By Thermoelectric Potential Generator (e.g., Thermocouple) Patents (Class 374/179)
  • Patent number: 8736139
    Abstract: Disclosed herein is an optical image stabilizer, including: a substrate; a table disposed over the substrate, while levitating, to be movable on the substrate and having an image sensor mounted on the upper end of the substrate; cantilever arms disposed over the substrate, while levitating, and connected to the table to move the table; anchors fixing one ends of the cantilever arms onto the substrate; and electrodes applying voltage for moving the cantilever arm.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: May 27, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Seung Seoup Lee
  • Publication number: 20140137916
    Abstract: A thermoelectric material including a 3-dimensional nanostructure, wherein the 3-dimensional nanostructure includes a 2-dimensional nanostructure connected to a 1-dimensional nanostructure.
    Type: Application
    Filed: June 25, 2013
    Publication date: May 22, 2014
    Applicants: Industry-Academic Cooperation Foundation, Yonsei University, Samsung Electronics Co., Ltd.
    Inventors: Jong-wook ROH, Jung-young CHO, Weon-ho SHIN, Dae-jin YANG, Kyu-hyoung LEE, Un-yong JEONG
  • Publication number: 20140123896
    Abstract: Embodiments of a probe assembly for a fluid bed reactor are disclosed. The probe assembly includes a fluid bed reactor (FBR) member, and a pressure tap comprising a wall defining a passageway within which the FBR member is located. Exemplary FBR members include, but are not limited to, a thermocouple, a seed pipe, a particle sampling line, a gas sampling line, a gas feed line, a heater, a second pressure tap, or a combination thereof. Disclosed embodiments of the probe assembly reduce or eliminate the need for support rods and rings within the fluid bed reactor, reduce component fouling within the reactor, and/or reduce product contamination.
    Type: Application
    Filed: November 6, 2012
    Publication date: May 8, 2014
    Applicant: REC SILICON INC
    Inventors: Matthew Miller, Michael V. Spangler, Barry Wemp, E. Wayne Osborne
  • Patent number: 8702306
    Abstract: Certain exemplary embodiments can provide a system, which can comprise a thermocouple input module. The thermocouple input module can be adapted to determine one or more calibration factors. The thermocouple input module can be adapted to store the calibration factors. The thermocouple input module can be adapted to apply the calibration factors to an incoming thermocouple voltage value to obtain an adjusted thermocouple voltage value.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: April 22, 2014
    Assignee: Siemens Industry, Inc.
    Inventors: Stephen Weeks Mowry, Jr., Robert Alan Weddle
  • Publication number: 20140105248
    Abstract: A quick connect temperature sensing assembly for measuring the surface of a structure includes a thermocouple device, a docking device and a spring loaded adapter to connect the thermocouple device with the docking device. The docking device can be made of a magnetic material so that the assembly can be quickly connected and disconnected from the surface of a structure for sensing the temperature of the surface. When disconnected, the end of the thermocouple device extends beyond the bottom surface of the docking device. When the bottom surface of the docking device engages the surface of the structure, the end of the thermocouple is retracted and the spring loaded adapter maintains a biasing force on the thermocouple to maintain the end of the thermocouple in contact with the surface.
    Type: Application
    Filed: September 6, 2013
    Publication date: April 17, 2014
    Inventors: Jeffrey N. Daily, Fahad Shamsi, Larry D. Welch
  • Patent number: 8684598
    Abstract: A thermoelement for measuring the temperature in gaseous or fluid media by means of one or more thermocouples comprising wires of different metals welded together which give off a resulting electrical voltage when heated and are configured as a measuring insert arranged in an insulating rod disposed in a heat-resistant protective tube that can be connected to a connection head, the protective tube being wholly or partially surrounded by a holding tube. To prevent a high input of heat which has an unfavourable effect on temperature measurement, the holding tube is supported against the protective tube at a radial distance from the protective tube, and a heat-resistant trace and optionally an insulating material are inserted between the protective tube and the holding tube, and the holding tube is attached to the connection head and/or the protective tube in one or both end areas and is provided with thermal insulation.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: April 1, 2014
    Assignee: innovatherm Prof. Dr. Leisenberg GmbH & Co. KG
    Inventors: Christian Hoβbach, Peter Krieg, Detlef Maiwald, Hans-Peter Mnikoleiski, Wolfgang Uhrig
  • Publication number: 20140072015
    Abstract: A wide range temperature control system for semiconductor manufacturing equipment uses a thermoelectric element applied to a chiller that is a temperature control device for semiconductor manufacturing equipment. The refrigerant circulated through a refrigerant tank passes through thermoelectric element block groups and is cooling and heating controlled, outputs of the thermoelectric element block groups are then supplied to a load, a heat exchanger using process cooling water (PCW) is configured in the refrigerant tank in which the refrigerant recirculated from a working load is stored, a heater for high temperature heating is further configured, some of the thermoelectric element block groups at a high temperature are bypassed through a variable valve, the polarity of a voltage is reversed in the thermoelectric element block groups through which a high-temperature refrigerant passes, and a part of an insulating element adjacent to the refrigerant is maintained at a lower temperature than the refrigerant.
