Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. Prior to writing a logic value to a ferroelectric memory cell, a digit line of a ferroelectric memory cell may be biased to a first voltage, and a cell plate of the ferroelectric memory cell may be biased to a second voltage. A magnitude of a difference between the first voltage and the second voltage may be greater than a magnitude of a write voltage for the first ferroelectric memory cell. The magnitude of the difference between the first voltage and the second voltage may decrease the time to reach a write voltage for the ferroelectric memory cell. Several example cell plate drivers are also disclosed.

Abstract: A memory device is able to store data using both on-chip dynamic random-access memory (“DRAM”) and nonvolatile memory (“NVM”). The memory device, in one aspect, includes NVM cells, word lines (“WLs”), a cell channel, and a DRAM mode select. The NVM cells are capable of retaining information persistently and the WLs are configured to select one of the NVM cells to be accessed. The cell channel, in one embodiment, is configured to interconnect the NVM cells to form a NVM string. The DRAM mode select can temporarily store data in the cell channel when the DRAM mode select is active.

Abstract: A highly reliable semiconductor device in which a shift in threshold voltage of a transistor due to deterioration can be inhibited is provided. A pulse output circuit includes a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, and a sixth transistor. A clock signal is supplied to a drain of the first transistor. A first power supply potential is applied to a source of the second transistor, and a drain of the second transistor is connected to the drain of the first transistor. A second power supply potential is applied to a drain of the third transistor. The first power supply potential is applied to a source of the fourth transistor, and a drain of the fourth transistor is connected to the drain of the third transistor. The first power supply potential is applied to a source of the fifth transistor, and a drain of the fifth transistor is connected to a gate of the third transistor.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A first ferroelectric memory cell may be initialized to a first state and a second ferroelectric memory cell may be initialized to a different state. Each state may have a corresponding digit line voltage. The digit lines of the first and second ferroelectric memory cells may be connected so that charge-sharing occurs between the two digit lines. The voltage resulting from the charge-sharing between the two digit lines may be used by other components as a reference voltage.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. The magnitude of a voltage applied across a ferroelectric capacitor may be dynamically increased during a write operation. For example, a memory cell may be selected for a write operation, and a voltage may be applied to a digit line corresponding to the memory cell during the write operation. An additional charge may be transferred to the digit line—e.g., from an energy storage component, such as a capacitor, that is in electronic communication with the digit line. In turn, the voltage across the ferroelectric capacitor of the memory cell may be increased.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A cell may be written with a value that is intended to convey a different logic state than may typically be associated with the value. For example, a cell that has stored a charge associated with one logic state for a time period may be re-written to store a different charge, and the re-written cell may still be read to have the originally stored logic state. An indicator may be stored in a latch to indicate whether the logic state currently stored by the cell is the intended logic state of the cell. A cell may, for example, be re-written with an opposite value periodically, based on the occurrence of an event, or based on a determination that the cell has stored one value (or charge) for a certain time period.

Abstract: Methods, systems, and apparatuses for memory array bit inversion are described. A memory cell (e.g., a ferroelectric memory cell) may be written with a charge associated with a logic state that may be the inverse of the intended logic state of the cell. That is, the actual logic state of one or more memory cells may be inverted, but the intended logic state of the memory cells may remain unchanged. Different sets of transistors may be configured around a sense component of a cell to enable reading and writing of intended and inverted logic states from or to the cell. For instance, a first set of transistors may be used to read the logic state currently stored at a memory cell, while a second set of transistors may be used to read a logic state inverted from the currently stored logic state.

Abstract: The present disclosure includes apparatuses and methods related to performing logical operations using sensing circuitry. An example apparatus comprises an array of memory cells and sensing circuitry coupled to the array of memory cells. The sensing circuitry includes a primary latch and a secondary latch. The primary latch is coupled to a pair of complementary sense lines and selectively coupled to a pair of adjacent complementary sense lines. The secondary latch is selectively coupled to the primary latch. The primary latch and secondary latch are configured to shift a data value between the pair of adjacent complementary sense lines and the primary latch. The primary latch and secondary latch are configured to shift the data value from the pair of adjacent complementary sense lines without activating a row line.

