Abstract: A substrate temperature measurement apparatus and a processing apparatus, whereby thermocouple wire reliability is improved, influence of infrared rays on the chip is reduced and the temperature of the substrate can be accurately measured. A chip (16) made of metal material reflecting infrared rays and electromagnetic waves, has an insertion opening (16a) for inserting thermocouple wires (20a, 20b) is crushed and deformed with the thermocouple wires inserted, and thereby united together with the thermocouple wires, and contacted with the substrate (13); and a supporting member or members (15b, 15c), made of material of lower thermal conductivity than said chip (16), are provided for supporting said chip (16).

Abstract: Disclosed is a temperature measuring device. The temperature measuring device includes: a thermo-well tube; and a cable or wire type temperature measuring means which is installed in a thermo-well tube, wherein temperature measuring means has temperature detecting sensors disposed at an intermediate portion thereof, and the temperature detecting sensors can be moved axially in the thermo-well tube by applying tension to both ends of the cable or wire type temperature measuring means. The present invention also provides a reaction tube in which the temperature measuring device is disposed axially, and a reactor including at least one temperature measuring device or reaction tube as described above.

Abstract: Thermoanalytical sensor for calorimetric measurements which cooperates with a temperature control device and comprises at least one measurement position formed on the sensor, a heat flow path established between the temperature control device and the at least one measurement position, and at least one temperature-measuring element, characterized in that the sensor has a plurality of layers which are formed substantially by ceramic elements that have been solidly bonded to each other by undergoing a sintering process together and which in their green state can be provided with a structure, wherein at least a part of the ceramic elements are structured.

Abstract: An instrument and associated method are disclosed for the loss-on-drying determination of the volatile content of a wide variety of samples.

Abstract: Heat transfer test assemblies for monitoring and recording fouling of aqueous systems are disclosed. The heat transfer test assemblies include an outer tube member, a heating rod positioned within the outer tube member, a ribbed tube sleeve fitted over the heating rod and thermocouples for sensing the wall temperature of heating rod. The disclosed heat transfer test assemblies enable improved monitoring of systems employing enhanced heat exchanger tubes. Monitoring and recording apparatuses including the heat transfer test assemblies are also disclosed.

Abstract: Method for the certification of heater blankets by means of infrared thermography, in which a heater blanket (1) to be certified is enclosed in a vacuum bag (3,4,5,5?,8,9,10) arranged above a support (2) and thermally insulated therefrom, the vacuum is formed inside said bag and said heater blanket is connected until its temperature is stabilized at a predefined value, considerably higher than the ambient temperature, whereupon the best infrared image or images of said heater blanket (1) are recorded and stored by means of an infrared camera (14) situated opposite it, then interrupting the electric power supply to said heater blanket and processing the stored images so as to produce, finally, a certification report.

Abstract: An apparatus and method for determining terminal solid solubility temperature in materials capable of forming hydrides, such as reactor pressure tubes. An inspection device is positioned within the reactor pressure tube under test and a pair of annular seals are radially deployed to seal a section of the pressure tube. Any water within the sealed section is displaced through the injection of gas and the heating of the sealed section to dry the tube and the device. A probe assembly on the device is deployed to contact the interior surface of the pressure tube and measure resistivity changes in the pressure tube wall as a function of temperature. The probe assembly includes a thermocouple probe for measuring temperature and transmit and receive coils for inducing eddy currents within the pressure tube wall. The pressure tube is allowed to cool at a predetermined rate, is reheated at a predetermined rate, and is allowed to cool again.

Abstract: A wireless parameter sensing system for a flask for use in lyophilization as well as a method of controlling a lyophilization process based on the sensed readings is disclosed. The wireless parameter sensing system may include a stopper adapted to be removably secured to an open end of the flask. A control unit may be positioned within an inner portion of the stopper. A parameter sensor may be connected with the control unit. A radio frequency transmitter may be connected with the control unit, wherein the control unit is operable to periodically transmit a parameter reading from the parameter sensor with the radio frequency transmitter.

