With Cooling Means Patents (Class 363/141)
  • Patent number: 9433125
    Abstract: A heat-dissipating type of power converter comprises a support unit, at least one power module, at least one pair of rails and at least one main air duct module corresponding to the at least one power module. The pair of rails are fixed to the support unit and parallel to each other. The power module comprises a mounting plate module, a power unit and a radiator. wherein the power unit is fixed to the radiator, and the mounting plate module and the radiator are fixedly connected to each other. the main air duct module is fixed to the support unit and provided between the pair of rails, a second opening is defined in a side of the main air duct module toward the power module. The power module is assembled with or disassembled from the main air duct module by sliding along the pair of rails.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: August 30, 2016
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Kaitian Yan, Bagao Li, Xu Wang
  • Patent number: 9318882
    Abstract: An inverter device has an inverter stack and a switchboard housing the inverter stack. The inverter stack has an output relay bar connected to an output terminal thereof, and a lower frame configuring a bottom portion and formed from a plurality of frame members connected to form each side of a cuboid. The lower frame is formed such that the frame members configuring one side of a four-sided frame being penetrated by the output relay bar are formed of a non-magnetic body.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: April 19, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Toshihiro Yoshida, Tomokazu Yoshikawa
  • Patent number: 9276499
    Abstract: A method for operating an electrical circuit is described. The electrical circuit is equipped with a power converter (10) that has at least one series connection (11, 12, 13) consisting of at least four power semiconductor elements. The electrical circuit is equipped with at least one capacitor (Cd1, Cd2) connected in parallel to the series connection (11, 12, 13). In the power converter (10), at least one resistor has been connected in parallel to the middle two power semiconductor elements. In the method, at least one of the power semiconductor elements is conductively connected and in this way a discharging current is generated from the capacitor (Cd1, Cd2) through the conductively connected power semiconductor element and the resistor.
    Type: Grant
    Filed: April 18, 2013
    Date of Patent: March 1, 2016
    Assignee: GE Energy Power Conversion GMBH
    Inventors: Roland Jakob, Piotr Sadowski
  • Patent number: 9220179
    Abstract: In one embodiment, a power cell chamber for a drive system includes moveable and fixed portions. The moveable portion includes a rectifier stage to rectify an input signal received from a secondary winding of a transformer to provide a rectified signal and an inverter stage having a plurality of switching devices to receive a DC signal and output an AC signal. This moveable portion can be slidably adapted within a cabinet of the drive system. In turn, the fixed portion includes a DC link having at least one capacitor to receive the rectified signal and provide the DC signal to the inverter stage.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: December 22, 2015
    Assignee: TECO-Westinghouse Motor Company
    Inventors: Enrique Ledezma, Thomas Keister, Mehdi Abolhassani, Ryan Edwards, Alex Skorcz, Randall Pipho, Srinivas Satumahanti
  • Patent number: 9160237
    Abstract: An electric power converter has a switching circuit section, a transformer, a rectifier, and a noise filtering element. The rectifier is connected to a secondary coil of the transformer. A closed circuit where the noise current flows is formed by the secondary coil, the rectifier, and the noise filtering element. The transformer and the noise filtering element are disposed in a position next to each other. The secondary coil and the noise filtering element are electrically connected to each other through a terminal for a coil that is a terminal of the secondary coil and a terminal for a filter that is a terminal of the noise filtering element. The terminal for the coil and the terminal for the filter are disposed in a position between the transformer and the noise filtering element.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: October 13, 2015
    Assignees: DENSO CORPORATION, NIPPON SOKEN, INC.
