Abstract: An electronic device includes a semiconductor memory. The semiconductor memory includes a first variable resistance element, a first switching element coupled to the first variable resistance element via a first line, a second variable resistance element, and a second switching element coupled to the second variable resistance element via a second line, wherein a distance between the first switching element and the first variable resistance element is larger than a distance between the second switching element and the second variable resistance element, and wherein a second path from a first terminal of the second switching element to the second variable resistance element includes a resistance component, a resistance of the second path being greater than a resistance of a first path, the first path being from a first terminal of the first switching element to the first variable resistance element.

Abstract: A memory device, such as an FeDRAM device, includes a memory array including a plurality of rows, each row having a plurality of storage elements (e.g., FeFETs). The memory device further includes a plurality of refresh trigger circuits, each refresh trigger circuit being associated with a respective one of the rows. Each refresh trigger circuit is structured to produce an output signal indicative of an estimated degradation of a memory window of one or more of the storage elements of the associated one of the rows. The memory device also further includes control circuitry coupled to each of the refresh trigger circuits, wherein the control circuitry is structured and configured to determine whether to initiate a refresh of the storage elements of a particular one of the rows based on the output signal produced by the refresh trigger circuit associated with the particular one of the rows.

Abstract: Methods, systems, and devices for drift mitigation with embedded refresh are described. A memory cell may be written to and read from using write and read voltages, respectively, that are of different polarities. For example, a memory cell may be written to by applying a first write voltage and may be subsequently read from by applying a first read voltage of a first polarity. At least one additional (e.g., a second) read voltage—a setback voltage—of a second polarity may be utilized to return the memory cell to its original state. Thus the setback voltage may mitigate a shift in the voltage distribution of the cell caused by the first read voltage.

Abstract: A memristive dot-product system for vector processing is described. The memristive dot-product system includes a crossbar array having a number of memory elements. Each memory element includes a memristor. Each memory element includes a transistor. The system also includes a vector input register. The system also includes a vector output register.

Abstract: Methods, systems, and devices for multiple plate line architecture for multideck memory arrays are described. A memory device may include two or more three-dimensional arrays of ferroelectric memory cells overlying a substrate layer that includes various components of support circuitry, such as decoders and sense amplifiers. Each memory cell of the array may have a ferroelectric container and a selector device. Multiple plate lines or other access lines may be routed through the various decks of the device to support access to memory cells within those decks. Plate lines or other access lines may be coupled between support circuitry and memory cells through on pitch via (OPV) structures. OPV structures may include selector devices to provide an additional degree of freedom in multideck selectivity. Various number of plate lines and access lines may be employed to accommodate different configurations and orientations of the ferroelectric containers.

Abstract: A semiconductor memory according to the present invention includes a first discharge circuit for discharging electric charge stored in a pair of bit lines; a second discharge circuit for discharging electric charge stored in the pair of bit lines; and a control part for selectively executing a low-speed discharge mode for operating only the second discharge circuit of the first and second discharge circuits, a high-speed discharge mode for operating both of the first and second discharge circuits, and a stop mode for stopping both of the first and second discharge circuits.

Abstract: A display device may include a pixel and a light shutter. The pixel may include a first region and a second region. The light shutter may be disposed in the second region. The light shutter may include a first electrode, a heat generation layer disposed on the first electrode, and a phase change layer disposed on the heat generation layer. The phase change layer may include a phase change material of which optical property is changed depending on temperature.

Abstract: A memory circuit has a ferroelectric memory cell having a word line and a bit line, an input transistor connected to the bit line, a gain element electrically connected the bit line, wherein the gain element includes a feedback capacitor, and an output terminal. A method of reading a memory cell includes applying a voltage to a word line of the memory cell, causing charge to transfer from the memory cell to a feedback capacitor, generating a voltage, amplifying the voltage by applying a gain having a magnitude of less than three, sensing an output voltage at an output node to determine a state of the memory cell, and storing the memory state in a latch.

Abstract: A hybrid memory includes a plurality of tiles including a plurality of rows including a first row having a first type of memory cells and a second row having a second type of memory cells; a pair of bitline select signals including a bitline select signal and a bitline select bar signal that is an inverse of the bitline select signal; a wordline driver that is configured to receive an input data; a sense amplifier that is configured to output an output data; a write bitline coupled to the first row and the second row; a read bitline coupled to the first row and the second row; a wordline coupled to each of the plurality of rows; and a bitline that is coupled to the write bitline and the read bitline based on set values of the pair of bitline select signals.

