Abstract: A power converter module for use alone or with other modules in a multiphase power converter. The power converter module has an enclosure that surrounds internal components to prevent radiation of electromagnetic energy, which internal components also limit conduction of electromagnetic energy. The internal components include an EMI filter, a ripple filter, a power converter, and a control interface that communicates with a control system of a power conversion system. The control interface includes a memory that stores information related to the power converter modules so as to improve interchangeability of similar power modules with the multiphase power converter.

Abstract: A packaged heat dissipating assembly for an intermediate bus converter (IBC) has a frame being mounted on and around the IBC and a heat sink being mounted on the frame. The packaged heat dissipating assembly is easily detached from the IBC. Therefore, a broken bus converter module (BCM) or heat sink is easily replaced separately. Consequently, heat dissipating designs and maintenance of a server or communication equipment is facilitated and maintenance costs of the IBC and the server or communication equipment are lowered.

Abstract: In a conventional cooling device, a heat pipe or a circulation-type liquid cooler provided with a pump is used and therefore, a large space is needed for the cooling device. There is provided a cooling device which includes a plurality of cooling modules having cooling units for cooling heat-generating elements by coolant and radiation units for radiating heat from the coolant heated in the cooling units, the plurality of cooling modules being bubble-pump-type ones in which the coolant is circulated between the radiation units and the cooling units by the coolant being boiled in the cooling units, the radiation units being arranged side by side, and a cooling fan for generating wind blowing the radiation units.

Abstract: The present invention relates generally to tuning the flow of cooling air across converter and inverter heat sinks in a motor drive system. More specifically, present techniques relate to motor drive duct systems having parallel cooling air duct channels dedicated to providing cooling air for a converter heat sink and an inverter heat sink, respectively. In particular, a first duct channel through an inverter duct and a converter duct is dedicated to providing cooling air to the converter heat sink without cooling the inverter heat sink, whereas a second duct channel through the inverter duct and the converter duct is dedicated to providing cooling air to the inverter heat sink without cooling the converter heat sink. A guide vane adjacent to the inverter duct may control the flow of cooling air from a blower between the first and second duct channels.

Abstract: On an inverter for feeding power of a direct voltage source, in particular of a photovoltaic generator (PVG), into an alternating voltage mains (N), with an asymmetrically clocked bridge circuit with at least two first switches (S1, S2) clocked at mains frequency and with at least two second switches (S3, S4) clocked at a higher clock frequency, the efficiency is intended to be improved at low cost. This is achieved in that slow speed switches (S1, S2) of equal temperature stability are utilized for the mains frequency and that fast speed switches (S3, S4) with steeper switching slopes and higher temperature stability are utilized for the higher clock frequency, the fast speed switches (S3, S4) being locally separated from the slow speed switches (S1, S2).

Abstract: A power drive stack system comprises a series of power electronic modules, each one of the modules containing power components and module contacts electrically and mechanically aligned for building a portion of a complete AC/DC drive stack. The modules utilize a common set of circuit connection points that are matched to a common set of physical connection points. The modules can be plugged together like building blocks to form a large variety of AC/DC drive stacks that can be tailored to meet an exact system requirement. The drive stack may be used in conjunction with a controller to adjust the torque and speed of an AC/DC electric motor.

Abstract: A PWM operation unit includes a modulation-mode selecting unit selecting a two-phase modulation mode signal and a carrier-wave-synchronous-mode select command, a modulation-wave generating unit generating a modulation wave in response to the two-phase modulation mode signal, a carrier-wave generating unit generating a carrier wave in response to the carrier-wave-synchronous-mode select command, and a comparing unit comparing the modulation wave with the carrier wave. In a two-phase modulation mode, the PWM operation unit controls the carrier-wave generating unit such that a carrier wave frequency is set to an integral multiple of a modulation wave frequency.

Abstract: A reversible fan tray device is provided for a power supply unit. The fan tray device includes a mounting panel to be removably mounted to the power supply, a fan unit secured to the mounting panel to provide airflow through the electronic device, and an interconnection board secured to the mounting panel to provide an electrical connection between the fan unit and the power supply unit. The mounting panel can be positioned in either of two orientations, the first orientation to draw external air into the power supply unit and the second orientation to force internal air out of the power supply unit. The interconnection board mates with a connector on the power supply unit when the fan tray cassette is in either of the two orientations. The interconnection board provides an airflow direction indication to the power supply unit for an existing orientation of the two orientations.

