Abstract: A complementary lateral bipolar SRAM device. The device includes: a first set and second set of lateral bipolar transistors forming a respective first inverter device and second inverter device, the first and second inverter devices being cross-coupled for storing a logic state. In each said first and second set, a first bipolar transistor is an PNP type bipolar transistor, and a second bipolar transistor is an NPN type bipolar transistor, each said NPN type bipolar transistor having a base terminal, a first emitter terminal, a second emitter terminal, and a collector terminal. Emitter terminals of the PNP type transistors of each first and second inverter devices are electrically coupled together and receive a first applied wordline voltage. The first emitter terminals of each said NPN transistors of said first inverter and second inverter devices are electrically coupled together and receive a second applied voltage.

Abstract: Apparatus and methods for providing a high density memory array with reduced read access time are disclosed. Multiple split bit lines are arranged along columns of adjacent memory bit cells. A multiple input sense amplifier is coupled to the multiple split bit lines. The loading on the multiple split bit line is reduced, and the corresponding read speed of the memory array is enhanced over the prior art. The sense amplifier and the memory bit cells have a common cell pitch layout height so that no silicon area penalty arises due to the use of the multiple split bit lines and sense amplifiers. Increased memory array efficiency is achieved.

Abstract: A semiconductor device is disclosed which comprises first and second local bit lines coupled to a plurality of memory cells arranged in first and second areas, respectively, a differential type local sense amplifier amplifying a voltage difference between the first and second local bit lines, a global bit line arranged in an extending direction of the first and second local bit lines, and first and second switches controlling electrical connections between the first and second local bit lines and the global bit line, respectively.

Abstract: A semiconductor integrated circuit device includes a first signal line and a second signal line, and a sense amplifier that includes a plurality of PMOS transistors and a plurality of NMOS transistors. The sense amplifier is configured to sense amplify a potential difference between the first signal line and the second signal line. The junction regions of the NMOS and PMOS transistors having the same conductivity type, and to which the same signal is applied, are formed in one integrated active region.

Abstract: Disclosed are various apparatuses and methods for a memory with a multiple word line design. A memory timing circuit may include a dummy word line including a first portion and a second portion and further including capacitative loading that is lumped in the second portion of the dummy word line, a first transistor connected to the first portion of the dummy word line and configured to charge the dummy word line, and a second transistor connected to the second portion of the dummy word line and configured to discharge the dummy word line. A method may include charging a dummy word line using a first transistor, and discharging the dummy word line using a second transistor, wherein the dummy word line includes a first portion and a second portion and further includes capacitative loading that is lumped in the second portion of the dummy word line.

Abstract: An integrated circuit device can include a radio-frequency device and a hard-wired lookup table. The radio-frequency device can have an analog input, a digital control input, and an analog output. An unadjusted transfer response of the analog output relative to the analog input and the digital control input can differ from an ideal transfer response. The hard-wired lookup table can be connected to the digital control input of the radio-frequency device to generate a modified digital control input based on a predetermined function. This can have the effect that the adjusted transfer response of the analog output relative to the analog input and the modified digital control input is closer to the ideal transfer response than the unadjusted transfer response of the analog output relative to the analog input and the digital control input. The predetermined function can be defined by metallization connections within the integrated circuit device.

Abstract: A setting information storage circuit includes first decoders configured to generate first input enable signals, respectively, in response to selection codes and a first set signal, first register sets configured to correspond to the first decoders, respectively, and to receive setting data when first input enable signals generated from the first decoders corresponding to the first register sets, respectively, are enabled, and store the received setting data, a second decoders configured to generate a second input enable signals, respectively, in response to the selection codes and a second set signal, and a second register sets configured to correspond to the second decoders, respectively, and to receive the setting data when second input enable signals generated from the second decoders corresponding to the second register sets, respectively, are enabled, and store the received setting data.

Abstract: A sense amplifier circuit comprising a pair of cross-coupled inverters and a data line charging circuit is disclosed. The cross-coupled inverters comprise a first inverter and a second inverter. The first inverter has a first pull-up transistor with a first pull-up terminal. The second inverter has a second pull-up transistor with a second pull-up terminal. The output of the first inverter is coupled to the input of the second inverter at a first sense amp node. The output of the second inverter is coupled to the input of the first inverter at a second sense amp node. The data line charging circuit has a first node connected to a data line and the first pull-up terminal. The data line charging circuit also has a second node connected to a complementary data line and the second pull-up terminal. The first and second pull-up transistors are coupled to different voltage levels when a sense amplifier enable signal is activated.

