Integrated Optical Circuit Patents (Class 385/14)
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Patent number: 12113081Abstract: The package structure having packaged components within includes a circuit board, multiple packaged light detecting components mounted on the circuit board, a sealing cap being light transmittable, multiple light filtering films mounted on the sealing cap, and a supporting annular wall. The two opposite ends of the supporting annular wall are adhesively bonded to the surfaces of the circuit board and the sealing cap, such that the projection on the circuit board of the light filtering films corresponds the packaged light detecting components. Since the light filtering films have different filtering frequency bands, each packaged light detecting component detects light of different frequency bands in one incident light beam. The package method is simple and stable, effectively lowering the manufacture cost of the light detecting module.Type: GrantFiled: December 3, 2021Date of Patent: October 8, 2024Assignee: TAIWAN REDEYE BIOMEDICAL INC.Inventors: Shuo-Ting Yan, Chen-Chung Chang, Tsung-Jui Lin
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Patent number: 12111207Abstract: Embodiments are directed to optical measurement systems that utilize multiple emitters to emit light during a measurement, as well as methods of performing measurements using these optical measurement systems. The optical measurement systems may include a light generation assembly that is configured to generate light via a light source unit, and a photonic integrated circuit that includes a launch group having a plurality of emitters. Each of these emitters is optically coupled to the light generation assembly to receive light generated from the light generation assembly, and may emit this light from a surface of the photonic integrated circuit. The optical measurement system may perform a measurement in which the light generation assembly generates light and each of the plurality of emitters simultaneously emit light received from the light generation assembly.Type: GrantFiled: August 16, 2023Date of Patent: October 8, 2024Assignee: APPLE INC.Inventors: Matthew A Terrel, David S Gere, Alexander F Sugarbaker, Thomas C Greening, Jason S Pelc, Mark A. Arbore
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Patent number: 12107391Abstract: A semiconductor optical element has a mesa structure in which an active layer is embedded, and comprises a straight propagating section and a spot size converter section being such that a light confinement in the active layer is weaker than that of the straight propagating section, wherein in a same plane parallel to a layer surface of the active layer, an average value of a width of the mesa structure of the straight propagating section is smaller than a value of the width of the mesa structure at the emission facet of the spot size converter section, and at a top part of the mesa structure, an electrode is formed so that an electric current is injected in the active layer across the entire length of the straight propagating section and the spot size converter section.Type: GrantFiled: April 27, 2020Date of Patent: October 1, 2024Assignee: Mitsubishi Electric CorporationInventor: Ayumi Fuchida
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Patent number: 12099245Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, where the package substrate comprises a recessed edge. In an embodiment, a compute die is on the package substrate, and an optics die on the package substrate and overhanging the recessed edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, a lid covers the recess in the package substrate.Type: GrantFiled: December 17, 2020Date of Patent: September 24, 2024Assignee: Intel CorporationInventors: Asako Toda, Chia-Pin Chiu, Xiaoqian Li, Yiqun Bai
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Patent number: 12100926Abstract: An embodiment of the present invention provides a photodetector chip, including a substrate, a semiconductor optical amplification section, and a photodetection section. The substrate includes a surface, the photodetection section and the semiconductor optical amplification section are arranged on the substrate, and the photodetection section is located in an optical signal output direction of the semiconductor optical amplification section. The semiconductor optical amplification section amplifies and filters an input optical signal to output an amplified and filtered optical signal to the photodetection section. The photodetection section is configured to convert the amplified and filtered optical signal into an electrical signal. The semiconductor optical amplification section includes a grating, the grating includes a first grating and a second grating that are cascaded, and the first grating is a slanted grating.Type: GrantFiled: April 29, 2021Date of Patent: September 24, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yuanbing Cheng, Heng Wang, Jing Dai, Yinghua Dong
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Patent number: 12092874Abstract: A silicon photonic package and a method of fabricating the package are disclosed. The silicon photonic package includes an optical waveguide structure, a heat dissipation structure, a plastic encapsulation layer, first and second structures. The optical waveguide structure is a right trapezoidal structure, and a surface where a non-right angle leg thereof is a totally reflecting surface capable of totally reflecting an optical signal that enters the optical waveguide structure from a surface where a right angle leg is disposed in a direction parallel to bases to a plane where a front face of the plastic encapsulation layer is disposed. The heat dissipation structure and the optical waveguide structure are spaced apart from each other and both embedded in the plastic encapsulation layer. The optical waveguide structure of the present invention allows a great reduction in loss of an optical signal incurred by its propagation in the optical waveguide structure.Type: GrantFiled: September 20, 2022Date of Patent: September 17, 2024Assignee: OIP TECHNOLOGY PTE LTD.Inventor: Yonggang Jin
