Abstract: A circuit may include a first switch to pre-charge a first voltage line to a first voltage for a first amount of time, such that the first voltage is an opposite polarity as compared to a second voltage coupled to the first voltage line when a first fuse is blown. The circuit may also include a second switch to pre-charge a second voltage line to a third voltage for the first amount of time, such that the third voltage is an opposite polarity as compared to a fourth voltage coupled to the second voltage line when a second fuse is blown. The circuit also includes a latch circuit to amplify a first voltage signal present on the first voltage line and amplify a second voltage signal present on the second voltage line after the first amount of time expires.

Abstract: A reading circuit for a die ID in a chip is provided. The reading circuit includes a chip damage detection circuit, a switch selector, a fuse controller, and a fuse device, where the fuse device stores the die ID; the fuse controller reads the die ID from the fuse device; the chip damage detection circuit detects whether a processor in the chip is capable of operating properly, so as to obtain a detection result, and notify the switch selector of the detection result; and when the detection result is that the processor is capable of operating properly, the switch selector connects the processor and the fuse controller; and when the detection result is that the processor is not capable of operating properly, the switch selector connects the fuse controller and a maintenance device that is located outside the chip.

Abstract: A non-volatile programmable bitcell has a read enable device with a source coupled with a bitline, an anti-fuse device with a gate coupled with a first write line, a drain coupled with a supply voltage and a source coupled with a drain of the read enable device. The bitcell has a fuse device coupled between a second write line and the drain of the read enable device. A magnitude of current flowing in the bitline, when the read enable device is enabled for reading, is dependent both on (1) a voltage level applied to the first write line and anti-fuse device state and on (2) a voltage level applied to the second write line and fuse device state. Usages include in a memory array, such as for FPGA configuration memory. The bitcell can be used as a multi-time programmable element, or to store multiple bit values.

Abstract: Disclosed are a unit cell capable of improving a reliability by enhancing a data sensing margin in a read operation, and a nonvolatile memory device with the same. The unit cell of a nonvolatile memory device includes: an antifuse having a first terminal between an input terminal and an output terminal; and a first switching unit coupled between a second terminal of the antifuse and a ground voltage terminal.

Abstract: A CMOS anti-fuse cell is disclosed. In one aspect, an apparatus includes an N? well and an anti-fuse cell formed on the N? well. The anti-fuse cell includes a drain P+ diffusion deposited in the N? well, a source P+ diffusion deposited in the N? well, and an oxide layer deposited on the N? well and having an overlapping region that overlaps the drain P+ diffusion. A control gate is deposited on the oxide layer. A data bit of the anti-fuse cell is programmed when a voltage difference between the control gate and the drain P+ diffusion exceeds a voltage threshold of the oxide layer and forms a leakage path from the control gate to the drain P+ diffusion. The leakage path is confined to occur in the overlapping region.

Abstract: A circuit includes a fuse cell with a current mirror. The first leg of the current minor includes first and second N-type transistors coupled in series between the upper and lower rails and the second leg includes third and fourth N-type transistors coupled in series between the upper and lower rails. The size of the first N-type transistor is (Y·A1), the second N-type transistor is (X·A2), the third N-type transistor is (X·A1) and the fourth N-type transistor is (Y·A2) where X and Y are integers and A1 and A2 are the sizes of respective reference transistors. A fuse has a first terminal coupled between the first and second N-type transistors and a second terminal coupled between the third and fourth N-type transistors; a first control node on the second leg of the current minor is coupled to control the voltage at an output node of the fuse cell.

Abstract: A fuse blowing method is disclosed. The fuse blowing method includes the following operations: receiving a number signal, in which the number signal includes a number; triggering the number of several fuse pumps according to the number signal; and generating a current to blow a fuse.

Abstract: A semiconductor apparatus may be provided. The semiconductor apparatus may include a plurality of memory blocks. The semiconductor apparatus may include a peripheral circuit region arranged between the plurality of memory blocks. A plurality of signal input/output (I/O) pads may be arranged in the plurality of memory blocks.

