Abstract: An address buffer circuit for a semiconductor memory device wherein an address buffer is enabled (to output an internal address signal) in response to a first level of a control signal and, but is disabled in response to a second level of the control signal. An address buffer control unit generates the control signal at the second level in ‘no operation’ state (NOP command) in which the semiconductor memory device does not perform data accessing operations and generates the control signal at the first level while the semiconductor memory device performs data accessing operations, thereby reducing or minimizing the output of an internal address buffered and output by the address buffer at and thus reducing power consumption during no-operation states of the semiconductor memory device.

Abstract: A power saving system and method are provided. In use, at least one of a plurality of memory circuits is identified that is not currently being accessed. In response to the identification of the at least one memory circuit, a power saving operation is initiated in association with the at least one memory circuit.

Abstract: A precharge voltage generating circuit outputs any of a plurality of kinds of precharge voltages in accordance with an ambient temperature. A precharge circuit supplies the precharge voltage to a bit line during the nonaccess of a dynamic memory cell. A sense amplifier amplifies a difference between the voltage of a data signal read from the dynamic memory cell onto the bit line and the supplied precharge voltage. The precharge voltage is altered in accordance with the ambient temperature, whereby the read margin of the sense amplifier can be changed, and the worst value of the data retaining time of the memory cell can be improved. As a result, the frequency of refreshing of the memory cell can be lowered, reducing power consumption and a standby current.

Abstract: In a semiconductor memory having a plurality of word lines and bit lines and memory cells arranged at the positions of intersection thereof, a word driver circuit that drives the word line has a drive PMOS transistor and drive NMOS transistor which are connected in series between a first node and a second node and each of which has a gate connected to a third node, the word line being connected to a connection node of the two transistors. A first voltage or a second voltage lower than the first voltage is then applied to the third node, and the first voltage or second voltage is applied to the first node. In addition, between the third node and the gate of the drive PMOS transistor, there is provided a leakage prevention NMOS transistor having a gate applied with the first voltage or a voltage in the vicinity thereof.

Abstract: A power control circuit for an integrated circuit module includes at least one switch device coupled between a supply voltage and a power node of the integrated circuit module; and a switch control module having a first terminal coupled to the switch device, a second terminal coupled to a control signal, a third terminal coupled to a first storage node of at least one tracking cell, a fourth terminal coupled to a second storage node of the tracking cell, and a fifth terminal coupled to the power node of the integrated circuit module, for controlling the switch device to pass the supply voltage to the power node with or without a substantial voltage drop depending on an operation mode of the integrated circuit module.

Abstract: A memory includes an input pad for receiving an input signal and a first circuit. The first circuit is configured to receive a first signal in response to the input signal and receive a second signal and provide a third signal in response to at least one of the first signal and the second signal indicating a request to enter a deep power down mode. The memory includes a second circuit configured to provide a fourth signal indicating an entry to the deep power down mode in response to the third signal.

Abstract: A control arrangement, for example, in a digital component that forms part of a system, draws an input current for its operation and is configured for monitoring an interface for any one of a group of commands and, upon detecting an issued one of the group of commands, operates the component for executing the issued command in an operational mode, and during an idle time on the interface, the control arrangement exclusively monitors the interface for any one of the group of commands such that the input current is limited to a leakage current. The component may draw less than 1 milliamp of current during the idle mode.

Abstract: In one embodiment, a memory block includes one or more bit lines that each include two or more cells. Each cell in each bit line has a distance from a sense amplifier coupled to the bit line, and each of one or more of the cells in each of one or more of the bit lines has a delay particularly set according to the distance of the cell from the sense amplifier coupled to the bit line.

Abstract: Circuits, methods, and apparatus that adaptively control 1T and 2T timing for a memory controller interface. An embodiment of the present invention provides a first memory interface as well as an additional memory interface, each having a number of address and control lines. The address and control lines of the redundant memory interface may be individually enabled and disabled. If a line in the additional interface is enabled, it and its corresponding line in the first interface drive a reduced load and may operate at the higher 1T data rate. If a line in the additional interface is disabled, then its corresponding line in the first interface drives a higher load and may operate at the slower 2T data rate. In either case, the operating speed of the interface may also be considered in determining whether each line operates with 1T or 2T timing.

