Mask Inspection (e.g., Semiconductor Photomask) Patents (Class 382/144)
  • Patent number: 11410291
    Abstract: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: August 9, 2022
    Assignee: KLA Corporation
    Inventors: Prasanti Uppaluri, Rajesh Manepalli, Ashok V. Kulkarni, Saibal Banerjee, John Kirkland
  • Patent number: 11410300
    Abstract: A defect inspection device includes at least one memory storing instructions and at least one processor.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: August 9, 2022
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Ryusuke Hirai, Kyoka Sugiura, Yukinobu Sakata, Akiyuki Tanizawa
  • Patent number: 11405560
    Abstract: A medical imaging device configured to spatially resolve recording of multispectral video data of an examination area of a patient including a light source having multiple optical emitters with different wavelengths in the visible and NIR spectral range. The light source has an emitter whose wavelength lies in the range of ±50% of its half-width around the intersection of the blue and green filter curves or the green and red filter curves, and the exposure control and the data processing means are arranged to separately detect the affected two of the red and green or the green and blue colour signals in an exposure pattern with activation of the emitter at the intersection point and to evaluate them in the multispectral analysis with mutually different wavelengths shifted by the two affected filter curves as two supporting point wavelengths.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: August 2, 2022
    Assignees: KARL STORZ SE & Co. KG, DIASPECTIVE VISION GmbH
    Inventors: Axel Kulcke, Hannes Köhler, Amadeus Holmer
  • Patent number: 11321585
    Abstract: Provided is an image classification device that facilitates efficient creation of teacher data and comprehensive evaluation on a basis of knowledge and experience of the user.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: May 3, 2022
    Assignee: Hitachi High-Tech Corporation
    Inventors: Yaku Maeda, Akira Ikeuchi, Shigeru Kawamata, Hiromi Mise, Akira Sawaguchi
  • Patent number: 11295435
    Abstract: A product defect detection method, device and system are disclosed. The method comprises: constructing a defect detection framework including segmentation networks, a concatenating network and a classification network, and setting a quantity of the segmentation network according to product defect types, wherein each segmentation network corresponds to a defect type; concatenating the sample image with the mask image output by each segmentation network by using the concatenating network to obtain a concatenated image; training the classification network by using the concatenated images to obtain a classification network capable of correctly identifying a product defect and a defect type; and when performing product defect detection, inputting a product image acquired into the defect detection framework, and detecting a product defect and a defect type existing in the product by using the segmentation networks, the concatenating network and the classification network.
    Type: Grant
    Filed: August 29, 2020
    Date of Patent: April 5, 2022
    Assignee: GOERTEK INC.
    Inventors: Jie Liu, Jifeng Tian, Wenchao Zhang, Yifan Zhang
  • Patent number: 11276552
    Abstract: There are provided: a method for image adjustment using a charged particle beam device, and a charged particle beam system, capable of appropriately adjusting a contrast and brightness as well as a focus for a measurement region present in a deep portion of a sample even when a depth of the measurement region is unknown. A method for image adjustment performed by a computer system controlling a charged particle beam device includes: by the computer system, specifying a measurement region from a captured image of a sample; performing centering processing based on the specified measurement region; extracting the measurement region in a field of view that has undergone the centering processing or the image that has undergone the centering processing; adjusting a contrast and brightness for the extracted measurement region; and adjusting a focus for the measurement region in which the contrast and brightness have been adjusted.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: March 15, 2022
    Assignee: Hitachi High-Tech Corporation
    Inventors: Yuki Tomizawa, Kazunari Asao, Kazuyuki Hirao
  • Patent number: 11270152
    Abstract: The application provides an image detection method, an image detection apparatus, and a patterning control method, the image detection method including: identifying an input image to obtain image feature data of the input image; comparing the image feature data with preset image feature data in a preset image feature database to obtain deviation data of the input image; wherein the input image is a pattern image of a patterned structure. By intelligently detecting the pattern image of the patterned structure, the accuracy of the detection is improved, thereby reducing the labor input cost.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: March 8, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Hong Wang, Zhaoyue Li
