Abstract: A voltage driving circuit comprises a current bias generating unit and a voltage driving unit. The current bias generating unit is configured to receive a mode signal and to generate a mode selection current in response to the mode signal. The voltage driving unit is coupled to the current bias generating unit, and is configured to receive the mode selection current and to drive an output voltage at a slew rate that is set according to the mode selection current. The voltage driving unit can include a plurality of stages, where each stage is configured to drive the output voltage at a respective different slew rate according to the mode signal.

Abstract: Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a first region connected to a bit line extending in a first orientation and a second region connected to a source line extending in a second orientation. The direct injection semiconductor memory device may also include a body region spaced apart from and capacitively coupled to a word line extending in the second orientation, wherein the body region is electrically floating and disposed between the first region and the second region. The direct injection semiconductor memory device may further include a third region connected to a carrier injection line extending in the second orientation, wherein the first region, the second region, the body region, and the third region are disposed in sequential contiguous relationship.

Abstract: Methods for programming a memory device, memory devices configured to perform the disclosed programming methods, and memory systems having a memory device configured to perform the disclosed programming methods, for example, are provided. According to at least one such method, multiple independent semiconductor well regions each having strings of memory cells are independently biased during a programming operation performed on a memory device. Reduced charge leakage may be realized during a programming operation in response to independent well biasing methods.

Abstract: Non-volatile memory device channel boosting methods in which at least two strings are connected to one bit line, the channel boosting methods including applying an initial channel voltage to channels of strings in a selected memory block, floating inhibit strings each having an un-programmed cell among the strings, and boosting channels of the floated inhibit strings.

Abstract: Integrated circuit memory devices include multiple voltage regulators configured to generate respective boosted voltages, which are provided to a memory cell block. A first voltage regulator is configured to increase a well voltage (Vwell) from a first level to an elevated second level during a pull-up time interval when a boosted well voltage level is required within a memory cell block. The increase in the level of the well voltage occurs in response to a transition of a trim signal (Trim) received at an input of the first voltage regulator. A second voltage regulator is also provided. The second voltage regulator is configured to increase a word line voltage (Vwl) from a third level to an elevated fourth level during the pull-up time interval, in response to the transition of the trim signal and in response to the well voltage. A memory cell block is provided, which is configured to receive the well voltage and the word line voltage during the pull-up time interval.

Abstract: A nonvolatile memory device (NVM), memory system and apparatus include control logic configured to perform a method of applying negative voltage on a selected wordline of the NVM. During a first time a first high voltage level is applied to the channel of a transistor of a address decoder and a ground voltage is applied to the well of the transistor. And, during a second time a second high voltage level is applied to the channel of the transistor, and within the second time interval a first negative voltage is applied to the well of the transistor. The first high voltage level is higher than the second high voltage level, and a voltage applied on the selected wordline is negative within the second time interval.

Abstract: The invention is a new method for operating a flash EEPROM memory device and in particular for programming and erasing the device. The memory device has a first semiconductor region within a second semiconductor region, source and drain regions in the first semiconductor region, a well terminal inside the first semiconductor region, a charge storing layer electrically isolated from the first semiconductor region by a dielectric layer, and a control terminal electrically isolated from the charge storing layer by a inter layer dielectric. The method comprises the steps of: applying a first voltage bias of first polarity to the well terminal; allowing a first time period to elapse; resetting the first voltage bias to zero; while during the either the ramp up or the ramp down phase of said first voltage; applying a second voltage bias of second polarity opposite to the first polarity to the control terminal; allowing a second time period to elapse; and resetting the second voltage bias to zero.

Abstract: A non-volatile memory cell and methods for programming, erasing and reading thereof are provided. A non-volatile memory cell includes a substrate having a first conductive type. A first transistor, a second transistor and a select transistor having a second conductive type are disposed in the substrate, wherein a first gate of the first transistor is coupled to a second gate of the second transistor. A source region of the first transistor is coupled to a bit line. A drain region of the second transistor and a gate of the select transistor are coupled to a select gate line. A drain region of the first transistor is coupled to a source region of the select transistor. A drain region of the select transistor is coupled to a select line.

