Abstract: Self-Validating Thermocouple (SVT) Systems capable of detecting sensor probe open circuits, short circuits, and unnoticeable faults such as a probe debonding and probe degradation are useful in the measurement of temperatures. SVT Systems provide such capabilities by incorporating a heating or excitation element into the measuring junction of the thermocouple. By heating the measuring junction and observing the decay time for the detected DC voltage signal, it is possible to indicate whether the thermocouple is bonded or debonded. A change in the thermal transfer function of the thermocouple system causes a change in the rise and decay times of the thermocouple output. Incorporation of the excitation element does not interfere with normal thermocouple operation, thus further allowing traditional validation procedures as well.

Abstract: The fabrication and use of a multifunctional micropipette biological sensor for in-situ detection of temperature changes, ion conductivity, and light is described herein.

Abstract: A thermocouple having at least one inner alignment feature or at least one outer alignment feature, or a combination thereof for positively positioning and aligning at least one thermocouple junction within a bore formed in a susceptor ring of a semiconductor substrate processing reactor. The outer alignment feature is configured to positively align the junction(s) longitudinally within the bore. The inner alignment feature configured to positively position the junction(s) rotationally within the sheath of the thermocouple relative to the bore.

Abstract: A temperature measuring device having a smart chip, or electronic circuit, integrated therein is provided. The smart chip, or electronic circuit, includes at least a unique identification number or data specific to the particular temperature measuring device stored thereon. The electronic circuit further includes calibration data of the temperature measuring device stored thereon. A module controller of a temperature control system is configured to verify the unique identification number of the thermocouple assembly prior to allowing data to be transferred between the temperature measuring device and a temperature controller. A graphical user interface allows an operator to enter the unique identification number or data to verify the temperature measuring device and display an error message if the number or data entered is not equivalent, or does not match, the unique identification number or data stored on the electronic circuit.

Abstract: An improved thermocouple assembly for providing a temperature measurement is provided. The thermocouple assembly includes a sheath having a measuring tip, a support member received within the sheath, and first and second wires disposed within the support member. An end of each of the first and second wires are fused together to form a thermocouple junction therebetween. A recessed region is formed in a distal end of the support member, and the thermocouple junction is fixedly located at the base of the recessed region such that the recessed region maintains the thermocouple junction in a substantially fixed position relative to the measuring tip of the sheath.

Abstract: A thermal detecting device for sensing temperature at multiple locations proximate to the detecting device is provided. The detecting device has a pair of infrared detectors each configured to measure temperature of two locations by receiving infrared energy of the two locations. A housing encloses the pair of infrared detectors. The housing is configured with an aperture to allow the infrared energy of the two locations to be received by the pair of infrared detectors. A reflective mirror or two mirrors focus the infrared energy of the two locations towards the pair of infrared detectors. The detecting device may be configured to determine if there is a temperature differential at a location as the housing moves with respect to the location.

Abstract: Disclosed is a thermocouple circuit that exhibits reduced levels of thermocouple drift. The thermocouple is generally comprised of first and second thermoelectric elements formed of first and second thermoelectric materials, respectively. The first and second thermoelectric elements are coupled to an electrically conductive substrate through intermediate first and second tab elements, respectively. The first and second tab elements are preferably formed of the respective first and second thermoelectric materials, and coupled to the substrate in a spaced apart configuration such that the first and second tab elements, are not physically coupled one to the other. Also disclosed are systems and methods for the preparation and use of the thermocouple circuits disclosed herein.

Abstract: A temperature measurement device includes a first thermocouple mounted on a tubular body that is shielded from the effects of radiation by a radiation shield, and a second, unshielded thermocouple. A difference in the measured temperatures from the first and second thermocouples is compared with calculated temperatures using an iterative process to determine a corrected temperature of the gas stream that estimates and compensates for incident radiation.

