Abstract: Some embodiments include transistor constructions having a first insulative structure lining a recess within a base. A first conductive structure lines an interior of the first insulative structure, and a ferroelectric structure lines an interior of the first conductive structure. A second conductive structure is within a lower region of the ferroelectric structure, and the second conductive structure has an uppermost surface beneath an uppermost surface of the first conductive structure. A second insulative structure is over the second conductive structure and within the ferroelectric structure. A pair of source/drain regions are adjacent an upper region of the first insulative structure and are on opposing sides of the first insulative structure from one another.

Abstract: A memory cell and memories constructed from that memory cell are disclosed. A memory according to the present invention includes a ferroelectric capacitor, a charge source and a read circuit. The charge source receives a data value to be stored in the ferroelectric capacitor. The charge source converts the data value to a remanent charge to be stored in the ferroelectric capacitor and causes that remanent charge to be stored in the ferroelectric capacitor. The read circuit determines a charge stored in the ferroelectric capacitor. The data value has more than three distinct possible states, and the determined charge has more than three determined values. The memory also includes a reset circuit that causes the ferroelectric capacitor to enter a predetermined known reference state of polarization.

Abstract: The present disclosure is related to shifting data using sensing circuitry. An example apparatus can include a first sensing component and a second sensing component. The first sensing component can include a first sense amplifier coupled to a first pair of complementary sense lines and a first compute component comprising a number of first pass transistors. The second sensing component can include a second sense amplifier coupled to a second pair of complementary sense lines. The second sensing component can include a second compute component comprising a number of second pass transistors. The first pair of complementary sense lines can be coupled to the number of first pass transistors and the number of second pass transistors.

Abstract: A monitoring device for a distributed antenna system including at least two node units communicatively coupled to each other transmits, to at least one target node unit among the node units, a data dump command for a first target signal passing through a first signal path in the target node unit. The monitoring device receives, from the target node unit, response data corresponding to the data dump command. The monitoring device generates first quality information indicative of the quality of the first target signal by using the response data.

Abstract: A voltage compensation circuit may be provided. The voltage compensation circuit may include a replica circuit block configured to be selected and driven to generate a resistance value for compensating a voltage level.

Abstract: A memory device includes a memory unit including a plurality of memory cells, and a controller including a storage unit that stores a plurality of operation selections each corresponding to a property of at least one selected memory cell among the plurality of memory cells.

Abstract: In a semiconductor device, some regions of a memory cell array region may be used as reservoir regions. A semiconductor device may include at least one reservoir cell disposed with the memory cells in a cell array region.

Abstract: Layers of high quality VO2 and methods of fabricating the layers of VO2 are provided. The layers are composed of a plurality of connected crystalline VO2 domains having the same crystal structure and the same epitaxial orientation.

Abstract: Methods, systems, and devices are described for operating a memory array. A first voltage may be applied to a memory cell to activate a selection component of the memory cell prior to applying a second voltage to the memory cell. The second voltage may be applied to facilitate a sensing operation once the selection component is activated. The first voltage may be applied during a first portion of an access operation and may be used in determining a threshold voltage of the selection component. The subsequently applied second voltage may be applied during a second portion of the access operation and may have a magnitude associated with a preferred voltage for accessing a ferroelectric capacitor of the memory cell. In some cases, the second voltage has a greater rate of increase over time (e.g., a greater “ramp”) than the first voltage.

Abstract: The present disclosure provides a storage cell or storage structure having a static RAM-like operational behavior while nevertheless providing non-volatile storage capability on a single bit basis. To this end, a non-volatile storage element, such as a ferroelectric transistor element, may be provided within an inverter structure so as to allow the storage of a logic state at any desired operational phase by increasing the voltage difference used for operating the inverter structure. In illustrative embodiments, the stored logic state may be re-established during a power-up event.

Abstract: An in-plane SOT MRAM non-volatile memory cell has enhanced thermal stability due to coercive pinning provided by an adjacent antiferromagnetic layer that has a thickness that is less than a minimum critical thickness needed to provide exchange bias.

Abstract: Methods, systems, techniques, and devices for operating a ferroelectric memory cell or cells are described. Groups of cells may be operated in different ways depending, for example, on a relationship between cell plates of the group of cells. Cells may be selected in pairs in order to accommodate an electric current relationship, such as a short, between cells that make up the pair. Cells may be arranged in cell plate groups, and a pair of cells may include a first cell plate from one cell plate group and a second cell plate from the same cell plate group or from another, adjacent cell plate group. So a pair of cell plates may include cell plates from different cell plate groups. The first and second cell plates may be selected as a pair or a group based at least in part on the electric current relationship between the cell plates.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A ground reference scheme may be employed in a digit line voltage sensing operation. A positive voltage may be applied to a memory cell; and after a voltage of the digit line of the cell has reached a threshold, a negative voltage may be applied to cause the digit line voltages to center around ground before a read operation. In another example, a first voltage may be applied to a memory cell and then a second voltage that is equal to an inverse of the first voltage may be applied to a reference capacitor that is in electronic communication with a digit line of the memory cell to cause the digit line voltages to center around ground before a read operation.