    Type: Application
    Filed: September 4, 2013
    Publication date: March 13, 2014
    Applicant: TECHEST CO., LTD.
    Inventors: Min Jin HAN, Jae Geon KIM
  • Publication number: 20140064334
    Abstract: A two piece measurement rake has a first split tubular section with at least one hollow support member disposed therethrough the measurement rake includes at least one sensor probe mounted on the hollow support member and coupled to a transducer. A second split tubular section is attached to the first split tubular section, and forms an interior cavity on which the at least one transducer tube is disposed.
    Type: Application
    Filed: September 6, 2012
    Publication date: March 6, 2014
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Tonya Lynn Watkins, Paul Dausacker, Paul Tangredi, Richard E. Warren, JR.
  • Patent number: 8662746
    Abstract: A gas turbine component (49) may be instrumented to provide a plurality of signals indicative of thermal measurements in a high temperature combustion environment of the gas turbine. A thermocouple arrangement may include a first thermocouple leg (50) disposed within a thickness of the component. At least two or more thermocouple legs (52, 53, 54) is each electrically connected to the first leg to form individual thermocouple junctions (56, 57, 58, 59) along the first leg for conversion of respective thermal gradients to respective electrical signals, such as electromotive force (emf) based voltages. The thermocouple arrangement may be used in combination with a thermographic system (70) to calculate heat flux over a region of the turbine component.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: March 4, 2014
    Assignee: Siemens, Energy Inc.
    Inventors: Ramesh Subramanian, Anand A. Kulkarni, Vinay Jonnalagadda, David J. Mitchell
  • Patent number: 8651738
    Abstract: A high-temperature plug (10) is provided for a heating element and/or thermocouple or a temperature sensor with at least one wire section (18) embedded in an insulating manner within a metal jacket (16) with a wire end (14) led out from the metal jacket (16) on the front side. The high-temperature plug (10) has a connection sleeve (11) made of metal, into which the at least one wire section (18) embedded in an insulating manner within the metal jacket (16) opens. At least one contact element (12) is in electrical contact within the connection sleeve (11) with the wire end (14) led out from the metal jacket (16) on the front side. At least the end section, facing the at least one wire end (14), of the at least one contact element (12) is embedded in an insulating compound (13) or a metal oxide, such that the embedding fixes the contact element (12) in the connection sleeve.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: February 18, 2014
    Assignee: Türk & Hillinger GmbH
    Inventor: Andreas Schlipf
  • Patent number: 8636409
    Abstract: A heat treatment apparatus includes: a furnace body including a heating part; a processing vessel wherein a space having a plurality of regions is formed between the furnace body and the processing vessel; an in-furnace temperature sensor disposed corresponding to each of the plurality of regions in the space; an in-furnace temperature calculating unit configured to calculate an in-furnace temperature based on signals from each of the in-furnace temperature sensors; and a control unit configured to control the heating part based on the in-furnace temperature calculated by the in-furnace temperature calculating unit. The in-furnace temperature sensor disposed in the reference region includes: a first thermocouple formed of an R thermocouple or an S thermocouple; and a second thermocouple formed of a thermocouple other than the R thermocouple or the S thermocouple. The in-furnace temperature sensor disposed in the other region includes the second thermocouple.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: January 28, 2014
    Assignee: Tokyo Electron Limited
    Inventor: Soichi Kanno
  • Publication number: 20140016671
    Abstract: The present invention, in one embodiment, provides a method of measuring pressure or temperature using a sensor including a sensor element composed of a plurality of carbon nanotubes. In one example, the resistance of the plurality of carbon nanotubes is measured in response to the application of temperature or pressure. The changes in resistance are then recorded and correlated to temperature or pressure. In one embodiment, the present invention provides for independent measurement of pressure or temperature using the sensors disclosed herein.
