Abstract: A method and apparatus are provided for high performance, high voltage memory operations on selected memory cells (200) of a semiconductor memory device (100). A high voltage generator (106) during program or erase operations provides a continuous high voltage level (702) on selected word lines (502) and maintains a continuous high voltage level supply to a bit line decoder (120) which sequentially provides the high voltage level (706) to a first portion of bit lines (504) and discharges (708) those bit lines (504) before providing the high voltage level to a second portion (710).

Abstract: A method for dual I/O data read in an integrated circuit which includes a serial peripheral interface memory device. In an embodiment, the memory device includes a clock signal, a plurality of pins, and a configuration register. In an embodiment, the configuration register includes a wait cycle count. The method includes transmitting a read address to the memory device using a first input/output pin and a second input/output pin concurrently. In an embodiment, the read address includes at least a first address bit and a second address bit, the first address bit being transmitted using the first input/output pin, and the second address bit being transmitted using the second input/output pin. The method includes accessing the memory device for data associated with the address and waiting a predetermined number clock cycles associated with the wait cycle count. The method includes transferring the data from the memory device using the first input/output pin and the second input/output pin concurrently.

Abstract: A semiconductor device includes a plurality of package terminals included in a package, a plurality of chips provided on the package, each of the chips including a memory cell array and a plurality of data input/output terminals, and a plurality of data line control switch disposed between the plurality of package terminals and the plurality of data input/output terminals. The plurality of data line control switches of each of the chips connects the data input/output terminals of each of the chips to corresponding ones of the plurality of package terminals in a normal mode. The plurality of data line control switches connects different groups of the data input/output terminals in different ones of the chips to respective groups of the package terminals in a test mode. The respective groups of the data input/output terminals belong to the plurality of data input/output terminals. The respective groups of the package terminals are different between different ones of the chips.

Abstract: Methods, memory devices and systems are disclosed. In one embodiment, a non-volatile memory device receives command signals through the same input/output terminals that receive address signals and write data signals and transmit read data signals. The input/output terminals are connected to a multiplexer, which is responsive to a received mode control signal to couple the input/output terminals to either a command bus or an input/output bus. A latch in the memory device latches the command signals when the mode control signal causes the input/output terminals to be coupled to the input/output bus. As a result, the command signals continue to be applied to the command bus. When the mode control signal causes the input/output terminals to be coupled to the input/output bus, write data signals are clocked into the memory device and read data signals are clocked out of the memory device responsive to a received clock signal.

Abstract: Systems and methods are described for reducing the number of exterior contacts on a semiconductor package without reducing the number of address, data and control signals used by an integrated circuit interior to the semiconductor package. In some embodiments, two signals may be received at a shared conductor accessible by devices exterior to the semiconductor package and communicated to two contacts on the integrated circuit that are inaccessible to the exterior of the semiconductor package. In various embodiments, signals required to support a full set of features of the JEDEC JESD79E standard or the JEDEC JESD79-2C standard are communicated using a reduced number of exterior contacts.

Abstract: A semiconductor memory device includes an output buffer which outputs an enable signal which makes an external memory device operable, an address buffer which generates an address at which data is held in the external memory device, an input buffer which receives the data held at the address from the external memory device, and a write data buffer which holds the data received by the input buffer, and writes the data in a plurality of memory cells at once. Whenever the write data buffer writes data, the input buffer receives, from the external memory, the data having a size which is written in the memory cells at once.

Abstract: A page buffer for an electrically programmable memory includes a plurality of storage units, each comprising a first latch and a second latch. Input switching means loads into the latch the data bit to be written and to be temporarily stored. The input switching means has an input terminal connected to the respective data line for receiving a set voltage provided therethrough. The input switching means provides the set voltage to the first or second input/output terminals of the latch depending on the data bit to be written. An output switch device transfers onto the respective data line the read data bit temporarily stored into the latch and has a first terminal coupled to one among the first and second input/output terminals of the latch, a second terminal connected to the respective data line and a control terminal receiving the output control signal.

Abstract: A method and a relative automatic regulation device regulate the reference sources in a non-volatile memory device, for example a flash memory. The method includes the following steps: providing, in the memory device, a regulation device of the reference sources and at least one start command for the entry in regulation mode; providing, on the device, at least one command for the selection of a corresponding reference source to be regulated; applying an external reference signal; starting the automatic regulation step by means of said command; detecting the result of the regulation step by means of a logic output of the memory device; if the result of the regulation of a given source is positive, proceeding, by means of the same process steps, with the regulation of another source.

