Abstract: The thermoelectric device includes a first leg made from a first material, anchored at the level of its first end to a support, and a second leg made from a second material, anchored at the level of its first end to said support. In addition, an electric connecting element provided with first and second contact areas is respectively in electric contact with the first leg and second leg so as to form a thermocouple. The device includes means for varying the position of the first and contact areas at the level of the first and second legs.

Abstract: A measuring device is provided having a protective cover and a sensor arranged in the protective cover. The protective cover has a carrier tube made of metal and closed on one end. A first coating made of an aluminum non-wettable material is arranged on an outer surface of the carrier tube, and a further coating made of aluminum-wettable material is applied on the first coating.

Abstract: A temperature sensing assembly for measuring the temperature of a surface of a structure includes a thermocouple device having a sheath containing a pair of conductors of dissimilar materials connected at a junction point to provide indications of temperature. The assembly further includes a docking device with a recess formed in a top surface to receive a portion of the sheath that is proximate the junction point. The bottom surface of the docking device is attached to the surface of the structure. The recess extends through the bottom surface of the docking device so that when the thermocouple device is positioned in the recess, the junction point is adjacent the surface of the tube. A heat shield can be attached to the docking device to shield the sheath proximate the junction point from direct and radiant heat sources.

Abstract: Apparatus for determining downhole fluid temperatures are described. An example apparatus for measuring a temperature of a downhole fluid includes a sensing element for measuring a physical or chemical property of the downhole fluid, and a plurality of electrical connections to enable the sensing element to measure the chemical or physical property and provide an output signal representative of the chemical or physical property, wherein at least one of the electrical connections is configured to function as a thermocouple to sense a temperature of the downhole fluid.

Abstract: A method for monitoring at least two temperature sensors of a turbomachine that is aligned along a reference plane, the two temperature sensors being located in the same transverse plane of the turbomachine, the method including detecting the stoppage of the turbomachine; waiting for a period at least equal to a predetermined threshold period; measuring the temperature with each of the two temperature sensors; comparing the two temperatures measured.

Abstract: An immersion well assembly may include a thermistor housing defining a first axial passage and a thermistor wire collar axially secured to the thermistor housing and defining a second axial passage. The second axial passage may receive a thermistor wire and may axially fix the thermistor wire relative to the thermistor housing.

Abstract: An improved thermocouple assembly for providing a temperature measurement is provided. The thermocouple assembly includes a sheath having a measuring tip, a support member received within the sheath, and first and second wires disposed within the support member. An end of each of the first and second wires are fused together to form a thermocouple junction therebetween. A recessed region is formed in a distal end of the support member, and the thermocouple junction is fixedly located at the base of the recessed region such that the recessed region maintains the thermocouple junction in a substantially fixed position relative to the measuring tip of the sheath.

Abstract: A novel scanning Seebeck coefficient measurement technique is disclosed utilizing a cold scanning thermocouple probe tip on heated bulk and thin film samples. The system measures variations in the Seebeck coefficient within the samples. The apparatus may be used for two dimensional mapping of the Seebeck coefficient on the bulk and thin film samples. This technique can be utilized for detection of defective regions, as well as phase separations in the sub-mm range of various thermoelectric materials.

Abstract: By forming thermocouples in a contact structure of a semiconductor device, respective extension lines of the thermocouples may be routed to any desired location within the die, without consuming valuable semiconductor area in the device layer. Thus, an appropriate network of measurement points of interest may be provided, while at the same time allowing the application of well-established process techniques and materials. Hence, temperature-dependent signals may be obtained from hot spots substantially without being affected by design constraints in the device layer.

Abstract: According to one embodiment, a temperature measurement system including: a plurality of thermocouples; a transmission signal conversion unit configured to convert, to a transmission signal, the thermo-electromotive force generated by each of the plurality of the thermocouple and configured to output the transmission signal; a plurality of transmission units configured to transmit the transmission signal outputted from the transmission signal conversion unit; a first connection unit configured to connect between each of the plurality of the transmission units; a second connection unit configured to connect at least one of the plurality of transmission units to a processing unit configured to process the transmission signal; and a housing unit configured to house at least the first connection unit.

Abstract: The invention relates to a temperature sensor (24) for measuring the temperature on or in a living body. The temperature sensor (24) includes a plurality of thermocouples arranged distributed on a measurement surface (30) of the sensor (24) and electrically connected to create at least one series circuit, wherein thermojunctions (16, 18) formed by the thermocouples in each series circuit are divided into at least two, and preferably a total of two, spatially separate groups such that in each group when there is a change in temperature the thermojunctions (16, 18) cause an equivalent change in voltage.