Abstract: According to one embodiment, a magnetic memory device includes a stack structure including a first magnetic layer having a variable magnetization direction, a second magnetic layer having a fixed magnetization direction, and a nonmagnetic layer provided between the first magnetic layer and the second magnetic layer, wherein the second magnetic layer includes a first layer containing iron (Fe) and boron (B), a second layer containing iron (Fe) and boron (B), and a third layer provided between the first layer and the second layer and containing a semiconductor.

Abstract: An amplifier circuit is disclosed having an amplifier with first and second input terminals. The amplifier circuit includes a first compensation capacitor coupled to the first input terminal and having a first capacitance, a second compensation capacitor coupled to the second input terminal and having a second capacitance, a first transistor coupled between the first compensation capacitor and a reference voltage and having a gate terminal that receives a first control signal, and a second transistor coupled between the second compensation capacitor and the reference voltage and having a gate terminal for receiving a second control signal. The amplifier circuit includes a programmable latch circuit arranged to provide the first and second control signals, wherein the first and second transistors are of the same conductivity type, and the first control signal and the second control signal are complementary signals with respect to each other.

Abstract: An amplifier circuit including a semiconductor element is formed on a substrate. A protection circuit formed on the substrate includes a plurality of protection diodes that are connected in series with each other, and the protection circuit is connected to an output terminal of the amplifier circuit. A pad conductive layer at least partially includes a pad for connecting to a circuit outside the substrate. The pad conductive layer and the protection circuit at least partially overlap each other in plan view.

Abstract: The present disclosure includes apparatuses and methods related to performing logical operations using sensing circuitry. An example apparatus comprises an array of memory cells and sensing circuitry comprising a primary latch coupled to a sense line of the array. The sensing circuitry can be configured to perform a first operation phase of a logical operation by sensing a memory cell coupled to the sense line, perform a number of intermediate operation phases of the logical operation by sensing a respective number of different memory cells coupled to the sense line, and accumulate a result of the first operation phase and the number of intermediate operation phases in a secondary latch coupled to the primary latch without performing a sense line address access.

Abstract: A single-ended sense amplifier and a memory device including the same are presented. A sense amplifier, which senses and amplifies data of a memory cell, may include a precharge circuit pre-charging a data line which is connected to the memory cell and provides a sensing voltage, and a reference line which provides a reference voltage, with a power supply voltage; a reference voltage generating circuit which generates the reference voltage by discharging the reference line based on a reference current, and adjusts an amount of the reference current based on the data of the memory cell; and a comparator which compares the sensing voltage and the reference voltage, and outputs a comparison result as the data of the memory cell.

Abstract: The disclosed technology generally relates to memory devices and more particularly to memory devices based on resistance change, and to systems and methods for evaluating states of memory cells of the memory devices. In one aspect, a memory device includes a plurality of memory cells arranged in an array, where each memory cell comprises a memory element configured to be switched between at least two resistance states. The memory device additionally includes a plurality of word lines and a plurality of bit lines crossing each other, where each of the memory cells is formed at a crossing between one of the word lines and one of the bit lines. In the memory device, the memory cells are configured to be connected to a source line. Additionally, each bit line has a bit line capacitance and is configured to store a charge associated with a state of a selected memory element.

Abstract: Various embodiments comprise apparatuses and methods of forming the apparatuses. In one embodiment, an exemplary apparatus includes a plurality of memory cells. At least a portion of the memory cells have a bottom electrode with each bottom electrode being at least partially electrically isolated from remaining ones of the bottom electrodes. At least one resistive interconnect electrically couples two or more of the bottom electrodes. The resistive interconnect is arranged to discharge at least a portion of excess charge from the two or more bottom electrodes. Additional apparatuses and methods of forming the apparatuses are disclosed.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A ground reference scheme may be employed in a digit line voltage sensing operation. A positive voltage may be applied to a memory cell; and after a voltage of the digit line of the cell has reached a threshold, a negative voltage may be applied to cause the digit line voltages to center around ground before a read operation. In another example, a first voltage may be applied to a memory cell and then a second voltage that is equal to an inverse of the first voltage may be applied to a reference capacitor that is in electronic communication with a digit line of the memory cell to cause the digit line voltages to center around ground before a read operation.