Abstract: A signal capture system and method is used to capture a data signal using a data strobe signal having a preamble of strobe signal transitions. The system includes a data latch circuit receiving the data signal. The data latch circuit is clocked by transitions of the data strobe signal to capture respective bits of data corresponding to the data signal. A decoder receives a memory command signal and generates a data start signal after a delay period from receiving the memory command signal if the command signal corresponds to a read or a write command. The receipt of read or write command signals is used by a control circuit to identify the start of valid read or write data signals. The control circuit then outputs the captured data signals responsive to the data start signal, thereby ignoring the transitions in the preamble of the data strobe signal.

Abstract: Methods, memory devices and systems are disclosed. In one embodiment, a non-volatile memory device receives command signals through the same input/output terminals that receive address signals and write data signals and transmit read data signals. The input/output terminals are connected to a multiplexer, which is responsive to a received mode control signal to couple the input/output terminals to either a command bus or an input/output bus. A latch in the memory device latches the command signals when the mode control signal causes the input/output terminals to be coupled to the input/output bus. As a result, the command signals continue to be applied to the command bus. When the mode control signal causes the input/output terminals to be coupled to the input/output bus, write data signals are clocked into the memory device and read data signals are clocked out of the memory device responsive to a received clock signal.

Abstract: A technique to increase transfer rate of command and address signals via a given number of command and address pins in each of one or more integrated circuit memory devices during a clock cycle of a clock signal. In one example embodiment, the command and address signals are sent on both rising and falling edges of a clock cycle of a clock signal to increase the transfer rate and essentially reduce the number of required command and address pins in each integrated circuit memory device.

Abstract: There is provided a semiconductor memory device which offers enhanced speed in burst mode. The semiconductor memory device has a burst mode for serially reading multiple bits of data in a fixed order in synchronization with both edges of a clock. Multiple memory blocks are geometrically arranged correspondingly to the multiple bits. An address selection circuit selects a memory cell from the memory blocks. Data read from the memory blocks is parallel transmitted to an output circuit. The output circuit first outputs data from a memory block to which data is transmitted fastest among the multiple memory blocks. The output circuit serially outputs data in the fixed order in synchronization with both edges of the clock.

Abstract: Systems and methods disclosed herein provide for variable data width memory. For example, in accordance with an embodiment of the present invention, a technique for doubling a width of a memory is disclosed, without having to increase a width of the internal data path or the number of input/output pads.

Abstract: A memory device includes a first sensing amplifier to amplify data received from the memory array, a first driver to generate a first tri-state signal responsive to the amplified data from an first sense amplifier and to provide the first tri-state signal to a data bus line, a second sensing amplifier to amplify data received from the memory array, and a second driver to generate a second tri-state signal responsive to the amplified data from an second sense amplifier and to provide the second tri-state signal to the data bus line, where the first sensing amplifier and the first driver are located in different regions of the device, and the second sensing amplifier and the second driver are located in a common region of the device.

Abstract: In a semiconductor memory device the power level of which is strengthened by using data input/output pads in a no connection state, and a method of strengthening the power of the semiconductor memory device at a stabilized power level, the semiconductor memory device comprises: a plurality of data input/output drivers; and a plurality of data input/output pads, each connected to a corresponding one of the plurality of data input/output drivers. A first subset of the data input/output pads are connected to respective data input/output pins of a package, and several or all of a remaining subset of the data input/output pads that are not connected to data input/output pins of the package are connected to power pins of the package.

Abstract: Disclosed is a semiconductor device in which In case a data group output from a first output pin in a first word configuration is output from the first output pin and a second output pin in a second word configuration, and a data group output from a third output pin in a first word configuration is output from the third output pin and a fourth output pin in a second word configuration, the second output pin is arranged adjacent to the first output pin, and the fourth output pin is arranged adjacent to the third output pin.

Abstract: The present invention describes a semiconductor memory device that can reduce current consumption occurring in a data write path. The semiconductor memory device includes a write path over which any one of general data and representative data corresponding to a particular mode is transferred in correspondence with a prescribed pad. A routing controller allows the representative data to be routed over a transfer path corresponding to any other pads in the particular mode and prevents the general data from being routed over the transfer path in modes other than the particular mode. The semiconductor memory device can reduce current consumption caused by unnecessary toggling of the data through utilization of the routing controller.

Abstract: A first input buffer receives sequentially inputted first data. A first data selector selectively transfers the first data from the first input buffer in accordance with a data input mode. A first data alignment circuit aligns and outputs the data from the first data selector. A second input buffer receives sequentially inputted second data in accordance with the data input mode. A second data selector selectively transfers the data of the first input buffer or of the second input buffer, in accordance with the data input mode. A first data alignment circuit aligns and outputs the data from the second data selector.