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Patent number: 12092884Abstract: An optical transceiver includes housing, connector coupler and internal optical connector. Opening of housing is located on a side of housing and connected to accommodation space of housing. Connector coupler includes positioning frame and at least one elastic holding arm. Elastic holding arm protrudes from positioning frame and forms holding space. Positioning frame is located between at least a part of elastic holding arm and opening. Positioning frame is disposed in accommodation space. Positioning recess is located on a side of positioning frame close to opening and connected to holding space. At least a part of internal optical connector is located in holding space to be held in position by elastic holding arm. Positioning recess is configured to position external optical connector so as to allow internal optical connector to be plugged with and optically coupled to external optical connector.Type: GrantFiled: December 6, 2022Date of Patent: September 17, 2024Assignee: Global Technology Inc.Inventors: Gaofei Yao, Qilin Hong, Yi Lin, PengBin Lin
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Patent number: 12092867Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: GrantFiled: December 1, 2023Date of Patent: September 17, 2024Assignee: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Patent number: 12092871Abstract: A device has a plurality of waveguide structures including two active (one of which comprises two sub-layers), two passive, and three intermediate waveguide structures on a common substrate. At least partial butt coupling between active and intermediate waveguide structures, and tapering in the intermediate and/or passive waveguide structures at each junction therebetween facilitates efficient optical mode transformations as optical signals travel through the device, either from a first sub-layer of the first active waveguide structure through the other sub-layer, then sequentially though a first intermediate waveguide structure, a passive waveguide structure, a second intermediate waveguide structure, a second active waveguide structure, a third intermediate structure, and a second passive waveguide structure; or in reverse from the second passive waveguide structure back through to the first sub-layer of the first active waveguide structure.Type: GrantFiled: January 12, 2022Date of Patent: September 17, 2024Assignee: NEXUS PHOTONICS LLCInventors: Aditya Malik, Hyun Dai Park, Tin Komljenovic
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Patent number: 12092873Abstract: An optical fiber coupler includes a plurality of optical fibers parallel to each other in a first direction, an optical fiber array block (FAB) configured to maintain a constant center-to-center distance between the plurality of optical fibers, and an optical waveguide block including a plurality of optical waveguides coupled to the plurality of optical fibers, respectively, and configured to transfer optical signals transmitted through the plurality of optical fibers connected to the optical FAB in a second direction in which a photonics chip is placed and which is different from the first direction.Type: GrantFiled: January 28, 2022Date of Patent: September 17, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Sae-Kyoung Kang, Joon Young Huh, Joon Ki Lee
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Patent number: 12089330Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on surface of the insulating layer and including a conductor pad, a covering layer covering a portion of the insulating layer, an optical waveguide positioned on the surface of the insulating layer and including core part, and a conductor post including plating metal and formed on the conductor pad such that the post is penetrating through the covering layer and connected to a component. The insulating layer has component region covered by the component when the component is connected, the core part has side surface extending in direction along the surface of the insulating layer, the side surface has an exposed portion exposed in the component region and facing the opposite direction with respect to the insulating layer, and distance between the exposed portion and the surface of the insulating layer is greater than thickness of the covering layer.Type: GrantFiled: June 28, 2022Date of Patent: September 10, 2024Assignee: IBIDEN CO., LTD.Inventor: Masatoshi Kunieda
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Patent number: 12080651Abstract: Various three-dimensional devices that can be formed within the bulk of a semiconductor by photo-controlled selective etching are described herein. With more particularity, semiconductor devices that incorporate three-dimensional electrical vias, waveguides, or fluidic channels that are disposed within a semiconductor are described herein. In an exemplary embodiment, a three-dimensional interposer chip includes an electrical via, a waveguide, and a fluidic channel, wherein the via, the waveguide, and the fluidic channel are disposed within the body of a semiconductor element rather than being deposited on a surface. The three-dimensional interposer is usable to make electrical, optical, or fluidic connections between two or more devices.Type: GrantFiled: March 27, 2019Date of Patent: September 3, 2024Assignee: NIELSON SCIENTIFIC, LLCInventor: Gregory Nolan Nielson
