Abstract: Methods of reading data from memory cells. Such methods include subjecting an analog storage device to a voltage level indicative of a threshold voltage of a memory cell to store a charge to the analog storage device, and generating an analog voltage from the stored charge.

Abstract: Apparatus, methods, and systems are disclosed, including those to improve program voltage distribution width using automatic selective slow program convergence (ASSPC). One such method may include determining whether a threshold voltage (Vt) associated with a memory cell has reached a particular pre-program verify voltage. In response to the determination, a voltage applied to a bit-line coupled to the memory cell may be automatically incremented at least twice as the program voltage is increased, until the cell is properly programmed. Additional embodiments are also described.

Abstract: Memory cells store k bits of data (k is a natural number not less than 2) into a single cell. A number n of data storage circuits store externally supplied k bits of data to write data into the memory cells. A control circuit inputs the data on a first page, a second page, . . . , a k-th page to every h (h?n) of the data storage circuits and then writes the data in the n data storage circuits into the memory cells.

Abstract: A control circuit is configured to execute a writing operation for giving a second threshold voltage distribution to a plurality of memory cells formed along one word line. In the writing operation, the control circuit performs a writing operation by executing a voltage applying operation in memory cells to be given the second threshold voltage distribution. While the control circuit executes a voltage applying operation in memory cells to be maintained in an erased state, thereby moving a first threshold voltage distribution to a positive direction to obtain a third threshold voltage distribution representing the erased state.

Abstract: Subject matter disclosed herein relates to techniques to operate memory.

Abstract: Devices, systems, methods, and other embodiments associated with accessing memory using fractional reference voltage are described. In one embodiment, an apparatus includes comparison logic. The comparison logic compares a threshold voltage of a memory cell to at least one pair of fractional reference voltages to generate comparison results. The apparatus includes read logic to determine a bit value of the memory cell based, at least in part, on the comparison results.

Abstract: A memory cell array has a structure in which a plurality of memory cells connected with word lines and bit lines and connected in series are arranged in a matrix form. A selection transistor selects the word lines. A control circuit controls potentials of the word lines and the bit lines in accordance with input data, and controls write, read and erase operations of data with respect to the memory cell. The selection transistor is formed on a well, and a first negative voltage is supplied to a well, a first voltage (the first voltage the first negative voltage) is supplied to a selected word line and a second voltage is supplied to a non-selected word line in the read operation.

Abstract: Integrated circuit memory devices utilize techniques to improve the timing of data update operations within a non-volatile memory, by more efficiently combining memory cell programming operations with threshold voltage adjust operations on erased memory cells. These adjust operations operate to narrow a threshold voltage distribution between memory cells that remain in an erased state after the programming operation has been performed. An integrated circuit memory device may include at least a first block of non-volatile memory cells and a volatile memory device, which has a data storage capacity equivalent to at least a capacity of the at least a first block of non-volatile memory cells. A memory controller is also provided, which is electrically coupled to the at least a first block of non-volatile memory cells and the volatile memory device.

Abstract: A NAND Flash memory controller is used to perform an erase operation on a NAND Flash memory chip including to a cell on the NAND Flash memory chip; the cell is configured to store a first number of bits. It is determined whether the erase operation performed on the NAND Flash memory chip is successful. In the event it is determined that the erase operation performed on the NAND Flash memory chip is unsuccessful, the number of bits stored by the cell is reduced from the first number of bits to a second number of bits; the second number of bits is strictly less than the first number of bits.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory unit and a control unit. The memory unit includes a charge storage film, a first insulating film provided adjacent to one surface of the charge storage film, a second insulating film provided adjacent to one other surface of the charge storage film, a semiconductor portion provided adjacent to the first insulating film and a plurality of electrode portions provided adjacent to the second insulating film. The control unit performs a control of applying a first voltage to electrode portions adjacent to each other in one direction at different timing respectively, in an erasing. The erasing is performed by at least one selected from injecting electron holes into the charge storage film and removing electrons from the charge storage film. The first voltage is applied from one of the electrode portions to the charge storage film to be erased.

Abstract: Shifts in the apparent charge stored on a charge storing element of a non-volatile memory cell can occur because of the coupling of an electric field based on the charge stored in adjacent charge storing elements. To compensate for this coupling, the programming process for a given memory cell can take into account the target programmed state of one or more adjacent memory cell. The amount of programming is verified after each programming pulse and the standard verify level for the programming cell is dependent on the target state. The verify level is further offset lower dependent on the amount of perturbation from neighboring cells, determinable by their target states. The verify level is preferably virtually offset by biasing adjacent word lines instead of actually offsetting the standard verify level. For soft-programming erased cells, neighboring cells on both adjacent word lines are taken into account.

