With Cooling Means Patents (Class 363/141)
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Publication number: 20130170269Abstract: A heat conductor for use with an inverter in an electric or hybrid-electric vehicle, the inverter including a direct current link capacitor having multiple film capacitors configured in a stack to form a substantially polygonal prism. Each film capacitor has orthotropic characteristics. The heat conductor has a first substantially planar member configured to contact a first side of the polygonal prism formed by one of the film capacitors, and a second substantially planar member configured to contact a second side of the polygonal prism opposite the first side of the rectangular prism, the second side of the rectangular prism formed by another one of the film capacitors. The first and second planar member are thermally conductive for dissipating heat generated by the film capacitors, are attached by an interconnect, and have sufficient rigidity to confine expansion of the film capacitors across the thicknesses thereof.Type: ApplicationFiled: December 29, 2011Publication date: July 4, 2013Applicant: LEAR CORPORATIONInventors: Nadir Sharaf, Slobodan Pavlovic, Dilip Daftuar, Ajmal Ansari
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Patent number: 8477502Abstract: A portable power tool includes a tool housing, a motor unit located in the tool housing, and an electronic module located in the tool housing. The electronic module includes (i) an electronic module housing having at least one housing component, and (ii) at least one printed circuit board. The at least one printed circuit board is at least partially decoupled relative to the at least one housing component of the electronic module housing.Type: GrantFiled: July 1, 2009Date of Patent: July 2, 2013Assignee: Robert Bosch GmbHInventors: Ulrich Single, Michael Maercker, Klaus Guenther, Martin Lohner, Klaus Dengler
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Patent number: 8462531Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.Type: GrantFiled: October 5, 2011Date of Patent: June 11, 2013Assignee: Hitachi, Ltd.Inventors: Fusanori Nishikimi, Kinya Nakatsu
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Publication number: 20130128645Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.Type: ApplicationFiled: January 17, 2013Publication date: May 23, 2013Applicant: Hitachi, Ltd.Inventor: Hitachi, Ltd.
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Publication number: 20130128646Abstract: A power conversion device includes: a cooling base 5 in which a flow passage 51 through which a cooling medium flows is formed and an opening portion 50 which is communicated with the flow passage 51 is formed; a power module 1; and a flow passage control portion 16b. The power module 1 has a bottomed cylindrical portion 13a in which a power semiconductor element is housed and which is inserted into the flow passage 51 through the opening portion 50, a flange portion 13b which is formed on an opening of the cylindrical portion 13a and is fixed to the cooling base 5 so as to close the opening portion 50, and a group of radiator fins 144 which are mounted on an outer peripheral surface of the cylindrical portion 13a with a gap of a predetermined distance formed between the flange portion 13b and the group of radiator fins 144.Type: ApplicationFiled: July 25, 2011Publication date: May 23, 2013Applicant: Hitachi Automotive Systems, Ltd.Inventors: Atsuo Nishihara, Kenichiro Nakajima, Keisuke Horiuchi
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Patent number: 8446726Abstract: A power semiconductor module includes a module housing with a sealing ring on its top side. The sealing ring, in co-operation with the module housing and a printed circuit board attached to the power semiconductor module, hermetically seals feed-through locations at the top side of the module housing for feeding through electric terminals of the power semiconductor module. On the bottom side of the module housing a sealing ring hermetically seals the bottom side of the module housing.Type: GrantFiled: October 28, 2010Date of Patent: May 21, 2013Assignee: Infineon Technologies AGInventors: Ralf Schloerke, Thilo Stolze
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Patent number: 8441827Abstract: A power converter assembly includes a housing and at least one transistor module. The housing has a liquid cooled heat transfer surface. The at least one transistor module is mounted directly to the liquid cooled heat transfer surface and positioned at least partially within the housing.Type: GrantFiled: March 11, 2010Date of Patent: May 14, 2013Assignee: Caterpillar Inc.Inventors: Thomas M. Baker, Robert R. Sychra, Keith E. Dixler, Jon N. Husser
