip to function independently and including independent communication capabilities.

Abstract: An electromagnetic shield is provided, for example for a printed circuit board. A shield lid fits onto a base structure having at least two, more typically four, opposing sidewalls. The lid includes a top portion and a lip extending downward from the top portion to cap the base structure. The lid includes at least one deformation inhibiting feature extending downward from the top portion, for placement near or against an interior portion of a sidewall, for example against an edge of a folded-over sidewall. The deformation inhibiting feature may include one or more half-dimples stamped into the lid. In response to an external force, the deformation inhibiting feature presses against its adjacent sidewall in order to brace the shield lid. This inhibits the base structure from deforming the lip due to outward pressure of a sidewall onto a portion of the lip, located opposite the deformation inhibiting feature.

Abstract: In the spectrometer, heavy loads are arranged centrally inside a case having a height smaller than a width, and having a depth smaller than the height. The heavy loads include a vacuum chamber, a vacuum pump which evacuates the vacuum chamber, a sample introduction unit which introduces a sample to be measured and evaporates the sample, an ionization unit which ionizes the evaporated sample and provides it to the vacuum chamber, and an ion detection unit which is connected to the vacuum chamber. Circuit board storage units which store a plurality of circuit boards with a predetermined space therebetween are formed on both sides along a width direction of the case.

Abstract: An electronic device includes a housing, a circuit board accommodated in the housing, a number of I/O ports mounted on the circuit board, and a port shield secured to the housing. The housing defines a number of openings, and the I/O ports are exposed from the plurality of openings. The port shield defines a number of receiving spaces to receive and position the I/O ports, thereby preventing the plurality of I/O ports from becoming loose and detaching from the circuit board.

Abstract: An electromagnetic shielding structure includes a first shielding material disposed at a first location with respect to at least one radiation source and a second shielding material attached with the first shielding material by fastening means. The second shielding material is disposed at a second location with respect to the at least one electromagnetic radiation source so as to define a predetermined gap between the first shielding material and the second shielding material. The first shielding material shields at least part of first frequency electromagnetic radiations generated from the at least one electromagnetic radiation source and penetrating through the second shielding material and the predetermined gap. The second shielding material shields at least part of second frequency electromagnetic radiations generated from the at least one electromagnetic radiation source.

Abstract: Provided is an electrical actuator for a variable geometry turbocharger. A lever is disposed outside a housing and is connected to a bottom end of an output shaft of a deceleration device, a ground structure is installed between a printed circuit board and a housing protrusion so as to prevent an electromagnetic interference (EMI) from occurring, a part of insertion parts is inserted in and is fixed to the printed circuit board, an end of an elastic part is mounted on the housing protrusion so that the ground structure can be maintained by an elastic force.

Abstract: The invention relates to an electromagnetic limiter. The limiter comprises a multilayer having an electrically conducting pattern superposed on a dielectric structure. Further, the multilayer is provided with at least one electromagnetically transparent aperture that is electromagnetically transparent for plane wave incidence. In addition, the limiter comprises a non-controlled non-linear structure interconnecting opposite edges of the electromagnetically transparent aperture.

Abstract: A protective, anti-tamper coating and methods of coating creation and application are provided. The coating may include an elastomeric layer to allow for strippability/removal. The coating may also include a “smart layer” for tamper detection, imaging prevention, and tamper prevention or underlying device de-activation/alteration upon tamper detection. The coating may also include one or more ground planes around the smart layer and one or more frangible layers designed to interrupt or alter smart layer function in the event of a tamper attempt.

Abstract: A shielding device for shielding an electronic component (102) to be mounted on a printed circuit board (132). The shielding device exhibiting a top shielding (110) and a bottom shielding (120; 140; 160; 180) separable from each other, wherein the top shielding includes an electrically and/or magnetically conductive material and the bottom shielding is multilayered. The bottom shielding exhibits at least one electrically and/or magnetically conductive metal sheet layer (122; 162; 164) embedded between at least two insulating layers (126; 124) and includes at least two electrically conductive transmission lines (172; 174; 176) for conducting electric current to the electronic component. The top shielding and the conductive metal sheet layer are electrically isolated from the electronic component. The bottom shielding integrated into the printed circuit board and the top shielding and the bottom shielding designed such when they are attached to each other, they completely envelope the electronic component.