Abstract: A nonvolatile programmable logic switch according to an embodiment includes: a first semiconductor region of a first conductivity type and a second semiconductor region of a second conductivity type; a memory cell transistor including a first insulating film formed on the first semiconductor region, a charge storage film formed on the first insulating film, a second insulating film formed on the charge storage film, and a control gate formed on the second insulating film; a pass transistor including a third insulating film formed on the second semiconductor region, and a gate electrode formed on the third insulating film and electrically connected to the first drain region; a first electrode applying a substrate bias to the first semiconductor region, the first electrode being formed in the first semiconductor region; and a second electrode applying a substrate bias to the second semiconductor region, the second electrode being formed in the second semiconductor region.

Abstract: Methods of programming or erasing a nonvolatile memory device having a charge storage layer including performing at least one unit programming or erasing loop, each unit programming or erasing loop including applying a programming pulse, an erasing pulse, a time delay, a soft erase pulse, soft programming pulse and/or a verifying pulse as a positive or negative voltage to a portion (for example, a word line or a substrate) of the nonvolatile memory device.

Abstract: A localized trapping multi-level memory cell operating method includes the following steps. First, a localized trapping memory cell with the initial threshold voltage of approximately 2.5V is provided. Next, an erasing operation is performed to obtain a negative threshold level having uniform charge distribution along the channel region. Taking into account the over-erasure issue in the erasing operation, a programming operation is performed to precisely adjust the threshold voltage to a predetermined level of ?2V to ?1V. Then, with this negative voltage as a new initial state, a corresponding programming operation is performed and electrons are locally injected into the storage layer. By controlling the quantity of injected electrons, the MLC storage is achieved.

Abstract: A memory device of the non-volatile type including a memory array having a plurality of memory cells organized as sectors, each sector having a main word line associated with a plurality of local word lines, each local word line coupled to the main word line by a respective local word line driver circuit, each of the local word line driver circuits consisting of a first MOS transistor coupled between the respective main word line and a respective local word line and a second MOS transistor coupled between the respective local word line and a first biasing terminal.

Abstract: A control voltage generation circuit for generating a control voltage for controlling a high-voltage transistor includes an input node configured to receive a first enable signal; an output node configured to generate the control voltage, a transferor configured to transfer a voltage of the input node to the output node in response to a transfer signal, an enabling voltage driver configured to drive the output node with a high voltage when the first enable signal is enabled, and a disabling voltage driver configured to drive the output node with a negative voltage when a second enable signal is enabled in a negative mode.

Abstract: An electrically programmable non-volatile memory device being integrated on a chip of semiconductor material is proposed.

Abstract: A nonvolatile memory device is provided which includes a plurality of memory blocks, a bias block and a control logic block. The memory blocks are formed in wells, respectively. The bias block biases a well of a selected memory block. The control logic block controls the bias block to pre-charge doping regions of the selected memory block to a junction voltage before word line voltages are applied to the selected memory block in a programming operation.

Abstract: A semiconductor storage device according to an embodiment includes multiple memory cells which electrically rewrite data, a well control circuit which outputs an erasure voltage to be applied to a well through an output terminal, a first pump circuit which outputs a voltage set by boosting an input voltage to the output terminal, a second pump circuit which outputs a voltage set by boosting the input voltage to the output terminal and outputs a voltage higher than an output voltage of the first pump circuit, a pump switching detecting circuit which outputs an assist signal to perform a boosting operation on at least one of the first pump circuit and the second pump circuit and an erase pulse control circuit which sets target voltages of the first pump circuit and the second pump circuit, on the basis of setting values to set a target voltage of the erasure voltage.