    Inventors: Hideki Itou, Yuuichi Handa, Yuji Hayashi
  • Patent number: 9156106
    Abstract: A flange section 12b protruding in a radial direction of a ball screw shaft 6a is formed at a lower end portion of the ball screw shaft 6a, and a protrusion stopper 12a which abuts on the flange section 12b to prevent the ball screw shaft 6a from protruding out of the rod 7 is formed in a hollow section of the rod 7. On the lower side of the hollow section of the rod 7, there is formed a retraction stopper 13a which abuts on a lower end portion 13b of the ball screw shaft 6a to limit the retraction of the rod 7.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: October 13, 2015
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Koichi Matsumoto, Teruaki Kobayashi, Hiroshi Miwa
  • Patent number: 9136745
    Abstract: A side cover 82 which covers a side surface portion of an electric motor 7 is formed of a resin, and a lubricant is ejected from plural ejecting holes 95 of an oil path 90 formed in the side cover 82 to a stator 71 of the electric motor 7 so as to cool the stator.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: September 15, 2015
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Teruo Nagahama, Norikazu Kawai, Heisuke Kobayashi, Shinji Fujimoto, Atsuhiro Sakai, Seiichi Mogi, Hironori Mito
  • Patent number: 9122737
    Abstract: Methods, systems, and products are provided for monitoring the temperature of a high powered computing component. The high powered computing component has a thermal sensor and the high powered computing component in thermal communication with a liquid cooled heatsink. Embodiments include determining, by a thermal monitoring module, a temperature of the thermal sensor; determining, by the thermal monitoring module, a temperature of the heatsink; determining, by the thermal monitoring module, a power delivered to the high powered computing component; and calculating, by the thermal monitoring module, a thermal value in dependence upon the temperature of the thermal sensor, the temperature of the heatsink, and the power delivered to the high powered computing component.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: September 1, 2015
    Assignee: International Business Machines Corporation
    Inventors: David L. Darrington, Adam C. Emerich, Michael J. Fedor, Raymond K. Shokes
  • Patent number: 9122736
    Abstract: Methods, systems, and products are provided for monitoring the temperature of a high powered computing component. The high powered computing component has a thermal sensor and the high powered computing component in thermal communication with a liquid cooled heatsink. Embodiments include determining, by a thermal monitoring module, a temperature of the thermal sensor; determining, by the thermal monitoring module, a temperature of the heatsink; determining, by the thermal monitoring module, a power delivered to the high powered computing component; and calculating, by the thermal monitoring module, a thermal value in dependence upon the temperature of the thermal sensor, the temperature of the heatsink, and the power delivered to the high powered computing component.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: September 1, 2015
    Assignee: International Business Machines Corporation
    Inventors: David L. Darrington, Adam C. Emerich, Michael J. Fedor, Raymond K. Shokes
  • Patent number: 9106156
    Abstract: Among first IGBTs and first MOSFETs, a transistor arranged near a first gate control circuit gives, through a gate thereof, a gate control signal supplied from the first gate control circuit to a gate of a transistor arranged at a position farther from the first gate control circuit. Among second IGBTs and second MOSFETs, a transistor arranged near a second gate control circuit gives, through a gate thereof, a gate control signal supplied from the second gate control circuit to a gate of a transistor arranged at a position farther from the second gate control circuit.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: August 11, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tomofumi Tanaka, Toru Iwagami
  • Patent number: 9099933
    Abstract: An AC-to-AC-converter for converting a first frequency AC-voltage to a second frequency AC-voltage is disclosed. The converter includes: a first converter section which includes a first input terminal, a second input terminal, a first DC-output node, and a second DC-output node; a second converter section which includes a first DC-input node connected to the first DC-output node, a second DC-input node connected to the second DC-output node, and at least two second output terminals; a DC-link overvoltage clamp which is coupled between the first DC-output node and the second DC-output node; and a capacitor system. The first converter section, the second converter section, the DC-link overvoltage clamp, and the capacitor system are integrated into one assembly.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: August 4, 2015
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventor: Rodney Jones
  • Patent number: 9089072
    Abstract: Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: July 21, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Ki Lee, Kwang Soo Kim, Bum Seok Suh, Chang Seob Hong, Joon Seok Chae
  • Patent number: 9066454
    Abstract: The invention relates to an inverter with an enclosure that includes a removable hand plug which, when inserted inside the enclosure, shares an electrical connection with the inverter. The hand plug includes a fan configured to cool at least a portion of the inverter enclosure.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: June 23, 2015