Abstract: In a non-volatile storage system, during a verify operation, a verify voltage of a currently-sensed target data state is applied to a selected word line. A higher, nominal bit line voltage is used for the storage elements which have the currently-sensed target data state and a verify status of pass or no pass, a target data state lower than the currently-sensed target data state and a verify status of pass or no pass, or a target data state higher than the currently-sensed target data state and a verify status of pass. A lower bit line voltage is used for the storage elements which have the target data state higher than the currently-sensed target data state and a verify status of no pass, to enhance channel-to-channel coupling, as an offset to floating gate-to-floating gate coupling which is later caused by these storage elements.

Abstract: A method to adjust the programming voltage in flash memory when the programming time exceeds specification. A method to adjust the programming voltage of flash memory after a predetermined number of erase/write cycles.

Abstract: A nonvolatile memory device using interleaving technology is provided. The nonvolatile memory device includes a first controller configured to allocate one of 2N threshold voltage states to N-bit data where N is 2 or a natural number greater than 2, a second controller configured to set a difference between adjacent threshold voltage states among the 2N threshold voltage states so that the difference increases as a threshold voltage increases, and a programming unit configured to form a threshold voltage distribution state corresponding to the allocated threshold voltage state and to program the N-bit data to a multi-level cell. The second controller controls the difference between the adjacent threshold voltage states to equalize the number of read errors for all intersections among the 2N threshold voltage states at the end of life.

Abstract: A method includes performing a first programming operation on a plurality of memory cells in a same programming cycle; and performing a verification operation on the plurality of memory cells to find failed memory cells in the plurality of memory cells, wherein the failed memory cells are not successfully programmed in the first programming operation; and performing a second programming operation on the failed memory cells. Passed memory cells successfully programmed in the first programming operation are not programmed in the second programming operation.

Abstract: A three-dimensional (3D) semiconductor memory device comprises memory cell strings each comprising at least one selection transistor and at least one memory cell, a first pass transistor group sharing a first well region and comprising a first selection line pass transistor connected to the selection transistor and a first world line pass transistor connected to the memory cell, a second pass transistor group sharing a second well region and comprising a second selection line pass transistor connected to the selection transistor, and a controller that controls the first pass transistor group and the second pass transistor group. The controller applies selected voltages to the first and second well regions during read operation.

Abstract: A nonvolatile semiconductor storage device includes a plurality of cells for storing data on a basis of charges stored nonvolatilly, a write unit for writing and erasing data on the cell by injecting or extracting charges into or from the cell, a comparator for comparing the voltage produced by a selected cell to be read out with a threshold, a read unit for outputting read data on the basis of the comparison result by the comparator, and a threshold update unit for updating the threshold of the comparator according to the voltage produced by the selected cell.

Abstract: A memory cell array is configured to have a plurality of memory cells arranged in a matrix, each of the memory cells being connected to a word line and a bit line and being capable of storing n values (n is a natural number equal to or larger than 3). A control circuit controls the potentials of the word line and bit line according to input data and writes data into a memory cell. The control circuit writes data into the memory cell to a k-valued threshold voltage (k<=n) in a write operation, precharges the bit line once, and then changes the potential of the word line an i number of times to verify whether the memory cell has reached an i-valued (i<=k) threshold voltage.

Abstract: A nonvolatile semiconductor storage device includes: a word line; a reading circuit; and a failure detection circuit. The word line is connected to gates of a plurality of nonvolatile memory cell transistors. The reading circuit is connected to one end of the word line and supplies one of a reading selection voltage and a reading non-selection voltage to the word line. The failure detection circuit is connected to the other end of the word line and detects a voltage of the word line supplied with the one of the reading selection voltage and the reading non-selection voltage by comparing the voltage with a plurality of reference voltages.

Abstract: An electrically addressed non-volatile memory is maintained by measuring a voltage threshold for each selected memory cell in the electrically addressed non-volatile memory. The voltage threshold is a voltage around which a controllable voltage signal applied to a control gate of a selected memory cell produces a change in value read from the selected memory cell. A measured voltage threshold distribution of the measured voltage thresholds is generated for the selected memory cells. The voltage threshold distribution is analyzed to identify memory cells having greater probabilities of read errors, for example. In response to the analysis, an operating parameter that affects the memory cells identified as having greater probabilities of read errors is selectively changed.