Abstract: Voltage coupling/decoupling devices are provided within DRAM devices for improving the bias sensing of sense amplifiers and thus the refresh performance. The voltage coupling/decoupling devices couple or decouple bias voltage from corresponding digit lines coupled to the sense amplifiers. By coupling and decoupling voltage from the digit lines, the time interval between refresh operations can be increased.

Abstract: A method of power optimization in a memory is disclosed. The method generally includes the steps of (A) dividing a plurality of bit cells in a design of the memory into (i) a plurality of first rows storing programmed data and (ii) at least one second row storing only padding data, (B) adjusting the design such that a second power consumption in each of the second rows is lower than a first power consumption in each of the first rows and (C) generating a file defining the design as adjusted.

Abstract: Provided is an internal voltage generation circuit for generating an internal voltage used in a semiconductor device. The internal voltage generation circuit includes a standby internal voltage generator which is driven during a standby operation and an active operation and supplies a voltage to a core voltage end, a first active internal voltage generator for supplying a voltage to the core voltage end in response to an active signal activated during the active operation, and a second active internal voltage generator which is driven only for a predetermined time period in response to the active signal, and supplies a voltage to the core voltage end.

Abstract: A semiconductor memory device controls the voltage level of an equalization signal to be a boost voltage VPP for a predetermined time period and then to be an external power supply voltage VDD, when the equalization signal is repeated by a repeater. In order to improve bit line precharging performance of the bit line precharge portion enabled by the equalization signal, a rising interval of the equalization signal is activated as the boost voltage. Precharging is then performed with the external supply voltage after a predetermined time period. Thus, a thin gate insulating membrane can be used in a transistor in the bit line precharge portion which receives the equalization signal can be formed.

Abstract: In one or more of the disclosed embodiments, the number of times toggle operations of a data bus are performed at the time of a data transmission in a semiconductor storage apparatus is reduced, thereby reducing the power consumption. For example, a semiconductor storage apparatus according to one embodiment of the present invention comprises a DRF bus, a DR11F bus, a GDRF bus and a GDR11F bus. The DRF bus and DR11F bus, and the GDRF bus and GDR11F bus, are placed in parallel for the purpose of reducing the number of times toggle operations of a data bus are performed at the time of a data transmission. The DR11F bus is added to make the DRF11F bus perform a toggle operation only when the DRF buses on both sides are made to perform a toggle operation if the data transmission were performed in a conventional system.

Abstract: A programmable logic device (PLD) such as a field programmable gate array (FPGA) has a power-down mode of operation that reduces power consumption during standby or idle periods for the PLD. In one embodiment, the PLD includes a switch such as an internal power supply operable to provide power to the logic core of the PLD, such as the programmable logic blocks, routing structure, and volatile configuration memory. The internal power supply powers down the logic core in response to assertion of a power-down signal, while power is maintained to other circuitry of the PLD.

Abstract: Apparatus, methods, and systems are disclosed, such as those involving a multi-die device having a common bus to indicate a state of each of a die of a multi-die device and that provides the state of all of the dice at a common output. Such a multi-die device can comprise two or more dice in a multi-die package, wherein each of said dice has a first drive parameter when indicating a first state and a second drive parameter when indicating a second state. When the first drive parameter of the two or more dice is at a value such that when one or more of said two or more dice is in the first state, said common output can indicate that all of the dice in the multi-die device are in the first state.

Abstract: A memory architecture and circuits for minimizing current leakage in the memory array. Subdivisions of the memory array each have local power grids that can be selectively connected to power supplies, such that only an accessed subdivision will receive power to execute the memory access operation. The memory array can further include databuses which are precharged to one voltage during idle times and a second voltage during active read cycles, which reduces leakage current in datapath circuitry connected to the databuses within the memory array blocks.

