Abstract: A nonvolatile semiconductor storage device includes first and second semiconductor layers extending in a first direction and spaced apart in a second direction, first and second bit lines extending in the second direction and respectively arranged on opposite sides of the semiconductor layers in the first direction, first and second source lines extending in a third direction and respectively arranged on opposite sides of the semiconductor layers in the first direction, a first memory string including first and second select transistors connected to the first bit line and the first source line, respectively, a second memory string including third and fourth select transistors connected to the second bit line and the second source line, respectively, a first select gate line connected to gates of the first and fourth select transistors, and a second select gate line connected to gates of the second and third select transistors.

Abstract: Various embodiments of tandem row decoders are disclosed. Each embodiment of a tandem row decoder comprises a word line decoder and a control gate decoder. The tandem row decoder exhibits reduced leakage current on the word line and the control gate line when the tandem row decoder is not enabled.

Abstract: An apparatus includes a control circuit configured to connect to memory cells connected in series in NAND strings. Each NAND string includes a plurality of data memory cells coupled to a plurality of data word lines in series with a plurality of dummy memory cells connected to a plurality of dummy word lines. The control circuit configured to apply a first dummy word line voltage to one or more dummy word lines of the plurality of dummy word lines in a verify step of a program operation to program data memory cells. The control circuit is configured to apply a second dummy word line voltage to the one or more dummy word lines in a read operation to read the data memory cells.

Abstract: A variety of applications can include memory devices designed to provide stabilization of selector devices in a memory array of the memory device. A selector stabilizer pulse can be applied to a selector device of a string of the memory array and to a memory cell of multiple memory cells of the string with the memory cell being adjacent to the selector device in the string. The selector stabilizer pulse can be applied directly following an erase operation to the string to stabilize the threshold voltage of the selector device. The selector stabilizer pulse can be applied as part of the erase algorithm of the memory device. Additional devices, systems, and methods are discussed.

Abstract: The present disclosure relates to a method for accessing memory cells comprising: applying an increasing read voltage with a first polarity to the plurality of memory cells; counting a number of switching memory cells in the plurality based on the applying the increasing read voltage; applying a first read voltage with the first polarity based on the number of switched memory cells reaching a threshold number; applying a second read voltage with a second polarity opposite to the first polarity; and determining that a memory cell in the plurality of memory cells has a first logic value based on the memory cell having switched during one of the applying the increasing read voltage and the applying the first read voltage or based on the memory cell not having switched during the applying the second read voltage. A related system is also disclosed.

Abstract: A multiplier-accumulator accepts A and B digital inputs and generates a dot product P by applying the bits of the A input and the bits of the B inputs to unit elements comprised of groups of AND gates coupled to charge transfer lines through a capacitor Cu. The number of bits in the B input is a number of AND-groups and the number of bits in A is the number of AND gates in an AND-group. Each unit element receives one bit of the B input applied to all of the AND gates of the unit element, and each unit element having the bits of A applied to each associated AND gate input of each unit element. The AND gates are coupled to charge transfer lines through a capacitor Cu, and the charge transfer lines couple to binary weighted charge summing capacitors which sum and scale the charges from the charge transfer lines, the charge coupled to an analog to digital converter which forms the dot product output. The charge transfer lines may span multiple unit elements.

Abstract: A read operation on selected memory cells may be performed by a method of operating a semiconductor memory device. The method may include determining a read voltage to be used in the read operation among first to 2N?1-th read voltages, applying the determined read voltage to a selected word line connected to the selected memory cells, and applying a read pass voltage to unselected word lines based on whether the determined read voltage is a first read voltage. Here, N may be a natural number of 2 or more.

Abstract: Technology for applying a positive temperature coefficient (Tco) voltage to a control terminal of a dummy select transistor. The dummy select transistor resides on a NAND string having non-volatile memory cells and a regular select transistor. The dummy select transistor is typically ON (or conductive) during memory operations such as selected string program, read, and verify. In an aspect, the positive Tco voltage is applied to the control terminal of a dummy select transistor during a program operation. Applying the positive Tco voltage during program operations reduces or eliminates program disturb to the dummy select transistor. In some aspects, the dummy select transistor is used to generate a gate induced drain leakage (GIDL) current during an erase operation. In some aspects, the dummy select transistor is a depletion mode transistor.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes apparatus including memory cells connected to word lines including at least one dummy word line and data word lines. The memory cells are arranged in strings and are configured to retain a threshold voltage. The apparatus also includes a control means coupled to the word lines and the strings and configured to identify ones of the memory cells connected to the at least one dummy word line with the threshold voltage being below a predetermined detection voltage threshold following an erase operation. The control means is also configured to selectively apply at least one programming pulse of a maintenance program voltage to the at least one dummy word line to program the ones of the memory cells connected to the at least one dummy word line having the threshold voltage being below the predetermined detection voltage threshold.

