Abstract: A semiconductor memory cell, semiconductor memory devices comprising a plurality of the semiconductor memory cells, and methods of using the semiconductor memory cell and devices are described. A semiconductor memory cell includes a substrate having a first conductivity type; a first region embedded in the substrate at a first location of the substrate and having a second conductivity type; a second region embedded in the substrate at a second location of the substrate and have the second conductivity type, such that at least a portion of the substrate having the first conductivity type is located between the first and second locations and functions as a floating body to store data in volatile memory; a trapping layer positioned in between the first and second locations and above a surface of the substrate; the trapping layer comprising first and second storage locations being configured to store data as nonvolatile memory independently of one another; and a control gate positioned above the trapping layer.

Abstract: Systems, methods, and memory device with row lines and column lines arranged in a matrix configuration with a memory cell coupled to one of the column lines and one of the row lines. The memory cell includes a storage capacitor with a first plate coupled to a storage node, a CMOS-compatible non-volatile storage element having a node coupled to the storage node and configured to hold a charge corresponding to a binary value, and an access transistor coupled to the storage node. The access transistor includes a word line gate, a first node, and a second node, the word line gate being coupled to the one of the plurality of row lines, the first node being coupled to the one of the plurality of column lines, the second node being coupled to the storage node and to said node of the CMOS-compatible non-volatile storage element.

Abstract: A nonvolatile semiconductor memory device comprises a first PMOS transistor and a second PMOS transistor having a gate, the first and the second PMOS transistors being connected in series; and a first NMOS transistor and a second NMOS transistor having a gate, the first and the second NMOS transistors being connected in series; wherein the gate of the second PMOS transistor and the gate of the second NMOS transistor are commonly connected and floated.

Abstract: A memory cell structure for a memory device is provided, the memory cell structure comprising a read transistor having a floating gate node, a tunnelling capacitor, and a coupling capacitor stack. The tunnelling capacitor is connected to the floating gate node and has a first programming terminal, whilst the coupling capacitor stack is connected to the floating gate node and has a second programming terminal. The coupling capacitor stack comprises at least two coupling capacitors arranged in series between the floating gate node and the second programming terminal, with the coupling capacitor stack having a larger capacitance than the tunnelling capacitor. During a programming operation, a voltage difference is established between the first programming terminal and the second programming terminal to cause charge tunnelling to occur through the tunnelling capacitor, such that after the programming operation a charge is stored in the floating gate node.

Abstract: Embodiments provide systems, methods, and apparatuses with a plurality of row lines and column lines arranged in a matrix, and at least one memory cell having an access transistor and a CMOS-compatible non-volatile storage element coupled to the access transistor in series. The CMOS-compatible non-volatile storage element includes a node and is configured to hold a charge corresponding to a n-bit binary value where n is an integer greater than 1. The access transistor has a word line gate coupled to a row line, a first node coupled to a column line, a second node coupled to a storage node, with the storage node connected to said node of the CMOS-compatible non-volatile storage element. Access circuitry coupled to the memory cell is configured to activate the memory cell and sense a resulting current corresponding to the n-bit binary value.

Abstract: A memory array is provided that includes a transistor having two active gates sharing a source, a drain, and a channel of the transistor. One of the active gates may be coupled to a volatile memory portion of a memory cell, such as a DRAM cell, and the other active gate may be coupled to a non-volatile memory portion, for example, a charge storage node such as a SONOS cell. Methods of operating the memory array are provided that include transferring data from the volatile memory portions to the non-volatile memory portions, transferring data from the non-volatile memory portions to the volatile memory portions, and erasing the non-volatile memory portions of a row of memory cells.

Abstract: Memory devices are disclosed. One example of a memory device may include two layers of memory arrays each containing at least four memory cells. In particular, the memory device includes two word lines commonly shared by the two layers of the memory arrays, with the word lines coupled with the memory cells and providing gate regions of the memory cells. Additionally, a first pair of bit lines cross under the two word lines and providing source and drain regions to the first layer of the two layers of the memory arrays, and a second pair of bit lines cross over the two word lines and providing source and drain regions to the second layer of the two layers of the memory arrays. A first set of channel regions are disposed between the source and drain regions to the first layer of the two layers of the memory arrays, and a second set of channel regions are disposed between the source and drain regions to the second layer of the two layers of the memory arrays.

