Integrated Optical Circuit Patents (Class 385/14)
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Patent number: 12235492Abstract: A large-scale silicon-photonics-based optical switching system that occupies an area larger than the maximum area of a standard step-and-repeat lithography reticle is disclosed. The system includes a plurality of identical switch blocks, each of is formed in a different reticle field that no larger than the maximum reticle size. Bus waveguides of laterally adjacent switch blocks are stitched together at lateral interfaces that include a second arrangement of waveguide ports that is common to all lateral interfaces. Bus waveguides of vertically adjacent switch blocks are stitched together at vertical interfaces that include a first arrangement of waveguide ports that is common to all vertical interfaces. In some embodiments, the lateral and vertical interfaces include waveguide ports having waveguide coupling regions that are configured to mitigate optical loss due to stitching error.Type: GrantFiled: May 16, 2024Date of Patent: February 25, 2025Assignee: The Regents of the University of CaliforniaInventors: Tae Joon Seok, Ming Chiang A Wu
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Patent number: 12222566Abstract: Alignment aid structures and the method of formation of these structures on an interposer comprised of a planar waveguide layer and a base structure, facilitate the alignment of the optical axes of optical and optoelectrical devices formed from and mounted to the interposer. Alignment aids formed from a common hard mask on the planar waveguide layer of the interposer structure include vertical and lateral alignment structures and fiducials. Optical losses for signals propagating in interposer-based photonic integrated circuits are reduced with effective alignment structures and methods.Type: GrantFiled: June 26, 2023Date of Patent: February 11, 2025Assignee: POET Technologies, Inc.Inventor: Suresh Venkatesan
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Patent number: 12222552Abstract: The present disclosure is directed to photonic wavelength division multiplexing (WDM) receivers with polarization diversity and/or low reflectance. In embodiments, a WDM receiver is provided with a splitter, a plurality of waveguides and a plurality of photodetectors in series. The waveguides having particular equal path lengths relationship from the splitter to respective ones of the photodetectors. In other embodiments, the WDM receiver is provided with a splitter, a looped waveguide, a plurality of photodetectors, and a plurality of variable optical attenuators (VOAs). The VOAs are configured to suppress reflection of signal beams back to the transmitter. In various embodiments, the WDM receiver is a receiver sub-assembly of a silicon photonic transceiver disposed in a silicon package. Other embodiments may be described and/or claimed.Type: GrantFiled: December 23, 2020Date of Patent: February 11, 2025Assignee: Intel CorporationInventors: Duanni Huang, Saeed Fathololoumi, Meer Nazmus Sakib, Mohammad Montazeri Najafabadi, Chaoxuan Ma, David Hui, Taehwan Kim, Ling Liao, Hao Li, Ganesh Balamurugan, Haisheng Rong, Aliasghar Eftekhar
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Patent number: 12216314Abstract: Provided is an optical module having high efficiency in optical coupling to a functional element on a substrate. An optical module includes: a first optical waveguide disposed parallel to a substrate; a condensing mirror configured to reflect and condense light propagated in the first optical waveguide toward the substrate; a second optical waveguide formed in a tapered shape narrowed toward the substrate, the second optical waveguide guiding the light reflected by the condensing mirror to the vicinity of the surface of the substrate; and an optical function unit disposed on the substrate such that the light emitted from the second optical waveguide is incident on the optical function unit.Type: GrantFiled: November 16, 2021Date of Patent: February 4, 2025Assignee: AIO CORE CO., LTD.Inventors: Shigeru Kobayashi, Kazuhiro Shiba, Mitsuru Kurihara, Kazuhiko Kurata
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Patent number: 12219304Abstract: A network element receives a classical header for a quantum payload, and processes the classical header to determine a destination endpoint for the quantum payload. The network element generates a new classical header for the quantum payload based on the destination endpoint. The network element sends the new classical header to a next hop ahead of the quantum payload at a time based on a number of hops between the network element and the destination endpoint.Type: GrantFiled: October 27, 2022Date of Patent: February 4, 2025Assignee: CISCO TECHNOLOGY, INC.Inventors: Alireza Shabani, Bing Qi, Stephen Magno DiAdamo, Glen W. Miller, Ramana Rao Venkata Renuka Kompella
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Patent number: 12211755Abstract: A system may include a wafer that includes ICs and defines cavities. Each cavity may be formed in a BEOL layer of the wafer and proximate a different IC. The system may also include an interposer that includes a transparent layer configured to permit optical signals to pass through. The interposer may also include at least one waveguide located proximate the transparent layer. The at least one waveguide may be configured to adiabatically couple at least one optical signal out of the multiple ICs. Further, the interposer may include a redirecting element optically coupled to the at least one the waveguide. The redirecting element may be located proximate the transparent layer and may be configured to receive the at least one optical signal from the at least one waveguide. The redirecting element may also be configured to vertically redirect the at least one optical signal towards the transparent layer.Type: GrantFiled: May 12, 2023Date of Patent: January 28, 2025Assignee: II-VI DELAWARE, INC.Inventors: Shiyun Lin, Daniel Mahgerefteh, Bryan Park, Jin-Hyoung Lee