    Assignee: SMA Solar Technology AG
    Inventors: Andreas Donth, Thorsten Hobein, Bernd Gebert
  • Patent number: 9054628
    Abstract: There is provided a power inverter that fixes a connector in which a DC-side connector and an AC-side connector are mechanically combined to a casing in which a power semiconductor module converting a DC current into an AC current is housed, a positive-side DC terminal and a negative-side DC terminal are arranged to be aligned along one side, which is formed in the widthwise direction, of one side face of the casing, and a U-phase side terminal, a V-phase side terminal, and a W-phase side terminal are arranged to be aligned along one side, which is formed in the longitudinal direction, of one side face of the casing.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: June 9, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventor: Yuta Numakura
  • Patent number: 9042112
    Abstract: A converter power unit comprises: a heat sink; n power switch modules on the heat sink; a first group of laminated bus bars comprising a first and a second bus bar; a capacitor group comprising m capacitor; a second group of laminated bus bars comprising a third and a fourth bus bar, the first bus bar is connected with the third bus bar, the second bus bar is connected with the fourth bus bar; providing that vertical projection areas projected by an area occupied by the n power switch modules and projected by the capacitor group on a first plane perpendicular to an axial direction of the capacitor group are defined as a first and a second projection areas respectively, the first and the second projection area have an overlapped area. The present application can reduce the stray inductances in the commutating loop of the converter.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: May 26, 2015
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei Guan, Jian Jiang, Bagao Li, Kaitian Yan, Hongyang Wu
  • Patent number: 9042147
    Abstract: A power inverter includes a power semiconductor module that includes a power semiconductor device, a control circuit board that outputs a control signal used for controlling the power semiconductor device, a driver circuit board that outputs a driving signal used for driving the power semiconductor device, a conductive metal base plate arranged in a space between the driver circuit board and the control circuit board in which a fine and long opening portion is formed, wiring that connects the driver circuit board and the control circuit board through the opening portion and delivers the control signal to the driver circuit board, and an AC busbar that is arranged on a side opposite to the metal base plate through the driver circuit board and delivers an AC current output from the power semiconductor module to a drive motor. At least a portion of the AC busbar that faces the opening portion extends in a direction directly running in a longitudinal direction of the fine and long opening portion.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: May 26, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Akira Ishii, Keisuke Fukumasu
  • Publication number: 20150131353
    Abstract: According to one embodiment, a power supply device includes a main circuit board including a switching circuit, a transformer board opposite the main circuit board and including a transformer, and an intermediate cooling plate between the main circuit board and the transformer board and configured to cool at least one of a heat-producing element of the switching circuit and the transformer.
    Type: Application
    Filed: July 22, 2014
    Publication date: May 14, 2015
    Inventor: Yuji Nakajima
  • Patent number: 9030822
    Abstract: A cooling system is operable to facilitate cooling a power module or other electronic assembly. The cooling system may be configured to facilitate cooling a DC/AC inverter or other electronic assembly where two power modules may be arranged in an opposing relationship relative to a coolant passageway. The opposing relationship may be suitable to minimizing a packaging size and footprint required to facilitate interacting both power modules with the coolant flow.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: May 12, 2015
    Assignee: Lear Corporation
    Inventors: Nadir Sharaf, Yu Qin, Reshma Rathod, Richard J. Hampo
  • Patent number: 8995128
    Abstract: A power conversion apparatus according to an embodiment includes a case that can be provided on a mounting wall surface and places therein an electric reactor and a power conversion board for performing power conversion between a predetermined power generator and a commercial electric power system. The case is sectioned into a central area and first and second side areas that sandwich the central area therebetween. The electric reactor is arranged in the central area.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: March 31, 2015
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventor: Yasunori Yamanaka
  • Patent number: 8995133
    Abstract: An electrical connection assembly includes a metal housing and an electrical module having a plurality of electrical components mounted on a component base. The base is supported on the housing. A socket conducts electrical current from a pin of a cable to the electrical components. A heat sink member conducts heat directly from the socket to the metal housing. An electrically insulating thermally conducting pad is positioned between the housing and an end of the heat sink member. A current sensor has a cylindrical body which surrounds a portion of the socket.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: March 31, 2015