  • Patent number: 11250366
    Abstract: The invention provides a dynamic risk analyzer (DRA) that periodically assesses real-time or historic process data, or both, associated with an operations site, such as a manufacturing, production, or processing facility, including a plant's operations, and identifies hidden near-misses of such operation, when in real time the process data appears otherwise normal. DRA assesses the process data in a manner that enables operating personnel including management at a facility to have a comprehensive understanding of the risk status and changes in both alarm and non-alarm based process variables. The hidden process near-miss data may be analyzed alone or in combination with other process data and/or data resulting from prior near-miss situations to permit strategic action to be taken to reduce or avert the occurrence of adverse incidents or catastrophic failure of a facility operation.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: February 15, 2022
    Assignee: Near-Miss Management LLC
    Inventors: Matthew L. Dering, Ankur Pariyani, Ulku G. Oktem, Daniel Shumway, Brett Emaus, Steven DeLaurentis
  • Patent number: 11215506
    Abstract: A substrate processing module includes a process chamber configured to perform a treatment process on a substrate; a transfer chamber provided on a first side of the process chamber, the substrate being transferred between the process chamber and the transfer chamber; an optical emission spectroscopy (OES) system provided on a second side of the process chamber and configured to monitor the process chamber; and a reference light source disposed in the transfer chamber and configured to emit a reference light to calibrate the OES system.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: January 4, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyeonghun Kim, Jeongil Mun, Hyung Joo Lee, Jongwoo Sun
  • Patent number: 11187975
    Abstract: A correction pattern generation device includes a processor configured to receive pattern information for a mask including a defect in a pattern formed on the mask, generate a correction pattern candidate for correcting the defect, calculate a correction difficulty degree for the correction pattern candidate, and select a correction pattern from correction pattern candidates based on the calculated correction difficulty degree for each correction pattern candidate if more than one correction pattern candidate for correcting the defect is generated.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 30, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventor: Keiko Morishita
  • Patent number: 11158039
    Abstract: A system and method for three dimensional (3D) vision inspection using a 3D vision system. The system and method comprising acquiring at least one 3D image of a 3D object using the 3D vision system, using the 3D vision system; extracting a 3D visible runtime mask of the 3D image; using the 3D vision system, comparing the 3D runtime visible mask to a 3D reference visible mask; and, using the 3D vision system, determining if a difference of pixels exists between the 3D runtime visible mask and the 3D reference visible mask.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: October 26, 2021
    Assignee: COGNEX CORPORATION
    Inventors: David J Michael, Gang Liu, Ali Zadeh
  • Patent number: 11127192
    Abstract: In some embodiments, techniques are provided for analyzing the manufacturability or fabricability of objects based on segmented designs. In some embodiments, a scanning device scans a manufacturing device and/or an object manufactured by the manufacturing device to characterize a manufacturing capability of the manufacturing device. A paintbrush pattern may be determined based on the characterization, and a proposed design may be determined to be fabricable or non-fabricable using the paintbrush pattern.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: September 21, 2021
    Assignee: X Development LLC
    Inventors: Sylvia J. Smullin, Albin Lee Jones, Joseph Sargent, Marina Dolivo
  • Patent number: 11114324
    Abstract: Systems and methods for detecting defect candidates on a specimen are provided. One method includes, after scanning of at least a majority of a specimen is completed, applying one or more segmentation methods to at least a substantial portion of output generated during the scanning thereby generating two or more segments of the output. The method also includes separately detecting outliers in the two or more segments of the output. In addition, the method includes detecting defect candidates on the specimen by applying one or more predetermined criteria to results of the separately detecting to thereby designate a portion of the detected outliers as the defect candidates.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: September 7, 2021
    Assignee: KLA Corp.