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Patent number: 12078484Abstract: A sensing component of a gyroscope and an opto-MEMS gyroscope comprising said sensing component are provided, the sensing component comprising, a frame; a proof mass configured to be displaced in response to a Coriolis force applied to the sensing component; and a photonic crystal cavity comprising, a first photonic crystal coupled to the proof mass; and a second photonic crystal coupled to the frame; wherein the first and second photonic crystals each comprises an array of holes formed thereon; wherein the photonic crystal cavity is configured to generate an optical output in response to the Coriolis force, and wherein the sensing component is configured to measure the Coriolis force based on changes in the optical output.Type: GrantFiled: September 22, 2022Date of Patent: September 3, 2024Assignee: ANYON TECHNOLOGIES PTE. LTD.Inventors: Hongbo Zhang, Hengjiang Ren, Jie Luo
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Patent number: 12069888Abstract: An organic light emitting display substrate includes: a base substrate; organic light emitting diodes disposed on the base substrate, with each organic light emitting diode including a first electrode layer, an organic light emitting layer and a second electrode layer, and the first electrode layer and the second electrode layer forming an optical resonant cavity; and a nanoparticle layer on a side of the organic light emitting diodes away from the base substrate and includes nanoparticle patterns, each nanoparticle pattern is disposed on a side of a second electrode layer of a corresponding one of the plurality of organic light emitting diodes away from an organic light emitting layer and at least partially covers the second electrode layer. Resonance mode of the nanoparticle pattern is coupled with a resonance mode of an optical resonant cavity of the corresponding organic light emitting diode to form a Fano resonance.Type: GrantFiled: February 22, 2021Date of Patent: August 20, 2024Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Feng Wang, Ziyu Zhang
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Patent number: 12067456Abstract: A system for entanglement-enhanced machine learning with quantum data acquisition includes a first variational circuit that generates a plurality of entangled probe light fields that interacts with a sample and is then processed by a second variational quantum circuit to produce at least one detection light field, a detector is used to measure a property of the at least one detection light field, and the first and second variational quantum circuits are optimized though machine learning. A method for entanglement-enhanced machine learning with quantum data acquisition includes optimizing a setting of a first and second variational quantum circuits, which includes probing a training-set with a plurality of entangled probe light fields generated by the first variational quantum circuit, and measuring a phase property of at least one detection light fields generated by the second variational quantum circuit from the plurality of entangled probe light fields after interaction with the training-set.Type: GrantFiled: November 19, 2020Date of Patent: August 20, 2024Assignee: Arizona Board of Regents on Behalf of the University of ArizonaInventors: Quntao Zhuang, Zheshen Zhang
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Patent number: 12066671Abstract: A semiconductor device includes a plurality of intermediate waveguides. The plurality of intermediate waveguides are vertically disposed on top of one another, and vertically adjacent ones of the plurality of intermediate waveguides are laterally offset from each other. When viewed from the top, each of the plurality of intermediate waveguides essentially consists of a first portion and a second portion, the first portion has a first varying width that increases from a first end of the corresponding intermediate waveguide to a middle of the corresponding intermediate waveguide, and the second portion has a second varying width that decreases from the middle of the corresponding intermediate waveguide to a second end of the corresponding intermediate waveguide.Type: GrantFiled: May 26, 2022Date of Patent: August 20, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Cheng-Tse Tang, Chewn-Pu Jou, Chih-Wei Tseng, Hsing-Kuo Hsia, Ming Yang Chung
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Patent number: 12055773Abstract: An alignment optical circuit includes: a plurality of grating couplers that are formed on a substrate and arranged on a line; a plurality of optical waveguides that are connected to the plurality of grating couplers, respectively. Further, the alignment optical circuit includes an optical sensor that is formed on the substrate and measures optical intensity at a first light-receiving spot and a second light-receiving spot on a line along an arrangement direction of the plurality of grating couplers.Type: GrantFiled: December 3, 2019Date of Patent: August 6, 2024Assignee: Nippon Telegraph and Telephone CorporationInventors: Toru Miura, Yoshiho Maeda, Hiroshi Fukuda