Abstract: The present disclosure provides a memory. The memory includes an array of memory cells arranged as a plurality of rows by a plurality of columns. A memory cell is connected to at least one redundant memory cell in series in a same row for storing same data as the memory cell; and a column of memory cells correspond to at least one redundant column of redundant memory cells wherein each redundant memory cell in the at least one redundant column stores same data as the memory cell in a same row.

Abstract: The present disclosure provides a memory. The memory includes an array of memory cells arranged as a plurality of rows by a plurality of columns. A memory cell is connected to at least one redundant memory cell in series in a same row for storing same data as the memory cell; and a column of memory cells correspond to at least one redundant column of redundant memory cells wherein each redundant memory cell in the at least one redundant column stores same data as the memory cell in a same row.

Abstract: There is provided a non-volatile memory circuit including: plural storage element sections each including a zener zap device and a switch section that connects an anode of the zener zap device to an output terminal during data reading; and wherein cathodes of respective zener zap devices of the plural storage element sections are commonly connected so as to be connected to a power supply employed in the writing or to a power supply employed in the reading, wherein the output terminals of the plural storage element sections are commonly connected to an input terminal of a detector, an anode of each of the storage element sections being connected to a ground voltage during data writing, and wherein the switch section is switched ON during data reading so as to connect the anode of the storage element section through the output terminal to the input terminal of the detector.

Abstract: Embodiments relate to the authentication of a semiconductor. An identification circuit disposed within a package of an integrated circuit, and the identification circuit includes carbon-nanotube transistors configured to generate an encryption key.

Abstract: A power loss protection integrated circuit includes a current switch circuit portion (eFuse) and an autonomous limit checking circuit. The limit checking circuit includes an input analog multiplexer, an ADC, a plurality of capture registers, a state machine, and a flag output terminal. For each capture register, the limit checking circuit further includes an associated lower limit register and an associated upper limit register. The state machine controls the multiplexer and the capture registers so the ADC digitizes voltages on various nodes to the monitored, and stores the results into corresponding capture registers. In integrated circuit has circuitry that allows both a high voltage as well as a high current to be monitored. The value in a capture register is compared to upper and lower limit values. If any capture value is determined to be outside the limits, then a digital flag signal is asserted onto the flag output terminal.

Abstract: An integrated circuit according to an embodiment includes: an anti-fuse element including a first terminal and a second terminal; a fuse element including a third terminal connected to the second terminal, and a fourth terminal; a first wiring line connected to the first terminal of the anti-fuse element; and a drive circuit configured to supply a plurality of potentials to the first terminal of the anti-fuse element, the drive circuit being connected to the first wiring line, the potentials being different from each other.

Abstract: Embodiments relate to the authentication of a semiconductor. An identification circuit disposed within a package of an integrated circuit, and the identification circuit includes carbon-nanotube transistors configured to generate an encryption key.

Abstract: Memory die can be stacked to form a three-dimensional integrated circuit. For example, through-silicon vias (TSVs) can permit signals to pass vertically through the three-dimensional integrated circuit. Disclosed herein are apparatuses and methods to perform post package trimming of memory die, which advantageously permits the memory die to be trimmed after the memory die is stacked, such that test and trimming characteristics are relatively close to that which will be actually be encountered.

Abstract: A locking system for an integrated circuit (IC) chip can include an arrangement of one or more antifuse devices in a signal path of the IC chip. The antifuse devices can be configured to operate in a first state, corresponding to a normally open switch, to inhibit normal operation of the IC chip, and to transition from the first state to a permanent second state, corresponding to a closed switch, in response to a program signal applied to at least one terminal of the IC chip to enable the normal operation of the IC chip.

Abstract: A one-time memory control apparatus is obtained that prevents erroneous opening of a fuse from causing logic conversion and enhances the reliability. The one-time memory control apparatus includes an opening current creation fuse C opening switch and an opening current creation fuse D opening switch that each allow a fuse opening current from a fuse opening current creation circuit to flow in response to an opening enable signal, and a fuse opening permission signal creation circuit that receives respective logic signals corresponding to the states of fuse opening currents that flow through an opening current creation fuse C and an opening current creation fuse D, and that creates a fuse opening permission signal.

