Abstract: An erase operation for a 3D stacked memory device applies an erase pulse which includes an intermediate level (Vgidl) and a peak level (Verase) to a set of memory cells, and steps up Vgidl in erase iterations of the erase operation. Vgidl can be stepped up when a specified portion of the cells have reached the erase verify level. In this case, a majority of the cells may have reached the erase verify level, such that the remaining cells can benefit from a higher gate-induced drain leakage (GIDL) current to reached the erase verify level. Verase can step up before and, optionally, after Vigdl is stepped up, but remain fixed while Vgidl is stepped. Vgidl can be stepped up until a maximum allowed level, Vgidl_max, is reached. Vgidl may be applied to a drain-side and/or source-side of a NAND string via a bit line or source line, respectively.

Abstract: Circuits, systems, and methods for discharging loads are provided. One circuit includes a node coupled to a voltage source, a capacitor, a source-follower device coupled between the node and the capacitor, and a current source coupled to the capacitor. The source-follower device is configured to switchably couple the capacitor to the node to discharge the voltage source and the current source is configured to discharge the capacitor. One system includes the above circuit coupled to a memory device such that the circuit is configured to discharge voltage from the memory device. A method includes discharging, via a capacitor coupled to the memory device, a high voltage from the memory device and discharging, via a current source coupled to the capacitor, the high voltage from the capacitor. The capacitor is configured to discharge the high voltage within a predetermined range of time.

Abstract: A method of operating a semiconductor device includes programming one of a drain dummy cell and a source dummy cell which are included in a cell string; and coupling a bit line to the cell string in response to program states of the drain dummy cell and the source dummy cell and a voltage level applied to a drain dummy line coupled to a gate of the drain dummy cell and a source dummy line coupled to a gate of the source dummy cell.

Abstract: A semiconductor device including multiple subarrays arrayed in a matrix in the row and column directions, and respectively containing multiple memory cells, bit lines coupled to the memory cells, and precharge circuits (to charge the bit lines; column select signal lines extending in the column direction for selecting subarray columns; main word lines for selecting subarray rows; and precharge signal lines for supplying precharge signals to the precharge circuits; and at least two of the subarrays formed in the row direction or the column direction are controlled by the same logic according to the precharge signal.

Abstract: A semiconductor memory device configured to apply a temperature-compensated word line voltage to a word line during a data read operation includes a memory cell array including a plurality of word lines, a plurality of non-volatile memory cells connected to the word lines, and a word line voltage application unit configured to apply a temperature-compensated read voltage to a selected word line and to apply a temperature-compensated pass voltage to at least one unselected word line during a read operation.

Abstract: A semiconductor memory device includes a memory cell array configured to store data; peripheral circuits configured to perform program verifying operation, read operation, and erase verifying operation on the memory cell array; and a control circuit configured to control the peripheral circuits, wherein the control circuit is configured to control the peripheral circuits to set a bit line voltage in the program verifying operation to have a higher level than a bit line voltage in the read operation, and a bit line voltage in the erase verifying operation to have a lower level than the bit line voltage in the read operation.

Abstract: Methods and devices for charging unselected bit lines are disclosed. The rate at which inhibited (or unselected) bit lines are charged may depend on a program condition. The program condition may be completion of a program loop. As another example, the program condition may be a certain program state completing or nearly completing programming. As one example, the bit lines may be charged at a faster rate prior to the program condition occurring than after the program condition. As another example, the bit lines may be charged at a slower rate prior to the program condition than after the program condition. Charging the unselected bit lines at a slower rate may reduce current consumption. Charging the unselected bit lines at a faster rate may allow for faster programming.

Abstract: In a programming operation of a 3D stacked non-volatile memory device, the channel of an inhibited NAND string is pre-charged by gate-induced drain leakage (GIDL) to achieve a high level of boosting which prevents program disturb in inhibited storage elements. In a program-verify iteration, prior to applying a program pulse, the drain-side select gate transistor is reverse biased to generate GIDL, causing the channel to be boosted to a pre-charge level such as 1.5V. Subsequently, when the program pulse is applied to a selected word line and pass voltages are applied to unselected word lines, the channel is boosted higher from the pre-charge level due to capacitive coupling. The pre-charge is effective even for a NAND string that is partially programmed because it does not rely on directly driving the channel from the bit line end.

