Integrated Optical Circuit Patents (Class 385/14)
  • Patent number: 10298332
    Abstract: A method of controlling a semiconductor element that includes a semiconductor laser diode (LD), a semiconductor modulator, and a semiconductor optical amplifier (SOA) is disclosed. The LD generates CW light supplied with the first bias current. The semiconductor modulator generates a modulated light by modulating the CW light supplied with a driving signal. The SOA generates an optical signal by amplifying the modulated light supplied with the second bias current. The method first sets the second bias current in a region where the output power of the optical signal shows negative dependence of the second bias current. Then, a temperature of the semiconductor element, the first bias current, and the driving signal are adjusted such that the optical signal shows performance in respective preset ranges.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: May 21, 2019
    Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Toshiaki Kihara, Sayuri Ichida
  • Patent number: 10295283
    Abstract: Generally discussed herein are devices and methods for thermal management of a component. An apparatus can include a phase change material substantially at a phase transition temperature of the phase change material, a component near, on, or at least partially in the phase change material, and a heat removal device to transfer heat energy away from the phase change material and maintain the phase change material substantially at the phase transition temperature.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: May 21, 2019
    Assignee: Intel Corporation
    Inventors: Michael K. Patterson, Andrew C. Alduino
  • Patent number: 10290619
    Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode; and an ASIC chip including circuitry configured to provide the electrical signal; and a bond contact that is electrically coupled to the circuitry; an bridge chip bonded to at least a portion of the photonic integrated circuit chip and at least a portion of the ASIC chip.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: May 14, 2019
    Assignee: Infinera Corporation
    Inventors: Peter W. Evans, John W. Osenbach, Fred A. Kish, Jr., Jiaming Zhang, Miguel Iglesias Olmedo, Maria Anagnosti
  • Patent number: 10288813
    Abstract: A platform taper is formed in an optical chip. A light-transmitting medium is attached to the optical chip after forming the platform taper in the optical chip. An waveguide taper is formed in the light-transmitting medium such that the waveguide taper and the platform taper are aligned so as to form an optical taper on the optical device.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: May 14, 2019
    Assignee: Mellanox Technologies Silicon Photonics Inc.
    Inventor: Rolf Andreas Wyss
  • Patent number: 10282979
    Abstract: Embodiments described herein enable the transmission of infrared (IR) signals via an AV cable containing a plurality of signal lines. In embodiments, an IR receiver, and IR emitter, and/or logic circuitry may be integrated within an AV cable (e.g., an HDMI cable) to enable transmitting signals from an IR remote control device to a media device that may be located behind a physical obstruction through which IR signals are unable to pass. By utilizing one or more signal lines of an AV cable to transmit IR signals, existing AV communication protocols may continue to be utilized in a user's home entertainment system. In this manner, a user may be able to locate one or more media devices (e.g., home entertainment devices) in a physically remote location, such as in a cabinet or closet, without sacrificing any IR signaling functionality.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: May 7, 2019
    Assignee: Caavo Inc
    Inventors: Ashish Dharmpal Aggarwal, Sharath Hariharpur Satheesh, Pankaj Ramesh Chandra Katiyar, Conrad Savio Jude Gomes, Ashok Kumar Kethe, Bitto Niclavose
  • Patent number: 10283931
    Abstract: An electro-optical device having two wafer components and a device fabrication method. A first wafer component includes a silicon substrate and a cladding layer on top thereof. The cladding layer comprises a cavity formed therein, wherein the cavity is filled with an electrically insulating thermal spreader, which has a thermal conductivity larger than that of the cladding layer. The second wafer component comprises a stack of III-V semiconductor gain materials, designed for optical amplification of a given radiation. The second wafer component is bonded to the first wafer component, such that the stack of III-V semiconductor gain materials is in thermal communication with the thermal spreader. In addition, the thermal spreader has a refractive index that is lower than each of the refractive index of the silicon substrate and an average refractive index of the stack of III-V semiconductor gain materials for said given radiation.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: May 7, 2019
    Assignee: International Business Machines Corporation
    Inventors: Charles Caër, Herwig Hahn
  • Patent number: 10284824