    Type: Application
    Filed: September 24, 2013
    Publication date: January 16, 2014
    Applicant: UT-BATTELLE LLC
    Inventors: Ilia N. Ivanov, David B. Geohegan
  • Publication number: 20140016670
    Abstract: A temperature probe includes a flange, a support structure, thermocouple wires, and guide plates. The flange has a midline. The support structure is attached to the midline and extends away from the flange. The thermocouple wires extend along the support structure, and terminate in a set of outer sensing tips and a set of inner sensing tips. The guide plates secure the thermocouple wires to the support structure. The guide plates are offset laterally from the midline of the flange.
    Type: Application
    Filed: July 16, 2012
    Publication date: January 16, 2014
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventors: Michael D. Greenberg, Ryan Spence, William T. Kelly, Joseph DeLorme, Bobby J. McLarty
  • Publication number: 20140003465
    Abstract: A temperature transmitter for sensing a temperature of an industrial process includes a temperature sensor arranged to provide a sensor output related to the temperature of the industrial process. Measurement circuitry is coupled to the temperature sensor and configured to determine the temperature of the industrial process based upon the sensor output. Output circuitry provides an output related to the measured temperature. A memory is configured to store temperature information related to excessive temperature events experienced by the temperature sensor. Diagnostic circuitry diagnoses a condition of the temperature sensor or other components based upon the stored temperature information.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 2, 2014
    Applicant: Rosemount Inc.
    Inventor: Anthony Michael Elke
  • Patent number: 8617385
    Abstract: A quenching medium is delivered directly to selected regions or locations within a catalyst bed in a hydroprocessing reactor vessel in order to control the reactivity of a hydroprocess occurring in the selected regions or locations separately from other regions or locations. Temperature sensors for providing temperature indications and conduits for delivering the quench medium are distributed throughout the catalyst bed. One or more conduits can be selected for delivery of the quenching medium to selected regions or locations so that separate control of the level of reactivity in each of various regions or locations throughout the bed can be achieved.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: December 31, 2013
    Inventor: Jeffrey N. Daily
  • Patent number: 8615875
    Abstract: A method of manufacturing a metal blading sector for low-pressure guide vanes of a turbomachine of which at least one blade includes an internal cavity configured to accept or communicate with a gas detection probe and at least one hole formed in the wall constituting a passage for gas from a low-pressure zone of the turbomachine toward the cavity and the probe through the fitting, into a casting mold, of a core corresponding to the cavity and the casting of a molten metal in the cavity of the casting mold. The core includes, for each hole for communication with the cavity, a protrusion penetrating the internal surface of the mold and constituting the only element holding the core in position in the casting mold.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: December 31, 2013
    Assignee: Snecma
    Inventors: Damien Alquier, Sebastien Digard Brou De Cuissart
  • Patent number: 8616765
    Abstract: A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: December 31, 2013
    Assignee: ASM America, Inc.
    Inventors: Buz Darabnia, Andy Yednak, Mike Halpin, Loren Jacobs, Ravinder Aggarwal
  • Publication number: 20130343429
    Abstract: A temperature measuring apparatus comprising at least one measuring element, a jacket, in which the measuring element is arranged, wherein the measuring element includes a thermocouple, which is composed of at least two thermocouple wires connected with one another at a height of a measuring point along the longitudinal axis of the jacket. The thermocouple wires extend a first distance along the longitudinal axis of the jacket at least up to the measuring point, and wherein the measuring element includes, furthermore, at least two connection wires, which extend a second distance on the side of the measuring point lying opposite the thermocouple wires along the longitudinal axis of the jacket and are connected with the thermocouple wires, wherein the two connection wires are composed of a material, which differs from that of the thermocouple wires.
    Type: Application
    Filed: June 25, 2013
    Publication date: December 26, 2013
    Inventors: Helmut Kalteis, Peter Seefeld
  • Patent number: 8608377
    Abstract: A thermocouple system is disclosed. The thermocouple system includes a thermocouple having a positive lead and a negative lead. A positive wire is connected at a first end to the positive lead at a first junction and at a second end to a second junction. A negative wire is connected at a first end to the negative lead at a third junction and at second end to a fourth junction. The second and fourth junctions constitute a reference junction. At least one of a thermal conductivity and a gauge of at least one of the positive wire and the negative wire are selected to govern the respective flows of heat from the first junction toward the reference junction and the flow of heat from the third junction toward the reference junction to be of such quantities that the difference in the heat flows is less than a predetermined amount.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: December 17, 2013
    Assignee: Heraeus Electro-Nite International N.V.
