Mask Inspection (e.g., Semiconductor Photomask) Patents (Class 382/144)
  • Patent number: 11127192
    Abstract: In some embodiments, techniques are provided for analyzing the manufacturability or fabricability of objects based on segmented designs. In some embodiments, a scanning device scans a manufacturing device and/or an object manufactured by the manufacturing device to characterize a manufacturing capability of the manufacturing device. A paintbrush pattern may be determined based on the characterization, and a proposed design may be determined to be fabricable or non-fabricable using the paintbrush pattern.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: September 21, 2021
    Assignee: X Development LLC
    Inventors: Sylvia J. Smullin, Albin Lee Jones, Joseph Sargent, Marina Dolivo
  • Patent number: 11114324
    Abstract: Systems and methods for detecting defect candidates on a specimen are provided. One method includes, after scanning of at least a majority of a specimen is completed, applying one or more segmentation methods to at least a substantial portion of output generated during the scanning thereby generating two or more segments of the output. The method also includes separately detecting outliers in the two or more segments of the output. In addition, the method includes detecting defect candidates on the specimen by applying one or more predetermined criteria to results of the separately detecting to thereby designate a portion of the detected outliers as the defect candidates.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: September 7, 2021
    Assignee: KLA Corp.
    Inventors: Martin Plihal, Erfan Soltanmohammadi, Prasanti Uppaluri, Mohit Jani, Chris Maher
  • Patent number: 11099134
    Abstract: An optical examination device is designed to detect properties of a semiconductor component. The device comprises a first illumination arrangement, a second illumination arrangement and an imaging device, where the first illumination arrangement emits infrared light onto a first surface of the semiconductor component, which faces away from the imaging device (camera). The infrared light fully penetrates the semiconductor component at least proportionally. The second illumination arrangement emits visible light onto a second surface of the semiconductor component, which faces the imaging device. The imaging device is designed and arranged to detect the light spectrum emitted from both the first and the second illumination arrangement, and as a result of a subsequent image evaluation on the basis of both the visible and the infrared light spectrum, to provide a separate image reduction for determining property defects or damage of the semiconductor component.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: August 24, 2021
    Assignee: MUEHLBAUER GMBH & CO. KG
    Inventors: Uladimir Prakapenka, Stephan Spichtinger, Rainer Miehlich
  • Patent number: 11092899
    Abstract: A method for manufacturing a lithographic mask for an integrated circuit includes performing an optical proximity correction (OPC) process to an integrated circuit mask layout to produce a corrected mask layout. The method further includes performing an inverse lithographic technology (ILT) process to the corrected mask layout to enhance the corrected mask layout to produce an OPC-ILT-enhanced mask layout. The method also includes performing an inverse lithographic technology (ILT) process to the corrected mask layout to enhance the corrected mask layout to produce an OPC-ILT-enhanced mask layout.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: August 17, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsu-Ting Huang, Tung-Chin Wu, Shih-Hsiang Lo, Chih-Ming Lai, Jue-Chin Yu, Ru-Gun Liu, Chin-Hsiang Lin
  • Patent number: 11067901
    Abstract: A method including: obtaining a logistic mathematical model predicting the formation of a physical structure created using a patterning process; evaluating the logistic mathematical model to predict formation of a part of the physical structure and generate an output; and adapting, based on the output, an aspect of the patterning process.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: July 20, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Scott Anderson Middlebrooks, Adrianus Cornelis Matheus Koopman, Markus Gerardus Martinus Maria Van Kraaij, Maxim Pisarenco
  • Patent number: 11051991
    Abstract: A method for inspecting absorbent articles is provided. The inspection is performed using an inspection algorithm generated with a convolutional neural network having convolutional neural network parameters. The convolutional neural network parameters are generated by a training algorithm. Based on the inspection, characteristics of the absorbent articles, such as defects, can be identified. Absorbent articles having identified characteristics can be rejected, or other actions can be taken.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: July 6, 2021
    Assignee: The Procter & Gamble Company
    Inventors: Paul Anthony Kawka, Stephen Michael Varga, Aitzaz Ahmad
  • Patent number: 11029359
    Abstract: A model is generated for predicting failures at the wafer production level. Input data from sensors is stored as an initial dataset, then data exhibiting excursions or useless impact is removed from the dataset. The dataset is converted into target features, where the target features are useful in predicting whether a wafer will be normal or not. A trade-off between positive and negative results is selected, and a plurality of predictive models are created. The final model is selected based on the trade-off criteria, and deployed.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: June 8, 2021
    Assignee: PDF Solutions, Inc.