Abstract: A static random access memory (SRAM) cell includes first and second n-channel transistors, first and second p-channel transistors, first and second enable transistors, and first and second pass gates. The first n-channel transistor, the first p-channel transistor, and the first enable transistor are connected in series between first and second reference potentials. The second n-channel transistor, the second p-channel transistor, and the second enable transistor are connected in series between the first and second reference potentials. The first pass gate is configured to selectively connect a first bitline to a first node. The first node is connected to a gate of the first n-channel transistor and a gate of the first p-channel transistor. The second pass gate is configured to selectively connect a second bitline to a second node. The second node is connected to a gate of the second n-channel transistor and a gate of the second p-channel transistor.

Abstract: An embodiment of a non-volatile memory device includes: a memory array, having a plurality of non-volatile logic memory cells arranged in at least one logic row, the logic row including a first row and a second row sharing a common control line; and a plurality of bit lines. Each logic memory cell has a direct memory cell, for storing a logic value, and a complementary memory cell, for storing a second logic value, which is complementary to the first logic value in the corresponding direct memory cell. The direct memory cell and the complementary memory cell of each logic memory cell are coupled to respective separate bit lines and are placed one in the first row and the other in the second row of the respective logic row.

Abstract: Schematic circuit designs for a dual-port SRAM cell are disclosed, together with various layout schemes for the dual-port SRAM cell. The dual-port SRAM cell comprises a storage unit and a plurality of partial dummy transistors connected to the outputs of the storage unit. Various layout schemes for the dual-port SRAM cell are further disclosed. A gate electrode serves as the gate for a pull-down transistor and a pull-up transistor, a gate of a first partial dummy transistor, and a gate of a second partial dummy transistor. A butt contact connects a long contact to the gate electrode. The long contact further connects to a drain of a pull-down transistor, a drain of a pull-up transistor, a drain of a first pass gate, and a drain of a second pass gate, wherein the first pass gate and the second pass gate share an active region.

Abstract: Memories and methods for providing and receiving non-data signals at a signal node are disclosed. One such memory includes first and second signal nodes, and first and second signal buffer. The first signal buffer is configured to be operative responsive to a first data strobe signal and further configured to be operative responsive to a non-data signal. The second signal buffer is configured to be operative responsive to a second data strobe signal. An example first data strobe signal is a read data strobe signal provided by the memory. In another example, the first data strobe signal is a write data strobe signal received by the memory. Examples of non-data signals include a data mask signal, data valid signal, error correction signal, as well as other signals.

Abstract: A memory with extra digit lines in full size end arrays with an open digit architecture, which can use the extra digit lines to form repair cells. In one example, folded digit sense amplifiers are connected to an end array with an open digit architecture such that each sense amplifier corresponds to a group of four digit lines. Two digit lines of the group connect to two open digit sense amplifiers and the other two digit lines connect to the corresponding folded digit sense amplifier. A repair method can be performed on memories including the end arrays with folded digit sense amplifiers. A row in a core array including a replaceable IO is activated and a row in an end array is activated. The repair cells in the end array can be sensed by the folded digit sense amplifiers to generate a replacement IO, which is selected rather than the replaceable IO.

Abstract: Embodiments of a memory are disclosed that may allow for a negative boost of data lines during a write. The memory device may include a data input circuit, an address decode circuit and a plurality of sub-arrays. Each of the sub-arrays may include a plurality of columns, a write selection circuit, a first write driver circuit, a second write driver circuit, and a boost circuit. Each of the columns may include a plurality of data storage cells. The write selection circuit may select a column of the plurality of columns. Each of the write driver circuits may be configured to discharge a data line of a selected column into a common node. The boost circuit may be configured to initialize the common node to the first voltage level and couple the common node to a second voltage level, where the second voltage level is lower than the first voltage level.

Abstract: A semiconductor storage apparatus according to the present invention includes a plurality of memory cells, a plurality of word lines, a plurality of pairs of bit lines, a plurality of sense amplifiers, a pair of common data lines, a data-to-be-written output circuit configured to, in writing data, set voltages of the common data lines forming the pair, a column selection signal output unit configured to output a plurality of column selection signals, and a plurality of column selection gates, in which in writing the data, the column selection signal output unit selectively turns on one of the column selection gates by setting each of voltages of the column selection signals to one of a level of a higher-potential power supply voltage and a level of a lower-potential power supply voltage, before activating the sense amplifiers.