    Assignee: Deere & Company
    Inventors: Andrew D. Wieland, Kevin B. Larsen, John N. Oenick, Gregory K. Harmelink, Neal D. Clements
  • Patent number: 8988861
    Abstract: The power converter includes a power conversion section which configures a circuit for power conversion, a power bus bar extending from the power conversion section, a terminal block, and a current sensor measuring current flowing in the power bus bar. The terminal block includes a mounting surface to which a terminal portion of the power bus bar is mounted. The mounting surface faces a direction substantially perpendicular to an arrangement direction in which the power conversion section and the terminal block are arranged. The current sensor is located at a side of a bottom surface on the opposite side of the mounting surface in the terminal block. The power bus bar includes: a sensor-surrounded portion surrounded by the current sensor; and an outer surface faced portion located between the sensor-surrounded portion and the terminal portion along an outer surface on the opposite side of the power conversion section.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: March 24, 2015
    Assignee: Denso Corporation
    Inventor: Akio Yokota
  • Patent number: 8971038
    Abstract: A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface thereof. The raised features are configured for attaching the main portion to a printed circuit board having multiple electronic components attached thereto. The raised features are further configured for maintaining the printed circuit board in a spaced relation relative to the main portion to facilitate air flow between the printed circuit board and the main portion for dissipating heat generated by the plurality of electronic components. The coldplate also includes a protrusion extending from the surface of the main portion. The protrusion is configured for contacting one of the plurality of electronic components attached to the printed circuit board for dissipating heat generated by the electronic component.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: March 3, 2015
    Assignee: Lear Corporation
    Inventors: Nadir Sharaf, Dilip Daftuar, George Kaminski, Venkat Yalamanchili, Richard J. Hampo
  • Patent number: 8971041
    Abstract: A coldplate for use with an inverter in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The inverter includes a direct current (DC) link capacitor comprising multiple film capacitors configured in a stack. The coldplate includes a first portion configured for attachment to at least one electronic component, the first portion having a perimeter and for dissipating heat generated by the electronic component. The coldplate includes a second portion oriented along the perimeter of the first portion and forming a conduit, the conduit having a chamber extending from the perimeter of the first portion and between two of the plurality of film capacitors of the DC link capacitor. The conduit has an inlet and an outlet to facilitate circulation of a coolant through the chamber of the conduit for dissipating heat generated by the DC link capacitor.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: March 3, 2015
    Assignee: Lear Corporation
    Inventors: Nadir Sharaf, Slobodan Pavlovic, Dilip Daftuar, Juan Lopez
  • Patent number: 8964387
    Abstract: A power converter arrangement has two static switching element bridges that are alternatively operable and comprise static switching elements. The power converter arrangement has one housing that houses the two static switching element bridges; the housing has one cooling system for the static switching element bridges housed therein.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: February 24, 2015
    Assignee: Alstom Technology Ltd.
    Inventors: Carsten Meinecke, Frank Furch
  • Patent number: 8964437
    Abstract: An energy dissipating device configured to connect to a power supply and to dissipate excess energy from a direct current (DC) rail in response to a change in power supply settings or operating characteristics. The energy dissipating device is connected to the DC rail, which conducts current generated by an AC/DC converter to at least one DC/DC converter. When power demand to the DC/DC converter is reduced, the DC/DC converter generates a supplemental current surge on the DC rail. A rail current monitor monitors the current level on the DC rail and generates the DC rail power signal indicative of the supplemental current surge level generated by the at least one DC/DC converter. The supplemental surge current is used to control dissipative elements connected across the DC rail to modulate a current sink path across the DC rail to dissipate the excess energy from the DC rail.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: February 24, 2015
    Assignee: Keysight Technologies, Inc.
    Inventors: Peyman Safa, Michael J. Benes, Marko Vulovic
  • Publication number: 20150049533
    Abstract: In a power converter, cooling of the power converter is extremely important for improving a power conversion performance. Specifically, a DC smoothing capacitor module stored in a housing of the power converter is heat-sensitive, and in order to secure the performance, efficient cooling of the capacitor module is required. In addition, reducing the heat entering from the outside as much as possible is required. A conductor panel of the capacitor module and the housing are connected via a cooling panel, an AC connection bus bar and the housing is connected by the cooling panel to release heat from the capacitor module and the AC connection bus bar to the housing via the cooling panel.