    Inventors: Tomonori Honda, Lin Lee Cheong, Lakshmikar Kuravi
  • Patent number: 11022966
    Abstract: An image-based Artificial Neural Networks (ANN) is used for photomask modeling, which can self-construct an internal representation of the photomask manufacturing process, therefore allowing the modeling process to become unfettered by the limitations of existing mathematical/statistical tools, thus greatly reduces/eliminates the effort needed from tedious and costly model-builders. The ANN model requires mask layout data converted into image pixel form. In ANN training phase a first circuit image and its existing SEM image are modeled via multiple layers of convolution and rectification to pick out the salient features of transformed image. In ANN testing phase, a second circuit image and its existing SEM image are compared and verified to have a difference smaller than the predetermined requirement. The satisfactory second circuit image is converted back from pixel form to circuit layout data for photomask writing.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: June 1, 2021
    Assignee: SYNOPSYS, INC.
    Inventors: Parikshit Kulkarni, Dan Hung, John Gookassian
  • Patent number: 10997736
    Abstract: Embodiments relate to a normalized cross correlation (NCC) circuit that can perform a normalized cross correlation between input patch data and kernel data. An interface circuit of an image signal processor receives input patch data from a source. Input patch data is data that represents a portion of a frame of image data from the source. The NCC circuit includes a filtering circuit and a normalization circuit. The filtering circuit receives the input patch data from the interface circuit and performs a convolution on the received input patch data or processed patch data derived from the input patch data with kernel data to produce convolution output data. The normalization circuit computes a normalized score output based on the convolution output data and the kernel data. The normalized score output includes normalization scores for each location of the convolution output data.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: May 4, 2021
    Assignee: Apple Inc.
    Inventors: Muge Wang, Junji Sugisawa
  • Patent number: 10997713
    Abstract: According to one embodiment, an inspection device includes: an image generation device configured to generate a second image corresponding to a first image; and a defect detection device configured to estimate a nonlinear shift based on a plurality of partial region sets, each of the partial region sets including a first partial region in the first image and a second partial region in the second image corresponding to the first partial region, and detect a defect in the second image from the first image.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: May 4, 2021
    Assignees: KABUSHIKI KAISHA TOSHIBA, NuFlare Technology, Inc.
    Inventors: Takeshi Morino, Hideaki Okano, Yoshinori Honguh, Ryoichi Hirano, Masataka Shiratsuchi, Hideaki Hashimoto
  • Patent number: 10976264
    Abstract: According to one embodiment, an analysis system includes a display controller. The display controller is configured to display a first comprehensive image and a first individual image from a plurality of workpiece data. The plurality of workpiece data relate to a plurality of workpieces, are classified into a plurality of categories, and are classified into one of a plurality of classes. The first comprehensive image is based on the plurality of workpiece data. The first individual image is based on a part of the plurality of workpiece data classified into one of the plurality of categories.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: April 13, 2021
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventor: Shun Hirao
  • Patent number: 10957034
    Abstract: There are provided a system and method of examination on a specimen, the method comprising: obtaining an inspection image of a die and generating a defect map using one or more reference images; selecting a plurality of defect candidates from the defect map; and generating for each defect candidate, a respective modified inspection image patch, comprising: extracting an image patch surrounding the defect candidate respectively from the inspection image and each reference image; and modifying the inspection image patch, comprising: estimating noise representative of intensity variations on the inspection image patch, the noise including a first type of noise representative of a polynomial relation between the inspection and reference image patches, and a second type of noise representative of a spatial anomaly in the inspection image patch, and removing at least one of the first and second types of noise from the inspection image patch based on the estimated noise.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: March 23, 2021
    Assignee: APPLIED MATERIALS ISRAEL LTD.
