Abstract: Methods and apparatus for programming a memory include programming cells to a first threshold voltage, verifying programming using a first verify voltage, and applying a test read voltage to verify again that the cells are programmed to the first threshold voltage. The test read voltage is lower than the first verify voltage.

Abstract: A method for operating a memory (28) that includes a plurality of analog memory cells (32) includes storing data in the memory by writing first storage values to the cells. Second storage values are read from the cells, and a Cumulative Distribution Function (CDF) of the second storage values is estimated. The estimated CDF is processed so as to compute one or more thresholds. A memory access operation is performed on the cells using the one or more thresholds.

Abstract: A method of reading data in a non-volatile memory device. The method includes reading a plurality of memory cells of a first page in a memory cell array using a first read level, reading a plurality of memory cells of a second page adjacent to the memory cells of the first page using a second read level, determining whether a state of each memory cell of the first page has been changed based on the first read level to verify a threshold voltage of each memory cell of the second page based on the second read level, and revising the state of each memory cell of the second page according to a result of the determination.

Abstract: A method and apparatus for a memory device is provided. The memory device includes a memory cell, a memory controller, and a temperature-sensing device that detects a temperature. The memory controller enables adjusting, based on the detected temperature, a parameter associated with a bit-altering operation to the memory cell that changes a threshold voltage of the memory cell such that the threshold voltage to which the memory cell is changed to by the bit-altering operation is compensated for variations in temperature.

Abstract: A memory cell array is configured to have a plurality of memory cells arranged in a matrix, each of the memory cells being connected to a word line and a bit line and being capable of storing n values (n is a natural number equal to or larger than 3). A control circuit controls the potentials of the word line and bit line according to input data and writes data into a memory cell. The control circuit writes data into the memory cell to a k-valued threshold voltage (k<=n) in a write operation, precharges the bit line once, and then changes the potential of the word line an i number of times to verify whether the memory cell has reached an i-valued (i<=k) threshold voltage.

Abstract: A semiconductor device with a novel structure is provided, in which the operation voltage is reduced or the storage capacity is increased by reducing variation in the threshold voltages of memory cells after writing. The semiconductor device includes a plurality of memory cells each including a transistor including an oxide semiconductor and a transistor including a material other than an oxide semiconductor, a driver circuit that drives the plurality of memory cells, and a potential generating circuit that generates a plurality of potentials supplied to the driver circuit. The driver circuit includes a data buffer, a writing circuit that writes one potential of the plurality of potentials into each of the plurality of memory cells as data, a reading circuit that reads the data written into the memory cells, and a verifying circuit that verifies whether the read data agrees with data held in the data buffer or not.

Abstract: A non-volatile memory device capable of reading and writing a large number of memory cells with multiple read/write circuits in parallel has features to reduce power consumption during read, and program/verify operations. A read or program verify operation includes one or more sensing cycles relative to one or more demarcation threshold voltages to determine a memory state. In one aspect, selective memory cells among the group being sensed in parallel have their conduction currents turned off when they are determined to be in a state not relevant to the current sensing cycle. In another aspect, a power-consuming period is minimized by preemptively starting any operations that would prolong the period. In a program/verify operation cells not to be programmed have their bit lines charged up in the program phase. Power is saved when a set of these bit lines avoids re-charging at every passing of a program phase.

Abstract: A method of programming a nonvolatile memory device comprises selectively programming memory cells from a first state to a second state based on lower bit data, selectively programming the memory cells from the second state to an intermediate state corresponding to the lower bit data, and selectively programming the memory cells from the intermediate state to a third or fourth state based on upper bit data.

Abstract: In a non-volatile memory system, a multi-phase programming operation is performed. In one phase, faster-programming storage elements have a higher bit line bias (Vbl) than slower-programming storage elements. In a next phase, the faster- and slower-programming storage elements have a lower Vbl. Further, a drain-side select gate voltage (Vsgd) can be adjusted in the different programming phases to accommodate the different Vbl levels. A higher Vsgd can be used in the one phase when Vbl is higher to avoid unnecessary stress on the SGD transistor and reduce power consumption. Vsgd can be reduced in the next phase when the lower Vbl is used. The higher Vbl is a slowdown measure which can be applied when the Vth of a storage element is between lower and upper verify levels of target data states, or throughout a programming phase.