    Inventor: Richard F. Conti
  • Patent number: 8602643
    Abstract: A method and apparatus is presented for obtaining of accurate measurements of the temperature of a thermocouple and high fidelity measurements of the rate of change of the temperature of a thermocouple. A first sub-circuit is connected to the thermocouple with two conductors made of two different thermocouple alloys which are substantially the same as the alloys used in the construction of the thermocouple. A second sub-circuit is connected to the thermocouple with two conductors made of substantially identical material, such as copper. The first sub-circuit provides an accurate measurement of the temperature of the thermocouple. The second sub-circuit provides a high fidelity measurement of the rate of change of the temperature of the thermocouple.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: December 10, 2013
    Inventor: David Phillip Gardiner
  • Patent number: 8602644
    Abstract: The fabrication and use of a multifunctional micropipette biological sensor for in-situ detection of temperature changes, ion conductivity, and light is described herein.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: December 10, 2013
    Assignee: University of North Texas
    Inventor: Tae-Youl Choi
  • Publication number: 20130322491
    Abstract: A test apparatus for welded thermocouple joints includes a signal selection circuit, a first comparison circuit, a second comparison circuit, a switch circuit, and an indication circuit. The signal selection circuit outputs either a first direct current (DC) voltage or a second DC voltage according to selection. The first comparison circuit compares the first DC voltage with a first reference voltage if a first DC voltage is received, to output a first control signal. The second comparison circuit compares the second DC voltage with a second reference voltage if a second DC voltage is received, to output a second control signal. The switch circuit receives either a first or a second control signal and outputs an indication accordingly. The indication circuit receives the indication, and warns the user that the joint has full integrity, that the joint has a short circuit, or that the joint is open circuit.
    Type: Application
    Filed: April 15, 2013
    Publication date: December 5, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: ZHI-YONG GAO, TING-TING WU, YU-LIN LIU
  • Patent number: 8550706
    Abstract: There is provided a temperature measuring device capable of achieving cost reduction even in the case where the same is a multichannel temperature measuring device. The temperature-measuring device comprises a thermocouple having two dissimilar metal wires, ends thereof, on one-side, being joined with each other, and the other ends thereof, being connected to one pair of contact terminals, respectively, a unit of a temperature-measurement set made up by joining together a plurality of the thermocouples, and a reference junction compensation circuit provided for every unit of the temperature-measurement set, wherein at least one of the reference junction compensation circuits of the temperature-measuring device is left out while the other reference junction compensation circuits of the temperature-measuring device are removed upon a plurality of the units of the temperature-measurement sets being disposed in series.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: October 8, 2013
    Assignee: Yokogawa Electric Corporation
    Inventor: Koji Ota
  • Publication number: 20130255658
    Abstract: A cooktop for a cooking appliance includes a glass ceramic plate, the glass ceramic plate providing a cooking surface and having an instrumentation opening. A low thermal expansion metallic sleeve is inserted into the opening and a high temperature ceramic cement is used to bond the sleeve to the glass ceramic plate.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Inventor: Timothy Scott Shaffer
  • Publication number: 20130259090
    Abstract: A temperature sensor (100, 200, 300) has a thermocouple (101), with a measurement point (102), and a holder (103), with a contact surface (152) and an opening (104). Electric connections (105) of the thermocouple are led through the opening, starting from the measurement point. A first metal jacket (106) is arranged on the contact surface or passes through such that an interior (107) of the first metal jacket is connected to another side of the holder and the measurement point is arranged in an interior (108) of a second metal jacket (109). The second metal jacket is located at least with one section (110) in the interior of the first metal jacket and can be or is connected at least by a partial area of this section to the first metal jacket such that the second metal jacket is fixed in its position relative to the first metal jacket.