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Patent number: 12210197Abstract: A method and system for forming a photonic device. A photonic device may include a substrate, a cladding layer disposed on the substrate, an electrical device region formed within the cladding layer, the electrical device region having a plurality of electrical device component layers that include at least one metal layer, and a grating region formed within the cladding layer, the grating region including a grating coupler and the at least one metal layer. The at least one metal layer is deposited simultaneously in the electrical device and grating regions and is used in the grating region to reflect light emitted from the grating coupler.Type: GrantFiled: September 24, 2020Date of Patent: January 28, 2025Assignee: Lumentum Operations LLCInventors: Guilhem De Valicourt, Michael Kossey
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Patent number: 12204150Abstract: An assembly of two fiber optic ferrules allows for the mating of a CWDM fiber optic ferrule with a non-CWDM fiber optic ferrule. The CWDM fiber optic ferrule has optical fibers that carry optical beams with at least two different wavelengths, which the non-CWDM ferrule has optical fibers that carry only one wavelength. The CWDM fiber optic ferrule and the non-CWDM fiber optic ferrule have optical fibers that are inserted along parallel axes. The non-CWDM fiber optic ferrule has a lens pitch that matches the CWDM ferrule.Type: GrantFiled: December 26, 2023Date of Patent: January 21, 2025Assignee: US Conec Ltd.Inventors: Mitchell Cloud, Darrell R. Childers, D J Hastings
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Patent number: 12197002Abstract: Disclosed are a heterogeneously integrated optical modulator and a manufacturing method thereof. The modulator includes a substrate having a trench, an input waveguide disposed at one side of the trench, an output waveguide disposed at the other side of the trench, a first Mach-Zehnder interferometer including first branch waveguides disposed between the input waveguide and the output waveguide and a heater disposed on one of the first branch waveguides, and second Mach-Zehnder interferometers connected to each of the first branch waveguides.Type: GrantFiled: November 4, 2021Date of Patent: January 14, 2025Assignee: Electronics and Telecommunications Research InstituteInventors: Young-Tak Han, Seoktae Kim, Sang Ho Park, Yongsoon Baek, Jang Uk Shin, Seok Jun Yun, Seo Young Lee
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Patent number: 12191257Abstract: A circuit package is described that includes a photonic interposer, a second interposer, and a die partially overlapping and connected to both the photonic interposer and the second interposer.Type: GrantFiled: January 8, 2024Date of Patent: January 7, 2025Assignee: CELESTIAL AI INC.Inventor: Ankur Aggarwal
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Patent number: 12189183Abstract: A structure includes a polarization device such as a polarization splitter, a polarization combiner or a polarization splitter rotator including a waveguide having a light absorber at an end section with an at least hook shape, e.g., it can be hooked or spiral shape. The structure also includes another waveguide adjacent the stated waveguide. The hook or spiral shape acts as a light absorber that reduces undesired optical noise such as excessive light insertion loss and/or light scattering. The hook or spiral shape may also be used on supplemental waveguides used to further filter and/or refine an optical signal in one of the waveguides of the polarization device, e.g., downstream of an output section of the polarization splitter and/or rotator.Type: GrantFiled: October 13, 2022Date of Patent: January 7, 2025Assignee: GlobalFoundries U.S. Inc.Inventors: Yusheng Bian, Won Suk Lee, Andreas D. Stricker
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Patent number: 12181724Abstract: Disclosed are apparatus and methods for optical interconnections that include the integration of a photonics die (pDie) and an electronic die (eDie) with a socket layer, waveguides and fiber connectors to enable high bandwidth communications. In one embodiment, an exemplary optical interconnect device includes an electronic die coupled to a photonics die and integrated with a substrate, a socket, a board, a pair of micro-lenses and a mirror coupled to a waveguide, which can be embedded in the board. In another embodiment, the waveguide is embedded in a socket layer and coupled to a fiber connector. In these embodiments, the exemplary optical interface device can be coupled one more other optical interconnect devices via a waveguide array and/or a fiber array.Type: GrantFiled: May 28, 2021Date of Patent: December 31, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Stefan Rusu, Wei-Wei Song, Mohammed Rabiul Islam, Chih-Tsung Shih
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Patent number: 12174422Abstract: A second core includes a first portion, a second portion, and a bending portion. In the first portion, a wave-guiding direction is a first direction parallel to a plane of a first substrate. In the second portion, a wave-guiding direction is a second direction that is at a predetermined angle with respect to the plane of the first substrate. For example, in the second portion, the wave-guiding direction is the second direction that is at substantially 90 degrees with respect to the plane of the first substrate. The bending portion connects the first portion and the second portion. A relative refractive index difference between the second core and a cladding of the second optical waveguide preferably has a value such that the propagation loss in the bending portion is equal to or smaller than 0.1 dB.Type: GrantFiled: August 23, 2019Date of Patent: December 24, 2024Assignee: Nippon Telegraph and Telephone CorporationInventors: Makoto Abe, Atsushi Aratake
