Abstract: Aspects of the invention provide for a resistance temperature device (RTD) measurement device. In one embodiment, aspects of the invention include a RTD measurement device that includes: an input including a plurality of terminals from an RTD sensor; a plurality of burnout switches, each burnout switch connected to a terminal of the RTD sensor; a plurality of resources; and a switch block connecting the plurality of terminals and the plurality of resources to determine a measurement of the RTD sensor.

Abstract: The present disclosure includes sensing device embodiments. One sensing device includes a heater layer, a resistance detector layer, constructed and arranged to indicate a temperature value based upon a correlation to a detected resistance value, an electrode layer, and a sensing layer.

Abstract: A method for determining a value of a parameter of an object or an environment includes positioning a device having a balanced circuit in or on an object or within a particular environment, wherein the balanced circuit comprises elements which are operationally sensitive to changes in a parameter of the object or the environment. The method further includes measuring a common mode signal of the balanced circuit and determining, from the common mode signal, a value of the parameter. An exemplary implementation of the method includes determining temperature using a resistive sensor having a Wheatstone bridge circuit with two variable resistors and two fixed resistors. Embodiments of systems and devices configured to employ such methods are provided, particularly medical probes, electronic signal monitoring devices, and systems employing such devices.

Abstract: A method for measuring a contacting thermal resistance of one-dimensional structures is provided. A first one-dimensional structure and A second one-dimensional structure are crossed and in contact with each other to form a suspended junction. A point P of the first one-dimensional structure is heated until the first one-dimensional structure and the second one-dimensional structure reach a thermal equilibrium. A point A and a point B are selected on the first one-dimensional structure and a point C and a point D are selected on the second one-dimensional structure, wherein the point B, the point A, the suspended junction, the point C and the point D are arranged equidistantly with a distance ?x. A temperature difference ?Tj is calculated by the formula ?Tj=?TAC??TBA??TCD. The heat flux Qj is calculated by the formula Qj=2k?TCD/?x. The contacting thermal resistance Rj is calculated by the formula Rj=?Tj/Qj.

Abstract: A temperature transmitter for sensing a temperature of an industrial process includes a temperature sensor arranged to provide a sensor output related to the temperature of the industrial process. Measurement circuitry is coupled to the temperature sensor and configured to determine the temperature of the industrial process based upon the sensor output. Output circuitry provides an output related to the measured temperature. A memory is configured to store temperature information related to excessive temperature events experienced by the temperature sensor. Diagnostic circuitry diagnoses a condition of the temperature sensor or other components based upon the stored temperature information.

Abstract: A dual-coplanar sensor architecture is constructed by launching from coaxial airline to a unique arrangement of coplanar waveguides, arranged symmetrically on both sides of a thin dielectric substrate. The center conductor of the coaxial airline makes electrical contact with the middle conductor of both the top and bottom coplanar waveguides. The characteristic impedance of the top and bottom coplanar waveguides is designed to be approximately twice the characteristic impedance of the coaxial airline, such that the parallel combination of the two coplanar waveguides is the characteristic impedance of the coaxial airline. Further, steps in both the ground planes and center conductor at the point of transition from coaxial to coplanar are used to tune the launch and minimize reflection at the launch.

Abstract: A temperature sensor assembly is provided that includes a handle defining an internal cavity, and a probe secured to the handle and extending distally therefrom. The probe includes a sheath, a thermistor disposed within the sheath and defining a pair of wires and a bead formed at a distal end portion of the pair of wires. An electrical noise suppression device is disposed within the internal cavity of the handle and is electrically connected to the pair of thermistor wires. A set of lead wires is secured to a proximal end portion of the handle and are electrically connected to the electrical noise suppression device. An adhesive lined heat shrink tubing extends from around the bead of the thermistor, around the pair of thermistor wires, around the electrical noise suppression device, and to around at least a portion of the lead wires.

Abstract: An electrical seat heater of a vehicle has a heating resistor which is connected to a seat ground cable has a temperature-dependent sensor resistor in the vehicle seat. A control unit is outside the vehicle seat is connected to a control unit ground remotely from the vehicle seat. The voltage measurement for determining the temperature is carried out with the seat heater briefly disconnected from the supply voltage. The heating resistor is connected to the supply voltage via a series circuit including the sensor resistor and a further resistor or to the supply voltage via a power path. The control unit measures the voltage drop at the sensor resistor by a measuring signal cable. The control unit measures the potential difference between the seat ground cable and the control unit ground, which is used to correct the seat temperature.