    Type: Application
    Filed: March 18, 2013
    Publication date: October 3, 2013
    Applicant: TUERK & HILLINGER GMBH
    Inventor: Andreas SCHLIPF
  • Patent number: 8545097
    Abstract: A housing between mineral-insulated cable and connecting wire in a turbocharger overheating protection device may include the following characteristics: coiled regions of springs (10) arranged point-symmetrically to each other; or the springs (10) are not placed on axes; or the coil regions of the coil springs (10) for cushioning the film resistor are shorter than its substrate length and longer than its substrate width; or the connecting wires of the film resistor are shorter than its substrate length and longer than its substrate width; or the springs are arranged staggered in their longitudinal direction adjacent to each other; or coil springs (10) are used, in which the coils are located only in one half of the spring (10) and the coils of one spring are arranged staggered in the longitudinal direction to the coils of the other spring (10).
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: October 1, 2013
    Assignee: Heraeus Sensor Technology GmbH
    Inventors: Mario Bachmann, Karlheinz Wienand
  • Publication number: 20130250999
    Abstract: According to one embodiment of the present disclosure a thermocouple is provided that includes an electrical component, such as a resistor, at or in close proximity to a junction where the temperature is expected to be measured. By monitoring analog voltage measurements, the system determines, for example, whether the measured temperature actually represents a temperature reading at the junction or whether the thermocouple has been compromised due to one or more of a variety of health issues, such as, a short circuit in the thermocouple, thereby causing a false junction.
    Type: Application
    Filed: February 8, 2013
    Publication date: September 26, 2013
    Applicant: Railway Equipment Company, Inc.
    Inventors: Randall G. Honeck, Dustin Duane Paloranta
  • Publication number: 20130247777
    Abstract: The invention pertains generally to a thermal sensor and a controlled heating system, in a beverage preparation machine. In particular, the invention relates to a thermal sensor comprising: connectors; an electrical coupling circuit; a sensing element having at least one measurable electrical quantity varying with the temperature of the sensing element; The sensing element is electrically coupled with the connectors through the electrical coupling circuit so as to allow measuring said electrical quantity at the level of the connectors. The sensor comprises a support having a first surface and a second surface thermally coupled and electrically isolated. The sensing element is thermally coupled with the first surface. The second surface is adapted to be thermally coupled with an area which temperature is to be measured.
    Type: Application
    Filed: December 1, 2011
    Publication date: September 26, 2013
    Applicant: NESTEC S.A.
    Inventors: Stefan Etter, Martin Ziegler, Frank Krauchi
  • Publication number: 20130250998
    Abstract: A heat sensor has the ability to correct for errors introduced during temperature changes of the hot junction of the thermopile for the heat sensor. For example, the effect of temperature changes at the hot junction of the heat sensor relative to the cold junction is mathematically modeled such that the effect on the temperature determination can be corrected given certain information relating to the thermopile, its electrical output, and the temperature history and current temperature of the cold junction. By accounting for these factors, a processing device can modify the temperature determination output for the heat sensor while correcting for error introduced by temperature changes at the hot junction as determined by the mathematical model.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 26, 2013
    Inventor: Habib Sami Karaki
  • Publication number: 20130243036
    Abstract: In a thermocouple, a pair of thermoelements extend within a protective sheath. The thermoelements are spaced from the sheath by an insulator. The sheath comprises an outer sheath formed from a metal alloy adapted to provide mechanical support and corrosion resistance during use of the thermocouple, typically at elevated temperature. The sheath further comprises an inner sheath positioned between the outer sheath and the thermoelements and formed from a nickel-based alloy containing less than 10 wt % Cr, to prevent diffusion of Cr and/or Mn from the outer sheath to the thermoelements.
    Type: Application
    Filed: March 31, 2011
    Publication date: September 19, 2013
    Applicant: CAMBRIDGE ENTERPRISE LIMITED
    Inventors: Michele Scervini, Cathie Rae
  • Publication number: 20130243035
    Abstract: The invention provides a thermocouple assembly for use with a thermocouple harness in a gas turbine engine, comprising a thermocouple connected to a resistor, the resistor comprising a conductor, a mineral insulating material surrounding the conductor, and a metal sheath surrounding the conductor.