    Inventors: Martin Plihal, Erfan Soltanmohammadi, Prasanti Uppaluri, Mohit Jani, Chris Maher
  • Patent number: 11099134
    Abstract: An optical examination device is designed to detect properties of a semiconductor component. The device comprises a first illumination arrangement, a second illumination arrangement and an imaging device, where the first illumination arrangement emits infrared light onto a first surface of the semiconductor component, which faces away from the imaging device (camera). The infrared light fully penetrates the semiconductor component at least proportionally. The second illumination arrangement emits visible light onto a second surface of the semiconductor component, which faces the imaging device. The imaging device is designed and arranged to detect the light spectrum emitted from both the first and the second illumination arrangement, and as a result of a subsequent image evaluation on the basis of both the visible and the infrared light spectrum, to provide a separate image reduction for determining property defects or damage of the semiconductor component.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: August 24, 2021
    Assignee: MUEHLBAUER GMBH & CO. KG
    Inventors: Uladimir Prakapenka, Stephan Spichtinger, Rainer Miehlich
  • Patent number: 11092899
    Abstract: A method for manufacturing a lithographic mask for an integrated circuit includes performing an optical proximity correction (OPC) process to an integrated circuit mask layout to produce a corrected mask layout. The method further includes performing an inverse lithographic technology (ILT) process to the corrected mask layout to enhance the corrected mask layout to produce an OPC-ILT-enhanced mask layout. The method also includes performing an inverse lithographic technology (ILT) process to the corrected mask layout to enhance the corrected mask layout to produce an OPC-ILT-enhanced mask layout.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: August 17, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsu-Ting Huang, Tung-Chin Wu, Shih-Hsiang Lo, Chih-Ming Lai, Jue-Chin Yu, Ru-Gun Liu, Chin-Hsiang Lin
  • Patent number: 11067901
    Abstract: A method including: obtaining a logistic mathematical model predicting the formation of a physical structure created using a patterning process; evaluating the logistic mathematical model to predict formation of a part of the physical structure and generate an output; and adapting, based on the output, an aspect of the patterning process.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: July 20, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Scott Anderson Middlebrooks, Adrianus Cornelis Matheus Koopman, Markus Gerardus Martinus Maria Van Kraaij, Maxim Pisarenco
  • Patent number: 11051991
    Abstract: A method for inspecting absorbent articles is provided. The inspection is performed using an inspection algorithm generated with a convolutional neural network having convolutional neural network parameters. The convolutional neural network parameters are generated by a training algorithm. Based on the inspection, characteristics of the absorbent articles, such as defects, can be identified. Absorbent articles having identified characteristics can be rejected, or other actions can be taken.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: July 6, 2021
    Assignee: The Procter & Gamble Company
    Inventors: Paul Anthony Kawka, Stephen Michael Varga, Aitzaz Ahmad
  • Patent number: 11029359
    Abstract: A model is generated for predicting failures at the wafer production level. Input data from sensors is stored as an initial dataset, then data exhibiting excursions or useless impact is removed from the dataset. The dataset is converted into target features, where the target features are useful in predicting whether a wafer will be normal or not. A trade-off between positive and negative results is selected, and a plurality of predictive models are created. The final model is selected based on the trade-off criteria, and deployed.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: June 8, 2021
    Assignee: PDF Solutions, Inc.
    Inventors: Tomonori Honda, Lin Lee Cheong, Lakshmikar Kuravi
  • Patent number: 11022966
    Abstract: An image-based Artificial Neural Networks (ANN) is used for photomask modeling, which can self-construct an internal representation of the photomask manufacturing process, therefore allowing the modeling process to become unfettered by the limitations of existing mathematical/statistical tools, thus greatly reduces/eliminates the effort needed from tedious and costly model-builders. The ANN model requires mask layout data converted into image pixel form. In ANN training phase a first circuit image and its existing SEM image are modeled via multiple layers of convolution and rectification to pick out the salient features of transformed image. In ANN testing phase, a second circuit image and its existing SEM image are compared and verified to have a difference smaller than the predetermined requirement. The satisfactory second circuit image is converted back from pixel form to circuit layout data for photomask writing.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: June 1, 2021
    Assignee: SYNOPSYS, INC.