Abstract: A temperature sensor having a weld zone between an element electrode wire and a sheath core wire. When a section of the weld zone is taken orthogonally to the axial direction and in such a manner as to pass through a center point, L/D is greater or equal to 0.6, wherein D represents the diameter of the element electrode wire, and L represents the length of a chord connecting a first weld point and a second weld point as defined herein.

Abstract: A temperature measuring device for an electric appliance such as a fryer includes at least one temperature sensor in the form of an electric resistor, to which at least two different measuring voltages can be applied with cyclic switching between the measuring voltages. The temperature sensor is connected to a control, which includes a microcontroller and which is configured for applying at least two different measuring voltages to the temperature sensor.

Abstract: Disclosed herein is a composition of a sensor element, a temperature sensor having the composition of the sensor element and a method of manufacturing the temperature sensor. The sensor element composition comprising Y2O3, Al2O3, MnO2, NiO and Fe2O3, and further comprising ZrO2 and a temperature sensor comprising the same. The method comprising: weighing the composition for a sensor element; mixing the composition; calcining the mixture at about 1000° C.—1400° C. for 30 min—5 hrs; pulverizing the calcined mixture to obtain powder; disposing the powder type mixture into a mold; inserting in parallel a plurality of lead wires into the powder type mixture; pressure molding the powder type mixture; and sintering the pressure molded material at about 1300° C.—1500° C. for 30 min—5 hrs.

Abstract: Provided is a temperature measuring device capable of continuously measuring a body temperature without imposing a load on a subject or a measurer. The temperature measuring device includes: a temperature measuring unit (10, 210) to be attached to an object to be measured, including a temperature measuring unit-side temperature sensing element (21, 221) and a first coil (11, 211); and a power supplying unit (30, 230) including a second coil (31, 231), for supplying power to the temperature measuring unit (10, 210), in which the temperature measuring unit (10, 210) and the power supplying unit (30, 230) are formed integrally with each other.

Abstract: An ultrasonic position sensing system is disclosed. In one embodiment, the system includes an ultrasonic sensor configured to monitor the position of a device. The system also includes ranging logic. The sensor is controlled by the logic to direct an ultrasonic pulse toward the device. The logic is configured to compute the transit time and the velocity of the ultrasonic pulse. Based on these parameters, the logic computes the path length between the sensor and the device, which corresponds to the location of the device relative to the location of the sensor. In further embodiments, the ultrasonic positioning system may include multiple sensors in communication with the ranging logic for monitoring multiple devices.

Abstract: A flexible board includes a base layer, a wiring conductor layer that is located on the base layer, and a cover layer that is stacked over the base layer and covers the wiring conductor layer. A portion of the wiring conductor layer defines connecting portions that connect each of split electrodes of a flexible thermistor. The cover layer includes an opening that exposes the connecting portions, and receives the flexible thermistor. The split electrodes of the flexible thermistor are mounted on the connecting portions of the wiring layer. The height of the exposed surface of the flexible thermistor from the opening is substantially equal to the height of the surface of the cover layer.

Abstract: The present invention, in one embodiment, provides a method of measuring pressure or temperature using a sensor including a sensor element composed of a plurality of carbon nanotubes. In one example, the resistance of the plurality of carbon nanotubes is measured in response to the application of temperature or pressure. The changes in resistance are then recorded and correlated to temperature or pressure. In one embodiment, the present invention provides for independent measurement of pressure or temperature using the sensors disclosed herein.

Abstract: A system and a method for measuring temperature within an operating circuit use a Wheatstone bridge within a temperature sensing circuit. One of the resistors in the Wheatstone bridge is a thermally sensitive resistive material layer within the operating circuit. The other three resistors are thermally isolated from the operating circuit. Particular configurations of NFET and PFET devices are used to provide enhanced measurement sensitivity within the temperature sensing circuit that includes the Wheatstone bridge.

Abstract: According to one embodiment, an apparatus for reading a temperature of a material includes a thermistor that is communicable in temperature sensing communication with the material. The apparatus also includes a first resistor that has a first resistance and a second resistor that has a second resistance that is lower than the first resistance. Additionally, the apparatus includes a switch that is selectively controllable to electrically couple the first resistor and second resistor to the thermistor in a low temperature mode. The switch also is selectively controllable to electrically couple the second resistor to the thermistor and electrically decouple the first resistor from the thermistor in a high temperature mode.

