Abstract: A semiconductor memory device includes a bit line sense amplifier block array, upper and lower memory cell arrays and a sense amplifier controller. The bit line sense amplifier block array senses and amplifies data of a memory cell array. The upper and the lower memory cell arrays are respectively connected to upper and lower sides of the bit line sense amplifier block array and store the data in the memory cell array. The sense amplifier controller selectively connects one of the upper and lower memory cell arrays to the bit line sense amplifier block array in response to an active command, and releases the connection when a corresponding one of the upper and lower memory cell arrays are not selected but overdriven.

Abstract: A semiconductor memory device having high integration, low power consumption and high operation speed. The memory device includes a sense amplifier circuit having plural pull-down circuits and a pull-up circuit. A transistor constituting one of the plural pull-down circuits has a larger constant than that of a transistor constituting the other pull-down circuits, for example, a channel length and a channel width. The pull-down circuit having the larger constant transistor is activated earlier than the other pull-down circuits and the pull-up circuit, which are activated to conduct reading. The data line and the earlier driven pull-down circuit are connected by an NMOS transistor and the NMOS transistor is activated or inactivated to control the activation or inactivation of the pull-down circuit.

Abstract: A memory device is a provided that includes memory cells situated at the intersection of lines and columns, and a dummy path including a first dummy column having two bit lines to which there are connected dummy memory cells, and a circuit adapted to select at least one of the dummy memory cells to discharge one of the dummy bit lines. The dummy path also includes at least one second dummy column adapted to generate a dummy leakage current (representing a leakage current of a column of the memory device selected in read mode), and a circuit adapted to copy the dummy leakage current to the one dummy bit line, so that the discharge of the one dummy bit line also depends on the dummy leakage current.

Abstract: A semiconductor memory device comprises a cell array having a plurality of SRAM cells arranged in a bit line direction and a word line direction orthogonal to said bit line direction in a matrix; and a peripheral circuit arranged adjacent to the cell array in the bit line direction. The cell array includes first P-well regions and first N-well regions shaped in stripes extending in the bit line direction and arranged alternately in the word line direction. The SRAM cell is formed point-symmetrically in the first P-well region and the first N-well regions located on both sides thereof. The peripheral circuit includes second P-well regions and second N-well regions extending in the bit line direction and arranged alternately in the word line direction.

Abstract: During programming of storage elements, channel-to-floating gate coupling effects are compensated to avoid increased programming speed and threshold voltage distribution widening. In connection with a programming iteration, unselected bit lines voltages are stepped up to induce coupling to selected bit lines. Dedicated power supplies can be used to provide the step up to avoid a risk that the unselected bit lines begin floating due to pre-charging of other bit lines The selected bit lines are coupled higher as a function of their proximity to unselected bit lines, and in preparation for applying a program pulse. Coupling may be used for slow and fast programming modes. A dedicated power supply can be provided for driving slow programming mode bit lines at a level which provides coupling compensation.

Abstract: Magnetic memory elements such as Phase Change RAM and Spin Moment Transfer MRAM require high programming currents. These high programming currents require high gate to source/drain voltages for the cell transistors controlling these programming currents, which can degrade the reliability of these cell transistors. This invention describes a circuit and method to write information into individual memory cells while minimizing the gate voltage stress in the cell transistors of the memory cells in which no information is being written. The circuit of this invention has a separately controllable word line voltage supply for each row of the memory array and a separately controllable voltage supply for each bit line of the memory array. During the write operation the voltage is raised for the word line of only one row of the array. The bit line voltages are then adjusted so that a 1 is written into the desired cells in that row and a 0 is written into the desired cells in that row.

