Abstract: An EUV light source of the present invention is capable of using a saturable absorber stably and continuously in a high heat load state. A saturable absorber (SA) device is disposed on a laser beam line to absorb feeble light, such as self-excited oscillation light, parasitic oscillation light or return light. SA gas from an SA gas cylinder and buffer gas from a buffer gas cylinder are mixed to be a mixed gas. The mixed gas is supplied to an SA gas cell via a supply pipeline, and absorbs the feeble light included in the laser beam. The mixed gas is exhausted via an exhaust pipeline, and is sent to a heat exchanger. The mixed gas, cooled down by a heat exchanger, is sent back to the SA gas cell by a circulation pump.

Abstract: A system and method for cooling an optical fiber includes a flexible heat sink member, a heat pipe evaporator, and a thermal storage medium. The flexible heat sink member is in thermal contact with the optical fiber. The heat pipe evaporator is configured to dissipate heat from the optical fiber. The thermal storage medium is in thermal contact with the flexible heat sink member and the heat pipe evaporator. The flexible heat sink member is configured to compensate for any mismatch in coefficient of thermal expansion between material of the optical fiber and material of the flexible heat sink member so as to provide radial compliance and to maintain direct thermal contact between the optical fiber and the flexible heat sink member.

Abstract: A broadband quantum cascade laser includes multiple gain regions and a spacer layer disposed between at least two of the gain regions. The arrangement and characteristics of the gain regions and the spacer layer may be configured to reduce cross absorption between the gain regions. For example, one gain region may be configured to produce gain in an energy range in which another gain region produces absorptive effects. The thickness of the spacer layer may be selected to separate optical modes produced by adjacent gain regions while still producing a single broadband output from the quantum cascade laser. Gain competition between gain stages within a gain region may be mitigated by dividing gain stages with overlapping gain curves among multiple gain regions.

Abstract: A high-gain optical amplifier for a wave to be amplified at a wavelength referred to as the emission wavelength, includes: optical pumping elements (4) producing a pump wave at a wavelength referred to as the pump wavelength; a solid amplifying medium (1) that is doped with active ions, the solid amplifying medium being capable of emitting laser radiation at the emission wavelength when the medium is pumped by the pumping elements; cooling elements (2) capable of cooling the solid amplifying medium to a temperature of no higher than 250 Kelvin; and optical multiplexing elements capable of coupling together the pump wave and the wave to be amplified in the amplifying medium. The amplifying medium has Stark sublevels contained within a spectral domain ranging over less than 200 cm?1 (approximately 20 nm, when expressed in wavelength). A laser including a resonant optical cavity and an amplifier are also described.

Abstract: An apparatus that includes a silicon-based support member and a silicon-based alignment structure is provided. The silicon-based alignment structure is received on a receiving surface of the support member. The alignment structure includes a first surface and a second surface parallel to and facing the first surface with a gap defined therebetween and configured to receive a light-emitting device inside the gap with the first surface and the second surface in contact with the light-emitting device such that, when a collimating rod lens is disposed on the alignment structure and over the gap, a longitudinal center line of the collimating rod lens is not aligned with a mid-point of the gap.

Abstract: The present invention relates to a method and system for repairing and refurbishing a microplate reader of the Flipr type which has a water cooled argon laser light source. The old laser is removed and replaced with a high power (300 to 500 mW) air cooled solid state laser as a replacement place on its own support and focused and wired to replace the old laser. The new product operates at lower power consumption yet provides accurate measurements.

Abstract: Embodiments of a system to maintain an even temperature distribution across a laser detector are generally described herein. In some embodiments, the system includes a multi-layer printed circuit board (PCB) assembly that includes a first layer comprising a thermally-conductive ring provided circumferentially around a thermally-conductive detector region for mounting the laser detector, a second layer comprising a plurality of resistive elements aligned with the thermally-conductive detector region to generate heat, and a fourth layer comprising a thermally-conductive heat-distribution region aligned with the thermally-conductive detector region. A plurality of thermally-conductive vias is provided to couple the thermally-conductive ring of the first layer to the thermally-conductive heat-distribution region of the fourth layer.