Abstract: Methods and apparatus for precise substrate cool down control are provided. Apparatus for measuring temperature of substrates may include a cool down plate to support a substrate; a sensor to provide data corresponding to a temperature of the substrate when disposed on the cool down plate; and a computer coupled to the sensor to determine the temperature of the substrate from the sensor data. A method for measuring the temperature of a substrate may include providing a substrate to be cooled to a chamber having a cool down plate disposed therein, a sensor to provide data corresponding to a temperature of the substrate, and a computer coupled to the sensor; sensing a first temperature of the substrate after a predetermined first time interval has elapsed; comparing the first temperature to a predetermined temperature; and determining whether the first temperature is greater than, equal to, or less than the predetermined temperature.

Abstract: A thermopile-based thermal detector is provided by a thermocouple, formed from a single sheet of material, which is made dissimilar with a P-doped and an N-doped junction electrically isolated via a naturally forming depletion region. The thermopile P-N sheet is uniform and planar, addressing stress and manufacturing issues. The usual non-active area of a conventional thermopile is significantly reduced or eliminated, and thus the output signal per unit diaphragm area of the detector is substantially increased, without the typical reduction in the signal-to-noise ratio. Also, a significant reduction in size of the thermal detector area is provided without a reduction in signal or signal-to-noise ratio. In an aspect, a second layer of thermocouples is axially positioned over, and connected with, a first layer of thermocouples. Additional axially stacked thermopiles can be provided within the same fabrication process. Signal processing circuitry may be electrically interconnected with the thermocouple.

Abstract: The present invention relates to an apparatus (1) for applying energy to an object (2), wherein the apparatus (1) comprises an energy emitting element, a temperature sensor and a tube (6), in which the energy emitting element and the temperature sensor are locatable. The energy emitting elements is adapting for applying energy to the object (2) and the temperature sensor is adapted for sensing the temperature of the object (2). Both, the energy emitting element and the temperature sensor can be guided to a location of the object (2), at which the energy is to be applied.

Abstract: An assembly includes a thermocouple, a cold junction sensor, and a circuit. The thermocouple has a process end and a cold junction end. The cold junction end has first and second cold junction terminals. The cold junction sensor is supported near the cold junction end and configured to measure temperature at the cold junction end. The circuit is electrically connected to the cold junction sensor and to the first and second cold junction terminals. The circuit is configured to produce a thermocouple signal as a function of voltage across the first and second cold junction terminals and to produce a cold junction sensor signal as a function of temperature of the cold junction end as measured by the cold junction sensor. The circuit is further configured to calculate a correlation between the thermocouple signal and the cold junction sensor signal.

Abstract: A temperature sensor has a sensor tip and a front for measuring the temperature of the inner walls of tools, particularly inner walls of injection molding tools. The tip of the temperature sensor has two thermocouple wires of a thermocouple. Each thermocouple wire of the thermocouple guided to the front is welded to the sensor tip up to a depth which is larger than the total processing depth behind the front. The sensor tip is processable by removing of material at the front up to that processing depth.

Abstract: A thermopile-based thermal detector is provided by a thermocouple, formed from a single sheet of material, which is made dissimilar with a P-doped and an N-doped junction electrically isolated via a naturally forming depletion region. The thermopile P-N sheet is uniform and planar, addressing stress and manufacturing issues. The usual non-active area of a conventional thermopile is significantly reduced or eliminated, and thus the output signal per unit diaphragm area of the detector is substantially increased, without the typical reduction in the signal-to-noise ratio. Also, a significant reduction in size of the thermal detector area is provided without a reduction in signal or signal-to-noise ratio. In an aspect, a second layer of thermocouples is axially positioned over, and connected with, a first layer of thermocouples. Additional axially stacked thermopiles can be provided within the same fabrication process. Signal processing circuitry may be electrically interconnected with the thermocouple.

Abstract: A ceramic thermocouple (10) in which the hot junction is defined by the junction between a first element (3) of molybdenum disilicide and a second element (2) of silicon carbide. The molybdenum disilicide element is formed by a layer of molybdenum disilicide on a molybdenum support.

