Abstract: Methods, devices and systems for non-volatile static random access memory (SRAM) are provided. One method embodiment for operating an SRAM includes transferring data from a pair of static storage nodes of the SRAM to a pair of non-volatile storage nodes when the SRAM is placed in a standby mode. The method further includes transferring data from the pair of non-volatile storage nodes to the pair of static storage nodes when the SRAM exits the standby mode.

Abstract: An electrically rewritable non-volatile memory device is configured by the EEPROM 3, and an electrically non-rewritable non-volatile memory device is configured by the OTPROM 4a. Both the EEPROM 3 and the OTPROM 4a are configured by phase change memory devices each of which can be fabricated in the same fabrication step and at a low cost. The EEPROM3 uses a phase change memory device in which an amorphous state and a crystal state of a phase change material are used for memory information, while the OTPROM 4a uses a phase change memory device in which a non-disconnection state and a disconnection state of a phase change material are used for memory information.

Abstract: A memory unit is provided herein. Two non-volatile devices are used to store a logic state of the memory unit into the non-volatile devices. Although a power supply for the memory unit is shut down, the non-volatile devices still keep the data stored therein. The present invention not only has an advantage of high speed operation of a static random access memory (SRAM), but also has a function for storing data of a non-volatile memory.

Abstract: Memory and methods of operating a memory adjusting an output voltage of an analog storage device, such as a data cache capacitor holding a voltage level representative of data, in response to an estimated charge loss are useful for compensating for the effects of charge leakage from the analog storage devices.

Abstract: An integrated circuit memory system includes a random access memory device, a flash memory device and a memory controller, which may be embodied on a single integrated circuit substrate. The memory controller is configured to respond to at least one command to write data into the flash memory device by first writing the data into the random access memory device and then transferring the data from the random access memory device to the flash memory device. The random access memory device may be a NOR-type flash memory device and the flash memory device may be a NAND-type flash memory device.

Abstract: A data storage system for refreshing in place data stored in a non-volatile re-writeable memory is disclosed. Data from a location memory can be read into a temporary storage location; the data at the memory location can be erased; the read data error corrected if necessary; and then the read data can be programmed and rewritten back to the same memory location it was read from. One or more layers of the non-volatile re-writeable memory can be fabricated BEOL as two-terminal cross-point memory arrays that are fabricated over a substrate including active circuitry fabricated FEOL. A portion of the active circuitry can be electrically coupled with the one or more layers of two-terminal cross-point memory arrays to perform data operations on the arrays, such as refresh in place operations or a read operation that triggers a refresh in place operation. The arrays can include a plurality of two-terminal memory cells.

Abstract: Semiconductor structures including a plurality of conductive structures having a dielectric material therebetween are disclosed. The thickness of the dielectric material spacing apart the conductive structures may be adjusted to provide optimization of capacitance and voltage threshold. The semiconductor structures may be used as capacitors, for example, in memory devices. Various methods may be used to form such semiconductor structures and capacitors including such semiconductor structures. Memory devices including such capacitors are also disclosed.

Abstract: Example embodiments relate to a semiconductor memory system which may include a volatile memory and a non-volatile memory that share a common bus, and a method for controlling the operation of the non-volatile memory. The semiconductor memory system may include a non-volatile memory and a memory controller. The non-volatile memory may include a buffer memory that temporarily stores data to be read from or to be written to a memory cell array, and an internal controller. The memory controller may transmits a mode signal to the non-volatile memory in response to a control signal, the control signal corresponds to either a read mode or a write mode to be applied to the non-volatile memory. In response to the mode signal, the internal controller may control the data to be read to be stored in the buffer memory, if the read mode is to be applied, and the internal controller may control the buffer memory to stand-by until a write command is received, if the write mode is to be applied.

Abstract: A plurality of non-volatile storage elements on a common active layer are offset from neighbor non-volatile storage elements. This offsetting of non-volatile storage elements helps reduce interference from neighbor non-volatile storage elements. A method of manufacture is also described for fabricating the offset non-volatile storage elements.