    Abstract: A stacked image sensor comprises an array of tiles, each comprising a sensor array layer tile comprising a plurality of sensing elements for receiving radiation, one or more electronics layer tiles comprising at least one read-out circuit, connected to at least one subgroup of sensing elements of the sensor array layer tile, a photonics layer tile comprising at least one waveguide and one or more modulators, each connected to the one or more electronics layer tiles. The modulators are adapted for modulating an optical signal travelling within the at least one waveguide. The electronics layer tile comprises at least one driver for driving an optical modulator in the photonics layer tile in accordance with the signals received in each sensing element of the sensor array layer tile. At least one of the layer tiles (sensor array layer, electronics layer and/or photonics layer tiles) is implemented in a single integrated circuit.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: May 7, 2019
    Assignee: Caeleste CVBA
    Inventors: Gaozhan Cai, Bart Dierickx, Bert Luyssaert, Peng Gao
  • Patent number: 10267991
    Abstract: First, half etching is performed to a semiconductor layer formed on an insulating layer to form trenches at positions of slab-portion regions in which slab portions are to be formed. After filling the trenches with an insulating film, a resist mask which covers the semiconductor layer at a projecting-portion region in which a projecting portion is to be formed and whose pattern ends are located on upper surfaces of the insulating films is formed on upper surfaces of the semiconductor layer and the insulating film, and full etching is performed to the semiconductor layer with using the resist mask and the insulating film as an etching mask, thereby forming an optical waveguide constituted of the projecting portion and the slab portions. Thereafter, a first interlayer insulating film is formed to cover the optical waveguide.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: April 23, 2019
    Assignee: Renesas Electronics Corporation
    Inventor: Atsuro Inada
  • Patent number: 10268232
    Abstract: An optical neural network is constructed based on photonic integrated circuits to perform neuromorphic computing. In the optical neural network, matrix multiplication is implemented using one or more optical interference units, which can apply an arbitrary weighting matrix multiplication to an array of input optical signals. Nonlinear activation is realized by an optical nonlinearity unit, which can be based on nonlinear optical effects, such as saturable absorption. These calculations are implemented optically, thereby resulting in high calculation speeds and low power consumption in the optical neural network.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: April 23, 2019
    Assignee: Massachusetts Institute of Technology
    Inventors: Nicholas Christopher Harris, Jacques Johannes Carolan, Mihika Prabhu, Dirk Robert Englund, Scott A. Skirlo, Yichen Shen, Marin Soljacic
  • Patent number: 10268004
    Abstract: Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: April 23, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young Tak Han, Sang Ho Park, Yong Soon Baek, Jang Uk Shin, Yong Hwan Kwon, Jong Hoi Kim
  • Patent number: 10261262
    Abstract: According to one example, the present application discloses an optical circuit comprising a grating to receive input light of mixed polarizations and output light of a same polarization to a first waveguide and a second waveguide. The first waveguide and second waveguide are optically coupled to a plurality of resonators that are coupled to a plurality of gratings that are to output light of mixed polarizations.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: April 16, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Lars Helge Thylen, Joaquin Matres Abril, Michael Renne Ty Tan
  • Patent number: 10254479
    Abstract: In one embodiment, an on-chip electronic-plasmonic transducer is provided that is capable of both direct plasmon generation and detection at high efficiencies. The electronic-plasmonic transducer includes a metal-insulator-metal junction formed from a first wire constructed of a first metal, a tunneling barrier material in contact with the first wire, and a second wire made from a second metal in contact with the tunneling barrier material. A plasmonic waveguide is formed as a contiguous part of the second wire, such that the waveguide is directly coupled to the MIM junction. The electronic-plasmonic transducer can both directly generate and detect plasmons, such that it may be configured on-chip as either a plasmon source or a plasmon detector. The electronic-plasmonic transducer may be used to form an on-chip plasmon-based frequency multiplier or plasmon amplifier, among other usages.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: April 9, 2019
    Assignee: National University of Singapore
    Inventors: Wei Du, Tao Wang, Christian Albertus Nijhuis
  • Patent number: 10247883
    Abstract: A composition for an optical waveguide is cured into a sheet to give a cured product. A difference in light transmittance with respect to light having a wavelength of 450 nm is 15% or less between this cured product and this cured product after retention in atmosphere at 175° C. for 40 hours, the light transmittance being calculated in terms of the cured product at a thickness of 50 ?m.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: April 2, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD
    Inventors: Naoyuki Kondou, Shinji Hashimoto, Toru Nakashiba, Shingo Maeda, Seiji Takagi
  • Patent number: 10248002
    Abstract: In an optical circuit using a Mach-Zehnder-type element, it is difficult to obtain an optical circuit which has a less wavelength dependence and is suitable for achieving high integration. Accordingly, an optical circuit according to the present invention includes: a first Mach-Zehnder-type element including a first branch waveguide, a first branching/combining unit connected to one end of the first branch waveguide, and a second branching/combining unit connected to another end of the first branch waveguide and having a branch configuration different from that of the first branching/combining unit; and a second Mach-Zehnder-type element including a second branch waveguide, a third branching/combining unit connected to one end of the second branch waveguide, and a fourth branching/combining unit connected to another end of the second branch waveguide and having a branch configuration different from that of the third branching/combining unit.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: April 2, 2019
    Assignee: NEC CORPORATION
    Inventor: Shigeru Nakamura
  • Patent number: 10241354
    Abstract: Techniques regard electro-optic modulators are provided. For example, one or embodiments described herein can regard an apparatus that can comprise a first lateral region, a second lateral region, and a central region located on a semiconductor substrate. The first lateral region can be adjacent to a first side of the central region and can have a first conductivity type. The second lateral region can be adjacent to a second side of the central region and can have a second conductivity type. Also, the first side can be opposite to the second side. Further, the central region can comprise a diode junction adjacent to an intrinsic region. The intrinsic region can separate the first lateral region and the second lateral region.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: March 26, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Douglas Max Gill
  • Patent number: 10241352
    Abstract: A phase controller for controlling the phase of a light signal in a surface waveguide and a method for its fabrication are disclosed. The phase controller controls the phase of the light signal by inducing stress in the waveguide structure, thereby controlling the refractive indices of at least some of its constituent layers. The phase controller includes a phase-control element formed on topographic features of the top cladding of the waveguide, where these features (1) provide a shape to the phase-control element that matches the shape of the mode field of the light signal and (2) give rise to stress-concentration points that focus and direct induced stress into specific regions of the waveguide structure, thereby providing highly efficient phase control. As a result, the phase controller can operate at a lower voltage, lower power, and/or over a shorter interaction length than integrated-optic phase controllers of the prior art.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: March 26, 2019
    Assignee: LioniX International BV
    Inventors: Jörn Philipp Epping, Arne Leinse, René Gerrit Heideman
  • Patent number: 10241267
    Abstract: A semiconductor optical integrated device includes: a substrate; at least a lower cladding layer, a waveguide core layer, and an upper cladding layer sequentially layered on the substrate, a buried hetero structure waveguide portions each having a waveguide structure in which a semiconductor cladding material is embedded near each of both sides of the waveguide core layer; and a ridge waveguide portion having a waveguide structure in which a semiconductor layer including at least the upper cladding layer protrudes in a mesa shape. Further, a thickness of the upper cladding layer in each of the buried hetero structure waveguide portions is greater than a thickness of the upper cladding layer in the ridge waveguide portion.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: March 26, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazuaki Kiyota, Tatsuya Kimoto, Yusuke Saito
  • Patent number: 10232809
    Abstract: A vehicle circuit body includes: a first wiring member including a first power supply line and a first ground line which have high rigidity; and a second wiring member including a second power supply line and a second ground line which have low rigidity. The first wiring member is located at a flat portion of a body panel, and the second wiring member is located at a protruding portion of the body panel protruding toward a cabin side. The second power supply line and the second ground line of the second wiring member have flexibility so as to be deformed along a shape of the protruding portion.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: March 19, 2019
    Assignee: YAZAKI CORPORATION
    Inventor: Shingo Kato
  • Patent number: 10234645
    Abstract: A variation in coupling ratio of output light from a laser element to an optical fiber is suppressed. A semiconductor laser module including a plurality of semiconductor laser elements, an optical fiber, a condenser that condenses a laser beam emitted from each of the semiconductor laser elements to the optical fiber, and a housing that implements the laser elements, the condenser, and the optical fiber includes at least one thin plate that is arranged between the laser elements and a top of the housing, and arranged on the top to form a gap with the top.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: March 19, 2019