Abstract: Embodiments are provided that include a method including providing a first pulsed gate signal to a selected memory cell, wherein the pulsed gate signal alternates between a first voltage level and a second voltage level during a time period and sensing a data line response to determine data stored on the selected memory of cells. Further embodiments provide a system including a memory device, having a regulator circuit coupled to a plurality of access lines of a NAND memory cell, and a switching circuit configured to sequentially bias at least one of the plurality of the access lines between a first voltage level and a second voltage level based on an input signal.

Abstract: A nonvolatile semiconductor storage device is disclosed. The device includes a cell group having a first memory cell and a second memory cell located first directionally adjacent to the first memory cell, and a programming circuit. The first memory cell is used for data retention and the second memory cell is used for adjustment of a threshold voltage of the first memory cell. The programming circuit is configured to program the first memory cell by applying voltage to the second memory cell to control the threshold voltage of the first memory cell to be higher than a first threshold voltage.

Abstract: A random access memory device is disclosed having an interface that is compatible with a NAND FLASH memory device such that the device can be operated with a standard NAND memory device's controller device. This memory device is can store data internally using any random access storage technology including PRAM, MRAM, RRAM, FRAM, OTP-RAM and 3-D memory.

Abstract: Devices and methods of programming memory cells, both SLC and MLC, such as to reduce charge-storage structure to charge-storage structure coupling, are shown and described. Programming of memory cells can include comparing a first page of data to a second page of data, and further programming cells corresponding to the first page of data that will not likely be affected by coupling from programming the second page of data.

Abstract: A memory system having a plurality of memory cells for storing payload data and redundancy data. The memory system having a read-out circuit configured to read-out a status of the plurality of memory cells, the read-out status having payload data, redundancy data and associated reliability information. Moreover, the memory system has a data processor configured to derive the payload data from the read-out status using the reliability information.

Abstract: A system including a reference voltage module to select a first reference voltage between a first threshold voltage corresponding to a first state of a memory cell and a second threshold voltage corresponding to a second state of the memory cell, a second reference voltage less than the first reference voltage, and a third reference voltage greater than the first reference voltage. The system includes a read module to perform a first read operation to determine a state of the memory cell based on the first reference voltage, and in response to a first failure to decode data read from the memory cell in the first read operation, perform a second read operation to determine the state based on the second reference voltage and a third read operation to determine the state based on the third reference voltage.

Abstract: A memory system comprises a multi-bit memory device and a memory controller that controls the multi-bit memory device. The memory system determines whether a requested program operation is a random program operation or a sequential program operation. Where the requested program operation is a random program operation, the memory controller controls the multi-bit memory device to perform operations according to a fine program close policy or a fine program open policy.

Abstract: Apparatus and methods for determining pass/fail condition of memories are disclosed. In at least one embodiment, a set of common lines, one for each rank of page buffers corresponding to a page, determine the pass/fail status of all connected memory cells, and the pass/fail status results for each line can be combined to determine a pass/fail for the page of memory.

Abstract: A programming method includes the following steps. A preset programming voltage is applied to a memory cell to program the memory cell. A first verify voltage is applied to the memory cell to detect a programming result of the memory cell. A programming voltage applied on the memory cell is adjusted according to the programming result of the memory cell. A flash memory is also provided.

Abstract: A storage device according to one embodiment includes memory cells which are connected in series in a first direction and are arranged in a matrix by the arranged series connections, and word lines which connect control gates of the memory cells in a second direction perpendicular to the first direction, in which a first interval and a second interval wider than that are alternately repeated for intervals in the second direction between the memory cells. The storage device according to the embodiment comprises a drive unit for writing data in a first cell, then writing data in a second cell which is connected to the same word line as the first cell and is spaced at the first interval in the second direction, then reading the data in the second cell, and reading the data in the first cell with correction based on the read value of the second cell.

Abstract: A programming method for a nonvolatile memory device includes performing a LSB programming operation programming all LSB logical pages, and thereafter performing a MSB programming operation programming all MSB logical pages, wherein during the LSB programming operation a selected MLC is programmed to a negative intermediate program state. A program sequence for the LSB and MSB programming operations may be sequential or non-sequential in relation to an order arranged of word lines.

Abstract: A method for operating a semiconductor memory device includes the steps of: erasing memory cells of a memory block to set the memory cells in a first erased state, programming a part of the memory cells of the memory block to convert them into a programmed state, raising threshold voltages of selected memory cells of the memory block and converting the selected memory cells from the programmed state to a second erased state, and reading data from the memory cells in the first erased state, the programmed state, and the second erased state, and outputting the data read from the memory cells in the first and second erased states with the same value.