Abstract: Structures and methods are provided for SRAM cells having a novel, non-volatile floating gate transistor, e.g. a non-volatile memory component, within the cell which can be programmed to provide the SRAM cell with a definitive asymmetry so that the cell always starts in a particular state. The SRAM cells include a pair of cross coupled transistors. At least one of the cross coupled transistors includes a first source/drain region and a second source/drain region separated by a channel region in a substrate. A floating gate opposes the channel region and separated therefrom by a gate oxide. A control gate opposes the floating gate. The control gate is separated from the floating gate by a low tunnel barrier intergate insulator.

Abstract: Semiconductor memory having both volatile and non-volatile modes and methods of operation.

Abstract: A semiconductor memory device is capable of reading data at a high speed, without using a reference cell transistor. The semiconductor memory device includes a sensing unit including first cross-coupled MOS transistors to sense and amplify a voltage difference between a first node and a second node, and a unit cell including second cross-coupled cell MOS transistors to latch data and output a first signal and a second signal corresponding to the latched data to the first node and the second node, respectively.

Abstract: Memory devices, methods, and sample and hold circuits are disclosed, including a memory device that includes a sample and hold circuit coupled to a bit line. One such sample and hold circuit includes a read circuit, a verify circuit, and a reference circuit. The read circuit stores a read threshold voltage that was read from a selected memory cell. The verify circuit stores a target threshold voltage that is compared to the read threshold voltage to generate an inhibit signal when the target and read threshold voltages are substantially equal. The reference circuit stores a reference threshold voltage that can be used to translate the read threshold voltage to compensate for a transistor voltage drop and/or temperature variations.

Abstract: A memory has first and second storage cells, each with a floating node, that store complementary data values. Interlaced inverters quickly sense a voltage difference between the storage cells and provide a data value output when the memory is read. Each floating node includes a tunneling gate of a tunneling transistor, a gate of a bitline transistor, and a plate of a coupling capacitor.

Abstract: The invention concerns semiconductor latches capable of memorizing any programmed information even after power supply has been removed. Used is a ?m BiCMOS EPROM process but it is applicable in any other process having hot electron injection devices like EPROM, Flash EEPROM.

Abstract: A technique to reduce refresh power in a DRAM. In one embodiment, all of the DRAM memory cells are refreshed at a first rate and a subset of the memory cells are refreshed a second rate greater than the first rate. In another embodiment, the DRAM has a refresh controller that generates a refresh address and controls the refresh of the memory cells addressed by the refresh address. A marker memory is used by the refresh controller to determine which of the memory cells requires refreshing at a rate faster than the refresh rate of the remaining memory cells. Testing the DRAM uses a method to determine which of the memory cells are to be refreshed at the faster rate and to store the results in the marker memory.

Abstract: A differential non-volatile content addressable memory array has a differential non-volatile content addressable memory cell which uses a pair of non-volatile storage elements. Each of the non-volatile storage elements can be a split-gate floating gate transistor or a stack gate floating gate transistor having a first terminal, a second terminal, a channel therebetween and a floating gate over at least a portion of the channel to control the conduction of electrons in the channel, and a control gate. The floating gate storage transistor can be in one of two states: a first state, such as erase, in which current can flow between the first terminal and the second terminal, and a second state, such as programmed, in which substantially no current flows between the first terminal and the second terminal. A pair of differential compare data lines connects to the control gate of each of the pair of non-volatile floating gate transistors.

Abstract: An electrical circuit contains volatile states that are lost without continued application of power to circuit elements to preserve their volatile states. A first power source in the circuit provides power to the volatile state circuit for holding and preserving their volatile states. A power selection circuit is coupled to the circuit elements and has a plurality of selectable modes. A first mode of operation of the power selection circuit is selected when the circuit elements are to be operated at a first power level via the first power source which constitutes a first mode of operation. A second mode of operation is selected when the volatile state circuit elements are to be operated under a condition where the first power source is inactivated, such as, for example, during a circuit backup or standby operation.