    Assignee: TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
    Inventors: Yuta Ishige, Etsuji Katayama, Hajime Mori
  • Patent number: 10234745
    Abstract: A solid state optical beam steering device and method of operation includes converting a frequency or wavelength of a signal in a non-linear converter associated with one channel just before launch. A second channel has a similar constructions and operation. A processor compares the phase difference between the two channels and uses the difference to horizontally steer a beam without moving mechanical parts. This establishes the solid-state nature of the present disclosure. The non-linear converter may be a quasi-phase matched non-linear converter with alternating crystal domains.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: March 19, 2019
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Paul R. Moffitt, Peter A. Ketteridge, Peter G. Schunemann
  • Patent number: 10216100
    Abstract: An inspection substrate for inspecting a component, such as a liquid confinement system, of an apparatus for processing production substrates is discussed. The inspection substrate includes a body having dimensions similar to a production substrate so that the inspection substrate is compatible with the apparatus, an illumination device, such as light emitting diodes, embedded in the body, a sensor, such as an imaging device or a pressure sensor, that is embedded in the body and configured to generate inspection information, such as image data, relating to a parameter of the component of the apparatus proximate to the inspection substrate, and a storage device embedded in the body and configured to store the inspection information.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: February 26, 2019
    Assignee: ASML Netherlands B.V.
    Inventors: Seerwan Saeed, Petrus Martinus Gerardus Johannes Arts, Harold Sebastiaan Buddenberg, Erik Henricus Egidius Catharina Eummelen, Giovanni Luca Gattobigio, Floor Lodewijk Keukens, Ferdy Migchelbrink, Jeroen Arnoldus Leonardus Johannes Raaymakers, Arnoldus Johannes Martinus Jozeph Ras, Gheorghe Tanasa, Jimmy Matheus Wilhelmus Van De Winkel, Daan Daniel Johannes Antonius Van Sommeren, Marijn Wouters, Miao Yu
  • Patent number: 10215921
    Abstract: Disclosed are a method and structure providing a silicon-on-insulator substrate on which photonic devices are formed and in which a core material of a waveguide is optically decoupled from a support substrate by a shallow trench isolation region.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: February 26, 2019
    Assignee: Micron Technology, Inc.
    Inventor: Roy E. Meade
  • Patent number: 10217691
    Abstract: Methods, systems and an apparatus relating to a heat spreader to be coupled to a heat source having a heat source coefficient of thermal expansion (HS CTE), the heat spreader comprising an anisotropic material having a high expansion axis. The heat spreader also including a surface to be coupled to the heat source, wherein the high expansion axis of the anisotropic material is oblique to the surface of the heat spreader and wherein the high expansion axis of the anisotropic material is oriented at a first angle of rotation about a first axis of the heat spreader wherein the first angle of rotation is selected to optimize a match of a first CTE of the heat spreader with the HS CTE.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: February 26, 2019
    Assignee: NLIGHT, Inc.
    Inventors: Walter R. Sanders, Manoj Kanskar
  • Patent number: 10217791
    Abstract: Disclosed herein is a method of manufacturing a bonded substrate, including the steps of: forming a first bonding layer on a surface on one side of a semiconductor substrate; forming a second bonding layer on a surface on one side of a support substrate; adhering the first bonding layer and the second bonding layer to each other; a heat treatment for bonding the first bonding layer and the second bonding layer to each other; and thinning the semiconductor substrate from a surface on the other side of the semiconductor substrate to form a semiconductor layer.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: February 26, 2019
    Assignee: Sony Corporation
    Inventor: Nobutoshi Fujii
  • Patent number: 10209466
    Abstract: Disclosed is a package comprising a substrate having a patterned surface with an optical contact area, an optical redistribution layer (oRDL) feature, and a build-up material extending over the patterned surface of the substrate and around portions of the oRDL features. In some embodiments, the package comprises a liner sheathing the oRDL features. In some embodiments, the oRDL feature extends through openings in an outer surface of the build-up material and forms posts extending outward from the outer surface. In some embodiments, the package comprises an electrical redistribution layer (eRDL) feature, at least some portion of which overlap at least some portion of the oRDL feature. In some embodiments, the package comprises an optical fiber coupled to the oRDL features.
