Integrated Optical Circuit Patents (Class 385/14)
  • Patent number: 10723614
    Abstract: A device, such as a MEMS device, with stress tuning to achieve a desired stack stress across the wafer. The stress tuning includes trimming a stress compensation layer over a target layer having different stresses in different target layer regions. The trimming may include ion beam trimming to produce a stress compensation layer having different thicknesses over the different target layer regions to balance the stress of the target layer to a desired stress. The desired stress may result in almost zero residual stress to produce an almost flat MEMS device.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: July 28, 2020
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
    Inventors: You Qian, Humberto Campanella Pineda, Rakesh Kumar, Rajesh Nair
  • Patent number: 10727944
    Abstract: Methods and systems for optoelectronics transceivers of a CMOS chip are disclosed and may include receiving optical signals from optical fibers via grating couplers, which may include a guard ring. A CW optical signal may be received from a laser source via optical couplers, and may be modulated using optical modulators, which may be Mach-Zehnder and/or ring modulators. Circuitry in the CMOS chip may drive the optical modulators. The modulated optical signal may be communicated out of the CMOS chip into optical fibers via grating couplers. The received optical signals may be communicated between devices via waveguides. The photodetectors may include germanium waveguide photodiodes, avalanche photodiodes, and/or heterojunction diodes. The CW optical signal may be generated using an edge-emitting and/or a vertical-cavity surface emitting semiconductor laser.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: July 28, 2020
    Assignee: Luxtera LLC.
    Inventors: Thierry Pinguet, Steffen Gloeckner, Sherif Abdalla, Sina Mirsaidi, Peter De Dobbelaere, Lawrence C. Gunn, III
  • Patent number: 10725254
    Abstract: A high density interconnect arrangement takes the form of a backplane-pluggable card, with electrical connections formed along a single (pluggable) edge and all remaining connections provided via optical fibers. An exemplary interconnect arrangement also includes on-board optical sources and silicon photonic-based circuitry for providing optical transceiver functionality. Passively aligned fiber arrays are utilized to provide I/O connections to external elements, as well as between laser sources and on-board silicon photonics.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: July 28, 2020
    Assignee: Aayuna Inc.
    Inventors: Kalpendu Shastri, Anujit Shastri, Soham Pathak, Bipin Dama, Alan Leonhartsberger, Rao Yelamarty
  • Patent number: 10725242
    Abstract: One example includes an apparatus that includes a plurality of input/output (I/O) ports and a body portion. The plurality of I/O ports can be arranged at a plurality of peripheral surfaces of the body portion. The body portion includes a solid dielectric material having a substantially constant index of refraction. The body portion also includes parallel planar surfaces spaced apart by and bounded by the plurality of peripheral surfaces. The solid dielectric material in the body portion can be writable via a laser-writing process to form an optical waveguide extending between a set of the plurality of I/O ports.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: July 28, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Raymond G. Beausoleil, Marco Fiorentino, Jason Pelc, Charles M. Santori, Terrel L. Morris
  • Patent number: 10725324
    Abstract: A photonic transmitter is provided, including a laser source including a first waveguide made of silicon and a second waveguide made of III-V gain material, the waveguides being separated from each other by a first segment of a dielectric layer; and a phase modulator including a first electrode made of single-crystal silicon and a second electrode made of III-V crystalline material, separated from each other by a second segment of the dielectric layer, where a thickness of the dielectric layer is between 40 nm and 1 ?m, where a thickness of a dielectric material in an interior of the first segment is equal to the thickness of the dielectric layer, and where a thickness of the dielectric material in an interior of the second segment is between 5 nm and 35 nm, a rest being formed by a thickness of semiconductor material.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: July 28, 2020
    Assignee: Commissariat A L'Energie Atomique et aux Energies Alternatives
    Inventors: Karim Hassan, Yohan Desieres, Bertrand Szelag
  • Patent number: 10721000
    Abstract: Intrapersonal communication systems and methods that provide an optical digital signal link between two or more local devices are disclosed. In some embodiments, the system includes a first signal converter disposed at a first end of the optical digital signal link and configured to convert between electrical digital signals from a first local device and optical digital signals from the optical digital signal link. The system can include an optical connector having a non-contact portion configured to couple optical digital signals between the first signal converter and the optical digital signal link across a gap. The system can include a second signal converter disposed at a second end of the optical digital signal link and configured to convert between electrical digital signals from the second local device and optical digital signals from the optical digital signal link.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: July 21, 2020
    Assignee: N2 Imaging Systems, LLC
    Inventor: David Michael Masarik
  • Patent number: 10705302
    Abstract: A photonic integrated circuit package includes a first substrate including a first mirror and an optical coupling device spaced apart from each other, and a second substrate on an upper portion of the first substrate, the second substrate including an electro-optical converter and a second mirror, the electro-optical converter to output an optical signal to the first mirror, and the second mirror to reflect an optical signal reflected by and received from the first mirror to the optical coupling device.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ho Chul Ji, Keun Yeong Cho
  • Patent number: 10699559
    Abstract: The present invention relates to an optical transceiver, comprising an optical converter circuit (24) comprising an optoelectronic device (26), an electronic appliance (30) generating data, and circuitry (28) configured to control the optoelectronic device (26) and the electronic appliance (30). The optoelectronic device (26) is configured to, upon receiving an incoming optical beam, convert the optical beam into electrical energy. The optoelectronic device (26) is further configured to emit optical pulses, wherein emission of the optical pulses is induced by the incoming optical beam through photo-induced electro-luminescence (PIEL), wherein the optical pulses based on photo-induced electro-luminescence comprise the data generated by the electronic appliance (30).
