Abstract: The memory controller may include a command generator generating and outputting first and second read commands to a memory device so that respective first and second read operations are performed using a first read voltage, a calculator receiving first and second read data in response to the read commands, comparing the first and second read data each other, and calculating a number of first inverted cells and a number of second inverted cells based on a result of the comparing, each of the first inverted cells having a bit value that inverted from a first bit value to a second bit value, and each of the second inverted cells having a bit value that inverted from the second bit value to the first bit value, and a read voltage determiner changing the first read voltage depending on the number of first inverted cells and the number of second inverted cells.

Abstract: NOR flash memory that includes three-dimensional memory cells is provided. In the NOR flash memory of the present disclosure, one memory cell includes one memory transistor and one selection transistor. A common source 5 is formed over a silicon substrate 9, and an active region 3 extending in a vertical direction to electrically connect to the common source 5 is formed. A control gate 4 of the memory transistor and a selection gate line 2 of the selection transistor are formed to surround a side portion of the active region 3, and a top portion of the active region 3 is electrically connected to a bit line 1.

Abstract: A storage device includes a memory device including a memory cell array and a page buffer group coupled to the memory cell array, and a memory controller configured to store a plurality of cache data chunks to be sequentially programmed, and configured to input a next cache data chunk corresponding to a next program sequence to the page buffer group, when programming of Least Significant Bit (LSB) data of a cache data chunk among the plurality of cache data chunks is completed.

Abstract: Methods for forming semiconductor structures are disclosed, including a method that involves forming sets of conductive material and insulating material, forming a first mask over the sets, forming a first number of contact regions, forming a second mask over a first region of the sets, and removing material from the sets in a second, exposed region laterally adjacent the first region to form a second number of contact regions. Another method includes forming first and second contact regions on portions of sets of conductive materials and insulating materials, each of the second contact regions more proximal to an underlying substrate than each of the first contact regions. Apparatuses such as memory devices including laterally adjacent first and second regions each of which including contact regions of a different portion of a plurality of conductive materials and related methods of forming such devices are also disclosed.

Abstract: According to the present embodiment, a nonvolatile semiconductor memory device includes a memory string group including k stacked memory strings, each of the memory strings including a plurality of nonvolatile memory cells connected in series, a selection transistor group including k selection transistors, each of the k selection transistors corresponding to each of the k memory strings respectively, the selection transistor group divided into n selection transistor sub-groups, each of the n selection transistor sub-groups including k/n selection transistors, n bit lines arranged in parallel to each of the k memory strings, and n bit line contacts arranged perpendicularly, each of the n bit line contacts connected to each of the n bit lines, respectively, each of the n bit line contacts connected to the k/n selection transistors belonging to the each of the n selection transistor sub-group respectively.

Abstract: Provided herein may be a semiconductor memory device and a method of operating the semiconductor memory device to program a selected physical page of the semiconductor memory device. The method may include performing a plurality of program loops. Each of the program loops may include: applying a bit line voltage based on data input to a page buffer of the semiconductor memory device; applying a two-step program pulse to a word line coupled to the selected physical page; performing a program verify operation on the selected physical page using a double verify scheme; and determining a bit line voltage to be applied in a subsequent program loop based on a result of the program verify operation.

Abstract: A method to operate a 3D semiconductor charge trap memory device, the method comprising; executing a memory set-up operation, wherein said memory set-up operation comprises a preload of a plurality of memory cells followed by a partial erase; and then executing a memory operation on said memory cells, wherein each memory cell of said plurality of memory cells comprises a charge trap layer, wherein said memory operation comprises first writing a first memory state by loading a charge into said charge trap layer, and then second writing a second memory state by removing said charge to a partially erased state. Various 3D devices, processing flows and methods are also disclosed.

Abstract: A semiconductor device includes a first chip and a second chip. The first chip includes a first circuit having a first output terminal. The second chip includes a second circuit having a second output terminal, which is electrically connected to the first output terminal via a first signal line. When the first chip and the second chip receive a first command, the second circuit calibrates an output impedance at the second output terminal through a first calibration operation based on an output impedance at the first output terminal.