Abstract: A method and apparatus are provided for programming a non-volatile data storage device, in which a fast write operation can be performed using a plurality of page buffers included in the non-volatile data storage device when the write operation is performed in a way of using interleaving for each channel in a multi-channel system using a plurality of non-volatile data storage devices. The method includes programming data in a memory cell array included in the non-volatile data storage device using a page buffer selected from among a plurality of page buffers included in the non-volatile data storage device and performing a setup operation for loading data using another page buffer, which is different from the page buffer selected during the programming.

Abstract: A non-volatile programmable memory cell suitable for use in a programmable logic array includes a non-volatile MOS transistor of a first conductivity type in series with a volatile MOS transistor of a second conductivity type. The non-volatile MOS transistor may be a floating gate transistor, such as a flash transistor, or may be another type of non-volatile transistor such as a floating charge-trapping SONOS, MONOS transistor, or a nano-crystal transistor. A volatile MOS transistor, an inverter, or a buffer may be driven by coupling its gate or input to the common connection between the non-volatile MOS transistor and the volatile MOS transistor.

Abstract: A memory device comprises a non-volatile electrically alterable memory which is susceptible to read disturbance. The device has a control circuit for controlling the operation of the non-volatile memory. The device further has a first volatile cache memory. The first volatile cache memory is connected to the control circuit and is for storing data to be written to or read from the non-volatile memory, as cache for the memory device. The device further has a second volatile cache memory. The second volatile cache memory is connected to the control circuit and is for storing data read from the non-volatile memory as read cache for the memory device. Finally the control circuit reads data from the second volatile cache memory in the event of a data miss from the first volatile cache memory, and reads data from the non-volatile memory in the event of a data miss from the first and second volatile cache memories.

Abstract: A semiconductor memory device comprises a memory cell array comprising memory cells of a first type. The memory cell array performs write and read operations in response to signals designed for the operation of a memory cell array comprising memory cells of a type other than the first type.

Abstract: A non-volatile DRAM cell includes a pass-gate transistor and a cell capacitor. A read operation of the non-volatile cell begins by negatively charging the cell capacitor. A cell capacitor of an associated dummy non-volatile DRAM cell is fully discharged. The pass-gate transistor is activated and if the pass-gate transistor is programmed it does not turn on and if it is erased, it turns on. Charge is shared on the complementary pair of precharged bit lines connected to the non-volatile DRAM cell and its associated Dummy non-volatile DRAM cell. A sense amplifier detects the difference in the data state stored in the pass-gate transistor. The program and erase of the non-volatile DRAM cell is accomplished by charge injection from the associated bit line of the non-volatile DRAM cell.

Abstract: A hot electron (BBHE) is generated close to a drain by tunneling between bands, and bit data writing is performed by injecting the hot electron into a charge storage layer. When Vg is a gate voltage, Vsub is a cell well voltage, Vs is a source voltage and Vd is a drain voltage, a relation of Vg>Vsub>Vs>Vd is satisfied, Vg?Vd is a value of a potential difference required for generating a tunnel current between the bands or higher, and Vsub?Vd is substantially equivalent to a barrier potential of the tunnel insulating film or higher.

Abstract: Disclosed is a method of performing a read operation in a NAND/RAM semiconductor memory device. The semiconductor memory device comprises a NAND flash memory device having a memory cell array and a page buffer, and a data RAM outputting data in response to a clock signal received from a host. The method comprising; sensing data stored in one page of the memory cell array in the page buffer, transferring the sensed data from the page buffer to the data RAM in multiple blocks via a corresponding number of transfer operations, and reading the transferred data from the data RAM in response to the host clock signal, wherein a read-out operation for the transferred data commences during any one of the plurality of transfer time periods.

Abstract: A buried bipolar junction is provided in a floating gate transistor flash memory device. During a write operation electrons are injected into a surface depletion region of the memory cell transistors. These electrons are accelerated in a vertical electric field and injected over a barrier to a floating gate of the cells.