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Publication number: 20130107601Abstract: An electric power converter for a renewable power source includes at least one alternating current (AC) conduit coupled to an external AC power device and at least one direct current (DC) conduit coupled to an external DC power device. The converter also includes at least one immersion structure defining at least one immersion cavity therein and a plurality of semiconductor devices. The semiconductor devices include a substrate positioned within the immersion cavity. The substrate defines a plurality of heat transfer surfaces thereon. The semiconductor devices also include at least one semiconductor die coupled to the substrate, the AC conduit, and the DC conduit. The converter further includes a liquid at least partially filling the immersion cavity such that the semiconductor die is fully immersed in and in direct contact with the liquid. Heat generated in the semiconductor device induces a phase change in the liquid.Type: ApplicationFiled: November 2, 2011Publication date: May 2, 2013Inventors: Robert Gregory Wagoner, Paul Stephen Pate, Allen Michael Ritter
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Publication number: 20130094269Abstract: A power conversion apparatus includes a smoothing capacitor module having a plurality of one and the other DC terminals arranged in a state of being laminated with each other, a flow channel forming body for forming a cooling medium flow channel that allows a cooling medium to flow along the capacitor module, and a plurality of power semiconductor modules each including a module case having a cooling surface, DC terminals projecting in one direction in a laminated state from the module case, and an AC terminal projecting in one direction from the module case. The power semiconductor modules are fixed to the flow channel forming body so that the cooling surface of the module case of the power semiconductor module is inserted into the cooling medium flow channel and comes into contact with the cooling medium flowing within the flow channel forming body.Type: ApplicationFiled: March 30, 2011Publication date: April 18, 2013Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.Inventors: Ken Maeda, Kenichiro Nakajima, Masamichi Kase
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Patent number: 8422235Abstract: The present invention provides a vehicle power module and a power converter including a power semiconductor element (328), a plurality of connecting conductors (371U, 372U, 373U) for transmitting current to the power semiconductor element (328), and a metallic base (304) upon which the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, and 373U) are mounted; and the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, and 373U) are mounted upon the metallic base (304) so as to form a looped current path. Desirably, the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, 373U) are arranged so as to form two or more looped current paths.Type: GrantFiled: July 30, 2009Date of Patent: April 16, 2013Assignee: Hitachi Automotive Systems, Ltd.Inventors: Katsunori Azuma, Mutsuhiro Mori, Kinya Nakatsu, Seiichi Hayakawa, Fusanori Nishikimi
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Patent number: 8422230Abstract: A power converter including a switching element, a switching power module containing a driving circuit for driving the switching element, a smoothing capacitor module for smoothing an input to the switching power module, and a heat sink for cooling the switching power module, wherein the switching power module is mounted on the heat sink, and the smoothing capacitor module is provided on a side surface of the heat sink.Type: GrantFiled: January 21, 2011Date of Patent: April 16, 2013Assignee: Honda Motor Co., Ltd.Inventors: Tsukasa Aiba, Hitoshi Saika, Yasuhiko Kondo
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Patent number: 8405992Abstract: A power-electronic arrangement comprising semiconductor components (102, 103, 107), a heat exchanger (110), and an electrically conductive element (109) is presented. The heat exchanger comprises evaporator channels (111) and condenser channels (112) for working fluid. The electrically conductive element comprises a contact surface providing a thermal contact to outer surfaces of walls of the evaporator channels for transferring heat from the electrically conductive element to the evaporator channels. A main current terminal of each semiconductor component is bonded to the electrically conductive element which thus forms a part of a main current circuitry of a power system. As the main current terminal is directly bonded to the electrically conductive element cooled with the heat exchanger, the temperature gradients inside the semiconductor components can be kept moderate, and thus the temperatures inside the semiconductor components can be limited.Type: GrantFiled: October 1, 2010Date of Patent: March 26, 2013Assignee: ABB Research Ltd.Inventors: Berk Yesin, Bruno Agostini, Christoph Haederli, Chunlei Liu, Francesco Agostini, Hamit Duran, Slavo Kicin
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Patent number: 8395897Abstract: There is provided an electrical power component attached to a chassis of an electrical power apparatus, including a semiconductor element constituting an electronic circuit, and cooling unit having a planar shape which cools the semiconductor element and serves as a reinforcing material for increasing strength of the chassis.Type: GrantFiled: November 19, 2009Date of Patent: March 12, 2013Assignee: Toshiba Mitsubishi-Electric Industrial Systems CorporationInventor: Yosuke Yamada