    Type: Grant
    Filed: April 2, 2016
    Date of Patent: February 19, 2019
    Assignee: Intel IP Corporation
    Inventors: Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes, Klaus Reingruber, Andreas Wolter, Richard Patten
  • Patent number: 10209180
    Abstract: A sensor device comprising a planar substrate defining a substrate plane and a waveguide for guiding an electromagnetic wave. The waveguide extends in a length direction in a waveguide plane parallel to the substrate plane and has a width and a height, wherein the width to height ratio is more than 5. The height of the waveguide is less than the wavelength of the electromagnetic wave. The waveguide is supported on the substrate by a support structure extending from the substrate to the waveguide, along the length direction of the waveguide, having a width which is smaller than the width of the waveguide. The invention further relates to a method of detecting a component in gas and a method of fabricating a sensor device.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: February 19, 2019
    Assignee: SenseAir AB
    Inventors: Kristinn B. Gylfason, Hans Sohlström, Floria Ottonello Briano, Göran Stemme
  • Patent number: 10205070
    Abstract: A light-emitting device includes a light-emitting structure with a side surface, and a reflective layer covering the side surface, and a light-transmitting body. The light-transmitting body encloses the light-emitting structure and has a first side surface, a second side surface, a third side surface and a fourth side surface. The reflective layer covers the first side surface and the third side surface without covering the second side surface and the fourth side surface. The light-emitting structure has a first light-emitting angle and a second light-emitting angle different from the first light-emitting angle.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: February 12, 2019
    Assignee: Epistar Corporation
    Inventors: Chien-Liang Liu, Ming-Chi Hsu, Shih-An Liao, Chun-Hung Liu, Zhi-Ting Ye, Cheng-Teng Ye, Po-Chang Chen, Sheng-Che Chiou
  • Patent number: 10203528
    Abstract: An optical device is described. This optical device includes an electro-optical material having an X-cut, Y-propagate orientation. In particular, a Y crystallographic direction of the electro-optical material is parallel to an optical waveguide defined in the electro-optic material and an X crystallographic direction of the electro-optical material is parallel to a vertical direction of the optical device. By applying drive signals having an angular frequency to the electro-optic material, the optical device may perform modulation, corresponding to a traveling-wave configuration, of an optical signal based at least in part on the drive signals. where the modulation involves a polarization conversion and a frequency shift. The angular frequency of the drive signals may be selected to approximately cancel electro-optic cross terms in X-Z plane of the electro-optical material. Moreover, an amplitude of the drive signals may be selected so that the optical device emulates a half-wave-plate configuration.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: February 12, 2019
    Assignee: The Regents of the University of California
    Inventors: Sung-Joo Ben Yoo, Chuan Qin, Burcu Ercan, Hongbo Lu
  • Patent number: 10203459
    Abstract: A semiconductor package including: a chip including a pad; an optical device including a pad; a mold configured to encapsulate the optical device and the chip; a wiring pattern configured to electrically connect the optical device and the chip; and an external connection terminal configured to electrically connect the semiconductor package to the outside. The chip includes at least one of: an amplifier circuit configured to process an electrical signal supplied from the optical device; and a driver circuit configured to supply the electrical signal to the optical device.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: February 12, 2019
    Assignee: GIPARANG CO., LTD.