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Patent number: 12055772Abstract: An optical interconnect for optically coupling at least a first optical integrated circuit and a second optical integrated circuit. The optical interconnect comprises at least two layers of optically transparent material. There is a first optical waveguide arranged along a surface of a first one of the at least two layers of optically transparent material. There is further a first non-guided optical path extending from the first optical waveguide through the at least two layers of optically transparent material. A first reflective element is arranged to receive light from at least one of the first non-guided optical path and the first optical waveguide and direct the light to the other of the first non-guided optical path and the first optical waveguide. At least one lens is arranged at a boundary between two of the at least two layers of optically transparent material. The at least one lens is arranged to receive and focus light travelling along the first non-guided optical path.Type: GrantFiled: December 18, 2018Date of Patent: August 6, 2024Assignee: Telefonaktiebolaget LM Ericsson (publ)Inventors: Francesco Testa, Marco Romagnoli, Luigi Tallone
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Patent number: 12055777Abstract: A multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. The main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die has physical-layer circuits that directly drive the optical engine. An optical cable can be connected directly to the optical engine of the multichip package.Type: GrantFiled: April 18, 2022Date of Patent: August 6, 2024Assignee: Intel CorporationInventors: Peng Li, Joel Martinez, Jon Long
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Patent number: 12044892Abstract: A semiconductor package includes a first interposer having a first substrate, a first redistribution structure over a first side of the first substrate, and a first waveguide over the first redistribution structure and proximate to a first side of the first interposer, where the first redistribution structure is between the first substrate and the first waveguide. The semiconductor package further includes a photonic package attached to the first side of the first interposer, where the photonic package includes: an electronic die, and a photonic die having a plurality of dielectric layers and a second waveguide in one of the plurality of dielectric layers, where a first side of the photonic die is attached to the electronic die, and an opposing second side of the photonic die is attached to the first side of the first interposer, where the second waveguide is proximate to the second side of the photonic die.Type: GrantFiled: March 24, 2022Date of Patent: July 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chen-Hua Yu, Hsing-Kuo Hsia
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Patent number: 12044857Abstract: A hybrid reflective/refractive HMD includes a structural frame, refractive optical lens elements, and optics housings coupled to the structural frame and positioned in front of a user's first and second eyes. Light-emitting visual sources and reflective optical surfaces are contained in the optics housings. Visual content is transmitted from light-emitting visual sources to the reflective optical surfaces. The visual content is reflected within the reflective optical surfaces at least four times without passing through a refractive optical lens element. The visual content is transmitted to the user's first eye or the user's second eye. Simultaneous with the transmission of the visual content to the user's first eye or the user's second eye, a real-world view of the outside surrounding environment is transmitted to the user's first eye or the user's second eye. The visual content is overlaid onto the real-world view of the outside surrounding environment.Type: GrantFiled: November 30, 2021Date of Patent: July 23, 2024Inventor: Douglas Peter Magyari
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Patent number: 12038616Abstract: A photonic system includes a light source and a photonic structure. The photonic structure includes an optical transmission structure and an optical absorption structure. The optical transmission structure is configured to transmit light associated with a first wavelength range. The optical absorption structure is configured to absorb light associated with a second wavelength range. The light source is configured to provide a light beam with a wavelength that is within the second wavelength range to the optical absorption structure. The optical absorption structure is configured to generate and provide heat to the optical transmission structure when the light beam falls incident on the optical absorption structure.Type: GrantFiled: July 14, 2023Date of Patent: July 16, 2024Assignee: VIAVI Solutions Inc.Inventor: William D. Houck
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Patent number: 12040321Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.Type: GrantFiled: September 20, 2022Date of Patent: July 16, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsiang-Cheng Tsai, Ying-Chung Chen
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Patent number: 12032268Abstract: An optical modulator in which an optical signal is input from one side of a package, includes in the package, a chip that optically modulates the optical signal and in which an input waveguide and an output waveguide of the optical signal are led to mutually different destinations each being one end of the chip facing the one side of the package and a side surface of the chip orthogonal to the one end of the chip; an input optical system coupled to the input waveguide of the chip; and an output optical system coupled to the output waveguide of the chip.Type: GrantFiled: February 5, 2021Date of Patent: July 9, 2024Assignee: FUJITSU OPTICAL COMPONENTS LIMITEDInventors: Shinji Maruyama, Shuntaro Makino, Yoshimitsu Sakai, Yoshinobu Kubota