    Type: Grant
    Filed: September 4, 2017
    Date of Patent: June 30, 2020
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Martinus Bernardus Van Der Mark, Klaas Cornelis Jan Wijbrans, Gerhardus Wilhelmus Lucassen
  • Patent number: 10698291
    Abstract: An apparatus has N optical structures positioned on a two-dimensional lattice defining a plane. The N optical structures are configured to redirect light out of the plane. The N optical structures are collectively arranged in a configuration that includes select elements on the two-dimensional lattice. N optical waveguides are integrated in the plane to individually supply optical power to each of the N optical structures.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: June 30, 2020
    Assignee: Quanergy Systems, Inc.
    Inventors: Oleksandr Zhuromskyy, Louay Eldada
  • Patent number: 10690857
    Abstract: An optical coupling system includes a first waveguide that includes a first waveguide end, a second waveguide end. The optical coupling system includes a first lens that is aligned with a first optical fiber. The optical coupling system includes a first lens holder that retains the first lens. The lens holder includes a waveguide retention portion on which the first waveguide end is positioned such that the first waveguide end is aligned with the first lens. The optical coupling system includes a second lens that is aligned with a first optical component. The optical coupling system includes a second lens holder that retains the second lens. The second lens holder includes a waveguide retention portion on which the second waveguide end is positioned such that the second waveguide end is aligned with the second lens.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: June 23, 2020
    Assignee: II-VI Delaware Inc.
    Inventors: Jiashu Chen, Yuxin Zhou
  • Patent number: 10693206
    Abstract: A nonreciprocal device includes a waveguide through which waves at a first frequency propagate with a first wavevector and with a second wavevector in a direction opposite to the first wavevector; a frequency-dependent device that operates within a frequency range and modifies the waves through the waveguide in a way that is dependent on the first frequency; and a set of couplers to couple the waveguide and the frequency-dependent device. Coupling rates of the set of couplers are modulated to enable nonreciprocal coupling, with respect to the frequency-dependent device, of the first wavevector compared to the second wavevector.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: June 23, 2020
    Assignee: Board of Trustees of the University of Illinois
    Inventors: Gaurav Bahl, Christopher Peterson
  • Patent number: 10678080
    Abstract: A display device including a display panel having an active area to display an image, and an inactive area provided with a pattern disposed thereto to apply an electrical signal to the active area, a side cover having a peripheral frame disposed at an outer portion of the display panel to form a side portion exterior of the display device, and a support frame extended from the peripheral frame to be disposed at a rear of the display panel and supporting the display panel, and a black matrix disposed at a front of the inactive area to hide a pattern of the inactive area.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: June 9, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Soo Jung, Woo Young Kan, Sang Hak Kim, Doo Soon Park, Hyun Jun Jung
  • Patent number: 10678115
    Abstract: A Mach-Zehnder waveguide modulator. In some embodiments, the Mach-Zehnder waveguide modulator includes a first arm including a first optical waveguide, and a second arm including a second optical waveguide. The first optical waveguide includes a junction, and the Mach-Zehnder waveguide modulator further includes a plurality of electrodes for providing a bias across the junction to enable control of the phase of light travelling through the junction.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: June 9, 2020
    Assignee: Rockley Photonics Limited
    Inventors: Guomin Yu, Aaron John Zilkie
  • Patent number: 10681832
    Abstract: A high-density universally-configurable system board architecture for use with multiple mid-board optic (MBO) type configurations is provided. The system board comprises a switch application specific integrated circuit (ASIC) assembly, a plurality of MBO interfaces comprising a plurality of via-in-pad plated over (VIPPO) vias, and a plurality of mounting holes. Each MBO interface is configured to mate with a soldered-down MBO assembly or a socket instance comprising a socketized MBO assembly. Each socketized MBO assembly comprises an interposer comprising a plurality of VIPPO vias, where the bottom contact pad of each VIPPO via is thicker than the top contact pad. Either configuration is facilitated without the need to modify the system board layout.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: June 9, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, Everett Salinas, Richard Barnett, Michael Chan
  • Patent number: 10678059