Abstract: A memory array assembly and a method for performing a write operation without disturbing data stored in other SRAM cells are provided. The memory array assembly comprises a plurality of SRAM cells, a plurality of avoid-disturb cells, a plurality of sense amplifiers and a plurality of write drivers. The SRAM cells are arranged in rows and columns, wherein each column is coupled to an avoid-disturb cell, a sense amplifier, and a write driver. The avoid-disturb cell receives a select signal capable of assuming first or second states. An output of the sense amplifier is coupled to an input of the write driver when the select signal is in the first state. A data-in bus is coupled to the input of the write driver if the select signal is in the second state. The write driver then sends the output signal to the SRAM cell.

Abstract: Embodiments of the disclosure provide a method for backing up data in an SRAM device, and an SRAM device that includes a capacitive backup circuit for backing up data in an SRAM device. The method may include writing data to the SRAM cell by applying an input voltage to set an input node of cross-coupled inverters to a memory state. The method may also include backing up the data written to the SRAM cell by electrically coupling the input node to the capacitive backup circuit. The method may also include restoring the data stored in the capacitive backup circuit to the SRAM cell by electrically coupling the capacitive backup circuit to the input node.

Abstract: A complementary metal-oxide-semiconductor (CMOS) dynamic random access memory (DRAM) cell with sense amplifier is described. In one embodiment, the DRAM cell includes an n-type field-effect transistor (NFET), a p-type field-effect transistor (PFET), and a storage capacitor accessed through both the NFET and the PFET. A pair of bit lines is coupled to the DRAM cell. A sense amplifier with a single-ended read path reads data in the DRAM cell through only one of the bit lines and a data-dependent write-back path writes back data to the DRAM cell through either one of the bit lines. The bit line used by the sense amplifier to write back the data to the DRAM cell depends on the logical value of the data.

Abstract: A voltage source controller for a memory array includes an input coupled to a voltage source, an output coupled to one or more memory cells of a memory array, where the output is configured to provide a cell source voltage to the memory cells. The controller also includes a switch circuit configured to: receive a retention enable signal, a write assist enable signal, and a standard mode enable signal; and based on the retention enable signal, write assist enable signal, and standard mode enable signal, selectively set the cell source voltage for one or more of the memory cells to one of: a retention voltage, a write assist voltage, or a standard mode voltage, where the retention voltage and the write assist voltage are less than the standard mode voltage.

Abstract: The disclosed embodiments provide a sense amplifier for a dynamic random-access memory (DRAM). This sense amplifier includes a bit line to be coupled to a cell to be sensed in the DRAM, and a complement bit line which carries a complement of a signal on the bit line. The sense amplifier also includes a p-type field-effect transistor (PFET) pair comprising cross-coupled PFETs that selectively couple either the bit line or the complement bit line to a high bit-line voltage. The sense amplifier additionally includes an n-type field effect transistor (NFET) pair comprising cross-coupled NFETs that selectively couple either the bit line or the complement bit line to ground. This NFET pair is lightly doped to provide a low threshold-voltage mismatch between NFETs in the NFET pair. In one variation, the gate material for the NFETs is selected to have a work function that compensates for a negative threshold voltage in the NFETs which results from the light substrate doping.

Abstract: A semiconductor device avoids the disturb problem and the collision between write and read operations in a DP-SRAM cell or a 2P-SRAM cell. The semiconductor device 1 includes a write word line WLA and a read word line WLB each coupled to memory cells 3. A read operation activates the read word line WLB corresponding to the selected memory cell 3. A write operation activates the write word line WLA corresponding to the selected memory cell 3. The selected write word line WLA is activated after activation of the selected read word line WLB in an operation cycle that performs both read and write operations.

Abstract: Provided is a semiconductor integrated device including a semiconductor memory circuit and a peripheral circuit of the semiconductor memory circuit. The peripheral circuit includes a first transistor having a first voltage as a breakdown voltage of a gate oxide film. The semiconductor memory circuit includes a pair of bit lines, one of the pair of bit lines being connected to a gate transistor of a memory cell, and a precharge circuit that includes a transistor having a breakdown voltage substantially equal to that of the first transistor, and precharges the pair of bit lines to a predetermined voltage in response to an activation signal. The activation signal of the precharge circuit is a second voltage higher than the first voltage.