Abstract: A system includes a ferroelectric random access memory (FRAM) array having one or more memory elements. A cycle controller cycles data to be fixed in a subset of the one or more memory elements by reading or writing the data a predetermined number of times to fix the data to a non-volatile stable state.

Abstract: A memory unit cell and memory array device are provided. The memory unit cell includes a pulse adjustment circuit for providing an adjusted pulse with symmetric weight updating for a given state update in response to an input pulse and state feedback. The memory unit further includes a synapse element having a memory element with hysteresis for storing one of multiple possible states responsive to the adjusted pulse and for providing the state feedback to the pulse adjustment circuit.

Abstract: A memory device includes a memory unit including a plurality of memory cells, and a controller including a storage unit that stores a plurality of operation selections each corresponding to a property of at least one selected memory cell among the plurality of memory cells.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A ferroelectric memory cell may be used to store a logic state. The capacitance of a digit line of the ferroelectric memory cell may be dynamically increased prior to, and during a portion of, a read operation used to determine a stored logic state of the cell. The capacitance may be increased by leveraging intrinsic capacitance of digit lines of the array—e.g., by shorting one digit line to another digit line. Increasing the capacitance of the digit line may increase the signal on the digit line that is sensed during the read operation.

Abstract: High density energy storage in semiconductor devices is provided. There are two main aspects of the present approach. The first aspect is to provide high density energy storage in semiconductor devices based on formation of a plasma in the semiconductor. The second aspect is to provide high density energy storage based on charge separation in a p-n junction.

Abstract: According to one embodiment, a temperature of a non-volatile memory or an ambient temperature of the non-volatile memory is acquired. A distribution of a threshold voltage, which is corrected according to the acquired temperature, is acquired from the non-volatile memory. Read voltages related to the reading of data are detected from the distribution. Error correction is performed for data read from the non-volatile memory, using the read voltages. The detected read voltages are separately corrected on the basis of the acquired temperature when the error correction has failed.

Abstract: Methods, systems, and devices for preventing disturb of untargeted memory cells during repeated access operations of target memory cells are described for a non-volatile memory array. Multiple memory cells may be in electronic communication with a common conductive line, and each memory cell may have an electrically non-linear selection component. Following an access operation (e.g., a read or write operation) of a target memory cell, untargeted memory cells may be discharged by applying a discharge voltage to the common conductive line. The discharge voltage may, for example, have a polarity opposite to the access voltage. In other examples, a delay may be instituted between access attempts in order to discharge the untargeted memory cells.

Abstract: A method of verifying a layout of a vertical memory device includes classifying a plurality of channel holes included in the layout of the vertical memory device into a plurality of types based on at least one of a distance between each channel hole and an isolation region adjacent thereto, shapes of the plurality of channel holes in the layout, and coordinates of the plurality of channel holes in the layout. Types of channel holes connected to each of a plurality of bit lines included in the layout are identified, and a determination is made whether loads of the plurality of bit lines are equalized, based on the identified types of the channel holes for each bit line.

Abstract: A technique including using an array of memory cells for data storage. A given cell of the memory cells includes a capacitive storage element and a resistive storage element that is coupled in series with the capacitive storage element. The technique includes accessing the given memory cell to write a value to the given memory cell or read a value stored in the memory cell. The accessing includes applying a time varying voltage to the memory cell.

Abstract: Integrated circuits with memory interface circuitry may be provided. Prior to calibration, a number of samples may be determined by computing probability density function curves as a function of timing window edge asymmetry for different degrees of oversampling. During calibration, duty cycle distortion in data strobe signals may be corrected by selectively delaying the data strobe rising or falling edges. A data clock signal that is used for generating data signals may also suffer from duty cycle distortion. The rising and falling edges of the data clock signal may be selectively delayed to correct for duty cycle distortion. The data path through which the data signals are routed may be adjusted to equalize rising and falling transitions to minimize data path duty cycle distortion. Multi-rank calibration may be performed by calibrating to an intersection of successful settings that allow each memory rank to pass memory operation tests.