    Type: Application
    Filed: January 21, 2013
    Publication date: February 19, 2015
    Inventors: Fusanori Nishikimi, Kenji Ohshima
  • Patent number: 8958225
    Abstract: An electric power converter has a semiconductor module that has a switching element therein, cooling pipes that contact with heat radiating surfaces of the semiconductor module and cool the semiconductor module, and a capacitor module formed by sealing a capacitor element therein by a potting material. A piled unit is formed by piling the semiconductor module and the cooling pipes. A direction in which the semiconductor module and the cooling pipes are piled is defined as a piling direction. The piled unit is sandwiched between the capacitor module disposed in a first end side in the piling direction of the piled unit and a pressing member disposed in a second end side in the piling direction of the piled unit. The first end of the piled unit is contacted to a potting surface that is a surface of the potting material in the capacitor module.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: February 17, 2015
    Assignee: Denso Corporation
    Inventors: Hiromi Ichijo, Shoji Sakai
  • Publication number: 20150016171
    Abstract: The present invention equalizes the temperatures of semiconductor elements and efficiently cools the semiconductor elements in a lightweight device configuration, by optimally combining the configurations of heat radiation fins in accordance with the configuration of the semiconductor elements. A traction converter includes plural semiconductor elements included in a traction converting circuit and a cooler to radiate heat from the plural semiconductor elements to outside air, the cooler including a heat receiving block, plural heat pipes and plural heat radiation fins, the plural semiconductor elements being arrayed on one surface of the heat receiving block, heat receiving parts of the plural heat pipes being buried in the opposite surface of the heat receiving block, heat radiation parts of the plural heat pipes being erectly provided so as to protrude from the heat receiving block, the plural heat radiation fins being joined to the heat radiation parts.
    Type: Application
    Filed: July 9, 2014
    Publication date: January 15, 2015
    Inventors: Yosuke Yasuda, Sunao Funakoshi, Takeshi Tanaka, Shuichi Terakado
  • Patent number: 8922997
    Abstract: Semiconductor element groups constituting a unit are mounted on a cooler heat receiving part 1 on the same plane and are adapted to radiate heat by self-cooling or cooling by wind. First and fourth semiconductor elements Q1, Q4 are arranged on the lower side of the cooler heat receiving part, second and third semiconductor elements Q2, Q3 are arranged in the middle, a first diode D5 and a second diode D6 are arranged on the upper side, the first and second semiconductor elements Q1, Q2, as well as the third and fourth semiconductor elements Q3, Q4 are each arranged in positions opposite to each other in a horizontal direction with respect to a centerline of a cooler in a vertical direction.
    Type: Grant
    Filed: October 16, 2012
    Date of Patent: December 30, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Takeshi Shinomiya, Yuichiro Nozaki, Masafumi Makino, Masaomi Konishide, Yasuhiko Kono, Tetsuo Kojima, Tetsu Sugiura
  • Patent number: 8917508
    Abstract: The invention relates to a power electronic assembly (1, 2, 3) with a heat sink (2), a power semiconductor module (1) and a circuit arrangement (3) for controlling the power semiconductor module, wherein the heat sink (2) has at least two parallel channels through which a coolant can flow.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: December 23, 2014
    Assignee: AEG Power Solutions B.V.
    Inventors: Liviu Bajan, Samir El Gharib, Gerrit Schulte
  • Patent number: 8917509
    Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: December 23, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Keisuke Horiuchi, Toshiya Satoh, Hideki Miyazaki
  • Patent number: 8910372
    Abstract: An improved choke assembly for a power electronics device is provided. More specifically, a choke assembly with improved protection from environmental conditions such as dirt and water is provided. An improved choke assembly may include an insulative housing for an inductor coil that seals the inductor coil from the environment.
