Abstract: Disclosed herein are methods of disrupting cell-to-cell communication. An exemplary method comprises transmitting one or more microwave signals to a communication molecule located in an environment having a plurality of cells. The one or more microwave signals can comprise a first microwave signal and a second microwave signal. The first microwave signal can have a first frequency corresponding to frequency of a first peak in a microwave spectrum associated with rotational modes of the communication molecule. The second microwave signal can have a second frequency corresponding to a frequency of a second peak in the microwave spectrum associated with the rotational modes of the communication molecule.

Abstract: According to one embodiment, a magnetic memory device includes a memory cell including a magnetoresistance effect element, a switching element, and a resistance element connected in series. The resistance element has an asymmetric current-voltage characteristic, and when data is read from the memory cell, a first voltage in a reverse direction is applied to the resistance element, and a resistance value of the resistance element at a time when the first voltage is applied is greater than a resistance value of the resistance element at a time when a second voltage in a forward direction having an absolute value identical to an absolute value of the first voltage is applied.

Abstract: A method includes fabricating a first transistor and a second transistor on a substrate and fabricating a first conducting line and a second conducting line in a first metal layer. The method also includes connecting a gate of the first transistor to the first conducting line and connecting a gate of the second transistor to the second conducting line. The first conducting line and the second conducting line are parallel and adjacent to each other in the first metal layer above the first transistor and the second transistor. The method still includes connecting a source and a drain of the first transistor to a third conducting line.

Abstract: An adaptive control circuit of SRAM (Static Random Access Memory) includes a switch circuit, a forward diode-connected transistor, a backward diode-connected transistor, and a first delay circuit. The switch circuit is supplied by a supply voltage, and is coupled to a first node. The backward diode-connected transistor is coupled in parallel with the forward diode-connected transistor between the first node and a second node. The first delay circuit is coupled between the second node and a ground voltage.

Abstract: An apparatus can include an array of memory cells and control circuitry coupled to the array of memory cells. The control circuitry can be configured to store a number of trim settings and receive signaling indicative of a use of the array of memory cells. The control circuitry can be configured to determine an adjustment to the number of trim settings based at least in part on the signaling.

Abstract: A memory cell comprises first, second, third, and fourth transistors individually comprising a transistor gate. First and second ferroelectric capacitors individually have one capacitor electrode elevationally between the transistor gates of the first, second, third, and fourth transistors. Other memory cells are disclosed, as are arrays of memory cells.

Abstract: A method for regulating the memory includes operations as follows. A mapping relationship among temperatures of a transistor, body bias voltages of the transistor, and data writing time of the memory is acquired, a current temperature of the transistor is acquired, the body bias voltage is regulated based on the current temperature and the mapping relationship, to enable the data writing time corresponding to the regulated body bias voltage to be within a preset writing time.

Abstract: A single-ended data transmission system transmits a signal having a signal voltage that is referenced to a power supply voltage and that swings above and below the power supply voltage. The power supply voltage is coupled to a power supply rail that also serves as a signal return path. The signal voltage is derived from two signal supply voltages generated by a pair of charge pumps that draw substantially same amount of current from a power supply.

Abstract: An apparatus can include an array of memory cells and control circuitry coupled to the array of memory cells. The control circuitry can be configured to store a number of trim settings and receive signaling indicative of a use of the array of memory cells. The control circuitry can be configured to determine an adjustment to the number of trim settings based at least in part on the signaling.

Abstract: A static random access memory SRAM unit and a related apparatus are provided, to reduce power consumption of an SRAM when the SRAM memory is accessed. The SRAM unit is located in an SRAM memory, and the SRAM memory includes an SRAM storage array including a plurality of SRAM units. The SRAM unit includes: a storage circuit, connected to each of a write circuit and a read circuit, and configured to store data; the write circuit, configured to write data into the storage circuit; and the read circuit, configured to: after a read enabling signal is valid, enable data on a read bit line connected to the SRAM unit to be the data stored in the storage circuit.

Abstract: A memory device may include a first sub-block and a second sub-block each including a plurality of select transistors and a plurality of memory cells, a peripheral circuit performing a read operation on data stored in the first sub-block, and a control logic controlling the peripheral circuit to turn on the plurality of select transistors included in each of the first and second sub-blocks and apply a read voltage to a selected word line among a plurality of word lines.