    Inventors: Elad Cohen, Shahar Arad
  • Patent number: 10886504
    Abstract: This disclosure provides techniques for assessing quality of a deposited film layer of an organic light emitting diode (“OLED”) device. An image is captured and filtered to identify a deposited layer that is to be analyzed. Image data representing this layer can be optionally converted to brightness (grayscale) data. A gradient function is then applied to emphasize discontinuities in the deposited layer. Discontinuities are then compared to one or more thresholds and used to ascertain quality of the deposited layer, with optional remedial measures then being applied. The disclosed techniques can be applied in situ, to quickly identify potential defects such as delamination before ensuing manufacturing steps are applied. In optional embodiments, remedial measures can be taken dependent on whether defects are determined to exist.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: January 5, 2021
    Assignee: Kateeva, Inc.
    Inventor: Christopher Cocca
  • Patent number: 10878557
    Abstract: In a device for detecting a defect, the device includes: an image pickup unit including pixels, the image pickup unit generating a substrate image by picking up an image of a substrate having patterns formed on a top surface thereof; and a controller for detecting a defect located on the substrate, based on the substrate image, wherein the substrate image includes pattern images corresponding to the patterns, wherein each of the pattern images includes pixel values, wherein the controller detects the defect by comparing weights of pixel values for each of the pattern images.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: December 29, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hyung Jin Lee, Dae Hong Kim, Sung Hoon Yang, Se Yoon Oh
  • Patent number: 10866506
    Abstract: A method for manufacturing a photo mask for a semiconductor device includes receiving a plurality of hotspot regions of a mask layout corresponding to the semiconductor device. The method further includes classifying the plurality of hotspot regions into two or more hotspot groups such that same or similar hotspot regions are classified into same hotspot groups. The hotspot groups includes a first hotspot group that has at least two hotspot regions. The method also includes correcting a first hotspot region of the first hotspot group to generate an enhancement of the first hotspot region and correcting other hotspot regions of the first hotspot group using the enhancement of the first hotspot region to generate enhancements of other hotspot regions of the first hotspot group.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Fu An Tien, Hsu-Ting Huang, Ru-Gun Liu
  • Patent number: 10859507
    Abstract: A surface defect inspection method includes: acquiring an original image by capturing an image of a subject of an inspection; generating texture feature images by applying a filtering process using spatial filters to the original image; generating a feature vector at each position of the original image, by extracting a value at a corresponding position from each of the texture feature images, for each of the positions of the original image; generating an abnormality level image representing an abnormality level for each position of the original image, by calculating, for each of the feature vectors, an abnormality level in a multi-dimensional distribution formed by the feature vectors; and detecting a part having the abnormality level that is higher than a predetermined level in the abnormality level image as a defect portion or a defect candidate portion.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: December 8, 2020
    Assignee: JFE Steel Corporation
    Inventors: Takahiro Koshihara, Yoshiyuki Umegaki, Takahiko Oshige
  • Patent number: 10832396
    Abstract: Methods and systems for setting up inspection of a specimen with design and noise based care areas are provided. One system includes one or more computer subsystems configured for generating a design-based care area for a specimen. The computer subsystem(s) are also configured for determining one or more output attributes for multiple instances of the care area on the specimen, and the one or more output attributes are determined from output generated by an output acquisition subsystem for the multiple instances. The computer subsystem(s) are further configured for separating the multiple instances of the care area on the specimen into different care area sub-groups such that the different care area sub-groups have statistically different values of the output attribute(s) and selecting a parameter of an inspection recipe for the specimen based on the different care area sub-groups.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: November 10, 2020
    Assignee: KLA-Tencor Corp.