Abstract: A shielding can assembly connected to a circuit board for eliminating electromagnetic interference is disclosed, wherein the circuit board has at least one hole. The shielding can assembly has a cover and an assemble element. The cover is situated at a side of the circuit board; the assemble element with at least one assemble portion is situated at another side of the circuit board. The at least one assemble portion passes through the at least one hole to connect with the cover such that the circuit board is situated between the cover and the assemble element.

Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

Abstract: The present disclosure is directed to a camera module that includes at least a semiconducting die, an image-sensing circuit, a lens, a lens aperture, and a coating that adheres to an exterior surface of the camera module. The coating is opaque to light and prevents light from accessing the camera other than through the lens aperture. The opaque coating is applied as a fluid and is cured. In one embodiment, a mask material is selectively applied to exterior surfaces of the semiconducting die, electrical interconnect layers, glass layers, the lens body, or the lens aperture. After applying the opaque coating, the selectively applied mask material is removed. Methods of selectively applying a mask material include applying a conformable and peelably releasable dope-like material, placing an array of joined, selectively shaped rigid masks over an array of assemblies, and applying a conformable mask material that is heat-expandable.

Abstract: A shield is adapted be locked to a casing. The casing is formed with an inserting space, an opening, and two engaging holes. The shield includes a shell body, two engaging members and two biasing springs. The shell body is inserted into the inserting space, and shields the opening. The shell body includes a base plate formed with a slot, and two side plates each formed with a through-hole. Each of the engaging members is slidable relative to the base plate, and includes an engaging portion extending through the corresponding through-hole and releasably engageable with the corresponding engaging hole. Each of the biasing springs biases the corresponding engaging member to move in a direction toward the corresponding through-hole.

Abstract: A resonance type non-contact power feeding system 10 includes, as a power reception side (secondary side) apparatus, a load device 50, a secondary coil 40, a secondary resonance coil 45, and a rectifier 160. A battery 52 is provided inside a load housing 54 of the load device 50. In addition, like a power transmission side metal shield 80 on the power transmission side, the resonance type non-contact power feeding system 10 includes a power reception side metal shield 90 that covers the secondary coil 40 and the secondary resonance coil 45, and a rectifier shield 170 that covers the rectifier 160. Moreover, a power reception side large metal shield 130 that covers the outside of the power reception side metal shield 90 and the rectifier shield 170 is provided.

Abstract: An electromagnetic interference (EMI) shield apparatus includes a shell, a hub, a shield member, a partition plate, a resilient member, and a cover. The hub is rotatably mounted within the shell. The shield member is wrapped around the hub. The partition plate is fastened to and rotatable together with the hub. The cover covered on an open end of the shell. The resilient member is connected between the partition plate and the cover to drive the hub to rotate to reel the shield member. The shield member is made of EMI shield material.

Abstract: A heatsink may include an area in thermal contact with a semiconductor microchip surface and a first trench of a first depth. The first trench may be substantially continuous around the area. A first substance, such as ferrite, may be positioned in the first trench to attenuate electromagnetic interference. A second trench having a second depth may be formed around and further from the area than the first trench. A second substance may be positioned in the second trench.

Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

Abstract: A high frequency module having a surface acoustic wave device and a method of manufacturing the same are provided. The high frequency module includes a substrate provided with a top ground pattern at both upper ends and provided with, inside thereof, an inner ground pattern electrically connected to the top ground pattern through a via electrode; at least one SAW device installed on the substrate; a molding layer formed on the substrate to cover the SAW device and provided with a groove at both ends to expose the top ground pattern; and an electromagnetic wave shield layer formed to cover a surface of the molding layer including an inside of the groove.