Abstract: Embodiments of the present invention provide for a system and method for flow assurance and pipe condition monitoring in a pipeline for flowing hydrocarbons using at least one thermal sensor probe, which at least one thermal sensor probe may be used in conjunction with one or more other sensors to manage the sensing process and for data fusion to accurately determine flow properties and/or pipeline condition. By way of example, but not by way of limitation, in an embodiment of the present invention, a network of noninvasive sensors may provide output data that may be data-fused to determine properties of the pipeline and/or flow through the pipeline.

Abstract: An overhead conductor sensor for measuring various parameters that affect an overhead conductor is disclosed. The overhead conductor sensor includes an electronics housing having first and second opposing ends, a jaw assembly having a first jaw connected to the first end of the electronics housing and a second jaw pivotally attached to the first jaw to allow the jaw assembly to move between an open position for receiving an overhead conductor therein and a closed position for securing the sensor to the overhead conductor, and a thermocouple assembly electrically connected to electronics housed in the electronics housing and extending through the jaw assembly for engagement with the overhead conductor. The thermocouple assembly is adapted to measure a temperature of the overhead conductor.

Abstract: A temperature detecting apparatus is provided which is capable of suppressing disconnection of a thermocouple wire or positional deviation of a thermocouple junction portion caused by change over time. The temperature detecting apparatus includes: an insulation rod installed to extend in a vertical direction and including a through-hole in vertical direction; a thermocouple wire inserted in the through-hole of the insulation rod, the thermocouple wire including a thermocouple junction portion at an upper end thereof and an angled portion at a lower end of the insulation rod; and a buffer area installed below the insulation rod and configured to suppress a restriction of a horizontal portion of the angled portion upon heat expansion, wherein an upper portion of the thermocouple wire or a middle portion in the vertical direction are supported by the insulation rod.

Abstract: A temperature sensor for a burner comprises two metal wires implementing a thermocouple, a protection sheath receiving the two metal wires, and a head in metal material having a front side intended to be facing the environment, the temperature of which is intended to be measured, and a rear side opposite the front side, in which the two metal wires are connected in a thermal exchange relationship to the head rear side, and the head comprises a front portion connectable to a burner wall of the burner so that the thermocouple is connectable to the burner by means of said metal head.

Abstract: A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.

Abstract: Apparatus and method for tire temperature measurement is disclosed. The apparatus includes a thermocouple having a measurement junction and a pair of first and second conductive leads. The measurement junction is mounted in a passage provided in the tire. The pair of first and second conductive leads extend through the passage in the tire and exit the tire at an interface. A patch is mounted to the tire at the interface. The pair of first and second conductive leads extend from the interface into a passage provided in the patch. The first and second conductive leads are surrounded by the patch at the interface where the first and second conductive leads exit the surface of the tire.

Abstract: Methods of using temperature control devices in electron microscopes. The temperature of the device structure may be controlled to extract information about reactions and processes that was previously unobtainable.

Abstract: In an exemplary embodiment, a temperature sensor and a 4-20 mA transmitter on a single flexible circuit subassembly with a separate housing suitable for use in industrial control or HVAC applications. In a preferred embodiment, a narrow flex circuit substrate includes a silicon diode-based surface-mount sensor at a sensor end, a surface-mount programmable transmitter IC on a flex circuit substrate in the transmitter section, conductive traces connecting the sensor to the transmitter IC, and two conductive pads at an output end for connecting the 4-20 mA output to a pair of external wires. Additional traces on the flex subassembly are provided for testing and programming the transmitter IC and sensor. The sensor end of the flex subassembly is mounted in a metal sensor tube, filled and sealed in the same manner as RTD or thermistor sensors with leads are currently assembled for use in industrial control or HVAC applications.

Abstract: A method and apparatus for assessing the cure status of a fibrous blanket manufactured with mineral fibers and binder is disclosed and comprises using continuous thermal measurement as an assessment of cure status. A plurality of thermocouples are installed in various oven locations both above and below the path of the fibrous pack to be cured and readings from the thermocouples are compared by a processor. The thermal measurements may be inlet or outlet temperatures of any particular zone or series of zones; or entry or egress temperatures; or averages or differences of measurements from selected thermocouple locations.

Abstract: A temperature sensor (1) has a sensor element (2), a carrier plate (4) and a contact surface and at least one electric feed line (3), which is routed, starting from the sensor element (2), through an opening (5) in the carrier plate (4). A guide element (8), through which the electric feed line (3) is routed such that at least the end of the routed section of the electric feed line, which end faces the sensor element, is located at a spaced location from each section of the carrier plate in the direction at right angles to the contact surface and is secured against displacement in each direction except in the directions in which the electric feed line (3) extends, is arranged on the side of the carrier plate (4) located opposite the contact surface or on a front side of the carrier plate (4).