Abstract: Embodiments of three-dimensional (3D) memory devices are disclosed. In an example, a 3D memory device includes a substrate, a peripheral device disposed on the substrate, a memory stack disposed above the peripheral device and including a plurality of conductor/dielectric layer pairs, and a plurality of memory strings. Each of the memory strings extends vertically through the memory stack and includes a drain select gate and a source select gate above the drain select gate. Edges of the conductor/dielectric layer pairs in a staircase structure of the memory stack along a vertical direction away from the substrate are staggered laterally toward the memory strings.

Abstract: A majority voting processing device performs majority voting on respective bits of information data piece including r-number of bits (r is an integer of 2 or greater). The device includes a memory including a plurality of memory element groups each including r-number of memory elements that store data for the corresponding r-number of bits, respectively, the plurality of memory element groups each being provide for one address. A memory access unit writes each bit of the information data piece in k-number (k is an odd number of 3 or greater) of the memory elements in the memory element group corresponding to one address, and reads out the k-number of bits written in the k-number of the memory elements corresponding to that one address. A majority voter that performs majority voting on the k-number of bits read out from the memory by the memory access unit.

Abstract: A semiconductor memory apparatus includes an access line control circuit. The access line control circuit applies a selected bias voltage to a selected access line coupled with a target memory cell and applies a first unselected bias voltage to an unselected access line adjacent to the selected access line. A second unselected bias voltage is applied to an unselected access line not adjacent to the selected access line.

Abstract: Techniques are described for programming memory cells with reduced widening of the threshold voltage distributions. Bit line voltages are adjusted during verify tests for memory cells assigned to the upper data state in a pair of adjacent data states which are concurrently verified. An elevated bit line voltage is applied and then stepped up in successive program loops. A lower, fixed bit line voltage is used for verifying the lower data state in the pair of adjacent data states. In one option, the step size increases progressively over the program loops. In another option, the minimum level of the elevated bit line voltage is lower for higher data states. In another option, the minimum level of the elevated bit line voltage is set as a function of data states, program-erase cycles and/or temperature.

Abstract: Methods of operating a memory, and memory configured to perform similar methods, might include performing a sense operation on a particular memory cell of a first string of series-connected memory cells selectively connected to a first data line, applying a first voltage level to the access line for a second memory cell of the first string, applying a second voltage level higher than the first voltage level to the access line for the particular memory cell, applying a third voltage level to the first data line concurrently with applying the first voltage level and concurrently with applying the second voltage level, and applying a fourth voltage level higher than the third voltage level to a second data line selectively connected to a second string of series-connected memory cells concurrently with applying the third voltage level to the first data line.

Abstract: The various implementations described herein include methods, devices, and systems for performing operations on memory devices. In one aspect, a memory device a magnetic memory component and a current selector component coupled to the magnetic memory component. The current selector component includes a first transistor having a first gate with a corresponding first threshold voltage. The first transistor comprises a charge storage layer configured to selectively store charge so as to adjust a current through the first transistor. The memory device further includes control circuitry configured to determine a bit error rate of the magnetic memory component and adjust a charge stored in the charge storage layer based on the determined bit error rate.

Abstract: Methods of operating a memory include activating a respective memory cell of each string of series-connected memory cells of a plurality of strings of series-connected memory cells, selectively activating a target memory cell of a selected string of series-connected memory cells of the plurality of strings of series-connected memory cells depending upon its data state, and deactivating a respective memory cell of each string of series-connected memory cells of a first subset of the plurality of strings of series-connected memory cells.

Abstract: Memory devices including a controller configured to cause the memory device to apply a positive first voltage level to a first data line selectively connected to a first string of series-connected memory cells while applying a second voltage level, higher than the first voltage level, to a second data line selectively connected to a second string of series-connected memory cells; while applying the first voltage level to the first data line and applying the second voltage level to the second data line, applying a third voltage level to a particular access line coupled to a memory cell of a first string of series-connected memory cells selected for programming, wherein a differential between the third voltage level and the first voltage level is configured to increase a threshold voltage of the memory cell selected for programming, as well as other apparatus containing similar memory devices.