Abstract: According to one embodiment, a non-volatile semiconductor memory device comprises memory strings. Each memory string comprises a semiconductor layer, control gates, a first selection gate, and a second selection gate. A semiconductor layer comprises a pair of pillar portions which extend in a vertical direction to a substrate, and a coupling portion formed to couple the pair of pillar portions. Control gates orthogonally intersect one of the pair of pillar portions or the other of the pair of pillar portions. A first selection gate orthogonally intersects one of the pair of pillar portions and is formed above the control gates. A second selection gate orthogonally intersects the other of the pair of pillar portions, is formed above the control gates, and is on the same level as the first selection gate as well as integrated with the first selection gate.

Abstract: A memory cell array has a number of memory cells which are connected to word lines and bit lines and are arranged in a matrix form, each of the memory cells storing one of n levels (n is a natural number of 2 or more). A control circuit controls the potentials on the word lines and the bit lines in accordance with input data to write data to the memory cells. The control circuit is adapted to, at the write time, first apply a first potential to a well region or substrate in which the memory cells are formed, then set the well region or substrate to a second potential lower than the first potential, and next apply a predetermined voltage to the word lines to thereby perform a write operation.

Abstract: An integrated circuit device having a body bias voltage mechanism. The integrated circuit comprises a resistive structure disposed therein for selectively coupling either an external body bias voltage or a power supply voltage to biasing wells. A first pad for coupling with a first externally disposed pin can optionally be provided. The first pad is for receiving an externally applied body bias voltage. Circuitry for producing a body bias voltage can be coupled to the first pad for coupling a body bias voltage to a plurality of biasing wells disposed on the integrated circuit device. If an externally applied body bias voltage is not provided, the resistive structure automatically couples a power supply voltage to the biasing wells. The power supply voltage may be obtained internally to the integrated circuit.

Abstract: A semiconductor memory device includes memory blocks each comprising a plurality of memory cells formed over a semiconductor substrate having a P well, a first voltage generator supplying operating voltages to an selected block of the memory blocks, and a second voltage generator generating a negative voltage to the P well during a program operation.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory string including a plurality of memory cells and, a driving unit. In sequentially reading data stored in the memory cells by applying a first signal to the memory cells, a second signal is applied to a second cell. The driving unit applies a third signal to the gate electrodes of all the memory cells prior to the sequential reading. The third signal has a voltage smaller than the second signal and time duration equal to or more than that of a sum of time duration during which the first signal is applied to all the memory cells. In a period prior to the third signal application, the driving unit performs at least one of applying a fourth signal to the gate electrodes and matching a potential of the gate electrodes with that of the semiconductor layer.

Abstract: The semiconductor device includes the nonvolatile memory cell in the main surface of a semiconductor substrate. The nonvolatile memory cell has a first insulating film over the semiconductor substrate, a conductive film, a second insulating film, the charge storage film capable of storing therein charges, a third insulating film over the charge storage film, a first gate electrode, a fourth insulating film in contact with the set of stacked films from the first insulating film to the foregoing first gate electrode, a fifth insulating film juxtaposed with the first insulating film over the foregoing semiconductor substrate, a second gate electrode formed over the fifth insulating film to be adjacent to the foregoing first gate electrode over the side surface of the fourth insulating film, and source/drain regions with the first and second gate electrodes interposed therebetween. The conductive film and the charge storage film are formed to two-dimensionally overlap.

Abstract: A plurality of element isolation insulating films are formed in a semiconductor substrate in a memory cell array and have a first direction as a long direction. A plurality of element formation regions are formed isolated by the element isolation insulating films. A memory string is formed in each of the element formation regions. A plurality of element formation region groups are each configured by the element formation regions. In a memory cell array, in a second direction orthogonal to the first direction, a spacing between the element formation region groups is configured larger than a spacing between the element formation regions in each of the element formation region groups. A control circuit executes a write operation on the memory cell array on an element formation region group basis.

Abstract: Some embodiments include methods and devices having a module and memory cells. The module is configured to reduce the amount of electrons in the sources and drains of the memory cells during a programming operation.