Abstract: In embodiments of the present invention improved capabilities are described for RFID tags with hardened memory, where the memory comprises a plurality of one time programmable (OTP) non-volatile memory locations for storing data, wherein the plurality of OTP non-volatile memory locations are configured to emulate a hardened memory system that retains data stored in the OTP non-volatile memory locations, wherein the data stored is retained after exposure of the RFID tag to an ionizing radiation exposure with an exposure level greater than 25 kGy.

Abstract: Various systems and methods for implementing fuse-based integrity protection are described herein. A system for validating a read-only memory (ROM), the system comprising a ROM reader logic, implemented at least partly in hardware, to: access a read-only memory (ROM) having a plurality of permanently programmable electric couplings (PPECs), the PPECs having been programmed; survey a number of permanently altered PPECs in the set of PPECs to produce a counter value; read a binary representation of the counter value from PPEC values stored as a PPEC signature; and read a binary representation of the binary complement of the counter value from PPEC values in the PPEC signature; and a ROM validation logic, implemented at least partly in hardware, to verify the integrity of the ROM using a combination of at least two of: the counter value, the binary representation of the counter value, and the binary representation of the binary complement of the counter value.

Abstract: System and method for testing the reliability of a fuse blow condition. The fuse blow detection circuit includes a fuse circuit comprising a fuse having a first end coupled to ground. A common node is coupled to the second end of the fuse. A pre-charge circuit is coupled to the common node for pre-charging the common node to a pre-charged HIGH level. An inverter includes an inverter output and an inverter input, wherein the inverter input is coupled to the common node. A feedback latch is coupled between a voltage source and ground, and includes a latch input that is coupled to the inverter output and a latch output coupled to the common node. A test circuit is included that is coupled to the common node, wherein in a normal mode the test circuit adds strength to the feedback latch for purposes of maintaining the common node at the pre-charged HIGH level, such that in a test mode the feedback latch is weaker than in the normal mode for purposes of maintaining the common node at the pre-charged HIGH level.

Abstract: To provide an electrical fuse that is connected to a detection node via a selective transistor, a precharge transistor that precharges the detection node in a state where the selective transistor is off; a bias transistor that passes a bias current to the detection node in a state where the selective transistor is on and the precharge transistor is off, and a detection circuit that detects a potential of the detection node in a state where the bias current is flowing into the detection node, wherein the bias transistor reduces an amount of the bias current in a stepwise manner or a continuous manner.

Abstract: A semiconductor memory device includes a fuse portion including a first fuse set having a plurality of first fuses assigned for a first mode and a second fuse set having a plurality of second fuses assigned for a second mode, and a program portion suitable for programming an available fuse among the first fuses included in the first fuse set or programming the second fuses included in the second fuse set in response to a repair control signal in the second mode.

Abstract: A semiconductor device having an electric fuse structure which receives an electric current to permit the electric fuse to be cut without damaging portions around the fuse. The electric fuse can be electrically connected between an electronic circuit and a redundant circuit as a spare of the electronic circuit. After these circuits are sealed with a resin, the fuse can be cut by receiving the electric current from the outside. The electric fuse is formed in a fine layer, and is made of a main wiring and a barrier film. The linear expansion coefficient of each of the main wiring and the barrier film is larger than that of each of the insulator layers. The melting point of each of the main wiring and the barrier film is lower than that of each of the insulator layers.

Abstract: A semiconductor device having an electric fuse structure which receives an electric current to permit the electric fuse to be cut without damaging portions around the fuse. The electric fuse can be electrically connected between an electronic circuit and a redundant circuit as a spare of the electronic circuit. After these circuits are sealed with a resin, the fuse can be cut by receiving the electric current from the outside. The electric fuse is formed in a fine layer, and is made of a main wiring and a barrier film. The linear expansion coefficient of each of the main wiring and the barrier film is larger than that of each of the insulator layers. The melting point of each of the main wiring and the barrier film is lower than that of each of the insulator layers.