Abstract: A diode-laser having an elongated diode-laser emitter is mounted on a relatively massive heat-sink. Two parallel grooves are machined into the heat-sink to leave a relatively narrow elongated ridge of the heat-sink between the grooves. The ridge has a width about equal to or narrower that the width of the emitter. The diode-laser is mounted on the heat-sink such that thermal communication between the emitter and heat-sink is essentially limited to thermal communication with the ridge.

Abstract: The performance of a laser scanner is optimized in the field by automatically determining appropriate laser parameters for the scan location. A laser control system uses information such as the environmental temperature to select an appropriate range of start points for various laser parameters, such as pump temperature and laser currents. Test pulses over that range can be used to determine optimal operating parameters.

Abstract: A highly portable, high-powered infrared laser source is produced by intermittent operation of a quantum cascade laser power regulated to a predetermined operating range that permits passive cooling. The regulation process may boost battery voltage allowing the use of a more compact, low-voltage batteries.

Abstract: A branched optical isolator includes, located over a substrate, at least two branches connected to a trunk at a junction location. At least one branch comprises an optical absorber material and at least one branch comprises an optical transmitter material. The optical isolator may be incorporated into an optical chip carrier such that: (1) an optical emitting portion of an optical chip integral to or attached to the optical chip carrier; and (2) a connection to the optical isolator, are butt connected with a gap less than 10 nanometers, and otherwise materials matched. The optical isolator provides for attenuated backscattered optical radiation into the optical chip.

Abstract: A light emitting device includes a semiconductor laser, which oscillates in a single longitudinal mode, formed above a semiconductor substrate, a first heater, which controls a temperature of the semiconductor laser, provided near the semiconductor laser, a gain unit, which amplifies a beam outputted from the semiconductor laser and outputs an amplified beam, formed above the semiconductor substrate, a second heater, which controls a temperature of the gain unit, provided near the gain unit, and a second harmonic generation element, which converts the amplified beam outputted from the gain unit to a second harmonic light and outputs the second harmonic light.

Abstract: In a laser module (310), single-emitter laser diode chips (110) are positioned at different heights on opposite sides of the module's combined output beam (114). Each laser diode chip (110), and its corresponding fast and slow axis collimators (130, 134), and turning mirror (140) are positioned on a corresponding heat-dissipating surface region (340). High thermal stability and output power are obtained in some embodiments even if the modules are combined to obtain higher-level modules (310-2). Other features and embodiments are also provided.

Abstract: The present invention includes a laser element, a laser-element temperature measuring unit that measures a temperature of a laser element, a harmonic generation element that converts the wavelength of a laser light output by the laser element, a harmonic-generation-element temperature measuring unit that measures a temperature of the harmonic generation element, a harmonic-generation-element temperature adjusting unit that adjusts the temperature of the harmonic generation element, a storage unit that stores therein a relationship between the temperature of the laser element and a target temperature of the harmonic generation element at which a power of the laser light output by the harmonic generation element reaches a maximum, and a controlling unit that controls the harmonic-generation-element temperature adjusting unit so that the temperature of the harmonic generation element is adjusted to the target temperature obtained from the temperature of the measured laser element in accordance with the relations

Abstract: Provided is a tunable laser module emitting an optical signal having high speed, high power and wideband wavelength tuning. The tunable laser module includes a laser array configured to emit an optical signal having a plurality of different lasing wavelengths, a temperature controller configured to change a temperature of the laser array, and an optical integration device configured to modulate or amplify the optical signal at a side of the laser array opposing the temperature controller.

Abstract: A laser source assembly (10) comprises a laser system (228), a mounting base (226), and a temperature control system (229). The mounting base (226) supports the laser system (228). The mounting base (226) includes a side wall (232) having a side top (232T) and a side bottom (232B), and a base floor (234) that extends away from the side wall (232) between the side top (232T) and the side bottom (232B). The temperature control system (229) controls the temperature of the laser system (228) and/or the mounting base (226). The temperature control system (229) includes a heat transferor (246) positioned substantially adjacent to an outer surface (2320) of the side wall (232). Heat generated by the laser system (228) is transferred away from the base floor (234) and through the side wall (232) to the heat transferor (246).