Abstract: Memories, data paths, methods for storing, and methods for utilizing are disclosed, including a data path for a memory using multi-level memory cells to provide storage of multiple bits per memory cell. One such data path includes a bit mapping circuit and a data converter circuit. Such a bit mapping circuit can be configured to map bits of the original data to an intermediate arrangement of bits and such a data converter circuit can be configured to receive the intermediate arrangement of bits and convert the intermediate arrangement of bits into intermediate data corresponding to a memory state to be stored by memory cells of a memory cell array.

Abstract: Methods for functional programming memory cells and apparatuses are disclosed. One such method for functional programming includes encoding a group of data with a function to generate representative data and programming the representative data to the memory. In one embodiment, the representative data is a pattern of threshold voltages to be programmed to a group of memory cells.

Abstract: Techniques and devices relating to adjusting one or more operational parameters for memory cells are provided. One such device may include a detection unit configured to perform one or more reading operations on a set of memory cells to determine an upper bound of the threshold voltages of the set of memory cells. The device may further include a parameter adjustment unit configured to adjust one or more operational parameters for the set of memory cells based, at least in part, on the determined upper bound of the threshold voltages. Other techniques and devices are also provided.

Abstract: A method for operating a memory (28) that includes a plurality of analog memory cells (32) includes storing data in the memory by writing first storage values to the cells. Second storage values are read from the cells, and a Cumulative Distribution Function (CDF) of the second storage values is estimated. The estimated CDF is processed so as to compute one or more thresholds. A memory access operation is performed on the cells using the one or more thresholds.

Abstract: The embodiments of the invention in this disclosure describe techniques for early warning of degradation in NOR Flash memories by estimating the dispersion of the threshold voltages (VT's), of a set of NOR Flash memory cells during read operations. In an embodiment invention the time-to-completion (TTC) values for the read operation for the memory cells are used as a proxy for dispersion of the threshold voltages (VT's). If the measured TTC dispersion differs by more than a selected amount from the reference dispersion value, a warning signal is provided to indicate that the page of memory has degraded significantly. Higher level components in the system can use the warning signal to take appropriate action. Since every cell's VT position in an ideal distribution can be estimated, the data from each cell can have a confidence level assigned based on deviation from the mean of an ideal distribution.

Abstract: According to one embodiment, a semiconductor memory device includes a semiconductor substrate, memory cells without a source region and a drain region, and a first insulating film. The memory cells are arranged adjacent to one another on the semiconductor substrate and include a first gate electrode including a charge accumulation layer. A current path functioning as a source region or a drain region of a selected memory cell is formed in the semiconductor substrate when a voltage is applied to the first gate electrode of one of unselected memory cells. The first insulating film is formed on the semiconductor substrate to fill a region between the first gate electrodes of the memory cells adjacent to each other.

Abstract: A semiconductor memory device includes memory cells, word lines, a driver circuit, and a control circuit. The driver circuit repeats a programming operation of selecting any one of the word lines, of applying a first voltage to selected one of the word lines, and of applying a second voltage to unselected one of the word lines, to write data to selected one of the memory cells connected to the selected one of the word lines. The control circuit, while the driver circuit is repeating the programming operation, steps up the first voltage and keeps the second voltage constant until the first voltage reaches a first threshold. The control circuit steps up the second voltage after the first voltage has reached the first threshold.

Abstract: A nonvolatile memory device for reducing programming current and improving reliability comprises a memory cell array, a write circuit, and a verification circuit. The memory cell array comprises memory cells arranged at crossing points of a bit-line and word-line matrix of the memory cell array. The write circuit provides multiple variable pulses to each word-line for programming. The multiple variable pulses have predetermined amplitude for keeping gate injection current roughly maximum while lowering conduction current during programming operation. The verification circuit senses variation of the conduction current during the programming operation, and disables the programming operation if the sensed conduction current during the programming operation reaches a predetermined value.

Abstract: Apparatuses, methods, and other embodiments associated with group based read reference voltage management in flash memory are described. According to one embodiment, an apparatus includes an interval logic configured to create a finite set of timer intervals, a partition logic configured to selectively assign a Vref value to a set of flash memory cells as a function of a given timer interval during which the set of flash memory cells are programmed, and an adaptation logic configured to selectively adapt a given Vref value associated with a flash memory cell upon determining that the flash memory cell has been read.

Abstract: A method for suspending an erase operation performed on a group of memory cells in a flash memory circuit is disclosed. One example method includes providing to the memory circuit a command to erase the group of memory cells via a plurality of erase pulses. After applying an erase pulse, if it is determined that another operation has a priority higher than a predetermined threshold, the method suspends the erase operation, performs the other operation, and then resumes the erase operation.