    Abstract: A device for displaying visual information to a user includes a waveguide and a lens positioned proximate the waveguide. The waveguide and lens are fixed relative to one another at a top portion of the waveguide and a top portion of the lens. An impact absorber is positioned between a part of the waveguide and a part of the lens, where the impact absorber is affixed to only one of the waveguide and the lens.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: June 9, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Pavana Abhiram Sirimamilla, Glen Patrick Gordon, Yinan Wu, Seyed Ehsan Mirbagheri
  • Patent number: 10678082
    Abstract: A display device including a display panel having an active area to display an image, and an inactive area provided with a pattern disposed thereto to apply an electrical signal to the active area, a side cover having a peripheral frame disposed at an outer portion of the display panel to form a side portion exterior of the display device, and a support frame extended from the peripheral frame to be disposed at a rear of the display panel and supporting the display panel, and a black matrix disposed at a front of the inactive area to hide a pattern of the inactive area.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: June 9, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Soo Jung, Woo Young Kan, Sang Hak Kim, Doo Soon Park, Hyun Jun Jung
  • Patent number: 10670891
    Abstract: Nonreciprocal optical transmission devices and optical apparatuses including the nonreciprocal optical transmission devices are provided. A nonreciprocal optical transmission device includes an optical input portion, an optical output portion, and an intermediate connecting portion interposed between the optical input portion and the optical output portion, and comprising optical waveguides. A complex refractive index of any one or any combination of the optical waveguides changes between the optical input portion and the optical output portion, and a transmission direction of light through the nonreciprocal optical transmission device is controlled by a change in the complex refractive index.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: June 2, 2020
    Assignees: SAMSUNG ELECTRONICS CO., LTD., IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Kiyeon Yang, Youngsun Choi, Seokho Song, Jaewoong Yoon, Choloong Han, Yongsung Kim, Jeongyub Lee, Changseung Lee
  • Patent number: 10663663
    Abstract: A spot-size converter includes a first part of a waveguiding structure to couple to a first waveguide to receive light from or transmit light to the first waveguide in a first propagation mode, wherein the first part of the waveguiding structure has a lower waveguiding structure with a varying effective refractive index that decreases away from the first waveguide; and a second part of the waveguiding structure to couple to a second waveguide to transmit light to or receive light from the second waveguide in a second propagation mode, the second part of the waveguiding structure includes an upper waveguiding structure with a plurality of high-index elements arranged therein, an overlap region is between the first part and the second part, the first propagation mode progressively transforms into the second propagation mode in the overlap region.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: May 26, 2020
    Assignee: Ciena Corporation
    Inventors: Yves Painchaud, Marie-Josee Picard, Ian Betty, Christine Latrasse, Michel Poulin
  • Patent number: 10656332
    Abstract: An optical coupling device for producing an optical coupling between an optical fiber and photonic circuits. The device includes a substrate and at least two coupling stages integrated on the substrate, and: each coupling stage includes a grating coupler configured to implement an optical coupling centered on a respective central wavelength; the multiple grating couplers are superimposed on top of each other, along an axis orthogonal to the substrate plane; at least one of the grating couplers is insensitive to polarization. The device can form, for example, a wide band coupler, wherein each portion of the spectrum is coupled by a coupling stage. As an alternative, such a device can form an emitting and receiving coupler, where emission and reception spectra are each coupled by a respective coupling stage.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: May 19, 2020
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Simon Plantier, Marco Casale, Daivid Fowler, Christophe Kopp
  • Patent number: 10656444
    Abstract: An optical modulator implementing an electro-absorption (EA) modulator is disclosed. The optical modulator includes a transmission line, a terminator, an EA modulator, a bonding wire, and a coil element. The transmission line transmits an electrical signal. The terminator terminates the transmission line. The coil element includes first and second inductors magnetically coupled with each other, where the first inductor is connected with the transmission line, while, the second inductor is connected with the terminator. The bonding wire connects the first and second inductors with the EA modulator. The impedance of the coil element as viewed from the transmission line substantially matches with the impedance of the transmission line.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: May 19, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Keiji Tanaka
