Abstract: This power conversion device includes: a semiconductor power module including a module busbar; a capacitor module including a capacitor element, a capacitor case formed in a bottomed tubular shape and storing the capacitor element with sealing resin interposed therebetween and a capacitor busbar having one end electrically connected to the capacitor element and another end extending outward from the capacitor case and electrically connected to the module busbar; and a power conversion device case formed in bottomed tubular shape and storing the semiconductor power module and the capacitor module. An outer surface of a bottom wall of the capacitor case and an inner surface of a bottom wall of the power conversion device case are thermally connected to each other. The capacitor module has a heat dissipation member located toward an opening side of the capacitor case relative to the capacitor element and thermally connected to the sealing resin.

Abstract: A power conversion apparatus includes: a converter main circuit converting AC power into DC power; an inverter main circuit converting, into AC power, the DC power obtained by conversion by the converter main circuit; and a common cooler cooling first switching elements included in the inverter main circuit and second switching elements included in the converter main circuit. The first switching elements are modularized in units of one or more elements to form first modules. The second switching elements are modularized in units of one or more elements to form second modules. The first and second modules are mounted on a first surface of a base of the cooler. The first modules are arranged in a first direction on the first surface. The second modules are arranged such that two or more second modules are continuously arranged in a second direction orthogonal to the first direction on the first surface.

Abstract: The disclosure herein relates to an electric power converter in which a power module accommodating a switching element for electric power conversion is in contact with a cooler, and provides a structure capable of effectively cooling the power module. An electric power converter includes coolers in contact with a power module. A stacked body of the power module and the coolers is accommodated in a case. The surface of the first cooler opposite to the power module is in contact with the case, and an output bus bar is connected to a midpoint terminal and is in contact with the case. The first cooler directly cools the power module by one surface, and absorbs heat from the power module transferred via the midpoint terminal and the output bus bar by another surface.

Abstract: An inverter module and an inverter are provided. The inverter module includes at least two capacitors and at least one power unit group. The at least one power unit group each comprises one or more power units. The capacitors are connected in series and parallel to form a capacitor head terminal, a capacitor end terminal and a capacitor midpoint, where capacitance between the capacitor midpoint and the capacitor head terminal is the same as capacitance between the capacitor midpoint and the capacitor end terminal. Positive poles of DC sides of the power units are equidistantly connected with the capacitor head terminal, negative poles of the DC sides of the power units are equidistantly connected with the capacitor end terminal, and midpoints of the DC sides of the power units are equidistantly connected with the capacitor midpoint.

Abstract: Disclosed is a box type cooling structure of a controller, which includes an upper water channel substrate, a front water channel substrate, a left water channel substrate, a rear water channel substrate, a right water channel substrate, a lower water channel substrate and an intermediate water channel substrate sequentially surrounding the controller in six directions to form a box structure. Each water channel substrate is internally provided with a water channel structure.

Abstract: Disclosed are a power supply module housing and a power supply module comprising same. The power supply module housing comprises a main housing, the main housing is provided with a maintenance and installation opening for facilitating the maintenance and installation of the power supply module, and a skylight cover plate detachably covers the maintenance and installation opening. The power supply module comprises the power supply module housing, a connecting terminal is installed in the power supply module housing, and the skylight cover plate is provided at the position corresponding to the connecting terminal. According to the present application, additionally providing the maintenance and installation opening and the skylight cover plate on a top cover enables wiring to be performed without removing the top cover in a field wiring work, thereby simplifying the steps of field wiring, and reducing the risk during work at height.

Abstract: A capacitor module that smooths a voltage of an inverter circuit includes a supply assembly including a connection terminal to the inverter circuit, an alternating-current assembly including a capacitor and a first bus bar, and a direct-current assembly including a second bus bar connecting a DC power source and the supply assembly. The alternating-current assembly and the direct-current assembly are side by side in a plan view and one side view of the capacitor module, and are arranged with the side surfaces thereof opposing each other in an opposite side view. The supply assembly is located inside an outer peripheral region collectively surrounding both the alternating-current assembly and the direct-current assembly in the plan view.

Abstract: Power amplifier modules (PAMs) having topside cooling interfaces are disclosed, as are methods for fabricating such PAMs. In embodiments, the method includes attaching the RF power die to a die support-surface of a module substrate. The RF power die is attached to the module substrate in an inverted orientation such that a frontside of the RF power die faces the module substrate. When attaching the RF power die to the module substrate, a frontside input/output interface of the RF power die is electrically coupled to corresponding substrate interconnect features of the module substrate. The method further includes providing a primary heat extraction path extending from the transistor channel of the RF power die to a topside cooling interface of the PAM in a direction opposite the module substrate.

