Abstract: A bit memory circuit of an antifuse element set includes two antifuse elements of which logical states are changed from an insulation state to a conductive state when a program voltage is applied. 1-bit data is represented by the logical states of the two antifuse elements. The two antifuse elements are collectively controlled by one decoder circuit. When writing data, the decoder circuit simultaneously performs insulation-breakdown on the two antifuse elements by simultaneously connecting the two antifuse elements to program voltage lines, respectively.

Abstract: Apparatuses and methods for sensing fuse states are disclosed herein. An apparatus may include an array having a plurality of sense lines. A plurality of cells may be coupled to a sense line of the plurality of sense lines. A fuse sense circuit may coupled to the sense line of the plurality of sense lines and configured to receive a sense voltage from a cell of the plurality of cells. The sense voltage may be based, at least in part, on a state of a fuse corresponding to the cell of the plurality of cells. The fuse sense circuit may further be configured to compare the sense voltage to a reference voltage to provide a fuse state control signal indicative of the state of the fuse.

Abstract: A semiconductor apparatus includes a memory block configured to have a normal cell array and a redundancy cell array; a column address buffer configured to compare a plurality of input column addresses with a fail column address signal-stored in a fuse array, and generate a column enable signal or a fail column enable signal; a column decoder configured to decode the column enable signal, and output a column selection signal to the normal cell array; and a column redundancy controller configured to generate a redundancy control signal in response to the fail column enable signal, generate a redundancy enable signal so as to reuse a redundancy bit line which has been substituted before according to the generated redundancy control signal, and output the generated redundancy enable signal to the redundancy cell array.

Abstract: A plurality of memory cells are tested in order. Each time a defective memory cell is detected by the test, error pattern information is updated based on a relative arrangement relationship between a plurality of defective memory cells, and error address information is updated based on the addresses of at least part of the plurality of defective memory cells. According to the present invention, it is possible to significantly reduce the storage capacity of the analysis memory. This allows the implementation of the analysis memory itself in the semiconductor device, in which case external testers need not include the analysis memory.

Abstract: An e-fuse array circuit includes a program gate line and a word line gate line that are stretched in parallel to each other, and a metal line formed over the program gate line and the word line gate line to cover the program gate line and the word line gate line, the metal line connected to the program gate line through a plurality of contact plugs disposed at a given distance.

Abstract: An e-fuse array circuit includes: an e-fuse transistor of a vertical gate type configured to have a gate for receiving a voltage of a program gate line and have one between a drain terminal and a source terminal floating; and a selection transistor of a buried gate type configured to have a gate for receiving a voltage of a word line gate line and electrically connect/disconnect the other one between the drain terminal and the source terminal with a bit line.

Abstract: A semiconductor memory device includes a fuse unit including a fuse configured to be programmed with a repair target address, an enable unit configured to enable the fuse unit, an output unit configured to output a signal corresponding to whether the fuse unit is programmed or not, and a control unit configured to control a voltage difference between both ends of the fuse unit in response to a control signal.

Abstract: An apparatus and method of testing one-time-programmable memory provides one-time-programmable memory having one or more memory locations for storing data and corresponding programming circuitry for each memory location. In addition, each programming circuitry has a circuit element configured to permanently change state to store the data in the memory. The method also reads each memory location to verify that the memory location is unprogrammed and activates the programming circuitry for each memory location, which applies a test current to the programming circuitry. The test current is less than a threshold current needed to permanently change the state of the circuit element. The method then determines whether the programming circuitry is functioning properly.

Abstract: A semiconductor integrated circuit for selecting one from a plurality of external storage devices and loading an execution program that includes a fuse part having a plurality of internal fuse circuits, and a processing unit that loads the execution program from the external storage device selected according to a value indicated by the internal fuse circuit.

Abstract: Memories, memory repair logic, and methods for repairing a memory having redundant memory are disclosed. One such memory includes programmable elements associated with respective redundant memory configured to have memory addresses mapped thereto, the programmable elements configured to be programmed with at least portions of the memory addresses. Such a memory further includes repair logic coupled to the programmable elements and configured to identify programmable elements available for programming to map memory addresses to respective redundant memory. One method for remapping a memory address of a memory to redundant memory includes receiving at least a portion of a memory address to be remapped to redundant memory, determining whether a programmable element associated with the redundant memory is available for programming, and when a programmable element is available, programming the programmable element such that the memory address will be mapped to the associated redundant memory.