Abstract: A semiconductor memory device, including: a memory cell connected to a first bitline and associated with a second bitline; a sense amplifier, including a first input/output node and a second input/output node; and an isolator connected to the bitlines and to the input/output nodes, the isolator being configured to carry out bitline isolation during a refresh operation of the memory cell, where the bitline isolation includes electrically disconnecting the first bitline from the first input/output node and electrically disconnecting the second bitline from the second input/output node, followed by: electrically re-connecting the first bitline to the first input/output node while the second bitline remains electrically disconnected from the second input/output node.

Abstract: Voltage coupling/decoupling devices are provided within DRAM devices for improving the bias sensing of sense amplifiers and thus the refresh performance. The voltage coupling/decoupling devices couple or decouple bias voltage from corresponding digit lines coupled to the sense amplifiers. By coupling and decoupling voltage from the digit lines, the time interval between refresh operations can be increased.

Abstract: An input-output line sense amplifier configured to drive input data signals over an input-output signal line to an output driver circuit, the input-output line sense amplifier having an output driver stage having a plurality of different programmable output drive capacities to tailor the output drive of the sense amplifier.

Abstract: A semiconductor memory apparatus includes: a first sense amplification unit including first and second inverters configured to be driven to voltage levels of a power driving signal and a ground driving signal and forming a latch structure between a bit line and a bit line bar; and a second sense amplification unit including first and second transistors configured to be driven to the voltage level of the ground driving signal and forming a latch structure between the bit line and the bit line bar when an activated switching signal is applied, wherein a threshold voltage of the second sense amplification unit is set lower than that of the first sense amplification unit.

Abstract: A hierarchical sectioned bit line of an SRAM memory device, an SRAM memory device having a sectioned bit line in hierarchy, and associated systems and methods are described. In one illustrative implementation, each sectioned bit line may comprise a local bit line, a memory cell connected to the local bit line, and a pass gate coupled to the local bit line, wherein the pass gate is configured to be coupled to a global bit line, and wherein the sectioned bit lines are arranged in hierarchical arrays. In other implementations, a hierarchical SRAM memory device may be configured involving sectioned bit lines and a global bit line wherein the pass gates are configured to connect and isolate the sectioned bit line and the global bit line.

Abstract: Provided is a semiconductor integrated device including a semiconductor memory circuit and a peripheral circuit of the semiconductor memory circuit. The peripheral circuit includes a first transistor having a first voltage as a breakdown voltage of a gate oxide film. The semiconductor memory circuit includes a pair of bit lines, one of the pair of bit lines being connected to a gate transistor of a memory cell, and a precharge circuit that includes a transistor having a breakdown voltage substantially equal to that of the first transistor, and precharges the pair of bit lines to a predetermined voltage in response to an activation signal. The activation signal of the precharge circuit is a second voltage higher than the first voltage.

Abstract: A memory system that includes a first bit line coupled to a first set of dynamic random access memory (DRAM) cells, a second (complementary) bit line coupled to a second set of DRAM cells, and a sense amplifier coupled to the first and second bit lines. The sense amplifier includes a pair of cross-coupled inverters (or a similar latching circuit) coupled between the first and second bit lines, as well as a first select transistor coupling the first bit line to a first global bit line, and a second select transistor coupling the second bit line to a second global bit line. The first and second select transistors are independently controlled, thereby enabling improved read and write access sequences to be implemented, whereby signal loss associated with bit line coupling is eliminated, ‘read bump’ conditions are eliminated, and late write conditions are eliminated.

Abstract: A first write transistor has a source connected to a power-supply node, a drain connected to a first local bit line, and a gate connected to a second write global bit line. A second write transistor has a source connected to the power-supply node, a drain connected to a second local bit line, and a gate connected to a first write global bit line. A third write transistor has a source connected to the first write global bit line, a drain connected to the first local bit line, and a gate receiving a first control signal. A fourth write transistor has a source connected to the second write global bit line, a drain connected to the second local bit line, and a gate receiving the first control signal. A read circuit is connected to the first and second local bit lines and first and second read global bit lines.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of word lines, a plurality of bit lines including complementary pairs of bit lines, and a plurality of memory cells storing data; a sense amplifier coupled to the memory cell array and configured to sense voltage differences between the complementary pairs of bit lines and amplify the voltage differences; and at least one voltage driver configured to provide either a predetermined voltage or a first power supply voltage to the memory cell array to increase a sensing margin of the semiconductor memory device. The semiconductor memory device increases respective potential differences between complementary pairs of bit lines using a voltage isolated in the memory cell array.