Abstract: Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for biasing a direct injection semiconductor memory device. The method may comprise applying a first voltage potential to a first N-doped region via a bit line and applying a second voltage potential to a second N-doped region via a source line. The method may also comprise applying a third voltage potential to a word line, wherein the word line is spaced apart from and capacitively coupled to a body region that is electrically floating and disposed between the first N-doped region and the second N-doped region. The method may further comprise applying a fourth voltage potential to a P-type substrate via a carrier injection line.

Abstract: A method for performing memory access management includes: with regard to a same memory cell of a memory, according to a first digital value output by the memory, requesting the memory to output at least one second digital value, wherein the first digital value and the at least one second digital value are utilized for determining information of a same bit stored in the memory cell, and a number of various possible states of the memory cell is equal to a number of various possible combinations of all bit(s) stored in the memory cell; and based upon the at least one second digital value, generating/obtaining soft information of the memory cell, for use of performing soft decoding. An associated memory device and a controller thereof are also provided.

Abstract: A flash memory device and reading method of the flash memory device. The reading method includes determining a read voltage set of memory cells corresponding to a first word line from at least one of flag cell data of the first word line and flag cell data of a second word line adjacent to the first word line, and reading the memory cells corresponding to the first word line according to the determined read voltage set.

Abstract: A system for error recovery for flash memory comprises a receiver and an interface. The receiver is configured to receive a portion of data. The receiver is further configured to identify a logical type of the portion of data. The receiver is further configured to adjust a threshold for error recovery of the portion of data based at least in part on the logical type. The receiver is further configured to read the portion of data using the adjusted threshold. The interface is coupled to the receiver.

Abstract: The present disclosure includes methods and devices for determining sensing voltages. One such method includes comparing data associated with a number of template distributions to data associated with a first threshold voltage distribution and a second threshold voltage distribution associated with a number of memory cells programmed to particular adjacent program states, determining an intersection of the first and second threshold voltage distributions based on a template distribution of the number template distributions which most closely compares to the first and second threshold voltage distributions, and using the determined intersection to determine a sensing voltage used to sense the number of memory cells programmed to the particular adjacent program states.

Abstract: A non-volatile semiconductor memory device according to one aspect of an embodiment of the present invention includes: a semiconductor substrate; an element region; a plurality of memory cell transistors which each include a control gate electrode; and programming means for programming data to a programming target memory cell transistor by applying a programming voltage to the programming target memory cell transistor. Moreover, the programming means applies a programming voltage incremented stepwise from an initial programming voltage, to the programming target memory cell transistor while applying a constant initial intermediate voltage to memory cell transistors adjacent to the programming target memory cell transistor.

Abstract: Techniques are disclosed herein for applying different process steps to single-level cell (SLC) blocks in a memory array than to multi-level cell (MLC) blocks such that the SLC blocks will have high endurance and the MLC blocks will have high reliability. In some aspects, different doping is used in the MLC blocks than the SLC blocks. In some aspects, different isolation is used in the MLC blocks than the SLC blocks. Techniques are disclosed that apply different read parameters depending on how many times a block has been programmed/erased. Therefore, blocks that have been cycled many times are read using different parameters than blocks that have been cycled fewer times.

Abstract: A non-volatile memory has its cells' thresholds programmed within any one of a first set of voltage bands partitioned by a first set of reference thresholds across a threshold window. Hard bits are obtained when read relative to the first set of reference thresholds. The cells are read at a higher resolution relative to a second set of reference thresholds so as to provide additional soft bits for error correction. The soft bits are generated by a combination of a first modulation of voltage on a current word line WLn and a second modulation of voltage on an adjacent word line WLn+1, as in a reading scheme known as “Direct-Lookahead (DLA)”.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell array, a column decoder, and a control circuit configured to control the memory cell array and the column decoder. The control circuit is configured to load program data from outside, to execute a first data program in a first even-numbered bit line, to execute a second data program in a first odd-numbered bit line, to execute a verify read of the programmed bit lines, to determine whether a value of the verify read is programmed up to a predetermined threshold value, and to change, in a case where the value of the verify read fails to be programmed to the predetermined threshold value, an order of the first and second data programs, to execute the second data program in the first odd-numbered bit line, and then to execute the first data program in the first even-numbered bit line.

Abstract: A method for data storage includes accepting data for storage in a memory that includes multiple analog memory cells. The data is stored in a first group of the memory cells by programming a second group of the memory cells so as to cause the second group to generate interference in the first group, and individually erasing the first group while verifying that analog levels of the memory cells in the first group subject to the interference are within a predefined bound following erasure. After erasing the first group, the first group of the memory cells is programmed with the data.