Abstract: A memory module may include a plurality of memory devices coupled to a memory controller over a same command/address bus. Methods of controlling such a memory module may include providing a mode register set command from the memory controller to each of the integrated circuit memory devices over the command/address bus during a mode register set operation. A disable signal may be provided from the memory controller to a first one of the integrated circuit memory devices over a signal line between the memory controller and the first integrated circuit memory device to thereby disable implementation of the mode register set command for the first integrated circuit memory device during the mode register set operation.

Abstract: A semiconductor memory device includes at least one data transmission block including data I/O pads arranged in a major-axis side of the semiconductor memory device; a command and address transmission block including address and command input pads arranged in at least one minor-axis side of the semiconductor memory device; a global line block, arranged in a center of the semiconductor memory device, for transmitting inputted command and address; and at least one bank area, arranged between the global line block and the data transmission block, each bank area containing plural data I/O blocks located in a side of the data transmission block and plural control blocks located in a side of the global line block.

Abstract: In a method of inputting/outputting data in a semiconductor memory device, first data and second data are buffered and outputted to a first output node and a second output node, respectively, in a normal mode. In a test mode, the first data is buffered through a first transmission line and a second transmission line and outputted to the first output node and the second output node in response to at least one control signal. Also, in the test mode, the second data is buffered through the first transmission line and the second transmission line and outputted to the first output node and the second output node in response to the at least one control signal. Accordingly, test time may be reduced, and variations of operation characteristics caused by merging the data pins may also be reduced.

Abstract: A write circuit structure may be used to transfer data between global bit lines and local bit lines of a cache. The write circuit structure located between the hierarchical bit lines may be buffers in parallel with P-channel devices in one embodiment or cross-coupled P-channel and N-channel devices in another embodiment.

Abstract: One embodiment of the present invention includes a column multiplexer for accessing data from a memory array comprising an output node having a logic state that is based on a logic state of a control node, and column elements, each comprising a first pair of series connected switches controlled by a column select signal and a bit line signal associated with data stored in a plurality of memory cells. The first pair of switches is configured to set the control node to a logic low state based on a logic state of the bit line signal. The column elements each also comprise a second pair of series connected switches controlled by the bit line signal and a complement of the column select signal. The second pair of switches is configured to set the control node to a logic high state based on the logic state of the bit line signal.

Abstract: Example embodiments may provide a magnetic device using magnetic domain dragging and a method of operating the same.

Abstract: A semiconductor integrated circuit includes a plurality of terminals, a first latch configured to, upon being uniquely specified by a first predetermined number of bits that are part of a plurality of bits entered through the terminals, store a second predetermined number of bits that are at least part of remaining bits left after excluding the first predetermined number of bits from the plurality of bits, and a second latch configured to, upon being uniquely specified by a third predetermined number of bits that are part of the plurality of bits entered through the terminals, store a fourth predetermined number of bits that are at least part of remaining bits left after excluding the third predetermined number of bits from the plurality of bits, wherein the first predetermined number is different from the third predetermined number, and the second predetermined number is different from the fourth predetermined number.

Abstract: A memory device is operable in either a high mode or a low speed mode. In either mode, 32 bits of data from each of two memory arrays are prefetched into respective sets of 32 flip-flops. In the high-speed mode, the prefetched data bits are transferred in parallel to 4 parallel-to-serial converters, which transform the parallel data bits to a burst of 8 serial data bits and apply the burst to a respective one of 4 data bus terminals. In the low speed mode, two sets of prefetched data bits are transferred in parallel to 8 parallel-to-serial converters, which transform the parallel data bits to a burst of 8 serial data bits and apply the burst to a respective one of 8 data bus terminals.

Abstract: A memory module may include a plurality of memory devices coupled to a memory controller over a same command/address bus. Methods of controlling such a memory module may include providing a mode register set command from the memory controller to each of the integrated circuit memory devices over the command/address bus during a mode register set operation. A disable signal may be provided from the memory controller to a first one of the integrated circuit memory devices over a signal line between the memory controller and the first integrated circuit memory device to thereby disable implementation of the mode register set command for the first integrated circuit memory device during the mode register set operation.

Abstract: A memory device including at least two output pads and at least two memory die. Each of the at least two memory die is configured to provide an output signal that includes compressed test results to any of the at least two output pads.