    Inventors: Parikshit Kulkarni, Dan Hung, John Gookassian
  • Patent number: 10997713
    Abstract: According to one embodiment, an inspection device includes: an image generation device configured to generate a second image corresponding to a first image; and a defect detection device configured to estimate a nonlinear shift based on a plurality of partial region sets, each of the partial region sets including a first partial region in the first image and a second partial region in the second image corresponding to the first partial region, and detect a defect in the second image from the first image.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: May 4, 2021
    Assignees: KABUSHIKI KAISHA TOSHIBA, NuFlare Technology, Inc.
    Inventors: Takeshi Morino, Hideaki Okano, Yoshinori Honguh, Ryoichi Hirano, Masataka Shiratsuchi, Hideaki Hashimoto
  • Patent number: 10997736
    Abstract: Embodiments relate to a normalized cross correlation (NCC) circuit that can perform a normalized cross correlation between input patch data and kernel data. An interface circuit of an image signal processor receives input patch data from a source. Input patch data is data that represents a portion of a frame of image data from the source. The NCC circuit includes a filtering circuit and a normalization circuit. The filtering circuit receives the input patch data from the interface circuit and performs a convolution on the received input patch data or processed patch data derived from the input patch data with kernel data to produce convolution output data. The normalization circuit computes a normalized score output based on the convolution output data and the kernel data. The normalized score output includes normalization scores for each location of the convolution output data.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: May 4, 2021
    Assignee: Apple Inc.
    Inventors: Muge Wang, Junji Sugisawa
  • Patent number: 10976264
    Abstract: According to one embodiment, an analysis system includes a display controller. The display controller is configured to display a first comprehensive image and a first individual image from a plurality of workpiece data. The plurality of workpiece data relate to a plurality of workpieces, are classified into a plurality of categories, and are classified into one of a plurality of classes. The first comprehensive image is based on the plurality of workpiece data. The first individual image is based on a part of the plurality of workpiece data classified into one of the plurality of categories.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: April 13, 2021
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventor: Shun Hirao
  • Patent number: 10957034
    Abstract: There are provided a system and method of examination on a specimen, the method comprising: obtaining an inspection image of a die and generating a defect map using one or more reference images; selecting a plurality of defect candidates from the defect map; and generating for each defect candidate, a respective modified inspection image patch, comprising: extracting an image patch surrounding the defect candidate respectively from the inspection image and each reference image; and modifying the inspection image patch, comprising: estimating noise representative of intensity variations on the inspection image patch, the noise including a first type of noise representative of a polynomial relation between the inspection and reference image patches, and a second type of noise representative of a spatial anomaly in the inspection image patch, and removing at least one of the first and second types of noise from the inspection image patch based on the estimated noise.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: March 23, 2021
    Assignee: APPLIED MATERIALS ISRAEL LTD.
    Inventors: Elad Cohen, Shahar Arad
  • Patent number: 10886504
    Abstract: This disclosure provides techniques for assessing quality of a deposited film layer of an organic light emitting diode (“OLED”) device. An image is captured and filtered to identify a deposited layer that is to be analyzed. Image data representing this layer can be optionally converted to brightness (grayscale) data. A gradient function is then applied to emphasize discontinuities in the deposited layer. Discontinuities are then compared to one or more thresholds and used to ascertain quality of the deposited layer, with optional remedial measures then being applied. The disclosed techniques can be applied in situ, to quickly identify potential defects such as delamination before ensuing manufacturing steps are applied. In optional embodiments, remedial measures can be taken dependent on whether defects are determined to exist.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: January 5, 2021
    Assignee: Kateeva, Inc.