Abstract: The invention relates to a semiconductor laser device comprising a laser bar (2), a flexible conductor support (10), a supporting body (3) of a metal or a metal alloy and a heat sink (4), which is arranged between the supporting body (3) and the laser bar (2), the laser bar (2) being electrically contacted by the flexible conductor support (10) and the supporting body (3) having a thickness of at least 2 mm. The invention further relates to a method for producing the above-described semiconductor laser device, wherein a synchronous soldering process is used to solder the laser bar (2) to the heat sink (4) by means of a hard solder layer (30) and the heat sink (4) to the supporting body (3) by means of a further hard solder layer (31).

Abstract: A wavelength conversion laser light source includes an element temperature switching section that switches a temperature of the wavelength conversion element according to a harmonic wave output value as set in an output setting device, and the element temperature switching section for switching a temperature of a wavelength conversion element according to a harmonic wave output level as set in the output setting device. The element temperature switch section includes an element temperature holding section that holds the wavelength conversion element at the temperature as switched by the element temperature switching section.

Abstract: An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board.

Abstract: A device for emitting a laser beam comprises a cylindrical solid amplifier medium, having a fluorescence wavelength ?, delimited by a surface ? connecting two faces and intended to be pumped through both the faces, or one of them, in order to become a gain medium. It comprises a cooling fluid of thermal conductivity Cr in contact with the amplifier medium over one of the faces, and an index matching liquid that absorbs or scatters the fluorescence wavelength, of thermal conductivity Ci<0.3 Cr, in contact with the amplifier medium over its surface ?.

Abstract: The semiconductor laser device of the present invention has a structure that allows a cooling medium to be directly fed into heatsink disposed inside package. Besides, the structure ensures that the inside of package is kept at hermetically sealed condition. The structure suppresses temperature rise in semiconductor laser element and package, enhancing the reliability and quality of the semiconductor laser device. At the same time, a high-power semiconductor laser element can be employed.

Abstract: An optical device including: a carrier having a first area and a second area, both edges of the second area having a wall of a step, one edge of the second area being adjacent to the first area, the first area having a first thickness, the second area having a second thickness larger than the first thickness; and a first optical component mounted on the first area of the carrier, the second area of the carrier being an absence area of a component.

Abstract: Included are a first modulator, a second modulator, a first optical amplifier that amplifies an output of the first modulator at an amplification factor based on a first bias signal, a second optical amplifier that amplifies an output of the second modulator at an amplification factor based on a second bias signal, an optical phase adjuster that phase-rotates an output of the second optical amplifier, an optical multiplexer that multiplexes an output of the first optical amplifier with an output of the optical phase adjuster, and a second bias corrector that generates a first pulse signal and a second pulse signal, which are complementary to each other, and obtains a first bias value and a second bias value based on a change of strength of an output signal of the optical multiplexer. The first and second pulse signals are superimposed on the first and second bias signals, respectively.

Abstract: To obtain a laser light source module, a copper-based material is press-fitted into a through hole formed in a stem made of an iron-based material, thereby forming a first heat sink. A mount made of a copper-based material is fixed to the first heat sink and at least one semiconductor laser device is mounted on the mount. A second heat sink is bonded to lower surfaces of the stem and the first heat sink by a thermal conductive adhesive. An upper surface of the first heat sink is located on a same plane as that of the stem, and a lower surface of the first heat sink is located higher than that of the stem.

Abstract: A thermal conduction path for a heat-sensitive, heat-generating component is formed by placing a heat-generating device, such as a laser diode, in a desired orientation relative to a supporting surface. A solid-phase mass of a heat-conducting material is positioned between the heat-generating device and the supporting surface and is converted to liquid phase by heating the supporting surface. Additional heat-conducting material is then added to the liquid-phase heat-conducting material until a meniscus is formed between the heat-generating component and the supporting surface. Because the heat-conducting material has a melting point or liquidus that is less than a critical temperature of the heat-generating component, the thermal conduction path can be formed without damaging the heat-generating component.