Abstract: The programming disturb effects in a semiconductor non-volatile memory device can be mitigated by biasing unselected memory cells with a negative voltage while a well containing the memory cells receives a positive voltage. A selected memory cell in the well can be biased with a negative voltage while the well is at the positive voltage then the selected memory cell bias transitions to a positive programming voltage when the well returns to a ground potential.

Abstract: Techniques for controlling a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for controlling a direct injection semiconductor memory device comprising applying a first voltage potential to a first region via a bit line, applying a second voltage potential to a second region of the memory device via a source line, applying a control voltage potential to a body region of the memory device via a word line that is spaced apart and capacitively coupled to the body region, and applying a third voltage potential to a third region of the memory device via a carrier injection line in order to bias at least one of the first region, the second region, the third region, and the body region to perform one or more operations.

Abstract: A NAND type flash memory for erasing data every block including plural memory cell transistors that are provided every block and have floating gates formed through first gate insulating film above a well formed in a semiconductor substrate and control gates formed through second gate insulating film above the floating gates, data in the memory cell transistors being rewritable by controlling charge amounts accumulated in the floating gates, and a row decoder having a plurality of MOS transistors having drains that are respectively connected to corresponding word lines connected to the control gates of the plurality of memory cell transistors, the row decoder controlling gate and source voltages of the MOS transistors.

Abstract: In one embodiment, the non-volatile memory device includes a well of a first conductivity type formed in a substrate, and a first plurality of memory cell transistors connected in series to a bit line formed in the well. A buffer is formed in the substrate outside the well and is connected to the bit line. At least one de-coupling transistor is configured to de-couple the buffer from the bit line, and the de-coupling transistor is formed in the well.

Abstract: A discharge circuit for a floating gate type MOS memory cell transistor disposed in a memory array region of a nonvolatile semiconductor memory device, the memory cell region being formed in P-well, the P-well being formed in an N-well, and the N-well being formed in a P-type semiconductor substrate, includes a word line discharge circuit providing a word line control voltage and a bulk discharge circuit providing a voltage to the P-well during a discharge operation. Constant current transistors and switching transistors in the word line discharge circuit and the bulk discharge circuit are simultaneously turned ON during at least a portion of the discharge operation.

Abstract: Some embodiments include methods and devices having a module and memory cells. The module is configured to reduce the amount of electrons in the sources and drains of the memory cells during a programming operation.

Abstract: A method of performing an operation on a flash memory cell device, used when a gate coupling ratio between a floating gate and a control gate of less than 0.4. A potential is required to be applied across the control gate. Electrons are either injected to the floating gate from the control gate or ejected from the floating gate to the control gate. The operation associated with the injection or the ejection is determined by the nature of a silicon channel provided in the device. Devices using a bulk-tied FinFET-like structure are particularly suited to this method. The method is also particularly suited for use on cells in a NAND array.

Abstract: In an embodiment of the invention, a memory cell arrangement includes a substrate and at least one memory cell including a charge storing memory cell structure and a select structure. The memory cell arrangement further includes a first doping well, a second doping well and a third doping well arranged within the substrate, wherein the charge storing memory cell structure is arranged in or above the first doping well, the first doping well is arranged within the second doping well, and the second doping well is arranged within the third doping well. The memory cell arrangement further includes a control circuit coupled with the memory cell and configured to control the memory cell such that the charge storing memory cell structure is programmed or erased by charging or discharging the charge storing memory cell structure via at least the first doping well.

Abstract: Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. At least one of the plurality of memory cells may include a first region coupled to a respective bit line of the array and a second region coupled to a respective source line of the array. At least one of the plurality of memory cells may also include a body region spaced apart from and capacitively coupled to a respective word line of the array, wherein the body region may be electrically floating and disposed between the first region and the second region.

Abstract: Integrated circuit flash memory devices, such as NAND flash memory devices, include an array of regular flash memory cells, an array of dummy flash memory cells and an erase controller. The erase controller is configured to concurrently apply a different predetermined bias voltage to the dummy flash memory cells than to the regular flash memory cells during an erase operation of the integrated circuit flash memory device. Related methods are also described.