Abstract: A semiconductor memory device including a bit line connected to a memory cell and a sense amplifier configured to drive a voltage level of a global bit line in response to a voltage level of the bit line. The sense amplifier provides data that is complementary to data stored in the memory cell to the global bit line and provides the complementary data of the global bit line to the memory cell during an active operation of the memory cell.

Abstract: Provided is a method of operating a semiconductor device, wherein an operating mode is set by adjusting timing of a voltage pulse or by adjusting a voltage level of the voltage pulse.

Abstract: A semiconductor memory device includes: a first n-type transistor; a first p-type transistor; a first wiring layer having a first interconnecting portion for connecting a drain of the first n-type transistor and a drain of the first p-type transistor; and a second wiring layer having a first conductive portion electrically connected to the first interconnecting portion.

Abstract: In one aspect, a memory circuit is provided. The memory circuit includes a first three-terminal (3T) resistive memory device and a second 3T resistive memory device coupled to the first 3T resistive memory device. In another aspect a memory array with memory circuits having 3T devices is provided. In yet another aspect, a method of programming a memory array is provided.

Abstract: A sense amplifier arrangement includes a first sense amplifier having a first input and a second input. A second sense amplifier has a first input and a second input. A switching circuit is configured to selectively couple the first input of the first sense amplifier to a first bit line in the array and the second input of the first sense amplifier to a first bit line in the array to selectively couple the first input of the first sense amplifier to the first bit line in the array, the first input of the second sense amplifier to the second bit line in the array, and the second inputs of the first and second sense amplifiers to a reference voltage.

Abstract: An access buffer, such as page buffer, for writing to non-volatile memory, such as Flash, using a two-stage MLC (multi-level cell) operation is provided. The access buffer has a first latch for temporarily storing the data to be written. A second latch is provided for reading data from the memory as part of the two-stage write operation. The second latch has an inverter that participates in the latching function when reading from the memory. The same inverter is used to produce a complement of an input signal being written to the first latch with the result that a double ended input is used to write to the first latch.

Abstract: Disclosed herein is a storage controlling apparatus including: a decision portion configured to decide whether or not a bit number of a specific value from between binary values is greater than a reference value in at least part of input data to a memory cell, which executes rewriting to one of the binary values and rewriting to the other one of the binary values in order in a writing process, to generate decision data indicative of a result of the decision; and a write side outputting portion configured to output, when it is decided that the bit number is greater than the reference value, the input data at least part of which is inverted as write data to the memory cell together with the decision data.

Abstract: Provided is a semiconductor memory device including a plurality of memory cells arranged in a matrix, a plurality of word lines arranged corresponding to each row of the memory cells, a plurality of bit line pairs arranged corresponding to each column of the memory cells, a column selector that selects any of the plurality of bit line pairs based on a column selection signal and connects the selected bit line pair to a data line pair, a precharge circuit that precharges the data line pair, a sense amplifier that amplifies a potential difference of the data line pair, and a control circuit that controls current for driving the sense amplifier based on potentials of the data line pair after a lapse of a specified period from start of amplification of the potential difference of the precharged data line pair by the sense amplifier.

Abstract: A circuit includes a first node, a second node, a memory cell, a first data line, a second data line, and a write driver. The memory cell is coupled to the first node and the second node and powered by a first voltage at the first node and a second voltage at the second node. The first data line and the second data line are coupled to the memory cell. The write driver has a third node carrying a third voltage less than the first voltage during a write operation. The write deriver is coupled to the first data line and the second data line and configured to, during a write operation, selectively coupling one of the first data line and the second data line to the third node and coupling the other one of the first data line and the second data line to the first node.

Abstract: Apparatuses and methods for improved memory cycle times are disclosed. An example apparatus may include first and second lines and a sense amplifier. The sense amplifier is directly coupled to the first and second lines. The sense amplifier may sense a differential signal between the first and second lines and amplify the same. An example method may include accessing a first memory cell coupled to a first line of a pair of lines and accessing a second memory cell coupled to a second line of the pair of lines. A differential is sensed between the pair of lines with a sense amplifier coupled directly to the pair of lines, and the sensed differential is amplified. The sense amplifier is coupled to an input/output bus to provide the amplified sensed differential to the input/output bus.