Abstract: A memory die includes an alternating stack of insulating layers and electrically conductive layers through which memory opening fill structures vertically extend. The memory die includes at least three memory array regions interlaced with at least two contact regions, or at least three contact regions interlaced with at least two memory array regions in the same memory plane. A logic die including at least two word line driver regions can be bonded to the memory die. The interlacing of the contact regions and the memory array regions can reduce lateral offset of boundaries of the word line driver regions from boundaries of the contact regions.

Abstract: A semiconductor storage device includes first and second chips. The first chip includes a first semiconductor substrate, first conductive layers arranged in a first direction and extending in a second direction, a semiconductor column extending in the first direction and facing the first conductive layers, a first charge storage film formed between the first conductive layers and the semiconductor column, a plurality of first transistors on the first semiconductor substrate, and first bonding electrodes electrically connected to a portion of the plurality of first transistors. The second chip includes a second semiconductor substrate, a plurality of second transistors on the second semiconductor substrate, and second bonding electrodes electrically connected to a portion of the plurality of second transistors, and bonded to the first bonding electrodes.

Abstract: Some embodiments include apparatuses and methods of using the apparatuses. One of the apparatuses includes a substrate, a first deck including first memory cell strings located over the substrate, a second deck including second memory cell strings and located over the first deck, first data lines located between the first and second decks and coupled to the first memory cell strings, second data lines located over the second deck and coupled to the second memory cell strings, and first and second circuitries. The first and second data lines extending in a direction from a first portion of the substrate to a second portion of the substrate. The first buffer circuitry is located in the first portion of the substrate under the first memory cell strings of the first deck and coupled to the first data lines. The second buffer circuitry is located in the second portion of the substrate under the first memory cell strings of the first deck and coupled to the second data lines.

Abstract: The present disclosure relates to a three-dimensional memory (3D) and a control method thereof. The 3D memory includes a first deck and a second deck which are stacked in a vertical direction of a substrate. The first deck and the second deck each includes a plurality of memory string. Each memory string includes a plurality of memory cells. The plurality of memory cells includes a first portion and a second portion. A diameter of channel structure corresponding to the first portion of memory cells is smaller than that of channel structure corresponding to the second portion of memory cells. The method includes performing a read operation for selected memory cells that are in at least one of the first deck or the second deck; and applying a pass voltage to non-selected memory cells other than the selected memory cells in the first deck and the second deck. A first pass voltage is lower than a second pass voltage.

Abstract: In order to inhibit memory cells from programming and mitigate program disturb, the memory pre-charges channels of NAND strings connected to a common set of control lines by applying positive voltages to the control lines and applying voltages to a source line and bit lines connected to the NAND strings. The control lines include word lines and select lines. The word lines include an edge word line. The memory ramps down the positive voltages applied to the control lines, including ramping down control lines on a first side of the edge word line, ramping down the edge word line, and performing a staggered ramp down of three or more control lines on a second side of the edge word line. After the pre-charging, unselected NAND strings have their channel boosted to prevent programming and selected NAND strings experience programming on selected memory cells.

Abstract: A multiphase programming scheme for programming a plurality of memory cells of a data storage system includes a first programming phase in which a first set of voltage distributions of the plurality of memory cells is programmed by applying a first plurality of program pulses to word lines of the plurality of memory cells, and a second programming phase in which a second set of voltage distributions is programmed by applying a second plurality of program pulses to the word lines of the plurality of memory cells. The second programming phase includes maintaining a margin of separation between two adjacent voltage distributions of the second set of voltage distributions after each of the second plurality of program pulses. This scheme achieves better margin using an aggressive quick pass approach, which helps with data recovery in case of power loss events.

Abstract: A trigger condition associated with latent read disturb in a memory device is detected. In response to detecting the trigger condition associated with latent read disturb, one or more blocks in the memory device that are impacted by the trigger condition are placed in a stable state to mitigate latent read disturb in the one or more blocks.