Abstract: The present disclosure includes drive modules for motor-drive assemblies of an industrial automation system. The drive modules may include a housing having a cavity and may also include power circuitry and control circuitry. The power circuitry may convert input DC power to three-phase controlled frequency AC power and may supply the three-phase controlled frequency AC power to a motor. The control circuitry may apply control signals to control operation of the motor. The drive module may also include an adapter that couples to a first end of the housing and couples the housing to the motor. The adapter may be removable and sized according to a frame size of the motor such that the drive module is compatible with the motor. The housing may be independent of the frame size of the motor. As such, the housing may be interchangeable for any motor frame size and/or motor power.

Abstract: A semiconductor arrangement includes at least two switching devices of a first type electrically coupled in parallel between first and second terminals, and at least two switching devices of a second type electrically coupled in parallel between the second terminal and a third terminal. One first diode is electrically coupled in parallel to each switching device of the first type. One second diode is electrically coupled in parallel to each switching device of the second type. The switching devices are arranged in a power semiconductor module having first and second longitudinal sides and first and second narrow sides. The first type switching devices and first diodes are arranged alternatingly in one row along the first longitudinal side. The second type switching devices and second diodes are arranged alternatingly in another row along the second longitudinal side. An axis of symmetry that extends perpendicular to the first and second narrow sides.

Abstract: An electronic system includes a casing including a first bearing surface, a first busbar attached to the casing and including a first connection end having a first connection surface, and an electronic unit having a second bearing surface and including a second busbar having a second connection end having a second connection surface. The second bearing surface is intended to slide on the first bearing surface when the electronic unit is inserted into the casing. One from among the first bearing surface and the second bearing surface includes a ramp that is inclined relative to the insertion direction for deforming the second busbar so as to bring the second connection surface closer to the first connection surface when the electronic unit is inserted into the casing. An electrical assembly may include such an electronic system and a rotary electric machine.

Abstract: A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

Abstract: A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

Abstract: An electric power converter includes a plurality of power modules, a capacitor, a positive bus bar, and a negative bus bar. Each of the power modules includes a positive terminal and a negative terminal on a side facing the capacitor. Leading ends of the positive terminal and negative terminal are parallel to the side. The positive bus bar includes a positive/negative base plate joined to a positive/negative electrode of the capacitor and a positive/negative flange bent from the positive/negative base plate. The positive/negative flange is joined to the positive/negative terminals of the power modules. The positive flange and the negative flange extend in directions away from the capacitor.

Abstract: Disclosed herein are apparatus and methods for a power electronics assembly includes a cold plate assembly and one or more power device assemblies. The cold plate assembly includes a manifold including a heat sink cavity in a first surface and a heat sink. The heat sink includes one or more substrate cavities and the heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly of the one or more power assemblies includes a direct bonded metal (DBM) substrate including a first metal layer directly bonded to an insulator layer and a power device. The DBM substrate includes a power device cavity. The power device is positioned in the power device cavity and the power device is electronically coupled to the first metal layer.

Abstract: A power electronics converter includes a multi-layer planar carrier substrate, and a converter commutation cell including a power circuit. The power circuit includes at least one power semiconductor switching element, each of which is comprised in a power semiconductor prepackage. Each power semiconductor prepackage includes one or more power semiconductor switching elements embedded in a solid insulating material. A heat sink is arranged to remove heat from the respective power semiconductor prepackage. A thermal interface layer is arranged between a heat removal side of the respective power semiconductor prepackage and the heat sink. The thermal interface layer has a thermal conductivity and a mechanical compressibility. A converter parameter, which is defined as the mechanical compressibility of the thermal interface layer divided by the thermal conductivity of the thermal interface layer, satisfies 0.1 MNK/Wm<?<1 GNK/Wm.

Abstract: Disclosed embodiments include alignment apparatuses for circuit boards, inverter assemblies, and methods for fabricating an assembly with a circuit board placed on an alignment apparatus. An illustrative apparatus includes an electrically insulative substrate having a first substantially planar surface and a second substantially planar surface forming an opposing side of the first substantially planar surface. The second substantially planar surface defines therein self-aligning features that are configured to align at least one power module pin with the electrically insulative substrate. The first substantially planar surface has at least one alignment feature configured to align a printed circuit board with the electrically insulative substrate. The apparatus also includes a routing feature coupled to the electrically insulative substrate. The routing feature is configured to route at least one low voltage conductor.