Abstract: A static random access memory device capable of preventing stability issues during a write operation is provided, in which a memory cell is coupled to a read word line, a write word line, a read bit line, a write bit line and a complementary write bit line, and a multiplexing unit is coupled to the read bit line, the write bit line and the complementary write bit line. The multiplexing unit applies first and second logic voltages representing a logic state stored in the memory cell to the write bit line and the complementary write bit line, respectively, when the memory cell is not selected to be written by an input signal from a data driver and the read word line is activated, in which the first and second logic voltages are opposite to each other.

Abstract: A semiconductor memory has a plurality of read amplifiers to which a pair each of two complementary bit lines is connected, wherein the semiconductor memory includes at least one switching element each for each bit line, by which at least a partial section of the bit line may be electrically decoupled from the read amplifier, and wherein the semiconductor memory controls the first switching element so that the first switching element, when reading out and/or refreshing any memory cell connected to the bit line, temporarily electrically decouples at least the partial section of the bit line from the read amplifier.

Abstract: A method for sensing the contents of a memory cell within a static random access memory (SRAM) includes holding a bit line associated with the memory cell at a zero voltage potential when the memory cell is not being accessed; energizing the bit line to a first voltage potential different than the zero voltage potential during an access of the memory cell; and sensing the memory cell contents when the associated bit line has reached the first voltage potential.

Abstract: Provided are an apparatus and method for writing data to a phase-change random access memory (PRAM) by using writing power calculation and data inversion functions, and more particularly, an apparatus and method for writing data which can minimize power consumption by calculating the power consumed while input original data or inverted data is written to a PRAM and storing the data consuming less power. A PRAM consumes a significant amount of power in order to store data in a memory cell since a large electric current is required to flow for a long period of time.

Abstract: A Static Random Access Memory (SRAM) cell having high stability and low leakage is provided. The SRAM cell includes a pair of cross-coupled inverters providing differential storage of a data bit. Power to the SRAM cell is provided by a read word line (RWL) signal, which is also referred to herein as a read control signal. During read operations, the RWL signal is pulled to a voltage level that forces the SRAM cell to a full-voltage state. During standby, the RWL signal is pulled to a voltage level that forces the SRAM cell to a voltage collapsed state in order to reduce leakage current, or leakage power, of the SRAM cell. A read-transistor providing access to the bit stored by the SRAM cell is coupled to the SRAM cell via a gate of the read transistor, thereby decoupling the stability of the SRAM cell from the read operation.

Abstract: A semiconductor memory device includes: a memory cell; a sense line; and a sense amplifier circuit connected to the memory cell via the sense line. The sense amplifier circuit includes a differential sense amplifier, a pull-up section, a read gate transistor, and a threshold correction section.

Abstract: Disclosed herein is a semiconductor integrated circuit including: a memory circuit section used for storing data; and a non-memory circuit section which is provided to serve as a section other than the memory circuit section and used for storing no data, wherein the second-conduction-type impurity concentration of a second-conduction-type semiconductor area including a channel created for a first-conduction-type transistor employed in the non-memory circuit section is lower than the second-conduction-type impurity concentration of a second-conduction-type semiconductor area including a channel created for a first-conduction-type transistor employed in the memory circuit section.

Abstract: Embodiments of a memory cell comprising a voltage module configured to supply a first supply voltage and a second supply voltage, a data node programming module configured to receive the first supply voltage and to program a data node based at least in part on a write data line, and a complementary data node programming module configured to receive the second supply voltage and to program a complementary data node based at least in part on a complementary write data line, wherein the voltage module is configured such that the first supply voltage is substantially different from the second supply voltage for a period of time while the memory device is being programmed. Additional variants and embodiments may also be disclosed and claimed.

Abstract: Provided is a nonvolatile semiconductor memory device which reads out a memory cell at high speed. A minute current source (105) is connected to a clamp NMOS transistor (103) for clamping a drain voltage of a memory cell (101), and a minute current is caused to flow through the clamp NMOS transistor (103). When the current does not flow through the memory cell (101), by causing the minute current to flow through the clamp NMOS transistor (103), the drain voltage of the memory cell (101) is prevented from rising. A bias voltage (BIAS) to be input to the clamp NMOS transistor (103) can be set high and the drain voltage of the memory cell (101) can also be high, and hence a current value of the memory cell (101) becomes larger and speed of sensing a current of a sense amplifier circuit (104) is improved.