Abstract: Disclosed embodiments include a memory device having a memory array that includes a first memory cell coupled to a first bit line and a second memory cell coupled to a second bit line and a sense amplifier that includes first and second transistors arranged in a cross-coupled configuration with third and fourth transistors, the first and second transistors being of a first conductivity type and the third and fourth transistors being of a second conductivity type, a first inverter having an input coupled to a first common drain terminal of the first and third transistors and an output coupled to the first bit line, and a second inverter having an input coupled to a second common drain terminal of the second and fourth transistors and an output coupled to the second bit line.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A ferroelectric memory cell may be used to store a logic state. The capacitance of a digit line of the ferroelectric memory cell may be dynamically increased prior to, and during a portion of, a read operation used to determine a stored logic state of the cell. The capacitance may be increased by leveraging intrinsic capacitance of digit lines of the array—e.g., by shorting one digit line to another digit line. Increasing the capacitance of the digit line may increase the signal on the digit line that is sensed during the read operation.

Abstract: Disclosed embodiments relate to generating random numbers using two transistor, two capacitor (2T-2C) ferroelectric memory cells. In accordance with one disclosed embodiment, an n-bit random number can be generated by writing to a uniform data pattern to a set of n 2T-2C ferroelectric memory cells in a 1T-1C mode so that all ferroelectric capacitors of the n 2T-2C cells have a polarization state corresponding to the same data value (e.g., all 0's or all 1's). The n 2T-2C cells are then read in a 2T-2C mode, so that a random bit (a 0 or 1) is produced for each cell, resulting in an n-bit random number. The n-bit random number is stored in the n 2T-2C ferroelectric memory cells by a rewrite operation. Such random numbers are useful for many purposes, including security, such as authentication, integrity checking, and encryption, and for identification.

Abstract: Apparatuses and methods are disclosed that include ferroelectric memory cells. An example ferroelectric memory cell includes two transistors and two capacitors. Another example ferroelectric memory cell includes three transistors and two capacitors. Another example ferroelectric memory cell includes four transistors and two capacitors.

Abstract: Techniques, systems, and devices for time-resolved access of memory cells in a memory array are described herein. During a sense portion of a read operation, a selected memory cell may be charged to a predetermined voltage level. A logic state stored on the selected memory cell may be identified based on a duration between the beginning of the charging and when selected memory cell reaches the predetermined voltage level. In some examples, time-varying signals may be used to indicate the logic state based on the duration of the charging. In some examples, the duration of the charging may be based on a polarization state of the selected memory cell, a dielectric charge state of the selected state, or both a polarization state and a dielectric charge state of the selected memory cell.

Abstract: Methods, systems, and devices for dual mode ferroelectric memory cell operation are described. A memory array or portions of the array may be variously operated in volatile and non-volatile modes. For example, a memory cell may operate in a non-volatile mode and then operate in a volatile mode following a command initiated by a controller while the cell is operating in the non-volatile mode. The memory cell may operate in the volatile mode and then operate in the non-volatile mode following a subsequent command. In some examples, one memory cell of the memory array may operate in the non-volatile mode while another memory cell of the memory array operates in the volatile mode.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A first ferroelectric memory cell may be initialized to a first state and a second ferroelectric memory cell may be initialized to a different state. Each state may have a corresponding digit line voltage. The digit lines of the first and second ferroelectric memory cells may be connected so that charge-sharing occurs between the two digit lines. The voltage resulting from the charge-sharing between the two digit lines may be used by other components as a reference voltage.

Abstract: Disclosed is a method and a tracking system for tracking content in a mobile communication network. The method comprises maintaining predefined identifying information pertaining to content to be tracked, the identifying information being independent of user information associated with the content, intercepting a message originated from a user, comparing content of the message with said predefined identifying information, and responsive to obtaining at least partial match in said comparing, concluding that said message comprises content to be tracked.

Abstract: Apparatuses and methods are disclosed that include two transistor-one capacitor memory and for accessing such memory. An example apparatus includes a capacitor coupled to first and second selection components. The apparatus further includes a first digit line and the first selection component configured to couple a first plate of the capacitor to the first digit line, and also includes a second digit line and the second selection component configured to couple the second plate to the second digit line. A sense amplifier is coupled to the second digit line and is configured to amplify a voltage difference between a voltage coupled to the second digit line and the reference voltage.

