Abstract: Methods of operating memory devices include storing data of a first type in a first set of logical erase blocks and storing data of a second type in a second set of logical erase blocks. The logical erase blocks of the first set of logical erase blocks each have a first size the logical erase blocks of the second set of logical erase blocks each have a second size different than the first size.

Abstract: A method of operating a semiconductor device is provided including applying a constant source voltage to a source line.

Abstract: An integrated circuit includes memory segments, each having at least one memory cell configurable in first and second states to store data, and a controller that controls programming and erasing of the memory segments. The controller maps external memory addresses of write data to internal memory addresses of erased memory segments with no memory cells in the first state such that erased memory segments are programmed with write data. When a write access occurs for an external memory address previously mapped to an internal memory address of a programmed memory segment with at least one memory cell in the first state, the controller remaps the external memory address to another internal memory address of an erased memory segment. The controller identifies programmed memory segments to be erased and controls selective erasure of the identified programmed memory segments, such as programmed memory segments no longer mapped to an external memory address.

Abstract: The present invention is related to a composite flash memory device comprises a plural sector flash memory array which is divided to plural sector that is a minimum erasing unit of the flash memory device, a flash memory array storing control commands which control a total system of the composite flash memory device and/or the only composite flash memory device in and sharing I/O line of the plural sector flash memory array, the read operation of the flash memory array is enable when the plural sector flash memory array is gained access.

Abstract: Provided is a method of operating a semiconductor device, in which a gate voltage or a drain voltage is adjusted in order to add carriers to or remove carriers from a body region, thereby realizing semiconductor having a plurality of data states.

Abstract: A nonvolatile semiconductor memory device comprises a cell array including plural MATs (unit cell arrays) arranged in matrix, each MAT containing a plurality of first lines, a plurality of second lines intersecting the plurality of first lines, and a plurality of memory cells connected at intersections of the first and second lines between both lines, each memory cell containing an electrically erasable programmable variable resistive element of which resistance is nonvolatilely stored as data; and a plurality of write/erase circuits connected to the MATs and operative to execute data write or erase to the memory cells inside the MATs in accordance with input data. A part of the plurality of write/erase circuits writes data to memory cells inside a corresponding MAT while another part of the plurality of write/erase circuits erases data from memory cells inside a corresponding MAT at the same time.

Abstract: There is provided a non-volatile memory having electrically rewritable non-volatile memory cells arranged therein. A controller controls operation at the non-volatile memory. The non-volatile memory comprises a status output section configured to output status information indicating a status of read operation, write operation or erase operation in the non-volatile memory cell. The controller comprises a control signal generating section configured to output a control signal for a certain operation in the non-volatile memory, and a control signal switching section configured to instruct the control signal generating section to switch the control signal based on the status information.

Abstract: Disclosed is a 3D memory device including a first plane having a first mat formed on a first layer and a third mat formed on a second layer disposed over the first layer, the first and third mats sharing a bit line, and a second plane having a second mat formed on the first layer and a fourth mat formed on the second layer. The second and fourth mats share a bit line. Each one of the first through fourth mats includes a plurality of blocks and a block associated with the first plane is simultaneously accessed with a block of the second plane.

Abstract: Nonvolatile semiconductor memory device of an embodiment includes: a memory cell array including a plurality of first and second lines intersecting each other and plural memory cells provided at intersections of the first and second lines and having data written and erased upon application of voltages of the same polarity; and a writing circuit configured to select first and second lines and supply a set or reset pulse to the memory cell through the selected first and second lines. In an erase operation, the writing circuit repeatedly supplies the reset pulse to a selected memory cell until data is erased, by increasing or decreasing voltage level and voltage application time of the reset pulse within a reset region. The reset region, or an aggregate of combinations of voltage level and voltage application time of the reset pulse, is a region where voltage level and voltage application time are negatively correlated.

Abstract: A method for conducting an over-erase correction describes the steps of: conducting a first erase and verification operation; using an FN soft program to correct over-erased cells if bit line leakage is found after the first erase and verification operation; conducting a second erase and verification operation; and using a hot carrier HC soft program to correct over-erased cells if bit line leakage is found after the second erase and verification operation.