    Inventors: Brian Duffy, Martin Plihal, Santosh Bhattacharyya, Gordon Rouse, Chris Maher, Erfan Soltanmohammadi
  • Patent number: 10824080
    Abstract: A method includes reducing refractive index of an environment at or adjacent an extreme ultraviolet (EUV) mask to below 1.0. The EUV mask is in an EUV lithography system that forms a projection beam of EUV radiation using EUV radiation emitted from a radiation source. The method further includes exposing the EUV mask to the projection beam of EUV radiation.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: November 3, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Tsung Shih, Tsung-Chih Chien, Tsung Chuan Lee
  • Patent number: 10752039
    Abstract: A document including a Directed Self-Assembly (DSA) pattern including a unique and randomized pattern embedded on the document, where the DSA is formed by using two different-length polymer chains.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: August 25, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin David Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Michael Rizzolo
  • Patent number: 10754261
    Abstract: Metrology target designs on the reticle and on the wafer, and target design and processing methods are provided. Target designs comprise coarse pitched periodic structures having fine pitched sub-elements, which vary in sub-element CD and/or height, an orthogonal periodic structure, perpendicular to the measurement direction, with an orthogonal unresolved pitch among periodically recurring bars, which provide a calibration parameter for achieving well-printed targets. Orthogonal periodic structures may be designed on the reticle and be unresolved, or be applied in cut patterns on the process layer, with relatively low sensitivity to the cut layer overlay. Designed targets may be used for overlay metrology as well as for measuring process parameters such as scanner aberrations and pitch walk.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: August 25, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Yoel Feler, Vladimir Levinski
  • Patent number: 10742890
    Abstract: An imaging apparatus includes an image sensor and a controller. The controller acquires an infrared image generated by the image sensor when infrared light is higher than a predetermined light amount. The controller acquires a normal image generated by the image sensor when the infrared light is lower than the predetermined light amount. The controller generates a synthesized image on the basis of the infrared image and the normal image. Thus, an image that includes colors and high luminance contrast may be generated in a dark environment without a plurality of infrared light sources.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: August 11, 2020
    Assignee: KYOCERA Corporation
    Inventor: Takatoshi Nakata
  • Patent number: 10733337
    Abstract: A method for the simulation of a photolithographic process for generating a wafer structure includes providing an aerial image of a region of a mask that includes the mask structure, prescribing a range of intensities, determining auxiliary or potential wafer structures for different threshold values within the range of intensities, determining the number of structure elements for each of the auxiliary or potential wafer structures, determining a stability range consisting of successive threshold values from the threshold values that were used for the determination of auxiliary or potential wafer structures, within the stability range the number of structure elements of the auxiliary or potential wafer structures remaining constant or lying within a prescribed range, and determining the wafer structure on the basis of the aerial image and a threshold value within the stability range. A microscope for carrying out the method is also provided.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: August 4, 2020
    Assignee: Carl Zeiss SMT GmbH
    Inventor: Hans Michael Solowan
  • Patent number: 10691864
    Abstract: Implementations of the disclosure provide a method of fabricating an integrated circuit (IC). The method includes receiving an IC design layout; performing optical proximity correction (OPC) process to the IC design layout to produce a corrected IC design layout; and verifying the corrected IC design layout using a machine learning algorithm. The post OPC verification includes using the machine learning algorithm to identify one or more features of the corrected IC design layout; comparing the one or more identified features to a database comprising a plurality of features; and verifying the corrected IC design layout based on labels in the database associated with the plurality of features.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: June 23, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hung-Chun Wang, Cheng Kun Tsai, Wen-Chun Huang, Wei-Chen Chien, Chi-Ping Liu
  • Patent number: 10658327
    Abstract: Provided are a chip bonding apparatus and bonding method.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: May 19, 2020
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Tianming Wang, Xiaoyu Jiang, Hai Xia, Feibiao Chen
  • Patent number: 10656989
    Abstract: Trend estimation for application-agnostic statistical fault detection of multi-process applications in environments with data trend includes at least one of: a multi-process application runs on a host. Statistical events are collected and sent to a statistical fault detector. The statistical fault detector creates one or more distributions and compares recent statistical event data to historical statistical event data and uses deviation from historical norm for fault detection. Trend is estimated, and if needed, removed from event data prior to the creation of distributions. Trend is estimated using spectral techniques, filter banks and Maximum Entry Spectral Estimation, and dominant frequencies are estimated and utilized to adapt to the environment.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: May 19, 2020
    Assignee: OPEN INVENTION NETWORK LLC
    Inventor: Allan Havemose
  • Patent number: 10632023