Abstract: A circuit has a storing portion, a write portion and a read portion. In one embodiment, read portion has a transistor which has a substantially thinner gate oxide than the transistors in the storing portion and the transistors in the write portion. In an alternate embodiment, circuit has a plurality of read ports. In an alternate embodiment, selecting the optimal gate oxide thickness for the transistors in circuit allows the trade-off between transistor switching speed and gate leakage current to be optimized to produce a circuit having a fast enough read access time and a low enough standby power.

Abstract: A non-volatile semiconductor memory device, which comprises (i) an interface having an input for receiving an input clock and a set of data lines for receiving commands issued by a controller including an erase command; (ii) a module having circuit components in a feedback loop configuration and being driven by a reference clock; (iii) a clock control circuit capable of controllably switching between a first state in which the reference clock tracks the input clock and a second state in which the reference clock is decoupled from the input clock; and (iv) a command processing unit configured to recognize the commands and to cause the clock control circuit to switch from the first state to the second state in response to recognizing the erase command. The module consumes less power when the reference clock is decoupled from the input clock than when the reference clock tracks the input clock.

Abstract: An integrated circuit includes one or more memory array segments configured to store information and a refresh controller. Each memory array segment has a plurality of memory cells arranged in rows selectable through a row address. The refresh controller is configured to monitor row address activity to identify which bits of the row address change state at least once during a memory access operation and to skip refresh of the rows associated with the row address bits that do not change state at least once during the memory access operation.

Abstract: An energy efficient storage device using per-element selectable power supply voltages provides energy conservation in storage devices while maintaining a particular performance level. The storage device is partitioned into multiple elements, which may be sub-arrays, rows, columns or individual storage cells. Each element has a corresponding virtual power supply rail that is provided with a selectable power supply voltage. The power supply voltage provided to the virtual power supply rail for an element is set to the minimum power supply voltage unless a higher power supply voltage is required for the element to meet performance requirements. A control cell may be provided within each element that provides a control signal that selects the power supply voltage supplied to the corresponding virtual power supply rail. The state of the cell may be set via a fuse or mask, or values may be loaded into the control cells at initialization of the storage device.

Abstract: A semiconductor memory device includes a cell core storing data, a plurality of peripheral circuit components, collectively driving data to/from the cell core and providing a default state at an output signal state during an initialization process upon power-up, and an initialization circuit detecting a standby mode of operation for the semiconductor memory device, and upon detecting the standby mode controlling operation of the plurality of peripheral circuit components to provide the default state as the signal state during standby mode.

Abstract: A method adapts circuit components of a memory module to changing operating conditions within a predefined range. According to one embodiment, a memory module provides a sensor arrangement and a communication bus. Sub-ranges are defined for at least one operating condition, in which the circuit components can work with a fixed setup. During operation, the current state of the at least one operating condition is sensed using the sensing arrangement. The sensed state of the operating condition is mapped to one of the predefined ranges and an associated set of control signals is transmitted over the communication bus. The control signals transmitted over the communication bus are used to adapt at least one circuit component to the current operating conditions.

Abstract: A non-volatile memory array such as a flash memory array may include a power savings circuit to control a stand-by mode of the non-volatile memory array. The power savings circuit may cause a placement of the non-volatile memory array into a stand-by mode in the absence of activity on at least one or more inputs of the non-volatile memory array. Power may be saved automatically without processor intervention by reducing the operating current of the non-volatile memory array. The automatic power savings circuit may provide a chip enable output to an input of stand-by circuitry to control the operation of the standby circuitry without requiring an explicit stand-by command from a processor.

Abstract: A self-contained backup power source such as a battery is provided for components within an electrically powered device such as a storage controller, photocopier or the like, to maintain diagnostic status data and to power a service indicator aid, or diagnostic indicator, such as an LED. A switch selects the backup power source when a primary power source of the electrically powered device is no longer available to the component, such as when the component is removed from the electrically powered device, the primary power source is disconnected as a safety precaution when servicing or replacing the component, or a higher-level assembly, in which the component is provided, is removed from the electrically powered device. The diagnostic indicator may be powered separately from the data storage device.