    Type: Grant
    Filed: February 23, 2012
    Date of Patent: December 16, 2014
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: John R. Brubaker, Lixiang Wei
  • Patent number: 8902582
    Abstract: A coldplate for use with a transformer in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having a recess formed therein, the recess having a floor configured for contacting a bottom surface of a transformer for dissipating heat generated by the transformer. The main portion includes a raised feature configured for contacting a winding of the transformer for dissipating heat generated by the transformer. The coldplate also includes a bracket member for use in securing the transformer in the recess of the main portion, the bracket member configured for contacting the main portion and the transformer for dissipating heat generated by the transformer. The bracket member includes a contact surface for contacting a top surface of the transformer, the contact surface having an area sufficient to contact substantially all of the top surface of the transformer.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: December 2, 2014
    Assignee: Lear Corporation
    Inventors: Venkat Yalamanchili, Rutunj Rai
  • Patent number: 8902612
    Abstract: A power conversion apparatus includes a switching circuit including semiconductor switches, and a main circuit capacitor connected between a DC power source and the switching circuit. The main circuit capacitor includes a capacitor element, first wiring members that connect the DC power source to the switching circuit, and second wiring members that connect the capacitor element to the switching circuit. The capacitor element, the first wiring members, and the second wiring members are received in a case.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: December 2, 2014
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Aiko Inuduka, Toshio Nagao, Hidenori Hara
  • Patent number: 8879259
    Abstract: A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: November 4, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Osamu Suzuki, Yosuke Yasuda, Keisuke Horiuchi, Tomoo Hayashi, Atsuo Nishihara, Sunao Funakoshi
  • Patent number: 8879293
    Abstract: A cooling system of a server with an AC power source and a DC power source includes an AC input subsystem, a DC input subsystem, and a driving control subsystem. The AC input subsystem receives an external AC power source and provides a first DC voltage and a second DC voltage. The DC input subsystem receives an external DC power source and provides a third DC voltage and a fourth DC voltage. When the external AC power source normally works, the driving control subsystem controls the first DC voltage and the second DC voltage to supply a high-voltage cooling apparatus and a low-voltage cooling apparatus, respectively. When the external DC power source normally works, the driving control subsystem controls the fourth DC voltage and the third DC voltage to supply the high-voltage cooling apparatus and the low-voltage cooling apparatus, respectively.
    Type: Grant
    Filed: January 17, 2013
    Date of Patent: November 4, 2014
    Assignee: Delta Electronics, Inc.
    Inventors: Yen-Chang Chen, Chien-Chung Lee, Chen-Yu Huang, Yu-Chieh Tseng
  • Publication number: 20140313806
    Abstract: In a DC-DC converter, the cooling of switching elements has been performed only by means of a cooling plate; therefore, there is a problem in that, to effectively radiate heats generated by power MOSFETs that have large heating values and that are arranged parallel, it becomes necessary to reduce thermal resistances and complicate the cooling route of a water-cooling device. Plural switching elements for controlling currents flowing through inductor elements, which are used for voltage conversion of a DC-DC converter, are fixed to a metal case via a heat conductive insulating material and via a metal radiator having a better heat conduction characteristic than the metal case. Because there occur no large mixing phenomena of heat currents among neighboring switching elements, and there are only little heat interferences between the neighboring switching elements, the thermal diffusion characteristic is improved, and the cooling efficiency for the switching elements can be increased.
    Type: Application
    Filed: October 17, 2012
    Publication date: October 23, 2014
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Hidenori Shinohara, Mitsuru Yasunami, Tadahiko Chida
  • Patent number: 8863869
    Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.
    Type: Grant
    Filed: January 17, 2013
    Date of Patent: October 21, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Kinya Nakatsu, Hideyo Suzuki, Fusanori Nishikimi, Takeshi Matsuo, Toshiya Satou
  • Publication number: 20140301122
    Abstract: The invention relates to a power source (10) for providing a direct current, comprising a heavy-current transformer (12) with at least one primary winding (13) and at least one secondary winding (14) with center tapping, a synchronous rectifier (16) connected with the at least one secondary winding (14) of the heavy-current transformer (12) and comprising circuit elements (24), and a circuit (17) for actuating the circuit elements (24) of the synchronous rectifier (16), and a supply circuit (48) for supplying the synchronous rectifier (16) and the actuation circuit (17), and to a method for cooling such a power source (10). For reduction of losses and improvement of efficiency, the synchronous rectifier (16) and the actuation circuit (17) and the supply circuit (48) thereof are integrated in the heavy-current transformer (12).