Abstract: The present disclosure is directed to connectors and methods for passing signals through capacitive coupling and electron tunneling. The connectors according to the present disclosure can include contacts that have a dielectric film or coating applied at least at a contact interface area where the contacts engage with the contacts of a complementary mating connector. The contacts of the either or both of the connector and complementary connector can be coated with a dielectric film. The dielectric film can be selected from metal oxides and can be applied using known methods such as vapor deposition methods, oxidative methods, plating methods and adhesive coating methods. Performance parameters such as capacitance and resistance can be selected by selecting the material for the film and the thickness of the dielectric film and provides a contrast between the requirements for high frequency signal transfer using capacitive coupling and electron tunneling versus traditional metallic contact.

Abstract: A semiconductor device includes a sense amplifier and a decoder provided on a semiconductor substrate together with memory cells provided above the sense amplifier and the decoder. Each of the memory cells includes a channel region, in which current flows in a direction perpendicular to a surface of the semiconductor substrate, a charge accumulation region provided along the channel region, and an insulator film provided between the channel region and the charge accumulation region.

Abstract: A nonvolatile SRAM circuit has an SRAM cell and one or two FLOTOX EEPROM cells connected to the data storage terminals of the SRAM cell. In programming to a first data level, the threshold voltage of a FLOTOX EEPROM transistor is brought to a programmed voltage level greater than a read voltage level and erasing to a second data level, the threshold voltage of the FLOTOX EEPROM transistor is brought to an erased voltage level less than the read voltage level. The nonvolatile SRAM array provides for restoring data to an SRAM cell from a FLOTOX EEPROM memory cell(s) at a power initiation and storing data to the FLOTOX EEPROM memory cell(s) to the SRAM cell at power termination. A power detection circuit for providing signals indicating power initiation and power termination to instigate restoration and storing of data between an SRAM cell and a FLOTOX EEPROM cell(s).

Abstract: The present invention relates to a flash memory cell string. The flash memory cell string includes a plurality of cell devices and switching devices connected to ends of the cell devices. Each of the cell devices includes a semiconductor substrate, and a transmissive insulating layer, a charge storage node, a control insulating layer and a control electrode sequentially formed on the semiconductor substrate. In the flash memory cell string, a buried insulating layer is provided on the semiconductor substrate between the cell device and an adjacent cell device, thus enabling an inversion layer, which performs the functions of source/drain, to be easily formed. According to the present invention, the reduction characteristics and performance of the cell devices of NAND flash memory are improved, and the inversion layer of a channel is induced through fringing electric fields from the control electrode and the charge storage node if necessary.

Abstract: A nonvolatile storage including a plurality of blocks each serving as one unit in erasing operation and performs a plurality of erasing operations successively, the nonvolatile storage comprising: a volatile memory cell array for storing erase setting information on each block, the information indicating whether or not its associated block is a target to be erased; a write amplifier for writing the erase setting information in the volatile memory cell array; a first readout amplifier for reading out the erase setting information on a target block from the volatile memory cell array upon start of the erasing operation; and a second readout amplifier for reading out the erase setting information on a target block from the volatile memory cell array upon start of readout operation.

Abstract: First and second complimentary static random-access-memory cell bit lines are coupled to first and second bit nodes through first and second access transistors controlled by a word line. A first inverter has an input coupled to the first bit node and an output coupled to the second bit node. A second inverter has an input coupled to the second bit node and an output coupled to the first bit node through a first transistor switch. A transistor switch is coupled between the output of a non-volatile memory cell and the first bit node. A control circuit coupled to the gate of the transistor switch. Either the drive level of the non-volatile memory cell is selected to overpower the output of the second inverter or the second inverter is decoupled from the first bit node while the output of the non-volatile memory cell is coupled to the first bit node.

Abstract: A non-volatile memory cell fabricated with a conventional CMOS process, including a flip-flop circuit having an NMOS transistor that shares a floating gate with a write PMOS capacitor and an erase PMOS capacitor. An erase function is implemented by inducing Fowler-Nordheim tunneling through the erase PMOS capacitor, thereby providing a positive charge on the floating gate. A write function is implemented by inducing Fowler-Nordheim tunneling through the NMOS transistor, thereby providing a negative charge on the floating gate. The write PMOS capacitor provides bias voltages during the erase and write operations. Prior to a read operation, the flip-flop circuit is reset. If the floating gate stores a positive charge, the NMOS transistor turns on, thereby switching the state of the flip-flop circuit. If the floating gate stores a negative charge, the NMOS transistor turns off, thereby leaving the flip-flop circuit in the reset state.