Abstract: In a programming operation of a 3D stacked non-volatile memory device, the channel of an inhibited NAND string is pre-charged by gate-induced drain leakage (GIDL) to achieve a high level of boosting which prevents program disturb in inhibited storage elements. In a program-verify iteration, prior to applying a program pulse, the drain-side select gate transistor is reverse biased to generate GIDL, causing the channel to be boosted to a pre-charge level such as 1.5V. Subsequently, when the program pulse is applied to a selected word line and pass voltages are applied to unselected word lines, the channel is boosted higher from the pre-charge level due to capacitive coupling. The pre-charge is effective even for a NAND string that is partially programmed because it does not rely on directly driving the channel from the bit line end.

Abstract: According to example embodiments of inventive concepts, a nonvolatile memory device includes at least two strings that are vertically stacked on a substrate and share one bit line. A program method of the nonvolatile memory device includes setting a pre-charge condition on the basis of a disturb environment between the at least two cell strings, pre-charging or not pre-charging an unselected cell string among the at least two cell strings in response to the pre-charge condition and programming memory cells in a selected cell string among the at least two cell strings.

Abstract: A flash memory with low power consumption and rapid operations is disclosed, including a memory array of memory cells, a word line selection circuit for selecting a row of cells, a current-type sensing circuit electrically connected with each bit line for sensing the current of a selected bit line, and an erase unit erasing the cells in a selected block of the array. The erase unit includes: an erase sequence that determines whether the current of each bit line in the erased block is larger than a first value and ends the erasure if the result is “yes”, and a soft-program sequence that performs a soft program verification, which applies a soft-program voltage to all word lines in the erased block and determines whether the current of each bit line is lower than a second value, and ends the soft programming if the result is “yes”.

Abstract: The present disclosure includes apparatuses and methods for sensing data stored in memory. A number of embodiments include an array of memory cells, and a controller coupled to the array and configured to sense a page of memory cells coupled to an activated access line by pre-charging only a single subset of a number of data lines coupled to the page, wherein more than two subsets of data lines are coupled to the page and the single subset is coupled to those memory cells storing at least a portion of a single sector of data of the page, and sensing the single subset of the number of data lines to determine the at least a portion of the single sector of data.

Abstract: A nonvolatile semiconductor memory device includes a memory string that includes a plurality of first memory cells, a plurality of second memory cells, and a transistor electrically connected between the plurality of first memory cells and the plurality of second memory cells, and a control circuit that performs a program operation by applying a program voltage to a gate of a selected first memory cell among the plurality of first memory cells and a gate of a selected second memory cell among the plurality of second memory cells, a pass voltage lower than the program voltage to other memory cells in the plurality of first and second memory cells, and a control voltage to a gate of the transistor.

Abstract: An one-transistor-one-bit (1T1b) Flash-based EEPROM cell is provided along with improved key operation schemes including applying a negative word line voltage and a reduced bit line voltage for perform erase operation, which drastically reduces the high voltage stress on each cell for enhancing the Program/Erase cycles while reducing cell size. An array made by the 1T1b Flash-based EEPROM cells can be operated with Half-page or Full-page divided programming and pre-charging period for each program cycle. Utilizing PGM buffer made of Vdd devices in the cell array further save silicon area. Additionally, a two-transistor-two-bit (2T2b) EEPROM cell derived from the 1T1b cell is disclosed with additional cell size reduction but with the operation of program and erase the same as that for the 1T1b cells with benefits of no process change but much enhanced storage density, superior Program/Erase endurance cycle, and capability for operating in high temperature environment.

Abstract: A semiconductor memory device includes a memory block comprising cell strings each of which includes a plurality of memory cells, a current measurement circuit measure a current flowing through a selected bit line coupled to a selected cell string when a data read operation or a program verification operation is performed, and a logic group configured to change a read voltage, a program verification voltage, or a pass voltage in response to the measured current.