Abstract: A backup volatile state retention circuit is provided with low leakage current for employment with a volatile memory circuit to store the value of the latter during power down of the volatile circuit or during power-down or inactivation of neighboring or peripheral circuits or due to the loss of power of any of these circuits. An example of such a volatile circuit is a memory circuit having volatile memory cells such as employed in dynamic memory core, in particular, a random access memory (RAM) in CMOS circuitry.

Abstract: A nonvolatile memory device implements a program routine followed by a program-verify routine when recording or modifying stored data. The nonvolatile memory device may include an array of memory cells for storing data, a sense node, and a gating circuit for selectively connecting a bitline of the array of memory cells to the sense node. The nonvolatile memory device may also include a page buffer coupled to the sense node. The page buffer may include a main latch for storing data to be written in the nonvolatile memory device, a cache latch for storing data supplied on an input line of the nonvolatile memory device to be transferred in the main latch through a source liner and a temporary static latch connected to the main latch through the source line and to the cache latch through an auxiliary switch and for transferring data between the main latch and the cache latch. The cache latch may be isolated from the source line during execution of the program routine and of the program-verify routine.

Abstract: Adaptive programming methods and supportive device architecture for memory devices are provided. Methods include partitioning words into variable length segments. More particularly, methods include receiving a word of data, parsing the word into a plurality of write-subsets, where the size of the write-subsets depends on values of the data and constraints that are specific to the memory circuit, and writing the data in cells of the memory circuit, one write-subset at a time. A memory device includes a digital controller capable of parsing words into a plurality of write-subsets, where the length of write-subsets are depending on values of the data and constraints that are specific to the memory device.

Abstract: Adaptive programming methods and supportive device architecture for memory devices are provided. Methods include partitioning words into variable length segments. More particularly, methods include receiving a word of data, parsing the word into a plurality of write-subsets, where the size of the write-subsets depends on values of the data and constraints that are specific to the memory circuit, and writing the data in cells of the memory circuit, one write-subset at a time. A memory device includes a digital controller capable of parsing words into a plurality of write-subsets, where the length of write-subsets are depending on values of the data and constraints that are specific to the memory device.

Abstract: A memory device comprises a non-volatile electrically alterable memory which is susceptible to read disturbance. The device has a control circuit for controlling the operation of the non-volatile memory. The device further has a first volatile cache memory. The first volatile cache memory is connected to the control circuit and is for storing data to be written to or read from the non-volatile memory, as cache for the memory device. The device further has a second volatile cache memory. The second volatile cache memory is connected to the control circuit and is for storing data read from the non-volatile memory as read cache for the memory device. Finally the control circuit reads data from the second volatile cache memory in the event of a data miss from the first volatile cache memory, and reads data from the non-volatile memory in the event of a data miss from the first and second volatile cache memories.

Abstract: A memory cell device has a bottom electrode and a top electrode, a plug of memory material in contact with the bottom electrode, and a cup-shaped conductive member having a rim that contacts the top electrode and an opening in the bottom that contacts the memory material. Accordingly, the conductive path in the memory cells passes from the top electrode through the conductive cup-shaped member, and through the plug of phase change material to the bottom electrode.

Abstract: A system and method for determining a SONOS VT window using a current sensing scheme is disclosed. The present invention creates a first current path and a second current path through the volatile and non-volatile sections of an nvSRAM memory cell. The erase threshold voltage of the first edge of the window is determined when current is detected in the first path. The program voltage of the second edge of the window is determined when current is detected in the second path. Accordingly, the voltage used to power a plurality of SONOS transistors may be set using the values of the first and second threshold edges to determine the VT window.

Abstract: An apparatus for estimating a frequency of access to a storage device that includes a flash memory and a controller for controlling the flash memory includes interface. Data is written into the flash memory in units of a page and being erased from the flash memory in units of a block consisting of pages. The interface is supplied with an internal signal transferred between the flash memory and the controller, configured to recognize the internal signal, and outputs the internal signal as an input signal. An erasure sequence detection section outputs a detection signal when address data is followed by an erasure command requesting erasure of data in the block specified by the address data in the input signal. An address holding section holds address data in the internal signal, and outputs held address data as erasure address data when supplied with the detection signal.