    Inventor: Sang Don Lee
  • Patent number: 10201112
    Abstract: A connector assembly includes: a socket connector and a plug connector. The socket connector includes a main body having a tongue, multiple mating terminals, and a first thermal conduction member. The tongue has two first surfaces arranged opposite to each other. Each mating terminal has a first contact portion, and the first contact portions are exposed from at least one of the first surfaces. The first thermal conduction member has a first mating portion exposed from the at least one first surface provided with the first contact portions. The plug connector includes: a circuit board; a chip provided on the circuit board; a mating joint having an insulating body and multiple conductive terminals provided on the insulating body; and a second thermal conduction member provided on the insulating body. The second thermal conduction member has a second mating portion and a conducting portion thermally conducted with the chip.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: February 5, 2019
    Assignee: LOTES CO., LTD
    Inventors: Ted Ju, Chin Chi Lin
  • Patent number: 10197730
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to optical via connections in chip-to-chip transmission in a 3D chip stack structure using an optical via, and methods of manufacture. The structure has a first wafer, including a first waveguide coupled to an optical resonator in the first wafer, and a second wafer, including a second waveguide, located over the first wafer. The structure also includes an optical via extending between the optical resonator of the first wafer and the second waveguide of the second wafer to optically couple the first and second waveguides.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: February 5, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Yves T. Ngu, Vibhor Jain, John J. Ellis-Monaghan, Sebastian Theodore Ventrone, Saurabh Sirohi
  • Patent number: 10197733
    Abstract: An edge coupling device including a substrate, a buried oxide disposed over the substrate, a cladding material disposed over the buried oxide, where the cladding material includes a trench, an inversely tapered silicon waveguide disposed within the cladding material beneath the trench, and a ridge waveguide disposed within the trench, where the ridge waveguide and the inversely tapered silicon waveguide are vertically-aligned with each other.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: February 5, 2019
    Assignee: Futurewei Technologies, Inc.
    Inventors: Huapu Pan, Zongrong Liu, Hongzhen Wei, Hongmin Chen
  • Patent number: 10193632
    Abstract: Techniques related to optical devices including a high contrast grating (HCG) lens are described herein. In an example, an optical device includes a transparent substrate. A laser emitter or detector at a first side of the transparent substrate to emit or detect a laser light transmitted via the transparent substrate. A HCG lens is at a second side of the transparent substrate to transmit and refract the laser light.
    Type: Grant
    Filed: May 22, 2013
    Date of Patent: January 29, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Wayne Victor Sorin, Michael Renne Ty Tan, David A. Fattal, Sagi Varghese Mathai
  • Patent number: 10191234
    Abstract: A method of aligning an optical fiber with an optical component in a micro-optical sub-assembly, comprises: providing a groove in the micro-sub-assembly in alignment with the optical component; and placing the optical fiber in the groove, thereby aligning the optical fiber with the optical component. In this way a placement tool with an accuracy of 50 microns can be used to place an optical fiber with an alignment accuracy of one micron.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: January 29, 2019
    Assignee: OTX Ltd.
    Inventor: Eli Benoliel
  • Patent number: 10193302
    Abstract: A light engine is disclosed that includes an optical bench with a mirror etched therefrom to form a single, unitary structure. The integrated mirror may therefore be pre-aligned with an associated light path to reduce light path alignment errors. In an embodiment, the optical bench includes a first end extending to a second end along a longitudinal axis, a laser diode disposed on a mounting surface adjacent the first end of the optical bench and configured to output laser light along a first light path that extends substantially along the longitudinal axis, and an integrated mirror device disposed along the light path to receive and direct the laser light along a second light path to optically couple the laser light to a photonically-enabled complementary metal-oxide semiconductor (CMOS) die, the second light path being substantially orthogonal relative to the first light path.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: January 29, 2019
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Justin Lii, Ziliang Cai
  • Patent number: 10180548
    Abstract: An optical transmission substrate of the disclosure includes a wiring substrate and an optical transmission line. The wiring substrate includes one main surface which includes a mounting area for a photoelectric conversion element. The optical transmission line includes a first cladding portion which is disposed on the one main surface of the wiring substrate and has a layer shape, at least one core portion which is disposed on the first cladding portion and has a strip shape, and a second cladding portion which is disposed on a part of the at least one core portion. The optical transmission line includes an end portion which is positioned in the mounting area. The end portion includes a part of the at least one core portion.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: January 15, 2019
    Assignee: Kyocera Corporation
    Inventor: Satoshi Asai
  • Patent number: 10180537
    Abstract: Light from discrete red, blue, and green lasers are combined into a single output using a planar lightwave circuit (PLC). In some embodiments some light from an output of the PLC is reflected back to the lasers, and in some embodiments the reflected light is primarily of one of the red, green, or blue wavelengths. In some embodiments multiple lasers of slightly differing wavelengths are provided as light sources for some or all of the red, blue, and green light.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: January 15, 2019
    Assignee: Kaiam Corp.