Abstract: Methods, systems, techniques, and devices for operating a ferroelectric memory cell or cells are described. A first ferroelectric memory cell may be used to charge a second ferroelectric memory cell by transferring charge from a plate of first ferroelectric memory cell to a plate of the second ferroelectric memory cell. In some examples, prior to the transfer of charge, the first ferroelectric memory cell may be selected for a first operation in which the first ferroelectric memory cell transitions from a charged state to a discharged state and the second ferroelectric memory cell may be selected for a second operation during which the second ferroelectric memory cell transitions from a discharged state to a charged state. The discharging of the first ferroelectric memory cell may be used to assist in charging the second ferroelectric memory cell.

Abstract: Exemplary embodiments of the present disclosure are directed to circuitry for effective operation of Ferroelectric-gated FET (FeFET) memories. Exemplary embodiment of the present disclosure includes circuits and/or circuit blocks to facilitate memory refresh, error checking and correcting (ECC), reading and sensing memory cells, program and erase operations, and other control and periphery operations for FeFET memory cell arrays.

Abstract: A memory array includes rows and columns with memory cell portion and a dummy cell portion. Bit lines are connected to the memory cells and to the dummy cell portion. The dummy cell portion includes a first row of dummy cells and a second row of dummy cells. The dummy cells in the first row have a first connection to a corresponding bit line of a first bit line group of the bit lines and a second connection to a first source line. The dummy cells in the second row have a first connection to a corresponding bit line of a second bit line group of the plurality of bit lines and a second connection to a second source line. The dummy cells are selectively actuated to couple voltages at the first and second source lines to the first and second bit line groups, respectively, depending on memory operating mode.

Abstract: Apparatuses and methods are disclosed that include ferroelectric memory and for accessing ferroelectric memory. An example method includes increasing a voltage of a first cell plate of a capacitor to change the voltage of a second cell plate of the capacitor, a second digit line, and a second sense node. The voltage of the second cell plate and the second digit line is decreased to change the voltage of the first cell plate, a first digit line, and a first sense node. The first node is driven to a first voltage and the second node is driven to a second voltage responsive to the voltage of the first node being greater than the second node. The first node is driven to the second voltage and the second node is driven to the first voltage responsive to the voltage of the first node being less than the second node.

Abstract: A semiconductor memory includes j×k first memory cells, j upper bit lines, (½)j sense amplifiers, j×k lower first bit lines, k first word lines, k pairs of plate lines, each pair having first and second plate lines, each being connected to odd-numbered and even-numbered first memory cells of one of the k columns, a pair of discharge signal lines having a first discharge signal line and a second discharge signal line respectively connecting two of the j upper lines in each sense amplifier to a prescribed potential, j×m second memory cells, j lower second bit lines, m second word lines, m third plate lines each connected to the j second memory cells of one of the m columns, and j shield lines each provided at positions respectively corresponding to the j upper bit lines, which are parallel to one another.

Abstract: A method of forming a segmented FDSOI STT-MRAM using dummy WL blocks and the resulting device are provided. Embodiments include forming a plurality of FDSOI STT-MRAM active WL blocks laterally separated across a memory array; forming a FDSOI STT-MRAM dummy WL block parallel to and on opposite sides of each active WL block; forming a plurality of SL structures laterally separated across the memory array; forming a plurality of BL structures laterally separated across the memory array; and connecting the plurality of SL and BL structures to the plurality of active WL blocks.

Abstract: The present disclosure provides a numerical control system and a numerical control machine tool. The NCS includes a storage and a MCU capable of reading data from and writing data into the storage. The MCU includes a data buffer, the storage includes an internal memory and a flash memory, the internal memory is configured to store data and programs which are needed when the MCU is in operation. The flash memory includes at least one of SD card memory and eMMC memory, and a built-in NAND-Flash memory. The NAND-Flash memory is configured to store system files of the NCS, and the SD card memory and the eMMC memory both are configured to store the system files and user data of the NCS, which enables the NCS to be workable in the absence of external SD card memory.

Abstract: An energy-efficient nonvolatile microprocessor includes a processing core, a nonvolatile flip-flop array, a set of nonvolatile interconnections, and a store-enable register. When a power source is recovered to a stable state, the processing core determines whether data of nonvolatile registers is not transmitted before power-off. If yes, the processing core executes programmable recovery entry decision to avoid recovery failures for different applications. The processing core has plural system states divided into programmer visible states and programmer invisible states. The nonvolatile interconnections are connected between the processing core and the nonvolatile flip-flop array. When the power source is unstable, the processing core only stores the programmer visible states into the nonvolatile flip-flop array and, at the same time, only stores the system states of the peripheral modules corresponding to the bits of the store-enable register that are set to be “true” into the nonvolatile flip-flop array.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A cell may be written with a value that is intended to convey a different logic state than may typically be associated with the value. For example, a cell that has stored a charge associated with one logic state for a time period may be re-written to store a different charge, and the re-written cell may still be read to have the originally stored logic state. An indicator may be stored in a latch to indicate whether the logic state currently stored by the cell is the intended logic state of the cell. A cell may, for example, be re-written with an opposite value periodically, based on the occurrence of an event, or based on a determination that the cell has stored one value (or charge) for a certain time period.