Abstract: A semiconductor magnetic memory device has a magnetic tunneling junction formed over a memory cell. The memory cell has a control gate surrounded by a floating gate. The floating gate is coupled to the magnetic tunneling junction through a pinning layer that maintains the magnetic orientation of the lower magnetic layer of the junction. A current through a selected word line, coupled to the control gate, generates a first magnetic field. A current through a cell select line generates a second magnetic field that is orthogonal to the first magnetic field. This changes the magnetic orientation of the upper magnetic layer of the junction to lower its resistance, thus allowing a write/erase voltage on a program/erase line to program/erase the floating gate.

Abstract: A non-volatile memory (NVM) system includes a plurality of NVM cells fabricated in a dual-well structure. Each NVM cell includes an access transistor and an NVM transistor, wherein the access transistor has a drain region that is continuous with a source region of the NVM transistor. The drain regions of each NVM transistor in a column of the array are commonly connected to a corresponding bit line. The control gates of each NVM transistor in a row of the array are commonly connected to a corresponding word line. The source regions of each of the access transistors in the array are commonly coupled. The NVM cells are programmed and erased without having to apply the high programming voltage VPP across the gate dielectric layers of the access transistors. As a result, the NVM cells can be scaled down to sub-0.35 micron geometries.

Abstract: A ferroelectric memory device having a NAND array of a plurality of ferroelectric memory cells includes: a fully depleted channel layer; a gate electrode layer; and a ferroelectric layer located between the channel layer and the gate electrode layer. The data of the plurality of ferroelectric memory cells is erased by applying a first erase voltage to a bit line and a common source line and applying a second erase voltage to a string selection line and a ground selection line.

Abstract: One embodiment of the technology is an apparatus, a memory integrated circuit. The memory integrated circuit has word line address decoding circuitry. The circuit allows selection of a single word line to have an erase voltage. A decoder circuit includes an inverter and logic. The inverter has an input, and an output controlling a word line to perform the erase operation. A voltage range of the input extends between a first voltage reference and a second voltage reference. Examples of voltages references are a voltage supply and a ground. In some embodiments, this wide voltage range results from the input being free of a threshold voltage drop from preceding circuitry limiting the voltage range of the input. The logic of the decoder is circuit is controlled by a word line address to determine a value of the input of the inverter during the erase operation.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array and a control circuit. The memory cell array includes a plurality of first wirings, a plurality of second wirings intersecting the plurality of first wirings, and a plurality of memory cells provided at the intersections of the plurality of first and second wirings and each including a non-ohmic element and a variable resistance element connected in series. The control circuit selects one of the plurality of memory cells, generates an erasing pulse for erasing data from the selected memory cell, and supplies the erasing pulse to the selected memory cell. The control circuit executes data erase by applying a voltage of the erasing pulse to the non-ohmic element in the reverse bias direction.

Abstract: A controller repeats an erase operation, an erase verify operation, and a step-up operation. A first storage unit stores a value of an erase start voltage applied first as an erase voltage when a series of erase operations are executed. A second storage unit stores a value of an erase completion voltage which is an erase voltage when erasure of data is finished in the erase operation and the erase verify operation. A first comparator compares the erase completion voltage with the erase start voltage each time the erase operation is executed. When the first comparator determines that the erase completion voltage is larger than the erase start voltage, a counter counts up a count value. When the count value becomes larger than a predetermined value, a second comparator updates a value of the erase start voltage stored in the first storage unit.

Abstract: A semiconductor device includes: a first sector (12) having data that are all to be erased and having flash memory cells; a second sector (14) having data that are all to be retained and having flash memory cells; a sector select circuit (16) selecting a pair of sectors from among sectors during erasing the data in the first sector, said pair of sectors being the first sector and the second sector; and an SRAM array (storage) (30) retaining the data of the second sector. The present invention can provide a semiconductor device in which a reduced number of sector select circuits is used so that the area of memory cell array can be reduced and provide a method of controlling the semiconductor device.