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Patent number: 12174421Abstract: A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described. The connected circuits, together comprising a photonic integrated circuit, are electrically tested using electrical signals that are provided via probing contact pads on the PIC die. Electrical activation of the optoelectrical sending devices and the subsequent detection and measurement of the optical signals in the receiving devices, in embodiments, provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.Type: GrantFiled: March 6, 2023Date of Patent: December 24, 2024Assignee: POET Technologies, Inc.Inventors: Suresh Venkatesan, Yee Loy Lam
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Patent number: 12174440Abstract: An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer/deserializer circuits, transceivers, clocking circuitry, and/or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electrically connected to the integrated switch ASIC.Type: GrantFiled: July 29, 2022Date of Patent: December 24, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Rabiul Islam, Stefan Rusu, Nick Samra
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Patent number: 12176958Abstract: Provided is a device which includes a method for the coherent detection of an optical signal, including the following steps of providing a vertically illuminable photodiode; producing an optical reference signal; radiating the optical signal and the reference signal into the photodiode in such a way that the two signals at least partially interfere with each other. Radiating the optical signal into the photodiode is effected via a first side of the photodiode, and radiating the reference signal into the photodiode is effected via a second side of the photodiode, or, vice versa, the reference signal is radiated into the photodiode via the first side of the photodiode and the optical signal is radiated into the photodiode via the second side.Type: GrantFiled: February 26, 2021Date of Patent: December 24, 2024Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.Inventors: Patrick Runge, Francsico Soares, Pascal Rustige, Jan Krause
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Patent number: 12171089Abstract: A light-source apparatus includes a light-source chip, a case, first and second electrically-conductive parts, a substrate, an electromagnetic shield plate, an electrically-conductive layer and an electrically-conductive unit. The light-source chip is received in the case. Each of the first and second electrically-conductive parts is a part of the case. The case is mounted to the substrate. The electromagnetic shield plate covers at least part of the substrate. The electrically-conductive layer is formed on the substrate and electrically connected with both the second electrically-conductive part and the electromagnetic shield plate. The electrically-conductive unit is provided to electrically connect the first electrically-conductive part and the electromagnetic shield plate.Type: GrantFiled: July 22, 2021Date of Patent: December 17, 2024Assignee: DENSO CORPORATIONInventor: Kosuke Niimura
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Patent number: 12164150Abstract: In part, in one aspect, the disclosure relates to a method for passivating a waveguide of an optical circuit. The method includes etching a suspended waveguide in the optical circuit; the suspended waveguide having a top surface, a bottom surface, and side surfaces; and covering the top surface and side surfaces of the suspended waveguide with a passivation coating having a thickness that ranges from between about 10 nm to about 20 nm. In one embodiment, the method further includes removing one or more coatings from a portion of the optical circuit. The disclosure also relates to various passivated optical silicon circuit embodiments.Type: GrantFiled: July 12, 2021Date of Patent: December 10, 2024Assignee: CISCO TECHNOLOGY, INC.Inventors: Li Chen, Long Chen, Christopher Doerr
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Patent number: 12164148Abstract: A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described. The connected circuits, together comprising a photonic integrated circuit, are electrically tested using electrical signals that are provided via probing contact pads on the PIC die. Electrical activation of the optoelectrical sending devices and the subsequent detection and measurement of the optical signals in the receiving devices, in embodiments, provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.Type: GrantFiled: March 27, 2023Date of Patent: December 10, 2024Assignee: POET Technologies, Inc.Inventors: Suresh Venkatesan, Yee Loy Lam
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Patent number: 12153253Abstract: An optical device includes a waveguide configured to guide light, a taper integrated with the waveguide on a substrate configured for optical coupling, and an attenuator to degrade unwanted optical signal from the taper. The attenuator extends along one side of the taper, and includes one of a conductive structure, a doped structure and a refractive structure.Type: GrantFiled: July 21, 2023Date of Patent: November 26, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, Feng Wei Kuo