Abstract: A low-voltage EEPROM array, which has a plurality of parallel bit lines, parallel word lines and parallel common source lines is disclosed. The bit lines include a first bit line. The word lines include a first word line and a second word line. The common source lines include a first common source line and a second common source line. The low-voltage EEPROM array also has a plurality of sub-memory arrays. Each sub-memory array includes a first memory cell and a second memory cell. The first memory cell connects with the first bit line, the first common source line and the first word line. The second memory cell connects with the first bit line, the second common source line and the second word line. The first and second memory cells are symmetrical and arranged between the first and second common source lines.

Abstract: There is disclosed an operating method of a semiconductor device including programming a memory cell by supplying a program voltage to a control gate of the memory cell and a detrap voltage to a well which is formed in a semiconductor substrate, and subsequently removing electrons trapped in a tunnel insulating layer of the memory cell by supplying a voltage lower than the detrap voltage to the control gate while also supplying the detrap voltage to the well before the programmed memory cell is verified.

Abstract: A nonvolatile memory device configured to apply a wordline erase voltage to a plurality of wordlines connected to a plurality of memory cells, apply an erase voltage to a substrate where a memory cell string is formed while applying a specific voltage to at least one ground selection line connected to at least one ground selection transistor, and float the at least one ground selection line when a target voltage of the substrate reaches a target voltage.

Abstract: Various circuits include MOS transistors that have a bulk voltage terminal for receiving a bulk voltage that is different from a supply voltage and ground. The bulk voltage may be selectively set so that some MOS transistors have a bulk voltage set to the supply voltage or ground and other MOS transistors have a bulk voltage that is different. The bulk voltage may be set to forward or reverse bias pn junctions in the MOS transistor. The various circuits include comparators, operational amplifiers, sensing circuits, decoding circuits and the other circuits. The circuits may be included in a memory system.

Abstract: An area saving electrically-erasable-programmable read-only memory (EEPROM) array, having: a plurality of parallel bit lines, a plurality of parallel word lines, and a plurality of parallel common source lines. The bit lines are classified into a plurality of bit line groups, containing a first group bit line and a second group bit line; the word line includes a first word line; and the common source lines include a first common source line. In addition, a plurality of sub-memory arrays are provided. Each sub-memory array contains a first, second, third, and fourth memory cells. Wherein, the first and second memory cells are symmetrically arranged, and the third and fourth memory cells are symmetrically arranged; also, the first and second memory cells, and the third and fourth memory cells are symmetrically arranged with the first common source line as a symmetric axis.

Abstract: Embodiments of the present disclosure provide methods, devices, modules, and systems for utilizing an expanded programming window for non-volatile multilevel memory cells. One method includes associating a different logical state with each of a number of different threshold voltage (Vt) distributions. In various embodiments, at least two Vt distributions include negative Vt levels. The method includes applying a read voltage to a word line of a selected cell while applying a pass voltage to word lines of unselected cells, applying a boost voltage to a source line coupled to the selected cell, applying a voltage greater than the boost voltage to a bit line of the selected cell, and sensing a current variation of the bit line in response to the selected cell changing from a non-conducting state to a conducting state.

Abstract: An apparatus and method for operating an array of NOR connected flash nonvolatile memory cells erases the array in increments of a page, block, sector, or the entire array while minimizing sub-threshold leakage current through unselected nonvolatile memory cells. The apparatus has a row decoder circuit and a source decoder circuit for selecting the nonvolatile memory cells for providing biasing conditions for reading, programming, verifying, and erasing the selected nonvolatile memory cells while minimizing sub-threshold leakage current through unselected nonvolatile memory cells.

Abstract: A semiconductor memory device includes a substantially planar substrate, a memory string vertical to the substrate, the memory string comprising a plurality of storage cells, and a plurality of elongated word lines, each word line including a first portion substantially parallel to the substrate and connected to the memory string and a second portion substantially inclined relative to the substrate and extending above the substrate, wherein a first group of the plurality of word lines are electrically connected to first conductive lines disposed at a first side of the memory string, and a second group of the plurality of word lines are electrically connected to second conductive lines disposed at a second side of the memory string.