    Abstract: A method for inspecting absorbent articles is provided. The inspection is performed using an inspection algorithm generated with a convolutional neural network having convolutional neural network parameters. The convolutional neural network parameters are generated by a training algorithm. Based on the inspection, characteristics of the absorbent articles, such as defects, can be identified. Absorbent articles having identified characteristics can be rejected, or other actions can be taken.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: April 28, 2020
    Assignee: The Procter & Gamble Company
    Inventors: Paul Anthony Kawka, Stephen Michael Varga, Aitzaz Ahmad, Paul Philip Thomas
  • Patent number: 10571799
    Abstract: A method for optimizing a binary mask pattern includes determining, by a processor, an evaluation value based on a comparison between a design pattern and a substrate pattern simulated based on the binary mask pattern. The method also includes, based on the evaluation value, using, by the processor, a gradient-based optimization method to generate a first adjusted binary mask pattern. The method also includes determining, by the processor, a first updated evaluation value based on a comparison between the design pattern and a first updated substrate pattern simulated based on the first adjusted binary mask pattern. The method also includes, based on the first updated evaluation value, using, by the processor, a product of a Hessian matrix and an arbitrary vector to generate a second adjusted binary mask pattern. The method also includes simulating, by the processor, a second updated substrate pattern based on the second adjusted binary mask pattern.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: February 25, 2020
    Assignee: ASML US, LLC
    Inventors: Jiangwei Li, Ke Zhao, Yuan He
  • Patent number: 10571406
    Abstract: One or more metrology objects and one or more metrology operations may be identified. A design-based representation of a first metrology object of the one or more metrology objects may be received. Furthermore, an image-based representation of the first metrology object of the one or more metrology objects may be received where the one or more metrology operations include a first metrology operation associated with the first metrology object that is to be performed on the image-based representation of the first metrology object. The design-based representation of the first metrology object may be mapped with the image-based representation of the first metrology object. The first metrology operation may be performed based on the mapping.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: February 25, 2020
    Assignee: Applied Materials Israel Ltd.
    Inventors: Ron Katzir, Imry Kissos, Lavi Shachar, Amit Batikoff, Shaul Cohen, Noam Zac
  • Patent number: 10565703
    Abstract: The image inspection device includes: a first extraction unit configured to repeatedly execute processing for moving a predetermined region by a predetermined distance on an inspection target image to extract an image of the predetermined region after movement as a first determination image until a predetermined first ratio of the inspection target image is included in a plurality of first determination images, and a second extraction unit configured to repeatedly execute processing for moving a predetermined region by a distance smaller than the predetermined distance on an image in the inspection target image including a first determination image where a determined degree satisfies a predetermined condition to extract an image of the predetermined region after movement as a second determination image until a predetermined second ratio of the image in the inspection target image including a first determination image is included in a plurality of second determination images.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: February 18, 2020
    Assignee: NEC Corporation
    Inventor: Hiroyuki Kobayashi
  • Patent number: 10560670
    Abstract: The present technology relates to an imaging apparatus, an imaging control method, and a program capable of obtaining a color image using infrared light without decreasing the frame rate. The imaging apparatus includes an imaging element including a first pixel and a second pixel, and a control unit that controls an exposure period of the imaging element and an emission period of the infrared light from the infrared light emission unit. The control unit controls to provide an exposure period of the first pixel and the second pixel in each of frame periods and provide a single exposure period being a period in which the first pixel alone is exposed, and controls so as to emit the infrared light within the single exposure period. The present technology is applicable to a surveillance camera, for example.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: February 11, 2020
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Yasushi Sato
  • Patent number: 10545401
    Abstract: In a phase shift mask blank comprising a transparent substrate and a phase shift film deposited thereon and having a phase shift of 150-200° with respect to sub-200 nm light, the phase shift film is composed of a silicon base material consisting of silicon, nitrogen and optionally oxygen, has a thickness of up to 70 nm, and provides a warpage change of up to 0.2 ?m in a central region of a surface of the substrate before and after the deposition of the phase shift film on the substrate.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: January 28, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yukio Inazuki, Takuro Kosaka
  • Patent number: 10540771
    Abstract: An image segmentation method is disclosed that allows a user to select image component types, for example tissue types and or background, and have the method of the present invention segment the image according to the user's input utilizing the superpixel image feature data and spatial relationships.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: January 21, 2020
    Assignee: Ventana Medical Systems, Inc.