Abstract: The present disclosure includes methods, devices, and systems for adjusting sensing voltages in devices. One or more embodiments include memory cells, and a controller configured to perform a sense operation on the memory cells using a sensing voltage to determine a quantity of the memory cells having a threshold voltage (Vt) greater than the sensing voltage and adjust a sensing voltage used to determine a state of the memory cells based, at least partially, on the determined quantity of memory cells.

Abstract: A system including a programming module and an interference module. The programming module is configured to determine a programming value to which a state of a target cell is to be programmed, wherein the programming value is determined based on states of one or more cells near the target cell. The interference module is configured to generate interference values based on (i) the state of the target cell and (ii) the states of the one or more cells near the target cell. The programming module is further configured to determine the programming value based on at least one of the interference values selected according to (i) the state of the target cell and (ii) the states of the one or more cells near the target cell.

Abstract: A nonvolatile semiconductor memory device according to one embodiment includes: a memory cell array; word lines each connected to nonvolatile memory cells; and a control circuit. When executing the data reading operation, the control circuit applies to a selected word line connected to a selected memory cell a first voltage obtained by adding a first adjusting voltage to an intermediate voltage between adjoining two of the threshold voltage distributions; applies to first non-selected word lines adjoining the selected word line a second voltage obtained by subtracting a second adjusting voltage from a reading pass voltage; applies to second non-selected word lines adjoining the first non-selected word lines a third voltage obtained by adding the second adjusting voltage to the reading pass voltage; and applies to third non-selected word lines, the third non-selected word lines being non-selected word lines except the first and second non-selected word lines, the reading pass voltage.

Abstract: A nonvolatile memory includes a plurality of N-bit multi-level cell (MLC) memory cells and a controller. The plurality of N-bit MLC memory cells are for storing N pages of data, each of the MLC memory cells programmable into any one of 2N threshold voltage distributions, where N is a positive number. The controller is configured to program the N pages of data into the MLC memory cells, and to execute a partial interleave process in which the N pages of data are divided into M page groups, where M is a positive number and where each page group includes at least one of the N pages of data, and in which each of the M page groups is applied to an error correction code (ECC) circuit to generate parity bits for the respective M page groups, where a bit-error rate (BER) among the pages within each of the M groups is equalized by the partial interleave process.

Abstract: A method and apparatus for operation for the NAND-like dual charge retaining transistor NOR flash memory cells begins by erasing, verifying over-erasing the threshold voltage level of the erased charge retaining transistors to an erased threshold voltage level. Then method progresses by programming one of two charge retaining transistors of the NAND-like dual charge retaining transistor NOR flash memory cells to a first programmed threshold voltage level, and programming the other of the two charge retaining transistors of the NAND-like dual charge retaining transistor NOR flash memory cells to the first programmed threshold voltage level or to a second programmed threshold voltage level. Combinations of the erased threshold voltage level and the first and second programmed threshold voltage levels determine an internal data state of the NAND-like dual charge retaining transistor NOR flash memory cells which are then decoded to ascertain the external data logical state.

Abstract: Methods of programming a memory and memories are disclosed. In at least one embodiment, a memory is programmed by determining a pretarget threshold voltage for a selected cell, wherein the pretarget threshold voltage is determined using pretarget threshold voltage values for at least one neighbor cell of the selected cell.

Abstract: A nonvolatile memory device comprises a memory cell array including a number of bit lines commonly coupled to a source line and each coupled to a number of memory cells, a delay unit configured to delay a sense signal in response to a voltage level of the source line and to output a delayed sense signal, and a page buffer unit configured to sense voltage levels of the bit lines in response to the delayed sense signal.

Abstract: A method of programming a nonvolatile memory device comprises performing a first program operation on first memory cells and second memory cells so that threshold voltages of the first and second memory cells have a first reference level lower than a first target level, the first memory cells having the first target level as a first target level, and the second memory cells having a second target level higher than the first target level as a second target level; performing a second program operation on the second memory cells so that the threshold voltages of the second memory cells have a second reference level lower than the second target level; and performing a third program operation on the first and second memory cells to have the respective target levels.

Abstract: A memory system and a nonvolatile memory device therein are disclosed. The memory system comprises a memory device outputting a plurality of analog signals during a read operation, a converter to convert the plurality of analog signals into binary data, and a memory controller to operate an error correction operation on the binary data. The error correction operation uses a soft decision algorithm.

Abstract: Disclosed is a method, circuit and system for determining a Lowest Operative Threshold Voltage Level for one or more cell segments/blocks/sets of a NVM array and a corresponding device, adapted to compare substantially native state NVM cells in a block of cells against one or more reference cells/structures or offset values, and to maintain a read error count.