Abstract: Out of a plurality of transistors, in a power switch which controls, for each logic block, a supply and an interruption of power with respect to the each logic block, each having a gate electrode connected to a well via a contact electrode, and a body region connected to a connection portion of the well with the contact electrode via a well resistor under an element isolation insulating film, and controlling a threshold voltage by changing an electric potential applied to the body region in accordance with a signal of the gate electrode, a plurality of first transistors and a plurality of second transistors which are different from the plurality of first transistors are made to have different delay characteristics from each other between the respective connection portions of the well with the contact electrodes and the respective body regions.

Abstract: An amplifier circuit is disclosed having an amplifier with first and second input terminals coupled to receive an input signal. A first compensation circuit is coupled to the first input terminal, and a second compensation circuit is coupled to the second input terminal. A programmable latch circuit is arranged to select one of the first and second compensation circuits.

Abstract: A method for operating a non-volatile memory device initially includes supplying an erase voltage to the memory cells. The memory cells are in cell strings in a three-dimensional structure. The method further includes performing a first read operation of the memory cells, performing a second read operation of the memory cells, and then performing a first erase verify operation based on results of the first and second read operations. The first erase verify operation may include performing a first exclusive-or (XOR) operation on the first and second read operation results.

Abstract: Reduced errors when sensing non-volatile memory are provided by applying a current spike or preconditioning current for a group of memory cells included a selected cell. During a sense operation, a preconditioning current can be passed through a group of non-volatile memory cells. The preconditioning current is provided prior to applying at least one reference voltage to a selected word line. The preconditioning current may simulate a cell current passing through the channel during a verification phase of programming. The preconditioning current can modify a channel resistance to approximate a state during verification to provide a more stable threshold voltage for the memory cells. Preconditioning currents may be applied selectively for select reference levels, select pages, and/or select operations. Selective application of preconditioning currents based on temperature is also provided.

Abstract: A word line divider which has a simplified circuit structure and can operate stably is provided. A storage device which has a simplified circuit structure and can operate stably is provided. A transistor whose leakage current is extremely low is connected in series with a portion between a word line and a sub word line so that the word line divider is constituted. The transistor can include an oxide semiconductor for a semiconductor layer in which a channel is formed. Such a word line divider whose circuit structure is simplified is used in the storage device.

Abstract: Methods, systems, and devices for recovering fatigued ferroelectric memory cells are described. Recovery voltages may be applied to a ferroelectric memory cell that is fatigued due to repeated access (read or write) operations. The recovery voltage may have a greater amplitude than the access voltage and may include multiple voltage pulses or a constant voltage. The recovery operation may be performed in the background as the memory array operates, or it may be performed when a host device is not actively using the memory array. The recovery operations may be performed periodically or may include discrete series of pulses distributed among several instances.

Abstract: A semiconductor device includes a first signal wiring, a first dummy wiring, and a second dummy wiring. The first signal wiring is configured to be supplied with a first signal potential. The first dummy wiring is insulated from the first wiring. The first dummy wiring is configured to be supplied with a fixed potential. The second dummy wiring is disposed between the first signal wiring and the first dummy wiring. The second dummy wiring is insulated from the first dummy wiring. The second dummy wiring is configured to be supplied with substantially the same potential as the first signal potential.

Abstract: A novel non-volatile latch circuit and a semiconductor device using the non-volatile latch circuit are provided. The latch circuit has a loop structure in which an output of a first element is electrically connected to an input of a second element and an output of the second element is electrically connected to an input of the first element through a second transistor. A transistor using an oxide semiconductor as a semiconductor material of a channel formation region is used as a switching element, and a capacitor is provided to be electrically connected to a source electrode or a drain electrode of the transistor, whereby data of the latch circuit can be retained, and a non-volatile latch circuit can thus be formed.

Abstract: A non-destructive readout ferroelectric memory as well as a method of preparing the ferroelectric memory and a method of operating the ferroelectric memory are disclosed. The ferroelectric memory comprises a ferroelectric thin film layer. The ferroelectric memory of the invention can realize a non-destructive readout by way of current, is suitable for a high density application, is simple in preparation and has a low cost.

Abstract: A semiconductor device includes a first memory cell including a first transistor and a first capacitor, the first transistor comprising a first gate electrode, a first source, and a first drain; a second memory cell including a second transistor and the first capacitor, the second transistor comprising a second gate electrode, a second source, and a second drain; a first word line coupled to the first gate electrode; and a second word line coupled to the second gate electrode. The first capacitor is electrically connected between the first and second transistors.