    Inventors: Christophe Chefd'hotel, Stanley Ho, Yao Nie
  • Patent number: 10534888
    Abstract: A computer implemented method, a system and a computer readable storage medium configured to conduct the following: determining a reliability parameter of an initial hybrid metallization to determine a determined reliability parameter, comparing the determined reliability parameter to a reliability limit and determining a reliability ratio, determining a performance parameter of the initial hybrid metallization to determine a determined performance parameter, comparing the determined performance parameter to a performance limit and determining a performance ratio, determining a reliability indice from the reliability ratio, determining a performance indice from the performance ratio, determining a reliability score from a combination of the determined reliability parameter and the reliability indice, determining a performance score from a combination of the determined performance parameter and the performance indice, comparing the reliability score to the performance score, selecting a first interconnect and
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: January 14, 2020
    Assignee: International Business Machines Corporation
    Inventors: Baozhen Li, Chih-Chao Yang, Theo Standaert
  • Patent number: 10495967
    Abstract: The present disclosure provides an integrated circuit (IC) method in accordance with some embodiments. The method includes building a mask model to simulate a mask image and a compound lithography computational model to simulate a wafer pattern; calibrating the mask model using a measured mask image; calibrating the compound lithography computational model using a measured wafer data and the calibrated mask model; and performing an optical proximity correction (OPC) process to an IC pattern using the calibrated compound computational model, thereby generating a mask pattern for mask fabrication.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: December 3, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsu-Ting Huang, Chih-Shiang Chou, Ru-Gun Liu
  • Patent number: 10474133
    Abstract: An inspection device includes a first processor, a second processor, and a server. The first processor detects first coordinates of first feature points from first images in a first image set. The second processor detects second coordinates of second feature points from second images in a second image set. The server generates reference coordinates based on the first coordinates and the second coordinates. The reference coordinates are transmitted to the first processor and the second processor. The first and second image sets correspond to scanned swaths on a wafer.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: November 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Janghee Lee, Yoo Jin Jeong, Sangbong Park, Byeonghwan Jeon
  • Patent number: 10445869
    Abstract: There is described an online inspection method and system having an illumination system that provides bright-field and dark-field illumination concurrently or sequentially, at varying intensities, in order to acquire images that may be read by an image processing device. The image processing device may obtain measurements of features in the images and evaluate acceptability of the features.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: October 15, 2019
    Assignee: BOMBARDIER INC.
    Inventor: Octavian Ioachim
  • Patent number: 10404868
    Abstract: Apparatus to detect a defect in a printed image and methods of detecting detects in a printed image are described. In some examples, a printing operation is initiated using image data to generate a printed image. The printed image is then scanned to generate a scanned image. A resolution of the scanned image is estimated, calculated or determined on the basis of a characteristic of the printing operation, and a reference image, having a resolution corresponding to the estimated, calculated or determined resolution, is generated from the image data. Whether defects are present in the printed image may be determined on the basis of a comparison of the reference image with the scanned image.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: September 3, 2019
    Assignee: HP Indigo B.V.
    Inventors: Alexander Spivakovsky, Oded Perry, Oren Haik, Avi Malki
  • Patent number: 10395958
    Abstract: A method of operating a multi-column electron beam array for quality inspection of a semiconductor wafer involves dividing the whole wafer area collectively in equally divided areas allocated to each column of the array, and assigning each of the areas as a column working space having the same dimensions and orientations. The array of column working spaces are assigned to an array of column optical axes, wherein a field of view of each column is defined as a covered region in which critical wafer patterns can be scanned by one or more columns to take an image. The stage supporting the wafer is moved such that each column working space is fully covered by the field of view of each column completely. By utilizing arbitrary waveform generators in electron inspection columns, this method also can be extended to write independent arbitrary patterns in predetermined positions in each die on a wafer.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: August 27, 2019
    Inventor: Weiwei Xu
  • Patent number: 10395362
    Abstract: Methods and systems for detecting defects in patterns formed on a specimen are provided. One system includes one or more components executed by one or more computer subsystems, and the component(s) include first and second learning based models. The first learning based model generates simulated contours for the patterns based on a design for the specimen, and the simulated contours are expected contours of a defect free version of the patterns in images of the specimen generated by an imaging subsystem. The second learning based model is configured for generating actual contours for the patterns in at least one acquired image of the patterns formed on the specimen. The computer subsystem(s) are configured for comparing the actual contours to the simulated contours and detecting defects in the patterns formed on the specimen based on results of the comparing.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: August 27, 2019
    Assignee: KLA-Tencor Corp.
