Abstract: Implementations described herein relate to performing a memory built-in self-test and indicating a status of the memory built-in self-test. A memory device may read one or more bits, associated with a memory built-in self-test, that are stored in a mode register of the memory device. The memory device may identify, based on the one or more bits, that the memory built-in self-test is enabled. The memory device may set a DMI bit of the memory device to a first value and perform the memory built-in self-test based on identifying that the memory built-in self-test is enabled. The memory device may set the DMI bit of the memory device to a second value based on a completion of the memory built-in self-test.

Abstract: An operation method of a memory device, having a plurality of memory cells, includes receiving a partial write command, which includes a partial write enable signal (PWE) and a plurality of mask signals, during a command/address input interval. A data strobe signal is received through a data strobe line after receiving the partial write command Data is received through a plurality of data lines in synchronization with the data strobe signal during a data input interval. A part of the data is stored in the plurality of memory cells based on the plurality of mask signals, in response to the partial write enable signal, during a data write interval.

Abstract: Some memory dies in a stack can be connected externally to the stack and other memory dies in the stack can be connected internally to the stack. The memory dies that are connected externally can act as interface dies for other memory dies that are connected internally thereto. The external connections can be used for transmitting signals indicative of data to and/or from the memory dies while the memory dies in the stack can be connected by a cascading connection for transmission of other signals such as command, address, power, ground, etc.

Abstract: A memory component includes a first memory bank. The first memory bank has a plurality of sub-arrays having sub-rows of memory elements. The memory component includes a write driver, coupled to the first memory bank, to perform a write operation of an entire sub-row of a sub-array. To perform the write operation, the write driver is to load a burst of write data to the memory bank. The memory bank may then activate a plurality of sense amplifiers associated with a plurality of memory elements of the entire sub-row to load the burst of write data to the plurality of sense amplifiers.

Abstract: A memory control circuit includes an access storage unit configured to store access requests for a memory, a status management unit configured to, based on the access requests stored in the access storage unit, perform priority access type switching between two access types obtained by classifying the access requests, and an access selection unit configured to select and execute an access request stored in the storage unit. The access selection unit performs, if the priority access type switching is in progress and there is time for executing an access request of a priority access type before the priority access type switching, selecting the access request of the priority access type before the priority access type switching, and if the priority access type switching is not in progress, selecting an access request of the priority access type.

Abstract: In an embodiment, a local memory dedicated to one or more hardware accelerators in a system may include at least two portions: a volatile portion and a non-volatile portion. Data that is reused from iteration to iteration of the hardware accelerator (e.g. constants, instruction words, etc.) may be stored in the non-volatile portion. Data that varies from iteration to iteration may be stored in the volatile portion. Both the local memory and the hardware accelerators may be powered down between iterations, saving power. The non-volatile portion need only be initialized at a first iteration, allowing the amount of time that the hardware accelerators and the local memory are powered up to be lessened for subsequent iterations since the reused data need not be reloaded in the subsequent iterations.

Abstract: A method can include, in an integrated circuit device: at a unidirectional command-address (CA) bus having no more than four parallel inputs, receiving a sequence of no less than three command value portions; latching each command value portion in synchronism with rising edges of a timing clock; determining an input command from the sequence of no less than three command value portions; executing the input command in the integrated circuit device; and on a bi-directional data bus having no more than six data input/outputs (IOs), outputting and inputting sequences of data values in synchronism with rising and falling edges of the timing clock. Corresponding devices and systems are also disclosed.

Abstract: Technology is disclosed for reading non-volatile memory when a host does not need perfect data. By allowing the memory to return data with some errors, the data will be provided to the host much quicker. Therefore, in response to one or more host read commands, the memory system returns multiple copies of the data over time, progressively getting better so that later in time copies of the data have lower number of errors. The host decides when the error rate is good enough and stops the process (or ignores the rest of the results).

Abstract: A circuit includes a detection circuit configured to determine a capacitance delay (RC-delay) in an initial stage of a read or program operation and to adjust timing for detecting data in a subsequent stage, or portion of a stage, of the same read or programming operation. In particular, during a program operation a detection circuit may be configured to detect a pre-charge time for a bit line and adjust a timing of subsequent verify stages of the bit line during the same program operation based on the detected pre-charge time. Additionally, a word line circuit may be configured to detect a pre-charge time for a word line during an initial stage of a read operation and adjust read timing for a subsequent portion of the same read stage, or subsequent read stage of the read operation based on the detected word line pre-charge time.