Abstract: A circuit for supplying power to a sense amplifier in a semiconductor memory apparatus includes: a compensation controlling unit configured to generate a compensation control signal to determine power compensation, in response to a refresh signal. A power compensating unit supplies a compensation voltage input node, which is applied with a first voltage, with a second voltage in response to the compensation control signal. And, a power supply unit configured to supply the second voltage or a voltage at the compensation voltage input node to a sense-amp driver in response to a first power control signal or a second power control signal.

Abstract: An aspect of the invention relates to a method of dynamically adjusting power consumption of a random access memory (RAM) coupled to a processor. Frequency of a memory clock signal coupled to the RAM is reduced. At least one supply voltage coupled to the RAM is reduced. At least one latency parameter of the RAM is configured in response to the reduced frequency and the reduced at least one supply voltage. The RAM may then be re-initialized. In this manner, voltage supplied to the RAM is reduced, thereby reducing power consumption in the RAM.

Abstract: A method for reducing power consumption in integrated devices is provided. The method comprising: locating a plurality of unused blocks of memory and a plurality of used blocks of memory in a memory device tlhrough a tracking mechanism; performing a refresh operation on the plurality of used blocks of memory at a constant frequency and suppressing the refresh operation on the plurality of unused blocks of memory through a memory controller; and suppressing error correction codes or parity errors on at least one of the plurality of unused blocks of memory when the at least one of the plurality of unused blocks of memory is accessed through the memory controller.

Abstract: An integrated circuit includes a first electrode including at least two electrode material layers and a resistivity changing material including a first portion and a second portion. The first portion contacts the first electrode and has a same cross-sectional width as the first electrode. The second portion has a greater cross-sectional width than the first portion. The integrated circuit includes a second electrode coupled to the resistivity changing material.

Abstract: An energy efficient storage device using per-element selectable power supply voltages provides energy conservation in storage devices while maintaining a particular performance level. The storage device is partitioned into multiple elements, which may be sub-arrays, rows, columns or individual storage cells. Each element has a corresponding virtual power supply rail that is provided with a selectable power supply voltage. The power supply voltage provided to the virtual power supply rail for an element is set to the minimum power supply voltage unless a higher power supply voltage is required for the element to meet performance requirements. A control cell may be provided within each element that provides a control signal that selects the power supply voltage supplied to the corresponding virtual power supply rail. The state of the cell may be set via a fuse or mask, or values may be loaded into the control cells at initialization of the storage device.

Abstract: The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without comprising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: A semiconductor device may include a first logic unit for performing a logic operation with respect to a plurality of first control signals, each of which indicates whether a corresponding one of a plurality of banks of the semiconductor device is in an active state, a refresh detector for outputting a second control signal which is enabled when at least one of the banks performs a self-refresh operation or auto-refresh operation, and a second logic unit for performing a logic operation with respect to an output signal from the first logic unit and the second control signal to generate a third control signal having information about activation of the semiconductor device. The third control signal is enabled when at least one of the banks performs the self-refresh operation or auto-refresh operation even though it is in the active state.

Abstract: A method for conserving power in a device is disclosed. The method generally includes the steps of (A) storing a plurality of data items in a plurality of bit cells in the device such that a majority of the bit cells holding the data items have a first logic state, wherein reading one of the bit cells having the first logic state consumes less power than reading one of the bit cells having a second logic state; (B) generating a polarity signal by analyzing the data items, the polarity signal indicating that the data items are stored in one of (i) an inverted condition and (ii) a non-inverted condition relative to a normal condition; and (C) driving at least one of the data items onto an external interface of the device in the normal condition during a read operation based on the polarity signal.

Abstract: Embodiments provide methods, apparatuses and systems including a plurality of memory cells configured to store bit values while being powered at a power-saving voltage lower than a normal-operation voltage during operation of a host apparatus, and power circuitry coupled to the plurality of memory cells. The power circuitry is configured to selectively power a first subset of the plurality of memory cells at the normal-operation voltage during operation of the host apparatus while concurrently powering a second subset of the plurality of memory cells at the power-saving voltage. The first and second subsets being different subsets of the memory cells.