Abstract: Disclosed is a semiconductor storage device which has a shared address/data terminal that shares an address terminal and a data terminal. In a latency period extending from receipt of an access command to a cell array to input or output of data, which corresponds to an access command, from the shared address/data terminal, pipeline control is performed in response to receipt of at least one other access command. Input or output of data from the shared address/data terminal corresponding to the other access commands is performed successively following data that corresponds to the initial access command.

Abstract: A memory card (1) includes an electrically rewritable non-volatile memory (4), a data processor (3) having a function of executing instructions, and managing the allocation of file data in the non-volatile memory, an interface control circuit (2) having a function of establishing an external interface, for controlling the execution of instructions by the data processor in response to external commands and for controlling access to the non-volatile memory and a buffer memory (7) for temporarily storing the file data. The interface control circuit includes command control means for decoding a first command externally supplied and for instructing the data processor to fetch an instruction from the buffer memory and to operate.

Abstract: A memory device having a number of terminals for transferring input data and output data to and from a memory array. The memory device includes an auxiliary circuit for receiving input auxiliary information associated with the input data and for generating output auxiliary information associated with the output data. The input and output auxiliary information include inverting codes, parity codes, temperature information, and time delay information. The input and output auxiliary information are transferred to and from the memory device on the same terminals that the input data and the output data are transferred.

Abstract: A core including a write logic IP block, a read logic IP block, a master delay IP block and an address and control IP block. The write logic IP block may be configured to communicate data from a memory controller to a double data rate (DDR) synchronous dynamic random access memory (SDRAM). The read logic IP block may be configured to communicate data from the double data rate (DDR) synchronous dynamic random access memory (SDRAM) to the memory controller. The master delay IP block may be configured to generate one or more delays for the read logic IP block. The address and control logic IP block may be configured to control the write logic IP block and the read logic IP block. The core is generally configured to couple the double data rate (DDR) synchronous dynamic random access memory (SDRAM) and the memory controller.

Abstract: A resetable memory is described that includes a memory without reset capability having a data output coupled to a first input of a first multiplexer. A second input of the first multiplexer has a reset value input. A channel select for the first multiplexer is coupled to a resetable storage cell output that indicates whether a storage cell within the memory without reset capability has been written to after a reset or has not been written to after a reset.

Abstract: A memory device includes a number of terminals for transferring input data and output data to and from a memory array. The memory device includes an auxiliary circuit for receiving input auxiliary information associated with the input data and for generating output auxiliary information associated with the output data. The input and output auxiliary information include inverting codes, parity codes, temperature information or time delay information. The input and output auxiliary information are transferred to and from the memory device on the same terminals that the input data and the output data are transferred.

Abstract: A memory architecture for a disk drive system in which Synchronous Random Access Memory (SRAM) and Dynamic Random Access Memory (DRAM) functions are provided on separate integrated circuits, and an interface protocol for transmitting information between these two memory components are provided to improve performance of the system, as well as reduce pin count and cost. An integrated circuit memory includes a random-access memory. The random-access memory includes a first terminal for receiving selection information. The random-access memory includes a second terminal for selectively (i) receiving a command, or (ii) receiving or transmitting data in accordance with the selection information received by the first terminal.

Abstract: The present invention provides a ROM test circuit capable of shortening a test time and a test method therefor. When data written into a plurality of ROMs are tested, data of the ROM(1) and ROM(2) are selected based on the output data of the specific ROM(3). Then, the selected data are compared with expected values to thereby perform testing thereof. Therefore, the contents of the ROM(3) are also tested within the time required to test each of the ROM(1) and ROM(2), thus making it possible to shorten a test time.

Abstract: A device includes a number of terminals for transferring input data and output data to and from a memory array. The memory device includes an auxiliary circuit for receiving input auxiliary information associated with the input data and for generating output auxiliary information associated with the output data. The input and output auxiliary information include inverting codes, parity codes, temperature information or time delay information. The input and output auxiliary information are transferred to and from the memory device on the same terminals that the input data and the output data are transferred.

Abstract: The present invention provides a semiconductor device and a method of controlling the semiconductor device, the semiconductor device comprising: a memory cell array; a terminal that inputs or outputs storage data stored in the memory cell array, and inputs address data indicating an address in the memory cell array at which the storage data is input or output, the terminal comprising: a first terminal that inputs a first part of the address data; and a second terminal that inputs a second part of the address data, wherein the second part of the address data is comprised of the entire remaining portion of the address data not comprising the first part of the address data; a first internal address line and a second internal address line to which the address data is supplied; and a switch that couples the first part of the address data to one of the first internal address line or the second internal address line in accordance with predetermined switch information, while coupling the second part of the address da

Abstract: An integrated circuit comprising a first terminal for exchanging signals; an evaluation unit coupled to the first terminal, the evaluation unit evaluating a signal level applied to the first terminal to determine whether or not the signal level corresponds to a predetermined signal level; and a switching unit coupled to the first terminal and to the evaluation unit, the switching unit admitting signal exchange via the first terminal if the evaluation unit does not determine the predetermined signal level, the switching unit cutting off signal exchange via the first terminal if the evaluation unit determines the predetermined signal level.