Abstract: A device for detecting temperature variations of the substrate of an integrated circuit chip, including, in the substrate, implanted resistors connected as a Wheatstone bridge, wherein each of two first opposite resistors of the bridge is covered with an array of metal lines parallel to a first direction, the first direction being such that a variation in the substrate stress along this direction causes a variation of the unbalance value of the bridge.

Abstract: A test apparatus for a thermal resistor includes a control device, a temperature processing circuit, a voltage regulating circuit and a temperature detecting circuit. The control device stores a plurality of predetermined voltage values and outputs control signals according to those predetermined values. The temperature processing circuit receives the control signals and outputs a pulse width modulation (PWM) signal according to the control signal. The voltage regulating circuit receives the PWM signal and outputs a first direct current (DC) voltage to heat the thermal resistor. The temperature detecting circuit detects temperature signals and current signals from the thermal resistor. The control device receives the temperature signals and current signals of the thermal resistor and generates a resistance-temperature graph of the thermal resistor.

Abstract: A housing between mineral-insulated cable and connecting wire in a turbocharger overheating protection device may include the following characteristics: coiled regions of springs (10) arranged point-symmetrically to each other; or the springs (10) are not placed on axes; or the coil regions of the coil springs (10) for cushioning the film resistor are shorter than its substrate length and longer than its substrate width; or the connecting wires of the film resistor are shorter than its substrate length and longer than its substrate width; or the springs are arranged staggered in their longitudinal direction adjacent to each other; or coil springs (10) are used, in which the coils are located only in one half of the spring (10) and the coils of one spring are arranged staggered in the longitudinal direction to the coils of the other spring (10).

Abstract: A method for determining the temperature of an ignition coil (1), including a primary winding with a winding resistance (Rp), the primary winding being controlled by a control stage (2) with a foot resistance (Rsh), the method including the following steps: a) controlling the control stage in order to establish a primary control current; b) waiting for a predetermined time; c) determining the current Ip by measuring the voltage Vshunt and by dividing this voltage by the foot resistance Rsh; d) acquiring the value of the supply VB and the voltage Vice; e) determining the winding resistance Rp using the formula: Rp = VB - Vce Ip - Rsh f) determining the primary winding temperature using a temperature-resistance correspondence curve.

Abstract: The temperature sensor includes a thermo-sensitive element, first and second electrode wires electrically connected to the thermo-sensitive element, first and second signal wires partially overlapped with and connected to the first and second electrode wires, respectively. The first and second electrode wires are made of a first metal material consisting primarily of Pt. The first and second signal wires are made of a second metal material containing Al and having a linear thermal expansion coefficient larger than that of the first metal material. Each of an overlap portion of the first electrode wire and the first signal wire and an overlap portion of the second electrode wire and the second signal wire includes a junction part formed by melting and thereafter coagulating the first or second electrode wire and the first or second signal wire. The junction part includes an oxidation film containing Al formed on a surface thereof.

Abstract: A system for measuring temperature includes a thermowell, a primary temperature sensor, a reference sensor, and a transmitter. The thermowell has a measurement instrument connection and a side port. The primary temperature sensor extends into the thermowell through the measurement instrument connection, and the reference sensor extends into the thermowell through the side port. The transmitter is connected to each of the primary temperature sensor and the reference sensor. The transmitter has circuitry for measuring temperature based upon signals received from the primary temperature sensor and for concurrently calibrating based upon signals received from the reference sensor.

Abstract: An ultra thin temperature sensor device includes a temperature sensor element, lead frames for allowing the temperature sensor element to be interposed and fastened between the lead frames, a supporter for protecting the temperature sensor element, and a film for enclosing and insulating the temperature sensor element, the lead frames, and the supporter. The supporter is formed to be larger than the temperature sensor element.

Abstract: An electronic comprises at least one strain gauge arranged at the electronic device such that a strain of the at least one strain gauge is influenced by a change of a temperature of the electronic device and a control assembly for evaluating an output signal of the at least one strain gauge to determine a temperature of the electronic device on the basis of the output signal and for controlling at least one function of the electronic device based on the determined temperature.

Abstract: In a hydrocarbyl gas the presence and amount of a condensable polar component may be detected by voltage or current excursions over background noise as measured using a probe having at least two common electrodes and optionally a third electrode preferably inert to corrosion.

