Integrated Optical Circuit Patents (Class 385/14)
  • Patent number: 10168473
    Abstract: An optoelectronic device includes an integrated circuit including electronic devices formed on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the semiconductor substrate. A photonics layer is formed on the barrier layer. The photonics layer includes a core for transmission of light and a cladding layer encapsulating the core and including a different index of refraction than the core. The core is configured to couple light generated from a component of the optoelectronic device.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: January 1, 2019
    Assignee: International Business Machines Corporation
    Inventors: Russell A. Budd, Effendi Leobandung, Ning Li, Jean-Olivier Plouchart, Devendra K. Sadana
  • Patent number: 10168495
    Abstract: An optical waveguide includes a laminate including a lower cladding, a core on the lower cladding, and an upper cladding positioned on the lower cladding and covering the core, via holes positioned in the laminate in a spaced opposing relation to each other, a cavity positioned over a span from an upper surface of the upper cladding to the lower cladding, the cavity including a sectional surface sectioning the core obliquely relative to the upper surface of the upper cladding, and a reflective surface positioned in the core and defined by part of the sectional surface, wherein the cavity extends from a region between the via holes in the spaced opposing relation toward the outside of the region, and an opening size of the cavity in the region is smaller than an opening size of the cavity outside the region when viewed in an opposing direction of the via holes.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: January 1, 2019
    Assignee: Kyocera Corporation
    Inventors: Akifumi Sagara, Ai Iwakura
  • Patent number: 10162112
    Abstract: An optical wire bond apparatus for optically connecting an optical-electrical integrated circuit (OE-IC) to an optical-electrical printed circuit board (OE-PCB) is formed by laser writing cores in a flexible glass support member to define an array of optical waveguides. The support member has a bend section and the waveguides reside close to either a top or bottom surface of the support member at the bend section. The cores have a front-end portion that can be laser written after the front end of the support member is coarse-aligned to optical waveguide structures in the OE-PCB to obtain fine alignment. The support members can be formed from flexible glass sheets or by drawing a glass preform. A photonic assembly that includes the OE-IC and the OE-PCB optically connected using the optical wire bond apparatus is also disclosed.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: December 25, 2018
    Assignee: Corning Optical Communications LLC
    Inventor: James Scott Sutherland
  • Patent number: 10162137
    Abstract: A mounting apparatus for mounting an optical element on a wiring board having a reflecting mirror part of an optical waveguide on its back side comprises a mounting table that supports the wiring board by a holding area, a mounting nozzle that holds the optical element and mounts it on the wiring board, a light source that emits light for illuminating the reflecting mirror part by transmission through the holding area, an image pickup apparatus that captures a transmitted light image of the reflecting mirror part, and a control apparatus that determines a mounting position of the optical element based on the transmitted light image, thereby achieving high density mounting without providing a light introducing part for positioning in mounting the optical axis.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: December 25, 2018
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Toru Mizuno, Hiroshi Ikeda, Tatsunori Otomo, Toshinobu Miyagoshi, Shoji Takano, Fumihiko Matsuda, Garo Miyamoto
  • Patent number: 10156678
    Abstract: A composite optical waveguide is constructed using an array of waveguide cores, in which one core is tapered to a larger dimension, so that all the cores are used as a composite input port, and the one larger core is used as an output port. In addition, transverse couplers can be fabricated in a similar fashion. The waveguide cores are preferably made of SiN. In some cases, a layer of SiN which is provided as an etch stop is used as at least one of the waveguide cores. The waveguide cores can be spaced away from a semiconductor layer so as to minimize loses.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: December 18, 2018
    Assignee: Elenion Technologies, LLC
    Inventors: Ari Novack, Ruizhi Shi, Michael J. Hochberg, Thomas Baehr-Jones
  • Patent number: 10151878
    Abstract: An optical axis adjustment method for optical interconnection, includes: providing, on a substrate, an optical transmitter including light sources and a mark for acquiring a position of each of the light sources; providing, on the substrate, an optical waveguide including cores each allowing light emitted from the respective light sources to propagate through the core; determining a first position based on the mark as a position of each of the light sources; and forming, at a second position in the optical waveguide corresponding to the first position, first mirrors configured to reflect the light emitted from the respective light sources and make the light propagate through the respective cores.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: December 11, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Kohei Choraku, Akiko Matsui, Tetsuro Yamada, Yoshiyuki Hiroshima
  • Patent number: 10139278
    Abstract: Described herein are optical sensing devices for photonic integrated circuits (PICs). A PIC may comprise a plurality of waveguides formed in a silicon on insulator (SOI) substrate, and a plurality of heterogeneous lasers, each laser formed from a silicon material of the SOI substrate and to emit an output wavelength comprising an infrared wavelength. Each of these lasers may comprise a resonant cavity included in one of the plurality of waveguides, and a gain material comprising a non-silicon material and adiabatically coupled to the respective waveguide. A light directing element may direct outputs of the plurality of heterogeneous lasers from the PIC towards an object, and one or more detectors may detect light from the plurality of heterogeneous lasers reflected from or transmitted through the object.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: November 27, 2018
    Assignee: Aurrion, Inc.