Abstract: Systems and methods, including computer software for performing operations enable interleaving of charging operations in a charging pump. A first charge pump is charged to a predetermined level, and a first operation is performed using a charge stored in the first charge pump after it reaches the predetermined level. A second charge pump is charged during a time that overlaps with performing the first operation. A second operation is performed using a charge stored in the second charge pump as a result of charging the second charge pump.

Abstract: The charge pump circuit has a plurality of cascaded charge pump stages, each provided with a first pump capacitor connected to a first internal node and receiving a first high voltage phase signal, and a second pump capacitor connected to a second internal node and receiving a second high voltage phase signal, complementary with respect to the first. A first transfer transistor is coupled between the first internal node and an intermediate node, and a second transfer transistor is coupled between the second internal node and the intermediate node. The first and second high voltage phase signals have a voltage dynamics higher than a maximum voltage sustainable by the first and second transfer transistors. A protection stage is set between the first internal node and second internal node and respectively, the first transfer transistor and second transfer transistor, for protecting the same transfer transistors from overvoltages.

Abstract: An aspect of the present embodiment, there is provided a nonvolatile programmable logic switch including a first memory cell transistor, a second memory cell transistor, a pass transistor and a first substrate electrode applying a substrate voltage to the pass transistor, wherein a writing voltage is applied to the first wiring, a first voltage is applied to one of a second wiring and a third wiring and a second voltage which is lower than the first voltage is applied to the other of the second wiring and the third wiring, and the first substrate voltage which is higher than the second voltage and lower than the first voltage is applied to a well of the pass transistor, when data is written into the first memory cell transistor or the second memory cell transistor.

Abstract: An apparatus and method for operating an array of NOR connected flash nonvolatile memory cells erases the array in increments of a page, block, sector, or the entire array while minimizing operational disturbances and providing bias operating conditions to prevent gate to source breakdown in peripheral devices. The apparatus has a row decoder circuit and a source decoder circuit for selecting the nonvolatile memory cells for providing biasing conditions for reading, programming, verifying, and erasing the selected nonvolatile memory cells while minimizing operational disturbances and preventing gate to source breakdown in peripheral devices.

Abstract: A NAND flash memory includes a semiconductor substrate, a well region in the semiconductor substrate, memory cells connected in series in the well region, a discharge circuit connected to the well region, a word line connected to the memory cells, and a control circuit which controls potentials of the well region and the word line. The control circuit set the well region to a first potential, and set the word line to a second potential lower than the first potential, in an erase operation. The discharge circuit comprises a constant current source with a constant discharge speed independent on a temperature, and discharges the well region after the erase operation.

Abstract: An erase method for a non-volatile memory device having a defined erase unit divided into first and second inner erase units includes; applying an erase voltage to at least one of the first and second inner erase units in accordance with respective states of corresponding first and second fail flags, after applying the erase voltage to the at least one of the first and second inner erase units, performing an erase verification on the at least one of the first and second inner erase units, and updating the at least one of the first and second fail flags in accordance with erase verification results.

Abstract: A memory device has a pair of conductive layers and an organic compound having a liquid crystal property that is interposed between the pair of conductive layers. Data is recorded in the memory device by applying a first voltage to the pair of conductive layers and heating the organic compound, to cause a phase change of the organic compound from a first phase to a second phase.

Abstract: A nonvolatile memory device includes a memory block including a number of cell strings, a channel voltage detection unit configured to detect channel voltages of the cell strings in which the channel voltages are changed based on voltages supplied to memory cells of the cell strings during a program operation and to generate channel voltage code based on an average channel voltage of the detected channel voltages, and a voltage supply unit configured to change a level of a pass voltage of the voltages supplied to memory cells in which the pass voltage is supplied to the memory cells during the program operation according to the channel voltage code.