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Publication number: 20130051108Abstract: An electronic component cooling unit includes a housing having a flow path in an interior thereof, the flow path being configured to circulate a cooling medium; two surfaces, that is, a top surface and a bottom surface, provided at the housing and to which electronic components are mounted; side surfaces provided at the housing and surrounding the top surface and the bottom surface; a plurality of opening portions provided at the side surfaces and communicating with the flow path; and a closing member closing, among the plurality of opening portions, the opening portion or each opening portion other than the opening portions corresponding to a supply opening and a discharge opening for the cooling medium.Type: ApplicationFiled: August 30, 2012Publication date: February 28, 2013Applicant: KABUSHIKI KAISHA YASKAWA DENKIInventors: Toshio NAGAO, Tetsuya Ito
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Patent number: 8379424Abstract: A method for managing the temperature implemented in a speed controller that includes several modules, each including a case containing a power semiconductor that provides a pulsed voltage to an electrical load, each module being characterized by a junction temperature, a heat sink, and a temperature sensor mounted on the heat sink. The method for a module includes estimating a case temperature based on a predetermined thermal model of the sink, a temperature measured by the sensor and average power losses that the module undergoes, the predetermined thermal model of the sink integrating the thermal transfer impedances representing the thermal influence of one module on another and vice versa; determining a junction-case temperature based on the case temperature of the module and a limiting value of the junction temperature; and limiting the junction-case temperature obtained to a predetermined limiting value of the junction-case temperature.Type: GrantFiled: April 11, 2008Date of Patent: February 19, 2013Assignee: Schneider Toshiba Inverter Europe SASInventor: Petar Grbovic
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Patent number: 8376069Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.Type: GrantFiled: July 11, 2012Date of Patent: February 19, 2013Assignee: Hitachi, Ltd.Inventors: Kinya Nakatsu, Hideyo Suzuki, Fusanori Nishikimi, Takeshi Matsuo, Toshiya Satou
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Patent number: 8369067Abstract: An electricity feeding control device is provided with an air hole (31c) which is formed by penetrating a part of a peripheral wall of a body (31) constituting a part of a housing case (3). The housing case (3) is provided in its inside with an inner pressure adjusting sheet (5), formed with a breathable and waterproof member, and arranged so as to cover the air hole (31c) from the inside of the housing case (3). The air hole (31c) comprises a long recess (31c2) formed in an outer surface of the body (31), a communicating hole (31c1) consecutively formed in one end of a longi-tudinal direction of the recess (31c2) and communicated with an inner surface of the body (31), and a shielding plate (33) attached in the outer surface of the body (31) so as to cover a region other than the other end of the longitudinal direction of the recess (31c2), in a region of an opening section (31c3) of the recess (31c2).Type: GrantFiled: November 17, 2010Date of Patent: February 5, 2013Assignees: Panasonic Corporation, Toyota Jidosha Kabushiki KaishaInventors: Shinichi Nakamura, Kouji Kakiuchi, Tatsuya Mukai, Shiro Mori, Hirotoshi Watanabe, Naoki Fukuo, Yoji Minami, Kazuhiro Kondou
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Patent number: 8363408Abstract: The present invention provides an electronic device, comprising: a circuit board having at least one first heat-generating element and at least one second heat-generating element mounted thereon; a heat sink connected to said at least one first heat-generating element; a fan facing said heat sink; and an airflow guiding member placed between said fan and said heat sink for guiding the cooling air from said fan to said heat sink and said at least one second heat-generating element respectively.Type: GrantFiled: December 10, 2007Date of Patent: January 29, 2013Assignee: Danfoss Drives A/SInventor: Li Zheng
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Patent number: 8363412Abstract: An arrangement of a mother circuit board and daughter circuit boards in a power instrument improves current and voltage capabilities. A mother board is mounted to a base panel of an enclosure, and a number of daughter boards are attached to and extend from the mother board. Each daughter board has substantially identical circuitry and produces substantially the same amount of current. The daughter boards together provide a total output current equal to a sum of each individually generated current. The amount of power generated by the instrument can be increased by attaching additional daughter boards to the mother board. The total current produced by the daughter boards is provided to and output from the mother board via a low inductance output path. The low inductance output path ensures that a sudden increase in current does not result in a large voltage spike that adversely affects instrument operation.Type: GrantFiled: March 25, 2010Date of Patent: January 29, 2013Assignee: IXYS CorporationInventor: James Budai