Abstract: A storage device includes a nonvolatile memory device and a memory controller is provided. The nonvolatile memory device includes a plurality of blocks. The memory controller is configured to detect, upon receiving a power-on signal, a partial block among the plurality of blocks. The partial block includes a first page incompletely programmed due to sudden power-off occurred to the storage device. The memory controller determines whether or not to perform a dummy program operation on the partial block, and programs a second page of the partial bock with dummy data. The first page is different from the second page.

Abstract: A spin transfer torque magnetic random access memory (STT-MRAM) device and a method to perform operations of an embedded eFlash device are disclosed. The STT-MRAM device is configured to include an array of STT-MRAM bitcells. The array includes a plurality of bitlines (BLs) and a plurality of word lines (WLs), where the bitlines form columns and the wordlines form rows of STT-MRAM bitcells. Each STT-MRAM bitcell includes a magnetic tunnel junction (MTJ) element coupled in series to an access transistor having a gate terminal and source and drain terminals. The array includes a plurality of source lines (SLs) coupled to the source terminals of the access transistors. A SL of the plurality of SLs is coupled to source terminals of access transistors of two or more adjacent columns of the STT-MRAM cells. The shared SL is parallel to the plurality of BLs. The operations of such a STT-MRAM bitcell are configured to include: an initialization operation, a program operation, and a sector erase operation.

Abstract: An apparatus may include an internal charge pump within an integrated circuit package, an external pin positioned at an exterior of the integrated circuit package, and a select circuit configured to operate independently from the internal charge pump and located within the integrated circuit package, wherein the select circuit is configurable to selectively couple at least one of the internal charge pump and the external pin to a transmit (TX) sensor electrode.

Abstract: A semiconductor memory device for high speed operation, and for flexible data reading and programming is disclosed. The flash memory of the present disclosure includes: a page buffer/sensor circuit including a volatile memory element that may maintain data with a size corresponding to a page of a memory array; a high speed cache register including a non-volatile memory element that may maintain data with a size corresponding to a page of a memory array. The page buffer/sensor circuit includes a sensor circuit, a data register, and a transmission gate. The data register may transmit and receive data with an input-output buffer. The high speed cache register includes RRAM, wherein the RRAM may transmit and receive data with an input-output buffer via a transmission gate, and may transmit and receive data with the data register via a transmission gate.

Abstract: Some embodiments include transistor constructions having a first insulative structure lining a recess within a base. A first conductive structure lines an interior of the first insulative structure, and a ferroelectric structure lines an interior of the first conductive structure. A second conductive structure is within a lower region of the ferroelectric structure, and the second conductive structure has an uppermost surface beneath an uppermost surface of the first conductive structure. A second insulative structure is over the second conductive structure and within the ferroelectric structure. A pair of source/drain regions are adjacent an upper region of the first insulative structure and are on opposing sides of the first insulative structure from one another.

Abstract: A memory circuit includes a first bit line, a second bit line, and a memory cell that is coupled to first bit line and the second bit line. The memory cell includes a capacitor, a first pass gate transistor, a non-volatile (NV) element, and a second pass gate transistor. The first capacitor has a first terminal coupled to a first storage node and a second terminal coupled to a reference. The first pass gate transistor is coupled between the first bit line and the first storage node. The NV element and a second pass gate transistor are coupled in series, wherein the first NV element and the second pass gate transistor are coupled between the first storage node and the first program line.

Abstract: A memory circuit includes: a bistable circuit (30) that stores data; nonvolatile elements (MTJ1, MTJ2) that store data written in the bistable circuit in a nonvolatile manner, and restore data stored in a nonvolatile manner into the bistable circuit; and a control unit that stores data written in the bistable circuit in a nonvolatile manner and cuts off a power supply to the bistable circuit when the period not to read data from or write data into the bistable circuit is longer than a predetermined time period, and does not store data written in the bistable circuit in a nonvolatile manner and makes the supply voltage for the bistable circuit lower than a voltage during the period to read data from or write data into the bistable circuit when the period not to read or write data is shorter than the predetermined time period.

Abstract: A highly reliable semiconductor device. In a configuration where a precharged source line is discharged to a bit line by establishing electrical continuity between the source line and the bit line through a transistor to read a potential retained at a gate of the transistor, the potential of the bit line is switched in accordance with a change in potential of the source line due to the discharge. With this configuration, the voltage between the source and drain of the transistor can be kept lower than a predetermined voltage by discharge. Accordingly, the source-drain voltage of the transistor can be kept lower than its breakdown voltage, so that the semiconductor device can have high reliability.