    Inventors: John Heanue, Bardia Pezeshki, Henk Bulthuis
  • Patent number: 10177161
    Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a die on a board, attaching a substrate on the die, wherein the substrate comprises a first region and a peripheral region, attaching a first memory device on the central region of the substrate, and attaching at least one additional memory device on the peripheral region of the substrate, wherein the at least one additional memory device is not disposed over the die.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: January 8, 2019
    Assignee: Intel Corporation
    Inventors: Navneet K. Singh, Shanto A. Thomas, Ranjul Balakrishnan
  • Patent number: 10177529
    Abstract: An optical module with a semiconductor element, which integrates a semiconductor laser diode with an electro-absorption modulator, mounted on a carrier; and an optical transmitter apparatus implementing the optical modules are disclosed. The carrier of the optical module has a back metal connected to the ground on the top thereof through a metal provided in a side surface of the carrier but electrically isolated from the chassis ground of the optical transmitter apparatus. The optical transmitter apparatus installs a plurality of the optical modules on a thermos-electric cooler (TEC) in a top plate thereof. The top plate is electrically isolated from the chassis ground.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: January 8, 2019
    Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventor: Masahiro Hirayama
  • Patent number: 10177532
    Abstract: A light emitting element array includes plural light emitting elements connected in parallel to each other by a wiring connected to a terminal configured to supply a current. The number of light emitting elements which have the shortest path length among path lengths on the wiring from the terminal to the respective light emitting elements along a path of the current is one.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: January 8, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Junichiro Hayakawa, Akemi Murakami, Hideo Nakayama, Tsutomu Otsuka
  • Patent number: 10177291
    Abstract: Disclosed are a lens for a light-emitting device usable in a display apparatus or a lighting apparatus, and a method of manufacturing a light-emitting device package. The lens may include a lens body including a light-receiving portion provided in a lower surface of the lens body, a light-emitting portion provided on an upper surface of the lens body, and a recess provided at a center of the upper surface of the lens body, and a flat portion provided in a horizontal shape on a bottom surface of the recess perpendicularly to a main emission line of light emitted from a light-emitting device to emit at least a part of light received through the light-receiving portion, upward. A diameter of the flat portion may be 1/100 to 1/10 of an inlet diameter of the light-receiving portion.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: January 8, 2019
    Assignee: LUMENS CO., LTD.
    Inventors: Seung Hyun Oh, Yun Geon Cho, Young Mi Na, Byeong Cheol Shim, Bo Gyun Kim, Jong Kyung Lee
  • Patent number: 10168473
    Abstract: An optoelectronic device includes an integrated circuit including electronic devices formed on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the semiconductor substrate. A photonics layer is formed on the barrier layer. The photonics layer includes a core for transmission of light and a cladding layer encapsulating the core and including a different index of refraction than the core. The core is configured to couple light generated from a component of the optoelectronic device.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: January 1, 2019
    Assignee: International Business Machines Corporation
    Inventors: Russell A. Budd, Effendi Leobandung, Ning Li, Jean-Olivier Plouchart, Devendra K. Sadana
  • Patent number: 10168495
    Abstract: An optical waveguide includes a laminate including a lower cladding, a core on the lower cladding, and an upper cladding positioned on the lower cladding and covering the core, via holes positioned in the laminate in a spaced opposing relation to each other, a cavity positioned over a span from an upper surface of the upper cladding to the lower cladding, the cavity including a sectional surface sectioning the core obliquely relative to the upper surface of the upper cladding, and a reflective surface positioned in the core and defined by part of the sectional surface, wherein the cavity extends from a region between the via holes in the spaced opposing relation toward the outside of the region, and an opening size of the cavity in the region is smaller than an opening size of the cavity outside the region when viewed in an opposing direction of the via holes.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: January 1, 2019
    Assignee: Kyocera Corporation
    Inventors: Akifumi Sagara, Ai Iwakura
  • Patent number: 10168498
    Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: January 1, 2019
    Assignee: Sony Corporation
    Inventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
  • Patent number: 10162137