Abstract: Systems are provided for measuring temperature in a semiconductor processing chamber. Embodiments provide a multi-junction thermocouple comprising a first junction and a second junction positioned to measure temperature at substantially the same portion of a substrate. A controller may detect failures in the first junction, the second junction, a first wire pair extending from the first junction, or a second wire pair extending from the second junction. The controller desirably responds to a detected failure of the first junction or first wire pair by selecting the second junction and second wire pair. Conversely, the controller desirably responds to a detected failure of the second junction or second wire pair by selecting the first junction and first wire pair. Systems taught herein may permit accurate and substantially uninterrupted temperature measurement despite failure of a junction or wire pair in a thermocouple.

Abstract: The invention provides a temperature measurement system including a temperature sensor and means for biasing the temperature sensor in the direction of a thermal energy source in response to receiving thermal energy from the source. The invention also provides a continuous casting system including at least one temperature sensor disposed in the secondary cooling region and means for biasing the temperature sensor in the direction of the strand of metal in response to receiving thermal energy from the strand of metal.

Abstract: A device for measuring a temperature of a heat pipe includes at least one measuring assembly, a block and at least one base. The measuring assembly includes a resilient member with one end thereof mounted on the base, a supporting member coupled to the other end of the resilient member, and a thermocouple arranged on the supporting member. The block defines a through hole configured for receiving the heat pipe inserted therein, and at least one opening in communication with the through hole. The at least one opening is configured for receiving the corresponding at least one measuring assembly. The device can improve the accuracy of temperature measuring of the outer surface of the heat pipe.

Abstract: A mounting terminal head of a thermocouple head unit having a metal casing for an end of a thermocouple wire, and thermocouple signal terminals 4 for connection to a thermocouple wire. The thermocouple head unit includes an insulating support member 8 extending around the outside of the thermocouple head unit and supporting the thermocouple signal terminals.

Abstract: A temperature detecting device includes a heat receiving plate, a displacement transmitting part, a deforming part, a deformation generating part and a displacement detecting part. The heat receiving plate is restrained at its rim portion to generate a displacement of a central portion in its thickness direction with respect to the rim portion in accordance with the temperature of an atmospheric gas. The displacement transmitting part is displaced in accordance with the displacement of the central portion of the heat receiving plate. The deforming part is deformed by the displacement transmitting part. The deformation generating part maintains a distance between the rim portion of the heat receiving plate and the deforming part. The displacement detecting part detects a deformation of the deforming part and outputs an electric signal.

Abstract: A burning oven, especially for dental materials, is provided and includes a temperature detection element and a calibrating device for calibrating the temperature detection element. The calibrating device has a temperature sensor that in turn can be calibrated at a given number of temperature points, especially one or two temperature points.

Abstract: A thermocouple rake. The thermocouple rake may include a number of support rods extending through a number of support disks, a number of thermocouple tubes extending through the support disks, and with the thermocouple tubes and the support disks having a thermal compression bond when heated.

Abstract: Systems and methods for evaluating the properties of fluids are described. One embodiment of the invention includes a printed wiring board substrate on which a first conductivity sensor and a second conductivity sensor are located, a temperature sensor mounted on the printed wiring board substrate and a casing partially encapsulating the printed wiring board substrate so as to leave at least the first and second conductivity sensors exposed.

Abstract: Various devices for measuring an electronic device lid are provided. In one aspect, an apparatus is provided that includes an integrated circuit, a lid for positioning on the integrated circuit, and a junction of two dissimilar metals associated with the lid. The junction provides a thermocouple to provide an output signal representative of a temperature of the lid.

Abstract: A probe for a scanning thermal microscope includes a cantilever beam, an insulating layer, a conductive layer and a carbon nanotube. The cantilever beam includes a microtip at a distal end thereof, and the microtip has a conductive exterior portion with a pointed part. The insulating layer is formed on a part of the conductive exterior portion other than the pointed part thereof. The conductive layer is formed on the insulating layer and has a coupling portion in contact with the pointed part of the conductive exterior portion of the microtip, the coupling portion of the conductive layer and the pointed part of the conductive exterior portion thereby cooperatively form a thermocouple junction. The carbon nanotube has one end arranged on the thermocouple junction. The probe for a scanning thermal microscope increases spatial resolution of scanning thermal microscope and can prevent excessive current leakage.