Abstract: A system includes a volatile storage, a persistent storage, a capacitor-based power supply, and a controller coupled to the capacitor-based power supply. The controller detects interruption of main power, and in response to detecting the interruption of main power, begins backup copying of data from the volatile storage to the persistent storage. After beginning the backup copying of data, the controller checks whether the main power has resumed prior to depletion of the capacitor-based power supply. In response to detecting that main power has resumed prior to depletion of the capacitor-based power supply, the controller resumes operation using content of the volatile storage without restoring data from the persistent storage.

Abstract: A flash memory array comprises a plurality of memory cells organized in a matrix of rows and columns. Each of the memory cells includes a floating gate memory transistor having a source region and a drain region, and a coupling capacitor electrically connected to the memory transistor. A plurality of word lines are each electrically connected to the capacitor in each of the memory cells in a respective row. A first set of bit lines are each electrically connected to the drain region of the memory transistor in each of the memory cells in a respective column. A plurality of high voltage access transistors are each electrically connected to a bit line in the first set of bit lines. A second set of bit lines are each electrically connected to the source region of the memory transistor in each of the memory cells in a respective column.

Abstract: A flash memory system includes a path selector to determine to write to a non-volatile memory, a volatile memory or both the non-volatile memory and the volatile memory when the flash memory system is to write data. A record is stored in the non-volatile memory which is updated the status of the non-volatile memory after each one or more writing operations. When the flash memory system is powered on after a power loss, it could be recovered to a command executed prior to the power loss or to any checkpoint prior to the power loss by using the record.

Abstract: A memory circuit includes volatile memory cells coupled to bit lines, and nonvolatile memory cells coupled to the volatile memory cells via the bit lines but not via complement bit lines.

Abstract: A method of controlling an electronic charge retention circuit for time measurement, including at least a first capacitive element, the dielectric of which has a leakage, and at least a second capacitive element, the dielectric of which has a higher capacitance than the first, the two elements having a common electrode defining a floating node that can be connected to an element for measuring its residual charge, in which a charge retention period is programmed or initialized by injecting or extracting charges via the first element.

Abstract: A non-volatile semiconductor memory device may include a memory cell array and a controller coupled to the memory cell array. The memory cell array may include first and second memory cells coupled to respective first and second word lines. Each of the first and second memory cells may be configured to be programmed to one of a first, a second, or a third threshold voltage so that the first and second memory cells provide nine different threshold voltage combinations. The controller may be configured to provide a mapping of data of a set of three binary bits providing eight different data combinations to eight of the nine different threshold voltage combinations provided by the first and second memory cells. The controller may be further configured to write data of first, second, and third binary bits to the first and second memory cells by programming each of the first and second memory cells to a respective one of the first, second, or third threshold voltages using the mapping of data.

Abstract: A static memory cell comprising a pair of cross-coupled inverters (10, 12) which is “shadowed” with non-volatile memory elements (14, 16) so that data written in the static memory can be stored in the non-volatile cell, but also can be recalled later. The non-volatile cells (14, 16) are programmed with opposite data to increase the robustness of the retrieval process, and they are cross-coupled to the internal nodes (A, B) of the static memory cell, one the non-volatile cells (14) having a control gate connected to B and its source to A, and the other non-volatile element (16) having a control gate connected to A and its source to B. The drain of each non-volatile element (14, 16) is connected by means of a respective pMOS transistor (18, 20) to a program supply means.

Abstract: Memory modules and methods for fabricating and implementing memory modules wherein unique device parameters corresponding to specific memory devices on the memory modules are accessed from a database such that the device parameters may be implemented to improve system performance. The device parameters may include sizes, speeds, operating voltages, or timing parameters of the memory modules. Memory modules comprising a number of volatile memory devices may be fabricated. Device parameters corresponding to the specific memory devices on the memory module may be stored in a database and accessed during fabrication or during implementation of the memory modules in a system. System performance may be optimized by implementing the unique device parameters corresponding to the specific memory devices on the memory modules.