    Type: Application
    Filed: October 31, 2012
    Publication date: October 9, 2014
    Applicant: FRONIUS INTERNATIONAL GMBH
    Inventors: Bernhard Artelsmair, Christoph Schultschik, Johannes Neuboeck, Stefan Wolfsgruber
  • Patent number: 8854807
    Abstract: A converter arrangement includes a housing having a first cooling air channel, at least one capacitor disposed in the housing, a fan for generating a cooling air flow, and a first power electronics module disposed in the housing between the at least one capacitor and the fan, as viewed in a direction of the cooling air flow. The first power electronics module is positioned in relation to the fan so as to only be cooled by a first partial air flow. A second partial air flow provided for cooling the at least one capacitor is routed via the first cooling air channel past the first power electronics module such that the second partial air flow is thermally separated from the first power electronics module.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: October 7, 2014
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ingolf Hoffmann, Wolfgang Lottes
  • Patent number: 8848370
    Abstract: An inverter for a vehicle is disclosed. The inverter for the vehicle illustratively includes: a power module provided with a power semiconductor device; a cooling module coupled to the power module and flowing a coolant therethrough; and a capacitor module mounted at the cooling module through a mounting unit and adapted to absorb a ripple current of the power module.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: September 30, 2014
    Assignee: Hyundai Motor Company
    Inventors: Dongmin Shin, Wooyong Jeon, In Pil Yoo, Hyong Joon Park, Joon Hwan Kim, Sungjun Yoon, Minji Kim, Jaehoon Yoon, Jung Hong Joo
  • Patent number: 8842436
    Abstract: An object is to provide an inverter module that can ensure satisfactory anti-vibration strength, moisture resistance, and isolation for each of the upper and lower boards of the inverter module and that can reduce the weight and cost, and to provide an integrated-inverter electric compressor. In an inverter module (21) in which a power system board (23) and a control board (31) are integrated via a resin case (22), the inverter module (21) is configured such that the power system board (23), on which a semiconductor switching device (24) is mounted, is provided at the lower part of the resin case (22) and the control board (31), on which a control-and-communication circuit is mounted, is provided thereabove.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: September 23, 2014
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Makoto Hattori, Masahiko Asai, Kazuki Niwa, Takayuki Takashige, Koji Nakano, Takashi Nakagami, Shunsuke Yakushiji
  • Publication number: 20140268969
    Abstract: An arm assembly is provided. The arm assembly includes a heat exchanger assembly, a plurality of electrical components thermally coupled to the heat exchanger assembly, and a number of electrical buses. Each electrical component is coupled to, and in electrical communication with, one electrical bus. A sealing compound is then applied to each electrical bus and to a limited number of the electrical components.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: EATON CORPORATION
    Inventors: JONATHAN CROUCH, WESLEY BYRON JOHNSON, IRVING GIBBS, RON SHUENEMAN
  • Publication number: 20140233291
    Abstract: An inverter stack includes an inverter main body housing an inverter circuit inside, and a fan block disposed on the inverter main body through an engagement device and housing a plurality of fans. The engagement device includes a bolt member penetrating through a slot formed in the inverter main body, wherein a body portion of the bolt member is screwed into a nut fixed to a plate member, and having a stopper nut, and an engagement hole formed in the fan block, the engagement hole having an attachment hole portion and a clamping hole portion formed continuously. When the bolt member is tightened in which the body portion passes through the clamping hole portion, the fan block is engaged with the inverter main body, and when the bolt member is released, the fan block is pulled out to the front side to be disengaged from the inverter main body.