Abstract: A NAND type flash memory included with a memory cell array composed of a plurality of electronically rewritable memory cells arranged in a matrix shape, and a data inversion control section which judges whether a polarity of a “1” data or a “0” data is to be inverted based on the number of the “1” data and the “0” data of the data when data is sent to the plurality of memory cells within a simultaneous write data unit and inverts the data and in the case where it is sent to the memory cell array adds an inversion flag bit to the data which shows the inversion of the polarity.

Abstract: In a semiconductor memory device the power level of which is strengthened by using data input/output pads in a no connection state, and a method of strengthening the power of the semiconductor memory device at a stabilized power level, the semiconductor memory device comprises: a plurality of data input/output drivers; and a plurality of data input/output pads, each connected to a corresponding one of the plurality of data input/output drivers. A first subset of the data input/output pads are connected to respective data input/output pins of a package, and several or all of a remaining subset of the data input/output pads that are not connected to data input/output pins of the package are connected to power pins of the package.

Abstract: A method of power optimization in a memory is disclosed. The method generally includes the steps of (A) dividing a plurality of bit cells in a design of the memory into (i) a plurality of first rows storing programmed data and (ii) at least one second row storing only padding data, (B) adjusting the design such that a second power consumption in each of the second rows is lower than a first power consumption in each of the first rows and (C) generating a file defining the design as adjusted.

Abstract: A power saving method for a semiconductor memory is provided. The power saving method for a semiconductor memory including the steps of receiving a plurality of address codes, each of which has a first part code and a second part code; and activating a first boost process when the first part code of a currently received address code is different from the first part code of a last received address code, otherwise a second boost process is activated.

Abstract: A storage controller for a host device comprises a control module that receives data storing and data retrieving requests from the host device. A disk drive that is controlled by the control module and that selectively stores user data received from the control module and selectively retrieves the user data for the control module. Non-volatile semiconductor memory is controlled by the control module and selectively stores user data received from the control module and selectively retrieves the user data for the control module. The control module selects at least one of the disk drive and the non-volatile semiconductor memory for storage and retrieval of the user data.

Abstract: A memory device responsive to standby mode commands for reducing internal operational power on a memory device is disclosed. The memory device includes a circuit for reducing power during a standby mode with the circuit including a reference with at least first and second reference signals. The circuit also includes a switching device for switching between the first and second reference signals in response to the standby mode command and further controls an internal operational power regulator to adjust between normal and low-power outputs for further reducing the power to portions of the memory device.

Abstract: A semiconductor device includes a memory cell array and a command interface that is configured to receive a command from outside of the semiconductor memory device. The command interface is further configured to interpret the received command and to determine if the received command is a continuous operation command. The command interface outputs a command signal corresponding to the command and at least one flag signal that indicates a continuous operation section if the command is a continuous operation command. A control unit is configured to receive the command signal and the at least one flag signal output from the command interface, and to generate a pump control signal based on the received command signal and the at least one flag signal. A charge pump is configured to generate a voltage in response to the pump control signal for use in accessing the memory cell array to read write and/or erase data.

Abstract: A memory device can be operated in a first operating state and a second operating state, where read access to memory cells can be performed in the first operating state. The memory device includes an activatable clock generator circuit to generate a clock signal. The clock generator circuit can be operated in an activated state, in which it generates the clock signal, and in a deactivated state, in which generation of the clock signal is suppressed. The activatable clock generator circuit is operated in the activated state at a time period after changeover of the memory device from the first operating state to the second operating state, and is changed over from the activated state to the deactivated state no later than after the period has elapsed.

Abstract: A reconfigurable memory in an integrated circuit includes an array of memory cells and a memory controller. The array of memory cells in the reconfigurable memory are tested to determine if they are unusable and if so, their associated physical addresses corresponding to their physical location. After determining the physical addresses where any failure exists, the physical addresses locations associated with the physical locations of unusable memory cells or memory blocks are mapped out to avoid addressing them. While mapping out unusable memory locations or memory blocks reduces the total capacity, the reconfigurable memory has sufficient capacity for the integrated circuit to remain functionally usable.