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Patent number: 12025833Abstract: Provided is an optical waveguide element that prevents leaked light generated at a forking section from entering a downstream optical waveguide such as another forking section, thereby affording minimal degradation of optical characteristics. The optical waveguide is characterized in that: at least one of two fork waveguides (20a, 20b) forking from a first forking section (20) comprises a second forking section (21, 22); slab waveguides (3c-1 to 3c-3) are formed between the two fork waveguides; and between the first forking section and the second forking section, slits (41, 42) are formed that partition the slab waveguides into a first slab waveguide area (3c-1) close to the first forking section and second slab waveguide areas (3c-2, 3c-3) close to the second forking section(s).Type: GrantFiled: September 23, 2020Date of Patent: July 2, 2024Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Yu Kataoka, Norikazu Miyazaki
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Patent number: 12007602Abstract: In an integrated optical device, squeezed light is used internally to effectively increase an optical modulation effect. One exemplary device operates by squeezing the light at the input, then sending it through an electro-optic stage where its phase picks up the signal of interest, and finally anti-squeezing it to obtain a displaced coherent state. Thus the displacement is amplified by the level of squeezing that is achieved inside the device and it is thereby less sensitive to loss. Since this device behaves simply as an electro-optic modulator, albeit one with an exponentially enhanced sensitivity, no extra considerations are needed to integrate the modulator into a system. Such devices can be operated as modulators or as sensors, and can make use of optical phase shift effects other than the electro-optic effect.Type: GrantFiled: May 9, 2022Date of Patent: June 11, 2024Assignee: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Amir H. Safavi-Naeini, Timothy Patrick McKenna, Hubert S. Stokowski
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Patent number: 12001120Abstract: An optical device including a plurality of electrodes, an electro-optic component, an optical grating, and a buried back reflector is described. The electro-optic component includes at least one optical material exhibiting an electro-optic effect. The optical grating is optically coupled with the electro-optic component. In some embodiments, the optical grating includes a vertical optical grating coupler. The buried back reflector is optically coupled with the optical grating. The buried back reflector is configured to increase a coupling efficiency of the optical grating to an out-of-plane optical mode and configured to reduce a performance perturbation to the plurality of electrodes. The buried back reflector may include a metal layer having a thickness of at least thirty nanometers and not more than five hundred nanometers.Type: GrantFiled: December 20, 2021Date of Patent: June 4, 2024Assignee: HyperLight CorporationInventors: Mian Zhang, Kevin Luke, Prashanta Kharel, Christian Reimer, Lingyan He
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Patent number: 11994426Abstract: A photon counting device includes unit cells, a bias current source coupled to the unit cells, and a waveguide coupled to the unit cells. Each unit cell includes photodetector(s). Each photodetector includes superconducting component(s) and a transistor. The transistor includes a superconducting gate that is coupled in parallel with the photodetector(s), and a channel that is electrically isolated from the superconducting gate. For each unit cell, a photodetector is optically coupled to the waveguide. A superconducting component is configured to transition from the superconducting state to the non-superconducting state in response to a photon being incident upon the superconducting component while the superconducting component receives at least a portion of bias current output from the bias current source.Type: GrantFiled: November 13, 2020Date of Patent: May 28, 2024Assignee: PSIQUANTUM CORP.Inventors: Faraz Najafi, Eric Dudley
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Patent number: 11977256Abstract: Various embodiments of the present disclosure are directed towards a semiconductor package comprising optically coupled integrated circuit (IC) chips. A first IC chip and a second IC chip overlie a substrate at a center of the substrate. A photonic chip overlies the first and second IC chips and is electrically coupled to the second IC chip. A laser device chip overlies the substrate, adjacent to the photonic chip and the second IC chip, at a periphery of the substrate. The photonic chip is configured to modulate a laser beam from the laser device chip in accordance with an electrical signal from the second IC chip and to provide the modulated laser beam to the first IC chip. This facilitates optical communication between the first IC chip to the second IC chip. Various embodiments of the present disclosure are further directed towards simultaneously aligning and bonding constituents of the semiconductor package.Type: GrantFiled: May 23, 2022Date of Patent: May 7, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Tsung Shih, Hau-Yan Lu, Wei-Kang Liu, Yingkit Felix Tsui
