Abstract: A process of operating a memory circuit involves RECALLing a state of a volatile memory cell from a nonvolatile memory cell, and inverting an output of the volatile memory cell after every other RECALL.

Abstract: A semiconductor memory device includes a memory cell array, first and second data caches, and a control circuit. The control circuit is configured to control, with use of the first and second data caches, a read operation of reading data from the selected memory cell of the memory cell array, and a write operation of writing data in the selected memory cell of the memory cell array. The control circuit is configured to execute, at a time of the read operation, an arithmetic operation of the data held in the first data cache by using the first and second data caches, and to generate the data which is to be written in the selected memory cell.

Abstract: One embodiment relates to a memory device. The memory device includes a capacitor having a first capacitor plate and a second capacitor plate, wherein the first and second capacitor plates are separated by an insulating layer and are formed over a first portion of a semiconductor substrate. The memory device also includes a transistor having a source region, a drain region, and a gate region, where the gate region is coupled to the second capacitor plate. The transistor is formed over a second portion of the semiconductor substrate. A well region is disposed in the first and second portions of the semiconductor substrate and has a doping-type that is opposite a doping-type of the semiconductor substrate. Other embodiments are also disclosed.

Abstract: A logic circuit for a semiconductor memory device, includes a first logic portion which stores data from a first data signal, and generates a second data signal based on the first data signal, a second logic portion which generates a first address signal and stores an address from the first address signal where data from the second data signal is to be written, and a third logic portion which generates a flag signal which indicates whether the data stored in the first logic portion is valid.

Abstract: An object is to provide a semiconductor device with a novel structure, which can hold stored data even when not powered and which has an unlimited number of write cycles. A semiconductor device is formed using a material capable of sufficiently reducing the off-state current of a transistor, such as an oxide semiconductor material that is a widegap semiconductor. The use of a semiconductor material capable of sufficiently reducing the off-state current of a transistor allows data to be held for a long time. In addition, the timing of potential change in a signal line is delayed relative to the timing of potential change in a write word line. This makes it possible to prevent a data writing error.

Abstract: According to an embodiment, a semiconductor device includes a substrate, a connector, a volatile semiconductor memory element, multiple nonvolatile semiconductor memory elements, and a controller. A wiring pattern includes a signal line that is formed between the connector and the controller and that connects the connector to the controller. On the opposite side of the controller to the signal line, the multiple nonvolatile semiconductor memory elements are aligned along the longitudinal direction of the substrate.

Abstract: According to an embodiment, a semiconductor device includes a substrate, a connector, a volatile semiconductor memory element, multiple nonvolatile semiconductor memory elements, and a controller. A wiring pattern includes a signal line that is formed between the connector and the controller and that connects the connector to the controller. On the opposite side of the controller to the signal line, the multiple nonvolatile semiconductor memory elements are aligned along the longitudinal direction of the substrate.

Abstract: A nonvolatile RAM for reading and writing data in a random manner includes a memory area configured by a plurality of memory cells suited to a nonvolatile-mode write operation, in which the stored content thereof is not lost irrespective of a power-off event, and a volatile-mode write operation, in which the stored content thereof is lost in the power-off event. A register designates a first portion of the memory area adapted to the nonvolatile-mode write operation regarding fixed data such as program codes and a second portion of the memory area serving as a work area adapted to the volatile-mode write operation. A control circuit performs the nonvolatile-mode write operation on the first portion of the memory area while performing the volatile-mode write operation on the second portion of the memory area.

Abstract: A nonvolatile memory device includes a memory cell array having multiple memory cells, a data input/output buffer for temporarily storing data to be stored in the memory cells, and a data scanner for scanning the data stored temporarily in the data input/output buffer. The nonvolatile memory device further includes control logic for reading address information of a memory cell in which at least a portion of the data is to be stored and selectively performing a data scan operation according to the read address information.

Abstract: A composite, hybrid memory device including a first storage die having an array of volatile storage cells and a second storage die having an array of non-volatile storage cells disposed within an integrated circuit package. The hybrid memory device includes a shared interface circuit to receive memory access commands directed to the first storage die and the second storage die and to convey read and write data between an external data path and the first and second storage dice.