Abstract: A method for operating a memory is disclosed. The memory includes a first group of word lines, a second group of word lines, a first dummy word line, and a second dummy word line. The first dummy word line and the second dummy word line are between the first group of word lines and the second group of word lines. A first pass voltage is applied to the first dummy word line and applying a second pass voltage to the second dummy word line. A program voltage is applied to a selected word line, wherein a condition is met: a first voltage difference between the first pass voltage and a first threshold voltage of a first dummy cell corresponding to the first dummy word line is different from a second voltage difference between the second pass voltage and a second threshold voltage of a second dummy cell corresponding to the second dummy word line.

Abstract: The present disclosure generally relates to improved foggy-fine programming. Rather than initially writing to SLC and then later performing a foggy write to QLC with the data read from SLC and then a fine write to QLC with data re-read from SLC, the foggy write to QLC can be performed in parallel to the initial writing to SLC using the same buffer. Once the foggy write to QLC has completed, and the writing to SLC has also completed, the data buffer can be released. The data written in SLC is then be read from SLC and passes through a relocation buffer for the first and only time to then be written using fine programming to QLC. Thus, the data only passes through the relocation buffer one time and the relocation buffer can be freed to usage after only one pass of the data therethrough.

Abstract: According to one embodiment, a semiconductor memory device includes a plurality of first interconnect layers, first and second memory pillars, and a plurality of first plugs. The plurality of first interconnect layers include a first array region where the first memory pillar penetrates the plurality of first interconnect layers, a second array region where the second memory pillar penetrates the plurality of first interconnect layers, and a coupling region where a plurality of coupling parts respectively coupled to the plurality of first plugs are formed. Along a first direction parallel to the semiconductor substrate, the first array region, the coupling region, and the second array region are arranged in order.

Abstract: A semiconductor storage device includes: a substrate layer; and a stacked body that is provided on the substrate layer. The semiconductor storage device includes a columnar portion that includes a semiconductor body extending within the stacked body in a stacking direction. The semiconductor storage device includes: an insulating layer provided on the plurality of terrace portions; and a plurality of columnar bodies extending in a first direction and provided within the insulating layer. The semiconductor storage device includes slit portions that split the stacked body into a plurality of string units. Each of the columnar bodies adjacent to each of the slit portions has a core film, the semiconductor body, a tunnel insulating film, and a block insulating film formed in sequence from a shaft center side to an outer periphery side of the columnar body, and the columnar body does not have the charge storage portion.

Abstract: According to one embodiment, a memory system includes a nonvolatile memory and a memory controller configured to cause the nonvolatile memory to execute a first process of reading data based on a first request from a host device. The memory controller is configured to, when the first request is received from the host device while causing the nonvolatile memory to execute a second process, hold interruption of the second process until a first number becomes a first threshold value or more. The first number is a number of the first requests to be performed in the memory controller. The first threshold value is an integer of 2 or more.

Abstract: A memory system separately programs memory cells connected by a common word line to multiple sets of data states with the set of data states having higher threshold voltage data states being programmed before the set of data states having lower threshold voltage data states. The memory system also separately programs memory cells connected by an adjacent word line to the multiple sets of data states such that memory cells connected by the adjacent word line are programmed to higher data states after memory cells connected by the common word line are programmed to higher data states and prior to memory cells connected by the common word line are programmed to lower data states.

Abstract: A semiconductor device includes: a substrate extending in a first direction and a second direction intersecting with the first direction; a plurality of input/output pads disposed at one side of the substrate; a first circuit adjacent to the input/output pads in the first direction; a second circuit disposed to be spaced farther apart from the input/output pads in the first direction than the first circuit; a first memory cell array overlapping the first circuit; a second memory cell array overlapping the second circuit; first metal source patterns overlapping the first memory cell array and being spaced apart from each other in the second direction; and a second metal source pattern overlapping the second memory cell array and formed to have a width wider than a width of each of the first metal source patterns in the second direction.

Abstract: Apparatuses and techniques are described for detecting a defect in a memory cell array during program operations. A defect can be detected by comparing the programming speed of memory cells connected to different word lines, for one or more programmed data states. The comparison can involve adjacent word lines in a block, or word lines in different blocks and planes. The comparison involves comparing two word lines in terms of a number of program-verify loops used to reach the programmed data states or to transition between programmed data states. If a program loop delta is not within an allowable range for one or more of the programmed data states, it can be concluded that a defect is present. The block which has the slower programming word line can be identified as a bad block.