Abstract: According to one embodiment, nonvolatile semiconductor memory device comprises: a memory mat including a memory cell having a variable resistance element; a write driver which applies a write current to the memory cell in one of a first direction and a second direction opposite to the first direction in write; and a read driver which applies a verify read current to the memory cell in one of the first direction and the second direction in verify read after write.

Abstract: Memory cell, method for operating the memory cell and method of forming the memory cell are disclosed. The memory cell includes a first selector having a first select transistor with a first gate coupled to a first wordline and first and second source/drain (S/D) regions, and a second selector having at least a second select transistor with a second gate coupled to a second wordline and first and second S/D regions. The memory cell includes a first magnetic tunnel junction (MTJ) element coupled between a first bit line and the first S/D region of the first select transistor, and a second MTJ element coupled between a second bit line and the first S/D region of the second select transistor.

Abstract: Aspects disclosed in the detailed description include write driver circuits for resistive random access memory (RAM) arrays. In one aspect, a write driver circuit is provided to facilitate writing data into a resistive RAM array in a memory system. The write driver circuit is coupled to a selector circuit configured to select a memory bitcell(s) in the resistive RAM array for a write operation. An isolation circuit is provided in the write driver circuit to couple a current source to the selector circuit to provide a write voltage during the write operation and to isolate the current source from the selector circuit when the selector circuit is not engaged in the write operation. By isolating the selector circuit from the current source when the selector circuit is on standby, it is possible to reduce leakage current in the selector circuit, thus reducing standby power consumption in the memory system.

Abstract: This invention concerns a semiconductor memory device comprising: at least one sense amplifier circuit for reading data sensed from selected memory cells in a memory array,—at least one reference circuit, each reference circuit being a replica of the sense amplifier circuit and having an output through which the reference circuit delivers an output physical quantity, a regulation network providing a regulation signal to each sense amplifier circuit and each reference circuit, wherein the regulation signal is derived from an averaging of the output physical quantity over time and/or space, wherein the regulation network comprises a control unit configured to sum up the physical quantities of each output of the reference circuit and a target mean value, the control unit delivering a regulation signal based on the sum, the regulation signal being fed in to each regular sense amplifier circuit and to each reference circuit.

Abstract: A semiconductor device includes a first magnetic tunnel junction (MTJ) device, a second MTJ device, and a top electrode. The first MTJ device includes a barrier layer. The second MTJ device includes the barrier layer. The top electrode is coupled to the first MTJ device and the second MTJ device.

Abstract: Described is an apparatus, for spin state element device, which comprises: a variable resistive magnetic (VRM) device to receive a magnetic control signal to adjust resistance of the VRM device; and a magnetic logic gating (MLG) device, coupled to the VRM device, to receive a magnetic logic input and perform logic operation on the magnetic logic input and to drive an output magnetic signal based on the resistance of the VRM device. Described is a magnetic de-multiplexer which comprises: a first VRM device to receive a magnetic control signal to adjust resistance of the first VRM; a second VRM device to receive the magnetic control signal to adjust resistance of the second VRM device; and an MLG device, coupled to the first and second VRM devices, the MLG device having at least two output magnets to output magnetic signals based on the resistances of the first and second VRM devices.

Abstract: Methods for sensing ferroelectric memory devices and apparatuses using the same have been disclosed. One such apparatus includes a ferroelectric memory cell coupled to a data line, a reference capacitance, and a common node coupled between the data line and the reference capacitance. A current mirror circuit is coupled to the data line and the reference capacitance. During a sense operation, the common node is configured to be at a fixed voltage and the current mirror circuit is configured to mirror displacement current from the reference capacitance to the ferroelectric memory cell.

