Lithography Patents (Class 378/34)
  • Patent number: 10593826
    Abstract: We disclose herewith a heterostructure-based infra-red (IR) device comprising a substrate comprising an etched portion and a substrate portion; a device region on the etched portion and the substrate portion, the device region comprising a membrane region which is an area over the etched portion of the substrate. At least one heterostructure-based element is formed at least partially within or on the membrane region and the heterostructure-based element comprises at least one two dimensional carrier gas.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: March 17, 2020
    Assignee: CAMBRIDGE GAN DEVICES LIMITED
    Inventors: Florin Udrea, Andrea De Luca, Giorgia Longobardi
  • Patent number: 10520827
    Abstract: An optical system, in particular for a microlithographic projection exposure apparatus, with at least one mirror (200) which has an optically effective surface and, for electromagnetic radiation of a predefined operating wavelength impinging on the optically effective surface at an angle of incidence of at least 65° relative to the respective surface normal, has a reflectivity of at least 0.5. The mirror has a reflection layer (210) and a compensation layer (220) which is arranged above this reflection layer (210) in the direction of the optically effective surface. The compensation layer (220), for an intensity distribution generated in a pupil plane or a field plane of the optical system during operation thereof, reduces the difference between the maximum and the minimum intensity value by at least 20% compared to an analogous structure without the compensation layer.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: December 31, 2019
    Assignee: CARL ZEISS SMT GMBH
    Inventors: Hartmut Enkisch, Thomas Schicketanz, Matus Kalisky, Oliver Dier
  • Patent number: 10514608
    Abstract: The disclosure relates to a method for producing an illumination system for an EUV apparatus in and to an illumination system for an EUV apparatus.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: December 24, 2019
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Juergen Baier, Daniel Runde, Matthias Manger, Ulrich Mueller, Joerg Lichtenthaeler, André Orthen, Joachim Welker, Markus Holz, Hubert Holderer
  • Patent number: 10502261
    Abstract: A concave portion provided in at least one of the first assembled surface, and other assembled surfaces for fastening the driving force source, in the region corresponding to the outer race of the tapered roller bearing, the other assembled surfaces provided to one of the fixed component and the driving force source.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: December 10, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Koichi Kato, Shinichi Baba, Shinichiro Suenaga, Iori Matsuda, Michitaka Tsuchida, Akiko Nishimine
  • Patent number: 10401723
    Abstract: A patterning device comprising a reflective marker, wherein the marker comprises: a plurality of reflective regions configured to preferentially reflect radiation having a given wavelength; and a plurality of absorbing regions configured to preferentially absorb radiation having the given wavelength; wherein the absorbing and reflective regions are arranged to form a patterned radiation beam reflected from the marker when illuminated with radiation, and wherein the reflective regions comprise a roughened reflective surface, the roughened reflective surface being configured to diffuse radiation reflected from the reflective regions, and wherein the roughened reflective surface has a root mean squared roughness of about an eighth of the given wavelength or more.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: September 3, 2019
    Assignee: ASML Netherlands B.V.