Abstract: A non-volatile random access memory (NV-RAM) and an operation method thereof are provided. The NV-RAM includes a latch unit, a switch, and a first to fourth non-volatile memory elements. First terminals of the first and the third non-volatile memory elements respectively couple to a first voltage and a second voltage. A second terminal of the first non-volatile memory element and a first terminal of the second non-volatile memory element are coupled to a first terminal of the latch unit. A second terminal of the third non-volatile memory element and a first terminal of the fourth non-volatile memory element are coupled to a second terminal of the latch unit. Second terminals of the second and the fourth non-volatile memory element are coupled to a first terminal of the switch. A second terminal of the switch is coupled to a third voltage.

Abstract: Some embodiments relate to a differential memory cell. The memory cell includes a first transistor having a source, a drain, a gate, and a body. A first capacitor has a first plate and a second plate, wherein the first plate is coupled to the gate of the first transistor and extends over the body region. The memory cell also includes a second transistor having a source, a drain, a gate, and a body, wherein the source and body of the second transistor is coupled to the second plate of the first capacitor. A second capacitor has a third plate and a fourth plate, wherein the third plate is coupled to the gate of the second transistor and the fourth plate is coupled to the source and the body of the first transistor.

Abstract: One of objects is to provide a nonvolatile memory device in which the occurrence of a defect in data writing is suppressed and whose area can be suppressed, or a semiconductor device including the nonvolatile memory device. A first memory portion including a nonvolatile memory element and a second memory portion (data buffer) for temporarily storing data in verifying operation in which whether the data is correctly written into the first memory portion is verified are provided. Further, the second memory portion includes a memory element and an insulated gate field effect transistor for controlling the holding of charge in the memory element; the off-state current or the leakage current of the transistor is extremely low.

Abstract: A hybrid memory device is provided. The hybrid memory device includes a DRAM, a non-volatile memory and a control circuit. The control circuit selects one of output data of the DRAM and output data of the non-volatile memory according to a mode selecting signal and output the selected data. The control circuit outputs data requested to be output from the DRAM when the data requested to be output is in the DRAM, and may output the data requested to be output from the non-volatile memory when the data requested to be output is in the non-volatile memory. Accordingly, the hybrid memory device has a high speed in a read and write operation, and has low power consumption.

Abstract: Integrated circuit memory devices utilize techniques to improve the timing of data update operations within a non-volatile memory, by more efficiently combining memory cell programming operations with threshold voltage adjust operations on erased memory cells. These adjust operations operate to narrow a threshold voltage distribution between memory cells that remain in an erased state after the programming operation has been performed. An integrated circuit memory device may include at least a first block of non-volatile memory cells and a volatile memory device, which has a data storage capacity equivalent to at least a capacity of the at least a first block of non-volatile memory cells. A memory controller is also provided, which is electrically coupled to the at least a first block of non-volatile memory cells and the volatile memory device.

Abstract: An object is to provide a semiconductor device in which stored data can be retained even when power is not supplied, and there is no limitation on the number of write cycles. The semiconductor device includes a source line, a bit line, a first signal line, a second signal line, a word line, a memory cell connected between the source line and the bit line, a first driver circuit electrically connected to the bit line, a second driver circuit electrically connected to the first signal line, a third driver circuit electrically connected to the second signal line, and a fourth driver circuit electrically connected to the word line and the source line. The first transistor is formed using a semiconductor material other than an oxide semiconductor. The second transistor is formed using an oxide semiconductor material.

Abstract: Semiconductor memory having both volatile and non-volatile modes and methods of operation. A semiconductor memory cell includes a substrate, a floating body to store data in volatile memory and a floating gate or trapping layer configured to receive transfer of data stored by the volatile memory and store the data as nonvolatile memory in the floating gate or trapping layer upon interruption of power to the memory cell.

Abstract: Disclosed herein is a device that comprises a SRAM cell, a pair of bit-lines coupled with the SRAM cell, a writing circuit producing at first and second output nodes thereof true and complementary data signals responsive to data to be written, a first pass transistor coupled between one of the pair of the bit-lines and the first output node of the writing circuit, a second pass transistor coupled between the other of the pair of bit lines and the second output node of the writing circuit; and a mask-write circuit configured to render both of the first and second pass transistors conductive in a write operation and render selected one or ones of first and second pass transistors non-conductive in a write-mask operation.