Abstract: Integrated circuits with memory interface circuitry may be provided. Prior to calibration, a number of samples may be determined by computing probability density function curves as a function of timing window edge asymmetry for different degrees of oversampling. During calibration, duty cycle distortion in data strobe signals may be corrected by selectively delaying the data strobe rising or falling edges. A data clock signal that is used for generating data signals may also suffer from duty cycle distortion. The rising and falling edges of the data clock signal may be selectively delayed to correct for duty cycle distortion. The data path through which the data signals are routed may be adjusted to equalize rising and falling transitions to minimize data path duty cycle distortion. Multi-rank calibration may be performed by calibrating to an intersection of successful settings that allow each memory rank to pass memory operation tests.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. Offsets in the threshold voltage of switching components (e.g., transistors) connected to digit lines may be compensated by using various operating techniques or additional circuit components, or both. For example, a switching component connected to a digit line may also be connected to an offset capacitor selected to compensate for a threshold voltage offset. The offset capacitor may be discharged in conjunction with a read operation, resulting in a threshold voltage applied to the switching component. This may enable all or substantially all of the stored charge of the ferroelectric memory cell to be extracted and transferred to a sense capacitor through the transistor. A sense amplifier may compare the voltage of the sense capacitor to a reference voltage in order to determine the stored logic state of the memory cell.

Abstract: A reliability screen of integrated circuits including ferroelectric random access memory (FRAM) arrays for stuck bits. The FRAM devices are subjected to a high temperature bake in wafer form. A “shmoo” of the reference voltage is performed, at an elevated temperature, for each device to identify a first reference voltage at which a first cell in the device fails a read of its low polarization capacitance data state, and a second reference voltage at which a selected number of cells in the device fail the read. The slope of the line between the first and second reference voltages, in the cumulative fail bit count versus reference voltage plane, is compared with a slope limit to determine whether any stuck bits are present in the device.

Abstract: A system including: a first memory including several portions of one or more pages each, said memory including first and second ports that can simultaneously access, for reading and writing respectively, two distinct pages of portions of the memory; and a control circuit capable of performing write operations to the pages of the memory, each write operation to a page of the memory requiring a reading step of a former datum on said page via the first port, and including a writing step of a new datum to the page via the second port, taking account of the former datum.

Abstract: A write driver for a memory circuit includes a control circuit configured to: operate a first push-pull driver to generate a first drive signal in a first voltage domain at a first node based on an input signal in a second domain and in response to a mode select signal being in a first mode, wherein the first drive signal is at a same logic level as the input signal; operate a second push-pull driver to generate a second drive signal in the first voltage domain at a second node based on the input signal and in response to the mode select signal being in the first mode, wherein the second drive signal is at a complement logic level with respect to the input signal; and operate the first and second push-pull drivers to float the first and second nodes in response to the mode select signal being in a second mode.

Abstract: A battery management system includes at least one controller programmed to, in response to a battery current becoming approximately zero, output an open-circuit voltage based on a sequence of battery terminal voltages measured during a time interval in which the battery current remains approximately zero and while a charge polarization voltage is decreasing. The open-circuit voltage may be further based on a non-linear regression of the sequence of battery terminal voltages. The non-linear regression may minimize a mean-squared error between the battery terminal voltages and corresponding battery terminal voltage estimates. The at least one controller may command the battery current to zero for the time interval. The battery management system may be included in a vehicle with a traction battery.

Abstract: An apparatus comprises field-effect transistor (FET) structures stacked horizontally and vertically in a three-dimensional memory array architecture, gates extending vertically and spaced horizontally between the plurality of FET structures, and a ferroelectric material separating the FET structures and the gates. Individual ferroelectric FETs (FeFETs) are formed at intersections of the FET structures, the gates, and the ferroelectric material. Another apparatus comprises a plurality of bit lines and word lines. Each bit line has at least two sides that are coupled with a ferroelectric material such that each bit line is shared by neighboring gates to form a plurality of FeFETs. A method of operating a memory array comprises applying a combination of voltages to a plurality of word lines and digit lines for a desired operation for a plurality of FeFET memory cells, at least one digit line having the plurality of FeFET memory cells accessible by neighboring gates.

Abstract: A magnetoresistive element includes a laminated structure including a plurality of fixed layers, an intermediate layer formed of a non-magnetic material, and a recording layer, the plurality of fixed layers being laminated via a non-magnetic layer, the plurality of fixed layers having at least a first fixed layer and a second fixed layer, the following formula being satisfied: S1>S2 (wherein S1 is an area of a portion of the first fixed layer adjacent to the intermediate layer, which faces the intermediate layer, and S2 is an area of the fixed layer having the smallest area out of the fixed layers other than the first fixed layer).