Abstract: According to one embodiment, a power supply circuit, which generates a power supply voltage which is applied to a memory cell array including a plurality of memory cells disposed at intersections between a plurality of word lines and a plurality of bit lines, comprises a first boost circuit configured to boost an input voltage, a first voltage step-down circuit having an input connected to an output of the first boost circuit, and a voltage control circuit configured to control the first boost circuit and the first voltage step-down circuit. The voltage control circuit is configured to generate, not via the first voltage step-down circuit, a voltage which is boosted by the first boost circuit, when a first voltage is transferred to a non-selected memory cell.

Abstract: A semiconductor memory device includes an enable fuse unit configured to generate a repair enable signal corresponding to a cutting state of an enable fuse after a power-up operation starts, and an address fuse unit enabled in response to the repair enable signal, and configured to generate an output signal in response to an external address and whether or not an address fuse is programmed.

Abstract: A semiconductor device includes a plurality of first chips, a second chip that controls the first chips, and internal wiring that connects the first chips and the second chip. The first chips each include: an optical fuse; a first latch circuit that retains information on the optical fuse; a second latch circuit that retains information on an electrical fuse, the information being supplied from the second chip through the internal wiring; and a select circuit that selects the information retained in either one of the first and second latch circuits. A redundancy determination signal is generated from the information selected. The information on the electrical fuse is transferred from the second chip to the first chips through the internal wiring.

Abstract: A method for controlling performance of an integrated circuit using a zero-pin serial interface is provided. The method comprises identifying a desired performance characteristic of the circuit, and transmitting a first change mode signal to the circuit on a first pin to cause the circuit to enter an instruction reception mode, with the first pin performing differently during a normal operation mode. The method also comprises transmitting a performance adjusting instruction to the circuit on a second pin when the circuit is in the instruction reception mode, with the second pin performing differently during the normal operation mode, and transmitting a second change mode signal to the circuit on the first pin to cause the circuit to enter the normal operation mode. An output performance of the circuit is compared to the desired performance characteristic, with the output performance being the performance of the circuit during the normal operation mode.

Abstract: An operating method for a memory unit is provided, wherein the memory unit includes a well region, a select gate, a first gate, a second gate, an oxide nitride spacer, a first diffusion region, and a second diffusion region. The operating method for the memory unit comprises the following steps. During a programming operation, a breakdown voltage is coupled to the second diffusion region through a first channel region formed under the select gate. A programming voltage is sequentially or simultaneously applied to the first gate and the second gate to rupture a first oxide layer and a second oxide layer, wherein the first oxide layer is disposed between the first gate and the well region, and the second oxide layer is disposed between the second gate and the well region.

Abstract: A semiconductor device has an antifuse element and a measurement unit. The antifuse element stores information according to whether the antifuse element is in the broken or unbroken state. The measurement unit determines a resistance value related to the resistance value of the broken antifuse element.

Abstract: A semiconductor memory device including an information storage unit comprising a fuse configured to store information, a control unit configured to control a node of a blown fuse to become a floating state in response to a control pulse signal, and an output unit configured to output the information.

Abstract: A repairable memory cell in accordance with one or more embodiments of the present disclosure includes a storage element positioned between a first and a second electrode, and a repair element positioned between the storage element and at least one of the first electrode and the second electrode.

Abstract: A word line driving signal control circuit of a semiconductor memory apparatus provided with a sub-redundancy cell array includes a fuse unit configured to generate a redundancy enable signal in response to a bank active signal and an address signal, and a repair determination unit configured to activate one of a normal word line driving signal, a redundancy word line driving signal, and a sub-redundancy word line driving signal in response to the bank active signal and the redundancy enable signal.

Abstract: An alternative electrical fuse structure, which may be similar to or identical with an insulated gate field effect transistor (“IGFET”) of advanced CMOS technology, can be very area efficient and programmable at relatively low voltages, e.g., programming voltages between 1.5 V and 2.5 V. A method is provided for programming an electrical fuse having the structure of an IGFET to permanently electrically isolate the drain of the IGFET from its source. In this way, the step of programming the IGFET fuse can increase a resistance between the source and the drain of the IGFET from a pre-programming value to a post-programming value by two or more orders of magnitude when any given gate-source voltage value and any given drain-source voltage value within normal operational ranges of the IGFET are applied thereto.

Abstract: A circuit for programming a fuse is disclosed. The circuit includes a voltage supply terminal (Vf) and a semiconductor controlled rectifier (222, 224). The fuse is coupled between the voltage supply terminal and the semiconductor controlled rectifier. A switching circuit (200, 202, 208, 210) is coupled to the semiconductor controlled rectifier.