Abstract: The operating method of a data storage device includes storing data in a buffer memory according to an external request, and determining whether the data stored in the buffer memory is data accompanying a buffer program operation of a memory cell array. When the data stored in the buffer memory is data accompanying the buffer program operation, the method further includes determining whether a main program operation on the memory cell array is required, and when a main program operation on the memory cell array is required, determining a program pattern of the main program operation on the memory cell array. The method further includes issuing a set of commands for the main program operation on the memory cell array to a multi-bit memory device based on the determined program pattern.

Abstract: A semiconductor memory apparatus includes a boundary circuit unit positioned between a low voltage page buffer and a high voltage page buffer and having circuits configured to electrically couple the low voltage page buffer and the high voltage page buffer. The boundary circuit unit includes: a first boundary circuit unit having first and second transistors configured to receive data of a corresponding memory cell area through a signal transmission line selected from a plurality of signal transmission lines extended and arranged along a first direction for each column; a second boundary circuit unit disposed adjacent in the first direction from the first boundary circuit unit and having the plurality of signal transmission lines extended and arranged thereon; and an active region where the first transistor is formed and an active region where the second transistor is formed are isolated from each other.

Abstract: A memory device having an array of memory cells connected to a core voltage level, and access circuitry used to perform a write operation in order to write data into a plurality of addressed memory cells. At least one bit line associated with at least each column in the array containing an addressed memory cell is precharged to the peripheral voltage level prior to the write operation being performed. Word line driver circuitry is then configured to assert a word line signal at the core voltage level on the word line associated with the row of the array containing the addressed memory cells. Write multiplexing driver circuitry asserts a mux control signal to write multiplexing circuitry which then couples the bit line of each addressed memory cell to the write driver circuitry in dependence on the mux control signal identifying which column contains the addressed memory cells.

Abstract: Nonvolatile memory devices including memory cell arrays with a plurality of cell strings connected between a substrate and a plurality of bit lines and selected by selection lines, and a gating circuit configured to drive the selection lines in at least two directions.

Abstract: The invention provides a clamp voltage generating circuit capable of generating a correct clamp voltage. The clamp voltage generating circuit includes an emulate transistor, having a drain coupled to a power source VDD, a source coupled to a node, and a gate coupled to the clamp voltage; a current setting circuit, connected between the node and ground, for setting a current flowing from the node to the ground; a regulator, inputting a feedback voltage from the node and a reference voltage, and outputting a voltage VCLMP. The current setting circuit duplicates a current of a bit line, so that the emulate transistor is similar to a charge transfer transistor.

Abstract: A system including a divider module, a read module, a counting module, and a reference voltage setting module. The divider module is configured to select a voltage range in which to adjust a reference voltage used to read memory cells of nonvolatile memory, and to divide the voltage range into a plurality of bins, where each of the bins is defined by a pair of voltages. The read module is configured to perform a plurality of read operations by applying, to the memory cells, the voltages defining the bins. The counting module is configured to generate, in each of the read operations, counts of a number of memory cells having threshold voltages in each of the bins. The reference voltage setting module is configured to adjust, based on the counts, the reference voltage to a voltage selected from one or more voltages associated with the bins.

Abstract: A nonvolatile memory device includes a memory cell array including a plurality of memory cells, a page buffer circuit connected with the memory cell array via a plurality of bit lines and configured to selectively pre-charge the plurality of bit lines, and control logic configured to control the page buffer circuit such that a pre-charge voltage is applied to selected bit lines of the plurality of bit lines during a first time at a read operation and such that a pre-charge voltage is applied to selected bit lines of the plurality of bit lines during a second time different from the first time at a verification read operation. The second time is determined on the basis of the number of selected bit lines of the plurality of bit lines at the verification read operation.

Abstract: Provided are an information processing, a non-transitory computer-readable storage medium storing a refresh control program, and a refresh control method. An information processing apparatus which can work in a plurality of operation modes, includes: a flash memory; and a control section. The control section is configured to acquire an operating time period of each of the operation modes. The control section is further configured to calculate a weighted time period of each of the operation modes by weighting the operating time period of each of the operation modes by using a weighting coefficient of the corresponding operation mode. The control section is further configured to perform refresh processing of the flash memory when an integrated weighted time period exceeds a refresh threshold value which has been determined previously, where the integrated weighted time period is calculated by adding up the weighted time periods of the operation modes.