Abstract: An optical transmitter is disclosed, where the optical transmitter shows an emission wavelength kept stable in one of grid wavelengths of the WDM system during the boot of the transmitter. The optical transmitter includes an LD, a TEC to control a temperature of the LD, and a controller. Detecting the flag to enable the optical output, the controller increases the driving current of the LD concurrently with the decrease of the temperature of the TEC to compensate the self-heating of the LD due to the driving current.

Abstract: A thermal management apparatus and method for a solid-state laser system enabling the laser system to have near isothermal temperatures across and throughout a solid-state gain material, by mechanically controlling an oscillating heat pipe having effective thermal conductivity of 10-20,000 W/m*K; bonding a solid-state lasing crystal or ceramic to the mechanically controlled oscillating heat pipe; and providing a supporting structure including a surface bonded to the solid-state lasing crystal or ceramic that matches the coefficient of thermal expansion of both the solid-state lasing crystal or ceramic and the mechanically controlled oscillating heat pipe.

Abstract: The invention is a method and apparatus for creating marks on an anodized aluminum specimen with selectable color and optical density. The method includes providing a laser marking system having a laser, laser optics and a controller operatively connected to said laser to control laser pulse parameters. The laser marking system is directed to produce laser pulses having laser pulse parameters associated with the desired color and optical density in the presence of a fluid directed to the surface of the anodized aluminum specimen while marking.

Abstract: The present embodiment provides a thin disk laser disk element having improved direct cooling through the use of a barrier material directly attached to the high reflectivity layer of the thin disk element. This barrier is needed due to noticeable degradation of the reflectivity of the thin disk element without the barrier material. A barrier material of sapphire (crystalline Al2O3) is preferable, given a desire to have adequate thermal conductivity through the barrier material, proper matching of the coefficient of thermal expansion with the other components of the thin disk, and to save monetary costs. In another preferred embodiment, an intermediate layer is interposed between the thin disk element and the barrier material to provide improved adhesion between the barrier material and the thin disk element. Preferred crystallographic orientations for sapphire barrier material are provided as well.

Abstract: An optical transmitter implemented with an LD whose temperature is stably controlled is disclosed. A temperature of the LD is continuously monitored; and a difference from the target temperature and a time derivative thereof are calculated. When the time derivative becomes substantially zero, that is, the difference becomes an extremum, the convergent range for the time derivative is changed depending on the extremum, or an average of the current extremum and the previous extremum.

Abstract: A laser device includes: a semiconductor laser element having an output surface; an optical fiber having a leading end portion facing the output surface of the semiconductor laser element; and an optical fiber supporting member for supporting the optical fiber, the optical fiber supporting member being made from a non heat insulating material and having a bonding pad to which the optical fiber is fixed by use of solder. The optical fiber supporting member includes a contact portion thermally in contact with a base. The bonding pad is (i) spaced apart from the contact portion so as to be located on a side opposite from the contact portion so that a region to which laser light is applied from another laser element when the optical fiber is fixed to the bonding pad is sandwiched between the bonding pad and the base and (ii) separated spatially from the base.

Abstract: A fan for circulating laser gas in a gas laser, the fan having a shaft which is supported by at least one radial bearing and at least one axial gas bearing. The axial gas bearing has at least two rotating bearing faces, one or both being structured with a groove pattern, and at least two stationary bearing faces that are arranged at both sides of a plate.

Abstract: A mirror includes a mirror base provided with a flow channel through which a heat medium passes for cooling the mirror. The flow channel includes a buffer tank portion for adjusting a flow rate of the heat medium in the flow channel. A reflective film is provided on the mirror base.

Abstract: The laser device includes a semiconductor laser element having an emission surface from which laser light is emitted, an optical fiber having an end part facing the emission surface, and an optical fiber supporting member which (i) supports the optical fiber and (ii) has a bonding pad to which the optical fiber is fixed by solder. The optical fiber supporting member includes a beam part having (i) a first main surface on which the bonding pad is provided and (ii) a second main surface opposite to the first main surface, and a pillar part which is fixed to a base and is joined to the beam part on an end portion of the beam part such that the second main surface and the base face each other while being spatially away from each other.