    Inventors: Pieter Cristiaan De Groot, Gerard Frans Jozef Schasfoort, Maksym Yuriiovych Sladkov, Manfred Petrus Johannes Maria Dikkers, Jozef Maria Finders, Pieter-Jan Van Zwol, Johannes Jacobus Matheus Baselmans, Stefan Michael Bruno Baumer, Laurentius Cornelius De Winter, Wouter Joep Engelen, Marcus Adrianus Van De Kerkhof, Robbert Jan Voogd
  • Patent number: 10353284
    Abstract: The present disclosure provides a lithographic reticle system comprising a reticle, a first pellicle membrane mounted in front of the reticle, and a second pellicle membrane mounted in front of the first pellicle membrane, wherein the first pellicle membrane is arranged between the reticle and the second pellicle membrane, and wherein the second pellicle membrane is releasably mounted in relation to the first pellicle membrane and the reticle.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: July 16, 2019
    Assignees: IMEC VZW, IMEC USA NANOELECTRONICS DESIGN CENTER
    Inventors: Rik Jonckheere, Cedric Huyghebaert, Emily Gallagher
  • Patent number: 10325798
    Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: June 18, 2019
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
  • Patent number: 10295915
    Abstract: A mask manufacturing apparatus, a method of manufacturing the mask, and a mask for lithography, capable of providing a pattern having a size in nanometer unit using the photo-lithography process are provided. A mask manufacturing apparatus, a method of manufacturing the mask, and an elastic film for a photo-mask lower a critical dimension of the pattern(s) without increasing a manufacturing cost. The mask manufacturing apparatus and the method of manufacturing the mask, and the mask for lithography provide a pattern having a size in nanometer unit using the photo-lithography process.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: May 21, 2019
    Assignee: POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Jun Suk Rho, In Ki Kim, Heon Yeong Jeong
  • Patent number: 10222693
    Abstract: A method of aligning a template and a substrate for imprint lithography involves using a mask pattern of the template and a luminescent marker pattern of the substrate, the method including aligning the template mask pattern and the substrate marker pattern using a radiation intensity measurement of radiation emitted by the luminescent marker pattern and having passed the template mask pattern. The mask pattern and the luminescent marker pattern may each be shaped to provide a turning point in the intensity of detected radiation emitted from the marker pattern, and passing through the mask pattern to a detector, as a function of relative displacement at the aligned position. The displacement of the template and substrate may be aligned by identifying the turning point in radiation intensity. The marker pattern may be fluorescent with the emitted radiation excited by a radiation source.
    Type: Grant
    Filed: July 22, 2011
    Date of Patent: March 5, 2019
    Assignee: ASML Netherlands B.V.
    Inventors: Johan Frederik Dijksman, Anke Pierik, Sander Frederik Wuister, Roelof Koole
  • Patent number: 10139725
    Abstract: The present invention is concerned with an apparatus for shielding a reticle for EUV lithography. The apparatus comprises a pellicle, and at least one actuator in communication with the pellicle, the actuator being configured to induce, in use, movement of the pellicle with respect to a reticle.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: November 27, 2018
    Assignee: ASML Netherlands B.V.
    Inventors: James Norman Wiley, Juan Diego Arias Espinoza, Derk Servatius Gertruda Brouns, Laurentius Cornelius De Winter, Florian Didier Albin Dhalluin, Pedro Julian Rizo Diago, Luigi Scaccabarozzi
  • Patent number: 10126642
    Abstract: Provided is a reflective photomask including a substrate, and a reflective layer formed on the substrate. The reflective layer includes at least one recessed portion. An absorbing layer is formed in the recessed portion. The absorbing layer includes at least one absorbent and at least one polymer.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: November 13, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Insung Kim, Seongsue Kim
  • Patent number: 10089733
    Abstract: A method and a microscope for determining a position of a structure element on a mask are provide. The method comprises predefining a region on the mask which comprises at least the structure element; determining a phase image of the region, wherein the phase image comprises in a spatially resolved manner the phase of the imaging of the mask by the illumination radiation; and determining the position of the structure element within the phase image.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: October 2, 2018
    Assignee: Carl Zeiss SMT GmbH
    Inventor: Dirk Seidel
  • Patent number: 10054513
    Abstract: Provided are an apparatus and method of sensing liquid leakage for a lithography apparatus, which can prevent a collector mirror from being contaminated by sensing leakage of cooling water supplied to the collector mirror of an extreme ultraviolet (EUV) light generating apparatus. The liquid leakage sensing apparatus includes a collector mirror module, a cooling unit configured to supply a cooling water to one surface of the collector mirror module, a gas supply unit configured to supply a water soluble gas to the cooling unit, and a sensing unit configured to sense the water soluble gas having leaked to the outside of the cooling unit.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: August 21, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Joo Kim, Jin-Pyoung Kim, Do-Hyun Seo, Jae-Pil Lee, Hyun-Hoon Lee, Sung-Jo Hwang
  • Patent number: 9938616
    Abstract: Nitrogen-doped tungsten films characterized by low stress (e.g. less than 250 MPa) and excellent adhesion to an underlying dielectric layer are deposited by physical vapor deposition (PVD). The films can be used as hardmask layers in fabrication of 3D memory stacks and can be deposited directly onto a top dielectric layer in a stack of layers. The low stress films are characterized by higher concentration of nitrogen at the interface with the dielectric layer than in the bulk of the film, and have a nitrogen content of between about 5-20% atomic. The films having a thickness of between about 300-900 nm can be deposited in a PVD process chamber by forming a plasma in a process gas comprising a noble gas and nitrogen, where the flow rate of nitrogen is between about 10-17% of the total flow rate of the process gas.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: April 10, 2018
    Assignee: Lam Research Corporation
    Inventors: Michael Rumer, Michael Ng
  • Patent number: 9891530
    Abstract: An illumination optical unit comprises a first faceted element and a second faceted element having a multiplicity of displaceable micromirrors which can be grouped flexibly to form facets.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: February 13, 2018
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Martin Endres, Michael Patra
  • Patent number: 9846371
    Abstract: An exposure apparatus exposes a substrate by projecting a pattern image onto the substrate through a liquid. The exposure apparatus includes a projection optical system by which the pattern image is projected onto the substrate, and a movable member which is movable relative to the projection optical system. A liquid-repellent member, at least a part of a surface of which is liquid-repellent, is provided detachably on the movable member, the liquid-repellent member being different from the substrate.