Abstract: A cooling device for a semiconductor element module and a magnetic part, includes: a water-cooled type heat sink having a cooling water passage; a semiconductor element module including a plurality of chips arranged side by side in a circulation direction in the cooling water passage, the semiconductor element module being mounted on the heat sink; and a magnetic part including a core and a winding portion mounted on the core, the magnetic part being mounted on the heat sink or another heat sink. In the cooling device, a plurality of cooling fins is disposed to extend along the circulation direction in the cooling water passage in a manner that the plurality of cooling fins are separated into groups for the respective chips arranged side by side in the circulation direction, and that the groups of the cooling fins are offset from each other in a direction perpendicular to the circulation direction. Accordingly, it is possible to have improved cooling efficiency of a heat sink with cooling fins.

Abstract: Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.

Abstract: An electronics assembly for use in a vehicle is provided. The assembly comprises a heat sink, a dam coupled to the heat sink, the dam and the heat sink combining to form a reservoir, an electronic component positioned within the reservoir, and a thermally conductive layer conformally molded to the electronic component and disposed between the electronic component and the heat sink.

Abstract: This invention provides a power supply comprising a mother board, a first socket, and a DC-DC converter module. The mother board comprises a transformer operative for transforming an input power into a first AC output power and a filter operative for receiving the first AC output power and filtering the first AC output power into a first DC output power. The first socket is mounted on the mother board and electrically coupled to a circuitry of the mother board by way of at least one conductor terminal operative for providing the first DC output power. The DC-DC converter module mounted on a printed circuit board electrically coupled to the mother board comprises a DC-DC converter operative for receiving the first DC output power and converting the first DC output power into a second DC output power and a third DC output power and a second socket operative for providing the second DC output power and the third DC output power by means of a conductive path of the printed circuit board.

Abstract: A solid state device controller is provided that includes a first electrical connector configured to be in electrical communication with an alternating current (AC) electrical power source and a second electrical connector in electrical communication with the first electrical connector, wherein the second electrical connector is configured to be in electrical communication with a direct current (DC) electrically powered device. The controller further includes circuitry in communication between the first electrical connector and the second electrical connector, wherein the circuitry is configured to convert the supplied AC electrical power to DC electrical power, and a housing configured to enclose at least a portion of the first electrical connector, the second electrical connector, and the circuitry, wherein the housing is further configured to be removably received by a service panel assembly.

Abstract: A motor control system of the present invention includes an accurate electrical insulation deterioration detecting system. A voltage divider circuit is arranged between a negative DC output portion and a ground, through a normally open switch circuit. A detecting operation control section closes the normally open switch while a circuit breaker is opened, and places at least one of transistors electrically connected to a positive DC output portion into a conductive state, from among six transistors included in three arm circuits. A voltage across the first resistor is inputted as a divided voltage into a voltage comparator of a voltage comparison section. The voltage comparison section compares a divided voltage outputted from the voltage divider circuit and a reference voltage using the voltage comparator and outputs an alarm signal if the divided voltage exceeds the reference voltage.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the at least some of the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit. The frame has such a shape that at least some of the electronic components constituting the internal unit are disposed inside the frame. The frame includes a terminal block on which input/output terminals for inputting and outputting controlled power are mounted for providing connection between the input/output terminals and external devices.

Abstract: A power converter including a switching element, a switching power module containing a driving circuit for driving the switching element, a smoothing capacitor module for smoothing an input to the switching power module, and a heat sink for cooling the switching power module, wherein the switching power module is mounted on the heat sink, and the smoothing capacitor module is provided on a side surface of the heat sink.

Abstract: An electric power converter includes a cooler and an electronic circuit. The cooler includes a heat sink, a cooling fan, and a wind tunnel. A plurality of radiator fins are provided on a heat-sink base in the heat sink. The cooling fan is configured to feed cooling air through the plurality of radiator fins. The wind tunnel covers the plurality of radiator fins and the cooling fan. The electronic circuit includes a plurality of rectifiers and a plurality of input terminals. The plurality of rectifiers are provided on a side of the heat-sink base opposite to the plurality of radiator fins and are arranged side by side in a longitudinal direction of the heat-sink base. The plurality of input terminals are connected to the plurality of rectifiers with band-shaped conductors and are provided on a side of the plurality of rectifiers opposite to the heat sink.

Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.