Abstract: A memory circuit, including a memory array (such as a cross-point array), may include circuit elements that may function both as selection elements/drivers and de-selection elements/drivers. A selection/de-selection driver may be used to provide both a selection function as well as an operation function. The operation function may include providing sufficient currents and voltages for WRITE and/or READ operations in the memory array. When the de-selection path is used for providing the operation function, highly efficient cross-point implementations can be achieved. The operation function may be accomplished by circuit manipulation of a de-selection supply and/or de-selection elements.

Abstract: A method for data storage includes storing data in a group of analog memory cells by writing respective storage values into the memory cells in the group. One or more of the memory cells in the group are read using a first readout operation that senses the memory cells with a first sense time. At least one of the memory cells in the group is read using a second readout operation that senses the memory cells with a second sense time, longer than the first sense time. The data stored in the group of memory cells is reconstructed based on readout results of the first and second readout operations.

Abstract: A plurality of addressable memory tiles each comprise one or more cross-point arrays. Each array comprises a plurality of non-volatile resistance-change memory cells. A controller is configured to couple to the array and to a host system. The controller is configured to perform receiving, from the host system, one or more data objects each having a size equal to a predetermined logical block size, and storing the one or more data objects in a corresponding integer number of one or more of the memory tiles.

Abstract: Embodiments of apparatus and methods having a memory device can include a line to exchange information with a string of memory cells and a transistor coupled between the string of memory cells and the line. Such a memory device can also include a module configured to couple a gate of the transistor to a node during a first time interval of a memory operation and decouple the gate from the node during a second time interval of the memory operation. Additional apparatus and methods are described.

Abstract: A flash memory device is provided. The flash memory device includes a memory cell array and a pre-charge unit. The pre-charge unit, coupled to a plurality of bit lines corresponding with the memory cell array, pre-charges the bit lines to a predetermined voltage during a pre-charge stage. The pre-charge unit includes a voltage stabilizing unit to provide a constant current to the bit lines. Due to the voltage stabilizing unit, in a programming process, the voltage applied to the bit lines which are not related with programming may not drop as a result of current leakage. Therefore, the memory cells except the memory cell to be programmed are kept in cut off state, without a current passing. As a result, interference with the memory cells which are not to be programmed may be effectively avoided and the accuracy of programming may be improved.

Abstract: A semiconductor memory device is operated by, inter alia: precharging a bit line, providing a first voltage to a coupling circuit for coupling the bit lines and cell strings of a plurality of memory cells, providing a program voltage to a selected word line coupled to a memory cell on which a program operation will be performed among the plurality of memory cells, providing a pass voltage to unselected word lines, providing a second voltage lower than the first voltage to the coupling circuit, discharging the bit line by loading program data, and providing a third voltage lower than the second voltage to the coupling circuit.

Abstract: System refresh in a cache memory that includes generating a refresh time period (RTIM) pulse at a centralized refresh controller of the cache memory and activating a refresh request at the centralized refresh controller based on generating the RTIM pulse. The refresh request is associated with a single cache memory bank of the cache memory. A refresh grant is received and transmitted to a bank controller. The bank controller is associated with and localized at the single cache memory bank of the cache memory.

Abstract: A method of reading a nonvolatile memory device including: applying a read voltage to a selected wordline of the nonvolatile memory device; applying a read pass voltage to unselected wordlines of the nonvolatile memory device; sensing a state of a memory cell connected to the selected wordline; and applying the read pass voltage to the selected wordline after the sensing.

Abstract: The disclosed embodiments provide a chip package that facilitates configurable-width memory channels. In this chip package, a semiconductor die is electrically connected to two or more memory chips. More specifically, contacts on each individual memory chip are each directly connected to a distinct set of contacts on the semiconductor die such that the semiconductor die has separate, unique command and address buses to individually address and communicate with each individual memory chip. Individually addressable memory chips that are each accessed via separate command and address buses facilitate a configurable-width memory channel that efficiently supports different data-access granularities.