Abstract: A memory device is provided comprising a transistor having a floating body positioned between source and drain regions, the floating body being sandwiched between first and second insulated gates each comprising a gate electrode. A control circuit is arranged to program the state of said floating body to have an accumulation or depletion of majority carriers by applying one of first and second voltage levels between the first gate and at least one of the source and drain regions, and to retain the programmed state of said floating body by applying a third voltage level to the second gate. The voltages are switched over a time duration shorter than 100 ns.

Abstract: The present invention is a semiconductor device including: a resistor R11 (first resistor part) and an FET 15 (second resistor part) connected in series between a power supply Vcc (first power supply) and ground (second power supply); an output node N11 provided between the resistor R11 and FET 15 and used for outputting a reference voltage; a feedback node N12 provided between the power supply Vcc and the ground; and a voltage control circuit (19) that maintains a voltage of the feedback node N12 at a constant level by using the reference voltage of the output node N11 and the voltage of the feedback node N12. The present invention can provide a semiconductor device having a reference voltage generating circuit capable of generating the reference voltage that does not greatly depend on a power supply voltage and its control method.

Abstract: A method of operation of a non-volatile dynamic random access memory system including: accessing a dynamic random access memory; managing a delay-locked-loop control in the dynamic random access memory; sourcing timing inputs to the dynamic random access memory by a control logic unit with the delay-locked-loop control disabled including: selecting a back-up interface through a first multiplexer and a second multiplexer, asserting an on-board termination, and accessing data in the dynamic random access memory by the control logic unit at a lower frequency; and enabling a memory control interface by the control logic unit, with the delay-locked-loop control enabled including: selecting a host interface through the first multiplexer, the second multiplexer, or a combination thereof, disabling the on-board termination, and accessing the data in the dynamic random access memory by the memory control interface at a delay-locked-loop frequency.

Abstract: Non-Volatile Static Random Access Memory (NVSRAM) cell devices applying only one single non-volatile element embedded in a conventional Static Random Access Memory (SRAM) cell are disclosed. The NVSRAM cell devices can be integrated into a compact cell array. The NVSRAM devices of the invention have a read/write speed of a conventional SRAM and non-volatile property of a non-volatile memory cell. The methods of operations for the NVSRAM devices of the invention are also disclosed.

Abstract: A non-volatile memory cell includes a semiconductor substrate with isolation structures formed therein and thereby transistor region and capacitor region are defined therein. A conductor is disposed over the isolation structures, the transistor region and a first-type doped well disposed in the capacitor region. The conductor includes a capacitor portion disposed over the first-type doped well, a transistor portion disposed over the transistor region, a first edge disposed over the isolation structure at a side of the transistor region, and an opposite second edge disposed over the first-type doped well. Two first ion doped wells are disposed in the transistor region and respectively at two sides of the transistor portion, and constitutes a transistor with the transistor portion. A second ion doped region is disposed in the capacitor region excluding the conductor and constitutes a capacitor with the capacitor portion.

Abstract: A data storage device includes a non-volatile memory device which includes a memory cell array; and a memory controller which includes a buffer memory and which controls the non-volatile memory device. The operating method of the data storage device includes storing data in the buffer memory according to an external request, and determining whether the data stored in the buffer memory is data accompanying a buffer program operation of the memory cell array. When the data stored in the buffer memory is data accompanying the buffer program operation, the method further includes determining whether a main program operation on the memory cell array is required, and when a main program operation on the memory cell array is required, determining a program pattern of the main program operation on the memory cell array. The method further includes issuing a set of commands for the main program operation on the memory cell array to the multi-bit memory device based on the determined program pattern.

Abstract: Memory elements are provided that exhibit immunity to soft error upset events when subjected to high-energy atomic particle strikes. The memory elements may each have ten transistors. To overcome difficulties in writing data into the memory elements, signal strengths for one or more of the signals provided to the array may be adjusted. There may be two positive power supply voltages that are used in powering each memory element. One of the power supply voltages may be temporarily lowered relative to the other power supply voltage to enhance write margin during data loading operations. Other signal strengths that may be adjusted in this way include other power supply signals, data signal levels, address and clear signal magnitudes, and ground signal strengths. Adjustable power supply circuitry and data read-write control circuitry may be used in making these signal strength adjustments.

