Abstract: A driver for a semiconductor memory includes: a selection controller configured to output a target charge current select signal and a bucket charge current select signal in response to an inputted memory cell address and a target charge current value and a bucket charge current value, which are to be applied to a memory cell of the memory cell address; a current supply unit configured to supply a target charge current to the memory cell of the memory cell address in response to the target charge current select signal; and a bucket charge current supply unit configured to supply a bucket charge current to the memory cell of the memory cell address, in order to pre-charge the memory cell of the memory cell address in response to the bucket charge current select signal.

Abstract: A digital voltage boost circuit, optionally working in parallel with an analog voltage regulator, periodically injects a constant amount of current each cycle into the bit line of a high density memory array to eliminate the bias voltage reduction which would otherwise occur. This results in a much faster recovery time and reduces the semiconductor real estate required. A pulse generator in the boost circuit generates one or more current modulation signals which control corresponding current supply devices in a current source. The boost circuit drives a constant amount of current to the bias voltage node each memory cycle.

Abstract: A method comprises providing a trigger signal, generating an input pulse according to the trigger signal, inverting the input pulse to generate an inverted input pulse and pulling down an output voltage using the inverted input pulse, wherein the inverted pulse is applied to a transistor of a high threshold voltage circuit.

Abstract: A semiconductor memory device that does not require a sense amplifier includes a memory cell group having at least one memory cell, a buffer unit, and a bias voltage unit. The buffer unit includes a tri-state buffer that has an input terminal coupled to the memory cell group, and an output terminal coupled to a data line unit. The tri-state buffer is operable to switch between a conducting state and a non-conducting state. The bias voltage unit controls supply of a preset bias voltage to the input terminal of the tri-state buffer. By using the tri-state buffer, the parasitic capacitance attributed to the memory cell can be reduced, such that no sense amplifier is required to ensure proper operation, thereby reducing power consumption.

Abstract: A negative voltage generator includes a variable-capacitance negative voltage generating unit, a switching unit and a positive voltage applying unit. The negative voltage generating unit includes a plurality of coupling capacitors for varying the capacitance in which the negative voltage is charged. The negative voltage generating unit selects at least one coupling capacitor of the plurality of coupling capacitors according to the number of rows (size) of a memory bank to which data is written, and charges the at least one selected coupling capacitor to a negative voltage. The switching unit selects one bitline of a bitline pair having complementary first and second bitlines in response to the data, and connects the at least one selected coupling capacitor to the selected bitline. The positive voltage applying unit applies a positive (high) voltage to an other bitline of the bitline pair.

Abstract: A voltage generator of a nonvolatile memory device includes a pump circuit for generating a pump output voltage by performing a pumping operation and raise or maintain the output voltage in response to a double enable signal or a single enable signal, a first regulator for comparing a first division voltage with a first reference voltage and generating the double enable signal according to a result of the comparison, a second regulator for comparing a second division voltage with a second reference voltage and outputting the voltage of the first level as a first regulation voltage, and a third regulator for comparing the second division voltage with the second reference voltage and generating the single enable signal according to a result of the comparison.

Abstract: A method is provided for operating a nonvolatile memory comprising memory cells stacked on a substrate. The method comprises counting a number of program loops performed in a first program operation of selected memory cells connected to a selected wordline, and controlling an increment of a program voltage between successive program loops of a second program operation of the selected memory cells according to the counted number.

Abstract: A write and/or read current generator for nonvolatile memory device, especially for Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM), may include a current supplying circuit which changes a level of a sample current, determines a resistance state change current of a sample bit cell based on a feedback signal obtained through the sample bit cell whose resistance state is changed according to a level of the sample current. The current supplying circuit may calibrate a write and/or read current of a memory cell in response to a sample current applied at a point of time when a resistance state of the sample bit cell is switched into another resistance state. A calibration circuit may generate the feedback signal indicating a resistance area of a predetermined resistance range to which a resistance state of the sample bit cell belongs.