Abstract: A furnace of controlled heating and treatment of material using infrared radiation. The furnace is capable of continuous infrared treating of material with consistent radiation being applied to the material, ease of access to the furnace for maintenance cleaning and repair, excellent control of radiant cooling of the material to be treated, and ease of maintenance of a volatile component condenser.

Abstract: A thermocouple for measuring temperature at a position adjacent to a substrate being processed in a chemical vapor deposition reactor is provided. The thermocouple includes a sheath having a measuring tip. The thermocouple also includes a support tube disposed within the sheath. The thermocouple further includes first and second wires supported by the support tube. The first and second wires are formed of different metals. A junction is formed between the first and second wires, wherein the junction is located adjacent to a distal end of the support tube. A spring is disposed about a portion of the support tube. The spring is compressed to exert a spring force on the support tube to bias the junction against the measuring tip to maintain the junction in continuous contact with the measuring tip. The spring force is small enough to prevent significant deformation of the junction as well as reducing variation of spring force or junction location from one thermocouple to another.

Abstract: A sensor apparatus including a plurality of sensors, and a measurement device. The plurality of sensors being divided into sensor groups with each sensor group having a number of sensors. The groups being arranged such that the sensor groups are electrically matched. The sensors in a sensor group coupled in parallel with each other to form a sensor ladder. A measurement device is arranged to compare electrical signals from each sensor group and to output an indication signal, wherein the measurement device is coupled to each sensor ladder at an intermediate position and in that the coupling position of each sensor ladder are electrically equivalent to one another. Also provided by the present invention is a method of monitoring a plurality of sensors.

Abstract: A temperature measurement device includes a first thermocouple mounted on a tubular body that is shielded from the effects of radiation by a radiation shield, and a second, unshielded thermocouple. A difference in the measured temperatures from the first and second thermocouples is compared with calculated temperatures using an iterative process to determine a corrected temperature of the gas stream that estimates and compensates for incident radiation.

Abstract: In a thermoanalytical sensor with a substrate and a thermocouple arrangement that is formed at a measurement position on the substrate, an increase in sensitivity can be achieved by way of a special geometry of the thermocouple arrangement and/or the selection of the material for the substrate. In addition, a manufacturing method is proposed for the inventive sensor.

Abstract: A radiant shield and a furnace employing a radiant shield for controlled heating and treatment of material using infrared radiation. The furnace is capable of improved temperature control where material treated by the furnace may interfere with the quality of a measured temperature signal and temperature control based on that signal.

Abstract: To calibrate a thermocouple, a calibrating thermocouple, made of the same thermocouple material as a detecting thermocouple, is used. An absolute thermoelectric power Ero, of the calibrating thermocouple is determined in advance, and the detecting thermocouple is assumed to have the same Ero. An internal resistance rs of the detecting thermocouple is obtained, and a short-circuit current Is is measured with a measured temperature difference ?Ts using an operational amplifier, and the temperature difference ?Ts is calculated. An offset of the operational amplifier is also calibrated. The thermocouples and switches are connected to an inverting input terminal of the operational amplifier, so that the sensors can be selected. Alternatively, these are connected to a non-inverting input terminal, allowing a plurality of the thermocouples to be switched, while a small resistor r is connected to the inverting terminal thereof, to provide an equivalent current detection type thermocouple.

Abstract: A thermowell mounting assembly and method which allow a finite-length thermowell tube to be precisely adjusted by length during field installation to a desired position within a machine, process unit, or other location to be evaluated by a thermocouple. The adjustable length thermowell protects the thermocouple from a harsh process environment while simultaneously facilitating temperature measurement by the thermocouple at the adjusted length of the thermowell. Adjustment of thermowell length is achieved by rotation of the thermocouple-thermowell assembly from a position exterior to a mounting flange connected to the machine or process unit.