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Patent number: 12149051Abstract: In an example embodiment, a system includes a first grating-coupled laser (GCL) that includes a first laser cavity optically coupled to a first transmit grating coupler configured to redirect horizontally-propagating first light, received from the first laser cavity, vertically downward and out of the first GCL. The system also includes a second GCL that includes a second laser cavity optically coupled to a second transmit grating coupler configured to transmit second light vertically downward and out of the second GCL. The system also includes a photonic integrated circuit (PIC) that includes a first receive grating coupler optically coupled to a first waveguide and configured to receive the first light and couple the first light into the first waveguide. The PIC also includes a second receive grating coupler optically coupled to a second waveguide and configured to receive the second light and couple the second light into the second waveguide.Type: GrantFiled: July 19, 2023Date of Patent: November 19, 2024Assignee: II-VI DELAWARE, INC.Inventors: Shiyun Lin, Daniel Mahgerefteh
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Patent number: 12140825Abstract: An optical communication device is configured to include: a laser diode that outputs light; an EA modulator including a cathode and an anode, to modulate the light output from the laser diode on the basis of a high-frequency signal applied between the cathode and the anode; a resistor connected between the cathode and the anode; and a pattern line connected in series with the resistor and having an inductance component, in which each of the laser diode and the EA modulator is formed on a front surface of the high-frequency line substrate or a back surface of the high-frequency line substrate, and the pattern line is formed on a side face of the high-frequency line substrate.Type: GrantFiled: November 4, 2021Date of Patent: November 12, 2024Assignee: MITSUBISHI ELECTRIC CORPORATIONInventor: Nobuo Ohata
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Patent number: 12136797Abstract: The upper surface of the semiconductor substrate has a slope descending from the projection in the second direction at an angle of 0-12° to a horizontal plane. The mesa stripe structure has an inclined surface with a slope ascending from the upper surface of the semiconductor substrate at an angle of 45-55° to the horizontal plane, the mesa stripe structure having an upright surface rising from the inclined surface at an angle of 85-95° to the horizontal plane. The buried layer is made from semiconductor with ruthenium doped therein and is in contact with the inclined surface and the upright surface. The inclined surface is as high as 80% or less of height from the upper surface of the semiconductor substrate to a lower surface of the quantum well layer and is as high as 0.3 ?m or more.Type: GrantFiled: September 17, 2021Date of Patent: November 5, 2024Assignee: Lumentum Operations LLCInventors: Takafumi Taniguchi, Shigenori Hayakawa, Yasushi Sakuma
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Patent number: 12128729Abstract: An optical transceiver includes a silicon photonics substrate and multiple devices. The devices are configured to process optical signals propagating to and from the optical transceiver, and to perform at least one of an optical-to-electrical conversion of received optical signals to incoming electric signals and an electrical-to-optical conversion of outgoing electric signals to transmitted optical signals. The devices are each fabricated to include respectively a package substrate configured according to one of multiple different package substrate mounting technologies. Each package substrate among the multiple devices is mounted on the silicon photonics substrate according to mounting requirements of the respective package substrate mounting technology of that package substrate. At least two of the package substrates are mounted according to the mounting requirements of different package substrate mounting technologies.Type: GrantFiled: October 13, 2023Date of Patent: October 29, 2024Assignee: Marvell Asia Pte LtdInventors: Ding Liang, Mark Patterson, Roberto Coccioli, Radhakrishnan L. Nagarajan
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Patent number: 12113081Abstract: The package structure having packaged components within includes a circuit board, multiple packaged light detecting components mounted on the circuit board, a sealing cap being light transmittable, multiple light filtering films mounted on the sealing cap, and a supporting annular wall. The two opposite ends of the supporting annular wall are adhesively bonded to the surfaces of the circuit board and the sealing cap, such that the projection on the circuit board of the light filtering films corresponds the packaged light detecting components. Since the light filtering films have different filtering frequency bands, each packaged light detecting component detects light of different frequency bands in one incident light beam. The package method is simple and stable, effectively lowering the manufacture cost of the light detecting module.Type: GrantFiled: December 3, 2021Date of Patent: October 8, 2024Assignee: TAIWAN REDEYE BIOMEDICAL INC.Inventors: Shuo-Ting Yan, Chen-Chung Chang, Tsung-Jui Lin