Abstract: Voltage coupling/decoupling devices are provided within DRAM devices for improving the bias sensing of sense amplifiers and thus the refresh performance. The voltage coupling/decoupling devices couple or decouple bias voltage from corresponding digit lines coupled to the sense amplifiers. By coupling and decoupling voltage from the digit lines, the time interval between refresh operations can be increased.

Abstract: A memory cell for storing a binary state, the memory cell being adapted for storing a binary state based on a write indication and a binary write masking value and for storing a complementary binary state based on the write indication and a complementary binary write masking value.

Abstract: A memory chip and method for operating the same are provided. The memory chip includes a number of pads. The method includes inputting a number of first test signals to the pads respectively, wherein the first test signals corresponding to two physically-adjacent pads are complementary; inputting a number of second test signals, respectively successive to the first test signals, to the pads, wherein the first test signal and the second test signal corresponding to each of the pads are complementary; and outputting expected data from the memory chip if the first test signals and the second test signals are successfully received by the memory chip.

Abstract: A semiconductor memory device having high integration, low power consumption and high operation speed. The memory device includes a sense amplifier circuit having plural pull-down circuits and a pull-up circuit. A transistor constituting one of the plural pull-down circuits has a larger constant than that of a transistor constituting the other pull-down circuits, for example, a channel length and a channel width. The pull-down circuit having the larger constant transistor is activated earlier than the other pull-down circuits and the pull-up circuit, which are activated to conduct reading. The data line and the earlier driven pull-down circuit are connected by an NMOS transistor and the NMOS transistor is activated or inactivated to control the activation or inactivation of the pull-down circuit.

Abstract: A novel memory reading circuit includes a bit line for transmitting data bits within the memory, a plurality of storage elements for storing bits of data, and a precharge circuit coupled to the bit line for charging the bit line when the precharge circuit is in a charging state, the precharge circuit being operative to remain in the charging state at time when the storage elements assert the stored bits of data on the bit line. The memory may be a single-ended, static random access memory (“SRAM”). The SRAM circuits of the invention may be incorporated into each of a plurality of individual computers arrayed on a single die.

Abstract: A layout structure of bit line sense amplifiers for use in a semiconductor memory device includes first and second bit line sense amplifiers arranged to share and be electrically controlled by a first column selection line signal, and each including a plurality of transistors. In this layout structure, each of the plurality of transistors forming the first bit line sense amplifier is arranged so as not to share an active region with any transistors forming the second bit line sense amplifier.

Abstract: A memory cell 36 within an integrated circuit memory is provided with an access controller 32 coupled to a first pass gate 38 and a second pass gate 40. During a write access to the memory cell 38 both the first pass gate 38 and the second pass gate 40 are opened. During a read access, the first pass gate 38 is opened and the second pass gate 40 is closed. This asymmetry in the read and write operations permits an asymmetry in the gates forming the memory cell 36 thereby permitting changes to increase both read robustness and write robustness. The asymmetry in the design parameters of different gates can take the form of varying the gate length, the gate width and the threshold voltage so as to vary the conductance of different gates to suit their individual role within the memory cell 36 which is operating in the asymmetric manner provided by the separate word line signals driving read operations and write operations.

Abstract: A semiconductor memory device and a method for operating the same can improve a refresh characteristic of the semiconductor memory device by physically writing only logic low data in memory cells, irrespective of logic level of input data, either high or low. The semiconductor memory device includes a positive word line configured to control a first memory cell connected to a positive bit line, a negative word line configured to control a second memory cell connected to a negative bit line, and a word line control circuit configured to enable one of the positive word line and the negative word line according to a logic level of data in a write operation.