Abstract: The installation contains a current conductor producing Joulean heat in the operating state, a cooling element and a monitoring device. The cooling element has a condensable working medium and an evaporator, which can be heated by the current conductor of the installation, and a condenser which has been withdrawn from the heating effect of the current conductor. The monitoring device comprises at least one sensor for detecting a parameter of the cooling element and an evaluation unit, which receives output signals from the sensor. In the evaluation unit, the output signals of the sensors are evaluated and a signal describing the state and/or the functionality of the cooling element is formed there. This installation is characterized by high operational reliability with a high current-carrying capacity and dimensions which are kept small.

Abstract: An object comprising a body part having an electrically insulating outer surface part, and a first layer arranged on the outer surface part. The first layer is formed by one or more electrically conducting materials and defines one or more conducting paths between a first area of the outer surface part and a second area of the outer surface part. Thereby electrical signals may be transferred between the first and second area parts. The layer further defines a sensing device, which is thereby embedded into the object. The object is provided with a threaded portion defining an outer thread. Thereby the object may easily be fitted into an opening having a mating inner thread. The object may be in the form of an ordinary bolt with a sensing device embedded in a surface part thereof.

Abstract: A thermocouple disposed on a substrate comprises a first leg of thermoelectric material, a second leg of thermoelectric material, and a thermocouple junction electrically connecting the first leg and the second leg, wherein a height of the thermocouple junction is substantially a height of the first or second legs.

Abstract: There are a number of sensors (2, 22) such as thermocouples which can provide a putative measurand signal which is within a predicted range for such signals whilst the sensor is incorrectly operating, such as as due to an open circuit. Techniques and processes are available to determine by interrogation sensor operational validity, but these can distort the measurand signal if correct. By time division multiplex techniques the present arrangement takes a putative measurand signal from a sensor (2, 22) in order that either within the same time division or more normally a separate time division, an interrogation of the sensor is performed in order to determine accuracy and therefore validity of the sensor 22.

Abstract: A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.

Abstract: A temperature sensor is described that comprises a temperature sensing element, a substantially thermally insulating substrate having a first side and a second side and at least one layer of substantially thermally conductive material coated on the first side of the substrate. A first hole is provided on the second side of the substrate and the temperature sensing element is arranged to sense temperature within the first hole. A plurality of additional holes may also be provided on the second side of the substrate, these holes may be coated to aid thermal transfer. The temperature sensing element may be a thermocouple. The temperature sensor may be included in a temperature measurement probe for use in measuring the temperature of workpieces produced using a machine tool.

Abstract: A flexible thin metal film thermal sensing system is provided. A thermally-conductive film made from a thermally-insulating material is doped with thermally-conductive material. At least one layer of electrically-conductive metal is deposited directly onto a surface of the thermally-conductive film. One or more devices are coupled to the layer(s) to measure an electrical characteristic associated therewith as an indication of temperature.

Abstract: A device is provided for temperature measurement in metal melts, particularly in iron or steel melts, having a thermoelement, which is arranged in a thermoelement tube, and having an exterior protective body, which is essentially formed of graphite and metal oxide. The thermoelement tube is arranged in the protective body with a spacing, forming an intermediate space, and an insulating material and an oxygen-reducing material are arranged in the intermediate space. The insulating material and the oxygen-reducing material, as a powder mixture, form a tube (2), which surrounds the thermoelement tube (3) with a spacing and/or which is surrounded by the protective body (1) with a spacing.

Abstract: A temperature sensor for a burner comprises two metal wires implementing a thermocouple, a protection sheath receiving the two metal wires, and a head in metal material having a front side intended to be facing the environment, the temperature of which is intended to be measured, and a rear side opposite the front side, in which the two metal wires are connected in a thermal exchange relationship to the head rear side, and the head comprises a front portion connectable to a burner wall of the burner so that the thermocouple is connectable to the burner by means of said metal head.

Abstract: A sensor apparatus including a plurality of sensors, and a measurement device. The plurality of sensors being divided into sensor groups with each sensor group having a number of sensors. The groups being arranged such that the sensor groups are electrically matched. The sensors in a sensor group coupled in parallel with each other to form a sensor ladder. A measurement device is arranged to compare electrical signals from each sensor group and to output an indication signal, wherein the measurement device is coupled to each sensor ladder at an intermediate position and in that the coupling position of each sensor ladder are electrically equivalent to one another. Also provided by the present invention is a method of monitoring a plurality of sensors.