Abstract: A process of operating a memory array includes performing all volatile and nonvolatile operations on an nvDRAM cell array via a single data interface and using only DRAM-level signals on the data interface.

Abstract: A memory circuit includes a single transistor storing both volatile and nonvolatile bit charges.

Abstract: A memory circuit includes a high voltage region providing storage of a nonvolatile bit, and a low voltage region providing at least partial storage of a volatile bit. The high and low voltage regions are isolated from one another and formed by a plurality of transistors in series between a current source and a bit line.

Abstract: A method, apparatus and system providing a memory device having an array of cells which may be selectively designated for either error correction code use or redundancy cell use.

Abstract: Disclosed herein is a one-transistor (1T) floating-body Dynamic Random Access Memory (DRAM) cell device with a non-volatile function for implementing the high integration/high performance DRAM. The 1T floating-body DRAM cell device includes a floating body for storing information of the DRAM cell device, a source and a drain formed on respective sides of the floating body, a gate insulating layer formed on a top of the floating body, a gate electrode formed on a top of the gate insulating layer, a gate stack formed under the floating body and configured to have a charge storage node for storing electric charges, and a control electrode formed on a lower side of the gate stack or partially or completely surrounded by the gate stack. The DRAM cell device performs “write0” and “write1” operations or a read operation. The DRAM cell device performs a non-volatile program operation or a non-volatile erase operation.

Abstract: A high speed voltage mode sensing is provided for a digital multibit non-volatile memory integrated system. An embodiment has a local source follower stage followed by a high speed common source stage. Another embodiment has a local source follower stage followed by a high speed source follower stage. Another embodiment has a common source stage followed by a source follower. An auto zeroing scheme is used. A capacitor sensing scheme is used. Multilevel parallel operation is described.

Abstract: A memory circuit includes volatile memory cells coupled to bit lines, and nonvolatile memory cells coupled to the volatile memory cells via the bit lines but not via complement bit lines.

Abstract: A nonvolatile semiconductor memory device includes a first latch to store data, a nonvolatile memory cell including two MIS transistors to store data as an irreversible change of transistor characteristics occurring in one of the two MIS transistors selected in response to the data stored in the first latch, a second latch to store data obtained by sensing a difference in the transistor characteristics between the two MIS transistors, a logic circuit to produce a signal indicative of comparison between the data of the first latch and the data of the second latch, and a control circuit configured to repeat a store operation storing data in the nonvolatile memory cell, a recall operation storing data in the second latch, and a verify operation producing the signal indicative of comparison until the signal indicates that the data of the first latch and the data of the second latch are the same.

Abstract: A method of making a non-volatile memory (NVM) cell structure comprises the formation of a first NVM cell, a second NVM cell and an SRAM cell that includes first and second data nodes. A first pass gate structure is connected between the first NVM cell and the first data node of the SRAM cell, the first pass gate structure being responsive to first and second states of a first pass gate signal to respectively couple and decouple the first NVM cell and the SRAM cell. A first equalize structure is formed to connect the first pass gate structure and the first NVM cell and is responsive to a first equalize signal to connect the first NVM cell to ground. A second pass gate structure is connected between the second NVM cell and the second data node of the SRAM cell, the second pass gate structure being responsive to first and second states of a second pass gate signal to respectively couple and decouple the second NVM cell and the SRAM cell.

Abstract: A non volatile memory device and a memory system having the same are disclosed. The non volatile memory device may include a memory cell array having a plurality of non volatile memory cells, a DRAM interface for exchanging data, a command and an address with an external device, a controller for selecting one of the memory cells in response to the address and performing a control operation for one of outputting data of the selected memory cell to the external device in response to the command and storing data received from the external device, and a DRAM buffer memory. The DRAM buffer memory has dynamic memory cells, and each of the dynamic memory cells has one transistor with a floating body.