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Patent number: 8355244Abstract: An electric power converter has a semiconductor module having a semiconductor element integrally and at least a pair of semiconductor terminals, a capacitor electrically connected to the semiconductor module, and a cooler that thermally contacts to at least one of a plurality of capacitor terminals provided in the capacitor. The capacitor terminals that thermally contact the cooler are arranged between the cooler and the capacitor.Type: GrantFiled: April 14, 2010Date of Patent: January 15, 2013Assignee: Denso CorporationInventors: Mitsunori Kimura, Yukitoshi Narumi, Masaya Tonomoto
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Publication number: 20120300525Abstract: An exemplary converter arrangement and method in connection with the arrangement includes a converter arranged in a closed container or similar structure. The container has a high voltage compartment and a low voltage compartment. The high voltage compartment includes a transformer connectable to a network to be supplied and the low voltage compartment includes the converter. The arrangement being configured to exchange heat from the high voltage compartment to the low voltage compartment and heating the low voltage compartment with losses of the transformer.Type: ApplicationFiled: May 29, 2012Publication date: November 29, 2012Applicant: ABB OyInventors: Timo Koivuluoma, Kari Kovanen, Juhani Helosvouri
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Patent number: 8310830Abstract: A frequency converter for driving a motor, includes a circuit board, having at least one first heat-generating element mounted thereon; a heat sink, connected to the at least one first heat-generating element; a fan, facing the heat sink; and a bracket, for positioning the at least one heat-generating element relative to the heat sink and the circuit board. The frequency converter includes a separating member for separating at least one portion of at least one second heat-generating element from the circuit board to prevent the cooling air guided to the at least one second heat-generating element from flowing to the circuit board. The frequency converter includes an airflow guiding member for guiding the cooling air from the fan to the heat sink and the at least one second heat-generating element and a flow guiding gate dispensing more airflow to the region corresponding to the at least one first heat-generating element.Type: GrantFiled: December 10, 2007Date of Patent: November 13, 2012Assignee: Danfoss Drives A/SInventors: Li Zheng, Elvir Redzepovic, Henrik Rosendal Andersen
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Publication number: 20120275205Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.Type: ApplicationFiled: July 11, 2012Publication date: November 1, 2012Applicant: Hitachi, Ltd.Inventors: Kinya NAKATSU, Hideyo Suzuki, Fusanori Nishikimi, Takeshi Matsuo, Toshiya Satou
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Patent number: 8300439Abstract: Method and apparatus for monitoring, measuring and recording the operating values of each of a plurality of inter-connected AC PV modules and performing a diagnostic analysis, including comparing the those operating values to each other and to operating values recorded at an earlier time to determine laminate degradation and the performance-attenuating effect of temperature, soiling, shading, and snow cover on the modules.Type: GrantFiled: February 27, 2008Date of Patent: October 30, 2012Assignee: GreenRay Inc.Inventors: Ruel Davenport Little, Zachary Adam King
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Patent number: 8295049Abstract: A power converter design is disclosed with a novel approach to thermal management which enhances the performance and significantly reduces the cost of the converter compared to prior art power converters. The invention minimizes the heating of one power component by another within the power converter and therefore enables the power converter to work at higher power levels. Essentially, the power converter uses a heatsink having a high length to width ratio, a linear array of power components thermally coupled to the heatsink parallel to the long axis of the heatsink and a heat removal system which produces the highest cross sectional thermal flux perpendicular to said long axis. In addition, a number of ancillary thermal management techniques are used to significantly enhance the value of this basic approach.Type: GrantFiled: May 27, 2011Date of Patent: October 23, 2012Assignee: Renewable Power Conversion, Inc.Inventor: Richard Travis West
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Patent number: 8295048Abstract: An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.Type: GrantFiled: December 20, 2010Date of Patent: October 23, 2012Assignee: Flextronics AP, LLCInventors: Bahman Sharifipour, Arian Jansen