Abstract: A semiconductor memory device includes a memory cell array configured as an arrangement of memory cells each arranged between a first line and a second line and each including a variable resistor. A control circuit controls a voltage applied to the first line or the second line. A current limiting circuit limits a current flowing through the first line or the second line to a certain upper limit or lower. In a case where a writing operation or an erasing operation to a memory cell is implemented a plural number of times repeatedly, the current limiting circuit sets the upper limit in the writing operation or erasing operation of the p-th time higher than the upper limit in the writing operation or erasing operation of the q-th time (q<p).

Abstract: A semiconductor device includes: a first sector (12) having data that are all to be erased and having flash memory cells; a second sector (14) having data that are all to be retained and having flash memory cells; a sector select circuit (16) selecting a pair of sectors from among sectors during erasing the data in the first sector, said pair of sectors being the first sector and the second sector; and an SRAM array (storage) (30) retaining the data of the second sector. The present invention can provide a semiconductor device in which a reduced number of sector select circuits is used so that the area of memory cell array can be reduced and provide a method of controlling the semiconductor device.

Abstract: In one aspect of the present invention, a memory apparatus comprises a plurality of resettable memory cells, a plurality of memory units, and a reset information propagation logic coupled to the resettable memory cells and the memory units. The reset information propagation logic designed to write reset information into a portion of the memory units in response to one of the resettable memory cells having a reset value when one of the memory units is written into.

Abstract: A memory having isolated dual memory cells is provided. A first isolation wall and a second isolation wall are separately disposed between a source and a drain on a substrate. An isolation bottom layer and a polysilicon layer are orderly disposed on the substrate between the first and the second isolation walls. A first charge storage structure and a first gate are orderly disposed on the substrate between the first isolation wall and the source. A second charge storage structure and a second gate are orderly disposed on the substrate between the second isolation wall and the drain. A word line disposed on the polysilicon layer, the first gate, the second gate, the first isolation wall and the second isolation wall is electrically connected to the first gate, the second gate and the polysilicon layer.

Abstract: A method is provided for block writing in an electrically programmable non-volatile memory, in which a block to be written in the memory includes at least one word. The method includes determining a word write time by dividing a fixed block write time by the number of words in the block to be written, and controlling the memory to successively write each word in the memory during the write time.

Abstract: A memory utilizes a data refresh algorithm to preserve data integrity over disturbances caused by memory programming or erase operations. The memory device maintains a counter for each memory block or sector. When a memory block or sector is erased or programmed, the associated counter is set to a first value while other counters are incremented or decremented. Whenever a counter reaches a threshold value, the associated block or sector is refreshed. The threshold value is set to ensure that each block or sector is refreshed before data integrity is adversely affected by disturbances caused by repeated programming and erase operations.

Abstract: A method of processing an array of non-volatile memory cells to program or erase the same, by applying a voltage to the same through a program and verify pulse application circuit. The process includes a first step of selecting a voltage to be applied. Then, the maximum number of memory cells that can be processed simultaneously is determined, based on the selected voltage and characteristics of the memory cells and the circuit. The array is divided into processing groups, each group having a number of cells less than or equal to the maximum determined number. Finally, the voltage is applied to the cells.

Abstract: Flash memory systems and methodologies are provided for providing multiple virtual ground decoding schemes in a flash device. The flash device can include sector configure registers for selecting a specific ground scheme at sector level. The sector configure registers can select a decoding scheme from multiple virtual ground decoding schemes including a conventional dual bit decoding scheme and a single program and erase entity decoding scheme. Since the single program and erase entity decoding scheme can emulate EEPROM functionality in a flash device, the combination of the conventional dual bit decoding scheme and the single program and erase entity decoding scheme can provide both dual bit high density storage and EEPROM emulation in a single flash device.