Abstract: A cooking apparatus with an information exchange system that involves an assembly featuring a cooking apparatus such as a smoker or an electric turkey fryer and an information exchange system that provides for local and/or remote monitoring of cooking characteristic that preferably includes food item temperature probing that is displayed externally on the cooking appliance as in a local remote cooking characteristic information conveyance device that are preferably either in unidirectional of bi-directional.

Abstract: A temperature sensor is disclosed having at least one thermal measuring element which is arranged on a carrier body to convert a temperature into an electrical measurement signal which can be tapped off by electrical connecting lines as a result of a voltage supply. A generator is likewise fitted to the carrier body adjacent to the thermal measuring element to convert thermal energy into electrical energy, and to supply the voltage to the thermal measuring element.

Abstract: A thermocouple rake. The thermocouple rake may include a number of support rods extending through a number of support disks, a number of thermocouple tubes extending through the support disks, and with the thermocouple tubes and the support disks having a thermal compression bond when heated.

Abstract: The invention concerns a method for the indirect determination of local irradiance in an optical system; wherein the optical system comprises optical elements between which an illuminated beam path is formed and a measurement object which absorbs the radiation in the beam path at least partially is positioned in a partial region of the beam path selected for the locally-resolved determination of the irradiance and the temperature distribution of at least one part of the measurement object is determined by means of a temperature detector.

Abstract: A very high speed temperature probe is provided that can be used in medical applications and in environments that are corrosive or hostile. The probe has a thin wall housing made of a thermally conductive material, a thin film RTD temperature sensor which is mounted within the interior of the housing and is embedded within a temperature cured composite material. A thermally conductive material is used to fill the interior of the housing. The thin wall housing and absence of entrapped air bubbles or voids in the cured composite and thermally conductive materials cooperate to achieve a low thermal time constant and thus, high temperature measuring speed for the probe.

Abstract: A temperature sensor for measuring a temperature of a moving or stationary surface includes a main body portion and a probe head with thermocouple element, the probe head coupled to the main body portion such that the probe head reciprocates relative to the main body portion in a pulsed manner.

Abstract: Provided is a plasmon resonance detector that can detect temperature change in optical devices, in which the metal structure having plasmon resonance absorption is used for the optical devices. A diode formed of a conductive substrate, an n-type semiconductor layer, an i-type semiconductor layer, a p-type semiconductor layer, an n electrode (negative electrode), a p electrode (positive electrode), an insulating film, or the like is used as a semiconductor device whose resistance value changes in accordance with temperature change. A nanochain formed by connecting a plurality of metal nanoparticles is disposed on this diode. When the nanochain is irradiated with light, the nanochain generates heat. The heat generated in the nanochain is conducted to the diode. The resistance value of the diode changes in accordance with temperature change, and thus this change is read, a temperature or an amount of heat generation of the nanochain is measured, and existence and strength of the plasmon resonance are detected.

Abstract: A power sensor having a microstrip transmission line, comprising: a dielectric substrate; a strip conductor disposed on one surface of the substrate; and a ground plane conductor disposed on an opposite surface of the substrate. The power sensor includes a plurality of thermocouples extending from the strip conductor, proximal end portions of the thermocouples being thermally coupled to the strip conductor. A plurality of electrical conductors is provided, each one having a first end electrically connected to a distal end of a corresponding one of the thermocouples and a second end electrically connected to the proximate end of one of the plurality of thermocouples disposed adjacent to such corresponding one of the thermocouples. The proximal ends of the thermocouples are electrically insulated one from the other.

Abstract: An electric submersible pump device, comprising an electric motor having stators and coils; a pump coupled with the electric motor; a thermocouple or RTD for measuring temperature of the motor windings.