    Inventor: Christopher Cocca
  • Patent number: 10878557
    Abstract: In a device for detecting a defect, the device includes: an image pickup unit including pixels, the image pickup unit generating a substrate image by picking up an image of a substrate having patterns formed on a top surface thereof; and a controller for detecting a defect located on the substrate, based on the substrate image, wherein the substrate image includes pattern images corresponding to the patterns, wherein each of the pattern images includes pixel values, wherein the controller detects the defect by comparing weights of pixel values for each of the pattern images.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: December 29, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hyung Jin Lee, Dae Hong Kim, Sung Hoon Yang, Se Yoon Oh
  • Patent number: 10866506
    Abstract: A method for manufacturing a photo mask for a semiconductor device includes receiving a plurality of hotspot regions of a mask layout corresponding to the semiconductor device. The method further includes classifying the plurality of hotspot regions into two or more hotspot groups such that same or similar hotspot regions are classified into same hotspot groups. The hotspot groups includes a first hotspot group that has at least two hotspot regions. The method also includes correcting a first hotspot region of the first hotspot group to generate an enhancement of the first hotspot region and correcting other hotspot regions of the first hotspot group using the enhancement of the first hotspot region to generate enhancements of other hotspot regions of the first hotspot group.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Fu An Tien, Hsu-Ting Huang, Ru-Gun Liu
  • Patent number: 10859507
    Abstract: A surface defect inspection method includes: acquiring an original image by capturing an image of a subject of an inspection; generating texture feature images by applying a filtering process using spatial filters to the original image; generating a feature vector at each position of the original image, by extracting a value at a corresponding position from each of the texture feature images, for each of the positions of the original image; generating an abnormality level image representing an abnormality level for each position of the original image, by calculating, for each of the feature vectors, an abnormality level in a multi-dimensional distribution formed by the feature vectors; and detecting a part having the abnormality level that is higher than a predetermined level in the abnormality level image as a defect portion or a defect candidate portion.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: December 8, 2020
    Assignee: JFE Steel Corporation
    Inventors: Takahiro Koshihara, Yoshiyuki Umegaki, Takahiko Oshige
  • Patent number: 10832396
    Abstract: Methods and systems for setting up inspection of a specimen with design and noise based care areas are provided. One system includes one or more computer subsystems configured for generating a design-based care area for a specimen. The computer subsystem(s) are also configured for determining one or more output attributes for multiple instances of the care area on the specimen, and the one or more output attributes are determined from output generated by an output acquisition subsystem for the multiple instances. The computer subsystem(s) are further configured for separating the multiple instances of the care area on the specimen into different care area sub-groups such that the different care area sub-groups have statistically different values of the output attribute(s) and selecting a parameter of an inspection recipe for the specimen based on the different care area sub-groups.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: November 10, 2020
    Assignee: KLA-Tencor Corp.
    Inventors: Brian Duffy, Martin Plihal, Santosh Bhattacharyya, Gordon Rouse, Chris Maher, Erfan Soltanmohammadi
  • Patent number: 10824080
    Abstract: A method includes reducing refractive index of an environment at or adjacent an extreme ultraviolet (EUV) mask to below 1.0. The EUV mask is in an EUV lithography system that forms a projection beam of EUV radiation using EUV radiation emitted from a radiation source. The method further includes exposing the EUV mask to the projection beam of EUV radiation.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: November 3, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Tsung Shih, Tsung-Chih Chien, Tsung Chuan Lee
  • Patent number: 10754261
    Abstract: Metrology target designs on the reticle and on the wafer, and target design and processing methods are provided. Target designs comprise coarse pitched periodic structures having fine pitched sub-elements, which vary in sub-element CD and/or height, an orthogonal periodic structure, perpendicular to the measurement direction, with an orthogonal unresolved pitch among periodically recurring bars, which provide a calibration parameter for achieving well-printed targets. Orthogonal periodic structures may be designed on the reticle and be unresolved, or be applied in cut patterns on the process layer, with relatively low sensitivity to the cut layer overlay. Designed targets may be used for overlay metrology as well as for measuring process parameters such as scanner aberrations and pitch walk.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: August 25, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Yoel Feler, Vladimir Levinski
  • Patent number: 10752039
    Abstract: A document including a Directed Self-Assembly (DSA) pattern including a unique and randomized pattern embedded on the document, where the DSA is formed by using two different-length polymer chains.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: August 25, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin David Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Michael Rizzolo
  • Patent number: 10742890
    Abstract: An imaging apparatus includes an image sensor and a controller. The controller acquires an infrared image generated by the image sensor when infrared light is higher than a predetermined light amount. The controller acquires a normal image generated by the image sensor when the infrared light is lower than the predetermined light amount. The controller generates a synthesized image on the basis of the infrared image and the normal image. Thus, an image that includes colors and high luminance contrast may be generated in a dark environment without a plurality of infrared light sources.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: August 11, 2020