Abstract: Apparatuses and methods for detecting refresh starvation at a memory. An example apparatus may include a plurality of memory cells, and a control circuit configured to monitor refresh request commands and to perform an action that prevents unauthorized access to data stored at the plurality of memory cells in response to detection that timing of the refresh request commands has failed to meet a refresh timing limit.

Abstract: A computing device includes bit line processors, multiplexers and a decoder. Each bit line processor includes a bit line of memory cells and each cell stores one bit of a data word. A column of bit line processors stores the bits of the data word. Each multiplexer connects a bit line processor in a first row of bit line processors to a bit line processor in a second row of bit line processors. The decoder activates at least two word lines of the bit line processor of the first row and a word line in the bit line processor in the second row and enables a bit line voltage associated with a result of a logical operation performed by the bit line processor in the first row to be written into the cell in the bit line processor in the second row.

Abstract: An approach for specifying data in a standards style pattern of Service-Oriented Architecture (SOA) environments is provided. The approach implemented in a computer infrastructure, includes defining an interface including one or more local data elements and one or more references to one or more common data elements, of a service, the one or more common data elements being defined in a library for a plurality of services. The approach further includes configuring a data definition file (DDF) which indicates whether each of the one or more local data elements and the one or more common data elements is mandatory for the service. The approach further includes validating one or more data elements from a consumer as mandatory for the service based on the configured DDF.

Abstract: According to one embodiment, a memory system is connectable to a host. The memory system includes a first memory, a second memory, and a controller. The first memory stores translation information associating a logical address and a physical address. The second memory stores location information associating the logical address and a location of the translation information. The controller updates the translation information and the location information. After returning from a power supply interruption, the controller starts, at different timing, recovery of first location information and recovery of second location information. The first location information is a part of the location information. The second location information is a part of the location information different from the first location information. The controller executes processing different from recovery of the location information between the recovery of the first location information and the recovery of the second location information.

Abstract: A memory device includes a volatile memory cell, a non-volatile memory cell, and a transfer system connected between the volatile memory cell and the non-volatile memory cell. The transfer circuit allows data transfer from the volatile memory cell to the non-volatile memory cell when the memory device is operating in a first mode, and from the non-volatile memory cell to the volatile memory cell when the memory device is operating in a second mode.

Abstract: An operating method of a data storage device includes performing a first static read fail solving operation in which the memory cell is read by applying read fail solving voltages included in a first group to the memory cell; and performing a second static read fail solving operation in which the memory cell is read by applying read fail solving voltages included in a second group to the memory cell after the first static read fail solving operation fails, wherein read success numbers of the respective read fail solving voltages included in the first group are larger than read success numbers of the respective read fail solving voltages included in the second group.

Abstract: There are a semiconductor device including: a plurality of memory blocks including a plurality of pages; peripheral circuits configured to perform a least significant bit read operation and a most significant bit read operation of a selected page included in a selected block; and a control circuit including a least significant bit read-retry table and a most significant bit read-retry table which have a plurality of indexes, and configured to control the peripheral circuits to store an index used when error correction is possible among the least significant bit read-retry table in the least significant bit read operation and perform the most significant bit read operation by first selecting the stored index among the most significant bit read-retry table.

Abstract: A non-volatile semiconductor device and a method for controlling the same are disclosed, which can increase a read efficiency of the non-volatile semiconductor device using the Low Power Double Data Rate (LPDDR) 2 specifications. The non-volatile semiconductor device includes a decoder configured to output a plurality of active control signals by decoding an active address and an active signal, and a plurality of active controls configured to be controlled by the plurality of active control signals and a plurality of active reset signals so as to generate a plurality of active enable signals that are independently activated.