Abstract: Charge pump and discharge circuitry for a non-volatile memory device that splits up the discharge operation into two discharge periods. In a first discharge period, the voltage being discharged (e.g., erase voltage) is discharged through a pair of discharge transistors until the discharging voltage reaches a first voltage level. The path through the pair of discharge transistors is controlled by an intermediate control voltage so that none of the transistors of the pair enter the snapback condition. In the second discharge period, the remaining discharging voltage is fully discharged from the first level through a third discharge transistor.

Abstract: A nonvolatile semiconductor memory device comprises a memory cell array of electrically erasable programmable nonvolatile memory cells arranged in matrix, each memory cell using a variable resistor. A pulse generator is operative to generate plural types of write pulses for varying the resistance of the variable resistor in three or more stages based on ternary or higher write data. A selection circuit is operative to select a write target memory cell from the memory cell array based on a write address and supply the write pulse generated from the pulse generator to the selected memory cell.

Abstract: In a method of operating a nonvolatile memory device, at least one among memory cell blocks of the nonvolatile memory device is designated as a content addressable memory (CAM) block which includes a plurality of CAM cells coupled to respective word lines of the nonvolatile memory device. Chip information for operations of the nonvolatile memory device is stored in the CAM cells which are coupled to a selected word line, whereas the remaining CAM cells of the CAM block are in an erased state.

Abstract: Non-volatile (NV) semiconductor memories and methods of operating the same to reduce or eliminate a need for an external capacitance are provided. In one embodiment, the memory includes a memory cell comprising a random access memory (RAM) portion and a NV memory portion, and the method comprises steps of: (i) initially erasing the NV memory portion; and (ii) on detecting a drop in power supplied to the memory, programming the NV memory portion with data from the RAM portion while powering the memory from a capacitor. On restoration of power data is recalled from the NV memory portion into the RAM portion, and the NV memory portion erased. Preferably, the capacitor is integrally formed on a single substrate with the NV memory portion and RAM portion. More preferably, the capacitor comprises intrinsic capacitance between elements of the memory formed on the substrate. Other embodiments are also disclosed.

Abstract: Integrated circuits such as programmable logic device integrated circuits are provided that have configuration random-access memory elements. The configuration random-access memory elements are loaded with configuration data to customize programmable logic on the integrated circuits. Each memory element has a capacitor that stores data for that memory element. A pair of cross-coupled inverters are connected to the capacitor. The inverters ensure that the memory elements produce output control signals with voltages than range from one power supply rail to another. Each configuration random-access memory element may have a clear transistor. The capacitor may be formed in a dielectric layer that lies above the transistors of the inverters, the address transistor, and the clear transistor. The inverters may be powered with an elevated power supply voltage.

Abstract: A system and method comprising a non-volatile memory including one or more memory blocks to store data, a controller to allocate one or more of the memory blocks to store data, and a wear-leveling table populated with pointers to unallocated memory blocks in the non-volatile memory, the controller to identify one or more pointers in the wear-leveling table and to allocate the unallocated memory blocks associated with the identified pointers for the storage of data.

Abstract: Methods and devices are provided for concurrent intersymbol interference encoding in a solid state memory. In an illustrative embodiment, a write data signal is received as input to a processing component. A channel-effect-corrected encoding of the write data signal is produced, where the channel-effect-corrected encoding is based on the write data signal and a channel effect factor that models concurrent intersymbol interference of the write data signal in a target data storage component in communicative connection with the processing component. An output signal based on the channel-effect-corrected encoding of the write data signal is produced from the processing component.

Abstract: A NROM memory device includes an array of memory cells and first and second bit lines. The first and second bit lines are coupled to opposite sides of the memory cells. During an erase operation, one of the sides of the memory cells receives a positive voltage and the other side couples to a common node or a limited current source. Methods are also disclosed that can easily screen for marginal memory cells based on a threshold voltage distribution of the memory cells.

Abstract: In bit alterable memories, a particular header of a particular block may be programmed to a particular code to indicate that the block is to be considered empty. This saves the time of resetting all the bits in both the header and the data section of the block.