Abstract: A fuse circuit includes a programming fuse signal generation block configured to generate parity signals, logic levels of which are determined according to addresses selected among a plurality of addresses with a programming enable signal enabled, and generate programming fuse signals which are programmed in response to the programming enable signal, the plurality of addresses and the parity signals; a corrected pulse generation block configured to correct an error included in the programming fuse signals and generate corrected pulses; and a fuse unit configured to generate fuse signals which are reprogrammed according to the corrected pulses.

Abstract: A method for programming a multi-level electrical fuse system comprises providing a fuse box with an electrical fuse and providing one of at least two fuse writing voltages to the electrical fuse to program the electrical fuse to one of at least two resistance states. The fuse box comprises at least one electrical fuse, a programming device serially coupled to the electrical fuse, and a variable power supply coupled to the fuse box and configured to generate two or more voltage levels.

Abstract: This description relates to a circuit including a bit line. The circuit further includes at least one memory bank. The at least one memory bank includes at least one memory cell, a first device configured to provide a current path between the bit line and the at least one memory cell when the at least one memory cell is activated, and a second device configured to reduce current leakage between the bit line and the at least one memory cell when the at least one memory cell is deactivated. The circuit further includes a tracking device configured to receive a mirror current substantially equal to a current along the current path, the tracking device configured to have a resistance substantially equal to a cumulative resistance of all memory cells of the at least one memory cell.

Abstract: Circuits and techniques for operating a memory cell on an integrated circuit (IC) are disclosed. A disclosed memory cell includes a first inverter coupled to a second inverter to form a first connection and a second connection. The first connection is operable to receive at least a first data signal at a first voltage and the second connection is operable to receive at least a second data signal at a second voltage. A first oxide capacitor and a second oxide capacitor are coupled to the first and second connections respectively. Both the first and second oxide capacitors are coupled to receive a programming signal at a third voltage that may be operable to rupture either one of the first or second oxide capacitor.

Abstract: An anti-fuse control circuit includes a first power supply voltage application unit, a second power supply voltage application unit and a control unit. The first power supply voltage application unit configured to selectively apply first power supply voltage to an output node in response to a power up signal. The second power supply voltage application unit configured to selectively apply second power supply voltage to the output node in response to a program signal. The control unit configured to control a connection between the output node and an anti-fuse in response to the power up signal when the program signal is inactivated.

Abstract: Read and write operations of a non-volatile memory (NVM) bitcell have different optimum parameters resulting in a conflict during design of the NVM bitcell. A single bitline in the NVM bitcell prevents optimum read performance. Read performance may be improved by splitting the read path and the write path in a NVM bitcell between two bitlines. A read bitline of the NVM bitcell has a low capacitance for improved read operation speed and decreased power consumption. A write bitline of the NVM bitcell has a low resistance to handle large currents present during write operations. A memory element of the NVM bitcell may be a fuse, anti-fuse, eFUSE, or magnetic tunnel junction. Read performance may be further enhanced with differential sensing read operations.

Abstract: An operation method of a semiconductor device, includes providing one or more memory elements each including a first semiconductor layer of a first conductivity type, second and third semiconductor layers of a second conductivity type, which are disposed to be separated from each other in the first semiconductor layer, a first electrode electrically connected to the second semiconductor layer, and a second electrode electrically connected to the third semiconductor layer, and performing operation of writing information on a memory element to be driven of the one or more memory elements. The operation of writing is performed by forming a filament in a region between the second and third semiconductor layers, which is a conductive path electrically linking these semiconductor layers, through application of a voltage equal to or higher than a predetermined threshold between the first electrode and the second electrode.

Abstract: A fuse circuit includes a program unit, a sensing unit and a control unit. The program unit is programmed in response to a program signal, and outputs a program output signal in response to a sensing enable signal. The sensing unit includes a variable resistor unit that has a resistance that varies based on a control signal, and generates a sensing output signal based on the resistance of the variable resistor unit and the program output signal. The control unit generates the control signal having a value changed depending on operation modes, and performs a verification operation with respect to the program unit based on the sensing output signal to generate a verification result. The program unit may be re-programmed based on the verification result.

Abstract: A semiconductor integrated circuit includes a column redundancy fuse block having a fuse set array having a plurality of fuse sets including a plurality of column address fuses, and a fuse blowing information block configured to output a fuse blowing determination signal of a corresponding column based on a cutting state of the column address fuses, wherein the column redundancy fuse is disposed in the edge area, wherein the fuse blowing determination signal is inputted to a column control block through upper portion of a memory cell array of a corresponding bank.