Abstract: A non-volatile memory (NVM) system compatible with double data rate, single data rate, or other high speed serial burst operation. The NVM system includes input and output circuits adapted to synchronously send or receive back-to-back continuous bursts of serial data at twice the frequency of any clock input. Each burst is J bits in length. The NVM system includes read and write circuits that are adapted to read or write J bits of data at a time and in parallel, for each of a multitude of parallel data paths. Data is latched such that write time is similar for each bit and is extended to the time it takes to transmit an entire burst. Consequently, the need for small and fast sensing circuits on every column of a memory array, and fast write time at twice the frequency of the fastest clock input, are relieved.

Abstract: In an embodiment of the invention, a method is provided for isolating a ferroelectric memory from a power supply during a write-back cycle or a write cycle of the ferroelectric memory. After it is determined that a write-back cycle or a write cycle will occur in the ferroelectric memory, the power supply is electrically disconnected from the ferroelectric memory before a write-back cycle or a write cycle occurs. Energy during the write-back cycle or the write cycle is provided to the ferroelectric memory by one or more capacitors in this embodiment. After the write-back cycle or the write cycle has ended, the power supply is electrically connected to the ferroelectric memory and the capacitors.

Abstract: By assigning a slave unit and at least one master unit in a buffer controller, clocks of the at least one master unit can be unified with a clock of the slave unit. A buffer status array is assigned for the slave unit in a buffer, and either a range status array or a queue status array is assigned for the master unit in the buffer for performing operations of the buffer controller in an accessing-by-block manner or in an accessing-by-spaced-interval manner. The master unit cooperated with the slave unit is determined from the at least one master unit by using a starvation-preventing algorithm.

Abstract: A semiconductor device includes: an I/O circuit configured to input/output a data signal; a plurality of internal circuits configured to transmit and receive the data signal to/from the I/O circuit; and a path provider configured to select one of a direct path to a target internal circuit or an indirect path to the target internal circuit that is longer than the direct path in response to one or more path control signals and use the selected path when the data signal is transmitted between the I/O circuit and the plurality of internal circuits.

Abstract: A die-stacked memory device incorporates a reconfigurable logic device to provide implementation flexibility in performing various data manipulation operations and other memory operations that use data stored in the die-stacked memory device or that result in data that is to be stored in the die-stacked memory device. One or more configuration files representing corresponding logic configurations for the reconfigurable logic device can be stored in a configuration store at the die-stacked memory device, and a configuration controller can program a reconfigurable logic fabric of the reconfigurable logic device using a selected one of the configuration files. Due to the integration of the logic dies and the memory dies, the reconfigurable logic device can perform various data manipulation operations with higher bandwidth and lower latency and power consumption compared to devices external to the die-stacked memory device.

Abstract: A semiconductor memory apparatus includes a data alignment control signal generation unit configured to output a data alignment control signal by generating a pulse when a tuning mode signal is enabled, and generate the data alignment control signal as a count pulse is inputted after the data alignment control signal generated by the tuning mode signal is outputted; a timing control block configured to determine a delay amount according to delay codes, generate a delay control signal by delaying the data alignment control signal, and output a timing control signal by latching the delay control signal at an enable timing of a data output control signal; a delay time control block configured to generate the delay codes; and a data alignment unit configured to convert parallel data into serial data, and change a data sequence of the serial data in response to the timing control signal.

Abstract: A memory controlling method, a memory controller and a memory storage apparatus are provided. The method includes identifying whether a transmission mode between the memory storage apparatus and a host system belongs to a first transmission mode or a second transmission mode and grouping memory dies of the memory storage apparatus into a plurality of memory die groups. The method also includes applying a first erasing mode to erase data stored in the memory dies when the transmission mode belongs to the first transmission mode and applying a second erasing mode to erase the data stored in the memory dies when the transmission mode belongs to the second transmission mode, wherein at least a part of the memory die groups are enabled simultaneously in the first erasing mode and any two of the memory die groups are not enabled simultaneously in the second erasing mode.

Abstract: A method for measuring a write current of a semiconductor memory device includes the steps of: programming initial data into memory cells which are to be programmed substantially at the same time; determining whether the memory cells are programmed into the same state or not; inputting test data when the memory cells are programmed into the same state; setting write current paths of the memory cells by comparing the initial data and the test data; and measuring a write current consumed when the test data are programmed into the memory cells.