Abstract: Apparatuses and methods for reading memory cells are described. An example method includes sharing a first voltage to increase a voltage of a first sense line coupled to a first capacitor plate of a ferroelectric capacitor of a memory cell, sharing a second voltage to decrease a voltage of a second sense line coupled to a second capacitor plate of the ferroelectric capacitor of the memory cell, sharing a third voltage to increase the voltage of the second sense line, and sharing a fourth voltage to decrease the voltage of the first sense line. A voltage difference between the first sense line and the second sense line that results from the voltage sharing is amplified, wherein the voltage difference is based at least in part on a polarity of the ferroelectric capacitor.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A ferroelectric memory cell may be selected using a selection component that is in electronic communication with a sense amplifier and a ferroelectric capacitor of a ferroelectric memory cell. A voltage applied to the ferroelectric capacitor may be sized to increase the signal sensed during a read operation. The ferroelectric capacitor may be isolated from the sense amplifier during the read operation. This isolation may avoid stressing the ferroelectric capacitor which may otherwise occur due to the applied read voltage and voltage introduce by the sense amplifier during the read operation.

Abstract: An object is to provide a memory element having a novel structure where data can be held even after power supply is stopped. The memory element includes a latch circuit, a first selection circuit, a second selection circuit, a first nonvolatile memory circuit, and a second nonvolatile memory circuit. The first nonvolatile memory circuit and the second nonvolatile memory circuit each include a transistor and a capacitor. The transistor included in each of the first nonvolatile memory circuit and the second nonvolatile memory circuit is a transistor in which a channel is formed in an oxide semiconductor film. The off-state current of such a transistor is extremely small. The transistor is turned off after data is input to a node where the transistor and the capacitor are connected to each other, and data can be held for a long time even after supply of power supply voltage is stopped.

Abstract: A memory device and method of operating the same are disclosed. Generally, the device includes an array of Ferro-electric Random Access Memory cells. Each cell includes a first transistor coupled between a bit-line and a storage node (SN) and controlled by a first wordline (WL1), a second transistor coupled between a reference line and the SN and controlled by a second wordline (WL2), and a ferro-capacitor coupled between the SN and a plateline. The device further includes a sense-amplifier coupled to the bit-line and reference line, and a processing-element configured to issue control signals to WL1, WL2, the plateline and the sense-amplifier. The cell is configured and operated to generate a bit-level reference in which a first voltage pulse is applied to the plateline during a read cycle for the data pulse and a second voltage pulse serves as a reference pulse and as a clear pulse.

Abstract: A memory cell includes a first electrode and a second electrode. A select device and a programmable device are in series with each other between the first and second electrodes. The select device is proximate and electrically coupled to the first electrode. The programmable device is proximate and electrically coupled to the second electrode. The programmable device includes a radially inner electrode having radially outer sidewalls. Ferroelectric material is radially outward of the outer sidewalls of the inner electrode. A radially outer electrode is radially outward of the ferroelectric material. One of the outer electrode or the inner electrode is electrically coupled to the select device. The other of the outer electrode and the inner electrode is electrically coupled to the second electrode. Arrays of memory cells are disclosed.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A memory device may maintain a digit line voltage at a ground reference for a duration associated with biasing a ferroelectric capacitor of a memory cell. For example, a digit line that is in electronic communication with a ferroelectric capacitor may be virtually grounded while a voltage is applied to a plate of the ferroelectric capacitor, and the ferroelectric capacitor may be isolated from the virtual ground after a threshold associated with applying the voltage to the plate is reached. A switching component (e.g., a transistor) that is in electronic communication with the digit line and virtual ground may be activated to virtually ground the digit line and deactivated to isolate the digit line from virtual ground.