Abstract: A dynamic random access memory (DRAM) having pairs of bitlines, each pair being connected to a first bit line sense amplifier, wordlines crossing the bitlines pairs forming an array, charge storage cells connected to the bitlines, each having an enable input connected to a wordline, the bit line sense amplifiers being connected in a two dimensional array, pairs of primary databuses being connected through first access transistors to plural corresponding bit line sense amplifiers in each row of the array, apparatus for enabling columns of the first access transistors, databus sense amplifiers each connected to a corresponding data bus pair, a secondary databus, the secondary databus being connected through second access transistors to the databus sense amplifiers, and apparatus for enabling the second access transistors, whereby each the primary databus pair may be shared by plural sense amplifiers in a corresponding row of the array and the secondary databus may be shared by plural primary databus pairs.

Abstract: A method for sensing the contents of a memory cell within a static random access memory (SRAM) includes holding a bit line associated with the memory cell at a zero voltage potential when the memory cell is not being accessed; energizing the bit line to a first voltage potential different than the zero voltage potential during an access of the memory cell; and sensing the memory cell contents when the associated bit line has reached the first voltage potential.

Abstract: A memory circuit includes a memory cell, a pair of conducting lines operable to signal the logic state of the memory cell and read circuitry operable to perform a read operation by detecting a voltage level of at least one of the pair of conducting lines. The memory circuit includes a pull-down circuit having an on configuration in which it is operable to pull-down a voltage level of at least one of the pair of conducting lines so as to affect the read operation and an off-configuration in which the pull-down circuit cannot affect the read operation. Control circuitry is configured to control whether the pull-down circuit is in the on configuration or the off configuration. The memory circuit can be incorporated in a data processing apparatus and a method of operating a memory circuit is provided in which a pull-down circuit is controlled to be in an on configuration or in an off configuration.

Abstract: A semiconductor memory device includes a plurality of memory cell array blocks, a bit line sense amplifier, a local sense amplifier that can be controlled to be turned on or off, a data sense amplifier, and a controller. The controller activates a local sense control signal for a predetermined duration in response to first and second signals. The first signal is a bit line sense enable signal that activates the bit line sense amplifier, and the local sense amplifier is activated for a predetermined duration after the bit line sense enable signal is activated. The second signal is activated or deactivated in phase with a column selection line signal that connects a pair of bit lines and a pair of local input/output lines. Accordingly, it is possible to turn on or off the local sense amplifier according to operating conditions, thereby increasing a tRCD parameter and reducing the consumption of current.

Abstract: A static random access memory device capable of preventing stability issues during a write operation is provided, in which a memory cell is coupled to a read word line, a write word line, a read bit line, a write bit line and a complementary write bit line, and a multiplexing unit is coupled to the read bit line, the write bit line and the complementary write bit line. The multiplexing unit applies first and second logic voltages representing a logic state stored in the memory cell to the write bit line and the complementary write bit line, respectively, when the memory cell is not selected to be written by an input signal from a data driver and the read word line is activated, in which the first and second logic voltages are opposite to each other.

Abstract: A system and method for erasing a block of data in a plurality of memory cells includes clamping one of a digit line and an I/O line in a sensing circuit of a memory device to a fixed logic level. The memory cells of the block of memory cells are selected and refreshed to the fixed logic level. A sense amplifier includes a clamping circuit adapted to connect one of a digit line and an I/O line to a fixed logic level in response to an erase signal during a refresh of the selected block of memory cells.

Abstract: A memory circuit includes a latch having a first node and a second node to store data such that a logic level of the first node is an inverse of a logic level of the second node, a MIS transistor having a gate node, a first source/drain node, and a second source/drain node, the first source/drain node coupled to the first node of the latch, and a control circuit configured to control the gate node and second source/drain node of the MIS transistor in a first operation such that a lingering change is created in transistor characteristics of the MIS transistor in response to the data stored in the latch, wherein the MIS transistor includes a highly-doped substrate layer, a lightly-doped substrate layer disposed on the highly-doped substrate layer, diffusion regions formed in the lightly-doped substrate layer, a gate electrode, sidewalls, and an insulating film.