Abstract: A circuit affixed to a moving part of an engine for sensing and processing the temperature of the part. The circuit generates a signal representative of the temperature sensed by a thermocouple (110) and amplified by an amplifier (112). A square wave oscillator (113) with a temperature sensitive capacitor (C8) varies its frequency in response to changes of a local temperature of the circuit. A chopper (114, J27) converts the output of the amplifier into an alternating current signal. The chopper is gated by the square wave oscillator and a second input is coupled to an output of the amplifier. Thus, the chopper has an output signal having a frequency representative of the local temperature and an amplitude representative of the thermocouple temperature, whereby the combined signals represent the true temperature of the part.

Abstract: A process variable transmitter for measuring a temperature of a process includes a first, a second, third, and fourth terminal configured to couple to the temperature sensitive element. Measurement circuitry measures an electrical parameter between a pair of the terminals. A microprocess identifies a location of the temperature sensitive element coupled to at least two of the terminals based upon an electrical parameter measured by the measured circuitry between two terminals. In another configuration, the process variable transmitter measures temperature of a process using a thermocouple. A heating element is configured to heat terminals coupled to the thermocouple. A microprocessor determines polarity of the thermocoupled based upon a measured electrical parameter between the terminals in response to applied heat.

Abstract: A thin-film thermocouple (12) is disclosed for use with a gas turbine component. The thermocouple may be formed on a non-planar substrate (22) having formed thereon an electrically insulating layer (34) capable of maintaining its insulating properties at gas turbine operating temperatures. A first thermocouple leg (26) made of pure platinum is then deposited on the dielectric layer (34). A second thermocouple leg (28) made of another pure metal or a transparent ceramic oxide is also formed on the dielectric layer (34) wherein the first and second thermocouple legs make ohmic contact at a first end of each leg to form a hot junction (30) for conversion of heat into an electrical signal. The thermocouple may be deposited on a surface of a thermal barrier coating or between a thermal barrier coating and an underlying metal substrate.

Abstract: Protective tubes for thermocouples exposed to oxidizing atmospheres at temperatures in the region of approximately 1100° C. are produced from a single-crystal nickel-based superalloy, preferably from an alloy having the following chemical composition (in % by weight): 7.7-8.3 Cr, 5.0-5.25 Co, 2.0-2.1 Mo, 7.8-8.3 W, 5.8-6.1 Ta, 4.9-5.1 Al, 1.3-1.4 Ti, 0.11-0.15 Si, 0.11-0.15 Hf, 200-750 ppm C, 50-400 ppm B, remainder nickel and unavoidable impurities. Protective tubes of this type exhibit good strength and good oxidation resistance under severe stress conditions.

Abstract: A temperature measuring device is configured of a substrate formed of a silicon wafer, a thermocouple formed by using the film forming method, the photolithographic method, and the etching method, and a clamp pad (an electrode pad) which is arranged in an edge portion of the substrate, and which is connected to the thermocouple. In a semiconductor manufacturing apparatus, the temperature measuring device is fixed on a wafer mounting portion with a clamper pin (a fastening device) being in contact with the clamp pad. An output of the thermocouple is taken out to the outside through the clamper pin.

Abstract: Disclosed is an apparatus (10) for simulation of heat generation of a heat-generating electronic component. The apparatus includes a heat-transfer simulation device (110), a base (120) and at least one supporting post (150). The base is made of a heat-insulation material, and defines therein a recess (122). The heat-transfer simulation device is used for simulating heat generation from a heat-generating electronic component. The supporting post supportively mounts the heat-transfer simulation device within the recess defined in the base. A method of evaluating heat removal capacity of a heat dissipation device is also disclosed based on this apparatus.

Abstract: A method is present for estimating engine load factor. Temperature data is obtained from a temperature sensor in a location with respect to an exhaust system for an engine. A rate of temperature change is estimated using the temperature data. A steady state temperature at a selected time is calculated for the location using the temperature data and the rate of temperature change. The engine load factor at the selected time is estimated from the steady state temperature.

Abstract: An aircraft monitoring system uses aircraft engine and system transducers to monitor critical engine and aircraft system parameters. Simple controls and graphical user interfaces facilitate the display of different kinds of critical information to the pilot. Such data may also be recorded for later downloading and analysis.