  • Patent number: 10654178
    Abstract: A robot has an optical signal transmitter that transmits an optical signal, the optical signal transmitter includes a light source, a supporting board that supports the light source, and a light guide part that transmits light emitted from the light source, and the supporting board includes a board main body, a penetration portion connected to the light source, penetrating in a thickness direction of the board main body, and formed using a metal material, and a heat dissipation portion connected to the penetration portion and formed using a metal material, wherein the penetration portion is placed between the light source and the heat dissipation portion, and the light source is placed between the light guide part and the supporting board.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: May 19, 2020
    Assignee: Seiko Epson Corporation
    Inventor: Hiroto Tomioka
  • Patent number: 10660242
    Abstract: Provided herein are a heat sink module of an inverter module to power an electric vehicle. The heats sink module can include a heat sink body having a plurality of mounting holes, a fluid inlet and a fluid outlet. The heats sink module can include a cooling channel that can be fluidly coupled with the fluid inlet and the fluid outlet. The heats sink module can include an insulator plate having a first surface and a second surface. The second surface of the insulator plate can couple with a joining surface of the heat sink body to seal the cooling channel. The heats sink module can include a heat sink lid disposed over the insulator plate. The heat sink lid can have a plurality of mounting feet to couple with the mounting holes of the heat sink body to secure the heat sink lid to the heat sink body.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: May 19, 2020
    Assignees: CHONGQING JINKANG NEW ENERGY VEHICLE CO., LTD., SF MOTORS, INC.
    Inventors: Yunan Song, Colin Haag, Zhong Nie, Duanyang Wang, Yifan Tang
  • Patent number: 10656338
    Abstract: A wafer-level optoelectronic packaging method includes fabricating a pre-singulated wafer. The pre-singulated wafer has a plurality of sub-mounts. A first sub-mount of the plurality of sub-mounts includes an optical waveguide formed on a substrate, a multi-layered sub-mount boundary wall that is formed on the optical waveguide, and a v-groove that is external to the sub-mount boundary wall. A plurality of optical dies are attached to the corresponding plurality of sub-mounts, such that each optical die is aligned to the optical waveguide of the corresponding sub-mount. A cap-wafer including a plurality of caps is attached to the pre-singulated wafer to obtain an encapsulated pre-singulated wafer. The encapsulated pre-singulated wafer is diced to obtain a plurality of optoelectronic packages. The optical waveguide of each optoelectronic package serves as an interconnection conduit between the corresponding optical die and an optical fiber placed in the corresponding v-groove.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: May 19, 2020
    Assignee: POET Technologies, Inc.
    Inventor: Yee Loy Lam
  • Patent number: 10660227
    Abstract: An electronic module includes a substrate having a first main surface and a second main surface, first electronic components on the first main surface, second electronic components on the second main surface, a first sealing resin portion, and a second sealing resin portion. Through holes are formed so as to extend through the substrate and the first sealing resin portion. A third electronic component is placed in the through holes. An area between the through holes and the third electronic component is filled with the second sealing resin portion, and the second sealing resin portion is formed to be exposed at a surface of the first sealing resin portion. When viewed in a direction perpendicular to the first main surface, the second sealing resin portion surrounds the third electronic component. The first sealing resin portion and the second sealing resin portion are made of different types of resins.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: May 19, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Issei Yamamoto
  • Patent number: 10656351
    Abstract: A package structure is provided. The package structure includes an optical component over a substrate, and a reflector disposed over the substrate. The reflector includes a first semiconductor layer over a second semiconductor layer, and a dielectric layer between the first semiconductor layer and the second semiconductor layer. The reflector also includes a metal layer between the second semiconductor layer and the substrate. In addition, the package structure includes a waveguide between the metal layer and the optical component.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: May 19, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Sung-Hui Huang, Jui-Hsieh Lai, Shang-Yun Hou