Abstract: Circuitry to provide a supply voltage. A voltage regulator is coupled to receive a target reference signal. The voltage regulator generates a supply voltage (Vtt) and is coupled to receive the supply voltage as an input signal. An upper limit comparator receives an upper limit voltage signal that is higher than the target reference voltage signal and the supply voltage to generate a “too high” signal when the supply voltage exceeds an upper threshold. A lower limit comparator receives a lower limit voltage signal that is lower than the target reference voltage signal and the supply voltage to generate a “too low” signal when the supply voltage is below a lower threshold. A pull up current source is coupled to pull the supply voltage up in response to the too low signal. A pull down current source is coupled to pull the supply voltage down in response to the too high signal.

Abstract: A method to trim a reference voltage source formed on an integrated circuit includes configuring the integrated circuit in a test mode; providing a power supply voltage and a trim code sequence to the integrated circuit where the power supply voltage is provided by a precision reference voltage source; generating a target voltage on the integrated circuit using the power supply voltage; generate a reference voltage using the reference voltage source formed on the integrated circuit; applying one or more trim codes in the trim code sequence to the reference voltage source to adjust the reference voltage; comparing the reference voltage generated based on the trim codes to the target voltage; asserting a latch signal in response to a determination that the reference voltage generated based on a first trim code is equal to the target voltage; and storing the first trim code in response to the latch signal being asserted.

Abstract: A memory is disclosed that includes a plurality of memory cells, a plurality of sense amplifiers for reading data of the memory cells, and a voltage regulator coupled to the plurality of sense amplifiers. The voltage regulator includes a reference sense amplifier, a current injector, and a current injector control circuit. The current injector control circuit controls an amount of current provided by the current injector to an output node of the voltage regulator based on a voltage of the reference sense amplifier.

Abstract: A transmission line interface circuit includes a voltage regulator to control a voltage swing of the transmission line interface circuit for signal transmission. The transmission line interface circuit includes complementary driver elements, including a p-type driver element to pull up the transmission line in response to a logic high, and an n-type driver element to pull down the transmission line in response to a logic low. The voltage regulator is coupled between one of the driver elements and a respective voltage reference to reduce a voltage swing of the transmission line interface circuit.

Abstract: A semiconductor chip includes: a data output buffer that outputs a data signal; a first power-supply pad that supplies a first power-supply potential to the data output buffer; a power-supply wiring that is connected to the first power-supply pad; a strobe output buffer that outputs a strobe signal; and a second power-supply pad that supplies a second power-supply potential to the strobe output buffer. The power-supply wiring and the second power-supply pad are electrically independent of each other. Therefore, the power-supply noise associated with the switching of the data output buffer does not spread to the strobe output buffer. Thus, it is possible to improve the quality of the strobe signal.

Abstract: A 3D NAND stacked non-volatile memory device, comprising: a string comprising a plurality of non-volatile storage elements, the string comprises a channel and extends vertically through layers of the 3D stacked non-volatile memory device, and the plurality of storage elements are subdivided into different groups based on group assignments, each group of the different groups comprises multiple adjacent storage elements of the plurality of storage elements; and a control circuit in communication with the string, the control circuit, to perform a Pseudo Block Operation Mode.

Abstract: A user system is provided including a plurality of flash memory devices and a memory controller connected to the flash memory devices through a plurality of channels. The memory controller includes a voltage regulator configured to supply a power of the flash memory devices and a compensation unit configured to supply an additional power to the flash memory devices when a power required by the flash memory devices exceeds a predetermined level. The compensation unit includes a resistor unit connected to an output terminal of the voltage regulator and input terminals of the flash memory devices and a charging unit connected to input terminals of the flash memory devices. The charging unit is configured to supply an additional power to the flash memory devices according to voltages of input terminals of the flash memory devices.

Abstract: One or more techniques or systems for controlling a voltage divider are provided herein. In some embodiments, a control circuit is configured to bias a pull up unit of a voltage divider using an analog signal, thus enabling the voltage divider to be level tunable. In other words, the control circuit enables the voltage divider to output multiple voltage levels. Additionally, the control circuit is configured to bias the pull up unit based on a bias timing associated with a pull down unit of the voltage divider. For example, the pull up unit is activated after the pull down unit is activated. In this manner, the control circuit provides a timing boost, thus enabling the voltage divider to stabilize more quickly.