Abstract: A method of real-time analysis of an engine, comprising sensing a temperature within a chamber of the engine with a thermocouple sensor disposed on a spark plug operating within the chamber, the thermocouple sensor generating a first signal based upon the temperature within the chamber; detecting current on a wire coupled to the sparkplug with a sensor, the sensor generating a second signal based upon current detected on the wire; converting the first and second signal into a first and second optical signal respectively utilizing one or more signal conditioners; generating a first and second digital signal based upon the first and second optical signal respectively with a receiver; and transmitting the first and second digital signal to an analysis device to generate a display of the temperature as it relates to engine speed at a first time in response to the receipt of the first and second digital signal.

Abstract: A nano-composite material having a high electrical conductivity and a high Seebeck coefficient and low thermal conductivity. The nano-composite material is capable of withstanding high temperatures and harsh conditions. These properties make it suitable for use as both a thermal barrier coating for turbine blades and vanes and a thermoelectric generator to power high temperature electronics, high temperature wireless transmitters, and high temperature sensors. Unique to these applications is that the thermal barrier coatings can act as a temperature sensor and/or a source of power for other sensors or high temperature electronics and wireless transmitters.

Abstract: A thermocouple shield for use in radio frequency fields. In some embodiments the shield includes an electrically conductive tube that houses a standard thermocouple having a thermocouple junction. The electrically conductive tube protects the thermocouple from damage by an RF (including microwave) field and mitigates erroneous temperature readings due to the microwave or RF field. The thermocouple may be surrounded by a ceramic sheath to further protect the thermocouple. The ceramic sheath is generally formed from a material that is transparent to the wavelength of the microwave or RF energy. The microwave transparency property precludes heating of the ceramic sheath due to microwave coupling, which could affect the accuracy of temperature measurements. The ceramic sheath material is typically an electrically insulating material. The electrically insulative properties of the ceramic sheath help avert electrical arcing, which could damage the thermocouple junction.

Abstract: A rugged sensor and method for manufacturing such, for use in hostile environments, the sensor exhibiting high mechanical strength to protect the sensor from physical damage. The sensor system also including a modular component that may variously be connected to the sensor to extension thereof, the modular component also exhibiting high mechanical strength to protect electrical conductors located therein.

Abstract: A temperature sensor element 10 has a reduced thermal conduction path from a measurement object to a sensitive end portion 22 of a thermocouple 21 and a high-dense insulating ceramic base body 20. Since the temperature sensor element 10 has excellent thermal conductivity from the measurement object to the sensitive end portion 22 of the thermocouple 21, it is also excellent in responsiveness at the time of temperature detection. Further, corrosion and material deterioration of the thermocouple 21 is unlikely to occur because the thermocouple 21 does not directly contact the measurement object (exhaust gas). As a result, the temperature sensor element 10 exhibits excellent durability. Therefore, the temperature sensor element 10 exhibits a good responsiveness at the time of temperature detection as well as excellent durability.

Abstract: A temperature measurement device includes a first member forming a first claw at an end thereof and a second member forming a second claw at an end thereof. The second claw faces the first claw, and can move towards and away from the first claw. A spring is provided between the first member and the second member for generating force to move the second claw towards the first claw. A pair of thermal coupling wires are fixed on the first and second claws, respectively. Thus an object needed to be measured can be arranged between the pair of thermal coupling wires and snugly engage the thermal coupling wires by the elastic force of the deformed spring.

Abstract: A heat flux measurement device includes at least two thermocouples disposed within a front portion of the device at different axial distances from a front wall of the device. A correlation between the measured heat fluxes from the device over a period of time is used to estimate a fouling thickness on a wall, for example, a water wall of a radiant syngas cooler (RSC).

Abstract: A measuring device for measuring the temperature of a thermally loaded metallic base element, especially a gas turbine component, provided with a protective surface coating includes a sensor integrated in the base element. The sensor is arranged in a recess introduced into the base element from the outside. The protective surface coating is formed continuously over the sensor disposed in the recess.