Abstract: A time-multiplexed thermal sensing circuit is provided for control and sensing of two thermistors over a single line electrical coupling. The circuit may include a first diode that selectively couples or isolates a first thermistor from a sense node based on the polarity of an applied voltage to the sense node. The circuit may further include a second diode that selectively couples or isolates a second thermistor from the sense node based on the polarity of the applied voltage to the sense node such that only of the thermistors is coupled to the sense node at any time.

Abstract: An object of the present invention is to provide a temperature sensor which can increase responsiveness while ensuring reliability and can be downsized without changing its mounting configuration from conventional ones. In a temperature sensor 10, two thermistors 20A and 20B are held in a protective tube 11 via holders 30. Flat portions 30b are formed on the holders 30, and a filler 60 can be spread throughout the protective tube 11 through spaces 40 between an inner circumferential surface of the protective tube 11 and the flat portions 30b as well as spaces 50 between the inner circumferential surface of the protective tube 11 and lateral portions 30c. Also, in the protective tube 11, element bodies 21 of the thermistors 20A and 20B are placed side by side close to the inner circumferential surface of the protective tube 11.

Abstract: The present disclosure relates to a composite material for a temperature sensor, and a method of manufacturing the temperature sensor using the same. The composite material according to the disclosure may contain four or more kinds of metal oxides that are combined with highly insulating materials, thereby producing a material with semiconductor-like properties that makes it possible to easily and accurately measure a temperature even at a high temperature in the range of 500° C. and above. Furthermore, unlike a conventional temperature sensors in which an electrode is printed/plated on the device surface, the sensor of the disclosure includes electrode wires with a predetermined diameter that are inserted into the metal oxide of the temperature sensor during a process in which the metal oxide is press-molded to form the temperature sensor so the electrode wires are prevented from becoming disconnected from the device.

Abstract: A temperature detection apparatus includes a transformer, a thermostat attached directly to an electrically conductive site of the heating element and has contacts that become short-circuited or come into an open-circuit condition depending on whether or not the temperature of the heating element is equal to or higher than a predetermined value, the contacts being connected to a secondary coil in the transformer, a DC voltage source and a transistor configured to supply required AC power to a primary coil in the transformer, a current detection resistor configured to detect a current flowing through the primary coil in the transformer, and a comparison circuit detecting a voltage generated across the current detection resistor when a current flows through the current detection resistor, the comparison circuit outputting an alarm signal when the current flowing through the primary coil in the transformer exceeds a preset threshold current.

Abstract: A control system is disclosed for determining an actual temperature of a light emitting diode. The control system uses conductor that supply power to the light emitting diode to supply a pulse to the light emitting diode. The pulse is determined along with a reaction caused by the pulse and the information gained is used in determination of the light emitting diode die temperature which can then be used in controlling current to the light emitting diode to control the temperature of the light emitting diode.

Abstract: A low-profile temperature sensor probe is disclosed as including a probe circuit subassembly having a temperature sensing thermistor, the subassembly being overmolded with a durable insulating material to form the probe body. The probe body forms a connector block portion and a flexible extension portion. The flexible extension portion enables the sensor probe to conform to the surface of the object to be sensed without undue strain on the components. The thermistor element is located in a protective pocket and positioned relative the probe body to ensure direct contact with the object to be sensed. The connector block is configured to accommodate a standard plug-in type electrical connector.

Abstract: A system for detecting a change in medium sensed by a thermistor comprises a first module that receives a temperature signal from a thermistor and that calculates a first dissipation factor of the thermistor. A second module receives the first dissipation factor of the thermistor and detects at least one of an unexpected medium and a change in medium based on the first dissipation factor.

Abstract: Systems and methods for dissipating heat generated during an electrical function are disclosed. In particular, the disclosed systems and methods can be used for dissipating heat generated during low impedance measurement on a multimeter. In some embodiments, the multimeter can include a first thermistor coupled in series with a resistor in a measurement path, a second thermistor, and a switch coupled to the measurement path and the second thermistor for selectively including the second thermistor in the measurement path during a low impedance measurement.

Abstract: A low temperature radiometer includes a main body, a main cavity, an exit cavity, a suspended thermometer, and an attached thermometer. The main cavity is disposed within the main body and is defined through an off-axis parabolic concentrating cone formed of the inner walls of the main body. The exit cavity is disposed within the main body and is defined through a cylindrical inner surface of the main body. The suspended thermometer is suspended within the exit cavity and is disposed to be in communication with radiation entering the main cavity and being diverted to the exit cavity. The attached thermometer is attached to the outer surface of the main body and is in thermal communication and contact with the main body.