  • Patent number: 10659169
    Abstract: A transmitter includes a first PCB having a first surface on which first ground wires and anode wires connecting a light-emitting element and a driver are formed, the anode wires being covered with an insulating section, and a second surface on which a second ground wire coupled to the first ground wires is formed, the second surface being opposite the first surface, a connector that supports the first PCB and is coupled to the second ground wire, a conductive housing that covers the first PCB and the connector, a coupling member in contact with the housing and the first ground wires, the coupling member coupling the housing and the first ground wires, and a second PCB on which the connector and the housing are mounted, the second PCB including a third ground wire that is coupled via the connector to the second ground wire and is coupled to the housing.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: May 19, 2020
    Assignee: FUJITSU LIMITED
    Inventor: Takashi Shiraishi
  • Patent number: 10658555
    Abstract: Provided is an optical semiconductor apparatus including an optical semiconductor device; a light-permeable buffer layer that contains a cured high-hardness silicone resin, that has a thickness ranging from 1 ?m to 300 ?m, and that covers at least part of a light-emitting surface of the optical semiconductor device; and a flexible sealing layer containing a cured flexible silicone resin that has a lower hardness than the light-permeable buffer layer, and that covers the optical semiconductor device and the light-permeable buffer layer. The optical semiconductor apparatus has superior heat resistance and UV resistance and is significantly prevents the breakage of a wire electrically connected to the optical semiconductor device.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: May 19, 2020
    Assignee: HOYA CANDEO OPTRONICS CORPORATION
    Inventors: Yasuo Kogure, Shinichi Ogawa, Satoshi Yajima
  • Patent number: 10656443
    Abstract: An optical interconnect system has first and second waveguides each with wedge-shaped cross-section at a first end, disposed over an optical modulator. The optical modulator is a surface-plasmon multi quantum well (SP-MQW) modulator, the first waveguide an input waveguide and the second waveguide configured an output waveguide. In embodiments the SP-MQW modulator has multiple semiconductor layers disposed atop a lower metal layer between 10 and 300 nanometers thick and configured such that incident light is reflected at the lower metal layer unless a voltage is applied to the semiconductor layers, when incident light is coupled into a surface plasmon mode in the lower metal layer.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: May 19, 2020
    Assignees: THE TRUSTEES OF DARTMOUTH COLLEGE, LAXENSE INC., MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: Jifeng Liu, Xiaoxin Wang, Juejun Hu, Xiaochen Sun, Tian Gu
  • Patent number: 10659166
    Abstract: An integrated optical transceiver, comprising a laser component, comprising an array of VCSEL diodes formed on a laser diode substrate; a laser driving component, comprising laser diode driving circuitry formed on a laser driving circuitry substrate; a photodiode component, comprising an array of photodiodes formed on a photodiode substrate; and a photodiode driving component, comprising photodiode driving circuitry formed on a photodiode driving circuitry substrate; a first heat sink comprising a connected piece of material to transport excess heat away from the integrated optical transceiver and connected to both the laser and photodiode driving components; and an electrically insulating material separating the photodiode substrate from the first heat sink and being air or dielectric material with a relative dielectric constant ?<10, wherein the electrically insulating material provides a gap having an effective electrical distance of at least 80 ?m between the photodiode substrate and the first heat sin
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: May 19, 2020
    Assignee: Finisar Corporation
    Inventors: Nicolae Chitica, Jürgen Hauenschild, Theron Jones, David Nidelius, Lennart Lundqvist, Elisabeth Källén, Odd Steijer, Marek Chacinski, Åsa Johansson, Andrei Kaikkonen
  • Patent number: 10650856
    Abstract: A thermally assisted magnetic head including a slider and a light source-unit. The slider includes a slider substrate and a magnetic head part. The light source-unit includes a laser diode and a sub-mount. The magnetic head part includes a medium-opposing surface, a light source-opposing surface and a waveguide which guides laser light from the light source-opposing surface to the medium-opposing surface. The thermally assisted magnetic head includes an optimal-structure which the following optimizing conditional expression, concerning an inlet-optical path length L1 of an inlet-interval of the waveguide, and an outlet-optical path length L2 of an outlet-interval, is satisfied, m1×L1=L2 (m1 is a natural number).