Abstract: A method of fabricating a FinFET device includes a self-aligned contact etch where a source/drain contact module is performed prior to a replacement metal gate (RMG) module. In particular, the method involves forming a sacrificial gate over the channel region of a fin, and an interlayer dielectric over adjacent source/drain regions of the fin. An etch mask is then used to protect source/drain contact regions and enable the removal of the interlayer dielectric from outside of the protected area, e.g., between adjacent fins.

Abstract: Methods, systems, and devices for cell bottom node reset in a memory array are described. The memory array may include a plurality of ferroelectric memory cells having a cell bottom node and a cell plate opposite the cell bottom node. A zero voltage may be applied to a plurality of digit lines in the memory array. A plurality of word lines may be activated to electrically coupled the plurality of digit lines to cell bottom node of each of the ferroelectric memory cells. Accordingly, the cell bottom node of each of the ferroelectric memory cells may be reset to the zero voltage.

Abstract: In an example, a method of controlling a memristor memory includes operating the memristor memory in a volatile mode, wherein switching a state of a memristor cell is with a low writing load. The method also includes operating the same memristor memory in a non-volatile mode, wherein switching a state of the memristor cell is with a high writing load.

Abstract: A memory circuit includes: cells arranged in rows and columns so that the rows are grouped to form banks each including one or more rows, each cell including: a bistable circuit storing data; and a non-volatile element storing data stored in the bistable circuit in a non-volatile manner and restoring data stored in a non-volatile manner to the bistable circuit; and a controller that performs a store operation on each row in turn; sets a voltage supplied, as a power-supply voltage, to cells in a first bank, which includes a row on which the store operation is performed, of the banks to a first voltage; and sets a voltage supplied, as a power-supply voltage, to cells in a bank of the banks other than the first bank to a second voltage that is less than the first voltage but at which data in the bistable circuit is retained.

Abstract: Methods, systems, and apparatuses for full bias sensing in a memory array are described. Various embodiments of an access operation of a cell in a array may be timed to allow residual charge of a middle electrode between the cell and a selection component to discharge. Access operations may also be timed to allow residual charge of middle electrodes associated with other cells to be discharged. In conjunction with an access operation for a target cell, a residual charge of a middle electrode of another cell may be discharged, and the target cell may then be accessed. A capacitor in electronic communication with a cell may be charged and a logic state of the cell determined based on the charge of the capacitor. The timing for charging the capacitor may be related to the time for discharging a middle electrode of the cell or another cell.

Abstract: Methods, systems, and apparatuses for memory array bit inversion are described. A memory cell (e.g., a ferroelectric memory cell) may be written with a charge associated with a logic state that may be the inverse of the intended logic state of the cell. That is, the actual logic state of one or more memory cells may be inverted, but the intended logic state of the memory cells may remain unchanged. Different sets of transistors may be configured around a sense component of a cell to enable reading and writing of intended and inverted logic states from or to the cell. For instance, a first set of transistors may be used to read the logic state currently stored at a memory cell, while a second set of transistors may be used to read a logic state inverted from the currently stored logic state.

Abstract: An integrated circuit includes a ferroelectric memory cell. The ferroelectric memory cell includes a ferroelectric layer stack comprising at least one ferroelectric material oxide layer. Each of the ferroelectric material oxide layers includes a ferroelectric material that is at least partially in a ferroelectric state. The ferroelectric layer stack comprises at least two ferroelectric domains. Further, the voltage which is to applied to the layer stack to induce polarization reversal differs for the individual domains such that polarization reversal of individual domains or of a portion of the totality of ferroelectric domains within the ferroelectric material of can be attained.

Abstract: Disclosed is a method for producing a polymeric ferroelectric material. The method can include (a) obtaining a polymeric ferroelectric precursor material, and (b) subjecting the polymeric ferroelectric precursor material to pulsed electromagnetic radiation sufficient to form a polymeric ferroelectric material having ferroelectric hysteresis properties, wherein the polymeric ferroelectric precursor material, prior to step (b), has not previously been subjected to a thermal treatment for more than 55 minutes.

Abstract: Methods, systems, and devices for variable filter capacitance are described. Within a memory device, voltages may be applied to access lines associated with two voltage sources to increase the capacitance provided by the access lines between the two voltage sources. In some cases, the access lines may be in electronic communication with capacitive cells that include a capacitive element and a selection component, and the voltage sources and access lines may be configured to utilize the capacitive elements and the capacitance between the access lines to generate an increase capacitance between the voltage sources. In some cases, decoders may be used to implement certain configurations that generate different capacitance levels. Similarly, sub-decoders may generate different capacitance levels by selecting portions of a capacitive array.