Abstract: A nonvolatile memory device is provided, which includes a memory core including a plurality of nonvolatile memory cells, a first read circuit that reads a first codeword from the memory core during a Read While Write (RWW) operation, a second read circuit that reads a second codeword from the memory core during a Read Modification Write (RMW) operation, and a common decoder that is shared by the first read circuit and the second read circuit and selectively decodes the first codeword or the second codeword.

Abstract: A non-volatile storage system is disclosed that includes a plurality of blocks of non-volatile storage elements, a plurality of word lines connected to the blocks of non-volatile storage elements such that each word line is connected to adjacent blocks of non-volatile storage elements, a plurality of bit lines connected to the blocks of non-volatile storage elements, multiple sets of word lines drivers such that each set of word line drivers is positioned between two adjacent blocks for driving word lines connected to the two adjacent blocks, global data lines, local data lines in selective communication with the bit lines, one or more selection circuits that selectively connect the global data lines to selected local data lines and connect unselected local data lines to one or more unselected bit line signals and control circuitry in communication with the one or more selection circuits and the global data lines.

Abstract: A semiconductor device according to the present invention includes plural core chips CC0 to CC7 to which mutually different pieces of chip identification information LID are allocated, and an interface chip IF that controls the core chips CC0 to CC7. The interface chip IF receives address information ADD for specifying a memory cell, and supplies in common a part of the address information to the core chips CC0 to CC7 as chip selection information SEL to be compared with the chip identification information LID. With this configuration, it appears from a controller that an address space is simply enlarged. Therefore, an interface that is same as that for a conventional semiconductor memory device can be used.

Abstract: A flash storage system includes a data buffer configured to receive and store a data block having data portions. The system further includes flash storage devices having storage blocks interleaved among the flash storage devices and a controller coupled to the data buffer and the flash storage devices. The controller is configured to initiate data transfers for writing the data portions of the data block asynchronously into the storage blocks, where the data transfers for writing the data portions of the data block asynchronously into the storage blocks include reading the data portions of the data block from the data buffer serially and writing the data portions of the data block into the storage blocks in parallel.

Abstract: A device for repair analysis includes a selection unit and an analysis unit. The selection unit is configured to select a part of the row addresses of a plurality of spare pivot fault cells and a part of the column addresses of the spare pivot fault cells in response to a control code. The analysis unit is configured to generate an analysis signal indicating whether row addresses of a plurality of non-spare pivot fault cells are included in selected row addresses and column addresses of the non-spare pivot fault cells are included in selected column addresses.

Abstract: A memory array having memory cells comprising a diode and a phase change material is reliably programmed by maintaining all unselected memory cells in a reverse biased state. Thus leakage is low and assurance is high that no unselected memory cells are disturbed. In order to avoid disturbing unselected memory cells during sequential writing, previously selected word and bit lines are brought to their unselected voltages before new bit lines and word lines are selected. A modified current mirror structure controls state switching of the phase change material.

Abstract: A semiconductor memory device, in which interference between adjoining cells can be reduced and an expansion of a chip area can be suppressed, comprising: a memory cell array in which plural memory cells connected to plural word lines and plural bit lines are disposed in a matrix form; sense amplifiers each of which is to be connected to each of the bit lines; a control circuit which controls voltages of the word lines and the bit lines, and programs data into the memory cells or reads data from the memory cells; wherein the plural bit lines include at least a first, a second, a third and a fourth bit lines adjoining to each other, and the sense amplifiers include at least a first and a second sense amplifiers, a first and a fourth selection transistors which are provided between the first and the fourth bit lines and the first sense amplifier, and connect the first and the fourth bit lines to the first sense amplifier; and a second and a third selection transistors which are provided between the second and t

Abstract: A data processing system includes a first semiconductor device that has a plurality of blocks each including plural data, and a second semiconductor device that has a first control circuit controlling the first semiconductor device, and the first control circuit issues a plurality of commands to communicate with the first semiconductor device in units of access units including a plurality of first definitions that define a plurality of burst lengths indicating numbers of different data, respectively, and a plurality of second definitions that define correspondences between certain elements of data among the plural data included in the blocks, respectively, and arrangement orders in the numbers of different data that constitute the burst lengths, respectively, and communicates with the first semiconductor device through the plural data in the numbers of different data according to the first and second definitions.