Abstract: A semiconductor memory device of embodiments includes: a substrate; a memory pillar; first to sixth conductive layers provided above the substrate; first to sixth memory cells formed between the first to sixth conductive layers and the memory pillar, respectively; and a control circuit. The control circuit applies a first voltage to the first, second, a sixth conductive layer and applies a second voltage to the third, fifth conductive layer, then applies a third voltage to the first conductive layer, applies a fourth voltage to the sixth conductive layer, and applies a fifth voltage to the second conductive layer, and then applies a sixth voltage to the first conductive layer, applies a seventh voltage to the sixth conductive layer, and applies an eighth voltage lower than the fifth voltage to the second conductive layer.

Abstract: The present disclosure provides a three-dimensional NAND memory device, comprising a first NAND string including a first channel corresponding to a first cell to be inhibited to program, and a controller configured to control a word line driver and a bit line driver to do the following operations: prior to applying a program voltage to a selected word line, charging a first bit line electrically coupling with the first channel to a first voltage level for charging the first channel to the first voltage level, charging an array common source electrically coupling with the first bit line for further charging the first channel to a second voltage level higher than the first voltage level, and cutting off the electrical coupling between the first bit line and the first channel for preparing to apply the program voltage to the selected word line.

Abstract: In certain aspects, a memory device includes a memory cell array having rows of memory cells, word lines respectively coupled to the rows of memory cells, and a peripheral circuit coupled to the memory cell array through the word lines. Each memory cell is configured to store a piece of N-bits data in one of 2N levels, where N is an integer greater than 1. The level corresponds to one of 2N pieces of N-bits data. The peripheral circuit is configured to program, in a first pass, a row of target memory cells, such that each target memory cell is programmed into one of K intermediate levels based on the corresponding piece of N-bits data, wherein 2N-1<K<2N. The peripheral circuit is also configured to program, in a second pass after the first pass, the row of target memory cells, such that each target memory cell is programmed into one of the 2N levels based on the corresponding piece of N-bits data.

Abstract: The present technology includes a memory device and a method of operating the memory device. The memory device includes a memory block including a plurality of memory cells connected to word lines, peripheral circuits configured to generate operation voltages to be applied to the word lines, and control logic configured to control the peripheral circuits in response to a program command, a read command, or an erase command. The peripheral circuits include a voltage generator that adjusts a section of threshold voltage distributions of memory cells to be programmed among the memory cells, according to a distance between the word lines.

Abstract: A semiconductor storage device includes: a plurality of first memory cells; a word line connected to gates of the first memory cells; a voltage generation circuit configured to generate voltage to be supplied to the word line on the basis of a set value; and a control unit configured to execute a write sequence that includes a plurality of loops, each loop including a program operation to increase a threshold voltage of at least part of the first memory cells to thereby write data to the first memory cells and a verify operation to verify the data written to the first memory cells. The voltage generation circuit generates voltage to be supplied to the word line at start of the verify operation on the basis of a first set value, and the control unit adjusts the first set value in accordance with progress of the write sequence.

Abstract: Described are systems and methods for performing memory programming operations in the overwrite mode. An example memory device includes: a memory array comprising a plurality of memory cells electrically coupled to a plurality of wordlines and a plurality of bitlines; and a controller coupled to the memory array, the controller to perform operations comprising: responsive to identifying a first data item to be stored by a portion of the memory array, causing a first memory programming operation to be performed to program, to a first target threshold voltage, a set of memory cells included by the portion of the memory array; and responsive to identifying a second data item to be stored by the portion of the memory array, causing a second memory programming operation to be performed to program the set of memory cells to a second target threshold voltage exceeding the first target threshold voltage.

Abstract: A memory system includes a memory device with a memory cell array including a first and second plane and first and second caches. A controller is configured to output status information in response to a status read command. The status information indicating the states of the caches. The controller begins a first process in response to a command addressed to the first plane if the status information indicates the first and second caches are in the ready state, and begins a second process on the second plane according to a second command to the second plane if the status information indicates at least the second cache is in the ready state.

Abstract: Disclosed in some examples are systems, methods, memory devices, and machine readable mediums for a fast secure data destruction for NAND memory devices that renders data in a memory cell unreadable. Instead of going through all the erase phases, the memory device may remove sensitive data by performing only the pre-programming phase of the erase process. Thus, the NAND doesn't perform the second and third phases of the erase process. This is much faster and results in data that cannot be reconstructed. In some examples, because the erase pulse is not actually applied and because this is simply a programming operation, data may be rendered unreadable at a per-page level rather than a per-block level as in traditional erases.