Abstract: This disclosure concerns memory kink compensation. One method embodiment includes applying a number of sequentially incrementing programming pulses to a memory cell, with the sequential programming pulses incrementing by a first programming pulse step voltage magnitude. A seeding voltage is applied after applying the number of sequentially incrementing programming pulses. A next programming pulse is applied after applying the seeding voltage, with the next programming pulse being adjusted relative to a preceding one of the sequentially incrementing programming pulses by a second programming pulse step voltage magnitude. The second programming pulse step voltage magnitude can be less than the first programming pulse step voltage magnitude.

Abstract: A memory array includes: at least one differential local bit line pair; at least one differential global bit line pair; at least a column selection signal, for charging the differential local bit line pair to a predetermined voltage; at least an enable signal for coupling the differential local bit line pair to the differential global bit line pair when a voltage of the differential local bit line pair reaches a specific value; and a local sense accelerator, coupled to the differential local bit line pair, for determining a voltage of the differential local bit line pair, and enabling an accelerator signal for latching one of the differential local bit line pair and pulling the other low when the voltage reaches the specific value.

Abstract: A sense amplifier arrangement includes a first sense amplifier having a first input and a second input. A second sense amplifier has a first input and a second input. A switching circuit is configured to selectively couple the first input of the first sense amplifier to a first bit line in the array and the second input of the first sense amplifier to a first bit line in the array to selectively couple the first input of the first sense amplifier to the first bit line in the array, the first input of the second sense amplifier to the second bit line in the array, and the second inputs of the first and second sense amplifiers to a reference voltage.

Abstract: A memory with extra digit lines in full size end arrays with an open digit architecture, which can use the extra digit lines to form repair cells. In one example, folded digit sense amplifiers are connected to an end array with an open digit architecture such that each sense amplifier corresponds to a group of four digit lines. Two digit lines of the group connect to two open digit sense amplifiers and the other two digit lines connect to the corresponding folded digit sense amplifier. A repair method can be performed on memories including the end arrays with folded digit sense amplifiers. A row in a core array including a replaceable IO is activated and a row in an end array is activated. The repair cells in the end array can be sensed by the folded digit sense amplifiers to generate a replacement IO, which is selected rather than the replaceable IO.

Abstract: Memories and methods for providing and receiving non-data signals at a signal node are disclosed. One such memory includes first and second signal nodes, and first and second signal buffer. The first signal buffer is configured to be operative responsive to a first data strobe signal and further configured to be operative responsive to a non-data signal. The second signal buffer is configured to be operative responsive to a second data strobe signal. An example first data strobe signal is a read data strobe signal provided by the memory. In another example, the first data strobe signal is a write data strobe signal received by the memory. Examples of non-data signals include a data mask signal, data valid signal, error correction signal, as well as other signals.

Abstract: A SRAM device which can set a threshold voltage of a selection transistor appropriate for all the cells on an SRAM array is disclosed. The SRAM device uses a field effect transistor as the selection transistor. The field effect transistor includes a gate to drive the transistor and a terminal to control a threshold voltage, which are electrically separated from each other. The SRAM device also includes a circuit which, in a reading operation, gradually increases a voltage supplied to the terminal at the start of the reading to control the threshold of the selection transistor.

Abstract: A solid-state memory in which stability assist circuitry is implemented within each memory cell. Each memory cell includes a storage element, such as a pair of cross-coupled inverters, and an isolation gate connected between one of the storage nodes and the input of the opposite inverter. The isolation gate may be realized by complementary MOS transistors connected in parallel, and receiving complementary isolation control signals. In read cycles, or in unselected columns during write cycles, the isolation gate is turned off slightly before the word line is energized, and turned on at or after the word line is de-energized. By isolating the input of one inverted from the opposite storage node, the feedback loop of the cross-coupled inverters is broken, reducing the likelihood of a cell stability failure.

Abstract: Embodiments and examples of differential threshold voltage non-volatile memories and related methods are described herein. Other embodiments, examples thereof, and related methods are also disclosed herein.

Abstract: Provided is a semiconductor integrated device including a semiconductor memory circuit and a peripheral circuit of the semiconductor memory circuit. The peripheral circuit includes a first transistor having a first voltage as a breakdown voltage of a gate oxide film. The semiconductor memory circuit includes a pair of bit lines, one of the pair of bit lines being connected to a gate transistor of a memory cell, and a precharge circuit that includes a transistor having a breakdown voltage substantially equal to that of the first transistor, and precharges the pair of bit lines to a predetermined voltage in response to an activation signal. The activation signal of the precharge circuit is a second voltage higher than the first voltage.