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Publication number: 20120262969Abstract: A power converting apparatus includes a housing, a self-standing cable, and a grommet securing member. The housing includes a housing base, a main body, and an air duct. The housing base includes a through hole. The main body includes a plurality of electronic components on a first surface of the housing base. The air duct is disposed on a second surface of the housing base. The self-standing cable is disposed through the through hole so as to be wired between the main body and the air duct. The self-standing cable stands on itself in a direction approximately orthogonal to the housing base. The grommet securing member is disposed in the air duct or the main body so as to secure a grommet to the through hole. The grommet securing member is not integral with the housing base.Type: ApplicationFiled: April 17, 2012Publication date: October 18, 2012Applicant: KABUSHIKI KAISHA YASKAWA DENKIInventors: Sumiaki NAGANO, Kazutaka Kishimoto, Makoto Kojyo
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Publication number: 20120262968Abstract: A power converting apparatus includes a housing, a cable, and a grommet supporting member. The housing includes a housing base, a main body, and an air duct. The housing base has a first surface and a second surface and includes a through hole. The main body includes a plurality of electronic components on the first surface of the housing base. The air duct is disposed on the second surface of the housing base, and cooling air flows through the air duct. The cable is disposed through the through hole of the housing base so as to be wired between the main body and the air duct. The grommet supporting member is in the air duct or the main body. The grommet supporting member supports a grommet through which the cable is disposed. The grommet supporting member is not integral with the housing base.Type: ApplicationFiled: April 12, 2012Publication date: October 18, 2012Applicant: KABUSHIKI KAISHA YASKAWA DENKIInventors: Sumiaki NAGANO, Kazutaka Kishimoto, Makoto Kojyo
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Patent number: 8289709Abstract: A housing includes a first chamber having an exhaust aperture to provide fluid communication with an outside environment, a wall disposed in the first chamber and containing an electrical component, wherein a thermal energy generated by the electrical component is transferred from the first chamber to the outside environment through the exhaust aperture, a second chamber formed adjacent the first chamber and including a control means for the electrical component, and a means for selectively providing access to the first chamber and the second chamber.Type: GrantFiled: October 19, 2010Date of Patent: October 16, 2012Assignee: Nextronex Inc.Inventors: David Feltner, David E. Olin, Peter Gerhardinger, Richard Ashton
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Patent number: 8284553Abstract: A power supply device includes a transformer and a heat-dissipating mechanism. The heat-dissipating mechanism includes a heat-dissipating fan unit and an activating unit. The heat-dissipating fan unit is connected pivotally to the transformer, and is pivotable relative to the transformer to lie on a top surface of the transformer. An inclination angle of the heat-dissipating fan unit relative to the top surface of the transformer is adjustable. The activating unit includes a control switch for controlling activation of the heat-dissipating fan unit.Type: GrantFiled: August 23, 2010Date of Patent: October 9, 2012Assignee: Wistron CorporationInventors: Wen-Chieh Cheng, Hsin-Hao Chen, Kuang-Hung Chen
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Publication number: 20120253571Abstract: An inverter for use in an electric vehicle includes a plurality of elements to convert direct current power to alternating current power, first and second heat sinks to absorb heat within the inverter, the first heat sink including a first cooling fluid passage therein to allow cooling fluid to pass through and exchange heat with the first heat sink, and the second heat sink including a second cooling fluid passage therein to allow cooling fluid to pass through and exchange heat with the second heat sink, wherein the first heat sink is disposed to exchange heat with at least one element of the inverter, and the second heat sink is disposed to exchange heat with the first heat sink. With the configuration, it may be possible to cool the components as well as collecting thermal energy to be used in heating.Type: ApplicationFiled: September 12, 2011Publication date: October 4, 2012Inventors: Junbo Yun, Jaeseok Oh, Heeseok Jeong, Junggi Lee, Sunkyoung Lim