Abstract: A flash memory array comprises a plurality of memory cells organized in a matrix of rows and columns. Each of the memory cells includes a floating gate memory transistor having a source region and a drain region, and a coupling capacitor electrically connected to the memory transistor. A plurality of word lines are each electrically connected to the capacitor in each of the memory cells in a respective row. A first set of bit lines are each electrically connected to the drain region of the memory transistor in each of the memory cells in a respective column. A plurality of high voltage access transistors are each electrically connected to a bit line in the first set of bit lines. A second set of bit lines are each electrically connected to the source region of the memory transistor in each of the memory cells in a respective column.

Abstract: Memory devices and methods of operating memory devices are provided, such as those that involve a memory architecture that replaces typical static and/or dynamic components with emerging non-volatile memory (NV) elements. The emerging NV memory elements can replace conventional latches, can serve as a high speed interface between a flash memory array and external devices and can also be used as high performance cache memory for a flash memory array.

Abstract: A method of controlling an electronic charge retention circuit for time measurement, including at least a first capacitive element, the dielectric of which has a leakage, and at least a second capacitive element, the dielectric of which has a higher capacitance than the first, the two elements having a common electrode defining a floating node that can be connected to an element for measuring its residual charge, in which a charge retention period is programmed or initialized by injecting or extracting charges via the first element.

Abstract: A nonvolatile SRAM circuit has an SRAM cell and one or two FLOTOX EEPROM cells connected to the data storage terminals of the SRAM cell. In programming to a first data level, the threshold voltage of a FLOTOX EEPROM transistor is brought to a programmed voltage level greater than a read voltage level and erasing to a second data level, the threshold voltage of the FLOTOX EEPROM transistor is brought to an erased voltage level less than the read voltage level. The nonvolatile SRAM array provides for restoring data to an SRAM cell from a FLOTOX EEPROM memory cell(s) at a power initiation and storing data to the FLOTOX EEPROM memory cell(s) to the SRAM cell at power termination. A power detection circuit for providing signals indicating power initiation and power termination to instigate restoration and storing of data between an SRAM cell and a FLOTOX EEPROM cell(s).

Abstract: A non-volatile static random access memory (NV-SRAM) including a latch unit, a first switch, a second switch, a first non-volatile memory (NVM), and a second NVM and an operation method thereof are provided. First terminals of the first and the second switch are respectively connected to a first and a second terminal of the latch unit. Second terminals of the first and the second switch are respectively connected to a first and a second bit line. Control terminals of the first and the second switch are connected to a word line. First terminals of the first and the second NVM are respectively connected to the first and the second terminal of the latch unit. Second terminals of the first and the second NVM are respectively connected to the first and the second bit line. Enable terminals of the first and the second NVM are connected to an enable line.

Abstract: A memory module is provided comprising a substrate having an interface to a host system, volatile memory, non-volatile memory, and a logic device. The logic device may receive the indicator of an external triggering event and copies data from the volatile memory devices to the non-volatile memory devices upon receipt of such indicator. When the indicator of the triggering event has cleared, the logic device restores the data from the non-volatile to the volatile memory devices. The memory module may include a passive backup power source (e.g., super-capacitor) that is charged by an external power source and temporarily provides power to the memory module to copy the data from volatile to non-volatile memory. A voltage detector within the memory module may monitor the voltage of an external power source and generates an indicator of a power loss event if voltage of the external power source falls below a threshold level.

Abstract: The chip area of a semiconductor device including a nonvolatile memory is reduced. The semiconductor device includes a first memory cell and a second memory cell which are formed on the principal surface of a substrate, and arranged adjacent to each other. In a principal surface of the substrate, active regions which are electrically isolated from each other are arranged. In the first active region, the capacitor element of the first memory cell is arranged, while the capacitor element of the second memory cell is arranged in the fourth active region. In the second active region, the respective write/erase elements of the first and second memory cells are both arranged. Further, in the third active region, the respective read elements of the first and second memory cells are both arranged.

Abstract: A programmable non-volatile device is operated with a floating gate that functions as a FET gate that overlaps a portion of a source/drain region and allows for variable coupling through geometry and/or biasing conditions. This allows a programming voltage for the device to be imparted to the floating gate through variable capacitive coupling, thus changing the state of the device. Multi-state embodiments are also possible. The invention can be used in environments such as data encryption, reference trimming, manufacturing ID, security ID, and many other applications.