    Type: Grant
    Filed: April 27, 2015
    Date of Patent: December 19, 2017
    Assignee: NIKON CORPORATION
    Inventors: Soichi Owa, Nobutaka Magome, Shigeru Hirukawa, Yoshihiko Kudo, Jiro Inoue, Hirotaka Kohno, Masahiro Nei, Motokatsu Imai, Hiroyuki Nagasaka, Kenichi Shiraishi, Yasufumi Nishii, Hiroaki Takaiwa
  • Patent number: 9810992
    Abstract: An illumination system has illumination optics which guide EUV illumination light collected by a collector to an object field. The illumination optics have a field facet mirror and a pupil facet mirror. Pupil facets are part of transfer optics which image the field facets in a manner superposed on one another into the object field. The collector images a radiation source region into an intermediate focal region disposed downstream thereof. The latter constitutes the first image of the radiation source region in the beam path disposed downstream thereof. A constriction region not coinciding with the downstream focal region is situated between the collector and a first component of the illumination optics.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: November 7, 2017
    Assignee: Carl Zeiss SMT GmbH
    Inventor: Markus Deguenther
  • Patent number: 9728668
    Abstract: A system to configure a conductive pathway and a method of forming a system of configurable conductivity pathways are described. The system includes a photosensitive layer that becomes conductive based on photoexcitation, and a light source layer deposited over the photosensitive layer, the light source layer selectively providing the photoexcitation to the photosensitive layer. The system further includes a controller to control the light source layer, the controller illuminating a portion of the light source layer corresponding with a user input image to photoexcite the photosentive layer and configure the conductive pathway in the photosensitive layer according to the image.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: August 8, 2017
    Assignee: RAYTHEON COMPANY
    Inventors: Michael H. Robson, Michael T. Pace
  • Patent number: 9588310
    Abstract: A method for aligning a ferrule-mounted optical fiber with the optical axis of an electro-optical device, including the following steps: providing an alignment marking with respect to the device in relation to the optical axis; providing an annular receptacle and a tubular alignment pin with a central passageway, having its proximal end slidably fitted in the annulus of the receptacle; aligning the proximal end of the alignment pin with the alignment marking; securing the device to the receptacle; removing the alignment pin from the receptacle; and inserting the ferrule-mounted optical fiber into the receptacle.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: March 7, 2017
    Assignee: Quantum Elctro Opto Systems Sdn Bhd.