    Assignee: KYOCERA Corporation
    Inventor: Takatoshi Nakata
  • Patent number: 10733337
    Abstract: A method for the simulation of a photolithographic process for generating a wafer structure includes providing an aerial image of a region of a mask that includes the mask structure, prescribing a range of intensities, determining auxiliary or potential wafer structures for different threshold values within the range of intensities, determining the number of structure elements for each of the auxiliary or potential wafer structures, determining a stability range consisting of successive threshold values from the threshold values that were used for the determination of auxiliary or potential wafer structures, within the stability range the number of structure elements of the auxiliary or potential wafer structures remaining constant or lying within a prescribed range, and determining the wafer structure on the basis of the aerial image and a threshold value within the stability range. A microscope for carrying out the method is also provided.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: August 4, 2020
    Assignee: Carl Zeiss SMT GmbH
    Inventor: Hans Michael Solowan
  • Patent number: 10691864
    Abstract: Implementations of the disclosure provide a method of fabricating an integrated circuit (IC). The method includes receiving an IC design layout; performing optical proximity correction (OPC) process to the IC design layout to produce a corrected IC design layout; and verifying the corrected IC design layout using a machine learning algorithm. The post OPC verification includes using the machine learning algorithm to identify one or more features of the corrected IC design layout; comparing the one or more identified features to a database comprising a plurality of features; and verifying the corrected IC design layout based on labels in the database associated with the plurality of features.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: June 23, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hung-Chun Wang, Cheng Kun Tsai, Wen-Chun Huang, Wei-Chen Chien, Chi-Ping Liu
  • Patent number: 10656989
    Abstract: Trend estimation for application-agnostic statistical fault detection of multi-process applications in environments with data trend includes at least one of: a multi-process application runs on a host. Statistical events are collected and sent to a statistical fault detector. The statistical fault detector creates one or more distributions and compares recent statistical event data to historical statistical event data and uses deviation from historical norm for fault detection. Trend is estimated, and if needed, removed from event data prior to the creation of distributions. Trend is estimated using spectral techniques, filter banks and Maximum Entry Spectral Estimation, and dominant frequencies are estimated and utilized to adapt to the environment.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: May 19, 2020
    Assignee: OPEN INVENTION NETWORK LLC
    Inventor: Allan Havemose
  • Patent number: 10658327
    Abstract: Provided are a chip bonding apparatus and bonding method.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: May 19, 2020
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Tianming Wang, Xiaoyu Jiang, Hai Xia, Feibiao Chen
  • Patent number: 10632023
    Abstract: A method for inspecting absorbent articles is provided. The inspection is performed using an inspection algorithm generated with a convolutional neural network having convolutional neural network parameters. The convolutional neural network parameters are generated by a training algorithm. Based on the inspection, characteristics of the absorbent articles, such as defects, can be identified. Absorbent articles having identified characteristics can be rejected, or other actions can be taken.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: April 28, 2020
    Assignee: The Procter & Gamble Company
    Inventors: Paul Anthony Kawka, Stephen Michael Varga, Aitzaz Ahmad, Paul Philip Thomas
  • Patent number: 10571799
    Abstract: A method for optimizing a binary mask pattern includes determining, by a processor, an evaluation value based on a comparison between a design pattern and a substrate pattern simulated based on the binary mask pattern. The method also includes, based on the evaluation value, using, by the processor, a gradient-based optimization method to generate a first adjusted binary mask pattern. The method also includes determining, by the processor, a first updated evaluation value based on a comparison between the design pattern and a first updated substrate pattern simulated based on the first adjusted binary mask pattern. The method also includes, based on the first updated evaluation value, using, by the processor, a product of a Hessian matrix and an arbitrary vector to generate a second adjusted binary mask pattern. The method also includes simulating, by the processor, a second updated substrate pattern based on the second adjusted binary mask pattern.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: February 25, 2020
    Assignee: ASML US, LLC
    Inventors: Jiangwei Li, Ke Zhao, Yuan He
  • Patent number: 10571406
    Abstract: One or more metrology objects and one or more metrology operations may be identified. A design-based representation of a first metrology object of the one or more metrology objects may be received. Furthermore, an image-based representation of the first metrology object of the one or more metrology objects may be received where the one or more metrology operations include a first metrology operation associated with the first metrology object that is to be performed on the image-based representation of the first metrology object. The design-based representation of the first metrology object may be mapped with the image-based representation of the first metrology object. The first metrology operation may be performed based on the mapping.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: February 25, 2020
    Assignee: Applied Materials Israel Ltd.