Abstract: A semiconductor memory device according to an embodiment includes: a memory cell array including a plurality of first lines, a plurality of second lines, and memory cells disposed at each of intersections of the first lines and the second lines; and a control circuit configured to apply a first voltage to a selected first line, apply a second voltage having a voltage value which is smaller than that of the first voltage to a selected second line, and apply a third voltage and a fourth voltage to a non-selected first line and a non-selected second line, respectively. The control circuit is configured to apply a fifth voltage to one of the non-selected first lines that is adjacent to the selected first line, and apply a sixth voltage to one of the non-selected second lines that is adjacent to the selected second line.

Abstract: A programmable memory cell includes a non-volatile memory unit, a reference current generator and a readout unit. The non-volatile memory unit is configured to be performed by a program operation, a read operation or an erase operation. The reference current generator is configured to generate a reference current; wherein a value of the reference current is dynamically modulated according to a count number of the program and erase operations performed on the non-volatile memory unit. The readout unit, electrically coupled to the non-volatile memory unit and the reference current generator, is configured to read a data stored in the non-volatile memory cell according to the reference current. A data read method applied to the aforementioned programmable memory cell is also provided.

Abstract: A memory bank includes memory cells and an additional cell to determine an operating voltage of the memory bank. The additional cell has an operating margin that is less than a corresponding operating margin of the other memory cells in the memory bank.

Abstract: A half bit line high level voltage generator, a memory device and a driving method are disclosed herein. The half bit line high level voltage generator includes a control module, a driving module and a detecting module. The control module is configured for generating a first control signal and a second control signal in accordance with an update signal and a half bit line high level voltage. The driving module is configured for generating a half bit line high level voltage to a memory device in accordance with the first control signal and the second control signal. The detecting module is configured for detecting whether a cross current flows through the driving module, and accordingly generating the update signal to adjust the driving module to reduce the cross current.

Abstract: The present invention provides an apparatus and method for erasing data in a memory device comprising an array of memory cells, and configured to operate from a clock signal. The apparatus includes erase circuitry, responsive to receipt of an erase signal in an asserted state, to perform a forced write operation independently of the clock signal in respect of each memory cell within a predetermined erase region of said array. Further, erase signal generation circuitry is configured to receive a control signal and to maintain said erase signal in a deasserted state provided that the control signal takes the form of a pulse signal having at least a predetermined minimum frequency between pulses. The erase signal generation circuitry is further configured to issue said erase signal in said asserted state if the control signal does not take the form of said pulse signal.

Abstract: Structures and related processes for effectively regulating power among slave chips in a 3D memory multichip package that employs TSVs for interlevel chip connections. Individual voltage regulators are employed on one or more of the slave chips for accurate level control of internal voltages, for example, word line driver voltage (VPP), back bias voltage (VBB), data line voltage (VDL), and bit line pre-charge voltage/cell plate voltage (VBLP/VPL). Employing regulators on one or more of the slave chips not only allows for precise regulation of power levels during typical memory stack operation, but also provides tolerance in small variations in power levels caused, for example, by manufacturing process variations. Moreover, less chip real estate is used as compared to techniques that provide complete power generators on each chip of a multichip stack.

Abstract: A 3D NAND stacked non-volatile memory device, comprising: a string comprising a plurality of non-volatile storage elements, the string comprises a channel and extends vertically through layers of the 3D stacked non-volatile memory device, and the plurality of storage elements are subdivided into different groups based on group assignments, each group of the different groups comprises multiple adjacent storage elements of the plurality of storage elements; and a control circuit in communication with the string, the control circuit, to perform a Pseudo Block Operation Mode.

Abstract: In a method, various operations are performed based on a voltage line coupled with a plurality of memory cells. Storage nodes of the plurality of memory cells are caused to change to a first logical value. Another first logical value is applied to a plurality of data lines. Each data line of the plurality of data lines carries data for each memory cell of the plurality of memory cells. A control line of the plurality of memory cells is activated. A first voltage value is applied to the voltage line. The first voltage value causes the another first logical value on the plurality of data lines to be transferred to the storage nodes of the plurality of memory cells.