Abstract: A magnetic field shielding raised floor panel having a plurality of grain-oriented electrical steel (GOES) sections. The orientation of each GOES section is parallel to a top surface of the section. The plurality of GOES sections can include sidewall and lip portions. The plurality of GOES sections can be perforated to permit air flow through the GOES section. Openings in adjacent perforated GOES sections do not substantially overlap.

Abstract: Provided is an electronic component box for a vehicle. The electronic component box for a vehicle, the electronic component box including a housing formed of a plastic material and manufactured through plastic injection molding, the housing having an opened top surface, a top cover formed of a plastic material and manufactured through the plastic injection molding, the top cover covering the opened top surface of the housing, a base cover seated on a bottom surface of the housing, an electronic component set seated on a top surface of the base cover, and an inner cover accommodated within the housing, the inner cover covering the electronic component set to shield an electromagnetic wave emitted from the electronic component set.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Abstract: An electromagnetically-countered display system includes at least one wave source and at least one counter unit. The wave source irradiates harmful electromagnetic waves and the counter unit emits counter electromagnetic waves for countering the harmful waves therewith. Examples of the various counter units for the electromagnetically-countered display system and various mechanisms to counter the harmful waves with the counter units include by matching configurations of the counter units with those of the wave sources, and by matching wavefronts of the harmful waves with those the counter waves. Various methods of countering the harmful waves with such counter waves include by source and/or wave matching. Various methods of providing the counter units for emitting the counter waves defining desired wave characteristics. Various electric and magnetic shields can be employed either alone or in conjunction with the counter units for minimizing irradiation of the harmful waves from the display system.

Abstract: A package structure comprises a substrate, a plurality of electronic components configured and structured on the substrate, a plurality of metal resilient units electrically connected to the substrate, and an encapsulation body encapsulating the plurality of electronic components and the plurality of resilient units together with the substrate. Part of each of the plurality of metal resilient units away from the substrate is exposed out of an exterior surface of the encapsulation body.

Abstract: A radio frequency shield which reversibly transects an electromagnetic frequency enclosure is provided. The shield includes first a number of panels attached to a first surface of the enclosure. The panels are adapted to move through a first arc relative to the first surface. Shield also includes a first panel from the number of panels having a first leading edge capable of transecting the first arc. The shield further includes a second number of panels attached to a second surface of the enclosure. The second set of panels is adapted to move through an arc relative to the second surface of the enclosure. Also a second panel from said second set of panels has a second leading edge capable of transecting the second arc so as to oppose the first leading edge. Finally, the shield includes a means for reversibly attaching the first leading edge to the second leading edge while simultaneously establishing electrical communication between the first and second plurality of panels.

Abstract: The present teachings provide a system and a method for manufacturing a mobile platform, such as an aircraft. The method can include coupling at least one required system for operation of the mobile platform to the mobile platform, and certifying the mobile platform according to predefined standards. The method can also include coupling at least one optional system to the mobile platform without re-certifying the mobile platform.

Abstract: An external EMI diverting structure to electrically shield an electronic device from EMI is presented. The electronic device is physically isolated from the case ground which interrupts the EMI or lightning fault path. This shield provides a return path to ground for the EMI away from the electronic device and replaces conventional EMI filter capacitors, which are not connected to case ground. The external EMI diverter comprises a first conducting enclosure enclosing the electrical circuit and is electrically coupled to the electric circuit and a second conducting enclosure enclosing the first conducting enclosure and being electrically isolated from the first conducting enclosure and the electric circuit. The diverter is physically and electrically connected to the case ground at an attachment point.

Abstract: An electronic device may include wireless circuitry such as infrared sources that control external equipment such as televisions and set-top boxes. An infrared source may be mounted within an electronic device housing in a visually inconspicuous location such as in a connector port. A button may be provided with transparent structures that allow infrared light to pass through the button. A removable accessory port may be provided with an infrared transmitter accessory that allows an electronic device to serve as a remote control device. Portions of an electronic device housing may be provided with thin housing walls or holes that are too small to be noticeable to the naked eye to serve as windows for infrared light. An audio port may serve as an infrared light window. Gasket structures, bezel structures, and the edges of displays and other planar glass members may be used in transmitting infrared light.

Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a component in the housing, an antenna in the housing, and an electrically conductive wall in the housing. The component is configured to emit electromagnetic noise. The wall is between the component and the antenna.

Abstract: A printed circuit board includes a first signal layer, a first ground layer, a second signal layer, a power layer, a second ground layer, and a third signal layer. The first signal layer includes an analog audio input/output (I/O) port and an audio chip. The audio chip includes a main body, a first group of signal pins connected to the analog audio I/O port, and a second group of signal pins connected to a control chip. The first ground layer, the power layer, and the second ground layer are each divided into an audio part and a digital part. The three audio parts act as a reference plane for traces between the analog audio I/O port and the audio chip, the three digital parts act as reference planes for traces between the control chip and the audio chip.

Abstract: A releasing apparatus for a subscriber identity module (SIM) card includes a bracket, a rack received in the bracket for manipulating the SIM card, a pivot pole pivotably received in the bracket, and a movable member pivotably attached to the bracket. The movable member includes a biasing portion and an engaging portion formed from opposite ends of the movable member. A tab and a biasing protrusion are formed from opposite ends of the pivoting member. The engaging portion is operated to rotate the movable member. The biasing portion presses the tab of the pivot pole to rotate the pivot pole. The biasing protrusion biases the rack and SIM card away from the bracket.

Abstract: An electronic device may have a housing. Components such as keys may be mounted in openings in the housing. The housing may include a display housing portion and a base portion that are coupled using hinge structures. The keys may be used to form a keyboard in the base portion of the housing. Sensitive circuitry such as sensitive wireless circuitry may be shielded from electromagnetic interference by shielding the openings with a layer of conductive material. The layer of conductive material may be a metal layer that forms part of a reflector for a backlight structure. The backlight structure may be used to provide backlight for keys in the keyboard. The keyboard may include a support structure having openings through which the backlight passes to reach the keys. The openings may be bridged using conductive paths so that the support structure serves as a radio-frequency shielding structure.

Abstract: An electromagnetic interference (EMI) shielding device and manufacturing method thereof are provided. The EMI shielding device includes at least one ferrite material outer layer, a first and a second electrodes within the ferrite material outer layer, and a positive temperature coefficient resistor (PTCR) core layer sandwiched between the first and the second electrodes in the ferrite material outer layer. The first and the second electrodes extend to two ends of the ferrite material outer layer respectively.

Abstract: An electronic device includes a housing, an electromagnetic shield and a fixing mechanism for securing the electromagnetic shield to the housing. The fixing mechanism includes a first fixing component. The first fixing component includes a first post and two first fixing elements. Free ends of the two first fixing elements are opposite to each other and protrude out of a surface of the electromagnetic shield opposite to the housing. The first post extends through the first fixing hole and is clipped by the free ends of the first fixing elements, for preventing the electromagnetic shield from disengaging from the housing in a first orientation.

Abstract: A semiconductor device is made by mounting a plurality of semiconductor die to a substrate, depositing an encapsulant over the substrate and semiconductor die, forming a shielding layer over the semiconductor die, creating a channel in a peripheral region around the semiconductor die through the shielding layer, encapsulant and substrate at least to a ground plane within the substrate, depositing a conductive material in the channel, and removing a portion of the conductive material in the channel to create conductive vias in the channel which provide electrical connection between the shielding layer and ground plane. An interconnect structure is formed on the substrate and are electrically connected to the ground plane. Solder bumps are formed on a backside of the substrate opposite the semiconductor die. The shielding layer is connected to a ground point through the conductive via, ground plane, interconnect structure, and solder bumps of the substrate.