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Patent number: 11971592Abstract: The present disclosure provides a method for stacking a plurality of optical fibre ribbons in an optical fibre cable. The method includes a step of arranging a plurality of optical fibre ribbon stacks in a hexagonal arrangement in the optical fibre cable. The method may further include stacking the plurality of optical fibre ribbons to form an optical fibre ribbon stack such that the optical fibre ribbon stack may have a parallelogram shape. Each optical fibre ribbon is placed at an offset from adjacent optical fibre ribbon. The optical fibre ribbon stack may have a stack height. In addition, each optical fibre ribbon of the plurality of optical fibre ribbons may have a ribbon height. The hexagonal arrangement may have the packaging density greater than 80%.Type: GrantFiled: December 31, 2020Date of Patent: April 30, 2024Inventors: Badri Gomatam, Manish Sinha
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Patent number: 11971757Abstract: In embodiments, an electronic device may include a housing, a display panel, and an optical sensor module. The display panel is disposed in an inner space of the housing and is at least partially visible from an outside through the housing, the display including a display area, a first non-display area disposed adjacent to at least a peripheral portion of the display area, and a second non-display area disposed adjacent to at least a peripheral portion of the first non-display area. The optical sensor module is disposed in the inner space at least partially overlapping the display panel, and includes a flexible printed circuit board (FPCB), a light emitting structure disposed on the FPCB at least partially overlapping the first non-display area when the display panel is viewed from above, and a light receiving structure disposed on the FPCB at least partially overlapping the display area when the display panel is viewed from above.Type: GrantFiled: July 14, 2020Date of Patent: April 30, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jongah Kim, Jeongho Cho, Heewoong Yoon, Donghan Lee
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Patent number: 11960131Abstract: Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.Type: GrantFiled: January 13, 2022Date of Patent: April 16, 2024Inventors: Michael J. Bishop, Vijay M. Iyer, Jason S. Pelc, Mario J. Costello
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Patent number: 11960152Abstract: A method for adjusting a transmission wavelength of signal light transmitted through an optical waveguide device provided with one or more optical waveguides through which the signal light having a wavelength of 1520 nm to 1560 nm and blue light having a wavelength of 375 nm to 455 nm pass, a groove through which the waveguide passes, and resin filled in the groove, including a step of passing the signal light and the blue light through the same or mutually different one or more optical waveguides and of passing the signal light and the blue light through the same or mutually different resin, the latter step changing a refractive index of the resin by irradiating the resin with the blue light so as to change the transmission wavelength of the signal light transmitted through the resin in accordance with a change in the refractive index of the resin.Type: GrantFiled: July 26, 2019Date of Patent: April 16, 2024Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Katsuhiko Hirabayashi, Nobutatsu Koshobu, Satomi Katayose, Ryoichi Kasahara
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Patent number: 11963291Abstract: A packaging assembly and methodology provide a PCB substrate with one or more waveguide apertures and a conductive pattern which includes a plurality of landing pads that are disposed around peripheral edges of each waveguide aperture and that are connected to one another by trace lines so that, upon attachment and reflow of solder balls to the plurality of landing pads, the solder balls reflow along the trace lines to form a fully closed solder waveguide shielding wall disposed around peripheral edges of the first waveguide aperture.Type: GrantFiled: April 21, 2022Date of Patent: April 16, 2024Assignee: NXP B.V.Inventors: Leo van Gemert, Michael B. Vincent
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Patent number: 11953725Abstract: A device includes a dielectric layer, a plurality of grating structures, and a dielectric material between the plurality of grating structures and on top of the plurality of grating structures. The grating structures are arranged on the dielectric layer and separated from each other, the plurality of grating structures each having a bottom portion and top portion, the top portion having a first width and the bottom portion having a second width, the second width being larger than the first width.Type: GrantFiled: September 1, 2021Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Feng-Wei Kuo, Chewn-Pu Jou, Hsing-Kuo Hsia
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Patent number: 11953727Abstract: A device coupon for use in a hybrid integration process with a silicon platform. The device coupon comprises: an input waveguide, including an input facet; an active waveguide, coupled to the input waveguide, the active waveguide including a III-V semiconductor based electro-optical device; and an output waveguide, configured to couple light between the active waveguide and an output facet. The input waveguide and output waveguide are passive waveguides.Type: GrantFiled: May 12, 2021Date of Patent: April 9, 2024Assignee: Rockley Photonics LimitedInventors: Guomin Yu, Aaron John Zilkie