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: May 12, 2020
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Ryo Hosoi, Seiichi Takayama
  • Patent number: 10649216
    Abstract: An optical reflective device for homogenizing light including a waveguide having a first and second waveguide surface and a partially reflective element is disclosed. The partially reflective element may be located between the first waveguide surface and the second waveguide surface. The partially reflective element may have a reflective axis parallel to a waveguide surface normal. The partially reflective element may be configured to reflect light incident on the partially reflective element at a first reflectivity for a first set of incidence angles and reflect light incident on the partially reflective element at a second reflectivity for a second set of incident angles.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: May 12, 2020
    Assignee: Akonia Holographics LLC
    Inventors: Mark R. Ayres, Adam Urness, Kenneth E. Anderson, Friso Schlottau
  • Patent number: 10649137
    Abstract: There are disclosed herein various implementations of a silicon-on-insulator (SOI) die including a light emitting layer pedestal-aligned with a light receiving segment, as well as methods for fabricating such an SOI die. The SOT die includes a pedestal region of the SOI die having a pedestal including a thin top silicon segment, a buried oxide (BOX) segment, and a handle wafer segment. The SOI die also includes an integrated circuit (IC) region having a thin silicon waveguide that is aligned with the thin top silicon segment in the pedestal region. A light emitting layer is situated over the pedestal in the pedestal region, the light emitting layer being aligned with the light receiving segment to situated over the thin silicon waveguide in the IC region.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: May 12, 2020
    Assignee: Newport Fab, LLC
    Inventors: Edward Preisler, Oleg Martynov, Farnood Rezaie
  • Patent number: 10649140
    Abstract: Structures including a waveguide core and methods of fabricating a structure including a waveguide core. A back-end-of-line interconnect structure includes a cap layer, an interlayer dielectric layer, and one or more metal features embedded in the interlayer dielectric layer. The interlayer dielectric layer is stacked in a vertical direction with the cap layer. The one or more metal features have an overlapping arrangement in a lateral direction with the waveguide core, which is arranged under the back-end-of-line interconnect structure.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: May 12, 2020
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Yusheng Bian, Ajey Poovannummoottil Jacob, Abu Thomas
  • Patent number: 10641976
    Abstract: A photonic chip includes a substrate, an electrical isolation region formed over the substrate, and a front end of line (FEOL) region formed over the electrical isolation region. The photonic chip also includes an optical coupling region. The electrical isolation region and the FEOL region and a portion of the substrate are removed within the optical coupling region. A top surface of a the substrate within the optical coupling region includes a plurality of grooves configured to receive and align a plurality of optical fibers. The grooves are formed at a vertical depth within the substrate to provide for alignment of optical cores of the plurality of optical fibers with the FEOL region when the plurality of optical fibers are positioned within the plurality of grooves within the optical coupling region.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: May 5, 2020
    Assignee: Ayar Labs, Inc.
    Inventors: Mark Wade, Chen Sun, John Fini, Roy Edward Meade, Vladimir Stojanovic, Alexandra Wright
  • Patent number: 10644822
    Abstract: A network system comprises a plurality of nodes and a plurality of optical amplifiers. A first node comprises a first transmitter configured to send a wavelength-division-multiplexed optical signal and a first receiver configured to receive a wavelength-division-multiplexed optical signal, and the second node comprises a second transmitter configured to send a wavelength-division-multiplexed optical signal and a second receiver configured to receive a wavelength-division-multiplexed optical signal. The first and second transmitters are optically connected to an input of the first optical amplifier and an input of the second optical amplifier, respectively, and the first and second receivers are optically connected to an output of the first optical amplifier and an output of the second optical amplifier, respectively. The receivers each comprise a photoreceiver and a reception circuit. The photoreceiver is electrically connected, by flip chip connection, to a reception circuit.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: May 5, 2020
    Assignee: PHOTONICS ELECTRONICS TECHNOLOGY RESEARCH ASSOCIATION
    Inventor: Yutaka Urino
  • Patent number: 10641930
    Abstract: A method of making an optical device including forming a plurality of holes with varying radii milled vertically into a film, wherein said holes form a pattern. The radius of each hole determines an effective refractive index for said hole. The effective refractive index modifies a phase and an intensity of an incoming electromagnetic radiation as the radiation propagates through said hole. The device is configured to be operating equally for each linearly polarized radiation simultaneously, wherein the each linearly polarized radiation is normally incident on the device.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: May 5, 2020
    Assignee: Purdue Research Foundation
    Inventors: Alexander V. Kildishev, Satoshi Ishii, Vladimir M. Shalaev
  • Patent number: 10634846
    Abstract: An optical module includes a single-mode optical fiber; a high relative refractive-index difference optical fiber having a larger core-to-cladding relative refractive-index difference than that of the single-mode optical fiber fusion-spliced to a first end of the high relative refractive-index difference optical fiber; a planar lightwave circuit that includes an optical waveguide having a core of quartz-based glass doped with a refractive-index raising dopant and a cladding of quartz-based glass, and is connected at a first end thereof to a second end, opposite to the first end, of the high relative refractive-index difference optical fiber; and a silicon thin-wire waveguide element that includes a silicon thin-wire waveguide having a silicon core and a cladding whose refractive index lower than that of the silicon core, and is connected to a second end, opposite to the first end, of the optical waveguide of the planar lightwave circuit.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: April 28, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Junichi Hasegawa, Yasuyoshi Uchida
  • Patent number: 10636954
    Abstract: In general, the present disclosure is directed to a thermoelectric cooler (TEC) that includes a top plate or bottom plate being formed of a high thermal conductivity material, and the other of the top plate and bottom plate being formed of a low thermal conductivity material, with the high thermal conductivity material having a thermal conductivity at least twice, and preferably five times, that of the thermal conductivity of the low thermal conductivity material. This disparity in thermal conductivity between the top plate and bottom plate materials may be referred to herein as asymmetric thermal performance.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: April 28, 2020
    Assignee: Applied Optoelectronics, Inc.