Abstract: A FIFO with data storage implemented with non-volatile third dimension memory cells is disclosed. The non-volatile third dimension memory cells can be fabricated BEOL on top of a substrate that includes FEOL fabricated active circuitry configured for data operations on the BEOL memory cells. Other components of the FIFO that require non-volatile data storage can also be implemented as registers or the like using the BEOL non-volatile third dimension memory cells so that power to the FIFO can be cycled and data is retained. The BEOL non-volatile third dimension memory cells can be configured in a single layer of memory or in multiple layers of memory. An IC that includes the FIFO can also include one or more other memory types that are emulated using the BEOL non-volatile third dimension memory cells and associated FEOL circuitry configured for data operations on those memory cells.

Abstract: Techniques for providing a semiconductor memory device are disclosed. In one particular embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns, each memory cell. Each of the memory cell may include a first region coupled to a source line, a second region coupled to a bit line, and a body region capacitively coupled to at least one word line via a gate region and disposed between the first region and the second region, wherein the body region may include a plurality of floating body regions and a plurality of floating gate regions capacitively coupled to the at least one word line.

Abstract: The state of a volatile memory cell is set by grounding a power supply to the volatile memory cell and driving a first bit line to the volatile memory cell to a first defined state. The first defined state of the first bit line is controllable independently of a defined state of a second bit line to the volatile memory cell. A word line of the volatile memory cell is driven to a word line state, and the power supply to the volatile memory cell is ungrounded.

Abstract: Data storage circuits are connected to the bit lines in a one-to-one correspondence. A write circuit writes the data on a first page into a plurality of 5 first memory cells selected simultaneously by a word line. Thereafter, the write circuit writes the data on a second page into the plurality of first memory cell. Then, the write circuit writes the data on the first and second pages into second memory cells adjoining 10 the first memory cells in the bit line direction.

Abstract: There is provided a technology which can allow a semiconductor chip formed with a nonvolatile memory to be sufficiently reduced in size. There is also provided a technology which can ensure the reliability of the nonvolatile memory. In a memory cell of the present invention, a boost gate electrode is formed over a control gate electrode via an insulating film. The boost gate electrode has the function of boosting a voltage applied to a memory gate electrode through capacitive coupling between the boost gate electrode and the memory gate electrode. That is, during a write operation or an erase operation to the memory cell, a high voltage is applied to the memory gate electrode and, to apply the high voltage to the memory gate electrode, the capacitive coupling using the boost gate electrode is subsidiarily used in the present invention.

Abstract: Semiconductor memory having both volatile and non-volatile modes and methods of operation.

Abstract: In response to a read command received by a system interface unit for accessing a plurality of blocks of data stored in said non-volatile semiconductor memory, a controller carries out selective read operations of blocks of data to two memories from the non-volatile semiconductor memory. The controller also carries out parallel operations of data transferring a first block of data, which has already been subjected to error detection and error correction operations by an error correction unit, from one of the two memories to a host system via said system interface unit and of data transferring of a second block of data to be subjected to the error detection and error correction operation, from said non-volatile semiconductor memory to the other of the two memories.

Abstract: Semiconductor memory is provided wherein a memory cell includes a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell. The cell further includes a nonvolatile memory comprising a resistance change element configured to store data stored in the floating body under any one of a plurality of predetermined conditions. A method of operating semiconductor memory to function as volatile memory, while having the ability to retain stored data when power is discontinued to the semiconductor memory is described.

Abstract: The present invention provides a memory circuit in which, while the power is not supplied, a data signal that has been held in a memory section corresponding to a volatile memory can be held in a capacitor in a memory section corresponding to a nonvolatile memory. In the nonvolatile memory section, a transistor whose channel is formed in an oxide semiconductor layer allows a signal to be held in the capacitor for a long period. Thus, the memory circuit can hold a logic state (data signal) even while the power supply is stopped. A potential applied to a gate of the transistor whose channel is formed in an oxide semiconductor layer is raised by a booster circuit provided between a wiring for carrying power supply potential and the gate of the transistor, allowing a data signal to be held even by one power supply potential without malfunction.