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Patent number: 11947172Abstract: An optical probe package structure is provided, used in a test environment for testing a plurality of optical chips on a wafer, including: a main body, an optical fiber, an optical fiber positioning area, a mode field conversion waveguide structure, and an optical waveguide. Wherein, the mode field conversion waveguide structure is used to convert the propagation field of the optical signal, and the optical signal transmitted by the mode field conversion waveguide structure enters the optical waveguide. The optical waveguide has an emitting end, and the emitting end is provided with a facet, the facet has a facet angle, and the facet angle makes the optical signal after field conversion mode field conversion to produce total reflection and output along a second direction. The optical signal after total reflection enters the optical chips. Thereby, an optical probe package structure that can test before wafer cutting and polishing is provided.Type: GrantFiled: July 12, 2022Date of Patent: April 2, 2024Assignee: FOCI FIBER OPTIC COMMUNICATIONS, INC.Inventors: Ting-Ta Hu, Hsu-Liang Hsiao, Po-Yi Wu
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Patent number: 11947200Abstract: The present disclosure relates to optical phase modulation devices. The optical phase modulation devices may include a heater resistance which induces a phase change and control systems and methods of controlling the induced phase change.Type: GrantFiled: September 30, 2020Date of Patent: April 2, 2024Assignee: MACOM Technology Solutions Holdings, Inc.Inventors: Quazi Ikram, Ronald Scott Karfelt, Steven Nguyen, Nicholas Karfelt, Saman Jafarlou, Swetha Babu
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Patent number: 11934022Abstract: A photoelectric fiber includes a fiber including a core through which light is guided; an electrical unit formed continuously with the fiber, the electrical unit being configured to house a photoelectric conversion chip including a photoelectric conversion element; and an external electrode formed on a front surface of at least one of the fiber or the electrical unit, wherein the photoelectric conversion chip is optically connected to the core and electrically connected to the external electrode.Type: GrantFiled: July 18, 2019Date of Patent: March 19, 2024Assignee: Nippon Telegraph and Telephone CorporationInventors: Norio Sato, Atsushi Aratake, Makoto Abe, Takuya Tanaka, Kota Shikama, Takao Fukumitsu, Hiroshi Ishikawa
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Patent number: 11934007Abstract: An assembly of an active semiconductor component and of a silicon-based passive optical component includes a carrier; and the active semiconductor component and the passive optical component both arranged on the carrier. The active semiconductor component includes a first set of semiconductor layers comprising at least one first waveguide configured to guide, in a first section of the assembly, at least one first optical mode; a second set of semiconductor layers, the set being superposed and making contact with the first set of layers, and including at least one second waveguide configured to guide at least one second optical mode. At least some of the layers of the first set of layers and of the second set of layers are doped to form, in a first region of the component, a PIN diode. The at least one first waveguide and the at least one second waveguide are configured to allow evanescent coupling therebetween, in a second section of the assembly.Type: GrantFiled: July 3, 2020Date of Patent: March 19, 2024Assignee: ALMAE TECHNOLOGIESInventors: Hélène Debregeas, François Lelarge, David Carrara
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Patent number: 11929357Abstract: An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.Type: GrantFiled: October 20, 2021Date of Patent: March 12, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jr-Wei Lin, Mei-Ju Lu
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Patent number: 11914264Abstract: Photonic ring modulators with high tuning efficiency and small footprint can be formed in a hybrid material platform from a silicon bus waveguide vertically coupled to an optically active compound semiconductor (e.g., III-V) ring resonator. The performance of the modulator, e.g., in terms of the tuning efficiency and the maximum insertion loss, may be optimized by suitable levels of an applied bias voltage and a heater power of a heater optionally included in the ring modulator. The disclosed hybrid photonic ring modulators may be used, e.g., in photonic transceiver circuits with high lane count.Type: GrantFiled: October 7, 2020Date of Patent: February 27, 2024Assignee: OpenLight Photonics, Inc.Inventors: John Parker, Jonathan Edgar Roth, Gregory Alan Fish
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Patent number: 11914201Abstract: A multi-chip photonic assembly includes first and second photonic integrated circuits having first and second waveguides vertically stacked such that first vertical dimensions of the first and second waveguides occupy different horizontal planes in the stack. At least one of the first and second waveguides has a region that has a second vertical dimension that is larger than the first vertical dimension and either horizontally overlaps the other waveguide and/or vertically contacts the other waveguide. Light moving through one of the waveguides from the first vertical dimension to the other vertical dimension changes modes vertically so that the light moves from one waveguide to the other.Type: GrantFiled: May 20, 2022Date of Patent: February 27, 2024Assignee: Apple Inc.Inventors: Jeremy D. Witmer, Alfredo Bismuto