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Patent number: 12111207Abstract: Embodiments are directed to optical measurement systems that utilize multiple emitters to emit light during a measurement, as well as methods of performing measurements using these optical measurement systems. The optical measurement systems may include a light generation assembly that is configured to generate light via a light source unit, and a photonic integrated circuit that includes a launch group having a plurality of emitters. Each of these emitters is optically coupled to the light generation assembly to receive light generated from the light generation assembly, and may emit this light from a surface of the photonic integrated circuit. The optical measurement system may perform a measurement in which the light generation assembly generates light and each of the plurality of emitters simultaneously emit light received from the light generation assembly.Type: GrantFiled: August 16, 2023Date of Patent: October 8, 2024Assignee: APPLE INC.Inventors: Matthew A Terrel, David S Gere, Alexander F Sugarbaker, Thomas C Greening, Jason S Pelc, Mark A. Arbore
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Patent number: 12107391Abstract: A semiconductor optical element has a mesa structure in which an active layer is embedded, and comprises a straight propagating section and a spot size converter section being such that a light confinement in the active layer is weaker than that of the straight propagating section, wherein in a same plane parallel to a layer surface of the active layer, an average value of a width of the mesa structure of the straight propagating section is smaller than a value of the width of the mesa structure at the emission facet of the spot size converter section, and at a top part of the mesa structure, an electrode is formed so that an electric current is injected in the active layer across the entire length of the straight propagating section and the spot size converter section.Type: GrantFiled: April 27, 2020Date of Patent: October 1, 2024Assignee: Mitsubishi Electric CorporationInventor: Ayumi Fuchida
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Patent number: 12099245Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, where the package substrate comprises a recessed edge. In an embodiment, a compute die is on the package substrate, and an optics die on the package substrate and overhanging the recessed edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, a lid covers the recess in the package substrate.Type: GrantFiled: December 17, 2020Date of Patent: September 24, 2024Assignee: Intel CorporationInventors: Asako Toda, Chia-Pin Chiu, Xiaoqian Li, Yiqun Bai
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Patent number: 12100926Abstract: An embodiment of the present invention provides a photodetector chip, including a substrate, a semiconductor optical amplification section, and a photodetection section. The substrate includes a surface, the photodetection section and the semiconductor optical amplification section are arranged on the substrate, and the photodetection section is located in an optical signal output direction of the semiconductor optical amplification section. The semiconductor optical amplification section amplifies and filters an input optical signal to output an amplified and filtered optical signal to the photodetection section. The photodetection section is configured to convert the amplified and filtered optical signal into an electrical signal. The semiconductor optical amplification section includes a grating, the grating includes a first grating and a second grating that are cascaded, and the first grating is a slanted grating.Type: GrantFiled: April 29, 2021Date of Patent: September 24, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yuanbing Cheng, Heng Wang, Jing Dai, Yinghua Dong
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Patent number: 12092874Abstract: A silicon photonic package and a method of fabricating the package are disclosed. The silicon photonic package includes an optical waveguide structure, a heat dissipation structure, a plastic encapsulation layer, first and second structures. The optical waveguide structure is a right trapezoidal structure, and a surface where a non-right angle leg thereof is a totally reflecting surface capable of totally reflecting an optical signal that enters the optical waveguide structure from a surface where a right angle leg is disposed in a direction parallel to bases to a plane where a front face of the plastic encapsulation layer is disposed. The heat dissipation structure and the optical waveguide structure are spaced apart from each other and both embedded in the plastic encapsulation layer. The optical waveguide structure of the present invention allows a great reduction in loss of an optical signal incurred by its propagation in the optical waveguide structure.Type: GrantFiled: September 20, 2022Date of Patent: September 17, 2024Assignee: OIP TECHNOLOGY PTE LTD.Inventor: Yonggang Jin
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Patent number: 12092871Abstract: A device has a plurality of waveguide structures including two active (one of which comprises two sub-layers), two passive, and three intermediate waveguide structures on a common substrate. At least partial butt coupling between active and intermediate waveguide structures, and tapering in the intermediate and/or passive waveguide structures at each junction therebetween facilitates efficient optical mode transformations as optical signals travel through the device, either from a first sub-layer of the first active waveguide structure through the other sub-layer, then sequentially though a first intermediate waveguide structure, a passive waveguide structure, a second intermediate waveguide structure, a second active waveguide structure, a third intermediate structure, and a second passive waveguide structure; or in reverse from the second passive waveguide structure back through to the first sub-layer of the first active waveguide structure.Type: GrantFiled: January 12, 2022Date of Patent: September 17, 2024Assignee: NEXUS PHOTONICS LLCInventors: Aditya Malik, Hyun Dai Park, Tin Komljenovic