Abstract: A non-volatile memory device includes a first metal-oxide-semiconductor (CMOS) device coupled to a bit line and a word line and a second CMOS device coupled to the first CMOS device. The second CMOS device is also coupled to a complementary bit line and a complementary word line. The first and second CMOS devices are complementary to one another. An output node is coupled between the first CMOS device and the second CMOS device. A method of programming a non-volatile field programmable gate array (NV-FPGA) includes coupling an information handling system to the FPGA, performing a block erase of a plurality of memory cells in the FPGA, verifying that the block erase is successful, programming an upper page of the FPGA, verifying that the upper page programming is successful, programming a lower page of the FPGA and verifying that the lower page programming is successful.

Abstract: A method of driving a variable resistance element includes: a writing step performed by applying a writing voltage pulse having a first polarity to a variable resistance layer to change a resistance state of the layer from high to low; and an erasing step performed by applying an erasing voltage pulse having a second polarity to the layer to change the state from low to high. Here, |Vw1|>|Vw2| where Vw1 represents a voltage value of the writing voltage pulse for first to N-th writing steps (N?1) and Vw2 represents a voltage value of the writing voltage pulse for (N+1)-th and subsequent writing steps, and |Ve1|>|Ve2| where Ve1 represents a voltage value of the erasing voltage pulse for first to M-th erasing steps (M?1) and Ve2 represents a voltage value of the erasing voltage pulse for (M+1)-th and subsequent erasing steps. The (N+1)-th writing step follows the M-th erasing step.

Abstract: A manufacturing method, remanufacturing method and reshipping method for a semiconductor memory device capable of preventing the charge hold characteristic from deteriorating even if information data is repeatedly written and erased. The manufacturing method is for a semiconductor memory device having a plurality of memory cells in an FET structure formed on a semiconductor substrate, wherein each of the plurality of memory cells is to store a unit bit and hold information data. Preparing a plurality of memory cells, bits of the information data are written to the memory cells. After writing the information data bits to the memory cells, the memory cells are allowed to stand at a predetermined ambient temperature for a predetermined time. Thereafter, bits of the information data are written to the memory cells.

Abstract: Methods of performing multi-block erasing operations on a memory device that includes a plurality of memory blocks are provided. Pursuant to these methods, the rate at which a first voltage that is applied to the memory blocks that are to be erased during the multi-block erasing operation rises is controlled based on the number of memory blocks that are to be erased. The memory device may be a flash memory device, and the first voltage may be an erasing voltage that is applied to a substrate of the flash memory device. The rate at which the first voltage rises may be set so that the substrate of the flash memory device reaches the erasing voltage level at approximately the same time regardless of the number of memory blocks that are to be erased.

Abstract: In a method of operating a nonvolatile memory device, data is read using a read level, and a range of logic values for erasure-decoding the read data is set. The bits of the read data corresponding to the set range of logic values are set as erasure bits, and an erasure decoding operation is performed.

Abstract: A memory device includes a memory cell array including a plurality of memory blocks, each memory block including a plurality of memory cells, a plurality of word lines coupled to rows of the plurality of memory cells, a plurality of bit lines coupled to columns of the plurality of memory cells, and a control unit controlling an erase operation so that erase data is simultaneously written in the plurality of memory cells corresponding to an erase unit. A first erase mode may include a first erase unit and a first erase data pattern. A second erase mode may include a second erase unit and a second erase pattern. At least one of the first and second erase units and the first and second erase data patterns are different.

Abstract: A microcomputer capable of on-board programming of dedicated user communication protocols without requiring a serial interface on the mounted board, and that will not destroy the dedicated user communication protocol code even if the system runs out of control. A user boot mat other than a user mat is provided for programming control programs for the user in the on-chip non-volatile memory of the microcomputer. The user boot mat serves as the mat for programming the dedicated user communication protocol and also provides a user boot mode for running the program. The user boot mat cannot program or erase in this user boot mode. By separating the user boot mat and user mat, an interface capable of programming and erasing the user-specified programming can be achieved without having to program a dedicated communication protocol on the user mat.