Abstract: Improved, high-strength micro-thermocouples (10) are provided, which include first and second microwires (12, 14) each preferably in the form of an elongated metallic core (18, 22), with an outer glass coating (20, 24); at least one of the microwires (12, 14) is an amorphous microwire (12), and in preferred forms the other microwire is a crystalline microwire (14). The thermocouple junction (16) is formed by stripping the distal ends of the microwires (12, 14) to provide stripped ends (18a, 22a). The stripped crystalline microwire end (22a) is wrapped about the stripped amorphous microwire end (18a) to form a series of abutting convolutions (30). The micro-thermocouples (10) find particular utility in the fabrication and repair of carbon fiber composite materials, such as airplane components.

Abstract: A semiconductor integrated circuit includes a delay characteristic compensating circuit that is provided in a logic area including an inside and a surface of a chip. The delay characteristic compensating circuit includes a heat generating circuit that heats the semiconductor integrated circuit, a temperature sensor that measures a junction temperature, a voltage monitor that measures a power supply voltage, and a control circuit that actuates the heat generating circuit when the junction temperature does not reach a reference temperature and when the power supply voltage is lower than a reference voltage and stops actuating the heat generating circuit when the junction temperature reaches the reference temperature.

Abstract: Electronic measurement of thermocouples has employed cold junction reference since Thomas Seebeck's discovery in 1820's. This patent discloses that thermocouple compensation is not needed nor wanted. Non-compensated thermocouple data which supports this claim is given in this patent.

Abstract: A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.

Abstract: A heat treatment apparatus includes: a furnace body including a heating part; a processing vessel wherein a space having a plurality of regions is formed between the furnace body and the processing vessel; an in-furnace temperature sensor disposed corresponding to each of the plurality of regions in the space; an in-furnace temperature calculating unit configured to calculate an in-furnace temperature based on signals from each of the in-furnace temperature sensors; and a control unit configured to control the heating part based on the in-furnace temperature calculated by the in-furnace temperature calculating unit. The in-furnace temperature sensor disposed in the reference region includes: a first thermocouple formed of an R thermocouple or an S thermocouple; and a second thermocouple formed of a thermocouple other than the R thermocouple or the S thermocouple. The in-furnace temperature sensor disposed in the other region includes the second thermocouple.

Abstract: A high temperature Seebeck coefficient measurement apparatus and method with various features to minimize typical sources of errors is described. Common sources of temperature and voltage measurement errors which may impact accurate measurement are identified and reduced. Applying the identified principles, a high temperature Seebeck measurement apparatus and method employing a uniaxial, four-point geometry is described to operate from room temperature up to 1300K. These techniques for non-destructive Seebeck coefficient measurements are simple to operate, and are suitable for bulk samples with a broad range of physical types and shapes.

Abstract: According to an aspect of the present invention, there is provided a temperature sensor mounting unit for mounting a temperature sensor inside a mounting-target member through a mounting hole provided in a mounting wall, the temperature sensor mounting unit including: a base plate; elastic gripping pieces that extend from the base plate to grip the temperature sensor therebetween; elastic locking pieces formed on the base plate to be brought into engagement with the mounting hole; and a passage hole formed on the base plate to lead out a lead wire therethrough, wherein, in a mounted state, at least when an external force to expand the elastic gripping pieces is exerted, the elastic gripping pieces are brought into abutment with an inner circumference of the mounting hole so as to be prevented from expanding.

Abstract: A temperature probe having a terminal attachment arrangement for securing and selectively releasing an electrical connection is disclosed. The temperature probe further includes a housing for sealing the temperature probe to a structure, such as a HVAC duct.

Abstract: A sensor element for detecting electromagnetic radiation, particularly in the infrared range, comprises one or more heat-sensitive portions provided on a substrate and one or more influencing layers for influencing the absorption and/or reflection of the electromagnetic radiation to be detected. The heat-sensitive portion(s) and/or the influencing layers are arranged on the substrate in accordance with the thermal properties of the influencing layers, preferably asymmetrically.

Abstract: A mounting terminal head of a thermocouple head unit having a metal casing for an end of a thermocouple wire, and thermocouple signal terminals 4 for connection to a thermocouple wire. The thermocouple head unit includes an insulating support member 8 extending around the outside of the thermocouple head unit and supporting the thermocouple signal terminals.