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Patent number: 12092867Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: GrantFiled: December 1, 2023Date of Patent: September 17, 2024Assignee: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Patent number: 12092884Abstract: An optical transceiver includes housing, connector coupler and internal optical connector. Opening of housing is located on a side of housing and connected to accommodation space of housing. Connector coupler includes positioning frame and at least one elastic holding arm. Elastic holding arm protrudes from positioning frame and forms holding space. Positioning frame is located between at least a part of elastic holding arm and opening. Positioning frame is disposed in accommodation space. Positioning recess is located on a side of positioning frame close to opening and connected to holding space. At least a part of internal optical connector is located in holding space to be held in position by elastic holding arm. Positioning recess is configured to position external optical connector so as to allow internal optical connector to be plugged with and optically coupled to external optical connector.Type: GrantFiled: December 6, 2022Date of Patent: September 17, 2024Assignee: Global Technology Inc.Inventors: Gaofei Yao, Qilin Hong, Yi Lin, PengBin Lin
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Patent number: 12092873Abstract: An optical fiber coupler includes a plurality of optical fibers parallel to each other in a first direction, an optical fiber array block (FAB) configured to maintain a constant center-to-center distance between the plurality of optical fibers, and an optical waveguide block including a plurality of optical waveguides coupled to the plurality of optical fibers, respectively, and configured to transfer optical signals transmitted through the plurality of optical fibers connected to the optical FAB in a second direction in which a photonics chip is placed and which is different from the first direction.Type: GrantFiled: January 28, 2022Date of Patent: September 17, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Sae-Kyoung Kang, Joon Young Huh, Joon Ki Lee
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Patent number: 12089330Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on surface of the insulating layer and including a conductor pad, a covering layer covering a portion of the insulating layer, an optical waveguide positioned on the surface of the insulating layer and including core part, and a conductor post including plating metal and formed on the conductor pad such that the post is penetrating through the covering layer and connected to a component. The insulating layer has component region covered by the component when the component is connected, the core part has side surface extending in direction along the surface of the insulating layer, the side surface has an exposed portion exposed in the component region and facing the opposite direction with respect to the insulating layer, and distance between the exposed portion and the surface of the insulating layer is greater than thickness of the covering layer.Type: GrantFiled: June 28, 2022Date of Patent: September 10, 2024Assignee: IBIDEN CO., LTD.Inventor: Masatoshi Kunieda
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Patent number: 12078484Abstract: A sensing component of a gyroscope and an opto-MEMS gyroscope comprising said sensing component are provided, the sensing component comprising, a frame; a proof mass configured to be displaced in response to a Coriolis force applied to the sensing component; and a photonic crystal cavity comprising, a first photonic crystal coupled to the proof mass; and a second photonic crystal coupled to the frame; wherein the first and second photonic crystals each comprises an array of holes formed thereon; wherein the photonic crystal cavity is configured to generate an optical output in response to the Coriolis force, and wherein the sensing component is configured to measure the Coriolis force based on changes in the optical output.Type: GrantFiled: September 22, 2022Date of Patent: September 3, 2024Assignee: ANYON TECHNOLOGIES PTE. LTD.Inventors: Hongbo Zhang, Hengjiang Ren, Jie Luo
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Patent number: 12080651Abstract: Various three-dimensional devices that can be formed within the bulk of a semiconductor by photo-controlled selective etching are described herein. With more particularity, semiconductor devices that incorporate three-dimensional electrical vias, waveguides, or fluidic channels that are disposed within a semiconductor are described herein. In an exemplary embodiment, a three-dimensional interposer chip includes an electrical via, a waveguide, and a fluidic channel, wherein the via, the waveguide, and the fluidic channel are disposed within the body of a semiconductor element rather than being deposited on a surface. The three-dimensional interposer is usable to make electrical, optical, or fluidic connections between two or more devices.Type: GrantFiled: March 27, 2019Date of Patent: September 3, 2024Assignee: NIELSON SCIENTIFIC, LLCInventor: Gregory Nolan Nielson
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Patent number: 12067456Abstract: A system for entanglement-enhanced machine learning with quantum data acquisition includes a first variational circuit that generates a plurality of entangled probe light fields that interacts with a sample and is then processed by a second variational quantum circuit to produce at least one detection light field, a detector is used to measure a property of the at least one detection light field, and the first and second variational quantum circuits are optimized though machine learning. A method for entanglement-enhanced machine learning with quantum data acquisition includes optimizing a setting of a first and second variational quantum circuits, which includes probing a training-set with a plurality of entangled probe light fields generated by the first variational quantum circuit, and measuring a phase property of at least one detection light fields generated by the second variational quantum circuit from the plurality of entangled probe light fields after interaction with the training-set.Type: GrantFiled: November 19, 2020Date of Patent: August 20, 2024Assignee: Arizona Board of Regents on Behalf of the University of ArizonaInventors: Quntao Zhuang, Zheshen Zhang