Abstract: A 3D memory device, the device including: a first horizontal bit-line; a second horizontal bit-line disposed above the first horizontal bit-line, where the first horizontal bit-line and the second horizontal bit-line function as a source or a drain for a plurality of parallel vertically-oriented memory transistors, where the first horizontal bit-line and the second horizontal bit-line are self-aligned being formed following the same lithography step; and conductive memory control lines, where a first portion of the conductive memory control lines are disposed at least partially directly underneath the plurality of parallel vertically-oriented memory transistors, and where a second portion of the conductive memory control lines are disposed at least partially directly above the plurality of parallel vertically-oriented memory transistors.

Abstract: According to one embodiment, a semiconductor memory device includes: a memory string including first and second select transistors and memory cell transistors; a bit line connected to the first select transistor; word lines which are connected to gates of the memory cell transistors, respectively; first and second select gate lines which are connected to gates of the first and second select transistors, respectively; a first contact plug connected to the first select gate line; a first wiring layer provided on the first contact plug; a second contact plug connected to the second select gate line; a second wiring layer provided on the second contact plug; and a row decoder connected to the first and second wiring layers. The row decoder applies different voltages to the first select gate line and the second select gate line.

Abstract: Vertical memory devices and methods of forming the same are provided. The devices may include a gate line structure including gate lines that are stacked in a first direction and extend in a second direction. The device may also include a first step pattern structure including extended gate lines extending from the gate lines and including first step layers and a second step pattern structure contacting the first step pattern structure, including the extended gate lines and including second step layers. An n-th extended gate line (n is an even number) may be disposed at an upper portion of each of the first step layers, and an (n-1)-th extended gate line may be disposed at an upper portion of each of the second step layers. Each of exposed portions of the (n-1)-th extended gate lines serves as a pad region, and the pad regions have different areas.

Abstract: Embodiments of the present disclosure relate to physical secure erase (PSE) of solid state drives (SSDs). One embodiment of a method of PSE of a SSD includes receiving a PSE command, erasing the memory cells of the blocks, programming the memory cells, and programming the select gates to a portion of the blocks. One embodiment of a SSD includes a controller and a plurality of blocks having a plurality of NAND strings. Each NAND string includes connected in series a select gate drain, memory cells, and a select gate source. The SSD includes a memory erasing instruction that cause the controller to erase the memory cells of the block, program the memory cells, and increase the threshold voltage to the select gate drain and/or the select gate source of some of the NAND strings from the blocks.

Abstract: A nonvolatile memory device performs a read operation comprising first and second intervals. In the first interval the device applies a turn-on voltage to string selection lines and ground selection lines connected to the string selection transistors and the ground selection transistors, respectively. In the second interval, the device applies a turn-off voltage to unselected string selection lines and unselected ground selection lines while continuing to apply the turn-on voltage to a selected string selection line and a selected ground selection line. In both the first and second intervals, the device applies a first read voltage to a selected wordline connected to memory cells to be read by the read operation and applying a second read voltage to unselected wordlines among connected to memory cells not to be read by the read operation.

Abstract: Non-volatile, high performance memory devices balance speed and reliability, which can include channel boosting to reduce data error rates in the memory cells. Vertical NAND strings exhibit greater program disturb (errors) the higher the wordline is on the string. The present disclosure applies a boosted bit line voltage or an increased precharge time when the programming reaches a level (wordline number) where it has been determined that errors due to program disturb may be an issue. The boost to the bit line may occur after a stored wordline value or based on a calculated number of errors at a previous wordline. In an example, the bit line stays the same as the prior world line programming operation until the likely program disturb is determined.

Abstract: A nonvolatile semiconductor memory device includes a control circuit configured to control a soft program operation of setting nonvolatile memory cells to a first threshold voltage distribution state of the nonvolatile memory cells. When a characteristic of the nonvolatile memory cells is in a first state, the control circuit executes the soft program operation by applying a first voltage for setting the nonvolatile memory cells to the first threshold voltage distribution state to first word lines, and applying a second voltage higher than the first voltage to a second word line. When the characteristic of the nonvolatile memory cells is in a second state, the control circuit executes the soft program operation by applying a third voltage equal to or lower than the first voltage to the first word lines and applying a fourth voltage lower than the second voltage to the second word line.

Abstract: Program disturb is a condition that includes the unintended programming of a memory cell while performing a programming process for other memory cells. Such unintended programming can cause an error in the data being stored. In some cases, program disturb can result from electrons trapped in the channel being accelerated from one side of a selected word line to another side of the selected word line and redirected into the selected word line. To prevent such program disturb, it is proposed to open the channel from one side of a selected word line to the other side of the selected word line after a sensing operation for program verify and prior to a subsequent programming voltage being applied.