    Type: Application
    Filed: October 26, 2012
    Publication date: August 21, 2014
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Toshihiro Yoshida
  • Patent number: 8805602
    Abstract: An electric vehicle including an inverter which includes a plurality of elements to convert direct current power to alternating current power. The inverter includes first, second and third heat sinks to absorb heat within the inverter. The first, second, and third heat sinks including fluid passages therein to allow cooling fluid to pass through each of the heat sinks in parallel, wherein a controller controls the flow of the cooling fluid through each of the first, second and third heat sinks. Temperature sensors associated with each of the heat sinks allows the controller to control the flow of the cooling fluid to the corresponding heat sink. The inverter being part of a cooling fluid circulation circuit which includes a heater core which can transfer heat from the cooling fluid to a passenger space of a body of the vehicle.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: August 12, 2014
    Assignee: LG Electronics Inc.
    Inventors: Junbo Yun, Jaeseok Oh, Heeseok Jeong, Junggi Lee, Sunkyoung Lim
  • Patent number: 8797738
    Abstract: A power converting apparatus includes a housing, a cable, and a grommet supporting member. The housing includes a housing base, a main body, and an air duct. The housing base has a first surface and a second surface and includes a through hole. The main body includes a plurality of electronic components on the first surface of the housing base. The air duct is disposed on the second surface of the housing base, and cooling air flows through the air duct. The cable is disposed through the through hole of the housing base so as to be wired between the main body and the air duct. The grommet supporting member is in the air duct or the main body. The grommet supporting member supports a grommet through which the cable is disposed. The grommet supporting member is not integral with the housing base.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: August 5, 2014
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Sumiaki Nagano, Kazutaka Kishimoto, Makoto Kojyo
  • Publication number: 20140211531
    Abstract: According to one embodiment, a liquid cooling type power conversion apparatus is provided. The liquid cooling type power conversion apparatus has a power conversion apparatus and a cooling apparatus which are provided in an engine room of a railway vehicle, an electric component and a plurality of semiconductor devices which are provided in the power conversion apparatus, a third heat exchanger located between the electric component and an electric blower, a cooling body on which the plurality of the semiconductor devices are mounted, a first heat exchanger provided in the cooling apparatus, a second heat exchanger provided in the cooling apparatus having a size smaller than the first heat exchanger 111b, a piping to connect the third heat exchanger 5 and the second heat exchanger, and a piping to connect the cooling body and the first heat exchanger.
    Type: Application
    Filed: March 25, 2014
    Publication date: July 31, 2014
    Inventors: Mitsuyo YAMASHITA, Yuuji IDE
  • Patent number: 8792244
    Abstract: A power converter equipped with a semiconductor stack made up of semiconductor modules, bus bars coupled to power terminals of the semiconductor modules, a capacitor, and an input terminal table. The capacitor is disposed in alignment with a first direction in which the semiconductor modules are stacked. The capacitor has a first end and a second end opposed to the first end in a second direction in which the power terminals extend from the semiconductor modules. The first end faces in the second direction. The input terminal table is located near the second end of the capacitor. This structure permits the power converter to be reduced in size and produced at a decreased cost.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: July 29, 2014
    Assignee: Denso Corporation
    Inventor: Wataru Funatsu
  • Patent number: 8787018
    Abstract: A power converting apparatus includes a housing, a cylindrical capacitor, and a cylindrical capacitor cover. The housing includes a housing base, a main body, and an air duct. The main body includes a plurality of electronic components on a first surface of the housing base. The air duct is disposed on a second surface of the housing base. The capacitor penetrates through the housing base so that a part of the capacitor is disposed in the main body while a rest part of the capacitor is disposed in the air duct. The capacitor cover is disposed on the housing base and covers the rest part of the capacitor. The capacitor cover includes an elastic material and an inner surface. The capacitor cover includes a groove disposed on the inner surface in an axial direction of the capacitor cover.
    Type: Grant
    Filed: April 11, 2012
    Date of Patent: July 22, 2014
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Sumiaki Nagano, Kazutaka Kishimoto, Makoto Kojyo
  • Patent number: 8787056
    Abstract: An electric power converter apparatus includes a plurality of semiconductor modules connected in parallel, with respective current-carrying electrode terminals of the modules being connected to a common branch point via connecting leads having respectively different values of impedance, such that the impedance values decrease in accordance with increased degrees of effectiveness of cooling the respective semiconductor modules, thereby reducing variations in operating temperature between the modules.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: July 22, 2014
    Assignee: Denso Corporation
    Inventor: Yuu Yamahira