    Inventors: Idris Rahmat, Huan Sin Lee, Tuan Chin Teyo, Gabriel Walter
  • Patent number: 9544984
    Abstract: An EUV light source includes a rotatable, cylindrically-symmetric element having a surface coated with a plasma-forming target material, a drive laser source configured to generate one or more laser pulses sufficient to generate EUV light via formation of a plasma by excitation of the plasma-forming target material, a set of focusing optics configured to focus the one or more laser pulses onto the surface of the rotatable, cylindrically-symmetric element, a set of collection optics configured to receive EUV light emanated from the generated plasma and further configured to direct the illumination to an intermediate focal point, and a gas management system including a gas supply subsystem configured to supply plasma-forming target material to the surface of the rotatable, cylindrically-symmetric element.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: January 10, 2017
    Assignee: KLA-Tencor Corporation
    Inventors: Alexander Bykanov, Oleg Khodykin, Daniel C. Wack, Konstantin Tsigutkin, Layton Hale, Joseph Walsh, Frank Chilese, Rudy F. Garcia, Brian Ahr
  • Patent number: 9538159
    Abstract: An apparatus and method for capturing a color image and a depth image are utilized as a source of obtaining a three-dimensional (3D) image. The apparatus for capturing the color image and the depth image may include a filtering unit to employ a frame having a polarity which includes an external frame to support a plurality of filters which filter at least one of a visible ray and an infrared (IR) ray from a ray input via a lens, a driving unit to move the filtering unit by pushing or pulling the external frame based on a polarity of an applied signal, and a control unit to control a voltage to be applied to the driving unit based on a distance between the filtering unit and the driving unit.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: January 3, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: ByongMin Kang
  • Patent number: 9488920
    Abstract: An exposure apparatus and method exposes a substrate by projecting an image of a pattern onto the substrate through a liquid. A projection optical system projects the image of the pattern onto the substrate. A recovery port recovers the liquid supplied onto the substrate. A temperature sensor measures a temperature of the liquid recovered via the recovery port.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: November 8, 2016
    Assignee: NIKON CORPORATION
    Inventor: Shigeru Hirukawa
  • Patent number: 9448493
    Abstract: An exposure apparatus and method exposes a substrate by projecting an image of a pattern onto the substrate through a liquid. A projection optical system projects the image of the pattern onto the substrate. A recovery port recovers the liquid supplied onto the substrate. A temperature sensor measures a temperature of the liquid recovered via the recovery port.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: September 20, 2016
    Assignee: NIKON CORPORATION
    Inventor: Shigeru Hirukawa
  • Patent number: 9417534
    Abstract: A lithography process in a lithography system includes loading a mask that includes two mask states defining an integrated circuit (IC) pattern. The IC pattern includes a plurality of main polygons, wherein adjacent main polygons are assigned to different mask states; and a background includes a field in one of the mask states and a plurality of sub-resolution polygons in another of the two mask states. The lithography process further includes configuring an illuminator to generate an illuminating pattern on an illumination pupil plane of the lithography system; configuring a pupil filter on a projection pupil plane of the lithography system with a filtering pattern determined according to the illumination pattern; and performing an exposure process to a target with the illuminator, the mask, and the pupil filter. The exposure process produces diffracted light and non-diffracted light behind the mask and the pupil filter removes most of the non-diffracted light.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: August 16, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yen-Cheng Lu, Shinn-Sheng Yu, Anthony Yen
  • Patent number: 9390984
    Abstract: A method for inspection includes irradiating, with a focused beam, a feature formed on a semiconductor wafer, the feature including a volume containing a first material and a cap made of a second material, different from the first material, that is formed over the volume. One or more detectors positioned at different angles relative to the feature are used to detect X-ray fluorescent photons that are emitted by the first material in response to the irradiating beam and pass through the cap before striking the detectors. Signals output by the one or more detectors at the different angles in response to the detected photons are processed in order to assess a quality of the cap.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: July 12, 2016
    Assignee: BRUKER JV ISRAEL LTD.