Abstract: Methods of operating semiconductor memory devices with floating body transistors, using a silicon controlled rectifier principle are provided, as are semiconductor memory devices for performing such operations.

Abstract: The memory device includes a memory cell array including a plurality of memory cells connected to a plurality of word lines and a plurality of bit lines, a row control circuit including a plurality of row switches corresponding to the word lines, a column control circuit including a plurality of column switches corresponding to the bit lines, and a control logic circuit configured to control pre-charge operations on a word line and a bit line of a selected memory cell and perform a control operation to float the word line and the bit line together after a pre-charge period during a data reading operation. One of the word line and the bit line is floated after the pre-charge period and the other one is pseudo-floated after the pre-charge period.

Abstract: A random access memory (RAM) includes a bit-line, a source-line, a memory cell connected to the bit-line and the source-line, and a read/write circuit connected to the bit-line and the source-line and including a negative differential resistance (NDR) device.

Abstract: An electronic component includes: a plurality of first substrates that are connected in series along a coupling path; and a second substrate that is connected with one first substrate of the plurality of first substrates. The second substrate is in line with the one first substrate along a connection direction intersecting the coupling path, and the plurality of first substrates and the second substrate are configured to be foldable such that they are stacked.

Abstract: A volatile memory array using vertical thyristors is disclosed together with methods of operating the array to read data from and write data to the array.

Abstract: After programming a set of resistive memory cells in a resistive memory device, the programmed states and the functionality of each resistive memory cell in the programmed set can be verified by a primary determination method and a secondary determination method. The primary determination method employs the step of determining whether a measured electrical current at a preset read voltage for the selected resistive memory cell is within electrical current specification for the selected resistive state. If the selected cell fails the primary determination method, the second determination method is performed, which includes determining whether a measured threshold voltage for the selected resistive memory cell is within threshold voltage specification for the selected resistive state. If the selected cell fails both methods, the selected cell is identified as a non-functional resistive memory cell. Otherwise, the selected cell is identified as an operational cell.

Abstract: Memory cells are formed with vertical thyristors to create a volatile memory array. Power consumption in such arrays is reduced or controlled for an operation on a set of memory cells in an array, sequentially engaging subsets of memory cells for the operation while keeping the remaining memory cells of the set on hold until all the memory cells of the set have been operated on.

Abstract: In one form, a process of manufacturing an avalanche photodiode includes forming an insulating layer over an active region of a semiconductor substrate. A shallow terminal of the avalanche photodiode is defined using a first patterned mask. A first dopant is implanted through the first patterned mask and the insulating layer to form the shallow terminal. The first patterned mask is removed. A deep terminal of the avalanche photodiode is defined using second patterned mask. A second dopant is implanted through the second patterned mask and insulating layer to form the deep terminal of the avalanche photodiode. A respective terminal of at least one of the shallow terminal and the deep terminal is defined using a respective patterned mask that forms at least two regions that are spatially separated from each other with no implanted structure located in a space therebetween.

Abstract: In one example, a volatile selector is switched from a low conduction state to a first high conduction state with a first voltage level and then the first voltage level is removed to activate a relaxation time for the volatile selector. The relaxation time is defined as the time the first volatile selector transitions from the high conduction state back to the low conduction state. The volatile selector is switched with a second voltage level of opposite polarity to the first voltage level to significantly reduce the relaxation time of the volatile selector.

Abstract: A memory device and method comprising a metal oxide material disposed between and in electrical contact with first and second conductive electrodes, and a voltage source configured to apply a plurality of voltage pulses spaced apart in time across the first and second electrodes. For each one of the voltage pulses, an amplitude of the voltage increases during the voltage pulse.

Abstract: Junction diodes or MOS devices fabricated in standard FinFET technologies can be used as program selectors or One-Time Programmable (OTP) element in a programmable resistive device, such as interconnect fuse, contact/via fuse, anti-fuse, or emerging nonvolatile memory such as MRAM, PCRAM, CBRAM, or RRAM. The MOS or diode can be built on at least one fin structure or at least one active region that has at least one first active region and a second active region. The first and the second active regions can be isolated by a dummy MOS gate or silicide block layer (SBL)to construct a diode.