Abstract: Methods and systems are provided for a power module. In one example, the power module may have a half-bridge configuration with electrical terminals arranged at opposite side of the power module, semiconductor chips arranged in a printed circuit board (PCB), a capacitor electrically coupled to the electrical terminals and arranged above and in contact with a top plate of the power module, and one or more connectors coupled to the PCB to couple the power module to external circuits. The power module may be directly cooled by flowing a coolant over the semiconductor chips.

Abstract: An electric compressor includes an electric motor, and a motor controller configured to drive the electric motor. The motor controller includes a high voltage circuit board on which switching elements are mounted, a low voltage circuit board on which a control circuit controlling switching operation of the switching elements is mounted, an input connector, an output connector, and a current sensor. The high voltage circuit board and the low voltage circuit board are stacked with each other. The output connector is integrated with a detection busbar that provides electrical connection between the high voltage circuit board and the low voltage circuit board, and through which detection signals indicative of the output current are output to the control circuit.

Abstract: A semiconductor package includes an encapsulant body; an upper electrically conductive element having an outwardly exposed metal surface; a lower carrier substrate having an upper electrically conductive layer, a lower electrically conductive layer having an outwardly exposed surface, and an electrical insulation layer; a first electrically conductive spacer between the upper electrically conductive element and the upper electrically conductive layer; a power semiconductor chip between the upper electrically conductive element and the upper electrically conductive layer; and a second electrically conductive spacer between the upper electrically conductive element and the power semiconductor chip, a first carrier region of the upper electrically conductive layer is connected to a first power terminal, a second carrier region of the upper electrically conductive layer is alongside the first carrier region and is connected to a phase terminal, a first region of the upper electrically conductive element is connec

Abstract: A small-scale application apparatus including an ozone generation apparatus configured to generate ozone gas, the application apparatus being configured to perform ozone usage processing. The ozone generation apparatus includes a load-resonant high-frequency step-up transformer configured to obtain a stepped-up high-frequency voltage and an ozone generator configured to receive the stepped-up high-frequency voltage as an operating voltage to generate the ozone gas having an ozone concentration of at least 200 g/m3 from raw gas containing oxygen gas. The application apparatus receives the ozone gas under a pressure environment of at least 0.2 MPa.

Abstract: A robot controller is a controller configured to control a motor of a robot and includes: a housing accommodating a heat generating part that generates heat; a vent hole that is open on a wall of the housing; a fan configured to supply air, introduced through the vent hole into the housing, to the heat generating part; and a lid part configured to cover the vent hole.

Abstract: The invention relates to a medium or high voltage converter (2), preferably a modular multilevel converter, as well as to a power module (1), which comprises at least one power semiconductor module (4), at least one energy storage module (5), at least one cooling device (6), and wherein the cooling device (6) is formed as a cooling plate (7) which can be run through by a coolant, in particular flown through by a cooling liquid, and which has a smaller cooling plate thickness (10) as compared to a cooling plate length (8) and a cooling plate height (9) and the cooling plate (7) has at least one support region (12) defined by the cooling plate length (8) and the cooling plate thickness (10) and/or a part of the cooling plate height (9) of the cooling plate (7), for load transfer of the power module (1) onto a rack (3) of the medium or high voltage converter (2).

Abstract: A power converter includes a housing that accommodates at least one capacitor inside the housing, a first power conversion module including at least one first positive electrode and at least one first negative electrode, a second power conversion module including at least one second positive electrode and at least one second negative electrode, a first positive electrode busbar that connects a first electrode of the capacitor to the first positive electrode, a first negative electrode busbar that connects a second electrode of the capacitor to the second negative electrode, a second positive electrode busbar that is fixed to the first positive electrode together with the first positive electrode busbar and that is fixed to the second positive electrode, and a second negative electrode busbar that is fixed to the first negative electrode and that is fixed to the second negative electrode together with the first negative electrode busbar.

Abstract: A step-down conversion circuit assembly and an electronic device are provided. The step-down conversion circuit assembly includes a box body, a step-down conversion circuit, a heat dissipation element, and a fan. The box body has multiple side walls, where the multiple side walls define an enclosed accommodating space, and the box body defines an air outlet on one of the multiple side walls. The step-down conversion circuit is disposed in the accommodating space of the box body. The heat dissipation element is disposed in the accommodating space of the box body and attached to the step-down conversion circuit for conducting heat. The fan is disposed between the step-down conversion circuit and the air outlet and configured to enable the heat in the accommodating space to exit from the air outlet.