Abstract: An embodiment may include a method of forming an integrated circuit. The method may include forming a first pair of transistors stacked vertically above a semiconductor substrate arranged substantially perpendicular to the plurality of layers. Each of the first pair of vertically stacked transistors are of the same type and are connected in series. The method may include forming a second pair of transistors connected in parallel and arranged substantially perpendicular to the plurality of layers. The second pair of transistors are a different type than the first pair of vertically stacked transistors. The method may include forming a power supply rail within the semiconductor substrate and arranged at one end of the first pair of vertically stacked transistors.

Abstract: An image sensor includes a first transfer gate formed over a substrate, and including a first projection; a second transfer gate formed over the substrate, neighboring the first transfer gate, and including a second projection; and a floating diffusion formed in the substrate, and partially overlapping with the first transfer gate and the second transfer gate, wherein the first projection and the second projection face each other.

Abstract: A non-volatile electronic memory device is integrated on a semiconductor and is of the Flash EEPROM type with a NAND architecture including at least one memory matrix divided into physical sectors, intended as smallest erasable units, and organized in rows or word lines and columns or bit lines of memory cells. At least one row or word line of a given physical sector is electrically connected to at least one row or word line of an adjacent physical sector to form a single logic sector being erasable, with the source terminals of the corresponding cells of the pair of connected rows referring to a same selection line of a source line.

Abstract: A memory device includes a semiconductor channel extending between a source region and a drain region, a plurality of pass gate electrodes, a plurality of word lines, a gate dielectric located between the semiconductor channel and the plurality of pass gate electrodes, and ferroelectric material portions located between the semiconductor channel and the plurality of word lines.

Abstract: A nonvolatile memory device includes a semiconductor substrate including a page buffer region, a memory cell array, bitlines, first vertical conduction paths, and second vertical conduction paths. The memory cell array is formed in a memory cell region above the semiconductor substrate and includes memory cells. The bitlines extend in a column direction above the memory cell array. Each of bitlines is cut into each of first bitline segments and each of second bitline segments. The first vertical conduction paths extend in a vertical direction and penetrate a column-directional central region of the memory cell region. The first vertical conduction paths connect the first bitline segments and the page buffer region. The second vertical conduction paths extend in the vertical direction and penetrate the column-directional central region. The second vertical conduction paths connect the second bitline segments and the page buffer region.

Abstract: Apparatuses are described that include stacked arrays of memory cell strings and their methods of operation. Apparatuses include architectures that reduce the use of several common components, allowing greater device density and smaller device size for a given semiconductor area.

Abstract: A memory device includes a memory cell array including a plurality of memory blocks; a peripheral circuit configured to sequentially perform a channel initialization operation and a read operation on a memory block selected from among the plurality of memory blocks; and control logic configured to control the peripheral circuit to perform the channel initialization operation and the read operation, wherein the control logic sets a time during which the channel initialization operation is to be performed as channel initialization period depending on a potential level of supply voltage, the channel initialization operation being performed to remove hot holes in a channel of the selected memory block.

Abstract: A semiconductor memory device according to an embodiment includes a string, a bit line, a well line, and a sequencer. The string includes first and second select transistors, and memory cell transistors using a ferroelectric material. The bit line and the well line are connected to the first and second select transistors, respectively. At a time in an erase verify operation, the sequencer is configured to apply a first voltage to the memory cell transistors, to apply a second voltage lower than the first voltage to the first select transistor, to apply a third voltage lower than the first voltage to the second select transistor, to apply a fourth voltage to the bit line, and to apply a fifth voltage higher than the fourth voltage to the well line.

Abstract: Some embodiments include apparatuses and methods of operating the apparatuses. One of the apparatuses includes a memory cell string having first, second, third, fourth, and fifth memory cells; access lines including first, second, third, fourth, and fifth access lines coupled to the first, second, third, fourth, and fifth memory cells, respectively, and a module. The first memory cell is between the second and third memory cells. The second memory cell is between the first and fourth memory cells. The third memory cell is between the first and fifth memory cells. The module is to couple the first access line to a ground node at a first time of a memory operation, couple the second and third access lines to the ground node at a second time of the operation after the first time, and couple the fourth and fifth access lines to the ground node at a third time of the operation after the second time.