Abstract: Methods, systems, and apparatus for reducing power consumption or signal distortions in a semiconductor device package. The semiconductor device package includes a semiconductor device, a first electric path, a second electric path, and an isolation element in the first electric path. The second electric path is electrically connected to the first electric path and a functional unit of the device. The isolation element separates an isolated portion in the first electric path from the second electric path, where the isolation element is configured to reduce current in the isolated portion when a signal is passing through the second electric path.

Abstract: A single-transistor random access memory (RAM) cell may be used as universal memory. The single-transistor RAM cell generally includes a first gate, a 2D-crystal channel, a source, a drain, an ion conductor, and a second (back) gate. The single-transistor RAM cell is capable of drifting ions towards the graphene channel. The ions in turn induce charge carriers from the source into the graphene channel. The closer the ions are to the graphene channel, the higher the conductivity of the graphene channel. As the ions are spaced from the graphene channel, the conductivity of the graphene channel is reduced. Thus the presence of the charged ions adjacent to the channel is used to modify the channel's conductivity, which is sensed to indicate the state of the memory.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. In some examples, multi-level accessing, sensing, and other operations for ferroelectric memory may be based on sensing multiple charges, including a first charge associated with a dielectric of the memory cell and a second charge associated with a polarization of the memory cell. In some cases, multi-level accessing, sensing, and other operations may be based on transferring a first charge associated with a dielectric of the memory cell to a sense amplifier, isolating the sense amplifier, activating the sense amplifier, transferring a second charge associated with a polarization of the memory cell to the sense amplifier, and activating the sense amplifier a second time.

Abstract: A processing device selectively backups only certain data based on a priority or binning structure. In one approach, a non-volatile logic controller stores the machine state by storing in non-volatile logic element arrays a portion of data representing the machine state less than all the data of the machine state. Accordingly, the non-volatile logic controller stores the machine state in the plurality of non-volatile logic element arrays by storing a first set of program data of the machine state according to a first category for backup and restoration and storing a second set of program data of the machine state according to a second category for backup and restoration.

Abstract: A FeSRAM cell includes (a) first and second inverters between a power supply voltage and a ground reference cross-coupled to each other, the first and second cross-coupled inverters providing first and second data terminals; (b) first and second select transistors respectively coupled to the first and second data terminals to control access to the first second data terminals; and (c) first and second ferroelectric capacitors coupled between a first plate line and respectively the first and second data terminals, the first plate line receiving a negative programming voltage having a magnitude greater than the power supply voltage to allow programming one of the first and second ferroelectric capacitors into a first non-volatile programmed state.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A memory array may be operated in a half density mode, in which a subset of the memory cells is designated as reference memory cells. Each reference memory cell may be paired to an active memory cell and may act as a reference signal when sensing the active memory cell. Each pair of active and reference memory cells may be connected to a single access line. Sense components (e.g., sense amplifiers) associated with reference memory cells may be deactivated in half density mode. The entire memory array may be operated in half density mode, or a portion of the array may operate in half density mode and the remainder of the array may operate in full density mode.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A first ferroelectric memory cell may be initialized to a first state and a second ferroelectric memory cell may be initialized to a different state. Each state may have a corresponding digit line voltage. The digit lines of the first and second ferroelectric memory cells may be connected so that charge-sharing occurs between the two digit lines. The voltage resulting from the charge-sharing between the two digit lines may be used by other components as a reference voltage.

Abstract: Methods, systems, and devices for operating an electronic memory apparatus are described. A logic value stored in a ferroelectric random access memory (FeRAM) cell is read onto a first sensing node of a sense amplifier. The reading is performed through a digit line coupling the FeRAM cell to the first sensing node, while the sense amplifier is in an inactive state. A second sensing node of the sense amplifier is biased to a reference voltage provided by a reference voltage source. The biasing is performed while reading the logic value stored in the FeRAM cell onto the first sensing node. The digit line is isolated from the first sensing node after the reading. The sense amplifier is activated, after isolating the digit line from the first sensing node, to amplify and sense a voltage difference between the first sensing node and the second sensing node.

Abstract: Volatile memory cells including dielectric materials exhibiting a nonlinear capacitance as a function of voltage. The volatile memory cells comprise a source region and a drain region within a substrate and a capacitor coupled to one of the source region and the drain region. The capacitor includes a charge storage material disposed between a pair of electrodes. The charge storage material has a crystal structure comprising an oxide of zirconium, hafnium, and bismuth, and is configured and formulated to transition from a first phase to a second phase exhibiting a higher capacitance than the first phase responsive to application of an electrical field. A digit line is electrically coupled to at least one electrode of the pair of electrodes and one of the source region and the drain region. Semiconductor devices and systems including the volatile memory cells and related methods of operating the volatile memory cells are also described.