Abstract: A semiconductor device that includes a fuse array including a plurality of fuses, and suitable for operating using a fuse operation voltage in a fuse operation period, a first voltage generation block suitable for generating an internal voltage based on a first target level, a second voltage generation block suitable for generating the fuse operation voltage based on a second target level in the fuse operation period, and generating the fuse operation voltage based on the first target level outside the fuse operation period, and a connection control block suitable for disconnecting a line of the internal voltage and a line of the fuse operation voltage in the fuse operation period, and connecting the line of the internal voltage and the line of the fuse operation voltage outside the fuse operation period.

Abstract: An e-fuse including a substrate including a first active region and a second active region which are spaced from each other by an isolation region, a first program gate and a second program gate which are disposed over the first active region in parallel with each other, a single select gate disposed over the second active region; a sharing doping region formed in the first active region between the first program gate and the second program gate, a first doping region and a second doping region that are formed in the second active region on both sides of the select gate, a first metal line suitable for electrically coupling the sharing doping region to the first doping region and a second metal line connected to the second doping region.

Abstract: A post package repair device may include a plurality of bank groups, each of the plurality of bank groups including fuses indicating repair information, configured to share a predetermined number of fuses. The post package repair device may include a resource detection unit configured to determine the availability of the fuses from among the plurality of bank groups.

Abstract: A memory includes first and second select gate transistors, memory cells, a source line, a bit line, a selected word line which is connected to a selected memory cell as a target of a verify reading, a non-selected word line which is connected to a non-selected memory cell except the selected memory cell, a potential generating circuit for generating a selected read potential which is supplied to the selected word line, and generating a non-selected read potential larger than the selected read potential, which is supplied to the non-selected word line, and a control circuit which classifies a threshold voltage of the selected memory cell to one of three groups by verifying which area among three area which are isolated by two values does a cell current of the selected memory cell belong, when the selected read potential is a first value.

Abstract: A fuse data reading circuit is configured to read fuse data in multi-reading modes. The fuse data may be stored in a fuse array that includes a plurality of fuse cells configured to store fuse data. The fuse data reading circuit may include a sensing unit configured to sense the fuse data stored in the fuse cells of the fuse array, and a controller configured to control an operation of reading the fuse data stored in the fuse cells. The controller sets different sensing conditions for sensing the fuse data according to an operation period during the fuse data reading operation to read the fuse data. Methods include operations and use of the fuse data reading circuit.

Abstract: A semiconductor memory apparatus includes a CAS latency setting circuit configured to change an initially-set CAS latency value in response to control signal pulses which are sequentially applied, during a test mode without changing settings of a mode register set during each test.

Abstract: A low-pin-count non-volatile (NVM) memory to be provided in an integrated circuit. The low-pin-count non-volatile (NVM) memory can use only one external control signal and one internal clock signal to generate start, stop, device ID, read/program/erase pattern, starting address, and actual read/program/erase cycles. When programming or erasing begins, toggling of the control signal increments/decrements a program or erase address and a pulse width of the control signal determines the actual program or erase time. A data out of the low-pin-count non-volatile (NVM) memory can be multiplexed with the control signal. In some applications where only the integrated circuit can read the data, a second control signal internal to the integrated circuit generates start, stop, device ID, read pattern, starting address, and actual read cycles, while the first control signal external to the integrated circuit can do the same for the program or erase path.

Abstract: A fuse array may include: an E-fuse including a plurality of active regions having a floating node and a contact node, and a plurality of gates overlapping the respective active regions and separated from each other between the floating node and the contact node; and a plurality of fuse sets each including two or more E-fuses and sharing the floating node or the contact node.