Abstract: A ferroelectric random access memory includes a memory cell matrix constituted by a plurality of 1T1C type memory cells. Each of the plurality of memory cells is connected to a j bit line and one pair of k word lines and k plate lines. A plate line drive circuit selectively applies one of a first potential and a second potential having a higher potential level than the first potential to one plate line of the k plate lines. An equalizing circuit performs an equalizing process in which the first potential is applied to each of the j bit lines. The plate line drive circuit applies a third potential having a potential level between the first and second potentials to the one plate line, before starting the equalizing process by the equalizing circuit.

Abstract: Embodiments of the technology implement DIOMEJ cells. In one embodiment, a DIOMEJ cell includes: an MEJ that includes, a ferromagnetic fixed layer, a ferromagnetic free layer, and a dielectric layer interposed between said fixed and free layers, where the fixed layer is magnetically polarized in a first direction, where the free layer has a first easy axis that is aligned with the first direction, and where the MEJ is configured such that when a potential difference is applied across it, the magnetic anisotropy of the free layer is altered such that the relative strength of the magnetic anisotropy along a second easy axis that is orthogonal to the first easy axis, as compared to the strength of the magnetic anisotropy along the first easy axis, is magnified for the duration of the application of the potential difference; and a diode, where the diode and the MEJ are arranged in series.

Abstract: A method for operating a memory device includes sensing a temperature of the resistive memory device, setting a level of a set voltage or current for writing to a memory cell based on the temperature, setting a level of a reset voltage for reset writing to the memory cell based on the temperature, and performing a write operation on the memory cell based on the level of the set voltage or current and the level of the reset voltage. The memory device may be a resistive memory device.

Abstract: A method of operating a first voltage regulator includes electrically coupling a transistor of an output stage of the first voltage regulator between a first power voltage and a second power voltage, and reverse biasing a bulk of the transistor by a back-bias circuit during a standby mode of a memory array. The first voltage regulator is coupled to a second voltage regulator and reverse biasing the bulk of the transistor reduces a contention current between the first voltage regulator and the second voltage regulator.

Abstract: A radio-frequency (RF) switch circuit is configured to maintain a disconnection or a connection between a node and an antenna terminal. The RF switch circuit comprises one or more switch cells. A switch cell comprises one or more transistors. The switch cell comprises one or more gate-drain capacitors. The switch cell comprises one or more source-drain capacitors. A gate-drain capacitor is coupled between a gate of a transistor and a drain of the transistor. A source-drain capacitor is coupled between a source of a transistor and a drain of the transistor.

Abstract: To provide a memory element which keeps a stored logic state even without supply of power. To increase an effect of reducing power consumption by facilitating stop of supply of power to the memory element for a short time. Data (potential) held in a node in a logic circuit can be swiftly saved on a node where one of a source and a drain of the transistor and one electrode of the capacitor included in a memory circuit are connected by lowering a potential of the other electrode of a capacitor before a transistor is turned on. By making a potential of the other electrode of the capacitor when the transistor is in an off state higher than a potential of the other electrode of the capacitor when the transistor is in an on state, a potential of the node can be reliably held even without supply of power.

Abstract: Described herein are techniques related to one or more systems, apparatuses, methods, etc. for programming a memory cell through the use of a program pulse.

Abstract: A memory cell and memories constructed from that memory cell are disclosed. A memory according to the present invention includes a ferroelectric capacitor, a charge source and a read circuit. The charge source receives a data value to be stored in the ferroelectric capacitor. The charge source converts the data value to a remanent charge to be stored in the ferroelectric capacitor and causes that remanent charge to be stored in the ferroelectric capacitor. The read circuit determines a charge stored in the ferroelectric capacitor. The data value has more than three distinct possible states, and the determined charge has more than three determined values. The memory also includes a reset circuit that causes the ferroelectric capacitor to enter a predetermined known reference state of polarization.

Abstract: Asymmetric transistors may be formed by creating pocket implants on one source-drain terminal of a transistor and not the other. Asymmetric transistors may also be formed using dual-gate structures having first and second gate conductors of different work functions. Stacked transistors may be formed by stacking two transistors of the same channel type in series. One of the source-drain terminals of each of the two transistors is connected to a common node. The gates of the two transistors are also connected together. The two transistors may have different threshold voltages. The threshold voltage of the transistor that is located higher in the stacked transistor may be provided with a lower threshold voltage than the other transistor in the stacked transistor. Stacked transistors may be used to reduce leakage currents in circuits such as memory cells. Asymmetric transistors may also be used in memory cells to reduce leakage.