Abstract: Provided are a flash memory system and a driving method thereof. A flash memory device according to an embodiment of the present invention includes a memory cell array including a plurality of memory cells, and a control logic. The control logic performs control for one-bit information to be stored in the plurality of memory cells. The control logic controls storing data in the plurality of memory cells multiple times without an erasion operation. Accordingly, the flash memory device does not execute an erasion operation, increasing an operation speed.

Abstract: Aspects of the subject technology encompass a method for retrieving information stored in flash memory. In certain implementations, the method can include operations for reading a plurality of memory cells in a word line, generating a plurality of read signals based on the reading of the plurality of memory cells and identifying, from among the plurality of read signals, a first read signal associated with a first memory cell and a second read signal associated with a second memory cell, wherein the first memory cell is adjacent to the second memory cell in the word line. In certain aspects, the method can further include operations for generating an output for the first memory cell, wherein the output is based on the first and second read signals. A data storage system and article of manufacture are also provided.

Abstract: A high side semiconductor structure is provided. The high side semiconductor structure includes a substrate, a first deep well, a second deep well, a first active element, a second active element and a doped well. The first deep well and the second deep well are formed in the substrate, wherein the first deep well and the second deep well have identical type of ion doping. The first active element and the second active element are respectively formed in the first deep well and the second deep well. The doped well is formed in the substrate and is disposed between the first deep well and the second deep well. The doped well, the first deep well and the second deep well are interspaced, and the type of ion doping of the first deep well and the second deep well is complementary with that of the doped well.

Abstract: A programming method includes setting the voltages of bit lines, performing a program operation, performing a program verify operation by supplying a program verify voltage and determining whether all of the memory cells of the selected page have been programmed with a target threshold voltage or higher, counting the number of passed memory cells corresponding to a number of pass bits, if, a result of the program verify operation, the program operation failed to program all of the memory cells of the selected page to the target threshold voltage or higher, and making a determination that determines whether the number of pass bits is greater than the first number of pass permission bits, and raising a voltage of a bit line coupled to a failed memory cell, if, as a result of the determination, the number of pass bits is greater than the first number of pass permission bits.

Abstract: A method in performing an erasure operation of a nonvolatile memory device includes a step of performing a block erasure operation wherein a plurality of memory cells in a selected block are erased at once, a step of selecting an over-programmed memory cell having a threshold voltage higher than an upper bound verification voltage, and a step of erasing selectively the over-programmed memory cell.

Abstract: Memory devices and programming methods are disclosed. In an embodiment of one such method, a memory cell is programmed to at least a first threshold voltage. After programming the memory cell to at least the first threshold voltage, the memory cell is read, using a read voltage that is less than the first threshold voltage. After reading the memory cell, the memory cell is programmed to at least a second threshold voltage that is greater than the first threshold voltage.

Abstract: An erase process for a 3D stacked memory device performs a two-sided erase of NAND strings until one of more of the NAND strings passes an erase-verify test, then a one-sided erase of the remaining NAND strings is performed. The two-sided erase charges up the body of a NAND string from the source-side and drain-side ends, while the one-sided erase charges up the body of the NAND string from the drain-side end. The NAND strings associated with one bit line form a set. The switch to the one-sided erase can occur when the set meets a set erase-verify condition, such as one, all, or some specified portion of the NAND strings of the set passing the erase-verify test. The erase operation can end when no more than a specified number of NAND strings have not met the erase-verify test. As a result, erase degradation of the memory cells is reduced.

Abstract: Embodiments and examples of differential threshold voltage non-volatile memories and related methods are described herein. Other embodiments, examples thereof, and related methods are also disclosed herein.

Abstract: A method and system for determining a respective threshold voltage of each of a plurality of transistors in a memory array. The method includes: applying a ramp voltage to gates of the plurality of transistors, wherein the ramp voltage is configured to increase based on an incrementing digital code; as the ramp voltage is being applied, generating a respective control signal in response to sensing a predetermined threshold current along a respective bitline in the memory array, wherein each transistor in the memory array is in communication with a respective bitline in the memory array; and for each transistor in the memory array, latching a current value of the incrementing digital code in response to the respective control signal corresponding to the transistor being generated. The current value of the incrementing digital code latched by each register corresponds to the threshold voltage of the corresponding transistor.