Abstract: Each phase of a three-level power converting apparatus is configured by a single unit, and four switching devices (1u-4u) and two diodes (9u, 10u) provided in each unit are arranged along a flow direction of cooling air on a heat sink (15) of a cooling device with long sides of the switching devices (1u-4u) and the diodes (9u, 10u) oriented perpendicular to the flow direction of the cooling air. The first and second diodes (9u, 10u) are arranged in a central area of the heat sink (15), whereas the second switching device (2u) and the third switching device (3u) with high heat generation loss are arranged in a distributed fashion to sandwich a group of diodes in the central area in between.

Abstract: A capacitor module in which the structure of a connecting portion is highly resistant against vibration and has a low inductance. The capacitor module includes a plurality of capacitors and a laminate made up of a first wide conductor and a second wide conductor joined in a layered form with an insulation sheet interposed between the first and second wide conductors. The laminate comprises a first flat portion including the plurality of capacitors which are supported thereon and electrically connected thereto, a second flat portion continuously extending from the first flat portion while being bent, and connecting portions formed at ends of the first flat portion and the second flat portion and electrically connected to the exterior.

Abstract: A power conversion apparatus includes a power module, four corners of which are fastened to a cooling jacket from its front surface by a front surface side fastening apparatus that includes nuts which are screwed with bolts projecting from the rear face of the cooling jacket to fasten the power module. An AC terminal of the power module, a DC positive electrode terminal connection portion, and a DC negative electrode terminal are arranged on the top surface of the cooling jacket facing the bolts.

Abstract: A motor drive system 10-1 for a railway vehicle is capable of reducing the weight of wiring, electromagnetic noise, and manufacturing cost. The motor drive system includes an inverter 11. The inverter is configured to control a motor 13-1 and is divided into at least two separate inverter units that are arranged integrally with the motor.

Abstract: A motor controller, which is inexpensive and has small size, is provided by reducing the size of a heat sink used in the motor controller and the number of all parts of the motor controller, wherein said motor controller includes a heat sink, a power semiconductor modules that is in close contact with the heat sink, a substrate (4) that is electrically connected to the power semiconductor module, and a fan (6) that generates the flow of external air and supplies cooling air to the heat sink, wherein said heat sink is formed by combining two kinds of heat sinks, which include a first heat sink (7) and a second heat sink (8), so as to conduct heat therebetween, and, wherein said power semiconductor module is in close contact with the second heat sink (8).

Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.

Abstract: A semiconductor module has switching semiconductor elements connected in parallel to each other and at least a free wheeling semiconductor element reversely connected in parallel to the switching semiconductor elements. The free wheeling semiconductor element is placed between the switching semiconductor elements. At both end parts of the semiconductor elements, each of the switching semiconductor elements is placed. A longitudinal side of each of the switching semiconductor elements and the free wheeling semiconductor element is placed in parallel to a short side of the semiconductor module. An electric-power conversion device has a plurality of arms. Each arm is composed of the semiconductor elements.

Abstract: A rectifier for an alternating current generator is provided. The rectifier comprise a plurality of high-side rectifying elements and a plurality of low-side rectifying elements. The high-side rectifying elements are held by a plurality of high-side cooling fins, while the high-side rectifying elements are held by a plurality of low-side cooling fins. By way of example, the plurality of high-side cooling fins are disposed to be apart from each other by a predetermined distance and the plurality of low-side cooling fins are disposed to be apart from each other by a predetermined distance.

Abstract: A modularly constructed power converter arrangement has two end-side elements and at least one power converter module arranged therebetween. One end-side element has, a fan of an air cooling device, while the other end-side element has, aligned with the fan, cutouts acting as air passages. At least one end-side element has an electrical connection device. The at least one power converter module has, as part of the cooling device, a heat sink, through which air can flow from one end-side element to the other and on which is arranged at least one power semiconductor module connected to a control device and to a capacitor device. For this purpose, the at least one power converter module has a housing, which is open at the end sides and which can be connected in each case at the end sides to an end-side element or a further power converter module.

Abstract: The invention relates to a module with a number of electrical or electronic components or switching circuits provided on a common cooler structure flowed through by a cooling medium. The entire cooler structure is made up of at least two plate-shaped coolers, which are arranged parallel to one another in an interspaced manner and which are flowed through by the cooling medium.

Abstract: An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.