Abstract: A semiconductor device includes a global bit line and a local bit line, and a switch coupled therebetween. Upon performing a precharge operation, a precharge voltage is supplied to the global bit line with turning the switch ON, so that the local bit line receives the precharge voltage through the global bit line and the switch, and after a lapse of a predetermined time, a precharge voltage is further supplied to the local bit line without an intervention of the global bit line and the switch.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device comprises a semiconductor substrate, memory strings formed above the semiconductor substrate, and a control circuit configured to control voltages applied to the memory cells. In a read operation, when the control circuit precharges a first source line electrically connected to a selected memory string to a first voltage, the control circuit precharges a second source line electrically connected to an unselected memory string to a second voltage, the second voltage being higher than the first voltage, and after the second source line is precharged, the control circuit precharges a first bit line electrically connected to the selected memory string to the second voltage.

Abstract: A semiconductor memory device includes a memory cell suitable for having a predetermined cell state based on a data stored therein, a control signal generation unit suitable for generating a control signal for changing the cell state of the memory cell during a reading operation, an information storage unit suitable for storing a variation status information of the control signal to which a moment when the cell state of the memory cell changes is reflected, and an output unit suitable for outputting the variation status information of the control signal stored in the information storage unit as a signal corresponding to the data stored in the memory cell.

Abstract: An electrically erasable and programmable non-volatile memory device includes memory cells arranged in rows and columns, and each column of memory cells is associated with a respective local bit line. The local bit lines are divided into packets of local bit lines, each packet of local bit lines associated with a respective main bit line. Each local bit line is selectively couplable to the respective main bit line by a corresponding selector. Each local bit line is selectively couplable to a reference terminal, for receiving a reference voltage, by a corresponding discharge selector. Each discharge selector is active when the memory device is in a standby state. The non-volatile memory device further includes biasing circuitry to bias each main bit line to a pre-charge voltage during operation, and reading circuitry to select and access a group of memory cells during reading operations.

Abstract: An erase operation for a 3D stacked memory device adjusts a start time of an erase period and/or a duration of the erase period for each storage element based on a position of the storage element. A voltage is applied to one or both drive ends of a NAND string to pre-charge a channel to a level which is sufficient to create gate-induced drain leakage at the select gate transistors. With timing based on a storage element's distance from the driven end, the control gate voltage is lowered to encourage tunneling of holes into a charge trapping layer in the erase period. The lowered control gate voltage results in a channel-to-control gate voltage which is sufficiently high to encourage tunneling. The duration of the erase period is also increased when the distance from the driven end is greater. As a result, a narrow erase distribution can be achieved.

Abstract: Methods for operating a non-volatile storage system utilizing a shared-bit-line NAND architecture are described. A shared-bit-line NAND architecture includes one or more pairs of NAND strings, wherein each pair of the one or more pairs of NAND strings shares a common bit line. In some embodiments, a pair of NAND strings includes an odd NAND string adjacent to an even NAND string. Prior to programming a memory cell associated with the even NAND string, an odd channel associated with the odd NAND string (i.e., the NAND string of the pair that is not selected for programming) is precharged to a bit line inhibit voltage, floated, and then boosted to a second voltage greater than the bit line inhibit voltage as an even channel associated with the even NAND string is precharged. Subsequently, the odd channel may be boosted (e.g., via self-boosting) prior to programming the memory cell.

Abstract: Charge leakage from a floating gate in a NAND flash memory die is reduced by applying a data retention bias to a word line extending over the floating gates. The data retention bias is applied to one or more selected word lines when the memory die is in idle mode, when no read, write, erase, or other commands are being executed in the memory die.

Abstract: Erasing memory cells in certain 3-D NAND charge-storage memory arrays is achieved by rapidly charging vertical conductors using Gate Induced Drain Leakage (GIDL) current generated in select transistors. When bit line voltage drops below its nominal value, select line voltage is controlled to maintain a constant voltage difference between bit line voltage and select line voltage thus maintaining a gate-drain voltage difference in select transistors that provides sufficient GIDL current for erase.