Abstract: Flash memory devices and systems are provided. One flash memory device includes an n-channel metal oxide semiconductor field-effect transistor (nMOSFET), a silicon-oxide-nitride-oxide silicon (SONOS) transistor coupled to the nMOSFET, and an isolated p-well coupled to the nMOSFET and the SONOS transistor. A flash memory system includes an array of memory devices divided into a plurality of paired sectors, a global bit line (GBL) configured to provide high voltage to each respective sector during erase and program operations coupled to each of the plurality of sectors, and a plurality of sense amplifiers coupled between a respective pair of sectors. Methods for operating a flash memory are also provided. One method includes providing high voltage, via the GBL, to the paired sectors during erase and program operations and providing low voltage, via a local bit line, to each memory device during read operations.

Abstract: A circuit includes an input/output (IO) circuit, a first node configured to have a first voltage level, a second node configured to have a second voltage level, a third node, and a switching circuit. The IO circuit has a set of transistors, and the third node is coupled to bulks of the set of transistors. The switching circuit is configured to couple the first node to the third node when the IO circuit is operated in an active mode; and couple the second node to the third node when the IO circuit is operated in an inactive mode. The first voltage level causes the set of transistors to have a first threshold voltage, the second voltage level causes the set of transistors to have a second threshold voltage, and an absolute value of the second threshold voltage is greater than that of the first threshold voltage.

Abstract: A semiconductor memory apparatus according to the embodiment includes: an external connection terminal configured to supply an external voltage; a fuse unit configured to perform a fuse rupture operation; and an interruption circuit unit configured to respond to a test signal to determine whether the external connection terminal is connected to the fuse unit.

Abstract: A semiconductor device includes a memory cell array configured to include a plurality of memory cells connected between a plurality of bit lines and a plurality of word lines, a bit line sense amplifier connected to a bit line of the bit lines and configured to amplify data stored in a selected memory cell and transfer the amplified data to a segment I/O line, a control signal generator configured to determine a level of an I/O switch control signal in response to a level of a power source voltage, and a local sense amplifier connected between the segment I/O line and an local I/O line and configured to couple or separate the segment I/O line and the local I/O line in response to the I/O switch control signal, amplify the data transferred to the segment I/O line, and supply the amplified data to the local I/O line.

Abstract: A voltage regulator may include an input terminal for receiving an input voltage and an output terminal for providing a respective output voltage, a regulation transistor having a first conduction terminal coupled to the input terminal for receiving the input voltage, a second conduction terminal coupled to the output terminal, and a control terminal coupled to the output of a first operational amplifier. The first operational amplifier may have a non-inverting input terminal for receiving a first reference voltage, and an inverting input terminal coupled to a first terminal of a divider circuit for receiving a second reference voltage.

Abstract: Disclosed herein is a device that includes a capacitor, a pumping circuit supplying a pumping signal changed between first and second potential to a first electrode of the capacitor, and an output circuit precharging a second electrode of the capacitor to a third potential different from the first and second potentials. The second electrode of the capacitor is thereby changed from the third potential to a fourth potential higher than the third potential when the pumping signal is changed from the first potential to the second potential.

Abstract: Systems and methods to set a voltage value associated with a memory controller coupled to a memory device are disclosed. A particular method includes comparing test data of a test path to functional data of a functional path. The functional data may be generated based on device data received at a memory controller from a memory device. The test data may be affected by a voltage value applied to a resistor arrangement in electronic communication with the test path. The voltage value may be applied to the resistor arrangement based on the comparison.

Abstract: Disclosed is a memory array structure, where a wordline driver selectively applies a high on-state voltage (VWLH) or a low off-state voltage (VWLL) to a wordline. VWLH has a slightly negative temperature coefficient so that it is regulated as high as the gate dielectric reliability limits allow, whereas VWLL has a substantially neutral temperature coefficient. To accomplish this, the wordline driver is coupled to one or more voltage regulation circuits. In one embodiment, the wordline driver is coupled to a single voltage regulation circuit, which incorporates a single voltage reference circuit having a single output stage that outputs multiple reference voltages. Also disclosed is a voltage reference circuit, which can be incorporated into the voltage regulation circuit of a memory array structure, as described, or, alternatively, into any other integrated circuit structure requiring voltages with different temperature coefficients. Also disclosed is a method of operating a memory array structure.