Abstract: A semiconductor memory device with a three-dimensional (3D) structure may include: a cell region arranged over a substrate, including a cell structure; a peripheral circuit region arranged between the substrate and the cell region; an upper wiring structure arranged over the cell region; main channel films and dummy channel films formed through the cell structure. The dummy channel films are suitable for electrically coupling the upper wiring structure.

Abstract: A memory device can include a nonvolatile memory (NVM) cell array, data path circuits, coupled between the NVM cell array and an output of the device, that are configured to enable access to the NVM cell array via a plurality of bit lines. A first charge pump can generate a first voltage supply. A second charge pump can generate a second voltage supply. Switch circuits are configured to, in a first mode, couple the first voltage supply to data path circuits, and in a second mode, couple the second voltage supply to the data path circuits. The first charge pump, the second charge pump, the switch circuits, the data path circuits and the NVM cell array are formed with the same integrated circuit substrate. Corresponding methods and systems are also disclosed.

Abstract: According to one embodiment, a memory system includes a memory controller and a nonvolatile memory with multiple planes each provided with multiple word lines, memory cell groups, dummy word lines, and dummy memory cell groups. The memory controller writes data to a memory cell group connected to a corresponding word line of any of the planes, such that a plane to which k-th data are to be written is different from a plane to which (k+m?1)-th data are to be written, and writes the parities to any of the dummy memory cell groups. The combinations of the data used for generating the different parities are different from each other.

Abstract: In a method of programming in a nonvolatile memory device including a memory cell region including a first metal pad and a peripheral circuit region including a second metal pad, wherein the peripheral circuit region is vertically connected to the memory cell region by the first metal pad and the second metal pad, a memory block in the memory cell region including a plurality of stacks disposed in a vertical direction is provided where the memory block includes cell strings each of which includes memory cells connected in series in the vertical direction between a source line and each of bitlines. A plurality of intermediate switching transistors disposed in a boundary portion between two adjacent stacks in the vertical direction is provided, where the intermediate switching transistors perform a switching operation to control electrical connection of the cell strings, respectively.

Abstract: Memory devices might include an array of memory cells, a plurality of access lines, and a heater. The array of memory cells might include a plurality of strings of series-connected memory cells. Each access line of the plurality of access lines might be connected to a control gate of a respective memory cell of each string of series-connected memory cells of the plurality of strings of series-connected memory cells. The heater might be adjacent to an end of each access line of the plurality of access lines.

Abstract: An in-memory computing device includes in some examples a two-dimensional array of memory cells arranged in rows and columns, each memory cell made of a nine-transistor current-based SRAM. Each memory cell includes a six-transistor SRAM cell and a current source coupled by a switching transistor, which is controlled by input signals on an input line, to an output line associates with the column of memory cells the memory cell is in. The current source includes a switching transistor controlled by the state of the six-transistor SRAM cell, and a current regulating transistor adapted to generate a current at a level determined by a control signal applied at the gate. The control signal can be set such that the total current in each output line is increased by a factor of 2 in each successive column of the memory cells.

Abstract: According to one embodiment, a semiconductor memory device includes: first and second select transistors; first and second select gate lines; first and second interconnects; first and second memory cell transistors; and first and second word lines. In a write operation, after execution of a verify operation, in a period in which the second select transistor is ON, a voltage of the first word line changes from a first voltage to a second voltage and a voltage of the second word line changes from a third voltage applied in the verify operation to a fourth voltage, and after the voltage of the first word line changes to the second voltage and the voltage of the second word line changes to the fourth voltage, a voltage of the second select gate line changes from a fifth voltage to a sixth voltage.

Abstract: A method used in forming a memory array comprises forming a stack comprising vertically-alternating first tiers and second tiers. First insulator material is above the stack. The first insulator material comprises at least one of (a) and (b), where (a): silicon, nitrogen, and one or more of carbon, oxygen, boron, and phosphorus, and (b): silicon carbide. Channel-material strings are in and upwardly project from an uppermost material that is directly above the stack. Conducting material is directly against laterally-inner sides of individual of the upwardly-projecting channel-material strings and project upwardly from the individual upwardly-projecting channel-material strings. A ring comprising insulating material is formed individually circumferentially about the upwardly-projecting conducting material. Second insulator material is formed above the first insulator material, the ring, and the upwardly-projecting conducting material.