Abstract: A detector assembly is provided and includes a board, a temperature response element and a support coupled to the board to support the temperature response element, the support including an elongate member having first and second opposing ends and being coupled to the board at the first end, guides through which temperature response element leads are threadable, and a saddle disposed at the elongate member second end to inhibit displacement of the temperature response element.

Abstract: Two vertically offset thermistors for sensing a fluid such as oil and refrigerant in a compressor shell are monitored by a method that takes into account rapidly changing conditions within the shell. The system can determine the fluid's sump temperature, high/low liquid levels, and can determine whether the thermistors are sensing the fluid as a liquid, gas, or a mixture of the two, such as a foam or mist of liquid and gas. For greater accuracy, thermistor readings can be dithered and filtered to provide temperature or voltage values having more significant digits than the readings originally processed through a limited-bit A/D converter. For faster response, limited microprocessor time is conserved by sampling thermistor readings at strategic periods that enable the microprocessor to identify certain conditions and temperatures via simple delta-temperature ratios and undemanding equations rather than resorting to exponential functions or lookup tables to determine time constants.

Abstract: A mounting structure (34) for receiving a sensor (18) having a sensing portion (26) and a base portion (30) includes a substantially flat sheet of material (20) having a first surface (20a), a second surface (20b) opposite the first surface (20a), and an aperture (36). The aperture (36) is configured such that the sensing portion (26) of the sensor (18) is passable through the aperture (36), and the base portion (30) is not passable through the aperture (36), but instead rests on the first surface (20a). The mounting structure (34) also includes a pair of tabs (38) that extend in a downward direction away from the second surface (20b) of the sheet of material (20) and are configured to immobilize the sensor (18) within the aperture (36).

Abstract: Disclosed herein, among other things, is a stator winding temperature sensor. According to an embodiment, the sensor includes at least one sensing wire coil adapted to be connected to a stator. The sensor also includes a body, including a core material surrounding at least a portion of the sensing wire coil, and a laminate material over the core material. The body has a thickness adapted to protect the sensing wire coil. The sensor includes a lead wire adapted to connect to an external monitoring device. The sensing wire coil is electrically connected to the lead wire at a lead step portion of the sensor. In addition, the sensor includes a tab extending from the lead wire and encompassing the lead step. The tab protects the lead step and the sensing wire coil in a region where the sensor extends over an end of the stator.

Abstract: This invention is to provide a temperature sensor which can measure a precise temperature of a minute region, which can measure a temperature in a wide range from a low temperature to a high temperature, and which has a simple structure. The temperature sensor comprises a two-dimensional electron gas. A resistance of the two-dimensional electron gas is used to measure a temperature. The two-dimensional electron gas may have a heterostructure selected from the group consisting of an AlGaN/GaN system, an AlGaAs/GaAs system, an InAs/GaAs system, an InAs/GaSb/AlSb system, a SiGe/Si system, a SiC/Si system, a CdTe/HgTe/CdTe system, an InGaAs/InAlAs/InP system, and nanocrystalline silicon.

Abstract: A temperature sensing module includes a thermal sensor and an auxiliary fixture member. The thermal sensor includes a sensing head and plural pins. The pins and respective wires are connected with each other to form plural connecting regions. The auxiliary fixture member includes a fixing part, an extension part, a receiving part and a covering part. The extension part includes plural grooves for partially accommodating the pins of the thermal sensor, the wires and the connecting regions. The receiving part is arranged between the fixing part and the extension part for accommodating the sensing head of the thermal sensor. The covering part is disposed over the extension part for covering the extension part so that the pins, the wires and the connecting regions accommodated within the grooves of the extension part are fixed between the extension part and the covering part.

Abstract: A micro mechanical vacuum sensor for determining the pressure within a cavity of a micro mechanical device is provided. The sensor comprises a substrate, at least one electrically conductive support member connected to the substrate, and a thermally resistive layer supported by the at least one support member and spaced from the substrate by the support member to provide a space between the thermally resistive layer and the substrate. The sensor is arranged such that the thermally resistive layer is substantially thermally insulated from the substrate. The sensor is further arranged to be driven such that the pressure within the cavity is determined by a temperature value sensed by the sensor.