Abstract: A multi-programmable non-volatile device is operated with a floating gate that functions as a FET gate that overlaps a portion of a source/drain region and allows for variable coupling through geometry and/or biasing conditions. This allows a programming voltage for the device to be imparted to the floating gate through variable capacitive coupling, thus changing the state of the device. The invention can be used in environments such as data encryption, reference trimming, manufacturing ID, security ID, and many other applications.

Abstract: A programmable non-volatile device uses a floating gate that functions as a FET gate that overlaps a variable portion of a source/drain region. This allows a programming voltage for the device to be imparted to the floating gate through variable capacitive coupling, thus changing the state of the device. Multi-state embodiments are also possible. The invention can be used in environments such as data encryption, reference trimming, manufacturing ID, security ID, and many other applications.

Abstract: A cache programming operation which requires 2 SRAMs (one for the user and one for the array) may be combined with a multi-level cell (MLC) programming operation which also requires 2 SRAMs (one for caching the data and one for verifying the data), using only a total of two SRAMs (or buffers). One of the buffers (User SRAM) receives and stores user data. The other of the two buffers (Cache SRAM) may perform a caching function as well as a verify function. In this manner, if a program operation fails, the user can have its original data back so that he can try to reprogram it to a different place (address).

Abstract: Semiconductor memory having both volatile and non-volatile modes and methods of operation. A semiconductor storage device includes a plurality of memory cells each having a floating body for storing, reading and writing data as volatile memory. The device includes a floating gate or trapping latter for storing data as non-volatile memory, the device operating as volatile memory when power is applied to the device, and the device storing data from the volatile memory, as non-volatile memory when power to the device is interrupted.

Abstract: A nonvolatile semiconductor memory device includes a latch configured to store data, a plurality of word lines, a driver configured to activate one of the plurality of word lines, and a plurality of nonvolatile memory cells coupled to the respective word lines, each of the nonvolatile memory cells coupled to the latch so as to exchange stored data with the latch upon activation of a corresponding one of the word lines, each of the nonvolatile memory cells including two MIS transistors and configured to store data as an irreversible change of transistor characteristics occurring in one of the two MIS transistors, wherein the driver includes at least one nonvolatile memory cell storing count data responsive to a number of times storing of data has been performed with respect to the plurality of nonvolatile memory cells, and is configured to activate one of the word lines indicated by the count data.

Abstract: The invention provides a method of updating a stored data value in a non-volatile memory. The method includes reading the stored data value from the non-volatile memory; reading a stored differential value from a volatile memory; receiving an updated data value; calculating a calculated differential value from the difference between the updated data value and the sum of the stored data value and the stored differential value; comparing the calculated differential value with a threshold differential value; and writing the updated data value to the non-volatile memory if the calculated differential value exceeds the threshold differential value. The invention further provides a related memory system.

Abstract: A memory unit is provided herein. The present invention utilizes two non-volatile devices having a split gate structure to save a logic state of the memory unit. Thus, even when a power supply for the memory unit is shut down, the non-volatile devices can still save the logic state. The memory unit not only has the advantage of high speed operation of a static random access memory, but also functions as a non-volatile memory for saving data.

Abstract: A precharge signal generation circuit outputs a precharge signal including a pulse every access cycle with respect to a data register in a first mode, and generates a precharge signal by masking the signal including the pulse every access cycle with respect to the data register when access to a memory cell other than a predetermined memory cell in the data register is designated in a second mode. A first precharge circuit precharges a bit line pair in response to activation of the precharge signal.

Abstract: Disclosed is a semiconductor storage apparatus in which two sorts of memories, that is, a volatile memory and a non-volatile memory, are mounted on one chip. Data of a DRAM memory array are saved in a corresponding area of a non-volatile memory before entry to a data retention mode or before power down and data is transferred from the area of the non-volatile memory to the DRAM memory array in exiting from the data retention mode or power up. Normal read/write access is made to the DRAM memory array, while data retention is in an area of the non-volatile memory.