Abstract: Memory cell structures and methods are described herein. One or more memory cells include a transistor having a charge storage node, a dielectric material positioned between the charge storage node and a channel region of the transistor, the channel region positioned between a source region and a drain region, and a first electrode of a diode coupled to the charge storage node.

Abstract: Systems, methods, and memory device with row lines and column lines arranged in a matrix configuration with a memory cell coupled to one of the column lines and one of the row lines. The memory cell includes a storage capacitor with a first plate coupled to a storage node, a CMOS-compatible non-volatile storage element having a node coupled to the storage node and configured to hold a charge corresponding to a binary value, and an access transistor coupled to the storage node. The access transistor includes a word line gate, a first node, and a second node, the word line gate being coupled to the one of the plurality of row lines, the first node being coupled to the one of the plurality of column lines, the second node being coupled to the storage node and to said node of the CMOS-compatible non-volatile storage element.

Abstract: A plurality of bit lines s arranged crossing a plurality of first word lines. A first diode is arranged at each cross point of the first word lines and the bit lines. A cathode of the first diode is connected to one of the first word lines. A first variable resistance film configuring the first diode is provided between the anodes of the first diodes and the bit lines, and configures a first memory cell together with each of the first diodes, and further, is used in common to the first diodes.

Abstract: Combined memories in integrated circuits are described, including determining a first requirement for logic blocks, determining a second requirement for memory blocks including a vertical configuration for the memory bocks, and compiling a design for the integrated circuit using the first requirement and the second requirement. The memory blocks may include non-volatile two-terminal cross-point memory arrays. The non-volatile two-terminal cross-point memory arrays can be formed on top of a logic plane. The logic plane can be fabricated in a substrate. The non-volatile two-terminal cross-point memory arrays may be vertically stacked upon one another to form a plurality of memory planes. The memory planes can be portioned into sub-planes. One or more different memory types such as Flash, SRAM, DRAM, and ROM can be emulated by the plurality of memory planes and/or sub-planes. The non-volatile two-terminal cross-point memory arrays can include a plurality of two-terminal memory elements.

Abstract: According to one embodiment, a memory system includes a nonvolatile first memory configured to store a boot program, a volatile second memory, a detection circuit configured to detect a level of a power supply voltage, and to generates an interrupt when the power supply voltage becomes less than a first level, and a state machine configured to execute a sequence including a first read operation for reading the boot program from the first memory and a transfer operation for transferring the read boot program to the second memory at power-on. The state machine includes a waiting state for waiting until the interrupt is deactivated when the interrupt is activated during the first read operation or the transfer operation.

Abstract: Embodiments disclosed herein generally relate to switches that utilize micro-electromechanical systems (MEMS). By replacing transistors in many devices with switches such as MEMS switches, the devices may be used for logic applications. MEMS switches may be used in devices such as FPGAs, NAND devices, nvSRAM devices, AMS chips and general memory logic devices. The benefit of utilizing MEMS devices in place of transistors is that the transistors utilize more space on the chip. Additionally, the MEMS devices can be formed in the BEOL without having any negative impacts on the FEOL or necessitating the use of additional layers within the chip.

Abstract: According to an embodiment, a nonvolatile semiconductor memory system includes: a nonvolatile semiconductor memory; and a memory controller having: a memory interface unit that inputs commands to the nonvolatile semiconductor memory and inputs or outputs data between the nonvolatile semiconductor memory; a memory that stores writing information indicating a memory cell transistor that is written the latest in each of the NAND cell units; and a processor that sets a read voltage based on the writing information to read out data from the memory cell transistors connected to a first word line; wherein a row controller is configured to set a plurality of levels of the read voltage to be applied to the first word line, with respect to one threshold for discriminating data stored in a memory cell transistors.

Abstract: An electrically erasable programmable read-only memory (EEPROM) with a ripple programming mode. Memory cells in an the EEPROM array include floating-gate transistors with control gates coupled to corresponding word lines, and drain electrodes coupled to corresponding bit lines. A memory cell is programmed by applying a high programming voltage to its control gate along with applying a high programming voltage to its drain. Multiple memory cells within a row can be programmed by applying the programming voltage to the word line of that row, during which multiple bit lines receive their programming voltage, without removing the word line programming voltage when changing the programming from one bit line to another.