Abstract: A one-time programmable memory array includes a first row conductor extending in a first row direction and disposed at a first elevation, a second row conductor extending in a second row direction and disposed at a second elevation and a column conductor extending in a column direction and disposed adjacent to the first row conductor and adjacent to the second row conductor. The array also includes a dielectric layer covering at least a portion of the column conductor, a fuse link coupled between the dielectric layer on the column conductor and the second row conductor.

Abstract: A relief-address control unit of a semiconductor memory device includes a fuse storage unit and a relief circuit. The fuse storage unit includes a plurality of fuse elements that are made nonconductive by irradiation with a laser beam, and a protective film with an opening directly above the fuse elements to facilitate the laser beam to pass through. The relief circuit specifies a relieved address based on a nonconductive state of the fuse elements. The opening is in a unified form along a long-side direction of the fuse storage unit. Further, the relief circuit is arranged adjacent to a short-side end of the fuse storage unit.

Abstract: In an embodiment of the invention, an integrated circuit includes a pipelined memory array and a memory control circuit. The pipelined memory array contains a plurality of memory banks. Based partially on the read access time information of a memory bank, the memory control circuit is configured to select the number of clock cycles used during read latency.

Abstract: Methods of setting wordline up-level voltage in as-fabricated SRAM. In one example, the method includes determining the relative speed, or strength, of 1) the combination of the pass-gate and pull-down devices and 2) the pull-up devices in the bitcells of the SRAM. These relative strengths are then used to adjust the wordline up-level voltage, if needed, to decrease the likelihood of the SRAM experiencing a stability failure. Corresponding systems are provided for determining the relative strengths of the devices of interest, for determining the amount of up-level voltage adjustment needed, and for selecting and setting the up-level voltage.

Abstract: Polysilicon diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, using electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse etc. as OTP element The diode can be constructed by P+/N+ implants on a polysilicon as a program selector. The OTP device has an OTP element coupled to a polysilicon diode. The OTP devices can be used to construct a two-dimensional OTP memory with the N-terminals of the diodes in a row connected as a wordline and the OTP elements in a column connected as a bitline. By applying a high voltage between a selected bitline and a selected wordline to turn on a diode in a selected cell for suitable duration of time, a current flows through an OTP element may change the resistance state. The cell data in the OTP memory can also be read by turning on a selected wordline and to couple a selected bitline to a sense amplifier.

Abstract: A semiconductor apparatus may include a transmission control signal generation unit, a fuse signal transmission unit, a reception control signal generation unit and a fuse signal reception unit. The transmission control signal generation unit receives a clock signal and generates a plurality of divided clock signals based on the clock signal to output transmission control signals from the plurality of divided clock signals. The fuse signal transmission unit transmits fuse information in synchronization with the transmission control signals. The reception control signal generation unit receives the clock signal and generates the plurality of divided clock signals, and generates reception control signals based on the plurality of divided clock signals. The fuse signal reception unit receives the fuse information in synchronization with the reception control signals.

Abstract: A non-volatile memory device includes a plurality of memory blocks. Each of memory blocks includes a main area including a plurality of first memory cells having a phase-change material and a spare area including at least one second memory cell for storing initial information about the plurality of first memory cells. In the non-volatile memory device, a circuit of the at least one second memory cell is cut off according to the initial information, and the initial information is defective block information that is information about a defect of the plurality of memory blocks.

Abstract: A multi-level flash memory device allows for a faster and more effective configuration of the operating parameters of the memory device for performing the different functioning algorithms of the memory. The identification of an optimal configuration of the operating parameters of the memory device during testing is simplified by allowing for a one-time processing of configuration bits into algorithm-friendly data that are stored in an embedded ancillary random access memory at every power-on of the memory device. This is done by executing a specific power-on algorithm code stored in the ancillary read only memory of the embedded microprocessor.

Abstract: An e-fuse array circuit includes a first select transistor configured to have a gate terminal connected to a first select line and have a first terminal connected to a first bit line, a first e-fuse transistor configured to have a gate terminal connected to a common program/read line and have a first terminal connected to a second terminal of the first select transistor, a second select transistor configured to have a gate terminal connected to a second select line and have a first terminal connected to the first bit line, and a second e-fuse transistor configured to have a gate terminal connected to the common program/read line and have a first terminal connected to a second terminal of the second select transistor.

Abstract: A semiconductor apparatus includes: a memory cell block configured to store data; a fuse block including a plurality of fuses configured to store fuse information; an I/O driver configured to output the data transmitted through a global line to a pad; and a fuse driver configured to output the fuse information transmitted through a test global line to the pad during a test mode.