Abstract: Methods, systems, and apparatuses related to a reprogrammable non-volatile latch are described. A latch may include ferroelectric cells, ferroelectric capacitors, a sense component, and other circuitry and components related to ferroelectric memory technology. The ferroelectric latch may be independent from (or exclusive of) a main ferroelectric memory array. The ferroelectric latch may be positioned anywhere in the memory device. In some instances, a ferroelectric latch may be positioned and configured to be dedicated to single piece of circuitry in the memory device.

Abstract: Disclosed embodiments relate to generating random numbers using two transistor, two capacitor (2T-2C) ferroelectric memory cells. In accordance with one disclosed embodiment, an n-bit random number can be generated by writing to a uniform data pattern to a set of n 2T-2C ferroelectric memory cells in a 1T-1C mode so that all ferroelectric capacitors of the n 2T-2C cells have a polarization state corresponding to the same data value (e.g., all 0's or all l's). The n 2T-2C cells are then read in a 2T-2C mode, so that a random bit (a 0 or 1) is produced for each cell, resulting in an n-bit random number. The n-bit random number is stored in the n 2T-2C ferroelectric memory cells by a rewrite operation. Such random numbers are useful for many purposes, including security, such as authentication, integrity checking, and encryption, and for identification.

Abstract: A method includes applying a first voltage to a first source line of a memory, applying a second voltage to a second source line of the memory, turning on an access transistor of a memory cell of the memory, and performing one of a write operation or a read operation on a metal-ferroelectric-semiconductor (MFS) transistor of the memory cell. Memories on which the method is performed are also disclosed.

Abstract: A configuration for a carbon nanotube (CNT) based memory device can include multiple CNT elements in order to increase memory cell yield by reducing the times when a memory cell gets stuck at a high state or a low state.

Abstract: Methods, systems, and devices for recovering fatigued ferroelectric memory cells are described. Recovery voltages may be applied to a ferroelectric memory cell that is fatigued due to repeated access (read or write) operations. The recovery voltage may have a greater amplitude than the access voltage and may include multiple voltage pulses or a constant voltage. The recovery operation may be performed in the background as the memory array operates, or it may be performed when a host device is not actively using the memory array. The recovery operations may be performed periodically or may include discrete series of pulses distributed among several instances.

Abstract: A memory apparatus may include a bit line sense-amplifier coupled to first and second bit lines; a first precharge unit suitable for coupling the first and second bit lines in response to a bit line equalization signal; a sense-amplifier power control unit suitable for providing a plurality of powers to the bit line sense-amplifier in response to a power control signal; and a second precharge unit suitable for individually changing each voltage level of the first and second bit lines based on a precharge control signal.

Abstract: A technique for erasing a ferroelectric field effect transistor (FeFET) memory circuit comprising a plurality memory cells comprising FeFETs is described. Each FeFET comprises a gate stack, a source, a drain, a channel and a bulk substrate region, where the gate stack comprises a gate and a ferroelectric layer disposed between the gate and the channel. A positive or a negative voltage is applied to the source and drain regions of at least one FeFET memory cell depending on the channel type. The gate and bulk substrate regions are held at a ground state during said applying of the positive voltage to the source and drain regions of the FeFET memory cell to cause erasure of the at least one FeFET memory cell. In addition, a FeFET is described with a charge storage layer disposed adjacently to the ferroelectric layer within the gate stack.

Abstract: A method of fabricating a FinFET device includes a self-aligned contact etch where a source/drain contact module is performed prior to a replacement metal gate (RMG) module. In particular, the method involves forming a sacrificial gate over the channel region of a fin, and an interlayer dielectric over adjacent source/drain regions of the fin. An etch mask is then used to protect source/drain contact regions and enable the removal of the interlayer dielectric from outside of the protected area, e.g., between adjacent fins.

Abstract: An operation recording circuit and an operation method thereof are provided. The operation recording circuit includes a pin monitor unit, a memory unit, a data writing unit, a mode verification unit and a data dumping unit. The pin monitor unit monitors at least one first type pin of an integrated circuit (IC) to correspondingly provide a monitor signal. The data writing unit writes at least one monitor records into the memory unit according the monitor signal. When receiving a test dump command through at least one second type pin of the IC, the mode verification unit correspondingly provides a dump control signal. The data dumping unit determines whether to output the at least one monitor records from the memory unit through the at least one second type pin or not according to the dump control signal.