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Patent number: 12069888Abstract: An organic light emitting display substrate includes: a base substrate; organic light emitting diodes disposed on the base substrate, with each organic light emitting diode including a first electrode layer, an organic light emitting layer and a second electrode layer, and the first electrode layer and the second electrode layer forming an optical resonant cavity; and a nanoparticle layer on a side of the organic light emitting diodes away from the base substrate and includes nanoparticle patterns, each nanoparticle pattern is disposed on a side of a second electrode layer of a corresponding one of the plurality of organic light emitting diodes away from an organic light emitting layer and at least partially covers the second electrode layer. Resonance mode of the nanoparticle pattern is coupled with a resonance mode of an optical resonant cavity of the corresponding organic light emitting diode to form a Fano resonance.Type: GrantFiled: February 22, 2021Date of Patent: August 20, 2024Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Feng Wang, Ziyu Zhang
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Patent number: 12066671Abstract: A semiconductor device includes a plurality of intermediate waveguides. The plurality of intermediate waveguides are vertically disposed on top of one another, and vertically adjacent ones of the plurality of intermediate waveguides are laterally offset from each other. When viewed from the top, each of the plurality of intermediate waveguides essentially consists of a first portion and a second portion, the first portion has a first varying width that increases from a first end of the corresponding intermediate waveguide to a middle of the corresponding intermediate waveguide, and the second portion has a second varying width that decreases from the middle of the corresponding intermediate waveguide to a second end of the corresponding intermediate waveguide.Type: GrantFiled: May 26, 2022Date of Patent: August 20, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Cheng-Tse Tang, Chewn-Pu Jou, Chih-Wei Tseng, Hsing-Kuo Hsia, Ming Yang Chung
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Patent number: 12055772Abstract: An optical interconnect for optically coupling at least a first optical integrated circuit and a second optical integrated circuit. The optical interconnect comprises at least two layers of optically transparent material. There is a first optical waveguide arranged along a surface of a first one of the at least two layers of optically transparent material. There is further a first non-guided optical path extending from the first optical waveguide through the at least two layers of optically transparent material. A first reflective element is arranged to receive light from at least one of the first non-guided optical path and the first optical waveguide and direct the light to the other of the first non-guided optical path and the first optical waveguide. At least one lens is arranged at a boundary between two of the at least two layers of optically transparent material. The at least one lens is arranged to receive and focus light travelling along the first non-guided optical path.Type: GrantFiled: December 18, 2018Date of Patent: August 6, 2024Assignee: Telefonaktiebolaget LM Ericsson (publ)Inventors: Francesco Testa, Marco Romagnoli, Luigi Tallone
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Patent number: 12055777Abstract: A multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. The main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die has physical-layer circuits that directly drive the optical engine. An optical cable can be connected directly to the optical engine of the multichip package.Type: GrantFiled: April 18, 2022Date of Patent: August 6, 2024Assignee: Intel CorporationInventors: Peng Li, Joel Martinez, Jon Long
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Patent number: 12055773Abstract: An alignment optical circuit includes: a plurality of grating couplers that are formed on a substrate and arranged on a line; a plurality of optical waveguides that are connected to the plurality of grating couplers, respectively. Further, the alignment optical circuit includes an optical sensor that is formed on the substrate and measures optical intensity at a first light-receiving spot and a second light-receiving spot on a line along an arrangement direction of the plurality of grating couplers.Type: GrantFiled: December 3, 2019Date of Patent: August 6, 2024Assignee: Nippon Telegraph and Telephone CorporationInventors: Toru Miura, Yoshiho Maeda, Hiroshi Fukuda
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Patent number: 12044857Abstract: A hybrid reflective/refractive HMD includes a structural frame, refractive optical lens elements, and optics housings coupled to the structural frame and positioned in front of a user's first and second eyes. Light-emitting visual sources and reflective optical surfaces are contained in the optics housings. Visual content is transmitted from light-emitting visual sources to the reflective optical surfaces. The visual content is reflected within the reflective optical surfaces at least four times without passing through a refractive optical lens element. The visual content is transmitted to the user's first eye or the user's second eye. Simultaneous with the transmission of the visual content to the user's first eye or the user's second eye, a real-world view of the outside surrounding environment is transmitted to the user's first eye or the user's second eye. The visual content is overlaid onto the real-world view of the outside surrounding environment.Type: GrantFiled: November 30, 2021Date of Patent: July 23, 2024Inventor: Douglas Peter Magyari