Abstract: The present invention provides a semiconductor light emitting element that can obtain oscillation at desired wavelengths. The semiconductor light emitting element comprises a semiconductor substrate 11, an active layer 12 for emitting and propagating light, which is formed in a stripe shape above the semiconductor substrate 11, buried layers 13a, 13b formed on both lateral sides of the active layer 12, a cladding layer 16 formed above the active layer 12 and the buried layers 13a, 13b, a first electrode 17a formed above the cladding layer 16, and a second electrode 17b formed below the semiconductor substrate 11. The active layer 12 opens on one end facet 14a among the two end facets formed by cleavage so that the active layer 12 makes a predetermined angle to the normal direction of the one end facet 14a.

Abstract: A parallel optical transceiver module is provided that has a heat dissipation system that dissipates large amounts of heat, while also protecting the laser diodes, ICs and other components of the module from particulates, such as dust, for example, and from mechanical handling forces. The heat dissipation system is configured to be secured to the optical subassembly (OSA) of the module such that when the OSA is secured to the upper surface of the leadframe of the module, the OSA and the heat dissipation system cooperate to encapsulate at least the laser diodes and laser diode driver IC in a way that protects these components from dust and other particulates and from external mechanical forces. The heat dissipation system of the module is disposed for coupling with an external heat dissipation system, e.g., with a heat dissipation system that is provided by the customer.

Abstract: A laser diode package includes a laser diode, a cooler, and control circuitry, such as an integrated circuit. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets. The ceramic sheets are fused together. The ceramic sheets include traces or vias that provide electrically conductive paths to the integrated circuit. The control circuitry controls the output of the laser diode, e.g. the output at each of the laser diode's emitters. Multiple laser diode packages are placed together to form an array.

Abstract: A method to control an LD (laser diode) is disclosed. The method compares the operating temperature of the LD with a transition temperature. When the former temperature exceeds the latter, the modulation current is set based on the bias current, which is independently determined by the APC loop. On the other hand, the operating temperature is less than the transition temperature; the modulation current is determined by the operating temperature.

Abstract: A method for stabilizing multi-channel optical signal wavelengths includes the following steps. A first detecting signal is stacked on a plurality of driving signals in sequence. A plurality of optical signals generated after being driven by the plurality of driving signals is combined into one optical total signal. A wavelength detection is performed on the optical total signal. A second detecting signal with a frequency band the same as that of the first detecting signal is extracted from the signals obtained after the wavelength detection. The wavelength of the optical signal in the corresponding channel among the multiple channels is controlled according to the second detecting signal. A device for stabilizing multi-channel optical signal wavelengths is also provided. Using the above method or device, the multi-channel optical signal wavelengths can be stabilized, which requires less elements, and has a simple circuit structure, a high integration level, and a low cost.

Abstract: An apparatus comprising a carrier comprising at least one heat-generating component and a thermoelectric cooler (TEC) coupled to a surface of the carrier, wherein the cross-sectional area of the TEC is less than the cross-sectional area of the carrier, and wherein the TEC is aligned with the heat-generating component. Included is an apparatus comprising a carrier comprising a plurality of optical transmitters and an active component, at least one TEC coupled to the surface of the carrier, and a support post coupled to the surface of the carrier, wherein the support post has a higher thermal resistivity than the TEC, wherein the cross-sectional area of the TEC is less than the cross-sectional area of the carrier, and wherein the TEC is aligned with the optical transmitters, the active component, or both.

Abstract: A mount for semiconductor laser devices comprises thermally conductive anode and cathode blocks on either side of a semiconductor laser device such as a laser diode. Interposed between at least the anode block and the anode of the semiconductor laser device is a sheet of conformable material with high thermal conductivity such as pyrolytic highly-oriented graphite. In some embodiments, a second sheet of such thermally conductive conformable material is interposed between the cathode of the semiconductor laser device and the cathode block. The semiconductor laser device can be either a single laser diode or a diode bar having a plurality of emitters. A thermally conductive, but electrically insulating, spacer of essentially the same thickness as the laser diode or bar surrounds the diode or bar to prevent mechanical damage while still permitting the conformable material to be maintained in a compressed state.