Abstract: A work piece 1 mounted on a movable table 22 is rotated while adjusting cutting depths of a grinding wheel 23 by means of feed motor so as to perform cylindrical grinding. During the cylindrical grinding, a thermocouple 42 is pushed to and caused to contact the rotating cylindrical grinding surface 1a of the work piece 1 at a constant pressure and thermoelectromotive force generated by the thermocouple 42 is measured. Surface roughness data corresponding to the measured thermoelectromotive force are obtained on the basis of the thermoelectromotive data obtained by the measurement and correlation between thermoelectromotive force and surface roughness concerning a known standard surface previously obtained and memorized. The surface roughness data are output and displayed on a display section. Therefore, an in-process measurement of surface state of the work piece 1 can be performed, while the machining such as cylindrical grinding is being carried out.

Abstract: A TGT measurement system comprises a plurality of thermocouples connected in parallel to a distributor, and a data storage device carrying calibration data relating to at least one of the thermocouples.

Abstract: A method of determining the degree of calibration of an RTP chamber (1) includes providing a test wafer having a deposited sichrome layer (22) of sheet resistance Rsi on an oxide layer (21) formed on a silicon substrate (20). The test wafer is annealed in the RTP chamber for a selected duration at a selected anneal temperature which is measured by the a permanent thermocouple or pyrometer (8). The sheet resistance of the annealed sichrome is measured, and a sheet resistance change ?Rs=Rsi?Rsf is computed. The “actual” value of the anneal temperature is determined from predetermined characterizing information relating ?Rs to a range of values of anneal temperature. The RTP chamber is re-calibrated if in accordance with the value of ?Rs if the difference between the “actual” value of the anneal temperature and the value measured by the permanent thermocouple or pyrometer exceeds an acceptable error.

Abstract: An assembly and method for testing the fire performance of sheet piling sections which includes: a first wall formed from sheet piling sections; a second wall substantially parallel to the first wall; a base plate; and a pair of end sections extending between the opposing ends of the two walls. The first and second walls and the end sections are attached to, and extend upwardly from, the base plate to form a cavity, which can be filled with materials. The assembly also includes two top sections, which are attached to the first and second walls and joined together by at least one connector. The sheet piling sections of the first wall are exposed to a heat source to certify compliance with fire codes and regulations.

Abstract: A method for fabricating a thermocouple capable of long-term operation in high temperature, hostile environments without significant signal degradation or shortened thermocouple lifetime due to heat induced brittleness.

Abstract: The invention provides a temperature measurement system including a temperature sensor and means for biasing the temperature sensor in the direction of a thermal energy source in response to receiving thermal energy from the source. The invention also provides a continuous casting system including at least one temperature sensor disposed in the secondary cooling region and means for biasing the temperature sensor in the direction of the strand of metal in response to receiving thermal energy from the strand of metal.

Abstract: A device and method for determining a thermal absorption of a part of an integrated circuit (IC) are provided. A specially designed ring oscillator including a non-silicided poly-silicon resistor is used for the determination. The parameters of the ring oscillator are designed/tuned so that a delay of the ring oscillator varies predominantly with a variation in a resistance of the non-silicided poly-silicon resistor. The dimensions of the non-silicided poly-silicon resistor are large enough so that the resistance of the non-silicided poly-silicon resistor is immune to the small process variations of the poly-silicon length and width. The resistance of the non-silicided poly-silicon resistor varies with the thermal absorption of the part of the IC. As such, the thermal absorption of the part of the IC may be determined based on the delay of the ring oscillator.

Abstract: Disclosed is a thermocouple circuit that exhibits reduced levels of thermocouple drift. The thermocouple is generally comprised of first and second thermoelectric elements formed of first and second thermoelectric materials, respectively. The first and second thermoelectric elements are coupled to an electrically conductive substrate through intermediate first and second tab elements, respectively. The first and second tab elements are preferably formed of the respective first and second thermoelectric materials, and coupled to the substrate in a spaced apart configuration such that the first and second tab elements, are not physically coupled one to the other. Also disclosed are systems and methods for the preparation and use of the thermocouple circuits disclosed herein.