Abstract: A memory unit includes a plurality of first blocks each having a first block size. Each of the first blocks stores data of a plurality of second blocks each having a second block size which is smaller than the first block size. A control unit writes the data of the second block in the first block. The control unit is configured such that in a case where the second block to be written is a block that is to be written in the same first block as the second block that is already written in the first block, the second block to be written is written in the same first block even if an address of the second block to be written is not consecutive to an address of the second block that is already written in the first block.

Abstract: A memory device is disclosed. A reference device of the memory includes a trimmable current source and a fixed current source. Currents provided by each source are summed to provide a reference current to a sense amplifier. The sense amplifier senses the state of a bit cell by comparing a current from the bit cell, representative of a logic value, to the reference current. By basing the reference current on both a fixed and a trimmable current source, the reference device can be trimmed to compensate for process and operating characteristics of the device, while maintaining a minimum reference current in the event of a disturb mechanism that results in loss of the current provided by the trimmable current source.

Abstract: Multi-bit semiconductor memory devices having both volatile and nonvolatile memory characteristics and methods of operating the same are disclosed, the semiconductor memory device including a floating body on an upper region of a substrate, a gate electrode on the floating body and electrically insulated from the floating body, source and drain regions on the substrate adjacent to the gate electrode and a charge trap layer between the floating body and the gate electrode, where first bit data is written in one of the charge trap layer and the floating body, and second bit data is written in one of the charge trap layer and the floating body in which first bit data is not written.

Abstract: Provided are a circuit and method for generating a program voltage, and a non-volatile memory device using the same. The circuit, which generates a program voltage for programming a memory cell of a semiconductor memory device, includes a program voltage controller and a voltage generating unit. The program voltage controller generates a program voltage control signal according to program/erase operations information. The voltage controller generates a program voltage in response to the program voltage control signal.

Abstract: A multi-bit non-volatile memory device is provided. The memory device includes a memory cell array including a plurality of memory cells. A page buffer is electrically coupled to the memory cell array. The page buffer includes a plurality of latches configured to store a first bit of multi-bit data to be written into or read out from one of the plurality of memory cells of the memory cell array. A buffer random access memory (RAM) is electrically coupled to the page buffer. The buffer RAM is configured to store a second bit of the multi-bit data to be written into or read out from one of the plurality of memory cells of the memory cell array. Related systems, memory cards and methods are also provided.

Abstract: A nonvolatile semiconductor memory device includes a latch circuit having two nodes, a nonvolatile memory cell including two MIS transistors, a bit swapping unit configured to provide straight connections between the two nodes and the two MIS transistors during a first operation mode and to provide cross connections between the two nodes and the two MIS transistors during a second operation mode, and a control circuit configured to cause, in one of the first and second operation modes, the nonvolatile memory cell to store the data latched in the latch circuit as an irreversible change of transistor characteristics occurring in a selected one of the two MIS transistors, and further configured to cause, in another one of the first and second operation modes, the latch circuit to detect the data stored in the nonvolatile memory cell.

Abstract: A nonvolatile memory integrated circuit arrayed in rows and columns is disclosed. Parallel lines of implant N-type regions are formed in a P-well of a semiconductor substrate, with lines of oxide material isolating each pair of the lines. Columns of memory cells straddle respective pairs of the implant region lines, with one line of the pair forming the source region and one line of the pair forming the drain region of each memory cell of the column. Each memory cell has a floating polysilicon storage gate. One of plural wordlines overlies each row of the memory cells. The portion of the wordline overlying each memory cells forms the control gate of the memory cell. Programming and erase operations occur by Fowler-Nordheim tunneling of electrons through a tunnel oxide layer between the floating gate and the source of the cell.

Abstract: An integrated circuit including an array of memory cells, volatile storage, non-volatile storage and a circuit. The circuit is configured to sense first addresses of first defective memory cells from the non-volatile storage to obtain sense first addresses. The circuit detects second defective memory cells via the sense first addresses and stores second addresses of the second defective memory cells in the volatile storage and in the non-volatile storage.