Abstract: Provided herein are a memory device and an operating method thereof. The memory device may include a plurality of memory blocks and one or more peripheral circuits. Each of the plurality of memory blocks may include a plurality of cell strings. The one or more peripheral circuits may perform one or more operations on the plurality of memory blocks. The operations may include turning off select transistors of the cell strings included in the memory blocks, increasing channel voltages of the cell strings included in the memory blocks, turning on, among select transistors included in the memory blocks, select transistors included in a selected memory block, and performing a read or a verify operation on the selected memory block.

Abstract: Techniques are described for maintaining a pre-charge voltage in a NAND string in a program operation. After a pre-charge voltage is applied to the channel of a NAND string, the word line voltages are controlled to avoid a large channel gradient which generates electron-hole pairs, where the electrons can pull down the channel boosting level on the drain side of the selected word line. In one approach, the word line voltages of a group of one or more source side word lines adjacent to the selected word line are increased directly from the level used during pre-charge to a pass voltage. The word line voltages of other source side word lines, and of drain side word lines, can be decreased and then increased to the pass voltage to provide a large voltage swing which couples up the channel.

Abstract: A semiconductor device and method of operating a semiconductor device, the semiconductor device includes memory strings coupled between a common source line and a bit line, and a peripheral circuit coupled to the memory strings through a plurality of word lines and a dummy word line, and configured to set bias of the word lines and the dummy word line before performing a read operation, wherein the peripheral circuit applies a first pass voltage to the word lines concurrently with applying an initial voltage lower than the first pass voltage to the dummy word line, and increases the first pass voltage and the initial voltage to a second pass voltage to set the bias of the word lines and the dummy word line.

Abstract: Apparatus and methods are disclosed, such as an apparatus that includes a string of charge storage devices associated with a pillar (e.g., of semiconductor material), a source gate device, and a source select device coupled between the source gate device and the string. Additional apparatus and methods are described.

Abstract: A memory device may include: a control circuit comprising a first verification component suitable for counting the number of memory cells in the selected word line having an excessively high threshold voltage as excessive memory cells, after a program operation is completed; and a second verification component suitable for counting the number of failed bits when the number of excessive memory cells counted is greater than or equal to an excess threshold value, and suitable for outputting a pass or fail signal for the program operation according to the count of at least one of the first verification component and the second verification component.

Abstract: A semiconductor memory device includes first and second memory transistors and first and second word lines connected to gate electrodes of the memory transistors. The semiconductor memory device is configured such that a first write operation to the first memory transistor, a second write operation to the second memory transistor, a third write operation to the first memory transistor, and a fourth write operation to the second memory transistor are executed in this order. In the first and second write operations, data write is performed using only a program operation. In the third and fourth write operations, data write is performed using the program operation and the verify operation.

Abstract: A memory system includes: a memory device; and a non-erase block management device suitable for determining, when an erase operation is performed on a first memory block included in the memory device, whether to perform a read operation on a second word line of a second memory block, according to a location of a first word line, which is a target word line for a read operation on the second memory block, wherein the second word line includes a target word line for a dummy read operation.

Abstract: An operation method of a nonvolatile memory device includes applying a program voltage to a selected word line and programming a selected memory cell connected to the selected word line; reading an adjacent memory cell connected to an adjacent word line of the selected word line; and verifying the selected memory cell by adjusting charge sharing between the selected memory cell and a sensing node, which is connected to the selected memory cell through a bit line.

Abstract: Disclosed in some examples, are methods, systems, and machine readable mediums which compensate for read-disturb effects by shifting the read voltages used to read the value in a NAND cell based upon a read counter. For example, the NAND memory device may have a read counter that corresponds to a group of NAND cells (e.g., a page, a block, a superblock). Anytime a NAND cell in the group is read, the read counter may be incremented. The read voltage, Vread, may be adjusted based on the read counter to account for the read disturb voltage.