Abstract: A dynamic random access memory device may include DRAM memory cells including several lines of memory cells, and line selection circuitry associated with each line. The line selection circuitry may include a first voltage-elevator stage configured to receive two initial control logic signals each having an initial voltage level corresponding to a first logic state, and to deliver two intermediate control logic signals each having an intermediate voltage level above the initial level and corresponding to the first logic state. The line selection circuitry may also include a control circuit to be supplied by PMOS transistors with a supply voltage having a second voltage level greater than the intermediate voltage level, and configured to, in the presence of the two intermediate control logic signals have their first logic state deliver to the gates of the memory cell transistors, a selection logic signal having the second voltage level.

Abstract: A clock driver integrated circuit device and method is provided. The device can include a VTT regulator provided on a single integrated circuit (IC) chip. A first termination at an internal VDD/2 can be coupled to the VTT regulator. A VTT bus can be coupled to the first termination. A plurality of command control inputs can be coupled to the VTT bus. The plurality of command inputs can include A, BA, RAS, CAS, WE, CS, CKE, ODT, PARIN, and the like. A VDD termination can be coupled to a first end of the VTT bus and a ground can be coupled to a second end of the VTT bus. The method can include regulating or removing signal noise from a host controller via the clock driver IC device.

Abstract: A non-volatile memory device comprises an array of memory cells and a charge pump coupled to the memory cells. The charge pump is dynamically reconfigurable to operate in a bypass mode to provide a first voltage to the memory cells, a program mode to provide the first voltage to the memory cells, and an erase mode to provide a second voltage that has inverse polarity of the first voltage.

Abstract: Embodiments disclosed herein may relate to applying verify or read pulses for phase change memory and switch (PCMS) devices. The read pulses may be applied at a first voltage for a first period of time. A threshold event for the phase change memory cell may be detected during a sense window. The sense window may close after the expiration of the first period of time for which the read pulses are applied.

Abstract: Upon selecting non-volatile storage elements to be sensed, the system obtains information about the position of these non-volatile storage elements, determines sensing parameters based at least in part on this information, pre-charges a charge storage device and, while maintaining the voltage level of the bit lines of these memory cells at a constant value, applies a reference signal to these non-volatile storage elements for a certain duration of time, afterwards determining whether, for the certain duration of time, the current conducted by these non-volatile storage elements exceeds a predetermined value.

Abstract: A precharge circuit includes a precharge unit configured to apply a voltage of a precharge voltage terminal to a data line during a precharge operation, and a sensing unit configured to disable the precharge unit by sensing the voltage of the precharge voltage terminal. The precharge circuit may control a precharge operation by sensing a change in the voltage level of the precharge voltage terminal.

Abstract: A memory includes an array of memory cells, a first module and a second module. The first module is configured to compare a first state of a memory cell with a reference. The memory cell is in the array of memory cells. The second module is configured to, subsequent to a read cycle or a write cycle of the memory cell and based on the comparison, reform the memory cell to adjust a difference between the first state and a second state of the memory cell.

Abstract: An object is to provide a highly integrated storage device which can operate at high speed and a driving method thereof. The storage device includes two storage portions, two precharge switches, and one sense amplifier. In each of the storage portions, storage elements are arranged in a matrix. In each of the storage elements, a node electrically connected to a source or a drain of a transistor whose off-state current is small is a memory storing portion. A page buffer circuit is unnecessary; thus, high-speed operation is possible and high integration is achieved.

Abstract: An e-fuse array circuit includes a high voltage pumping unit configured to generate a high voltage by pumping a power source voltage, a negative voltage pumping unit configured to generate a negative voltage by pumping a ground voltage, a program/read line supplied with the high voltage when a program operation is activated, a read voltage, which is lower than the high voltage, when a read operation is activated, or the negative voltage when deactivated, a row line supplied with the ground voltage when the row line is activated or the negative voltage when the row line is deactivated, an e-fuse device supplied with voltage of the program/read line, a switch device controlled by the row line and configured to electrically connect the e-fuse device with a column line, and a column circuit configured to supply the negative voltage to the column line when the column line is activated.