    Inventors: I-Lung Ho, Qin Li, Chong Wang
  • Patent number: 10635625
    Abstract: A plug connector component is provided having a housing, at least one control module arranged therein and an operating system for operating the control module. At least one functional module that can be controlled by the control module can be introduced into the housing. In addition, the control module is configured to receive at least one container with at least one process configured for using an operating system core of the operating system and to implement same, and to at least partially control the functional module by the process. Related plug connectors, systems and methods are also provided.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: April 28, 2020
    Assignee: HARTING Electric GmbH & Co. KG
    Inventors: Lutz Tröger, Christoph Gericke, Markus Friesen, Karsten Walther
  • Patent number: 10629775
    Abstract: Devices, systems, and methods for providing wireless personal area networks (PANs) and local area networks (LANs) using visible and near-visible optical spectrum. Various constructions and material selections are provided herein. According to one embodiment, a light-emitting diode (LED) includes a substrate, a carrier confinement (CC) region positioned over the substrate, and an active region positioned over the CC region. The CC region includes a first CC layer that is a wideband gap CC layer including indium gallium phosphide or aluminum gallium arsenide. The CC region includes a second CC layer positioned over the first CC layer. The second CC layer is a wideband gap CC layer that includes indium gallium phosphide or aluminum gallium arsenide. The active region is configured to have a transient response time of less than 500 picoseconds (ps).
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: April 21, 2020
    Assignee: Lumeova, Inc.
    Inventors: Mohammad Ali Khatibzadeh, Arunesh Goswami
  • Patent number: 10615567
    Abstract: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: April 7, 2020
    Assignee: INPHI CORPORATION
    Inventors: Frank Gelhausen, Ahmed Sanaa Ahmed Awny, Edward Pillai, Ulrich Schacht, Oliver Piepenstock
  • Patent number: 10606002
    Abstract: An opto-electric hybrid board includes an electric circuit board in which electric wiring is formed on a front surface of an insulating layer, and an optical waveguide formed on the rear side of the electric circuit board. The optical waveguide and the electric circuit board are arranged so that left and right edges of the electric circuit board along a longitudinal direction of the optical waveguide overlap with left and right edges of the optical waveguide when viewed from above, or so that the left and right edges of the electric circuit board are on the inside of where the left and right edges of the optical waveguide are located. The opto-electric hybrid board is easy to handle owing to the reduced chance of the electric circuit board being damaged. The opto-electric hybrid board also does not cause misalignment of a core when used as a connector.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: March 31, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuichi Tsujita, Naoyuki Tanaka
  • Patent number: 10607843
    Abstract: According to one embodiment, there is provided a method of manufacturing a semiconductor device which includes forming an alignment mark in a planned cutting line region of a first surface of a semiconductor substrate, forming a stacked structure above the first surface of the semiconductor substrate, removing the portion of the stacked structure present above the alignment mark, aligning the substrate in the lithography process, by causing infrared light to pass through the semiconductor substrate from a second surface thereof which is on a side opposite to the first surface thereof and performing positional alignment for exposure of a resist pattern based on the location of the alignment mark using infrared light reflected from the alignment mark, and exposing the resist, opening a pattern in the exposed resist, and further processing the semiconductor substrate using the resist pattern.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: March 31, 2020
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Shinya Watanabe, Keisuke Taira
  • Patent number: 10605989
    Abstract: A method of manufacturing an integrated semiconductor optical waveguiding device comprising an elongated waveguide, the method comprising: providing a material stack comprising a substrate layer, an anisotropically wet etchable conductive layer, a waveguiding core layer, an etch-guiding layer between the substrate layer and the waveguiding core layer, and InP material between the etch-guiding layer and the waveguiding core layer; etching said material stack down to and including said waveguiding core layer, to form an elongated shape of the elongated waveguide together with an etched area laterally beside the waveguide; providing an etch mask material across the formed waveguide; and wet etching parts of said etched areas that are not protected by the etch mask, to remove material of the etch-guiding layer across a lateral direction of the waveguide, forming a laterally extending through tunnel in the etch-guiding layer and in the conductive layer.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: March 31, 2020