    Type: Application
    Filed: July 31, 2012
    Publication date: September 19, 2013
    Applicant: WESTON AEROSPACE LIMITED
    Inventor: Paul Walling
  • Patent number: 8521013
    Abstract: A technology to control temperature of a large substrate to be heated. A temperature sensing device is disposed lateral to a region where a radiation heater faces a substrate to be heated inside a heating chamber. A heating device has the heating chamber, the radiation heater, a power-supply device, a substrate-holding device, a control device, and the temperature sensing device. A control program is built into the control device, according to which the power-supply device controls the power applied to the radiation heater to generate heat such that the temperature of the temperature measurement substrate detected by a thermocouple of the temperature sensing device becomes a set temperature. Furthermore, a circulation passage is disposed in close contact with the temperature-sensing device, and with a coolant flowing through the circulation passage, the temperature of the temperature measurement substrate can be cooled from the set temperature to an initial temperature.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: August 27, 2013
    Assignee: Ulvac, Inc.
    Inventors: Tsuyoshi Yoshimoto, Katsumi Yamane, Tetsuhiro Ohno, Takahiro Mizoguchi
  • Patent number: 8519866
    Abstract: A telemetry system for use in a combustion turbine engine (10) having a compressor (12), a combustor and a turbine (16) that includes a sensor (50, 74) in connection with a turbine blade (18) or vane (22). A telemetry transmitter circuit (210) may be affixed to the turbine blade (18) with a first connecting material (52, 152) deposited on the turbine blade (18) for routing electronic data signals from the sensor (50, 74) to the telemetry transmitter circuit (210), the electronic data signals indicative of a condition of the turbine blade (18). An induction power system for powering the telemetry transmitter circuit (210) may include a rotating data antenna (202) affixed to the turbine blade (18) with a second connecting material (140) deposited on the turbine blade (18) for routing electronic data signals from the telemetry transmitter circuit (210) to the rotating data antenna (202).
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: August 27, 2013
    Assignee: Siemens Energy, Inc.
    Inventors: David J. Mitchell, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, John R. Fraley, Roberto M. Schupbach, Alexander B. Lostetter
  • Patent number: 8517606
    Abstract: In a hydrocarbyl gas the presence and amount of a condensable polar component may be detected by voltage or current excursions over background noise as measured using a probe having at least two common electrodes and optionally a third electrode preferably inert to corrosion.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: August 27, 2013
    Assignee: Transcanada Pipelines Limited
    Inventor: Russell M. Given
  • Publication number: 20130208759
    Abstract: A sample holder for use in a scientific instrument requiring accurate and precise measurements of temperatures. The sample holder includes a ceramic sample cup diffusion bonded to a ceramic beam or to a ceramic adapter. A thermocouple is welded to the bottom of the sample cup.
    Type: Application
    Filed: June 8, 2011
    Publication date: August 15, 2013
    Applicant: WATERS TECHNOLOGIES CORPORATION
    Inventors: Robert L. Danley, Xiaoping Hu, Robert M. Krause
  • Patent number: 8506161
    Abstract: This disclosure describes systems, methods, and apparatuses for making a non-contact measurement of a substrate in a plasma processing chamber that accounts for stray blackbody radiation. In particular, a photocurrent is calculated that can be attributed to the stray blackbody radiation based upon a temperature of the stray blackbody radiation, a reflectance of a target substrate, and a temperature of the substrate. Knowing the photocurrent attributable to the stray blackbody radiation, a non-contact temperature measurement can be made, and the photocurrent attributable to the stray blackbody radiation can be subtracted out to arrive at a more accurate non-contact substrate temperature measurement.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: August 13, 2013
    Assignee: Advanced Energy Industries, Inc.
    Inventor: Thomas Haw
  • Publication number: 20130195143
    Abstract: The invention relates to a method of measuring a cutting temperature for an apparatus for a cutting process, when the apparatus for a cutting process includes a shank and a tool jointed to the shank by means of silver solder, the shank being electrically conductive, the tool being electrically nonconductive. The method includes: connecting a first lead wire to the shank, connecting a second lead wire to the silver solder, and measuring thermal electromotive force that is generated between the first lead wire and the second lead wire.
    Type: Application
    Filed: January 30, 2013
    Publication date: August 1, 2013
    Applicant: Toshiba Kikai Kabushiki Kaisha
    Inventor: Toshiba Kikai Kabushiki Kaisha
  • Patent number: 8496374
    Abstract: A differential scanning calorimeter (1) includes: a sample container (2) for receiving a measurement sample; a reference substance container (3) for receiving a reference substance; a heat sink (10); a thermal resistance (5), which is connected between the sample container and the heat sink, and between the reference substance container and the heat sink to form heat flow paths therebetween; a sample-side thermocouple (7), which is thermally connected to the thermal resistance at a portion in the vicinity of the sample container with its hot-junction (7c) being insulated; and a reference substance-side thermocouple (8), which is thermally connected to the thermal resistance at a portion in the vicinity of the reference substance container with its hot junction (8c) being insulated, in which the sample-side thermocouple and the reference substance-side thermocouple output a heat flow difference signal indicating a temperature difference between the measurement sample and the reference substance.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: July 30, 2013
    Assignee: SII Nano Technology, Inc.