Abstract: A temperature sensor circuit has a reference voltage generator that is trimmable at two temperatures for increased accuracy. The reference voltage generation section generates a reference voltage, the level of which is trimmable. A voltage divider section is connected to receive the reference voltage from the reference voltage generation section and generate a plurality of comparison voltage levels determined by the reference voltage and a trimmable resistance. An analog-to-digital converter can then be connected to a temperature dependent voltage section to receive the temperature dependent output voltage, such as a proportional to absolute temperature type (PTAT) behavior, and connected to the voltage divider section to receive the comparison voltage levels. The analog to digital converter generates an output indicative of the temperature based upon a comparison of the temperature dependent output voltage to the comparison voltage levels.

Abstract: The invention is a method and system for detecting attackers that are interested in attacking an organization's infrastructure during the reconnaissance phase of an Advanced Persistent Threat (APT). APTs are very sophisticated attacks and incorporate advanced methods for evading current security mechanisms. Therefore, the present invention uses an innovative social network honeypot.

Abstract: DC-DC current mode switching power converters that have negative current capability are presented. The power converters comprise: an output node, a pass device connected to the output node of the power converter, the pass device being configured to operate in accordance with a PWM signal and to supply at least a portion of an output current of the power converter, a PWM comparator for generating the PWM signal for controlling operation of the pass device in accordance with a current conducted by the pass device and a difference between an output voltage of the power converter and a reference voltage. The converters have push pull class B (or AB) current sensing, dynamic biasing of a current sense amplifier using error information, and using operational transconductance amplifiers that are fed an error voltage. This results in a lower quiescent current at zero load.

Abstract: A semiconductor device includes an insulating layer on a semiconductor substrate, a bit line including TiAl and disposed on the insulating layer, a sidewall layer disposed on opposite sides of the bit line, a word line including TiN and disposed on the sidewall layer intersecting the bit line, and an air gap in an intersection region of the bit line and the word line. The thickness of the sidewall layer is larger than the thickness of the bit line. By having the TiAl bit line and TiN word line, the uniformity of the bit line and word line can be easily controlled to improve the performance of the semiconductor device.

Abstract: Memory cells are formed with vertical thyristors to create a volatile memory array. Power consumption in such arrays is reduced or controlled with various techniques including encoding the data stored in the arrays.

Abstract: A memory cell based upon cross-coupled thyristors for an SRAM integrated circuit can be implemented in different combinations of MOS and bipolar select transistors with the thyristors in a semiconductor substrate with shallow trench isolation. Standard CMOS process technology can be used to manufacture the SRAM cells.

Abstract: A two-transistor memory cell based upon a thyristor for an SRAM integrated circuit can be implemented in different combinations of MOS and bipolar select transistors, or without select transistors, with the thyristor in a semiconductor substrate with shallow trench isolation. Standard CMOS process technology can be used to manufacture the SRAM cells.

Abstract: A memory cell based upon thyristors for an SRAM integrated circuit can be implemented in different combinations of MOS and bipolar select transistors, or without select transistors, with thyristors in a semiconductor substrate with shallow trench isolation. Standard CMOS process technology can be used to manufacture the SRAM cells. Special circuitry provides lowered power consumption during standby.

Abstract: A semiconductor device includes an insulating layer on a semiconductor substrate, a bit line including TiAl and disposed on the insulating layer, a sidewall layer disposed on opposite sides of the bit line, a word line including TiN and disposed on the sidewall layer intersecting the bit line, and an air gap in an intersection region of the bit line and the word line. The thickness of the sidewall layer is larger than the thickness of the bit line. By having the TiAl bit line and TiN word line, the uniformity of the bit line and word line can be easily controlled to improve the performance of the semiconductor device.

Abstract: Embodiments disclosed include memory cell operating methods, memory cell programming methods, memory cell reading methods, memory cells, and memory devices. In one embodiment, a memory cell includes a wordline, a first bitline, a second bitline, and a memory element. The memory element is electrically connected to the wordline and selectively electrically connected to the first bitline and the second bitline. The memory element stores information via a resistive state of the memory element. The memory cell is configured to convey the resistive state of the memory element via either a first current flowing from the first bitline through the memory element to the wordline or a second current flowing from the wordline through the memory element to the second bitline.

Abstract: According to one embodiment, a magnetic memory includes a cell array includes a plurality of memory cells, each memory cell including a magnetoresistive effect element; and a read circuit to read data from a memory cell selected based on an address signal from among the memory cells. The read circuit selects one determination level from among a plurality of determination levels corresponding to a position of a magnetoresistive effect element in the cell array and uses the selected determination level to perform reading of the data.