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Patent number: 8248771Abstract: A power supply of personal computers equipped with a modular conversion circuit comprises a main circuit board, a conversion module board, a first conversion circuit and a first module slot located on the main circuit board, and a second conversion circuit and a second module slot located on the conversion module board. The first conversion circuit converts an input power to generate at least one output power. The first module slot outputs the output power. The second conversion circuit converts the output power and generates at least one conversion power. The second module slot outputs the conversion power to allow at least one external element to respectively electrically connect to the first module slot and the second module slot according to power requirement.Type: GrantFiled: January 19, 2010Date of Patent: August 21, 2012Assignee: Sea Sonic Electronics Co., Ltd.Inventor: Hsiu-Cheng Chang
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Publication number: 20120206950Abstract: A power electronics inverter includes a housing which forms a cold plate with coolant passages. The housing encloses an insulated gate bipolar transistor (IGBT), and a DC Link capacitor. The capacitor comprises a bus-bar which exits from a bottom side of the capacitor, and the bus-bar is positioned adjacent to the cold plate. The cold plate forms a cooling passage which underlies the IGBT and the capacitor bus-bar. Thermally conductive gap pads are located between the capacitor bus-bar and the cold plate.Type: ApplicationFiled: February 11, 2011Publication date: August 16, 2012Inventors: Jeffrey Scott Duppong, David Michael Loken, Erich Joel Drees
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Patent number: 8243447Abstract: A power conversion apparatus includes a casing and an inverter unit housed in the casing. The inverter unit includes a unit case, a capacitor block removably provided at a position on an inner side of a detachable side plate of the unit case, and a fan block placed in the unit case in such a manner as to be removable from a front side. The capacitor block includes a capacitor case having a plurality of capacitor insertion holes, a plurality of electrolytic capacitors placed in the capacitor insertion holes, respectively, and a laminated bus bar connected to the electrolytic capacitors. The fan block includes a fan case and a cooling fan provided in the fan case.Type: GrantFiled: August 4, 2010Date of Patent: August 14, 2012Assignee: Kabushiki Kaisha Yaskawa DenkiInventors: Toshiaki Fujiki, Sumiaki Nagano, Tomohiro Shigeno
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Patent number: 8243446Abstract: A DC to AC inverter used in a solar cell power system can include an improved control scheme for cooling itself and optimizing power output.Type: GrantFiled: March 11, 2010Date of Patent: August 14, 2012Assignee: First Solar, Inc.Inventor: Christopher Thompson
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Patent number: 8243451Abstract: A cooling member for withdrawing heat from a heat containing device is disclosed. The cooling member can have a housing with a fluid inlet, a fluid outlet and a plurality of irregular-shaped fins located at least partially therewithin. In addition, a plurality of irregular-shaped and hierarchical branched fluid pathways can be located between the plurality of fins and the housing and/or the plurality of fins can be in physical contact with the heat containing device.Type: GrantFiled: June 8, 2010Date of Patent: August 14, 2012Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Ercan Mehmet Dede, Brian Joseph Robert, Serdar H. Yonak
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Patent number: 8240411Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.Type: GrantFiled: May 29, 2009Date of Patent: August 14, 2012Assignee: Hitachi, Ltd.Inventors: Kinya Nakatsu, Hideyo Suzuki, Fusanori Nishikimi, Takeshi Matsuo, Toshiya Satou
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Patent number: 8238131Abstract: A method in connection with a frequency converter and a frequency converter, the frequency converter being arranged for periodic recurrent use. The method comprises steps for generating and storing in a memory an average heating of a power semiconductor of the frequency converter, caused by one loading period, determining a temperature limit from the generated heating and the highest allowed temperature of the power semiconductor, determining the temperature of the power semiconductor in the frequency converter, and changing the operation mode of the frequency converter when the temperature of the power semiconductor exceeds the temperature limit when transferring to a loading period.Type: GrantFiled: December 13, 2006Date of Patent: August 7, 2012Assignee: ABB OyInventors: Ari Hedemäki, Vesa Tiihonen
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Patent number: 8228700Abstract: Connection portions (225UP through 225WP) to which upper arm control terminals (320UU through 320UW) are connected are disposed at a first edge portion of a drive circuit board (22). And connection portions (225UN through 225WN to which lower arm control terminals (320LU through 320LW) are connected are disposed at a second edge portion of the drive circuit board (22). Upper arm implementation regions (227UP through 227WP), lower arm implementation regions (227UN through 227WN), and a low voltage pattern region (228) in which photo-couplers (221U through 221W) are implemented are formed in the board region between these board edge portions. And signal wiring (40U) that transmits a control signal from a photo-coupler (221U) to an implementation region (227UN) is formed in a conductor layer that is a lower layer than the conductor layer in the lower arm implementation region in which the lower arm driver circuit is implemented.Type: GrantFiled: July 30, 2009Date of Patent: July 24, 2012Assignee: Hitachi Automotive Systems, Ltd.Inventors: Koichi Yahata, Masashige Tsuji, Yoshio Akaishi