Abstract: A memory device having at least one output predicting a feasibility of whether the memory device will work properly at a different operating condition including a different supply voltage and/or a different operating frequency than the current supply voltage and/or the current operating frequency. A semiconductor device (e.g. a SoC chip) provides a test to either validate or invalidate the feasibility for the memory device to enter such a different operating condition based on read and write operations of the memory device in normal access cycles. The memory device is partitioned with at least a first memory unit and a second memory unit, which can be coupled to different back-bias voltages. This operating condition predicting function can be enabled or disabled by the semiconductor device in real time operation depending on the feasibility test results.

Abstract: Techniques for reducing disturbance in a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device having reduced disturbance. The semiconductor memory device may comprise a plurality of memory cells arranged in arrays of rows and columns. The semiconductor memory device may also comprise a plurality of data sense amplifiers, coupled to the plurality of memory cells, configured to perform one or more operations during an operation/access cycle, wherein the operation/access cycle may comprise an operation segment and a disturbance recovery segment.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A memory device may maintain a digit line voltage at a ground reference for a duration associated with biasing a ferroelectric capacitor of a memory cell. For example, a digit line that is in electronic communication with a ferroelectric capacitor may be virtually grounded while a voltage is applied to a plate of the ferroelectric capacitor, and the ferroelectric capacitor may be isolated from the virtual ground after a threshold associated with applying the voltage to the plate is reached. A switching component (e.g., a transistor) that is in electronic communication with the digit line and virtual ground may be activated to virtually ground the digit line and deactivated to isolate the digit line from virtual ground.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. Before reading a memory cell, the voltage on an access line of the memory cell may be initialized to a value associated with the threshold voltage of a switching component in electronic communication with the memory cell. The voltage may be initialized by reducing the existing voltage on the access line to the value. The switching component or an additional pull down device, or both, may be used to reduce the voltage of the access line. After the access line has been initialized to the value, the read operation may be triggered.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A ferroelectric memory cell may be used to store a logic state. The capacitance of a digit line of the ferroelectric memory cell may be dynamically increased prior to, and during a portion of, a read operation used to determine a stored logic state of the cell. The capacitance may be increased by leveraging intrinsic capacitance of digit lines of the array—e.g., by shorting one digit line to another digit line. Increasing the capacitance of the digit line may increase the signal on the digit line that is sensed during the read operation.

Abstract: Virtual ground sensing circuits, electrical systems, computing devices, and related methods are disclosed. A virtual ground sensing circuit includes a sense circuit configured to compare a reference voltage potential to a sense node voltage potential, and virtual ground circuitry operably coupled to the sense circuit. The virtual ground circuitry is configured to provide a virtual ground at a first bias voltage potential to a conductive line operably coupled to a selected ferroelectric memory cell, and discharge the conductive line to the sense node responsive to the selected ferroelectric memory cell changing from a first polarization state to a second polarization state. A method includes applying a second bias voltage potential to another conductive line operably coupled to the selected ferroelectric memory cell, and comparing a sense node voltage potential to a reference voltage potential. Electrical systems and computing devices include virtual ground sensing circuits.

Abstract: A method of setting the reference voltage for sensing data states in integrated circuits including ferroelectric random access memory (FRAM) cells of the one-transistor-one capacitor (1T-1C) type. In an electrical test operation, some or all of the FRAM cells are programmed to a particular polarization state. A “shmoo” of the reference voltage for sensing the data state is performed, at one or more worst case electrical or environmental conditions for that data state, to determine a reference voltage limit at which the weakest cell fails to return the correct data when read. A configuration register is then written with a reference voltage based on this reference voltage limit, for example at the limit plus/minus a tolerance.

Abstract: A memory device includes a first memory cell, a second memory cell, a precharge circuit, a sense amplifier, a switch circuit, and a controller. The first memory cell is connected to a first bit line, the second memory cell is connected to a second bit line, and the precharge circuit connected between the first bit line and the second bit line. The sense amplifier includes a first input terminal and a second input terminal. The switch circuit is connected to the first bit line and the first input terminal and to the second bit line and the second input terminal and is configured to control a connection between the first bit line and the first input terminal and a connection between the second bit line and the second input terminal in response to a switch signal. The controller is configured to generate the switch signal in response to a command.

Abstract: A memory element having a novel structure and a signal processing circuit including the memory element are provided. A first circuit, including a first transistor and a second transistor, and a second circuit, including a third transistor and a fourth transistor, are included. A first signal potential and a second signal potential, each corresponding to an input signal, are respectively input to a gate of the second transistor via the first transistor in an on state and to a gate of the fourth transistor via the third transistor in an on state. After that, the first transistor and the third transistor are turned off. The input signal is read out using both the states of the second transistor and the fourth transistor. A transistor including an oxide semiconductor in which a channel is formed can be used for the first transistor and the third transistor.