Abstract: The invention relates to a cooling circuit, notably for a casing of an electrical equipment, comprising a first portion and a second portion, said first and second portions of the cooling circuit being complementary and respectively comprising hollow parts and projecting parts configured to fit one into the other so as to form by assembly a circulation channel for a coolant, said circulation channel being configured to generate a flow extending over different levels laid out successively one after the other along said circulation channel, said hollow parts and said projecting parts being configured to fit one into the other thanks to a functional clearance enabling the imbrication of said hollow parts and said projecting parts, one at least of said first and second complementary circuit portions comprising at least one deflector configured to divert the coolant from said functional clearance.

Abstract: An object of the present invention is to ensure the reliability of a capacitor element by appropriately securing a heat path around the capacitor element. A power converter according to the present invention includes: a power semiconductor circuit unit that converts DC power into AC power; a capacitor element that smooths the DC power; a DC-side bus bar that transmits the DC power; a capacitor terminal that is connected to an electrode surface of the capacitor element and to the DC-side bus bar; and a case that forms a capacitor housing portion for housing the capacitor element, in which the DC-side bus bar has: a power supply-side terminal; a main body portion that is arranged at a position facing a bottom of the capacitor housing portion with the capacitor element interposed therebetween; and an extending member that is formed between the case and the capacitor element and formed from the main body portion toward the bottom of the capacitor housing portion, and that does not contact the electrode surface.

Abstract: An apparatus including a substrate, a power conversion circuit coupled to the substrate, a power prong coupled to the power conversion circuit, a device connector to couple to a device, and a device connector cable to couple the device connector to the power conversion circuit is disclosed.

Abstract: A snubber device to be mounted to a terminal of a semiconductor module is provided. The snubber device includes n (n: integer of 1 or greater) parallel charge paths each having a positive-side capacitor, a first diode, and a negative-side capacitor sequentially connected in series between positive-side and negative-side terminals of the semiconductor module, and configured to enable current to flow from the positive-side terminal toward the negative-side terminal; and (n+1) parallel discharge paths each of which having a second diode connected between the negative-side terminal or the negative-side capacitor of an Nth charge path (N: integer within a range of 0?N?n) of then charge paths and the positive-side capacitor of a (N+1)th charge path of the n charge paths or the positive-side terminal, and configured to enable current to flow from the negative-side terminal toward the positive-side terminal via at least one of the negative-side and positive-side capacitors.

Abstract: An integrated inverter assembly including a main cover and an opposing back cover, a coolant channel, wherein power electronics of the inverter assembly are thermally coupled to the coolant channel, and wherein at least one of a coolant inlet or a coolant outlet of the coolant channel comprises a quick connector without a locking element.

Abstract: An apparatus, such as a power converter, includes first, second and third core bus plates arranged in parallel. The apparatus also includes a first bus extension plate joined to the first core bus plate and extending therefrom at a first angle and a second bus extension plate joined to the second core bus plate and extending therefrom at a second angle. The apparatus further includes a third bus extension plated joined with the third core bus plate and disposed parallel to the first bus extension plate and a fourth bus extension plate joined with the third core bus plate and disposed parallel to the second bus extension plate.

Abstract: A rotating electric machine includes a machine main body, a frame member and a rectifier. The machine main body is configured to generate alternating current. The frame member holds the machine main body. The rectifier is provided axially outside the frame member and has a rectification circuit configured to rectify the alternating current generated in the machine main body into direct current. The rectifier includes first and second heat sinks that are located to axially overlap each other, first rectifying elements mounted to the first heat sink and constituting an upper arm of the rectification circuit, and second rectifying elements mounted to the second heat sink and constituting a lower arm of the rectification circuit. The second heat sink is located closer than the first heat sink to the frame member. The surface area of the second heat sink is greater than the surface area of the first heat sink.

Abstract: The present invention provides an inverter including: a middle frame in which a main circuit is disposed; an upper case disposed above the middle frame and configured to accommodate the main circuit; and a lower case disposed under the middle frame and having a first vent hole formed in one side surface thereof; a fan disposed at the other side surface of the lower case facing the first vent hole; a heat sink interposed between the first vent hole and the fan; an auxiliary housing disposed under the lower case, configured to accommodate an auxiliary circuit, and including a second vent hole in at least one side surface thereof; and a controller disposed in the main circuit of the auxiliary circuit.