Abstract: A high-speed double or quadrature data rate interface semiconductor device and a method thereof are provided. A transmitter (e.g., a data transmitting semiconductor device) for high-speed data transmission transmits a first strobe signal and a second strobe signal, which have a phase difference of 90 degrees there-between, a first group (byte of) data, and a second group (byte of) data. The transmitter adjusts the phase of at least one of the first and second strobe signals based on phase-error information fed back from a receiver and then transmits the phase-adjusted strobe signal to the receiver. The receiver receives the first and second strobe signals from the transmitter and receives the first group (byte of) data and the second group (byte of) data using the first and second strobe signals. The receiver does not require a phase-locked loop (PLL) or a delay-locked loop (DLL), thereby decreasing the circuit area and power consumption of the receiver.

Abstract: Methods and systems to write to redundant storage latches, or storage cells, including soft error upset tolerant latches and feedback-interlocked redundant storage cells, including to write a logic value to one of a plurality of same sense storage nodes, and to write a complementary logic value to a selected one of a plurality of opposite sense storage nodes responsive to the logic value. Remaining storage nodes may be written to through circuitry within the storage cell. Logic values may be output substantially simultaneously with corresponding write operations. A system may include a multiple logic level write circuit to write to the first same sense storage node, and first and second single logic level write circuits to write to the first and second opposite sense storage nodes, respectively.

Abstract: An electro-optical device includes an X address decoder that selects one of plural X selection lines, a Y address decoder that selects one of plural Y selection lines, and plural pixel blocks. Each pixel block is provided with respect to an intersection of a corresponding X selection line and a corresponding Y selection lines. Each pixel block includes a pixel circuit and the pixel circuits corresponding to a column share a bit line and a complementary bit line. Each pixel circuit includes a memory circuit, a selection circuit, and a pixel electrode. The memory circuit includes plural transistors that become conductive between the bit line, the complementary bit line, and terminals of the memory circuit at the time of concurrent selection of an X selection line and a Y selection line corresponding to the pixel block to which the plural transistors belong.

Abstract: Systems and methods for reducing the latency of data transfers between memory cells by enabling data to be transferred directly between sense amplifiers in the memory system. In one embodiment, a memory system uses a conventional DRAM memory structure having a pair of first-level sense amplifiers, a second-level sense amplifier and control logic for the sense amplifiers. Each of the sense amplifiers is configured to be selectively coupled to a data line. In a direct data transfer mode, the control logic generates control signals that cause the sense amplifiers to transfer data from a first one of the first-level sense amplifiers (a source sense amplifier) to the second-level sense amplifier, and from there to a second one of the first-level sense amplifiers (a destination sense amplifier.) The structure of these sense amplifiers is conventional, and the operation of the system is enabled by modified control logic.

Abstract: A memory has an array of memory cells, column logic, a write driver, a voltage detector, and a bootstrap circuit. The array of memory cells is coupled to pairs of bit lines and word lines. The column logic is coupled to the array and is for coupling a selected pair of bit lines to a pair of data lines. The write driver is coupled to the pair of data lines. The voltage detector provides an initiate boost signal when a voltage of a first data line of the pair of data lines drops below a first level during the writing of the pair of data lines by the write driver. The bootstrap circuit reduces the voltage of the first data line in response to the boost enable signal. This is particularly beneficial when the number of memory cells on a bit line can vary significantly as in a compiler.