Abstract: In a prior-art nail puncture test, it has been difficult to measure the temperature at a short-circuiting portion, which is closely related to the scale of an accident which occurs. As a solution, A nail puncture test device having a temperature measurement function, a sheath thermocouple, and a fixing portion 6 of the sheath thermocouple, wherein a bottomed hole through which the sheath thermocouple is inserted is bored in the axial direction from a head portion to the vicinity of the distal end at the center part of the outer frame, and the sheath thermocouple is fixed to the outer frame by the fixing portion 6 in a state where the sheath thermocouple is inserted into the bottomed hole and the distal end thereof having a temperature measurement point is in contact with the bottom of the hole is provided.

Abstract: In a hydrocarbyl gas the presence and amount of a condensable polar component may be detected by voltage or current excursions over background noise as measured using a probe having at least two common electrodes and optionally a third electrode preferably inert to corrosion.

Abstract: The invention has for its object the provision of a thermocouple having a fused portion that is kept against growing bulky in a small ball form, and a process for fabricating the same. To accomplish that object, the inventive thermocouple has a feature that the included butt angle (a) between two thermocouple element wires (2a) and (2b) is 90° or greater. Portions of mutual contact of two thermo-couple element wires are fused and integrated into a thermo-metric contact (16) having a feature that its diameter is at most twice as large as the diameter of each element wire (2a), (2b).

Abstract: Methods for determining a temperature of a portion of an electrically conductive substrate are provided wherein the substrate is heated by applying an electrical current flow through the substrate. The method for determining the temperature employs a thermocouple including a first tab element and a second tab element that are spaced apart from one another along an axis transverse to a direction of the current flow. In another example, an apparatus includes an electrically conductive substrate and a direct heating apparatus configured to heat the substrate with an electrical current flow through the substrate. The apparatus includes first and second coupling positions of a thermocouple that are spaced apart from one another along an axis transverse to a direction of the current flow.

Abstract: A drop-in probe is provided for determining phase changes of a sample removed from a molten steel by thermal analysis. The probe includes a measurement head that has an immersion end and in which is arranged a sample chamber having an inlet opening and a thermocouple projecting with its hot solder joint into the sample chamber and having a cable bushing for signal cables of the thermocouple. The cable bushing emerges from the measurement head out of a discharge opening on an end of the measurement head opposite the immersion end. A straight line between the immersion end and the discharge opening forms a longitudinal axis of the measurement head, and a theoretical plane through the hot solder joint and through a part of the inlet opening farthest away from the immersion end is formed perpendicular to the longitudinal axis.

Abstract: A heat flux measurement device includes at least two thermocouples disposed within a front portion of the device at different axial distances from a front wall of the device. A correlation between the measured heat fluxes from the device over a period of time is used to estimate a fouling thickness on a wall, for example, a water wall of a radiant syngas cooler (RSC).

Abstract: An apparatus for measuring the temperature of a rolling material is capable of accurately measuring the temperature of a rolling material by putting a temperature-measuring unit in contact with a surface of the rolling material that is extracted from a heating furnace and conveyed on a roller table to the next process, and moving the temperature-measuring unit contacting the surface of the rolling material together with the rolling material in the conveyed direction thereof.

Abstract: Disclosed herein is a multiposition temperature cable, including: a measuring unit that includes a plurality of connectors, each being composed of a plus (+) terminal and a minus (?) terminal, in which each of the connectors measures a thermoelectromotive force; and a plurality of wire couples (thermocouples) that are connected to the plurality of connectors, wherein each of the wire couples includes a plus (+) junction wire, one end of which is connected to the plus (+) terminal, and a minus (?) junction wire, one end of which is connected to the minus (?) terminal, and the other end of the plus (+) junction wire and the other end of the minus (?) junction wire are connected to each other to form a hot junction with respect to each connector to form a closed circuit. The multiposition temperature cable can simultaneously measure temperatures at several positions in real time.

Abstract: A portable noncontact thermometer comprising a housing defining an aperture for ingress of incident thermal energy in a field of view. A graphical display is fixed with respect to the housing. The thermometer further comprises a thermopile array including a plurality of thermopile elements positioned inside the housing so as to be impinged by the incident thermal energy. The thermometer further includes processing circuitry in electrical communication with the thermopile array. The processing circuitry is operative to produce on the graphical display a thermal image of the field of view. The processing circuitry is further operative to determine a temperature of a target location within the field of view based on electrical signals derived from a subset of the thermopile elements. The subset of thermopile elements may be a single thermopile element located approximately at a center of the thermopile array.

Abstract: An integrated cold junction compensation system for a thermocouple connection is disclosed. The system includes a temperature sensor integrated with a terminal at which the thermocouple wires terminate. The temperature sensor is integrated with the terminal proximal to a cold junction of a thermocouple, such that the temperature at the sensor location is substantially equal to that at the cold junction. The temperature sensor is further in electrical signal isolation from a circuit carrying voltage output by the thermocouple.