Abstract: In an optical disk apparatus, by obtaining the temperature in the vicinity of a laser in the apparatus, the power source voltage of the laser driver is controlled such that power consumed by the headroom of the laser driver is reduced to the maximum extent without deteriorating the current drive characteristic of the headroom when the temperature becomes higher. The laser driving current of the laser driver is monitored to control the power source of the laser driver such that the power consumed by the headroom is possibly reduced while maintaining the current drive characteristic of the headroom for the monitored current.

Abstract: One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.

Abstract: According to one of embodiment, an apparatus for image projecting and a method for controlling color fluctuation of light are acquired the temperatures of a plurality of light sources configured to emit light beams of different colors or the temperature at a position near the light-emitting elements, set an amount of light each of the light sources emits, in accordance with the temperature acquired of the light source, and set at least one of the color and brightness of the image to be projected. The fluctuation of the color or brightness of the image to be projected can therefore be controlled.

Abstract: A hand-held laser weapon including: a laser module for generating a laser light; a telescope module fiber optically coupled to the laser module for focusing the laser light on a target; a burst power module, including a storage capacitor, for storing electrical energy capable of a rapid release in the form of a current; a trickle power module including a battery for providing said electrical energy to the burst power module; a drive circuit for driving the laser module with the stored electrical energy to generate the laser light; a trigger module for providing the stored electrical energy to the drive circuit; and a structure for coupling at least the laser module, the telescope module, the drive circuit and the trigger module together.

Abstract: An assembly for distributing laser energy is provided that is formed using a compact rigid housing with a sealed beam path contained therein. The assembly employs a monolithic housing with modular collimator and mirror switching components installed therein to reduce its size while maintaining a sealed beam path thereby reducing the possibility of contamination of the beam path. Other than the optics and mirror, there are no elements of the distribution device contained within the beam path. In one embodiment, the assembly distributes incoming energy from a single source to one or more outputs. In another embodiment, the assembly operates as a beam combiner to direct energy from one or more sources to a single output.

Abstract: A high power laser source comprises a bar of laser diodes having a first coefficient of thermal expansion CTEbar on a submount having a second coefficient CTEsub and a cooler having a third coefficient CTEcool. The submount/cooler assembly shows an effective fourth coefficient CTEeff differing from CTEbar. This difference leads to a deformation of the crystal lattice of the lasers' active regions by mechanical stress. CTEeff is selected to be either lower than both CTEbar and CTEcool or is selected to be between CTEbar and CTEcool. The submount may either comprise layers of materials having different CTEs, e.g., a Cu layer of 10-40 ?m thickness and a Mo layer of 100-400 ?m thickness, or a single material with a varying CTEsub. Both result in a CTEsub varying across the submount's thickness.

Abstract: A laser array light source unit 1 includes: a plurality of semiconductor lasers 2 each including a main body portion 2a and a leg portion 2b with two leading electrodes; a laser holder 3 holding the main body portions 2a, and having through-holes for the leg portions 2b; a pressing member 5 for fixing the semiconductor lasers 2 to the laser holder 3; an insulator 4 including a plurality of electrode insertion portions 4f having through-holes for the leading electrodes; and a wiring base 6 for electrically connecting at least two of the semiconductor lasers 2 in series. The insulator 4 includes a connecting portion 4b for connecting the plurality of electrode insertion portions 4f in the same direction in which the plurality of semiconductor lasers 2 are arranged. The wiring base 6 includes first through-holes into which the leading electrodes of the semiconductor lasers 2 are inserted.

Abstract: A laser unit, usable in a network interface unit (NIU), that includes a laser adapted to generate an optical signal having a wavelength, a temperature control system for establishing a temperature of the laser and a controller functionally connected to the temperature control system for setting the temperature, the controller configured to automatically vary the temperature between a high temperature and a low temperature different than the high temperature. Also an NIU and a system of NIU's including the laser and an associated method of controlling the laser.

Abstract: An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.