    Inventors: Isaac Mazor, Alex Tokar, Boris Yokhin, Matthew Wormington
  • Patent number: 9353436
    Abstract: The present invention refers to a method for coating a substrate, a coating apparatus for carrying out the method and a handling module for coating apparatuses. The handling module comprises a moveable support for a substrate to be coated the support being movable between at least two positions. Further, a mask arranging device for at least one of attaching and detaching a mask to the substrate, and a mask alignment device for aligning the mask with respect to the substrate are provided for, wherein the mask alignment device is attached to the movable support so as to be movable together with the support. Alternatively, the handling module comprises a vacuum chamber, a moveable support for a substrate to be coated, the support being arranged in the vacuum chamber and being rotatable between at least two positions, wherein a mask arranging device for at least one of attaching and detaching a mask to the substrate is arranged within the vacuum chamber of the handling module.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: May 31, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Michael Koenig, Stefan Bangert, Uwe Schuessler, Reiner Gertmann
  • Patent number: 9341942
    Abstract: A chamber assembly (26) for providing a sealed chamber (40) adjacent to a workpiece (28) to counteract the influence of gravity on the workpiece (28) includes a chamber housing (244), and a seal assembly (33) that expands and/or contracts to better seal against the workpiece (28). Further, the chamber assembly (26) can include one or more transducer assemblies (34) that expand or contract to quickly respond to leaks or injections of fluid in chamber assembly (26) to maintain a constant and stable chamber pressure in the chamber assembly (26). Moreover, the chamber assembly (26) can utilize a pressure source (35) that directs a lager amount of fluid (374) through a fluid passageway (368) to accurately maintain the pressure within the chamber assembly (26).
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: May 17, 2016
    Assignee: Nikon Research Corporation of America
    Inventors: Fardad Hashemi, Douglas C. Watson, Lorri L. Watson
  • Patent number: 9329501
    Abstract: A lithographic apparatus includes a projection system, a substrate table, a plurality of sensors, an actuator and a controller. The projection system is configured to project a patterned beam of radiation onto a substrate. The substrate table is configured to support the substrate and to move relative to the projection system. The plurality of sensors is configured to measure a deformation of the substrate table. The actuator is configured to deform the substrate table. The controller is configured to control the actuator to deform the substrate table based on measurements made by the sensors. The plurality of sensors is located on a first side of the substrate table opposite to a second side of the substrate table facing the projection system. The plurality of sensors is substantially stationary relative to the projection system.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: May 3, 2016
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Yang-Shan Huang, Hans Butler, Jan Van Eijk, Sven Antoin Johan Hol, Engelbertus Antonius Fransiscus Van Der Pasch, Bastiaan Lambertus Wilhelmus Marinus Van De Ven, Johannes Petrus Martinus Bernardus Vermeulen, Theodorus Petrus Maria Cadee, Robbert Edgar Van Leeuwen
  • Patent number: 9312161
    Abstract: A receiving means for receiving and mounting of wafers. The receiving means includes a mounting surface. A mounting means is provided for mounting a wafer on the mounting surface. A compensation means is provided for active, especially locally controllable, at least partial compensation of local and/or global distortions of the wafer.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: April 12, 2016
    Assignee: EV Group E. Thallner GmbH
    Inventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
  • Patent number: 9304407
    Abstract: In general, in one aspect, the invention features an objective arranged to image radiation from an object plane to an image plane, including a plurality of elements arranged to direct the radiation from the object plane to the image plane, wherein the objective has an image side numerical aperture of more than 0.55 and a maximum image side field dimension of more than 1 mm, and the objective is a catoptric objective.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: April 5, 2016
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Hans-Juergen Mann, David Shafer, Wilhelm Ulrich
  • Patent number: 9291919
    Abstract: There is provided an EUV exposure apparatus which restrains its optical systems or a mask used therein from being polluted by contaminations generated in its chamber. An energy beam generating source is arranged near a wafer stage set in the chamber of the EUV exposure apparatus to decompose an emission gas generated from a resist painted on the front surface of a wafer by an energy beam. In this manner, lightening mirrors configuring a lightening optical system as one of the optical systems, projection mirrors configuring a projection optical system as another of the optical systems, the mask, and others are protected from being polluted by contaminations.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: March 22, 2016
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventor: Hiroaki Oizumi
  • Patent number: 9285689
    Abstract: A lithographic apparatus includes an illumination system to provide a beam of radiation, a support to support a patterning devices, the patterning devices configured to impart the beam with a pattern in its cross-section, a substrate table to hold a substrate, a projection system to project the patterned beam onto a target portion of the substrate, and a conditioning system to condition the substrate. The conditioning system conditions a non-target portion of the substrate with a conditioning fluid. A method of manufacturing a device includes conditioning a non-target portion of a substrate.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: March 15, 2016
    Assignee: ASML NETHERLANDS B.V.