Abstract: A memory device capable of rescuing defective characteristics that occur after packaging includes a memory cell array including a plurality of memory cells and an antifuse circuit unit including at least one antifuse. The antifuse circuit unit stores a defective cell address of the memory cell array in the at least one antifuse and reads the defective cell address to an external source. The antifuse circuit unit stores a defective characteristic code in the at least one antifuse, wherein the defective characteristic code is related to at least one of a timing parameter spec., a refresh spec., an input/output (I/O) trigger voltage spec., and a data training spec. of the memory device, and outputs the defective characteristic code to an external source.

Abstract: One-time programmable integrated circuit security is described. An example of a method of protecting memory assets in an integrated circuit includes sampling values of multiple OTP memory arrays and comparing the sampled value of each OTP memory array with the sampled value of each other OTP memory array and with an unprogrammed OTP memory array value. The method further includes determining if an integrated circuit performance fault has occurred based on the compared sampled values, booting the integrated circuit, and operating the integrated circuit with access to memory determined by the fault occurrence determination.

Abstract: A one-time programmable memory includes a first cell array including a plurality of one-time programmable memory cells, and a second cell array including a plurality of one-time programmable memory cells, wherein the first cell array and the second cell array are programmed separately during a program operation, and read in combination during a read operation.

Abstract: An OTP memory cell and an OTP memory circuit. The OTP memory cell having a memory module, a write module, a read module, and a load module. Data may be written into the memory module once the write module is active; and data may be read out of the memory module once the read module is active. The OTP memory cell may also have a first latch module and a second latch module.

Abstract: Apparatuses and methods for sensing fuse states are disclosed herein. An apparatus may include an array having a plurality of sense lines. A plurality of cells may be coupled to a sense line of the plurality of sense lines. A fuse sense circuit may coupled to the sense line of the plurality of sense lines and configured to receive a sense voltage from a cell of the plurality of cells. The sense voltage may be based, at least in part, on a state of a fuse corresponding to the cell of the plurality of cells. The fuse sense circuit may further be configured to compare the sense voltage to a reference voltage to provide a fuse state control signal indicative of the state of the fuse.

Abstract: Gate oxide breakdown anti-fuse suffers notorious soft breakdown that reduces yield and reliability. This invention discloses circuit and system to enhance electrical field by blocking LDD so that the electrical field is higher and more focused near the drain junction, to make electrical field in the channel more uniform by creating slight conductive or conductive in part or all of the channel, or to neutralize excess carriers piled up in the oxide by applying alternative polarity pulses. The embodiments can be applied in part, all, or any combinations, depending on needs. This invention can be embodied as a 2 T anti-fuse cell having an access and a program MOS with drain area in the program MOS, or 1.5 T anti-fuse cell without any drain in the program MOS. Similarly this invention can also be embodied as a 1 T anti-fuse cell having a portion of the channel made conductive or slightly conductive to merge the access and program MOS into one device with drain area, or 0.5 T anti-fuse cell without any drain.

Abstract: Provided are a nonvolatile memory device and a method for operating the nonvolatile memory device. The method for operating the nonvolatile memory device includes generating a first program voltage, applying the generated first program voltage to a first word line to which a first memory cell is connected for performing a first program operation on the first memory cell, determining whether a number of pulses of a pumping clock signal for generating the first program voltage is greater than or equal to a predetermined critical value n (where n is a natural number), and stopping the performing of the first program operation on the first memory cell when the number of pulses of the pumping clock signal is determined to be greater than or equal to the predetermined critical value n.

Abstract: A memory element includes: an electrical fuse provided to be inserted between a first input node and a second input node; and an antifuse provided to be inserted between the second input node and a third input node. The third input node is configured to be a node to which a voltage is allowed to be applied separately from a voltage to be applied to the first input node.

Abstract: A method including forming a fuse link after a first fuse contact and a second fuse contact. The fuse link is in direct contact with both the first fuse contact and the second fuse contact. Embodiments of the invention provide an e-fuse that is capable of being connected to a device either through back end of line or by a long contact allowing for sufficient separation between the e-fuse and the device.