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Patent number: 8228694Abstract: A converter station an element adapted to determine a value of an actual temperature of any critical component of the station and an element adapted to determine a value of an actual temperature of any media used to cool the critical component. An arrangement is adapted to utilize these temperature values and information about actual cooling capacity of any cooling equipment present to cool the critical component and information about the thermal behavior of the critical component and the possible cooling media upon a possible change of the power actually transmitted through the station in a mathematical model for calculating the present overload capabilities of the converter station for use in the control of converters of the station upon a possible request of utilizing an overload capability of the station.Type: GrantFiled: June 15, 2006Date of Patent: July 24, 2012Assignee: ABB Technology Ltd.Inventors: Ulf Radbrant, Bernt Bergdahl
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Patent number: 8199505Abstract: A jet impingement heat exchanger includes an inlet jet, a target layer, a second layer, a transition channel, and a fluid outlet. The target layer includes an impingement region and a plurality of target layer microchannels that radially extend from the impingement region. The jet of coolant fluid impinges the target layer at the impingement region and flows through the radially-extending target layer microchannels toward a perimeter of the target layer. The second layer includes a plurality of radially-extending second layer microchannels. The transition channel is positioned between the target layer and the second layer to fluidly couple the second layer to the target layer. The coolant fluid flows through the transition channel and the plurality of radially-extending second layer microchannels. The fluid outlet fluidly is coupled to the second layer. Jet impingement exchangers may be incorporated into a power electronics module having a power electronics device.Type: GrantFiled: September 13, 2010Date of Patent: June 12, 2012Assignee: Toyota Motor Engineering & Manufacturing Norh America, Inc.Inventor: Ercan Mehmet Dede
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Publication number: 20120140539Abstract: The present invention provides a modular circuit card configuration for distributing heat among a plurality of circuit cards. Each circuit card includes a housing adapted to dissipate heat in response to gas flow over the housing. In one aspect, a gas-cooled inverter includes a plurality of inverter circuit cards, and a plurality of circuit card housings, each of which encloses one of the plurality of inverter cards.Type: ApplicationFiled: December 6, 2011Publication date: June 7, 2012Applicant: UT-BATTELLE, LLCInventor: Madhu Sudhan Chinthavali
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Patent number: 8189324Abstract: A power electronic assembly includes a pair of thermally and electrically conductive plates, and semiconductor switching elements positioned between contact surfaces of the pair of conductive plates. A first of the semiconductor switching elements is positioned at a first region of the conductive plates, and a second of the semiconductor switching elements positioned at a second region of the conductive plates. At least one of the conductive plates includes an aperture positioned between the first region and the second region of the conductive plates, such that in a compressed state, a contact surface of the conductive plate associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression.Type: GrantFiled: December 7, 2009Date of Patent: May 29, 2012Assignee: American Superconductor CorporationInventor: Douglas C. Folts
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Publication number: 20120127770Abstract: A solar AC power generation apparatus is provided such that it can be conveniently installed in accordance with a required power generation amount because utility power can be drawn from each solar cell panel having a predetermined generation capacity. The solar AC power generation apparatus includes: a solar cell panel comprising a plurality of cells arranged in a certain pattern and serially connected to each other in units of two or more cells, upper and lower sheets protecting the plurality of cells from the outside, a transparent resin filled between the sheets, and an edge frame installed along the circumference of the edges of the sheets; an external terminal box fixed to the solar cell panel and for drawing out the DC power of a solar cell module including a plurality of cells connected in series; and an inverter device for converting the DC power drawn from the external terminal box into AC power and outputting the AC power.Type: ApplicationFiled: July 2, 2010Publication date: May 24, 2012Applicant: TOPSUN CO., LTD.Inventor: Hyoung-Gurn Kim