    Inventor: Wilhelmus Josephus Box
  • Patent number: 9280069
    Abstract: An exposure apparatus for exposing a pattern formed on a mask (M) onto a photosensitive substrate (P) through a projection optical system (PL), comprising an upper pedestal (26) on which at least one of the projection optical system (PL) and a mask stage (MST) which is to hold the mask (M) is mounted, and a plurality of lower pedestals (6a) which supports the upper pedestal (26) and which has a longitudinal direction in a predetermined direction.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: March 8, 2016
    Assignee: NIKON CORPORATION
    Inventor: Shuji Kawamura
  • Patent number: 9261792
    Abstract: Various non-planar reflective lithography masks, systems using such lithography masks, and methods are disclosed. An embodiment is a lithography mask comprising a transparent substrate, a reflective material, and a reticle pattern. The transparent substrate comprises a curved surface. The reflective material adjoins the curved surface of the transparent substrate, and an interface between the reflective material and the transparent substrate is a reflective surface. The reticle pattern is on a second surface of the transparent substrate. A reflectivity of the reticle pattern is less than a reflectivity of the reflective material. Methods for forming similar lithography masks and for using similar lithography masks are disclosed.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: February 16, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hsuan Liu, Jen-Pan Wang
  • Patent number: 9223197
    Abstract: A lithography process in a lithography system includes loading a mask having multiple mask states and having a mask pattern consisting of a plurality of polygons and a field. Different mask states are assigned to adjacent polygons and the field. The lithography process further includes configuring an illuminator to generate an illumination pattern on an illumination pupil plane of the lithography system; configuring a pupil filter on a projection pupil plane of the lithography system with a filtering pattern determined according to the illumination pattern; and performing an exposure process to a target with the illuminator, the mask, and the pupil filter. The exposure process produces diffracted light and non-diffracted light behind the mask and the pupil filter removes most of the non-diffracted light.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: December 29, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shinn-Sheng Yu, Yen-Cheng Lu, Anthony Yen
  • Patent number: 9195150
    Abstract: A lithographic apparatus has a support that is provided with burls for holding an object. The support has been fabricated with a lithographic manufacturing method, e.g., a MEMS-technology, so as to create burls whose orientations or positions are individually electrically controllable.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: November 24, 2015
    Assignee: ASML Netherlands B.V.
    Inventors: Theodorus Petrus Maria Cadee, Vadim Yevgenyevich Banine, Koen Jacobus Johannes Maria Zaal, Ramin Badie, Harmeet Singh
  • Patent number: 9176390
    Abstract: A method includes moving a correction device into a neutral position; subsequently ascertaining, for a given arrangement of imaging light channels in the illumination optical unit of the projection exposure apparatus, intensity distributions of at least some of the individual imaging light partial beams along a transverse coordinate transverse to a displacement direction of an object to be imaged; subsequently ascertaining, in dependence on the transverse coordinate, an actual variation of actual values of structure image sizes of object structures in an image field, onto which the object is imaged; and subsequently specifying a predetermined variation of the structure image sizes over the transverse coordinate and displacing correction elements of the correction device, starting from the neutral position, such that the actual variation matches the predetermined variation within a tolerance bandwidth. The method can provide improved imaging results as compared to known uniformity adjustment.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: November 3, 2015
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Michael Layh, Markus Deguenther
  • Patent number: 9117631
    Abstract: Method of handling a substrate support structure for clamping a substrate on a surface thereof in a lithography system. First, a substrate support structure adapted to absorb energy from a substrate clamped thereon and a substrate are provided. The substrate is clamped on a surface of the substrate support structure. The substrate support structure with the substrate clamped thereon is transferred to a lithography apparatus, in which a lithographic process is performed on the substrate clamped onto the substrate support structure. The substrate support structure with the substrate clamped thereon is then removed from the lithography system. The substrate is removed from the substrate support structure, and the substrate support structure is conditioned by removing energy stored in the substrate support structure before providing a new substrate onto the substrate support structure.
    Type: Grant
    Filed: April 11, 2013
    Date of Patent: August 25, 2015
    Assignee: MAPPER LITHOGRAPHY IP B.V.