    Assignee: Finisar Sweden AB
    Inventors: David Adams, Martin Anders Isak Stattin, Christopher Daunt
  • Patent number: 10598878
    Abstract: A scavenging photodetection device (10) is provided. The scavenging photodetection device (10) includes an optical coupling portion (12) and a scavenging photodetection portion (14). The optical coupling portion (12) includes an optical coupler (16) configured to receive light from a light source, a plurality of light absorbers (18) arranged to absorb the light from the light source that is not collected by the optical coupler (16), and at least one primary input waveguide (20) optically coupled to the optical coupler (16) and configured to direct collected light to a photonic integrated circuit. The scavenging photodetection portion (14) includes a primary photodetector (22) configured to collect uncollected light from the optical coupling portion (12) to determine an alignment position of the photonic integrated circuit.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: March 24, 2020
    Assignee: Rain Tree Photonics Pte. Ltd.
    Inventors: Tsung-Yang Liow, Ying Huang
  • Patent number: 10602634
    Abstract: A card module includes a transceiver, multiple connector interfaces that are each matable with a system connector of a respective type, a detection mechanism and a switching component. The detection mechanism can detect any one of the multiple connector interfaces being mated with the system connector of the respective type. Based on the respective type of the mated system connector, the switching component implements a switch state to connected the mated system connector to the transceiver.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: March 24, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: KaiChun Su, Yuan-Hung Wang, Kent Liu, Ting Wen Tsai, Hung-Chu Lee, Wei Ying Chiang
  • Patent number: 10598873
    Abstract: Optical alignment of optical subassembly and optoelectronic device is achieved using an external source and an external receiver, passing optical signal through a passive waveguide in the optoelectronic device, via alignment reflective surface features provided on the optical subassembly. The optical subassembly is provided with a first alignment reflective surface directing alignment signal from the source to a grating coupler at the input of the waveguide, and a second alignment reflective surface directing to the receiver the alignment signal directed from a grating coupler at the output of the waveguide after the alignment signal has been transmitted from the input to the output through the waveguide.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: March 24, 2020
    Assignee: CUDOQUANTA FLORIDA, INC.
    Inventors: Robert Ryan Vallance, Gregory L. Klotz, Rand D. Dannenberg
  • Patent number: 10594108
    Abstract: A multimode interference device includes: man MMI semiconductor mesa having first and second end faces that are arranged in a direction of a first axis, and first and second side faces that extend in the direction of the first axis; first and second semiconductor mesas disposed apart from the first and second side faces, respectively; an embedding region covering the MMI semiconductor mesa and the first and second semiconductor mesas and having first and second openings at the first and second semiconductor mess, respectively; and first and second metal bodies making contact with the first and second semiconductor mesas through the first and second openings, respectively. The first and second end faces have multiple first ports and multiple second ports, respectively. The first semiconductor mesa, the MMI semiconductor mesa, and the second semiconductor mesa are arranged in a direction of a second axis intersecting the first axis.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: March 17, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Takehiko Kikuchi
  • Patent number: 10591671
    Abstract: Some embodiments of the present disclosure describe an apparatus for III/V-Si taper coupling, including a III/V-Si taper coupler with one end to receive a laser beam where the one end has at least one surface at a non-perpendicular angle with respect to a direction of the laser beam, and where the at least one surface forms one or more tips at the one end of the III/V-Si taper coupler. The one end is positioned so that the one or more tips are outside the laser beam to reduce reflection of laser beam away from the one end of the III/V-Si taper coupler.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: March 17, 2020
    Assignee: Intel Corporation
    Inventors: Wenhua Lin, Kimchau N. Nguyen
  • Patent number: 10591962
    Abstract: In one example, a system for a cage assembly for an optical module includes a receptacle coupled to an interposer card, a number of rails coupled to the interposer card to align an optical module with the receptacle, and a mezzanine card coupled to the interposer card, wherein the optical module is utilized via the mezzanine card.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: March 17, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B Leigh, John Norton, George D Megason