Abstract: A problem to be solved by the present invention is to secure a creepage distance while maintaining miniaturization. A power converter according to the present invention includes a positive electrode side conductor, a negative electrode side conductor, and an insulating member disposed between the positive electrode side conductor and the negative electrode side conductor, in which the positive electrode side conductor or the negative electrode side conductor includes a main surface on a side opposite to a surface in contact with the insulating member, a side surface connected to the surface in contact with the insulating member, and an inclined surface forming an obtuse angle with respect to each of the main surface and the side surface, and the insulating member includes a protrusion formed so as to overlap with the side surface and the inclined surface as viewed in a direction perpendicular to the side surface.

Abstract: An electric machine configured to propel a vehicle includes a stator, a rotor, and an end plate. The stator has end windings that protrude axially therefrom. The rotor is disposed within the stator. The end plate is secured to an axial end of the rotor. The end plate defines a primary chamber, a secondary chamber that is radially outward of the primary chamber, and a first outlet channel that is configured to direct fluid onto the end windings. The primary chamber is in fluid communication with a fluid source and the secondary chamber. The secondary chamber is in fluid communication with the outlet channel.

Abstract: A method for producing a power electronics system having a cooling device, a switching device, a terminal device, a capacitor device and a control device includes the following production steps: providing a cooling device with a plurality of first and second positioning cutouts; providing the switching device with a substrate and a first mounting device, which has first positioning devices; providing the terminal device, which is completely independent of the switching device, i.e. forms a dedicated component part or a dedicated assembly, with a second mounting device, which has second positioning devices; arranging the switching device on the cooling device, wherein the first positioning devices are arranged in the respectively assigned first positioning cutouts; arranging the terminal device on the cooling device, wherein the respective second positioning devices are arranged in the assigned second positioning cutouts; arranging the capacitor device.

Abstract: Provided is an electronic component (13) that can be miniaturized while including a cooling structure. The electronic component includes an electronic component main body (13a), a bus bar (31) arranged inside the electronic component main body, and a heat dissipating member (40) embedded in the electronic component main body and having one end face thermally in contact with the bus bar and the other end face exposed to an outside of the electronic component main body.

Abstract: An electronic module includes an operational subunit, having upper, lower and lateral surfaces, and including one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation. A heat sink is disposed in proximity to the lower surface of the operational subunit. A heat spreader, including a continuous sheet of a heat-conducting material, is folded to wrap around the operational subunit so that a lower side of the sheet is interposed between the lower surface of the operational subunit and the heat sink and a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit.

Abstract: The present invention is a system for converting a direct electrical power into alternating electrical power. The conversion system comprises an assembly on a printed circuit board (14) of power modules (7), an electrical energy recovery module (5?) and a coil and the present invention also relates to a method for assembling the conversion system, and a motor system comprising the conversion system.

Abstract: A power converter includes: a converter circuit converting an alternating current to a direct current; a reactor electrically connected to one of output terminals of the converter circuit; a capacitor electrically connected to the other output terminal of the converter circuit and the reactor; and an inverter circuit electrically connected to the capacitor converting the direct current to an alternating current. The capacitor is a film capacitor. The capacitor and the reactor are mounted on an identical circuit board.

Abstract: A load controller includes a casing; a busbar module, the busbar module including a DC busbar and an AC busbar connected to a load; a capacitor connected to an external DC power supply, the capacitor being connected to the DC busbar; an IGBT power module, an input end of each IGBT being connected to the DC busbar, and an output end of each IGBT being connected to the AC busbar; a heat-dissipating module, the heat-dissipating module including multiple heat-dissipating fins, each IGBT in a same column of IGBTs being sandwiched between adjacent two heat-dissipating fins; a driving circuit board, the driving circuit board being electrically connected to each IGBT; and a control circuit board, the control circuit board being connected to the driving circuit board, where all of the busbar module, the IGBT power module, the heat-dissipating module, the driving circuit board and the control circuit board are disposed on the casing.