    Inventor: Hendrik Jan De Jong
  • Patent number: 9113538
    Abstract: A structure for discharging an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for discharging an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and bottom. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUU mask is grounded.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: August 18, 2015
    Assignee: HERMES MICROVISION, INC.
    Inventors: You-Jin Wang, Chiyan Kuan, Chung-Shih Pan
  • Patent number: 9091936
    Abstract: An illumination system of a microlithographic projection exposure apparatus includes a light source configured to produce projection light that propagates along a light path. The illumination system also includes a beam deflection array of reflective or transmissive beam deflection elements. Each beam deflection element is configured to deflect an impinging light beam by a deflection angle that is variable in response to a control signal. The beam deflection array is used in a first mode of operation to determine an irradiance distribution in the system pupil surface. The system further includes an optical raster element, in particular a diffractive optical element, which is used in a second mode of operation to determine the irradiance distribution in the system pupil surface. An exchange unit is configured to hold the optical raster element in the second mode of operation such that it is inserted into the light path.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: July 28, 2015
    Assignee: Carl Zeiss SMT GmbH
    Inventor: Dieter Bader
  • Patent number: 9081311
    Abstract: An apparatus, in an embodiment, having a patterning device support including a first planar element having a first flow-restricting surface; a second planar element including a second flow-restricting surface facing the first flow-restricting surface; a support driver to linearly move the support along a certain direction relative to the second planar element, wherein the first and/or second flow-restricting surface has one or more projections and/or recesses between the first and second flow-restricting surfaces, and wherein the projection and/or recess on the first and/or second flow-restricting surface is arranged to provide a flow resistance, per unit width of the first and/or second flow-restricting surface perpendicular to the flow, that is lower against flow that is parallel to the certain direction than against flow that is perpendicular to the certain direction. The flow-restricting surfaces may direct gas flow onto a driver part that generates heat.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: July 14, 2015
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Herman Vogel, Jeroen Gerard Gosen, Bart Dinand Paarhuis, Frank Johannes Jacobus Van Boxtel, Jinggao Li
  • Patent number: 9036772
    Abstract: A mirror for the EUV wavelength range (1) having a layer arrangement (P) applied on a substrate (S), the layer arrangement having a periodic sequence of individual layers, where the periodic sequence has at least two individual layers—forming a period—composed respectively of silicon (Si) and ruthenium (Ru). Also disclosed are a projection objective for microlithography (2) including such a mirror, and a projection exposure apparatus for microlithography having such a projection objective (2).
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: May 19, 2015
    Assignee: Carl Zeiss SMT GmbH
    Inventor: Aurelian Dodoc
  • Patent number: 8976927
    Abstract: Substrates suitable for mirrors which are used at wavelengths in the EUV wavelength range have a main body (2) and a polishing layer (3). The polishing layer (3) has a thickness of less than 10 ?m and a root-mean-square roughness of less than 0.5 nm and the main body (2) is produced from an aluminum alloy. Moreover, a highly reflective layer (6) is provided on the polishing layer (3) of the substrate (1) of the EUV mirror (5).
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: March 10, 2015
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Claudia Ekstein, Johannes Lippert, Holger Maltor, Martin Weiser, Heiko Siekmann, Udo Dinger
  • Patent number: 8944615
    Abstract: A method of manufacturing a projection objective (22) of a microlithographic projection exposure apparatus (10). The projection objective (22) comprises at least one mirror (M1 to M6) that each have a mirror support (241 to 246) and a reflective coating (26) applied thereon. First imaging aberrations of a pre-assembled projection objective are measured. Before the coating (26) is applied, the mirror supports (241 to 246) are provided with a desired surface deformation (34). If the mirrors (M1 to M6) are not reflective for projection light without the coating (26), measuring light is used that has another wavelength. Alternatively, two identical mirror supports (246) may be provided. One support having a reflective coating is part of the pre-assembled projection objective whose imaging aberrations are measured. The other support is provided with surface deformations before coating and mounting the support into the objective.