Abstract: A monolithic three-dimensional memory array is provided that includes a first memory level and a second memory level disposed above or below the first memory level. The first memory level includes a plurality of vertically oriented p-i-n diodes that each include a bottom heavily doped p type region. The second memory level includes a plurality of vertically oriented p-i-n diodes that each include a bottom heavily doped n type region. Numerous other aspects are also provided.

Abstract: According to various embodiments, a resistive-switching memory element and memory element array that uses a bipolar switching includes a select element comprising only a single diode that is not a Zener diode. The resistive-switching memory elements described herein can switch even when a switching voltage less than the breakdown voltage of the diode is applied in the reverse-bias direction of the diode. The memory elements are able to switch during the very brief period when a transient pulse voltage is visible to the memory element, and therefore can use a single diode per memory cell.

Abstract: A nonvolatile memory (“NVM”) bitcell includes a capacitor, an asymmetrically doped transistor, and a gated diode device. The capacitor, transistor, and gated diode device are each electrically coupled to different active regions and metal contacts. The three devices are coupled by a floating gate that traverses the three active regions. The gated diode device allows for erasure of an entire NVM memory more efficiently and using less substrate space than a similar device that uses a transistor. The asymmetric transistor, in conjunction with the capacitor, is used to both program and read the logical state of the floating gate. The capacitor and floating gate are capacitively coupled together, removing the need for a separate selection device to perform read and write operations.

Abstract: The present invention discloses a small-grain three-dimensional memory (3D-MSG). Each of its memory cells comprises a thin-film diode with critical dimension no larger than 40 nm. The thin-film diode comprises at least a small-grain material, whose grain size G is substantially smaller than the diode size D. The small-grain material is preferably a nano-crystalline material or an amorphous material. The critical dimension f of the small-grain diode is smaller than the critical dimension F of the single-crystalline transistor.

Abstract: A nonvolatile semiconductor memory device in accordance with an embodiment comprises a plurality of first, second lines, a plurality of memory cells, and a control circuit. The plurality of second lines extend so as to intersect the first lines. The plurality of memory cells are disposed at intersections of the first, second lines, and each includes a variable resistor. The control circuit is configured to control a voltage applied to the memory cells. The control circuit applies a first pulse voltage to the variable resistor during a forming operation. In addition, the control circuit applies a second pulse voltage to the variable resistor during a setting operation, the second pulse voltage having a polarity opposite to the first pulse voltage. Furthermore, the control circuit applies a third pulse voltage to the variable resistor during a resetting operation, the third pulse voltage having a polarity identical to the first pulse voltage.

Abstract: A phase change memory device having a multi-level and a method of driving the same are presented. The disclosed phase change memory device includes variable resistors and shifting units. The variable resistors are interchanged into set and reset states in response to an applied current. The shifting units, which are connected to the variable resistors, shift resistance distribution in the set and reset state of the variable resistors by a predetermined level.

Abstract: MIMCAP diodes are provided that can be suitable for memory device applications, such as current selector devices for cross point memory array. The MIMCAP diodes can have lower thermal budget as compared to Schottky diodes and controllable lower barrier height and lower series resistance as compared to MIMCAP tunneling diodes. The MIMCAP diode can include a barrier height modification layer, a low leakage dielectric layer and a high leakage dielectric layer. The layers can be sandwiched between two electrodes.

Abstract: This semiconductor memory device comprises: a memory cell array configured as an arrangement of memory cells disposed at intersections of a plurality of first lines disposed substantially in parallel and a plurality of second lines disposed to intersect the first lines, each of the memory cells including a variable resistance element; and a control circuit configured to control the memory cell array. The control circuit is configured to change a voltage value of a resetting verify voltage applied for confirming completion of the resetting operation according to a degree of change of resistance of the memory cell when performing the resetting operation to change the memory cell from a low-resistance state to a high-resistance state.

Abstract: A cross point nonvolatile memory device capable of suppressing sneak-current-caused reduction in sensitivity of detection of a resistance value of a memory element is provided. The device includes perpendicular bit and word lines; a cross-point cell array including memory cells each having a resistance value reversibly changing between at least two resistance states according to electrical signals, arranged on cross-points of the word and bit lines; an offset detection cell array including an offset detection cell having a resistance higher than that of the memory cell in a high resistance state, the word lines being shared by the offset detection cell array; a read circuit (a sense amplifier) that determines a resistance state of a selected memory cell based on a current through the selected bit line; and a current source which supplies current to the offset detection cell array in a read operation period.