Abstract: A semiconductor device includes a fuse unit connected to a detection node and configured to be programmed in response to a first voltage supplied through the detection node, an output unit connected to the detection node and configured to output a fuse information signal indicating whether the fuse unit is programmed or not, and a blocking unit configured to block the first voltage supplied through the detection node in response to the fuse information signal.

Abstract: A memory chip design methodology is disclosed wherein fuse banks on the memory chip may be implemented without enable fuses. A fuse bank may be enabled by using one or more least significant bits (LSBs) in the memory address stored in the fuse bank, thereby avoiding the need for a separate enable fuse. A reduction in the number of fuses results in space savings on the memory chip real estate and also savings in power consumption because of fewer fuses to be blown and read. With reduced fuse count, the yield of the memory chip's die may also be improved because of less number of defective fuses or failed fuse blows. The use of effective default state inversion for address fuses may further reduce the average number of fuses that need to be blown to repair a given non-redundant memory address. Because of the rules governing abstracts, this abstract should not be used to construe the claims.

Abstract: Devices, methods, and systems for temperature compensation in memory devices, such as resistance variable memory, among other types of memory are included. One or more embodiments can include a memory device including a table with an output that is used to create a multiplication factor for a current to compensate for temperature changes in the memory device, where the output depends on an operating temperature of the memory device and a difference in the current between a highest specified operating temperature and a lowest specified operating temperature of the memory device.

Abstract: A semiconductor memory device and method of operating same are described. The semiconductor memory device includes a first anti-fuse array having a plurality of first anti-fuse elements that store first fuse data, a second anti-fuse array having a plurality of second anti-fuse elements that store error correction code (ECC) data associated with the first fuse data, and an ECC decoder configured to generate second fuse data by correcting the first fuse data using the ECC data.

Abstract: A semiconductor memory apparatus including a repair circuit may comprise: a fuse set block configured to store a repair address, compare the repair address with an input address, and generate a primary repair signal; and a redundancy control block configured to receive the primary repair signal, determine whether a repair cell in a repair memory designated by the primary repair signal is failed or not, and generate a secondary repair signal which repair the failed repair cell with another repair cell in the repair memory.

Abstract: A memory cell includes a selection transistor on a substrate and an antifuse on the substrate. The selection transistor includes a first gate connected to a read word line, a first gate insulation layer that insulates the first gate from the substrate, a first source region connected to a bit line, and a first drain region, an impurity concentration of the first drain region being lower than an impurity concentration of the first source region. The antifuse includes a first electrode connected to a program word line and a second electrode connected to the selection transistor.

Abstract: An electrical fuse (eFuse) bit cell includes a program transistor, a read transistor, and an eFuse. The program transistor has a first program terminal, a second program terminal, and a third program terminal. The read transistor has a first read terminal, a second read terminal, and a third read terminal. The eFuse has a first end and a second end. The first end, the first program terminal, and the second read terminal are coupled together. The read transistor is configured to be off and the program transistor is configured to be on when the eFuse bit cell is in a program mode. The program transistor is configured to be off and the read transistor is configured to be on when the eFuse bit cell is in a read mode.

Abstract: Used fusebay storage elements are counted so that storage of data may begin at a first unused storage element. Repair register length and a number of previous passes are stored in a fuse header of a fusebay. When a bit of data is sent to the repair register, a repair register position tracker value is changed by one until it reaches a first value. When the first value is reached, a pass tracker value is changed by one. If the first value is not reached, the steps are repeated. A bit counter and/or a page counter may be included.

Abstract: A notebook computer comprises a first machinery, a first latch, a second machinery, a slider, an elastic element and a push element. The first latch is disposed on an edge of the first machinery. The second machinery has one side pivotally connected to the first machinery, and the other side formed with at least one latching hole. When the computer is closed, the first latch is inserted into the latching hole. The slider includes a body and a second latch. The body is slidably disposed in the second machinery along a first moving path. The second latch, disposed on the body, suits to latch or unlatch the first latch. The elastic element has one end connected to the slider, and the other end connected to the second machinery. The push element, slidably disposed in the second machinery along a second moving path, suits to push the body.

Abstract: A notebook computer comprises a first machinery, a first latch, a second machinery, a slider, a second elastic element and a push element. The second machinery has one side pivotally connected to the first machinery, and the other side formed with at least one latching hole. The slider comprises a body, a second latch and a first elastic element. The body is slidably disposed in the second machinery along a first moving path. The second latch disposed on the body latches or unlatches the first latch disposed on the first machinery. The first elastic element has one end connected to the body, and the other end pressing the first latch. The second elastic element has one end connected to the slider, and the other end connected to the second machinery. The push element, slidably disposed in the second machinery along a second moving path, pushes the first elastic element.