    Inventors: Ajay Gupta, Mohan Mahadevan, Sankar Venkataraman, Hedong Yang, Laurent Karsenti, Yair Carmon, Noga Bullkich, Udy Danino
  • Patent number: 10373796
    Abstract: A method of inspecting a wafer may include: loading of a wafer onto a stage, the wafer having a plurality of dies thereon; positioning of the wafer such that a plurality of electron beam columns on the wafer respectively face a partial region of each of the plurality of dies on the wafer; scanning the respective partial regions of each of the plurality of dies by using the electron beam columns; and combining a plurality of partial images that are obtained by scanning the partial regions to provide a die image.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: August 6, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Souk Kim, Chung-sam Jun, Woo-seok Ko, Sang-kil Lee, Kwang-il Shin, Yu-sin Yang, Min-chul Yoon
  • Patent number: 10366486
    Abstract: A mounting device mounts components on a board, and performs processing of arranging discard components discarded based on a captured image on a discard loading section. A CPU of a management computer acquires an identification image in which it is possible to identify a discard component to be discarded and a captured image of the discard component, links the acquired identification image of the discard component and the captured image of the discard component, and creates a discard component arrangement image screen that includes an arrangement display area in which the identification images are arranged based on an order in which the discard components were arranged on discard loading section. The CPU of management computer then outputs the created discard component arrangement image screen.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: July 30, 2019
    Assignee: FUJI CORPORATION
    Inventors: Takeshi Kato, Hiroshi Oike, Hirotake Esaki
  • Patent number: 10360669
    Abstract: There are provided a system, computer software product and method of generating a training set for a classifier using a processor. The method comprises: receiving a training set comprising training defects each having assigned attribute values, the training defects externally classified into classes comprising first and second major classes and a minor class; training a classifier upon the training set; receiving results of automatic classification of the training defects; automatically identifying a first defect that was externally classified into the first major class and automatically classified into the second major class; automatically identifying by the processor a second defect from the multiplicity of training defects that was externally classified into the minor class and automatically classified to the first or second major classes; and correcting the training set to include the first defect into the second major class, or to include the second defect into the first or the second major class.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: July 23, 2019
    Assignee: APPLIED MATERIALS ISRAEL LTD.
    Inventors: Ohad Shaubi, Assaf Asbag, Idan Kaizerman
  • Patent number: 10338032
    Abstract: An assembly includes a sensor configured to obtain a data scan of a joint. A controller is operatively connected to the sensor. The controller includes a processor and tangible, non-transitory memory on which is recorded instructions for executing a method for automated quality assessment of the joint. Execution of the instructions by the processor causes the controller to: obtain the data scan of the joint (via the sensor) and generate a first image based on the data scan. The first image is divided into a plurality of pixels having respective numeric values. The controller is programmed to identify a region of interest as the plurality of pixels from the first image with a respective numeric value greater than a threshold value (I0). The controller is programmed to assess joint quality based on a porosity factor (PF) determined at least partially from the data scan.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: July 2, 2019
    Assignee: GM Global Technology Operations LLC.
    Inventors: Ingrid A. Rousseau, Selina X. Zhao, Hamid G. Kia
  • Patent number: 10318805
    Abstract: When the degree of matching between patterns decreases due to a pattern fluctuation or an appearance fluctuation that has occurred during manufacturing steps, a heavy work burden would be placed on an operator. A data processing unit of a pattern matching apparatus calculates a threshold for determination of matching between a first template image and a partial region of a search target image obtained by capturing an image of the surface of a sample, on the basis of a result of evaluation of a similarity between the search target image and a second template image, the second template image having been captured in a wider range than the first template image.