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Patent number: 11906802Abstract: An apparatus includes a substrate that includes one or more routing layers, and an optical module coupled to the substrate. The optical module includes a photonic integrated circuit (PIC) and electronic integrated circuit (EIC), wherein the photonic integrated circuit is at least partially embedded within the substrate. The apparatus further includes a fiber optic coupler coupled to at least one of the substrate or PIC, wherein the PIC is configured to transmit or receive an optical signal via the fiber optic coupler.Type: GrantFiled: May 10, 2022Date of Patent: February 20, 2024Assignee: Avago Technologies International Sales Pte. LimitedInventors: Mayank Mayukh, Sam Zhao, Sam Karikalan, Reza Sharifi, Liming Tsau, Arun Ramakrishnan, Dharmendra Saraswat
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Patent number: 11899254Abstract: A photonic integrated circuit including an InP-based substrate that is provided with a first InP-based optical waveguide and a neighboring second InP-based optical waveguide, a dielectric planarization layer that is arranged at least between the first optical waveguide and the second optical waveguide. At least between the first optical waveguide and the neighboring second optical waveguide, the dielectric planarization layer is provided with a recess that is arranged to reduce or prevent optical interaction between the first optical waveguide and the second optical waveguide via the dielectric planarization layer. At the location of the recess, the dielectric planarization layer has a first sidewall that is arranged sloped towards the first optical waveguide, and a second sidewall that is arranged sloped towards the second optical waveguide. An opto-electronic system including said PIC.Type: GrantFiled: March 16, 2022Date of Patent: February 13, 2024Assignee: EFFECT PHOTONICS B.V.Inventor: Tsjerk Hans Hoekstra
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Patent number: 11892678Abstract: A photonic device includes a silicon layer, wherein the silicon layer extends from a waveguide region of the photonic device to a device region of the photonic device, and the silicon layer includes a waveguide portion in the waveguide region. The photonic device further includes a cladding layer over the waveguide portion, wherein the device region is free of the cladding layer. The photonic device further includes a low refractive index layer in direct contact with the cladding layer, wherein the low refractive index layer comprises silicon oxide, silicon carbide, silicon oxynitride, silicon carbon oxynitride, aluminum oxide or hafnium oxide. The photonic device further includes an interconnect structure over the low refractive index layer.Type: GrantFiled: August 26, 2021Date of Patent: February 6, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chien-Ying Wu, Yuehying Lee, Sui-Ying Hsu, Chen-Hao Huang, Chien-Chang Lee, Chia-Ping Lai
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Patent number: 11894312Abstract: A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.Type: GrantFiled: July 20, 2022Date of Patent: February 6, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wei-Yu Chen, Chun-Chih Chuang, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu
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Patent number: 11886004Abstract: Provided is a planar lightwave circuit in which stress on a substrate is reduced to decrease the curve of the substrate. The planar lightwave circuit is formed by layering a glass film on the substrate. When the optical axis direction from an input waveguide toward an output waveguide is in the longitudinal direction of the substrate, a plurality of grooves are formed in a line in the transverse direction of the substrate.Type: GrantFiled: July 9, 2019Date of Patent: January 30, 2024Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Junji Sakamoto, Toshikazu Hashimoto
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Patent number: 11874497Abstract: A photonic chip and a preparation method thereof are provided. The chip includes a lithium niobate film modulator array, a first optical coupling array, and a silica waveguide wavelength-division multiplexer, and the lithium niobate film modulator array includes one or more lithium niobate film modulators and is used to modulate an optical signal; the first optical coupling array includes one or more first optical coupling structures, and the first optical coupling structure has one end connected to a corresponding lithium niobate thin film modulator and the other end connected to the silica waveguide wavelength-division multiplexer so as to transmit the modulated optical signal to the silica waveguide wavelength-division multiplexer; and the silica waveguide wavelength-division multiplexer is used to perform wavelength-division multiplexing on the modulated optical signal.Type: GrantFiled: July 17, 2019Date of Patent: January 16, 2024Assignee: INSTITUTE OF SEMICONDUCTORS, CHINESE ACADEMY OF SCIENCESInventors: Lin Yang, Shanglin Yang, Lei Zhang
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Patent number: 11874495Abstract: A monolithic InP-based PIC having a first photonic assembly that has a first optical splitter-combiner unit having a first end part that is optically connected with a first optical waveguide and a second end part that is optically connected with a first main photonic circuit and a first auxiliary photonic circuit. The first auxiliary photonic circuit has a first laser unit, and a first SOA. The first SOA is configurable to be in a first operational state in which the first SOA allows optical communication between the first laser unit and the first optical splitter-combiner unit, or a second operational state in which the first SOA prevents optical communication between the first laser unit and the first optical splitter-combiner unit. An opto-electronic system including the PIC.Type: GrantFiled: February 16, 2022Date of Patent: January 16, 2024Assignee: EFFECT PHOTONICS B.V.Inventors: Tim Koene, Niall Patrick Kelly