Abstract: A disturb management technique for a non-volatile memory including first and second memory cells includes programming the first memory cell by applying a first voltage to a first word line coupled to the first memory cell and a second voltage to a terminal, such as a source terminal, shared by the first memory cell and the second memory cell. A non-zero third voltage having the same sign as the second voltage is applied to a second word line coupled to the second memory cell. The applied non-zero third voltage reduces a tunnel current across a gate oxide that insulates the second word line from a substrate of the second memory cell. This results in the second memory cell having a lower likelihood of being disturbed when programming the first memory cell.

Abstract: Technology for two-sided adjacent memory cell interference mitigation in a non-volatile storage system is disclosed. During reading of target memory cells, the storage system applies a suitable magnitude read pass voltage to a first unselected word line adjacent to a target word line to compensate for interference from adjacent cells on the first unselected word line while applying a suitable magnitude read reference voltage to the target word line to compensate for interference from adjacent cells on a second unselected word line on the other side of the target word line. The read pass voltage may compensate for interference due to charge being added to when programming cells on the first unselected word line after programming the target cells. The read reference voltage may compensate for interference due to charge movement near the target cells that results from charge stored in the cells on the second unselected word line.

Abstract: A storage system caches, in volatile memory, data read from non-volatile memory. After detecting an uncorrectable error in the data cached in the volatile memory, the storage system replaces the cached data with data re-read from the non-volatile memory and updated to reflect any changes made to the data after it was stored in the non-volatile memory. The storage system can also analyze a pattern in data adjacent to the uncorrectable error and predict corrected data based on the pattern.

Abstract: An analog CAM and an operation method thereof are provided. The analog CAM includes a matching line, an analog CAM cell and a sense amplifier. Each of the at least one analog CAM includes a first floating gate device having a N type channel and a second floating gate device having a P type channel. A match range is set through programming the first floating gate device and the second floating gate device. The sense amplifier is connected to the matching line. If an inputting signal is within the match range, a voltage of the matching line is pulled down to be equal to or lower than a predetermined level. The sense amplifier outputs a match result if the voltage of the matching line is pulled down to a predetermined level.

Abstract: A semiconductor structure includes a substrate, an insulating layer disposed on the substrate, an active layer disposed on the insulating layer, a first semiconductor device formed in a first device region of the active layer, a charge trap structure through the active layer and surrounding the first device region, and a charge trap layer between the insulating layer and the substrate and extending laterally to underlie the first device region and the charge trap structure.

Abstract: A controller controls a memory including first and second strings. The first and second strings configure first and second string groups, respectively. In each string group, a set of memory cell transistors each from each string configures a unit. The controller is configured to: sequentially write, in the first string group, data in first units to which serially-coupled memory cell transistors respectively belong; sequentially write, in the second string group, data in first units to which serially-coupled memory cell transistors respectively belong; and sequentially write, in the first string group, data in second units to which serially-coupled memory cell transistors respectively belong.

Abstract: Systems and methods for providing memory access commands to memory circuitry using a multi-clock cycle memory command protocol is described. A command decoder (or controller) of the memory circuitry may efficiently receive a memory access request (or a memory command) provided using multiple clock cycles. For example, the command decoder may receive a header and a first portion of address bits of target memory cells of the memory command in a first clock cycle and a second portion of the address bits of the target memory cells in a subsequent clock cycle. Accordingly, the memory circuitry may receive a memory command provided over multiple clock cycles with one header. Such memory commands may efficiently include a high number of address bits received using input circuitry of the memory circuitry.

Abstract: The present technology relates to a semiconductor memory device and a method of operating the same. The semiconductor memory device includes a memory cell array including a plurality of memory blocks, a peripheral circuit configured to perform a program operation on a selected memory block among the plurality of memory blocks, and control logic configured to control the peripheral circuits to perform a retention acceleration operation including boosting a channel of a plurality of cell strings included in the selected memory block between a program voltage applying operation and a program verify operation during the program operation.

Abstract: An apparatus is described. The apparatus includes a non volatile memory chip. The non volatile memory chip includes an interface to receive access commands, a three dimensional array of non volatile storage cells, and, a controller to orchestrate removal of charge in a column of stacked ones of the non volatile storage cells after a verification process that determined whether or not a particular cell along the column was programmed with a correct charge amount. The removal of the charge pushes the charge out of the column by changing respective word line potentials along a particular direction along the column. Cells that are coupled to the column are programmed in the particular direction. Disturbance of neighboring cells during programming is less along the particular direction than a direction opposite that of the particular direction.

Abstract: Algorithms for fast data retrieval, low power consumption in a 3D or planar non-volatile array of memory cells, connected between an accessible drain string and a floating, not directly accessible, source string, in a NOR-logic type of architecture, are presented.