Abstract: A data storage device includes a nonvolatile memory device including dies including word line groups in which word lines are grouped; and a controller. The controller includes a word line health rating logic configured to determine a health rating of each word line and a health rating of each word line group based on state information on each of health rating factors associated with the word lines; a memory including a word line health rating table in which the health rating of each word line and the health rating of each word line group are stored; and a mapping logic configured to generate a management target logical super block by mapping one word line group having a lowest health rating and word line groups having a highest health rating, and generate a normal logical super block by mapping word line groups having intermediate health ratings.

Abstract: A memory device includes a memory cell array including a plurality of word lines, at least one select line provided above the plurality of word lines, and a channel region passing through the plurality of word lines and the at least one select line, the plurality of word lines and the channel region providing a plurality of memory cells, and a controller. The controller is to store data in a program memory cell among the plurality of memory cells by sequentially performing a first programming operation and a second programming operation, and to determine a program voltage input to a program word line connected to the program memory cell, in the first programming operation, based on information regarding the program memory cell.

Abstract: A semiconductor structure for a DRAM is described having multiple layers of arrays of memory cells. Memory cells in a vertical string extending through the layers have an electrical connection to one terminal of the memory cells in that string. Word lines couple the strings together. Each layer of the array also includes bit line connections to memory cells on that layer. Select transistors enable the use of folded bit lines. The memory cells preferably are thyristors. Methods of fabricating the array are described.

Abstract: A semiconductor memory device includes a memory string with a first selection transistor, a first memory cell, a second memory cell, and a second selection transistor connected in series. A first word line connects to the first memory cell, and a second word line connects to the second memory cell. Selection gates line are connected to first and second selection transistors. A control circuit is configured to control a write operation on the first memory string. The write operation includes a program loop with a program operation and a program verification operation. After the program loop is completed, a first voltage is applied to the first and second word lines and a second voltage is applied to the selection gate lines. The first voltage is sufficient to turn on the first and second memory cells. The second voltage is sufficient to turn on the selection transistors.

Abstract: Systems and methods reduce latency during read-verify and programming operations by biasing a dummy line next to a neighboring bit line with an over-drive voltage during a first period and then biasing the dummy line to a same voltage as that of the neighboring bit line during a second period that contiguously follows the first period. The dummy line may be biased based on a state of the neighboring bit line. For example, a first dummy line is first charged to an over-drive voltage and then charged to the same voltage as that of a first neighboring bit line, and a second dummy line at an opposing edge is first charged to the over-drive voltage and then charged to the same voltage as that of a second neighboring bit line. This biasing scheme using the dummy lines helps reduce capacitive loading for neighboring bit lines during ready-verify and programming operations.

Abstract: A data storage device includes a nonvolatile memory device including a plurality of memory blocks; a random-access memory including a bad block management module configured to register and manage bad blocks included in the plurality of memory blocks; and a processor configured to detect primary bad blocks by performing a primary bad block scan operation on the plurality of memory blocks using the bad block management module, detect secondary bad blocks by performing a secondary bad block scan operation on normal memory blocks other than the primary bad blocks among the plurality of memory blocks, and register the detected primary bad blocks and the detected secondary bad blocks as bad blocks.

Abstract: Various embodiments of the present application are directed a memory layout for reduced line loading. In some embodiments, a memory device comprises an array of bit cells, a first conductive line, a second conductive line, and a plurality of conductive bridges. The first and second conductive lines may, for example, be source lines or some other conductive lines. The array of bit cells comprises a plurality of rows and a plurality of columns, and the plurality of columns comprise a first column and a second column. The first conductive line extends along the first column and is electrically coupled to bit cells in the first column. The second conductive line extends along the second column and is electrically coupled to bit cells in the second column. The conductive bridges extend from the first conductive line to the second conductive line and electrically couple the first and second conductive lines together.

Abstract: A non-volatile semiconductor memory device has a NAND string, in which multiple memory cells are connected in series. A read procedure is performed for a selected memory cell in the NAND string on the condition that the selected memory cell is applied with a selected voltage while unselected memory cells are driven to be turned on without regard to cell data thereof. In the read procedure, a first read pass voltage is applied to unselected memory cells except an adjacent and unselected memory cell disposed adjacent to the selected memory cell, the adjacent and unselected memory cell being completed in data write later than the selected memory cell, and a second read pass voltage higher than the first read pass voltage is applied to the adjacent and unselected memory cell.