    Inventors: Ron Katzir, Imry Kissos, Lavi Shachar, Amit Batikoff, Shaul Cohen, Noam Zac
  • Patent number: 10565703
    Abstract: The image inspection device includes: a first extraction unit configured to repeatedly execute processing for moving a predetermined region by a predetermined distance on an inspection target image to extract an image of the predetermined region after movement as a first determination image until a predetermined first ratio of the inspection target image is included in a plurality of first determination images, and a second extraction unit configured to repeatedly execute processing for moving a predetermined region by a distance smaller than the predetermined distance on an image in the inspection target image including a first determination image where a determined degree satisfies a predetermined condition to extract an image of the predetermined region after movement as a second determination image until a predetermined second ratio of the image in the inspection target image including a first determination image is included in a plurality of second determination images.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: February 18, 2020
    Assignee: NEC Corporation
    Inventor: Hiroyuki Kobayashi
  • Patent number: 10560670
    Abstract: The present technology relates to an imaging apparatus, an imaging control method, and a program capable of obtaining a color image using infrared light without decreasing the frame rate. The imaging apparatus includes an imaging element including a first pixel and a second pixel, and a control unit that controls an exposure period of the imaging element and an emission period of the infrared light from the infrared light emission unit. The control unit controls to provide an exposure period of the first pixel and the second pixel in each of frame periods and provide a single exposure period being a period in which the first pixel alone is exposed, and controls so as to emit the infrared light within the single exposure period. The present technology is applicable to a surveillance camera, for example.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: February 11, 2020
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Yasushi Sato
  • Patent number: 10545401
    Abstract: In a phase shift mask blank comprising a transparent substrate and a phase shift film deposited thereon and having a phase shift of 150-200° with respect to sub-200 nm light, the phase shift film is composed of a silicon base material consisting of silicon, nitrogen and optionally oxygen, has a thickness of up to 70 nm, and provides a warpage change of up to 0.2 ?m in a central region of a surface of the substrate before and after the deposition of the phase shift film on the substrate.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: January 28, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yukio Inazuki, Takuro Kosaka
  • Patent number: 10540771
    Abstract: An image segmentation method is disclosed that allows a user to select image component types, for example tissue types and or background, and have the method of the present invention segment the image according to the user's input utilizing the superpixel image feature data and spatial relationships.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: January 21, 2020
    Assignee: Ventana Medical Systems, Inc.