Abstract: A nonvolatile memory device and a method of programming the same. The nonvolatile memory device includes a memory cell array including a plurality of memory cells and a program control logic circuit controlling the memory cell array. The program control logic circuit programs a first memory cell so that the threshold voltage of the first memory cell corresponding to data of erasure state is higher than the threshold voltage of a second memory cell corresponding to data of program state, in the memory cell array. The nonvolatile memory device controlled in this manner can provide higher reliability.

Abstract: Memories, data paths, methods for storing, and methods for utilizing are disclosed, including a data path for a memory using multi-level memory cells to provide storage of multiple bits per memory cell. One such data path includes a bit mapping circuit and a data converter circuit. Such a bit mapping circuit can be configured to map bits of the original data to an intermediate arrangement of bits and such a data converter circuit can be configured to receive the intermediate arrangement of bits and convert the intermediate arrangement of bits into intermediate data corresponding to a memory state to be stored by memory cells of a memory cell array.

Abstract: A method for data storage includes storing data in a group of analog memory cells by writing into the memory cells in the group respective storage values, which program each of the analog memory cells to a respective programming state selected from a predefined set of programming states, including at least first and second programming states, which are applied respectively to first and second subsets of the memory cells, whereby the storage values held in the memory cells in the first and second subsets are distributed in accordance with respective first and second distributions. A first median of the first distribution is estimated, and a read threshold, which differentiates between the first and second programming states, is calculated based on the estimated first median. The data is retrieved from the analog memory cells in the group by reading the storage values using the calculated read threshold.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array, a bit line, and a voltage generator. The memory cell array includes each of a plurality of memory cells. Each of the memory cells includes a charge storage layer and a control gate and is capable of holding two or more levels of data. The bit line is capable of transferring data to the memory cells in a one-to-one correspondence. The voltage generator carries out a verify operation by applying a verify voltage to the memory cells after performing first writing by applying a first voltage and then a second voltage lower than the first voltage to the control gate.

Abstract: A memory includes first and second select gate transistors, memory cells, a source line, a bit line, a selected word line which is connected to a selected memory cell as a target of a verify reading, a non-selected word line which is connected to a non-selected memory cell except the selected memory cell, a potential generating circuit for generating a selected read potential which is supplied to the selected word line, and generating a non-selected read potential larger than the selected read potential, which is supplied to the non-selected word line, and a control circuit which classifies a threshold voltage of the selected memory cell to one of three groups by verifying which area among three area which are isolated by two values does a cell current of the selected memory cell belong, when the selected read potential is a first value.

Abstract: A flash memory device and a reading method are provided where memory cells are divided into at least two groups. Memory cells are selected according to a threshold voltage distribution. Data stored in the selected memory cells are detected and the data is latched corresponding to one of the at least two groups according to a first read operation. A second read operation detects and latches data of the memory cells corresponding to another one of the at least two groups. The data is processed through a soft decision algorithm during the second read operation.

Abstract: Apparatuses and methods for determining threshold voltage shift are described. A number of methods for determining threshold voltage shift in memory cells include determining changes in threshold voltage for memory cells at each data state of a first number of data states by searching threshold voltage data of memory cells programmed to the first number of data states and determining changes in threshold voltage for memory cells at each data state of a second number of data states by searching threshold voltage data of memory cells programmed to the second number of data states within a range of threshold voltages, wherein the range is shifted from a previous range based on the changes in threshold voltage for memory cells programmed to the first number of data states.

Abstract: Subject matter disclosed herein relates to techniques to use a memory device. A method includes receiving a memory instruction comprising at least one parameter representative of at least one threshold voltage value and a read command to read at least one cell of the memory device. The method further includes detecting at least one voltage value from the at least one cell. The method further includes comparing the at least one voltage value to the at least one threshold voltage value. The method further includes determining at least one logical value of the at least one cell in response to the comparison of the at least one voltage value to the at least one threshold voltage value.

Abstract: A non-volatile memory device comprises a memory cell array comprising memory cells arranged in rows connected to corresponding word lines and columns connected to corresponding bit lines, a page buffer that stores a program data, a read-write circuit that programs and re-programs the program data into selected memory cells of the memory cell array and reads stored data from the programmed memory cells, and a control circuit that controls the page buffer and the read-write circuit to program the selected memory cells by loaded the program data from in page buffer and to re-program the selected memory cells by re-loaded the program data in the page buffer.

Abstract: Nonvolatile memory devices, memory systems and related methods of operating nonvolatile memory devices are presented. During a programming operation, the nonvolatile memory device is capable of using bit line forcing, and is also capable of selecting a verification mode for use during a verification operation from a group of verification modes on the basis of an evaluated programming condition.