Abstract: A thermocouple assembly for the continuous measurement of the temperature of a molten phase contains first and second ceramic elements contacting each other at a first junction and forming thereby a first thermocouple, a second thermocouple formed of two different conducting elements contacting each other at a second junction located on the first ceramic element and a third thermocouple formed of two different contacting elements contacting each other at a third junction located on the second ceramic element. Both positive legs or both negative legs of the second and third thermocouples are connected to a first measuring device. Both legs of the second and third thermocouple are connected respectively to a second and third measuring device as well as to a process for the measurement of the temperature of a molten phase.

Abstract: A thermopile-based thermal detector is provided by a thermocouple, formed from a single sheet of material, which is made dissimilar with a P-doped and an N-doped junction electrically isolated via a naturally forming depletion region. The thermopile P-N sheet is uniform and planar, addressing stress and manufacturing issues. The usual non-active area of a conventional thermopile is significantly reduced or eliminated, and thus the output signal per unit diaphragm area of the detector is substantially increased, without the typical reduction in the signal-to-noise ratio. Also, a significant reduction in size of the thermal detector area is provided without a reduction in signal or signal-to-noise ratio. In an aspect, a second layer of thermocouples is axially positioned over, and connected with, a first layer of thermocouples. Additional axially stacked thermopiles can be provided within the same fabrication process. Signal processing circuitry may be electrically interconnected with the thermocouple.

Abstract: A clamping device with flexible contact for heat pipe includes a clamping body and a thermal couple wire. The clamping body includes a clamping section formed by at least two claws. The thermal couple wire has one end enclosing a pressing element and includes a temperature-sensing head at end of the pressing element. A first clamping block is provided on the claw and comprises an accommodating space. An opening is defined at end of the accommodating space near the first clamping block. The pressing element is elastically pressed in the accommodating space such that the temperature-sensing head is exposed out of the opening.

Abstract: There are provided a sensor unit of thermal analysis equipment capable of keeping heat conduction between a furnace body and samples to detect a temperature difference between the samples with high sensitivity, while suppressing the heat conduction between a measurement sample and a reference sample, and a method of manufacturing the same.

Abstract: A system for monitoring the temperature of a component includes a temperature sensor that is in thermal contact with the component. The temperature sensor includes a thermocouple and connecting lines. The thermocouple is mounted in an electrically conducting fashion onto a flexible printed circuit board tape in which the connecting lines are integrated. The component is a mirror and the flexible printed circuit board tape is disposed as an electrical insulator between the thermocouple and the mirror.

Abstract: An apparatus for testing properties of a product comprising a thermal barrier layer comprises an ignition source, a test stand that extends a sample of the product over the ignition source, and a means for measuring thermal transfer across the sample. The apparatus may further comprise a means for measuring thermal transfer across each layer of the sample. A method for testing properties of a product comprising a thermal barrier layer comprises supporting a sample of the product over an ignition source, heating the sample via the ignition source, and determining a thermal differential across the sample. The method may further comprise determining a thermal differential across each layer of the sample.

Abstract: Self-Validating Thermocouple (SVT) Systems capable of detecting sensor probe open circuits, short circuits, and unnoticeable faults such as a probe debonding and probe degradation are useful in the measurement of temperatures. SVT Systems provide such capabilities by incorporating a heating or excitation element into the measuring junction of the thermocouple. By heating the measuring junction and observing the decay time for the detected DC voltage signal, it is possible to indicate whether the thermocouple is bonded or debonded. A change in the thermal transfer function of the thermocouple system causes a change in the rise and decay times of the thermocouple output. Incorporation of the excitation element does not interfere with normal thermocouple operation, thus further allowing traditional validation procedures as well.