Abstract: Methods and apparatus provide for testing an SRAM cell, the SRAM cell including an anti-parallel storage circuit operable to store a logic high or low value across a true node and a complementary node, where the true node and complementary node are coupled to a true bit line (BLT) and a complementary bit line (BLC), by first and second transistors, respectively, the method including: preventing a write driver circuit from significantly pulling the BLT towards a supply voltage; preventing a pre-charge circuit from significantly pulling the BLT towards the supply voltage; preventing the first transistor from significantly pulling the BLT towards the voltage stored in the SRAM cell; and comparing the voltage of the BLT under the foregoing conditions to a threshold voltage.

Abstract: The semiconductor storage device according to the present invention comprises a switch provided to a bit line between a memory cells and a sense amplifier and capable of continuously varying a degree of conduction; and a switch control circuit for varying the degree of conduction of the switch in accordance with an access request signal. The semiconductor storage device of the present invention enables operation in which the degree of conduction between the sense amplifier and a memory cell is increased, and an ON state is achieved during a time in which the sense amplifier amplifies the holding voltage of the memory cell and feeds the amplified holding voltage to the bit line. The access time can thereby be reduced.

Abstract: A semiconductor memory device includes a sense amplifier, a sense amplifier driving signal driver, and a controller. The sense amplifier is configured to sense and amplify a signal of a bit line and a signal of a complementary bit line in response to a sense amplifier driving signal. The sense amplifier driving signal driver includes a first driving signal driver configured to drive via a transmission line the sense amplifier driving signal in response to a first sense amplifier control signal, and a second driving signal driver configured to drive via the transmission line the sense amplifier driving signal in response to a second sense amplifier control signal. The controller activates the first sense amplifier control signal in response to an active command, and toggles the second sense amplifier control signal while the first sense amplifier control signal is activated.

Abstract: A bit line precharge circuit capable of improving bit line precharge operation includes a first precharge element for precharging a first bit line in response to a first precharge signal, a precharge unit for precharging second and third bit lines in response to a second precharge signal, and a second precharge element for precharging a fourth bit line in response to a third precharge signal.

Abstract: A static random access memory (SRAM) device a pair of cross-coupled, complementary metal oxide semiconductor (CMOS) inverters configured as a storage cell for a bit of data, a first pair of transfer gates configured to couple complementary internal nodes of the storage cell to a corresponding pair of bitlines during a read operation of the device; and a second pair of transfer gates configured to couple the storage cell nodes to the pair of bitlines during a write operation of the device, wherein impedance between the bitlines and the storage cell nodes during the write operation is less than that for the read operation, wherein impedance between the bitlines and the storage cell nodes during the write operation is less than that for the read operation.

Abstract: A dynamic random access memory (DRAM) having pairs of bitlines, each pair being connected to a first bit line sense amplifier, wordlines crossing the bitlines pairs forming an array, charge storage cells connected to the bitlines, each having an enable input connected to a wordline, the bit line sense amplifiers being connected in a two dimensional array, pairs of primary databuses being connected through first access transistors to plural corresponding bit line sense amplifiers in each row of the array, apparatus for enabling columns of the first access transistors, databus sense amplifiers each connected to a corresponding data bus pair, a secondary databus, the secondary databus being connected through second access transistors to the databus sense amplifiers, and apparatus for enabling the second access transistors, whereby each the primary databus pair may be shared by plural sense amplifiers in a corresponding row of the array and the secondary databus may be shared by plural primary databus pairs.

Abstract: A method and circuit for implementing domino static random access memory (SRAM) local evaluation with enhanced SRAM cell stability, and a design structure on which the subject circuit resides are provided. A SRAM local evaluation circuit enabling a read and write operations of an associated SRAM cell group includes true and complement bitlines, true and complement write data propagation inputs, a precharge signal, and a precharge write signal. A respective precharge device is connected between a voltage supply VDD and the true bitline and the complement bitline. A first passgate device is connected between the complement bitline and the true write data propagation input. A second passgate device is connected between the true bitline and the complement write data propagation input. The precharge write signal disables the passgate devices during a read operation. During write operations, the precharge write signal enables the passgate devices.