Abstract: An external AC power adapter defines a power conversion chamber that retains power conversion circuitry operable to convert an input power to an output power. The power adapter further include an intake chamber and an outlet chamber, both having an aperture that places the respective chamber in fluid communication with the power conversion chamber. Each chamber may have at least one vent to the ambient environment such that an air mover is operable to circulate ambient air through the power conversion chamber. Each chamber may include a guard that deters liquid that has entered the respective chamber from flowing into the associated aperture.

Abstract: A cooling apparatus with high strength and good heat radiation characteristics. In the cooling apparatus, a heat exchanger is joined to an evaporator disposed on the lower side in a face to face manner; a containing unit of the heat exchanger includes a heat exchanger high temperature liquid outlet, and a two-phase fluid inlet in a joint portion with the evaporator; an outlet header of the heat exchanger includes an intermediate liquid outlet at a joint portion with the evaporator; and the evaporator includes a two-phase fluid outlet in the joint portion with the heat exchanger in opposition to the two-phase fluid inlet of the containing unit, and including an intermediate liquid inlet at the joint portion with the heat exchanger in opposition to the intermediate liquid outlet of the outlet header.

Abstract: There is provided a motor controller that can easily reduce the size and manufacturing cost of a motor controller by reducing the size of a heat sink without increasing the number of parts much. The motor controller includes a heat sink, a plurality of power semiconductor modules that is in close contact with the heat sink, a substrate (6) that is electrically connected to the plurality of power semiconductor modules, and a fan (8) that generates the flow of external air and supplies cooling air to the heat sink. The heat sink is formed by the combination of two kinds of heat sinks that include a first heat sink (9) and a second heat sink (10), and at least one of the power semiconductor modules is in close contact with each of the first and second heat sinks (9) and (10).

Abstract: A method and apparatus for anti-islanding of distributed power generation systems having an inverter comprising a phase locked loop (PLL), a phase shift generator for injecting a phase shift into the PLL during at least one sample period, and a phase error signature monitor for monitoring at least one phase error response of the PLL during the at least one sample period.

Abstract: A power supply topology with pulse width modulation frequency control allows the use of an inductor with higher inductance in a converter. By controlling the switching frequency of the pulse width modulation signal, the inductor can achieve high efficiency during a light load condition and is also suitable for a heavy load condition.

Abstract: A power conversion device in which the inductance of a main circuit is reduced, a surge voltage is suppressed, elements are properly cooled, which is miniaturized and reduced in weight as a whole, and is excellent in handling performance in a manufacturing process and a maintenance work. A positive side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a first laminated bus bar connected to the respective modules. A negative side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a second laminated bus bar connected to the respective modules, and both the laminated bus bars and the capacitors are connected to one another by a third laminated bus bar. Both the cooling plates are parallel to each other so that the mount surfaces thereof are set in the same direction.

Abstract: A cooling structure of a power semiconductor device includes a cooling water passage and a plurality of fins. The cooling water for cooling the power semiconductor device flows through the cooling water passage. The plurality of fins are provided on a path of the cooling water passage and set up with a spacing therebetween in a direction orthogonal to a flow direction of the cooling water. The plurality of fins promote heat exchange between the power semiconductor device and the cooling water. The plurality of fins have ends facing the upstream side of a cooling water flow. The end of at least one fin among the plurality of fins is arranged so as to be displaced to a more upstream side of the cooling water flow than the ends of the fins adjacent to both sides of the at least one fin. By such a configuration, there is provided a cooling structure of a power semiconductor device and an inverter with excellent cooling efficiency.

Abstract: A plastic liquid cooled variable speed drive or inductor provided. The cooler provides lightweight, space conservative, corrosive free cooling to the components as well as provides a mounting area for modules. A cooler can be mounted to the core of an inductor to absorb heat generated by the core losses.

Abstract: A mounting structure for a power module, in which a power module and a heat sink can be easily separated without additional labor and time and without requiring an extra disassembly space in a product and in which parts are not damaged during the disassembly. In the heat sink (5a), screw holes (7a) having female screw threads into which power module fixing screws (2a) are screwed are formed so as to penetrate a power module mounting surface (5c) of the heat sink (5a) and heat radiation fins (9a). The power module fixing screw (2a) is constructed such that, to mount the power module (3) on the heat sink (5a), the screw head of the power module fixing screw (2a) is tightened from the printed circuit board (4a) side with a tool (8a) and that, to remove the power module (3) from the heat sink (5a), the power module fixing screw (2a) is loosened with the tool (8a) from the heat radiation fin (9a) side on the opposite side of the screw head.