Abstract: A temperature measuring device is configured of a substrate formed of a silicon wafer, a thermocouple formed by using the film forming method, the photolithographic method, and the etching method, and a clamp pad (an electrode pad) which is arranged in an edge portion of the substrate, and which is connected to the thermocouple. In a semiconductor manufacturing apparatus, the temperature measuring device is fixed on a wafer mounting portion with a clamper pin (a fastening device) being in contact with the clamp pad. An output of the thermocouple is taken out to the outside through the clamper pin.

Abstract: A temperature sensor adaptor assembly and method having a conversion circuit configured for receiving an input characteristic of an input temperature sensor and generating a pulse width signal having a pulse width that varies in response to the received input characteristic. The assembly also includes an output circuit coupled to the conversion circuit for receiving the pulse width signal, coupled to an output, and configured for providing an impedance at the output responsive to the pulse width of the received pulse width signal. The provided impedance at the output corresponds to an impedance of a synthesized temperature sensor that is different from the input temperature sensor.

Abstract: A probe assembly of an infrared thermometer is capable of detecting the surface temperature of a thermal radiation source and is suitable for holding over human skin or inserting into a patient's ear canal for accurately taking human body temperature. The probe assembly comprises a taper plastic tube, a conductive shell, an infrared radiation sensor and an adiabatic supporter, wherein the plastic tube has a radiation collection end and the conductive shell has a first open end. The infrared radiation sensor is placed in the first open end of the conductive shell, and has a base against the adiabatic supporter. The infrared radiation sensor has a hot junction toward the first open end of the conductive shell and a cold junction toward the adiabatic supporter.

Abstract: A temperature sensor for measuring a temperature of a moving or stationary surface includes a main body portion and a probe head with thermocouple element, the probe head coupled to the main body portion such that the probe head reciprocates relative to the main body portion in a pulsed manner.

Abstract: In a thermoanalytical sensor with a substrate and a thermocouple arrangement that is formed at a measurement position on the substrate, an increase in sensitivity can be achieved by way of a special geometry of the thermocouple arrangement and/or the selection of the material for the substrate. In addition, a manufacturing method is proposed for the inventive sensor.

Abstract: A measuring device for a heat exchanger includes a heat exchanger pressure pipe having a pipe wall with a circumference, and an indentation extending over and deforming a portion of the circumference. At least one thermocouple is disposed eccentrically in the portion of the circumference deformed by the indentation. Filling material fills the indentation. A method for producing a measuring device in a pressure pipe of a heat exchanger, a method for monitoring an operating state of a heat exchanger having a pressure pipe, a heat exchanger, and a method for measuring a heat flux, are also provided. The size of the indentation can be decreased for a given size of the thermocouple due to the eccentric configuration of the thermocouple, so that the heat flux is obstructed to a comparatively small degree by the pipe wall while local overheating of the pipe wall is prevented.

Abstract: The cold junction temperature of the channels on a multi-channel terminal block are accurately determined for each terminal pair without affixing a thermistor to each terminal. One embodiment provides accurate cold junction measurement of a six channel device (12 terminals) by mounting or directly affixing only three sensors (e.g., thermistors). The present technique decreases cost by reducing the number of sensors to less than the number of channels or terminals, while providing for accurate cold junction measurement at each channel.

Abstract: Hot spots in power conductors are monitored by apparatus comprising a temperature probe embedded in an electrically insulative thermally conductive material in surface-to-surface contact with the power conductor, typically at a joint being monitored. The temperature probe is spaced from the power conductor by the electrically insulative thermally conductive material a distance sufficient to provide electrical isolation, while the material has sufficient thermal conductivity that the temperature probe is able to substantiate trends in temperature changes at the joint. The invention can be incorporated into existing electrically insulative supports for the power conductors.

Abstract: A method of producing a calibration wafer having at least a predetermined emissivity, including providing a wafer of semiconductor material; subjecting the bulk material of the wafer to doping with foreign atoms and/or generating lattice defects to obtain the predetermined emissivity; and coating the wafer to obtain a further optical characteristic.