Abstract: A semiconductor device includes a first CMOS inverter, a second CMOS inverter, a first transfer transistor and a second transfer transistor wherein the first and second transfer transistors are formed respectively in first and second device regions defined on a semiconductor device by a device isolation region so as to extend in parallel with each other, the first transfer transistor contacting with a first bit line at a first bit contact region on the first device region, the second transfer transistor contacting with a second bit line at a second bit contact region on the second device region, wherein the first bit contact region is formed in the first device region such that a center of said the bit contact region is offset toward the second device region, and wherein the second bit contact region is formed in the second device region such that a center of the second bit contact region is offset toward the first device region.

Abstract: Part of the latency from memory read or write operations is for data to be input to or output from the data latches of the memory via an I/O bus. Methods and circuitry are present for improving performance in non-volatile memory devices by allowing the memory to perform some of these data caching and transfer operations in the background while the memory core is busy with a write operation. In the exemplary embodiment, when the multiple phases of a write operation vary as to the number of states to track, a phase-dependent coding enables efficient utilization of the available data latches, thereby allowing a maximum of surplus latches for background cache operations.

Abstract: A memory device comprising memory cells having volatile and non-volatile memory portions. The volatile memory portion of each cell includes circuitry for performing RAM functions while the non-volatile memory portion comprises circuitry defining pre-coded data. The memory device comprises a mechanism to operate an initialization sequence, which sets the initial state of the volatile memory portion of each memory cell to the pre-coded data defined in the associated non-volatile memory portion. The initialization sequence allows the initial state of each memory cell's volatile portion to be re-established after power has been applied to the memory device.

Abstract: A semiconductor device having an electrically erasable and programmable nonvolatile memory, for example, a rewritable nonvolatile memory including memory cells arranged in rows and columns and disposed to facilitate both flash erasure as well as selective erasure of individual units of plural memory cells. The semiconductor device which functions as a microcomputer chip also has a processing unit and includes an input terminal for receiving an operation mode signal for switching the microcomputer between a first operation mode in which the flash memory is rewritten under control of a processing unit and a second operation mode in which the flash memory is rewritten under control of separate writing circuit externally connectable to the microcomputer.

Abstract: Part of the latency from memory read or write operations is for data to be input to or output from the data latches of the memory via an I/O bus. Methods and circuitry are present for improving performance in non-volatile memory devices by allowing the memory to perform some of these data caching and transfer operations in the background while the memory core is busy with a write operation. In the exemplary embodiment, when the multiple phases of a write operation vary as to the number of states to track, a phase-dependent coding enables efficient utilization of the available data latches, thereby allowing a maximum of surplus latches for background cache operations.

Abstract: The invention describes the method for regrouping data read from multi-sector pages inside a memory chip. As a result, garbage collection operation time greatly reduces and overall system performance increases. Architectural features include the ability to selectively transfer individual data sectors of a page between on-chip registers and the ability to realign data sectors within a register.

Abstract: An integrated circuit memory system includes an integrated circuit device having a random access memory array, a non-volatile memory array (e.g., flash memory array) and a data transfer circuit therein. The memory arrays and data transfer circuit may be included in a common integrated circuit chip. The random access memory (RAM) array includes a plurality of columns of RAM cells and a first plurality of bit lines, which are electrically connected to the plurality of columns of RAM cells. The non-volatile memory array includes a plurality of columns of non-volatile memory cells and a second plurality of bit lines, which are electrically connected to a plurality of columns of non-volatile memory cells. The data transfer circuit is electrically connected to the first and second pluralities of bit lines. The data transfer circuit is configured to support direct bidirectional communication between the first and second pluralities of bit lines.

Abstract: A non-volatile memory cell includes a volatile storage device that stores a corresponding logic state in response to electrical stimulus; and a shadow memory device coupled to the volatile storage device. The shadow memory device receives and stores the corresponding logic state in response to electrical stimulus. The shadow memory device includes a non-volatile nanotube switch that stores the corresponding state of the shadow device.

Abstract: A FIFO memory device (300) comprises a storage device (321) which is a non-volatile FIFO comprising a plurality of non-volatile storage elements or latches. The FIFO memory device (300) also comprises an input stage (315) which is a volatile FIFO and comprises a plurality of volatile storage elements. The input stage (315) provides a temporary store for data and thus hides the latency of the storage device (321).