Abstract: A design structure embodied in a machine readable medium used in a design process for small signal sensing during a read operation of a static random access memory (SRAM) cell includes coupling a pair of complementary sense amplifier data lines to a corresponding pair of complementary bit lines associated with the SRAM cell, and setting a sense amplifier so as to amplify a signal developed on the sense amplifier data lines, wherein the bit line pair remains coupled to the sense amplifier data lines at the time the sense amplifier is set.

Abstract: A method and circuit for implementing domino static random access memory (SRAM) local evaluation with enhanced SRAM cell stability, and a design structure on which the subject circuit resides are provided. A SRAM local evaluation circuit enabling a read and write operations of an associated SRAM cell group includes true and complement bitlines, a single write data propagation input, a precharge signal, and a precharge write signal. A passgate device is connected between the complement bitline and the write data propagation input. A transistor stack is connected in series with the precharge device between the true bitline and ground. The precharge write signal disables the passgate device connected between the complement bitline and the write data propagation input during a read operation. During write operations, the precharge write signal enables the passgate device connected between the complement bitline and the write data propagation input and activates the transistor stack.

Abstract: Provided are a nonvolatile memory and an apparatus and method for deciding data validity for the same, in which validity of data stored in the nonvolatile memory can be decided. The nonvolatile memory includes a memory cell storing data bits in a plurality of pages included in a predetermined block through a plurality of states realized by at least two bits. The block includes a first page in which data bits for determining validity of data bits written by a user are stored, and a second page in which the data bits written by the user are stored.

Abstract: In a memory cell having a first and a second load transistor, a first and a second drive transistor, and a first and a second access transistor, a third access transistor provided between a first bit line and a first memory node and having a gate terminal connected to a first column line and a fourth access transistor provided between a second bit line and a second memory node and having a gate terminal connected to a second column line, are additionally provided.

Abstract: A semiconductor device (DRAM) according to one embodiment of the present invention includes a plurality of pairs of digit lines (digit True, Not) connected to a memory cell, a common signal line pair (main I/O True, Not) connected to the plurality of pairs of digit lines in common, a main I/O equalizer performing precharge of the common signal line pair, and a control circuit determining whether the precharge operation is continued irrespective of a signal level of a mask signal input from an outside.

Abstract: Methods and apparatus provide for controlling an SRAM memory, the SRAM memory including a plurality of memory cells arranged in an array of rows (word lines) and columns (bit lines), comprising: inverting a state of data for input to one or more columns of the array; and storing the inverted data in one or more memory cells of the one or more columns.

Abstract: Content-addressable memory (CAM) cells comprised of phase change material devices (PCMDs), including PCMD-based binary CAM cells (PCMD-based BCAM cells), PCMD-based ternary CAM cells (PCMD-based TCAM cells), and PCMD-based universal CAM cells (PCMD-based UCAM cells). The PCMDs of the various PCMD-based CAM cells are configured and programmed in a manner that allows a logic “0” or a logic “1” to be stored by the CAM cell. The logic value stored by a given PCMD-based CAM cell depends on the program states of the PCMDs. A program state of a PCMD is determined by whether the phase change material of the PCMD has been allowed to solidify to a crystalline, low-resistance state during a programming operation, or whether the phase change material of the PCMD is forced to solidify to an amorphous, high-resistance state during the programming operation.

Abstract: A maskable data output buffer includes an output stage receiving data signals from a data coder. The signals output from the data coder are normally complementary data signals corresponding to complementary data input signals. However, in response to receiving a mask signal, the data coder forces the output signals to be other than complementary. The output stage normally generates a data output signal corresponding to the complementary data input signals. However, when the data input signals are other than complementary, the output of the output stage assumes a high impedance condition. Since the timing of the high impedance condition is determined from the data signals themselves, the timing of the mask operation is inherently properly timed to the output of the data from the data output buffer.