    Type: Grant
    Filed: March 3, 2013
    Date of Patent: June 11, 2019
    Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Hideki Nakayama, Masashi Sakamoto
  • Patent number: 10319087
    Abstract: A control system configured to use a database and a data storage area includes a control device for controlling a process executed on an object; and an image processing device arranged in association with the control device for taking an image of the object and processing image data acquired from taking the image of the object. The control device and the image processing device may work independently or collaboratively to send the database at least one of an attribute value or results information, and designation information in association with each other for the same object, the attribute value managed by the control device and corresponding to any attribute defined in the database, the results information representing a process result from the image processing device, and the designation information specifying a storage destination in the data storage area for the image data acquired from taking an image of the object.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: June 11, 2019
    Assignee: OMRON Corporation
    Inventors: Minoru Oka, Shinya Sawa
  • Patent number: 10262229
    Abstract: Described is a system for detecting multiple salient objects in an image using low power hardware. From consecutive pair of image frames of a set of input image frames, image channels are generated. The image channels are resized into multiple image scales that specify a relative size of a salient object in the image frames. A patch-based spectral transform is applied to overlapping image patches in the resized image channel, generating salient patches. Saliency patches are combined into a saliency map for each resized image channel, resulting in multiple saliency maps. The saliency maps are combined into an aggregate saliency map. An adaptive threshold is applied to the aggregate saliency map to determine which pixels in the aggregate saliency map correspond to a detected salient object region including a salient object. An object bounding box is generated for each salient object and output to a display.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: April 16, 2019
    Assignee: HRL Laboratories, LLC
    Inventors: Shankar R. Rao, Narayan Srinivasa
  • Patent number: 10254816
    Abstract: A control unit of a substrate processing apparatus has a storage medium that stores operation commands as a single macro. The operation commands include an operation command for shutdown of the substrate processing apparatus by which the substrate processing apparatus is automatically transferred from a normally-operating condition to a condition suitable for man power maintenance, and an operation command for startup of the substrate processing apparatus by which the substrate processing apparatus is automatically transferred to a condition suitable for normal operation after completion of the man power maintenance. The control unit makes a display unit display both the operation commands for shutdown and startup together on a single ejection screen of the display unit, and allows editing of the macro on the single edit screen by using the input unit.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: April 9, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Seiichiro Yuasa, Kunihiko Fujimoto
  • Patent number: 10254753
    Abstract: The present disclosure relates to a system for predicting abnormality occurrence using a PLC log data, the system including a controller configured to receive a data from a lower-level device connected to a PLC data log module and determine the data, and to store the data in an event storage when the data is a data related to abnormality occurrence, an analyzer configured to generate an abnormality analysis result by analyzing the data related to abnormality occurrence, and an analysis result storage configured to store the abnormality analysis result, wherein the controller compares the data transmitted from the lower-level device with the abnormality analysis result stored in the analysis result storage, and generates an abnormality occurrence prediction signal, when it is determined that the data transmitted from the lower-level device is similar to the abnormality analysis result.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: April 9, 2019
    Assignee: LSIS CO., LTD.
    Inventor: Seung Jong Kim
  • Patent number: 10241395
    Abstract: A pattern correction amount calculating apparatus includes: an accepting unit that accepts pattern information; a micro side group acquiring unit that acquires a micro side group, which is a group of continuous sides forming a contour of a pattern figure indicated by the pattern information, and is a group of micro sides that are each small enough to satisfy a predetermined condition; a virtual side acquiring unit that acquires a virtual side, which is a side that approximates micro sides contained in the micro side group; a virtual side correction amount calculating unit that calculates a virtual side correction amount, which is a correction amount for the virtual side; and a micro side correction amount calculating unit that calculates micro side correction amounts, which are correction amounts respectively for the micro sides contained in the micro side group corresponding to the virtual side, using the virtual side correction amount.
    Type: Grant
    Filed: July 3, 2015
    Date of Patent: March 26, 2019
    Assignee: Nippon Control System Corporation
    Inventor: Hiroyuki Tsunoe
  • Patent number: 10204416
    Abstract: Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: February 12, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Arpit Jain, Arpit Yati, Thirupurasundari Jayaraman, Raghavan Konuru, Raj Kuppa, Hema Prasad, Saiyashwanth Momula, Arun Lobo