Abstract: A semiconductor storage device includes a memory cell array including memory cells arranged at respective intersections between first wirings and second wirings. Each of the memory cells includes a rectifier element and a variable resistance element connected in series. A control circuit is configured to apply a first voltage to a selected first wiring and a second voltage lower than the first voltage to a selected second wiring so that a certain potential difference is applied to a selected memory cell positioned at an intersection between the selected first wiring and the selected second wiring. The control circuit performs a concurrent read operation to perform a read operation from plural memory cells concurrently by applying the first voltage to a plurality of the first wirings concurrently. It is possible to switch the number of the first wirings to be applied with the first voltage concurrently in the concurrent read operation.

Abstract: For example, to include plural data input/output terminals and a strobe terminal that are electrically connected in common by a test probe, a command address terminal that is connected to a test probe, and an output control circuit that performs a selecting operation of data output circuits based on a signal that is supplied to the command address terminal. According to the present invention, it is possible to perform a test that uses non-compressed actual data while allocating plural data input/output terminals to one determination circuit within a tester. With this configuration, it is possible to test a large number of semiconductor devices in parallel by using a limited number of determination circuits within the tester.

Abstract: A flash storage system accesses data interleaved among flash storage devices. The flash storage system receives a data block including data portions, stores the data portions in a data buffer, and initiates data transfers for asynchronously writing the data portions into storage blocks interleaved among the flash storage devices. Additionally, the flash storage system may asynchronously read data portions of a data block interleaved among the storage blocks, store the data portions in the data buffer, and access the data portions from the data buffer.

Abstract: A high speed memory chip module includes a type of memory cell array group and a logic unit. The type memory cell array group includes multiple memory cell array integrated circuits (ICs), and each of the memory cell array ICs has a data bus and at least one memory cell array, and corresponds to first metal-oxide-semiconductor field-effect transistor (MOSFET) gate length corresponding to a first MOSFET process. The logic unit accesses the type of memory cell array group through a first transmission bus, where bus width of the first transmission bus is wider than bus width of the data bus of each of the memory cell array ICs. Corresponding to a second MOSFET process, the logic unit has a second MOSFET gate length which is shorter than the first MOSFET gate length.

Abstract: A semiconductor integrated circuit includes a multi-mode control signal generating unit configured to control an activation of a up/down mat I/O switch control signal, which controls I/O switches in a up/down mat, according to a multi-test mode signal and a read/write discriminating signal, a multi-mode decoder configured to output multi-mat select signals to simultaneously activate a plurality of mats according to a multi-test mode active write signal, and a mat controller configured to enable word lines and the I/O switches according to the up/down mat I/O switch control signal and the multi-mat select signals.

Abstract: A memory array having memory cells comprising a diode and a phase change material is reliably programmed by maintaining all unselected memory cells in a reverse biased state. Thus leakage is low and assurance is high that no unselected memory cells are disturbed. In order to avoid disturbing unselected memory cells during sequential writing, previously selected word and bit lines are brought to their unselected voltages before new bit lines and word lines are selected. A modified current mirror structure controls state switching of the phase change material.

Abstract: A memory cell array includes a plurality of memory cells, in which n (n is a natural number equal to 3 or larger) cells are simultaneously written. A control circuit controls the memory cell array. A conversion circuit converts data constituted of k (k is equal to n or smaller, and is a natural number equal to 3 or larger) bits stored in the memory cells into data of h (h is equal to k or larger, and is a natural number equal to 2 or larger) bits on the basis of a conversion rule.

Abstract: An integrated circuit can include an input/output (I/O) bank. The I/O bank can include a plurality of byte clock groups. Each byte clock group can include at least one phaser configured to clock circuit elements of the byte clock group at a frequency at which a source synchronous device coupled to the byte clock group communicates data.