Abstract: An apparatus for measuring a temperature of a process fluid includes a resistance based temperature sensor (RTD) sensor configured to thermally couple to the process fluid. First and second electrical connections are configured to apply a current through the RTD. Measurement circuitry is configured to measure a voltage across the RTD and identify a degraded connection to the RTD and responsively measure a temperature of the process fluid using the electrical connections.

Abstract: A temperature sensor is disclosed having a measuring resistor which is accommodated inside a protective tube and a proximal end of which is connected to a sensor head. The sensor head includes a measurement insert for electrically connecting the measuring resistor and a measuring transducer which is connected downstream thereof to, for example, condition measurement signals. The sensor head is formed by a cylindrical housing having an intermediate base, the measurement insert being accommodated in a lower housing section which is adjacent to the measuring resistor and is sectioned off by the intermediate base, and the measuring transducer being accommodated in an opposite, upper housing section.

Abstract: A method of producing a temperature measuring sensor including an insulating substrate having a top surface and a bottom surface, the top surface including a first area and a second area, and a first contact and a second contact being formed in the first area, the above contacts having a structured measuring film located therebetween: creating a conductive connection between the first contact on the top surface of the insulating substrate and the bottom surface of the insulating substrate, and a first conductive layer as a first terminal area of the temperature measuring sensor on the bottom surface such that the first conductive layer is electrically connected to the conductive connection, as well as a second conductive layer on the second area of the top surface as a second terminal area of the temperature measuring sensor such that the second conductive layer is in contact with the second contact.

Abstract: The invention relates to systems and methods for calibrating and using resistance temperature detectors. In one embodiment, the system includes a calibration circuit comprising a resistance temperature detector in a bridge circuit with at least one potentiometer, and a programmable gain amplifier coupled to the bridge circuit. Embodiments of the invention further comprise methods for calibrating the bridge circuit and the programmable gain amplifier for use with the resistance temperature detector and methods for determining the self heating voltage of the bridge circuit.

Abstract: A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC. This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, first linear conductive members are positioned in a first IC layer, in parallel relationship with one another. Second linear conductive members are positioned in a second IC layer in parallel relationship with one another. Conductive elements connect the first linear members into a first conductive path, and the second linear members into a second conductive path. A third conductive element extending between the first and second layers connects the first and second conductive paths into a single conductive path, wherein the path resistance varies with temperature. The path resistance is used to determine temperature.

Abstract: A temperature sensor including a temperature sensitive device which is disposed in a flow path through which fluid flows and whose electric characteristic changes as a function of temperature of the fluid in the flow path, signal lines connected at top end sides thereof to said temperature sensitive device through electrode wires and at base end sides thereof to lead wires for connection with an external circuit, a sheath member retaining the signal lines therein, and a holding member which holds an outer circumferential surface of said sheath member directly or indirectly through another member. The resonance (primary) frequency at a top end of the temperature sensor against acceleration in a radius direction of the temperature sensor is 480 Hz or less, thereby reducing the transmission of vibration to the top end of the temperature sensor to avoid the breakage of the temperature sensitive device and the disconnection of the electrode wires 502102 even when the temperature sensor resonates.

Abstract: Provided is a temperature sensor capable of stably keeping the accuracy of detected temperatures. The temperature sensor of the present invention comprises a sensor element (1) comprising a temperature sensing element (2) whose electrical resistance changes according to temperature; a pair of lead wires (4) electrically connected to the temperature sensing element (2); and a covering material (5) which seals the temperature sensing element (2) and portions of the lead wires (4) in a prescribed range; wherein the lead wires (4) are led out of the sealed ends (6) of the covering material (5). The temperature sensor further comprises a metallic protective tube (20) which houses the sensor element (1) except part of the lead wires (4); and a shield comprising a ceramic sealed end closing element (7) which encloses the sealed ends (6), and a lead wire protective tube (8). The shield is loosely fitted inside the metallic protective tube (20).

Abstract: A system for compensating a thermal effect is provided and includes a substrate structure and a microcantilever. The substrate structure includes a first piezoresistor. The first piezoresistor is buried in the substrate structure and has a first piezoresistance having a first relation to a first variable temperature. The microcantilever has the thermal effect and a second piezoresistance having a second relation to the first variable temperature, wherein the thermal effect is compensated based on the first and the second relations.