Abstract: Provided herein are methods, devices, and systems that relate to electromagnetic interference (EMI) filters that, in certain embodiments, comprise: (a) a housing comprising a substantially enclosed first compartment and a substantially enclosed second compartment; (b) a first circuit card located in the first compartment of the housing that converts a signal transmitted on a conductive based medium to a signal transmitted on a non-conductive based medium; (c) a second circuit card located in the second compartment of the housing that converts a signal transmitted on a non-conductive based medium to a signal transmitted on a conductive based medium; (d) at least one non-conductive based medium that transmits a signal from the first circuit card to the second circuit card; and (e) at least one waveguide through which the non-conductive based medium passes from the first compartment to the second compartment.

Abstract: Equipment and systems for protecting electronics against damage or upsets from electromagnetic pulse (HEMP or EMP), intentional electromagnetic interference (IEMI), and high power RF weapons are disclosed. This equipment can include a shielding arrangement includes a metallic enclosure having an interior volume defining a protected portion and an unprotected portion separated by an electromagnetically shielding barrier, and having a portal providing access to the protective portion and including an access opening, a shielding cover sized to cover the access opening, and an electromagnetically sealing gasket positioned around a perimeter of the access opening. The shielding arrangement also includes one or more filters positioned at least partially within the unprotected portion and along the electromagnetically shielding barrier to dampen electromagnetic signals and/or power signals outside a predetermined acceptable range.

Abstract: A touch panel with a single plate includes a plate and a sensing circuit structure. The substrate is taken as a cover. The sensing circuit structure is formed on the plate.

Abstract: A display device having a compact structure includes a main board and an inverter board of the display device connected to each other. A bracket supports the main board and the inverter board. The bracket includes a shielding part to block electromagnetic waves, an inverter board holding part to allow the inverter board to be easily seated on the bracket, and a support and fixing part to support and fix the bracket. Further, a front cover and a back cover are connected in a snap-fit manner, and a bottom chassis includes a cable receipt groove to organize the internal wiring of the display device.

Abstract: Various electromagnetically-countered systems are provided and include at least one wave source irradiating harmful electromagnetic waves and at least one counter unit emitting counter electromagnetic waves for countering the harmful waves. Various generic counter units of such systems and various mechanisms are provided to counter the harmful waves by the counter units by matching configurations of the counter units with those of the wave sources, matching shapes of such counter waves with shapes of the harmful waves, etc. Various methods are provided for countering the harmful waves with the counter waves by such source or wave matching. Various methods are also provided for the counter units as well as counter waves. Various processes are provided for providing such systems and counter units. Various electric and/or magnetic shields may be used alone or in conjunction with such counter units to minimize irradiation of the harmful waves from the system.

Abstract: Various electromagnetically-countered systems are provided and include at least one wave source irradiating harmful electromagnetic waves and at least one counter unit emitting counter electromagnetic waves for countering the harmful waves. Various generic counter units of such systems and various mechanisms are provided to counter the harmful waves by the counter units by matching configurations of the counter units with those of the wave sources, matching shapes of such counter waves with shapes of the harmful waves, etc. Various methods are provided for countering the harmful waves with the counter waves by such source or wave matching. Various methods are also provided for the counter units as well as counter waves. Various processes are provided for providing such systems and counter units. Various electric and/or magnetic shields may be used alone or in conjunction with such counter units to minimize irradiation of the harmful waves from the system.

Abstract: A multi-layered cable consisting of three or more conductive layers separated by layers of dielectric and/or adhesive material. The bottom layer and the top layer may act as return path for the transmitted signals and as a shield to prevent interference between these and external electrical signals. Located between the bottom layer and the top layer, the middle layer may transmit desired signals through the flexible cable. The material selection and specifics of each of the layers should be selected so as to achieve a balance in which the desired electrical impedance and mechanical flexibility requirements are met. The cable may also include one or more vias connecting the bottom layer to the top layer, providing shielding all the way around the flex cable. An additional conductive sock may be used to improve shielding effectiveness of the top and bottom layer and to connect to I/O connector shells and the system Faraday cage.