    Type: Grant
    Filed: February 23, 2010
    Date of Patent: February 3, 2015
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Hans-Juergen Mann, Stephan Muellender, Johann Trenkler, Harmut Enkisch
  • Patent number: 8930859
    Abstract: Embodiments relate to a method of decomposing a layout of a semiconductor device. The method may include generating a pattern layout including first patterns and second patterns, generating an interference map for the pattern layout, the interference map including optical interference information regarding the first and second patterns, and decomposing the pattern layout into a first decomposition pattern layout including the first patterns, and a second decomposition pattern layout including the second patterns, based on the interference map. In the interference map, an influence of constructive interference on the first patterns may be greater than an influence of constructive interference on the second patterns.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: January 6, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Sung-Gon Jung
  • Patent number: 8928972
    Abstract: A stress-reduced reflective optical element for a working wavelength in the soft X-ray and extreme ultraviolet wavelength range includes a first multilayer system (4) of at least two alternating materials (41, 42) having different real parts of the refractive index at the working wavelength on a substrate (2), which exerts a layer stress on the substrate (2), and comprising a second multilayer system (6) of at least two alternating materials (61, 62) on a substrate (2), which exerts an opposed layer stress on the substrate (2) and is arranged between the first multilayer system (4) and the substrate (2), wherein one of the materials (61) of the second multilayer system (6) is nickel-vanadium-silicon, and wherein the ratio (G) of the overall thickness of nickel-vanadium-silicon layers (61) within one period (60) of the second multilayer system (6) to the overall thickness of the period (60) of the second multilayer system (6) is at least 0.25.
    Type: Grant
    Filed: July 22, 2011
    Date of Patent: January 6, 2015
    Assignee: Carl Zeiss SMT GmbH
    Inventor: Joern Weber
  • Patent number: 8891732
    Abstract: The present invention discloses an apparatus and a method for detecting a mark as well as a semiconductor device processing system. In order to address the problem existing in the prior art that detection of a mark in a layer of a semiconductor device has a low accuracy, the present invention uses an X-ray emitter and an X-ray detector to image the mark contained in the layer of the semiconductor device supported on the supporting member. According to the present invention, due to the use of the X-ray, even if the mark is covered by multiple layers which are opaque to visible light, the mark may be clearly imaged.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: November 18, 2014
    Assignee: Semiconductor Manufacturing International (Beijing) Corporation
    Inventor: Qiang Wu
  • Patent number: 8893067
    Abstract: In one aspect, the present invention is directed to a technique of, and system for simulating, verifying, inspecting, characterizing, determining and/or evaluating the lithographic designs, techniques and/or systems, and/or individual functions performed thereby or components used therein. In one embodiment, the present invention is a system and method that accelerates lithography simulation, inspection, characterization and/or evaluation of the optical characteristics and/or properties, as well as the effects and/or interactions of lithographic systems and processing techniques.
    Type: Grant
    Filed: August 20, 2013
    Date of Patent: November 18, 2014
    Assignee: ASML Netherlands B.V.
    Inventors: Jun Ye, Yen-Wen Lu, Yu Cao, Luoqi Chen, Xun Chen
  • Patent number: 8841625
    Abstract: An extreme ultraviolet light source device, comprising a collector mirror focusing extreme ultraviolet radiation at a focal point, wherein a porous plate having a plurality of through holes arranged such that only radiation focusing at said focal point passes is provided insertably between said collector mirror and said focal point on an optical axis of said collector mirror, and a detection means is provided to receive radiation having passed through said porous plate and to detect an intensity of said received radiation, and a method for detecting an irradiance distribution in an extreme ultraviolet light source device.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: September 23, 2014
    Assignee: Ushio Denki Kabushiki Kaisha
    Inventor: Daiki Yamatani
  • Patent number: 8831170
    Abstract: A mirror with a mirror carrier, as well as related apparatuses, systems and methods are disclosed. The mirror carrier can be embodied as cooling device with at least one cooling channel. Tube connections can be provided to connecting the at least one cooling channel to an inlet and an outlet of coolant. Sealing elements for a gas-tight and liquid-tight seals can be arranged between the tube connections and the mirror carrier. The field of application of the mirror can be, for example, an illumination device of a projection exposure apparatus.
    Type: Grant
    Filed: November 2, 2007
    Date of Patent: September 9, 2014
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Rutger Wevers, Andreas Seifert, Joachim Hartjes, Guenther Dengel