Abstract: A method of storing data in a multi-level charge-trapping memory array is described. An incidence-of-occurrence (i.e., frequency) analysis is performed on data to be programmed to identify data words combining a high programming voltage with a high frequency of occurrence. Those words are reassigned in order to reduce programming time.

Abstract: The present invention realizes a semiconductor integrated circuit device for driving liquid crystal (liquid crystal control driver IC) capable of easily setting drive conditions and the like according to specifications of a liquid crystal display to be used. An electrically-programmable nonvolatile memory circuit (EPROM) or an electrically erasable and programmable nonvolatile memory circuit (EEPROM) is provided in a semiconductor integrated circuit device for driving a liquid crystal display, and setting information is stored in the memory circuit. The memory circuit is constructed by a normal device which can be formed in the same process as a semiconductor manufacturing process of forming devices of other circuits.

Abstract: A method of programming a non-volatile memory including N-bit multi-level cell (MLC) memory includes executing an incremental step pulse programming (ISPP) operation on the MLC memory cells, where the ISPP operation includes a programming sequence of first through Nth page programming operations, where N is an integer of 2 or more. The programming sequence further includes an erase programming that is executed after the (N?1)th page programming operation and before the Nth page programming operation, where the erase page programming increases a threshold voltage distribution of erase cells among the MLC memory cells.

Abstract: Methods and systems for addressing threshold voltage shifts of memory cells. A method includes reading a pattern of data from a first plurality of memory cells, comparing the read of the pattern of data with a known pattern of data using a reference, and if the read of the pattern of data and the known pattern of data do not match, adjusting the reference to find a reference level that results in a matching of a read of the pattern of data and the known pattern of data. Thereafter, trim sector data is read into a second plurality of memory cells using the adjusted reference level.

Abstract: A three-terminal Ovonic Threshold Switch (OTS) is used to provide current to a Phase Change Memory Switch (PCMS) cross point array. The current is started by sending a small current into the second terminal of the three-terminal OTS allowing a larger current to flow from the first terminal to the third terminal of the three-terminal OTS. A method of making the three-terminal OTS is also presented.

Abstract: Methods for programming a memory array, memory devices, and memory systems are disclosed. In one such method, the target reliability of the data to be programmed is determined. The relative reliability of different groups of memory cells of the memory array is determined. The data is programmed into the group of memory cells of the array having a relative reliability corresponding to the target reliability.

Abstract: A NOR flash nonvolatile memory or reconfigurable logic device has an array of NOR flash nonvolatile memory circuits that includes charge retaining transistors serially connected in a NAND string such that at least one of the charge retaining transistors functions as a select gate transistor to prevent leakage current through the charge retaining transistors when the charge retaining transistors is not selected for reading. The topmost charge retaining transistor's drain is connected to a bit line parallel to the charge retaining transistors and the bottommost charge retaining transistor's source is connected to a source line and is parallel to the bit line. The charge retaining transistors are programmed and erased with a Fowler-Nordheim tunneling process.

Abstract: The flash memory device includes a control logic circuit and a bit level conversion logic circuit. The control logic circuit programs first through Nth bits of data in a memory cell array of the N-bit MLC flash memory device or reads the first through Nth bits of the data from the memory cell array in response to one of a program command and a read command. The bit level conversion control logic circuit, after the first through Nth bits of the data are completely programmed or read, programs or reads an (N+1)th bit of the data in response to a control signal. The bit level conversion control logic circuit converts voltage levels of voltages, which are used for programming or reading the first through Nth bits of the data, to program or read for 2N cell distributions of 2N+1 cell distributions corresponding to the (N+1)th bit of the data and then programs or reads for other 2N cell distributions.

Abstract: A semiconductor memory includes: a non-volatile memory cell including a floating gate and a memory transistor; a state machine that generates a normal program signal for performing a normal program operation and a verify signal for performing a verify operation and generates a soft program signal for performing a soft program operation when detecting a fail in the verify operation after the normal program operation, whether a threshold voltage of the memory transistor reaches a value being checked in the verify operation; a voltage generating circuit that generates a normal program voltage and a verify voltage based on the normal program signal and the verify signal and generates a soft program voltage based on the soft program signal; and a determination circuit that detects a pass when the threshold voltage reaches the value and detects the fail when the threshold voltage does not reach the value.

Abstract: A method of programming a semiconductor device includes performing a Least Significant Bit (LSB) program operation on selected memory cells, performing a soft program operation on the remaining memory cells other than memory cells on which the LSB program operation has been performed, and performing a Most Significant Bit (MSB) program operation on memory cells, selected from among the memory cells on which the LSB program operation has been performed and the memory cells on which the soft program operation has been performed.