Abstract: A semiconductor memory device includes a memory array including memory blocks stacked in a plurality of layers over a substrate and an operation circuit suitable for performing a read operation and a program loop to memory cells included in the memory blocks, wherein word lines of the memory blocks are coupled to each other and a pair of the memory blocks are arranged vertically adjacent to each other and share bit lines.

Abstract: A one-time programmable (OTP) memory cell includes a dual date transistor and, in some embodiments, two transistors. The dual gate transistor is formed using the same processing operations used to form floating gate transistors in other areas of the semiconductor device. The dual gate transistor includes an upper gate isolated from a floating gate by a floating gate oxide, the combination of which produces an anti-fuse. The nonvolatile memory device may include a plurality of such OTP memory cells and one or more OTP memory cells are selected and programmed by applying a voltage sufficient to blow the anti-fuse by causing the floating gate oxide layer to break down and the upper gate to become shorted to the floating gate.

Abstract: A programmable memory cell including a thick oxide spacer transistor, a programmable thin oxide anti-fuse disposed adjacent to the thick oxide spacer transistor, and first and second thick oxide access transistors. The thick oxide spacer transistor and first and second thick oxide access transistors can include an oxide layer that is thicker than an oxide layer of the programmable thin oxide anti-fuse. The programmable thin oxide anti-fuse and the thick oxide spacer transistor can be natively doped. The first and second thick oxide access transistors can be doped so as to have standard threshold voltage characteristics.

Abstract: A semiconductor storage device 1 according to an aspect includes a first memory area 11—1 and a second memory area 11—2. Memory cells MC_m_n and bit lines BL1, BL2_, . . . . , BLm_are disposed in a boundary area 18 between the first and second memory areas 11—1 and 11—2. The memory cells MC_m_n disposed in the boundary area 18 includes memory cells into which no data is written, and a line 56 is formed in a place that overlaps memory cells disposed in the boundary area 18 when the boundary area 18 is viewed from the top. As a result, it is possible to increase the integration density of a memory cell array and provide a line in the memory cell array.

Abstract: A nonvolatile memory device includes an operation control unit, a reference voltage generating unit, and a sensing unit. The operation control unit is configured to select a unit cell from unit cells to perform reading and writing operations. The reference voltage generating unit is configured to voltage-divide a read voltage using series-connected resistors and generate a reference voltage based on the voltage-divided read voltage. The sensing unit is configured to compare a size of a voltage through an e-fuse of the selected unit cell based on the read voltage with the reference voltage, and sense data of the e-fuse of the selected unit cell. The nonvolatile memory device also includes a read current supply unit configured to output the read voltage to the unit cells during a reading operation of the nonvolatile memory device.

Abstract: An antifuse according to an embodiment of the invention herein can include a depletion mode metal oxide semiconductor field effect transistor (“MOSFET”) having a conduction channel and a metal gate overlying the conduction channel. A cathode and an anode of the antifuse can be electrically coupled to the gate, such that the antifuse is programmable by driving a programming current between the cathode and the anode to cause material of the metal gate to migrate away. Under appropriate biasing conditions, when the antifuse is unprogrammed, the conduction channel is turned on unless a voltage above a first threshold voltage is applied to the gate to turn off the conduction channel. The gate can be configured such that when the antifuse has been programmed, the conduction channel remains turned on even if a voltage above the first threshold voltage is applied between the gate and a source region of the MOSFET.

Abstract: The present disclosure includes apparatuses and methods for sensing a resistance variable memory cell. A number of embodiments include programming a memory cell to an initial data state and determining a data state of the memory cell by applying a programming signal to the memory cell, the programming signal associated with programming memory cells to a particular data state, and determining whether the data state of the memory cell changes from the initial data state to the particular data state during application of the programming signal.

Abstract: A one-time programmable memory array includes a first row conductor extending in a first row direction and disposed at a first elevation, a second row conductor extending in a second row direction and disposed at a second elevation and a column conductor extending in a column direction and disposed adjacent to the first row conductor and adjacent to the second row conductor. The array also includes a dielectric layer covering at least a portion of the column conductor, a fuse link coupled between the dielectric layer on the column conductor and the second row conductor.