Abstract: The present invention provides a high-speed memory device that can be easily tested using the existing low-speed Automatic Test Equipment (ATE). In an embodiment of the invention, a memory device includes two channels. During normal communications with a host, one channel is used for bidirectional communications with a host. But during a test mode, a first channel is used to communicate with the ATE in one direction, and a second channel is used to communicate with the ATE in the opposite direction. The present invention also provides a memory module and a method for controlling the high-speed memory device.

Abstract: In a semiconductor memory device which uses a same pad for an address input and data input/output, and has an input circuit and data output circuit connected to the pad, an output of the data output circuit is turned to a high impedance state in accordance with a chip enable signal, output enable signal, and address capture signal, at a stand-by time, output disable time, and address capture period, and thereby, it becomes possible to start an internal read operation even before the address capture period is finished, and a high-speed operation becomes possible.

Abstract: A multi-ported register cell. The register cell includes a base cell and a plurality of history cells, each of which is coupled to the base cell. Each of the plurality history cells is coupled to write to the base cell through a first port, and each of the plurality of history cells is coupled to receive data from the base cell through a second port.

Abstract: A circuit exhibits a signal input, means for determining a reference level on the basis of properties of a signal received at the signal input. In addition, the circuit further exhibits means for evaluating the signal on the basis of the reference level.

Abstract: A semiconductor memory device has a memory core that includes at least eight banks of dynamic random access storage cells and an internal data bus coupled to the memory core. The internal data bus receives a plurality of data bits from a selected bank of the memory core. The semiconductor memory device further comprises a first interface to receive a read command from external to the semiconductor memory device and a second interface to output first and second subsets of the plurality of data bits. The first subset is output during a first phase of an external clock signal and the second subset is output during a second phase of the external clock signal. The first phase includes a first edge transition and the second phase includes a second edge transition. The second edge transition is an opposite edge transition with respect to the first edge transition.

Abstract: An unclocked electrically programmable fuse (eFUSE) system includes at least two resistive voltage dividers, one voltage divider including an eFUSE, and a differential amplifier. An output node of at least one of the voltage dividers includes an eFUSE that changes an output voltage based on a state of the eFUSE, and the differential amplifier changes the output voltage into a digital output with no clocking capabilities.

Abstract: A memory subsystem is provided including an interface circuit adapted for coupling with a plurality of memory circuits and a system. The interface circuit is operable to interface the memory circuits and the system for emulating at least one memory circuit with at least one aspect that is different from at least one aspect of at least one of the plurality of memory circuits. Such aspect includes a signal, a capacity, a timing, and/or a logical interface.

Abstract: A memory subsystem is provided including an interface circuit adapted for communication with a system and a majority of address or control signals of a first number of memory circuits. The interface circuit includes emulation logic for emulating at least one memory circuit of a second number.

Abstract: An electronic system according to various aspects of the present invention includes a memory having a location-specific command interface and a general command interface. The memory communicates with other components in the system via a main command bus configured to transfer address-specific commands and a supplementary command bus configured to transfer general commands. Commands may be received by the memory simultaneously at the respective interfaces.

Abstract: A semiconductor memory device includes an IO circuit for receiving or outputting command signals, address signals and data which are serialized and an IO signal control circuit for parallel converting the serialized command signals, address signals and data inputted through the IO circuit and applying the parallel converted signals to an internal portion and serial converting parallel data applied from the internal portion and outputting the serial converted data to the IO circuit.

Abstract: A semiconductor memory integrated circuit includes a plurality of pads; a peripheral circuit having a plurality of control circuits which are arranged at locations adjacent to the plurality of the pads and receive a plurality of input signals to generate a plurality of output signals in response to a plurality of control signals, respectively; and a plurality of fuse circuits for generating the plurality of the control signals, said fuse circuits being arranged between the plurality of the pads and the peripheral circuit. Since the integrated circuit has the fuse circuits at a location adjacent to the pads, the characteristics of the IC can be changed even after the package test when a small region is opened.