Abstract: A PLD (200) includes a power management unit (PMU 210) that selectively implements one or more different power-reduction techniques in response to power configuration signals (PC). By manipulating the PC signals, the PMU can independently enable/disable various supply voltage circuits (110, 120, 130) that power CLBs (101), IOBs (102), and configuration memory cells (106), can generate a capture signal that causes data stored in storage elements of the CLBs to be captured in configuration memory cells, and/or can switch power terminals of configuration memory cells between voltage supply circuits. Also, the PMU can sequentially apply and remove power from a number of configurable PLD portions in response to the PC signals, wherein each configurable portion may include any number of the PLD's resources.

Abstract: A temperature sensor instruction signal generator, which may drive a temperature sensor, and a semiconductor memory device including the same. The temperature sensor instruction signal generator may generate an instruction signal that instruct the operation of the temperature sensor using at least one of a master clock (CLK) signal, a clock enable (CKE) signal, a row address selection (RAS) signal, a column address selection (CAS) signal, a write enable (WE) signal, and a chip selection (CS) signal, wherein the instruction signal may be enabled corresponding to at least one of a self refresh mode, an auto refresh mode, and a long tRAS mode. The semiconductor memory device may include a temperature sensor and the temperature sensor instruction signal generator.

Abstract: There is provided a bit line voltage supply circuit for reducing leakage current flowing from bit lines to a memory cell without substantially deteriorating the performance of a semiconductor memory device. A bit line voltage switch applies a first supply voltage to a bit line pair in response to a first switch control signal, and applies a second supply voltage having a lower voltage than the first supply voltage to the bit line pair in response to a second switch control signal. A bit line voltage controller controls the first and second switch control signals so that the second supply voltage is supplied to the bit line pair during a standby mode, and the first supply voltage is supplied to the bit line pair when the semiconductor memory device changes from the standby mode to an operational mode for a predetermined time period.

Abstract: An internal voltage generation device includes a plurality of output nodes; a bit line precharge voltage generation unit for generating a bit line precharge voltage; a first voltage drop unit for transferring the bit line precharge voltage to a first output node after decreasing the bit line precharge voltage by a first voltage drop amount in response to a test mode signal; and a second voltage drop unit for transferring the bit line precharge voltage to a second output node after decreasing the bit line precharge voltage by a second voltage drop amount in response to the test mode signal, wherein the second voltage drop amount is greater than the first voltage drop amount.

Abstract: An internal voltage generator when activated, generates an internal voltage to be supplied to an internal circuit. Operating the internal voltage generator consumes a predetermined amount of the power. In response to a control signal from the exterior, an entry circuit inactivates the internal voltage generator. When the internal voltage generator is inactivated, the internal voltage is not generated, thereby reducing the power consumption. By the control signal from the exterior, therefore, a chip can easily enter a low power consumption mode. The internal voltage generator is exemplified by a booster for generating the boost voltage of a word line connected with memory cells, a substrate voltage generator for generating a substrate voltage, or a precharging voltage generator for generating the precharging voltage of bit lines to be connected with the memory cells.

Abstract: An internal voltage generator includes an output node, a bit line precharge voltage generating unit for generating a bit line precharge voltage, and a voltage drop block for dropping a voltage level of the bit line precharge voltage according to operating modes.

Abstract: In sensing a group of cells in a multi-state nonvolatile memory, multiple sensing cycles relative to different demarcation threshold levels are needed to resolve all possible multiple memory states. Each sensing cycle has a sensing pass. It may also include a pre-sensing pass or sub-cycle to identify the cells whose threshold voltages are below the demarcation threshold level currently being sensed relative to. These are higher current cells which can be turned off to achieve power-saving and reduced source bias errors. The cells are turned off by having their associated bit lines locked out to ground. A repeat sensing pass will then produced more accurate results. Circuitry and methods are provided to selectively enable or disable bit-line lockouts and pre-sensing in order to improving performance while ensuring the sensing operation does not consume more than a maximum current level.