Abstract: A processor-based system includes a processor coupled to core logic through a processor bus. This includes a dynamic random access memory (“DRAM”) memory buffer controller. The DRAM memory buffer controller is coupled through a memory bus to a plurality of a dynamic random access memory (“DRAM”) modules and a flash memory module, which are at the same hierarchical level from the processor. Each of the DRAM modules includes a memory buffer to the memory bus and to a plurality of dynamic random access memory devices. The flash memory module includes a flash memory buffer coupled to the memory bus and to at least one flash memory device. The flash memory buffer includes a DRAM-to-flash memory converter operable to convert the DRAM memory requests to flash memory requests, which are then applied to the flash memory device.

Abstract: Provided is a read circuit for a semiconductor memory device which may have a reduced circuit scale, and a semiconductor memory device. In a plurality of sense amplifiers of the read circuit of the semiconductor memory device, for serially reading data from a serial output terminal, if a number of byte selectors which may be selected to determine an address at a predetermined time before determination of the address is four, only four sense amplifiers are required in total, and hence the read circuit and the semiconductor memory device are reduced in circuit scale.

Abstract: A semiconductor device includes a test circuit that generates a pulse signal from a timing signal. The test circuit outputs the pulse signal and a first set of address signals in response to a first type transition of the timing signal. The test circuit outputs the pulse signal and a second set of address signals in response to a second type transition of the timing signal. The second set of address signals is different from the first set of address signals.

Abstract: An apparatus includes a programmable device that has an interface and command ports that can each receive commands, each command requesting an information transfer through the interface. A technique relating to the device involves: selecting during field programming a number of priority definitions; configuring each of the priority definitions during field programming to specify an order of priority for a group of the command ports; and using the priority definitions in succession and, for each of the priority definitions, causing a command to be accepted from the command port of highest priority that contains a command.

Abstract: A flash storage system accesses data interleaved among flash storage devices. The flash storage system receives a data block including data portions, stores the data portions in a data buffer, and initiates data transfers for asynchronously writing the data portions into storage blocks interleaved among the flash storage devices. Additionally, the flash storage system may asynchronously read data portions of a data block interleaved among the storage blocks, store the data portions in the data buffer, and access the data portions from the data buffer.

Abstract: System and method for a four-slot asynchronous communication mechanism with increased throughput. The system may include a host system and a client device. The host may comprise a data structure with four (two pairs of) slots and first information indicating a status of read operations from the data structure by the host. The client may read the first information from the host. The client may read second information from a local memory. The second information may indicate a status of write operations to the data structure by the client. The client may determine a slot of the data structure to be written. The slot may be determined based on the first information and the second information and may be the slot which has not been written to more recently of the pair of slots which has not been read from most recently. The client may increment a value of a counter. The value of the counter may be useable to indicate which slot has been written to most recently.

Abstract: Systems and methods for controlling memory devices are disclosed. In one embodiment, a memory system comprises a memory controller for forwarding a command signal and an address signal and for receiving and forwarding a data signal, and a first memory device for receiving the command signal and the address signal from the memory controller, where the first memory device comprises a first command judging circuit for receiving and forwarding the data signal and for decoding the command signal. The memory system further comprises a second memory device for receiving the command signal and the address signal from the memory controller, where the second memory device comprises a second command judging circuit for receiving and generating the data signal and for decoding the command signal. The command signal, the address signal and the data signal are commonly connected to the first memory device and the second memory device.

Abstract: A nonvolatile ferroelectric memory immediately outputs data stored in a page buffer without performing a cell access operation when a page buffer is accessed. Since a block page address region and a column page address region are arranged in less significant bit region, and a row address region is arranged in more significant bit region, the cell operation is not performed in the access of the page address buffer, thereby improving reliability of the cell and reducing power consumption.

Abstract: An asynchronously pipelined SDRAM has separate pipeline stages that are controlled by asynchronous signals. Rather than using a clock signal to synchronize data at each stage, an asynchronous signal is used to latch data at every stage. The asynchronous control signals are generated within the chip and are optimized to the different latency stages. Longer latency stages require larger delays elements, while shorter latency states require shorter delay elements. The data is synchronized to the clock at the end of the read data path before being read out of the chip. Because the data has been latched at each pipeline stage, it suffers from less skew than would be seen in a conventional wave pipeline architecture. Furthermore, since the stages are independent of the system clock, the read data path can be run at any CAS latency as long as the re-synchronizing output is built to support it.