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Patent number: 12044892Abstract: A semiconductor package includes a first interposer having a first substrate, a first redistribution structure over a first side of the first substrate, and a first waveguide over the first redistribution structure and proximate to a first side of the first interposer, where the first redistribution structure is between the first substrate and the first waveguide. The semiconductor package further includes a photonic package attached to the first side of the first interposer, where the photonic package includes: an electronic die, and a photonic die having a plurality of dielectric layers and a second waveguide in one of the plurality of dielectric layers, where a first side of the photonic die is attached to the electronic die, and an opposing second side of the photonic die is attached to the first side of the first interposer, where the second waveguide is proximate to the second side of the photonic die.Type: GrantFiled: March 24, 2022Date of Patent: July 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chen-Hua Yu, Hsing-Kuo Hsia
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Patent number: 12040321Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.Type: GrantFiled: September 20, 2022Date of Patent: July 16, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsiang-Cheng Tsai, Ying-Chung Chen
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Patent number: 12038616Abstract: A photonic system includes a light source and a photonic structure. The photonic structure includes an optical transmission structure and an optical absorption structure. The optical transmission structure is configured to transmit light associated with a first wavelength range. The optical absorption structure is configured to absorb light associated with a second wavelength range. The light source is configured to provide a light beam with a wavelength that is within the second wavelength range to the optical absorption structure. The optical absorption structure is configured to generate and provide heat to the optical transmission structure when the light beam falls incident on the optical absorption structure.Type: GrantFiled: July 14, 2023Date of Patent: July 16, 2024Assignee: VIAVI Solutions Inc.Inventor: William D. Houck
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Patent number: 12032268Abstract: An optical modulator in which an optical signal is input from one side of a package, includes in the package, a chip that optically modulates the optical signal and in which an input waveguide and an output waveguide of the optical signal are led to mutually different destinations each being one end of the chip facing the one side of the package and a side surface of the chip orthogonal to the one end of the chip; an input optical system coupled to the input waveguide of the chip; and an output optical system coupled to the output waveguide of the chip.Type: GrantFiled: February 5, 2021Date of Patent: July 9, 2024Assignee: FUJITSU OPTICAL COMPONENTS LIMITEDInventors: Shinji Maruyama, Shuntaro Makino, Yoshimitsu Sakai, Yoshinobu Kubota
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Patent number: 12025833Abstract: Provided is an optical waveguide element that prevents leaked light generated at a forking section from entering a downstream optical waveguide such as another forking section, thereby affording minimal degradation of optical characteristics. The optical waveguide is characterized in that: at least one of two fork waveguides (20a, 20b) forking from a first forking section (20) comprises a second forking section (21, 22); slab waveguides (3c-1 to 3c-3) are formed between the two fork waveguides; and between the first forking section and the second forking section, slits (41, 42) are formed that partition the slab waveguides into a first slab waveguide area (3c-1) close to the first forking section and second slab waveguide areas (3c-2, 3c-3) close to the second forking section(s).Type: GrantFiled: September 23, 2020Date of Patent: July 2, 2024Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Yu Kataoka, Norikazu Miyazaki
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Patent number: 12007602Abstract: In an integrated optical device, squeezed light is used internally to effectively increase an optical modulation effect. One exemplary device operates by squeezing the light at the input, then sending it through an electro-optic stage where its phase picks up the signal of interest, and finally anti-squeezing it to obtain a displaced coherent state. Thus the displacement is amplified by the level of squeezing that is achieved inside the device and it is thereby less sensitive to loss. Since this device behaves simply as an electro-optic modulator, albeit one with an exponentially enhanced sensitivity, no extra considerations are needed to integrate the modulator into a system. Such devices can be operated as modulators or as sensors, and can make use of optical phase shift effects other than the electro-optic effect.Type: GrantFiled: May 9, 2022Date of Patent: June 11, 2024Assignee: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Amir H. Safavi-Naeini, Timothy Patrick McKenna, Hubert S. Stokowski