    Inventors: Shinya Nishimura, Kentaro Yamada
  • Publication number: 20130188667
    Abstract: An integrated circuit containing an embedded resistor in close proximity to an embedded thermoelectric device. An integrated circuit containing an embedded resistor in close proximity to an embedded thermoelectric device composed of thermoelectric elements and at least one switch to disconnect at least one thermoelectric element from the thermoelectric device. Methods for testing embedded thermoelectric devices.
    Type: Application
    Filed: March 13, 2013
    Publication date: July 25, 2013
    Inventor: TEXAS INSTRUMENTS INCORPORATED
  • Patent number: 8485724
    Abstract: A mixed-signal integrated circuit comprises: 1) an analog front end having differential inputs adapted for directly connecting to at least one thermocouple, 2) an analog-to-digital (ADC) for converting the thermocouple voltages to digital representations thereof, 3) a linearization circuit capable of performing the multi-order polynomial equations for converting the thermocouple electromotive voltages (the digital representations) to linear temperature measurement units by using coefficients unique to each type of thermocouple from a coefficients table based upon the National Institute of Standards and Technology (NIST), 4) a integrated temperature sensor for measuring cold junction temperature, 5) optionally, an input multiplexer for selecting each of a plurality of thermocouples for measurement thereof, 6) optionally, registers for storing measured temperature values, high and low set points, alarm limits, etc., and 7) a communications interface for setting parameters and receiving temperature information.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: July 16, 2013
    Assignee: Microchip Technology Incorporated
    Inventor: Ezana Hailekiros Aberra
  • Publication number: 20130177042
    Abstract: Devices for determining sterilization conditions within a sterilization chamber are described. Such devices include an elongate tube to be placed within said sterilization chamber and at least two temperature sensors within the cavity of the elongate tube. The at least two temperature sensors are spaced apart from each other along the length of the elongate tube by a predetermined distance and spaced apart from the interior wall of the elongate tube. Methods for determining sterilization discussed.
    Type: Application
    Filed: September 16, 2011
    Publication date: July 11, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Robbert-Jan Hermsen, Knut Schumacher
  • Publication number: 20130170521
    Abstract: A detector assembly is provided and includes a board, a temperature response element and a support coupled to the board to support the temperature response element, the support including an elongate member having first and second opposing ends and being coupled to the board at the first end, guides through which temperature response element leads are threadable, and a saddle disposed at the elongate member second end to inhibit displacement of the temperature response element.
    Type: Application
    Filed: September 7, 2010
    Publication date: July 4, 2013
    Applicant: UTC FIRE & SECURITY CORPORATION
    Inventors: Jan A. Braam, Paul Schatz
  • Patent number: 8475037
    Abstract: A moving object thermometer is provided which can precisely measure the surface temperature of a moving (travelling) measurement object, particularly, a small-diameter conductive wire. A first metallic wire 1 and a second metallic wire 2 constituting a thermocouple are disposed on the outer circumferential surface 13 of the disk 11 in the rotary section 10 so as to be inclined toward the shaft center. A thermoelectric force resulting from contact of the metallic wires with a measurement object is converted into an electric signal, which is transmitted through the light emitting diode 31 and passed to the photodiode 32 provided at the stationary section 20 in a non-contact manner. Application of a high frequency current to the stationary side coil 42 provided at the stationary section 20 causes electric power to be supplied in a non-contact manner to the rotary side coil 41 provided so as to be opposed to the stationary side coil 42.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: July 2, 2013
    Assignee: Takikawa Engineering Co., Ltd.
    Inventors: Katsunobu Takigawa, Yasufumi Sakamoto
  • Publication number: 20130163637
    Abstract: A thermocouple includes a first housing defining a first interior with an open end, a second housing having a first end and a second end, wherein the second housing is slidably coupled to the first housing with the first end residing within the first interior and the second end residing exteriorly of the first interior and a temperature sensing element, and a seal.