Abstract: A nonvolatile semiconductor memory device includes a semiconductor substrate having a source, a drain, and a channel region between the source and the drain. The channel region has a first end portion near the drain, a second end portion near the source, and a middle portion between the first and second end portions. The first and second end portions having approximately same width. The memory device is electrically erased by using a hot carrier generated in the first end portion due to avalanche breakdown. The channel region includes a first channel extending from the drain and a second channel adjacent to the first channel. An impurity concentration of the second channel is higher than that of the first channel. An interface between the first and second channels is located in the middle portion between the first and second end portions.

Abstract: Non-volatile memory devices logically organized to have erase blocks of at least two different sizes provide for concurrent erasure of multiple physical blocks of memory cells, while providing for individual selection of those physical blocks for read and program operations. In this manner, data expected to require frequent updating can be stored in locations corresponding to first erase blocks having a first size while data expected to require relatively infrequent updating can be stored in locations corresponding to second erase blocks larger than the first erase blocks. Storing data expected to require relatively more frequent updating in smaller logical memory blocks facilitates a reduction in unnecessary erasing of memory cells. In addition, by providing for larger logical memory blocks for storing data expected to require relatively less frequent updating, efficiencies can be obtained in erasing larger quantities of memory cells concurrently.

Abstract: Flash memory systems and methodologies are provided herein for facilitating a single logical cell erasure and dynamic erase state. The single logical cell erasure can be accomplished on a basis of a single program and erase entity which is a combination of neighboring drain/source regions of two adjacent physical memory cells. The dynamic erase state can involve an indicator bit that indicates an erase direction of a low voltage state or a high voltage state. The single logical cell erasure can be performed by changing a voltage state of a single program and erase entity according to the indicated erase direction. By employing the indicator bit with the single program and erase entity decoding scheme, the methods and systems can reduce erase time and/or a number of cycles, thereby increasing system reliability, efficiency, and/or durability.

Abstract: An active memory element is provided. One embodiment of the invention includes a bi-polar memory two-terminal element having polarity-dependent switching. A probability of switching of the bi-polar memory element between a first state and a second state decays exponentially based on time delay and a difference between received signals at the two terminals and a switching threshold magnitude.

Abstract: In one embodiment, a bit-line interface is disclosed. The bit-line interface has a multiplexer having a plurality of bit-line outputs, and a write path coupled to a multiplexer signal input. The bit-line interface also has a read path coupled to the multiplexer signal input, wherein the read path and the write path share at least one component.

Abstract: An embodiment of a non-volatile memory device is proposed. Said memory device comprises a matrix of memory cells; each memory cell is individually programmable to at least a first logic level and individually erasable to a second logic level. The memory device further comprises partition means for logically subdividing the matrix into a plurality of subspaces; each subspace comprises at least one respective memory cell. The memory device further comprises selection means for selecting a subspace, operative means for performing an operation on all the memory cells of the selected subspace, and means for dynamically modifying the number of subspaces and/or the number of memory cells included in each subspace.

Abstract: An information storage array includes a programmable material at one or more storage locations and pulse generation circuitry for generating at least two pulses—in particular, a write pulse that writes a value into the programmable material an erase pulse that erases a value from the programmable material. In general, the erase pulse is greater in duration than the write pulse. Either the write pulse or the erase pulse is selected based at least in part on a state of a data bit to be stored in the programmable material.

Abstract: In some embodiments all cells within a word-line of a floating body cell memory are erased. A back-gate of the floating body cell memory is self-aligned with the word line, and the erasing is performed using a back-gate bias. Other embodiments are described and claimed.

Abstract: A method for data storage in a memory (28) that includes a plurality of analog memory cells (32) includes estimating respective achievable storage capacities of the analog memory cells. The memory cells are assigned respective storage configurations defining quantities of data to be stored in the memory cells based on the estimated achievable capacities. The data is stored in the memory cells in accordance with the respective assigned storage configurations. The achievable storage capacities of the analog memory cells are re-estimated after the memory has been installed in a host system and used for storing the data in the host system. The storage configurations are modified responsively to the re-estimated achievable capacities.