Abstract: A memory cell and array and a method of forming a memory cell and array are described. A memory cell includes first and second pull-up transistors, first and second pull-down transistors, first and second pass-gate transistors, and first and second isolation transistors. Drains of the first pull-up and first pull-down transistors are electrically coupled together at a first node. Drains of the second pull-up and second pull-down transistors are electrically coupled together at a second node. Gates of the second pull-up and second pull-down transistors are electrically coupled to the first node, and gates of the first pull-up and first pull-down transistors are electrically coupled to the second node. The first and second pass-gate transistors are electrically coupled to the first and second nodes, respectively. The first and second isolation transistors are electrically coupled to the first and second nodes, respectively.

Abstract: A semiconductor integrated circuit according to an embodiment includes an oscillator that generates and outputs an oscillation signal in an active state and generates no oscillation signal in an inactive state. The semiconductor integrated circuit includes a negative charge pump that generates an output voltage that is a negative voltage in response to the oscillation signal and outputs the output voltage to an output pad. The semiconductor integrated circuit includes a negative voltage detecting circuit that detects the output voltage and controls the oscillator to be in the active state or inactive state so as to bring the output voltage close to a target voltage.

Abstract: A semiconductor device includes a register unit for storing additional bits associated with a command signal and outputting a selected additional bit corresponding to a received address; a combination circuit for combining received control bits and the selected additional bit, and outputting enable signals based on the combined bits, where the received control bits are generated in response to the command signal and a control signal; and a voltage generation circuit for outputting voltages distributed in response to the enable signals.

Abstract: A semiconductor memory apparatus according to the embodiment includes: an external connection terminal configured to supply an external voltage; a fuse unit configured to perform a fuse rupture operation; and an interruption circuit unit configured to respond to a test signal to determine whether the external connection terminal is connected to the fuse unit.

Abstract: Electronic apparatus, systems, and methods can include a delayer having an inverter chain, where each inverter of the chain can be operatively regulated using current generators to control variation of the delay time of the delayer. In various embodiments, current generators can be arranged to provide reference voltages to each inverter stage of an inverter chain. Additional apparatus, systems, and methods are disclosed.

Abstract: A method of operating an embedded dynamic random access memory (eDRAM). The method includes sending requests for sampling and correction between accesses of the eDRAM using an oscillator. The method further includes sending a pulse defining a time interval during which sampling and correction occurs using a control block and providing a reference level using a reference generator and comparing the reference level with a sampling of a reference voltage using a comparator. The method further includes sending a correction request using the comparator if the reference voltage requires correction and generating a correction pulse according to the correction request from the comparator and the pulse defining the time interval from the control block using a pulse generator. The method further includes adjusting the reference voltage during the correction pulse using a driver determining a logic value stored in the eDRAM based on the adjusted reference voltage.

Abstract: A regulator includes a variable resistance unit coupled between an input node to which a pumping voltage is inputted and a control node and configured to adjust resistance of the variable resistance unit in response to a control signal varied depending on a target voltage, a voltage output unit configured to adjust the pumping voltage according to potential of the control node and output the adjusted pumping voltage, and a regulation unit configured to control the potential of the control node according to the adjusted pumping voltage, to output the target voltage. The regulator adjusts the resistance of an internal resistor according to the target voltage, thereby reducing current consumption.

Abstract: Devices, systems, methods, and other embodiments associated with accessing memory using fractional reference voltage are described. In one embodiment, an apparatus includes comparison logic. The comparison logic compares a threshold voltage of a memory cell to at least one pair of reference voltages that are near an integral reference voltage to generate comparison results. The apparatus includes read logic to determine a bit value of the memory cell based, at least in part, on the comparison results.

Abstract: A nonvolatile semiconductor memory device include: a two terminal structured variable resistive element, wherein resistive characteristics defined by current-voltage characteristics at both ends transit between low and high resistance states stably by applying a voltage satisfying predetermined conditions to the both ends. A transition from the low resistance state to the high resistance state occurs by applying a voltage of a first polarity whose absolute value is at or higher than first threshold voltage, and the reverse transition occurs by applying a voltage of a second polarity whose absolute value is at or higher than a second threshold voltage. A load circuit is connected to the variable resistive element in series having an adjustable load resistance. A voltage generation circuit applies a voltage to both ends of a serial circuit. The variable resistive element can transit between the states by adjusting a resistance of the load circuit.