    Type: Application
    Filed: December 21, 2011
    Publication date: June 27, 2013
    Applicant: UNISON INDUSTRIES, LLC
    Inventors: John Patrick Parsons, Denis John O'Flynn, James Timothy Hall
  • Publication number: 20130156070
    Abstract: An apparatus and method for measuring, collecting, and processing the temperatures of a number of hot junctions in a thermocouple sensor array simultaneously comprises means for measuring the temperature of one or more reference junctions and means for collecting, processing, storing, and transmitting data collected from an array of thermocouple temperature sensors. The measured temperature(s) of the one or more reference junctions is used to correct the measured voltage in each of a plurality of thermocouple circuits to obtain accurate hot junction temperature measurements. The apparatus and method are particularly useful for collecting and processing temperature data from various locations within engines such as turbine, rocket, and internal combustion engines.
    Type: Application
    Filed: August 30, 2011
    Publication date: June 20, 2013
    Applicant: Streamline Automation, LLC
    Inventors: Alton Reich, James Shaw
  • Patent number: 8465201
    Abstract: According to certain embodiments, an electro-magnetic radiation detector includes a sensor coupled to multiple nanostructures and an electro-magnetic radiation indicating device. The nanostructures are adapted to absorb electro-magnetic energy and generate heat according to the absorbed electro-magnetic energy. The sensor is adapted to measure the heat generated by the plurality of nanostructures and to generate a first signal according to the measured heat. The electro-magnetic radiation indicating device is operable to receive the signal from the sensor and indicate a level of electro-magnetic energy absorbed by the plurality of nanostructures according to the received signal.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: June 18, 2013
    Assignee: Raytheon Company
    Inventor: Timothy J. Imholt
  • Patent number: 8465202
    Abstract: A microstructured sensor for detecting IR radiation includes: one measuring channel having a measuring diaphragm, on which a first sensitive detector surface is implemented for the absorption of a first IR radiation; and one reference channel having a reference diaphragm, on which a second sensitive detector surface is implemented for the absorption of a second IR radiation. A measuring structure, e.g., a thermopile measuring structure as a series circuit made of thermocouple pairs, is implemented between the measuring diaphragm and the reference diaphragm for measuring a temperature differential between the measuring diaphragm and the reference diaphragm. First and second thermal contacts lie alternately on the two diaphragms.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: June 18, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Udo Kaess, Christian Lemier, Markus Niemann
  • Publication number: 20130148693
    Abstract: An improved thermocouple assembly for providing a temperature measurement is provided. The thermocouple assembly includes a sheath having a measuring tip, a support member received within the sheath, and first and second wires disposed within the support member. An end of each of the first and second wires are fused together to form a thermocouple junction therebetween. A recessed region is formed in a distal end of the support member, and the thermocouple junction is fixedly located at the base of the recessed region such that the recessed region maintains the thermocouple junction in a substantially fixed position relative to the measuring tip of the sheath.
    Type: Application
    Filed: February 6, 2013
    Publication date: June 13, 2013
    Applicant: ASM America, Inc.
    Inventor: ASM America, Inc.
  • Patent number: 8459865
    Abstract: Innovative tracking heat flux sensors located at or near the solar collector's focus for centering the concentrated image on a receiver assembly. With flux sensors mounted near a receiver's aperture, the flux gradient near the focus of a dish or trough collector can be used to precisely position the focused solar flux on the receiver. The heat flux sensors comprise two closely-coupled thermocouple junctions with opposing electrical polarity that are separated by a thermal resistor. This arrangement creates an electrical signal proportional to heat flux intensity, and largely independent of temperature. The sensors are thermally grounded to allow a temperature difference to develop across the thermal resistor, and are cooled by a heat sink to maintain an acceptable operating temperature.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: June 11, 2013
    Assignee: Sandia Corporation
    Inventors: Charles E. Andraka, Richard B. Diver, Jr.
  • Patent number: 8454230
    Abstract: The invention concerns a method for the indirect determination of local irradiance in an optical system; wherein the optical system comprises optical elements between which an illuminated beam path is formed and a measurement object which absorbs the radiation in the beam path at least partially is positioned in a partial region of the beam path selected for the locally-resolved determination of the irradiance and the temperature distribution of at least one part of the measurement object is determined by means of a temperature detector.
    Type: Grant
    Filed: February 16, 2010
    Date of Patent: June 4, 2013
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Frank Melzer, Axel Scholz