Abstract: A composite material that is responsive to either electromagnetic or thermal radiation. The composite has a controllable structure that is either dynamically or tunably responsive to such radiation and comprises a metamaterial. Sensors, such as a bolometer, that incorporate the composite are also described.

Abstract: Systems and methods relating to programmable circuits are described. Several embodiments relate to systems and methods for controlling the long-term stability and accuracy of circuits that produce waveforms varying in frequency and amplitude. Such embodiments may include a circuit comprising a common vacuum environment that houses a pair of heater-thermocouples. The circuit may compare signals outputted by each heater-thermocouple and then may produce a resultant value based on the comparison. The resultant value may be used by the circuit to control the long-term stability and accuracy of the circuit. Such control of the long-term stability and accuracy of the circuit may include drift compensation associated with certain components of the circuit.

Abstract: A mount includes a mounting bolt attached to a casing; an internal bushing that engages the casing at a distal end of the internal bushing; and an external bushing that engages a manifold and engages the internal bushing. The internal bushing is adjustable with respect to the external bushing thereby allowing the manifold to be adjustable with respect to the casing.

Abstract: An assembly includes a thermocouple, a cold junction sensor, and a circuit. The thermocouple has a process end and a cold junction end. The cold junction end has first and second cold junction terminals. The cold junction sensor is supported near the cold junction end and configured to measure temperature at the cold junction end. The circuit is electrically connected to the cold junction sensor and to the first and second cold junction terminals. The circuit is configured to produce a thermocouple signal as a function of voltage across the first and second cold junction terminals and to produce a cold junction sensor signal as a function of temperature of the cold junction end as measured by the cold junction sensor. The circuit is further configured to calculate a correlation between the thermocouple signal and the cold junction sensor signal.

Abstract: Metal ebulliometer with internal fluid recirculation which is used to study the Vapor-Liquid Equilibrium without requiring the use of any auxiliary external elements. It provides the advantages of glass equipment and, as it is made of metal, it allows working in pressures higher than the atmospheric pressure—in a range of up to approximately 10 bars. This invention can be manufactured in either copper or stainless steel, for example. The result is the design of a continuous and dynamic equipment in which both phases (Vapor-Liquid) can be recirculated.

Abstract: A device for measuring the temperature of a substrate comprising a thermocouple comprising electric wires joined to each other at least one junction; a fixing element suitable for fixing said junction to said substrate in order to measure its temperature; characterized in that the fixing element comprises a thermally conductive element suitable for bearing a portion of electric wires adjacent to said junction; said thermally conductive element being capable of thermally coupling said portion of electric wires to said substrate.

Abstract: A portable temperature sensing probe (10) having a plurality of thermocouples (18) is inserted into a tank (16) mounted on a truck or other receptacle at the time of loading a hot liquid, e.g., molten sulfur (14). The probe and at least a portion of the associated wiring or leads are attached to the loading pipe (22) and/or discharge nozzle, and the probe is inserted into the interior of the tank before the molten sulfur (14) is discharged. The signals from the plurality of thermocouples (18) are amplified and the corresponding temperature information is transmitted to a display and control device (30). Due to the significant differential between the temperature of the rising molten sulfur (14) and the vapors in the tank overhead space (26), the signals generated indicate which of the thermocouple (18) are in contact with molten sulfur (14) or the vapor zone (32). The generated signals adjust the shut-off valve (38) that controls the flow of molten sulfur (14) into the tank (16).

Abstract: A thermocouple having at least one inner alignment feature or at least one outer alignment feature, or a combination thereof for positively positioning and aligning at least one thermocouple junction within a bore formed in a susceptor ring of a semiconductor substrate processing reactor. The outer alignment feature is configured to positively align the junction(s) longitudinally within the bore. The inner alignment feature configured to positively position the junction(s) rotationally within the sheath of the thermocouple relative to the bore.

Abstract: The present invention provides a digital linear heat detector with thermocouple heat confirmation. A digital linear heat detector with thermocouple heat confirmation comprises a first conductor and a second conductor, the first conductor composed of a different conductive material than the second conductor. The first and second conductors are then are twisted together to form substantially continuous spring pressure between the first conductor and the second conductor, thereby causing the layers of the non-conductive heat sensitive thermoplastic material to be in contact. The present invention also includes a monitoring circuit that is configured to monitor resistance along the first and second conductors. When the resistance changes along the first and second conductors, the monitor is configured to detect a short and enter a thermocouple mode.