Abstract: A memory includes a first memory cell, a bit line corresponding to the first memory cell, at least one second memory cell adjacent to the first memory cell, and a page buffer configured to read data of the first memory cell by precharging the bit line to a voltage level which is decided in response to data of the at least one second memory cell.

Abstract: The present disclosure includes apparatuses and methods for sensing data stored in memory. A number of embodiments include an array of memory cells, and a controller coupled to the array and configured to sense a page of memory cells coupled to an activated access line by pre-charging only a single subset of a number of data lines coupled to the page, wherein more than two subsets of data lines are coupled to the page and the single subset is coupled to those memory cells storing at least a portion of a single sector of data of the page, and sensing the single subset of the number of data lines to determine the at least a portion of the single sector of data.

Abstract: Local bit lines (LBL) are respectively provided for a plurality of sectors, corresponding to each of the global bit lines (GBL). Sector select transistors connect a LBL to a GBLector select lines control the on/off state of the sector select transistors for the corresponding sectors. A plurality of word lines (WL) intersect the local bit lines. Memory cells are located at the intersections between the LBL and the WL. Each memory cell connects a source line with the corresponding LBL and includes an n-channel transistor that is turned on/off by the corresponding WL. A precharge voltage is applied to a charging line. Charging transistors connect the LBL to the charging line. A charging gate line controls the on/off state of the charging transistors.

Abstract: A read operation for a memory device. In response to an input address indicating to read data from a different page, a selected word line, first and second global bit lines and a selected first bit line group are precharged. A first cell current flowing through the selected word line, the first and the selected first bit line groups is generated. A first reference current flowing through the second global bit line group is generated. A first half page data is read based on the first cell current and the first reference current. The selected word line, the first and the second global bit lines are kept precharged. A second cell current flowing through the selected word line is generated. A second reference current is generated. A second half page data is read based on the second cell current and the second reference current.

Abstract: A semiconductor memory device and the operating method thereof use a low pass voltage to boost a channel of unselected cell strings during a program operation, and boost the channel of the cell string by using the GIDL phenomenon, thereby reducing a disturbance influence on the memory cells connected to the unselected cell strings due to a high pass voltage.

Abstract: A semiconductor device includes MOS transistors, capacitor elements, a voltage generating circuit, a contact plug, and a memory cell. The MOS transistor and the capacitor element are formed on a first one of the element regions and a second one of the element regions, respectively. In the voltage generating circuit, current paths of the MOS transistors are series-connected and the capacitor elements are connected to the source or drain of the MOS transistors. The contact plug is formed on the source or the drain to connect the MOS transistors or one of the MOS transistors and one of the capacitor elements. A distance between the gate and the contact plug both for a first one of the MOS transistors located in the final stage in the series connection is larger than that for a second one of the MOS transistors located in the initial stage in the series connection.

Abstract: A precharge circuit includes a precharge unit configured to apply a voltage of a precharge voltage terminal to a data line during a precharge operation, and a sensing unit configured to disable the precharge unit by sensing the voltage of the precharge voltage terminal. The precharge circuit may control a precharge operation by sensing a change in the voltage level of the precharge voltage terminal.

Abstract: A method for refreshing memory cells in a DRAM includes receiving a refresh command, receiving a refresh mode specifying signal in synchronization with the refresh command, refreshing a first quantity of memory cells when the refresh mode specifying signal has a first value, and refreshing a second quantity of memory cells, at least double the first quantity, when the refresh mode specifying signal has a second value.

Abstract: In a method of storing data in a nonvolatile memory device, a program operation is performed on target memory cells among a plurality of memory cells based on a program voltage. A verification operation is performed on the target memory cells based on a verification voltage to determine whether all of the target memory cells are completely programmed. The verification voltage is changed depending on the program operation.

Abstract: The configurations of a flash memory having a read tracking clock and method thereof are provided. The proposed flash memory includes a first and a second storage capacitors, a first current source providing a first current flowing through the first storage capacitor, a second current source providing a second current flowing through the second storage capacitor, and a comparator electrically connected to the first and the second current sources, and sending out a signal indicating a developing time being accomplished when the second current is larger than the first current.