Abstract: A nonvolatile semiconductor memory device includes a latch circuit including a first inverter and a second inverter cross-coupled to each other, a source node of a MIS transistor of the first inverter and a source node of a MIS transistor of the second inverter being both coupled to a plate line, and a control circuit configured to apply a first potential to the plate line in a store mode to cause a change in threshold voltage to one of the MIS transistors, and configured to apply a second potential to the plate line in a power-on mode to cause the latch circuit to latch data responsive to the change in threshold voltage generated in the store mode, such that the data latched by the latch circuit in the power-on mode is automatically output to outside the nonvolatile semiconductor memory device upon power-on thereof.

Abstract: A method of employing memory cells of an integrated circuit is disclosed. The method comprises steps of storing configuration data in a plurality of memory cells of a memory of the integrated circuit; selecting unused memory cells of the memory of the integrated circuit for use as a scratchpad memory; providing access to the unused memory cells of the integrated circuit; and enabling use of the unused memory cell of the integrated circuit in a user mode as scratchpad memory. According to one embodiment of the invention, a plurality of input/output ports of the integrated circuit is coupled to a plurality of JTAG inputs coupled to the plurality of unused memory cells. A programmable logic device having memory cells for storing data, and a circuit employing a programmable logic device, are also disclosed.

Abstract: A nonvolatile memory device including a plurality of word lines; a plurality of bit lines intersecting the word lines; a plurality of memory cells corresponding to intersections of the word lines and the bit lines; a common control gate line commonly connected to the memory cells; and a common erasing gate line commonly connected to the memory cells.

Abstract: A flash memory device is provided, and the flash memory device comprises memory cells, a sense node connected to a selected bit line, a load circuit connected to the sense node, and first and second sense and register circuits, each connected to the sense node. The first sense and register circuit is configured to store a first data value in accordance with the voltage level of the sense node during an initial read interval of a multi-bit program operation. The load circuit is configured to selectively pre-charge the sense node in accordance with the data value stored in the first sense and register circuit during a verify read interval of the multi-bit program operation. A multi-bit programming method for the flash memory device is also provided.

Abstract: A system and method, including software implemented techniques, can be used to adjust for sag in stored data values. Charge is applied to multiple memory cells, and each memory cell is charged to a target voltage corresponding to a data value. The memory cells include a reference cell that is charged to a predetermined voltage. A voltage level in the reference cell is detected, and voltage levels from a group of memory cells are also detected. An adjustment is performed based upon the difference between the detected voltage level in the reference cell and the predetermined voltage.

Abstract: A semiconductor device includes a sense amplifier and a decoder provided on a semiconductor substrate together with memory cells provided above the sense amplifier and the decoder. Each of the memory cells includes a channel region, in which current flows in a direction perpendicular to a surface of the semiconductor substrate, a charge accumulation region provided along the channel region, and an insulator film provided between the channel region and the charge accumulation region.

Abstract: This disclosure concerns a memory comprising a charge trapping film; a gate insulating film; a back gate on the charge trapping film; a front gate on the gate insulating film; and a body region provided between a drain and a source, wherein the memory includes a first storage state for storing data depending on the number of majority carriers in the body region and a second storage state for storing data depending on the amount of charges in the charge trapping film, and the memory is shifted from the first storage state to the second storage state by converting the number of majority carriers in the body region into the amount of charges in the charge trapping film or from the second storage state to the first storage state by converting the amount of charges in the charge trapping film into the number of majority carriers in the body region.

Abstract: A method of making a non-volatile memory (NVM) cell structure includes the formation of a first NVM cell, a second NVM cell and an SRAM cell that includes first and second data nodes. A first pass gate structure is connected between the first NVM cell and the first data node of the SRAM cell, the first pass gate structure being responsive to first and second states of a first pass gate signal to respectively couple and decouple the first NVM cell and the SRAM cell. A first equalize structure is formed to connect the first pass gate structure and the first NVM cell and is responsive to a first equalize signal to connect the first NVM cell to ground. A second pass gate structure is connected between the second NVM cell and the second data node of the SRAM cell, the second pass gate structure being responsive to first and second states of a second pass gate signal to respectively couple and decouple the second NVM cell and the SRAM cell.