    Inventors: Christophe Chefd'hotel, Stanley Ho, Yao Nie
  • Patent number: 10534888
    Abstract: A computer implemented method, a system and a computer readable storage medium configured to conduct the following: determining a reliability parameter of an initial hybrid metallization to determine a determined reliability parameter, comparing the determined reliability parameter to a reliability limit and determining a reliability ratio, determining a performance parameter of the initial hybrid metallization to determine a determined performance parameter, comparing the determined performance parameter to a performance limit and determining a performance ratio, determining a reliability indice from the reliability ratio, determining a performance indice from the performance ratio, determining a reliability score from a combination of the determined reliability parameter and the reliability indice, determining a performance score from a combination of the determined performance parameter and the performance indice, comparing the reliability score to the performance score, selecting a first interconnect and
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: January 14, 2020
    Assignee: International Business Machines Corporation
    Inventors: Baozhen Li, Chih-Chao Yang, Theo Standaert
  • Patent number: 10495967
    Abstract: The present disclosure provides an integrated circuit (IC) method in accordance with some embodiments. The method includes building a mask model to simulate a mask image and a compound lithography computational model to simulate a wafer pattern; calibrating the mask model using a measured mask image; calibrating the compound lithography computational model using a measured wafer data and the calibrated mask model; and performing an optical proximity correction (OPC) process to an IC pattern using the calibrated compound computational model, thereby generating a mask pattern for mask fabrication.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: December 3, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsu-Ting Huang, Chih-Shiang Chou, Ru-Gun Liu
  • Patent number: 10474133
    Abstract: An inspection device includes a first processor, a second processor, and a server. The first processor detects first coordinates of first feature points from first images in a first image set. The second processor detects second coordinates of second feature points from second images in a second image set. The server generates reference coordinates based on the first coordinates and the second coordinates. The reference coordinates are transmitted to the first processor and the second processor. The first and second image sets correspond to scanned swaths on a wafer.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: November 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Janghee Lee, Yoo Jin Jeong, Sangbong Park, Byeonghwan Jeon
  • Patent number: 10445869
    Abstract: There is described an online inspection method and system having an illumination system that provides bright-field and dark-field illumination concurrently or sequentially, at varying intensities, in order to acquire images that may be read by an image processing device. The image processing device may obtain measurements of features in the images and evaluate acceptability of the features.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: October 15, 2019
    Assignee: BOMBARDIER INC.
    Inventor: Octavian Ioachim
  • Patent number: 10404868
    Abstract: Apparatus to detect a defect in a printed image and methods of detecting detects in a printed image are described. In some examples, a printing operation is initiated using image data to generate a printed image. The printed image is then scanned to generate a scanned image. A resolution of the scanned image is estimated, calculated or determined on the basis of a characteristic of the printing operation, and a reference image, having a resolution corresponding to the estimated, calculated or determined resolution, is generated from the image data. Whether defects are present in the printed image may be determined on the basis of a comparison of the reference image with the scanned image.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: September 3, 2019
    Assignee: HP Indigo B.V.
    Inventors: Alexander Spivakovsky, Oded Perry, Oren Haik, Avi Malki
  • Patent number: 10395958
    Abstract: A method of operating a multi-column electron beam array for quality inspection of a semiconductor wafer involves dividing the whole wafer area collectively in equally divided areas allocated to each column of the array, and assigning each of the areas as a column working space having the same dimensions and orientations. The array of column working spaces are assigned to an array of column optical axes, wherein a field of view of each column is defined as a covered region in which critical wafer patterns can be scanned by one or more columns to take an image. The stage supporting the wafer is moved such that each column working space is fully covered by the field of view of each column completely. By utilizing arbitrary waveform generators in electron inspection columns, this method also can be extended to write independent arbitrary patterns in predetermined positions in each die on a wafer.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: August 27, 2019
    Inventor: Weiwei Xu
  • Patent number: 10395362
    Abstract: Methods and systems for detecting defects in patterns formed on a specimen are provided. One system includes one or more components executed by one or more computer subsystems, and the component(s) include first and second learning based models. The first learning based model generates simulated contours for the patterns based on a design for the specimen, and the simulated contours are expected contours of a defect free version of the patterns in images of the specimen generated by an imaging subsystem. The second learning based model is configured for generating actual contours for the patterns in at least one acquired image of the patterns formed on the specimen. The computer subsystem(s) are configured for comparing the actual contours to the simulated contours and detecting defects in the patterns formed on the specimen based on results of the comparing.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: August 27, 2019
    Assignee: KLA-Tencor Corp.
    Inventors: Ajay Gupta, Mohan Mahadevan, Sankar Venkataraman, Hedong Yang, Laurent Karsenti, Yair Carmon, Noga Bullkich, Udy Danino