Abstract: A memory cell with a decoupled read/write path includes a switch comprising a first terminal connected to a first line and a second terminal connected to a second line, a resistive switching device connected between a gate of the switch and a third line, and a conductive path between the gate of the switch and the second line.

Abstract: A gated diode memory cell is provided, including one or more transistors, such as field effect transistors (“FETs”), and a gated diode in signal communication with the FETs such that the gate of the gated diode is in signal communication with the source of a first FET, wherein the gate of the gated diode forms one terminal of the storage cell and the source of the gated diode forms another terminal of the storage cell, the drain of the first FET being in signal communication with a bitline (“BL”) and the gate of the first FET being in signal communication with a write wordline (“WLw”), and the source of the gated diode being in signal communication with a read wordline (“WLr”).

Abstract: A non-volatile electro-mechanical diode memory cell is described for implementation of compact (4F2) cross-point memory arrays. The electro-mechanical diode memory cells operate with relatively low set/reset voltages and excellent retention characteristics, and are multi-time programmable. Due to its simplicity, this electro-mechanical diode memory cell is attractive for implementation of three-dimensional memory arrays for higher storage density.

Abstract: Junction diodes fabricated in standard CMOS logic technologies can be used as program selectors for a programmable resistive device, such as electrical fuse, contact/via fuse, anti-fuse, or emerging nonvolatile memory such as MRAM, PCM, CBRAM, or RRAM. The diode can be constructed by P+ and N+ active regions on an N well as the P and N terminals of the diode. By applying a high voltage to the P terminal of a diode and switching the N terminal of a diode to a low voltage for proper duration of time, a current flows through a resistive element in series with the program selector may change the resistance state. The P+ active region of the diode can be isolated from the N+ active region in the N well by using dummy MOS gate, SBL, or STI isolations. If the resistive element is an interconnect fuse based on CMOS gate material, the resistive element can be coupled to the P+ active region by an abutted contact such that the element, active region, and metal can be connected in a single rectangular contact.

Abstract: A resistance change memory includes a first conductive line extending in a first direction, a second conductive line extending in a second direction which is crossed to the first direction, a cell unit including a memory element and a rectifying element connected in series between the first and second conductive lines, and a control circuit which is connected to both of the first and second conductive lines. The control circuit controls a voltage to change a resistance of the memory element between first and second values reversibly. The rectifying element is a diode including an anode layer, a cathode layer and an insulating layer therebetween.

Abstract: A system and method for operating a unipolar memory cell array including a bidirectional access diode. An example embodiment is a method including determining if the operating state of the unipolar memory cell is in a select state or a deselect state and the programming state is a read state or a write state. The method switches a column voltage switch based on the operating state and the programming state of the unipolar memory cell. The method further switches a row voltage switch based on the operating state and the programming state of the unipolar memory cell.

Abstract: A nonvolatile semiconductor memory device include: a two terminal structured variable resistive element, wherein resistive characteristics defined by current-voltage characteristics at both ends transit between low and high resistance states stably by applying a voltage satisfying predetermined conditions to the both ends. A transition from the low resistance state to the high resistance state occurs by applying a voltage of a first polarity whose absolute value is at or higher than first threshold voltage, and the reverse transition occurs by applying a voltage of a second polarity whose absolute value is at or higher than a second threshold voltage. A load circuit is connected to the variable resistive element in series having an adjustable load resistance. A voltage generation circuit applies a voltage to both ends of a serial circuit. The variable resistive element can transit between the states by adjusting a resistance of the load circuit.

Abstract: A semiconductor device has a DRAM cell configured from an information charge accumulating capacitor and a memory cell selecting transistor, the threshold voltage value of a MOS transistor that constitutes a sense circuit is monitored, and the monitored threshold voltage value of the MOS transistor is converted through the use of a transfer ratio that is determined based on the capacitance of the information charge accumulating capacitor and the parasitic capacitance of the bit line. The converted voltage value is level-shifted so that the pre-charge voltage of a pre-charge circuit is a pre-set voltage, a current feeding capability is added to the level-shifted voltage value, and the voltage is fed as the pre-charge voltage.