Abstract: A rotating rectifier includes diode subassemblies that each have an AC contact between two diodes, held in place by a spring clip or interference fit between an inner DC bus and an outer DC bus. The outer DC bus can also act as a housing and heat sink. Diodes and resistors are distributed around the rotating rectifier. Zener diodes can be included in series with the resistors to provide further protection to the diodes to ensure proper operation of the rectifier.

Abstract: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate.

Abstract: First and second bases and composing a coolant path structure are arranged at the middle stage of the power converter, and semiconductor modules and a capacitor are arranged on both surfaces of the coolant path structure. Furthermore, through-holes are formed in the first and second bases, and cables of DC and AC circuits are laid via the through-holes.

Abstract: The main objective of the present invention is a modular outdoor LED power supply disposed inside or outside of an outdoor LED light or an LED device so as to decrease the distance between the power supply and a LED light base for preventing an output power drop from an output of the power supply to the LED light base. One or more than one power supply can be disposed in a groove of a main heat-dissipating outer cover of the power supply according to the actual requirements, so that the production and installation thereof become more convenient. The power supply is characterized by being water-resistant, moisture-proof, dust-proof, antirust and direct heat-dissipating, wherein the water-resistant effect is above the IP 65 standard, and thus the reliability and the lifetime of the power supply are increased.

Abstract: A high-power thyristor module includes a housing configured with an inner receiving space, and a thyristor unit disposed in the inner receiving space in the housing and including a mounting frame, and a plurality of high-power thyristors mounted on the mounting frame. Each thyristor has a gate. The mounting frame includes a dielectric top plate disposed on a top side of the housing, and a plurality of electrodes mounted on the top plate so that the electrodes are exposed outwardly of the housing, and coupled respectively to the gates of the thyristors. Cooling oil is contained in the inner receiving space so that the thyristors are submerged thereby.

Abstract: Power converter system topologies comprise a DC/DC converter. The DC/DC converter includes a transformer coupling a high side to a low side. The high side may include an inverter bridge in the form of an inverter module and an inductor. The low side may include a rectifier in the form of a rectifier module and a pair of inductors. The transformer may take the form of a planar transformer.

Abstract: The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.

Abstract: An air cooled switching unit for a motor drive includes a plurality electrical switches and a plurality of heat pipe assemblies. Each heat pipe assembly includes a thermally and electrically conductive evaporator, a condenser, and at least one heat pipe extending between the evaporator and condenser. Each of the switches is abutted with an evaporator of at least one of the heat pipe assemblies for conduction of both electrical power and heat between the switch and the evaporator. Each heat pipe assembly further includes an electrically conductive base abutted with the evaporator, and the air cooled switching unit further includes a plurality of power lugs each connected to a base of a respective one of the heat pipe assemblies for input or output of electrical power to the base and the evaporator plate abutted with the base. Each heat pipe assembly includes at least one evaporator defined by a metallic plate. The condenser of each heat pipe assembly includes a plurality of parallel spaced-apart cooling fins.

Abstract: A power converting apparatus and method includes a converter for converting AC power from a commercial power supply into DC power, a smoothing unit for smoothing the DC power from the converter, an inverter for converting an output of the smoothing unit into another AC power, a control unit for controlling the inverter, and a current detector for detecting an output current of the inverter and providing a detection signal indicative thereof. A cooling device for cooling at least one of the converter or the inverter. The detection signal of the current detector is inputted into the control unit so that the control unit estimates a temperature of the inverter or the converter based on the detection signal and controls a cooling device for cooling based on the estimated temperature.

Abstract: One embodiment of the present invention provides an apparatus that measures the average-output-current produced by a switching regulator within an electronic device. The apparatus includes current-sensing-circuitry coupled to a switching field-effect-transistor (FET) within the switching regulator, wherein the current-sensing-circuitry is configured to bypass a small sense current from the conducting current of the switching-FET according to a sense ratio, wherein the conducting current is controlled by a control signal for the switching regulator. The apparatus also includes a current-to-voltage-converter coupled to the current-sensing-circuitry which is configured to convert the sense current into a sense voltage. The apparatus further includes voltage-averaging-circuitry which is configured to produce an average-sense-voltage from the sense voltage. This sense voltage is coupled to the input of the voltage-average-circuitry through a switch, which is gated by the control signal.

Abstract: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate. The coolant flow paths are formed such that coolant flows in a coolant flow direction.

Abstract: Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.