Abstract: The invention relates to a system, including a bus bar device and a power converter housing, wherein the bus bar device includes a stack made of at least two bus bars and an electrically insulating insulation body, which encloses the bus bars in two insulating regions of the bus bar device, wherein each bus bar includes two opposing base surfaces extending in the direction of current flow and lateral surfaces connecting the base surfaces and extending in the direction of current flow, wherein the bus bar device includes a temperature control region formed between the insulating regions, in which the insulation body has an opening that exposes one of the lateral surfaces and a portion of at least one of the base surfaces of a respective bus bar, wherein the bus bars are thermally connected to the power converter housing in the temperature control region by a heat transfer means.

Abstract: A dedicated airflow tunnel can extend directly from a front side of the chassis to a power supply unit (PSU) located near the rear side of the chassis. The dedicated airflow tunnel is removable and replaceable with airflow tunnels of different size. The dedicated airflow tunnel can avoid recirculation of PSU cooling air.

Abstract: The invention which relates to an EMC filter (1) addresses the problem of specifying an EMC filter (1) that is simple of structure, cost-effective and temperature resistant. This problem is resolved thereby that the core of the choke (4, 5) is comprised of one or two core parts (10), that at least one first planar or convex heat transfer area (23) is located on an outside of the core and that the core with this first planar or convex heat transfer area (23) is disposed on a housing (12) of the refrigerant compressor, wherein the housing (12) in the region of the first planar or convex heat transfer area (23) is implemented planar or concave.

Abstract: A power converter to be mounted to a mounting portion of a host in a suspended manner includes a plurality of component-housing chassis configured to be connected together parallel to the mounting portion, the plurality of component-housing chassis each containing parts for a power converter so that the plurality of component-housing chassis collectively constitute the power converter for the host, wherein at least one of the plurality of component-housing chassis has a support frame, the support frame protruding out so as to extend into at least an adjacent one of the component-housing chassis, wherein the at least adjacent one of the component-housing chassis has an insertion hole for inserting the support frame, and wherein the support frame is configured to be inserted into the insertion hole in the adjacent component-housing chassis and fixed to the adjacent component-housing chassis.

Abstract: In a semiconductor device, a plurality of semiconductor chips included in an upper-arm circuit are connected in parallel between a pair of upper-arm plates, while a plurality of semiconductor chips included in a lower-arm circuit are connected in parallel between a pair of lower-arm plates. In each of the arm circuits, the plurality of semiconductor chips are arranged in a direction perpendicular to a direction in which emitter electrodes and pads are arranged, the pads are disposed on the same side of the emitter electrodes, and signal terminals extend in the same direction. A series-connecting part between the upper- and lower-arm circuits includes a joint part 20 continued to respective side surfaces of the corresponding upper- and lower-arm plates. Each of inductances of respective parallel-connecting parts of the upper- and lower-arm plates which connect the semiconductor chips in parallel is smaller than an inductance of the series-connecting part.

Abstract: A power converter includes: a power module that converts direct-current electric power from a power storage apparatus and alternating-current electrical power to be supplied to a load; a charger that converts alternating-current electrical power supplied via an external connector to direct-current electric power and charges the power storage apparatus therewith; a case that accommodates the power module and the charger; a cooling-medium flow channel that is provided in the case and through which cooling medium flows, wherein the power module and the charger are arranged on the cooling-medium flow channel.

Abstract: To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, a first electronic component housing chamber 5000 houses the high voltage power supply module 100 (the first electronic component). A second electronic component housing chamber 6000 houses the TWT 200 (the second electronic component). At least some of a first partition plate 2500 and a second partition plate 2600 are provided so as to face each other. A first gap part G1 is provided between the first partition plate 2500 and the second partition plate 2600.

Abstract: A power conversion device includes a case including an upper case and a lower case; an inverter that is accommodated in a first partial case and is fixed to the first partial case, the first partial case being one of the upper case and the lower case; and a capacitor that is connected to the inverter by a positive electrode bus bar and a negative electrode bus bar, the capacitor being disposed in an internal space of a second partial case that is another of the upper case and the lower case. The first partial case includes a fastening portion that extends from an internal space of the first partial case to the internal space of the second partial case. In the internal space of the second partial case, the capacitor is fastened to the fastening portion.

Abstract: An electrical receptacle that is normally configured to receive AC voltage is configured to provide a low voltage DC instead. An LED bulb without a transformer can be plugged into the appliance and operate on the DC voltage from the wall outlet. An optional circuit interrupter can prevent damage to the LED bulb is it is inadvertently plugged into a source of AC voltage. Any appliance designed to be operated on DC voltage can be plugged into the DC outlet without a transformer. Multiple LEDs can be “piggybacked” onto a base.