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Patent number: 8179705Abstract: A power subsystem is actively optimized to improve total subsystem efficiency in a way that is responsive to changes in load requirements, power supply variations, and subsystem temperature variations. Detailed, multidimensional power loss models are developed for constituent devices which are then combined into a power subsystem containing a controller and circuity for measuring device operating parameters such as input and output voltage, output current, and temperature. Operating parameters are continually monitored, and set points are correspondingly changed based on the detailed power loss models to achieve maximum overall efficiency for the instantaneous operating state of the system.Type: GrantFiled: May 27, 2008Date of Patent: May 15, 2012Assignee: Power-One, Inc.Inventor: Alain Chapuis
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Patent number: 8169779Abstract: Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.Type: GrantFiled: December 15, 2009Date of Patent: May 1, 2012Assignee: GM Global Technology Operations LLCInventors: Khiet Le, Terence G. Ward, Brooks S. Mann, Edward P. Yankoski, Gregory S. Smith
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Publication number: 20120075901Abstract: Embodiments of the present invention provide novel techniques for cooling power conversion circuitry. In particular, a geothermal conditioning system may be used that includes a ground loop heat exchanger. The ground loop heat exchanger may pump heat from the power conversion circuitry into the ground in order to cool the power conversion circuitry. The ground loop heat exchanger may also extract heat from the ground and direct the heat into the power conversion circuitry in order to heat the power conversion circuitry. The geothermal conditioning system may also include a surface loop heat exchanger and combine the cooling and heating abilities of both the ground loop and surface loop heat exchangers in order to improve energy efficiency.Type: ApplicationFiled: September 29, 2010Publication date: March 29, 2012Applicant: Rockwell Automation Technologies, Inc.Inventors: Abdolmehdi Kaveh Ahangar, Scott D. Day
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Publication number: 20120069619Abstract: A power converter module for use alone or with other modules in a multiphase power converter. The power converter module has an enclosure that surrounds internal components to prevent radiation of electromagnetic energy, which internal components also limit conduction of electromagnetic energy. The internal components include an EMI filter, a ripple filter, a power converter, and a control interface that communicates with a control system of a power conversion system. The control interface includes a memory that stores information related to the power converter modules so as to improve interchangeability of similar power modules with the multiphase power converter.Type: ApplicationFiled: November 14, 2011Publication date: March 22, 2012Applicant: NORTHERN POWER SYSTEMS, INC.Inventors: Christopher Samuel Badger, Kiran Kumar Kulihithalu Channakeshava, Shazreen Meor Danial, Stephen Paul Hoskins, Jeffrey K. Petter
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Patent number: 8134836Abstract: A packaged heat dissipating assembly for an intermediate bus converter (IBC) has a frame being mounted on and around the IBC and a heat sink being mounted on the frame. The packaged heat dissipating assembly is easily detached from the IBC. Therefore, a broken bus converter module (BCM) or heat sink is easily replaced separately. Consequently, heat dissipating designs and maintenance of a server or communication equipment is facilitated and maintenance costs of the IBC and the server or communication equipment are lowered.Type: GrantFiled: July 29, 2009Date of Patent: March 13, 2012Assignee: ACBEL Polytech Inc.Inventors: Chung-Yu Tsai, Bo-Hao Lin, Yu-Kun Sun
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Patent number: 8107241Abstract: In a conventional cooling device, a heat pipe or a circulation-type liquid cooler provided with a pump is used and therefore, a large space is needed for the cooling device. There is provided a cooling device which includes a plurality of cooling modules having cooling units for cooling heat-generating elements by coolant and radiation units for radiating heat from the coolant heated in the cooling units, the plurality of cooling modules being bubble-pump-type ones in which the coolant is circulated between the radiation units and the cooling units by the coolant being boiled in the cooling units, the radiation units being arranged side by side, and a cooling fan for generating wind blowing the radiation units.Type: GrantFiled: March 31, 2006Date of Patent: January 31, 2012Assignee: Mitsubishi Electric CorporationInventors: Tetsuya Takahashi, Kazuyoshi Toya, Akihiro Murahashi, Yasushi Nakayama, Shigetoshi Ipposhi, Kenichi Hayashi