    Abstract: A mounting apparatus for mounting an optical element on a wiring board having a reflecting mirror part of an optical waveguide on its back side comprises a mounting table that supports the wiring board by a holding area, a mounting nozzle that holds the optical element and mounts it on the wiring board, a light source that emits light for illuminating the reflecting mirror part by transmission through the holding area, an image pickup apparatus that captures a transmitted light image of the reflecting mirror part, and a control apparatus that determines a mounting position of the optical element based on the transmitted light image, thereby achieving high density mounting without providing a light introducing part for positioning in mounting the optical axis.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: December 25, 2018
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Toru Mizuno, Hiroshi Ikeda, Tatsunori Otomo, Toshinobu Miyagoshi, Shoji Takano, Fumihiko Matsuda, Garo Miyamoto
  • Patent number: 10162112
    Abstract: An optical wire bond apparatus for optically connecting an optical-electrical integrated circuit (OE-IC) to an optical-electrical printed circuit board (OE-PCB) is formed by laser writing cores in a flexible glass support member to define an array of optical waveguides. The support member has a bend section and the waveguides reside close to either a top or bottom surface of the support member at the bend section. The cores have a front-end portion that can be laser written after the front end of the support member is coarse-aligned to optical waveguide structures in the OE-PCB to obtain fine alignment. The support members can be formed from flexible glass sheets or by drawing a glass preform. A photonic assembly that includes the OE-IC and the OE-PCB optically connected using the optical wire bond apparatus is also disclosed.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: December 25, 2018
    Assignee: Corning Optical Communications LLC
    Inventor: James Scott Sutherland
  • Patent number: 10156678
    Abstract: A composite optical waveguide is constructed using an array of waveguide cores, in which one core is tapered to a larger dimension, so that all the cores are used as a composite input port, and the one larger core is used as an output port. In addition, transverse couplers can be fabricated in a similar fashion. The waveguide cores are preferably made of SiN. In some cases, a layer of SiN which is provided as an etch stop is used as at least one of the waveguide cores. The waveguide cores can be spaced away from a semiconductor layer so as to minimize loses.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: December 18, 2018
    Assignee: Elenion Technologies, LLC
    Inventors: Ari Novack, Ruizhi Shi, Michael J. Hochberg, Thomas Baehr-Jones
  • Patent number: 10151878
    Abstract: An optical axis adjustment method for optical interconnection, includes: providing, on a substrate, an optical transmitter including light sources and a mark for acquiring a position of each of the light sources; providing, on the substrate, an optical waveguide including cores each allowing light emitted from the respective light sources to propagate through the core; determining a first position based on the mark as a position of each of the light sources; and forming, at a second position in the optical waveguide corresponding to the first position, first mirrors configured to reflect the light emitted from the respective light sources and make the light propagate through the respective cores.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: December 11, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Kohei Choraku, Akiko Matsui, Tetsuro Yamada, Yoshiyuki Hiroshima
  • Patent number: 10139278
    Abstract: Described herein are optical sensing devices for photonic integrated circuits (PICs). A PIC may comprise a plurality of waveguides formed in a silicon on insulator (SOI) substrate, and a plurality of heterogeneous lasers, each laser formed from a silicon material of the SOI substrate and to emit an output wavelength comprising an infrared wavelength. Each of these lasers may comprise a resonant cavity included in one of the plurality of waveguides, and a gain material comprising a non-silicon material and adiabatically coupled to the respective waveguide. A light directing element may direct outputs of the plurality of heterogeneous lasers from the PIC towards an object, and one or more detectors may detect light from the plurality of heterogeneous lasers reflected from or transmitted through the object.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: November 27, 2018
    Assignee: Aurrion, Inc.
    Inventors: Gregory Alan Fish, Jonathan Edgar Roth, Brandon Buckley
  • Patent number: 10135539
    Abstract: Devices and techniques for integrated optical data communication. A method of encoding symbols in an optical signal may include encoding a first symbol by injecting charge carriers, at a first rate, into a semiconductor device, such as a PIN diode. The method may also include encoding a second symbol by injecting charge carriers, at a second rate, into the semiconductor device. The first rate may exceed the second rate. A modulator driver circuit may include a resistive circuit coupled between supply terminal and drive terminals. The modulator driver circuit may also include a control circuit coupled between a data terminal and the resistive circuit. The control circuit may modulate a resistance of the resistive circuit by selectively coupling one or more of a plurality of portions of the resistive circuit to the drive terminal based on data to be optically encoded.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: November 20, 2018
    Assignee: Massachusetts Institute of Technology
    Inventors: Benjamin Roy Moss, Jason Scott Orcutt, Vladimir Marko Stojanovic