    Inventors: Gregory Alan Fish, Jonathan Edgar Roth, Brandon Buckley
  • Patent number: 10135539
    Abstract: Devices and techniques for integrated optical data communication. A method of encoding symbols in an optical signal may include encoding a first symbol by injecting charge carriers, at a first rate, into a semiconductor device, such as a PIN diode. The method may also include encoding a second symbol by injecting charge carriers, at a second rate, into the semiconductor device. The first rate may exceed the second rate. A modulator driver circuit may include a resistive circuit coupled between supply terminal and drive terminals. The modulator driver circuit may also include a control circuit coupled between a data terminal and the resistive circuit. The control circuit may modulate a resistance of the resistive circuit by selectively coupling one or more of a plurality of portions of the resistive circuit to the drive terminal based on data to be optically encoded.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: November 20, 2018
    Assignee: Massachusetts Institute of Technology
    Inventors: Benjamin Roy Moss, Jason Scott Orcutt, Vladimir Marko Stojanovic
  • Patent number: 10126502
    Abstract: In a waveguide device, unnecessary optical power is appropriately terminated. According to an embodiment of the present invention, the waveguide device has a termination structure filled with a light blocking material to terminate light from a waveguide end. In the termination structure, a cladding and a core are removed to form a groove on an optical waveguide. The groove is filled with a material (light blocking material) that attenuates the intensity of light. Thus, light input to the termination structure is attenuated by the light blocking material, suppressing crosstalk which possibly effects on other optical devices. Thus, such a termination structure can restrain crosstalk occurred in optical devices integrated in the same substrate and can also suppress crosstalk which possibly effects on any other optical device connected directly to the substrate.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: November 13, 2018
    Assignees: NTT ELECTRONICS CORPORATION, NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Takanori Ishikawa, Tomoyo Shibazaki, Mitsuru Nagano, Masahiro Yanagisawa, Hiroshi Terui, Mikitaka Itoh
  • Patent number: 10120128
    Abstract: A semiconductor device includes: a first substrate; a surface insulating film formed over an upper surface of the first substrate; a BOX layer formed over the surface insulating film; an optical waveguide made of an SOI layer formed on the BOX layer; and a first interlayer insulating film formed over the BOX layer so as to cover the optical waveguide. The semiconductor device further includes: a trench formed in the surface insulating film and the first substrate below the optical waveguide; and a cladding layer made of a buried insulating film buried in the trench. A thickness of the BOX layer is 1 ?m or less, and a distance from an interface between the optical waveguide and the BOX layer to a bottom surface of the trench is 2 ?m or more.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: November 6, 2018
    Assignee: Renesas Electronics Corporation
    Inventors: Tetsuya Iida, Yasutaka Nakashiba
  • Patent number: 10122464
    Abstract: An optical module includes a substrate, a package, and a flexible substrate. The substrate is provided with an electrode. The package includes a housing fixed to the substrate, a receiving unit that optically demodulates a received optical signal to convert the optical signal into a reception electrical signal, an output terminal that is provided on a surface of the housing and outputs the reception electrical signal, an input terminal that is provided at a height from the substrate different from a height of the output terminal and receives a transmission electrical signal, and a transmitting unit that optically modulates the transmission electrical signal received from the input terminal and transmits an optical signal resulting from optical modulation. A flexible substrate has flexibility and includes a signal electrode that connects one of the output terminal and the input terminal to the electrode arranged on the substrate.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: November 6, 2018
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventor: Masaki Sugiyama
  • Patent number: 10120126
    Abstract: Methods and systems for partial integration of wavelength division multiplexing and bi-directional solutions are disclosed and may include, an optical transceiver on a silicon photonics integrated circuit coupled to a planar lightwave circuit (PLC). The silicon photonics integrated circuit may include a first modulator and first light source that operates at a first wavelength and a second modulator and second light source that operates at a second wavelength. The transceiver and PLC are operable to modulate a first continuous wave (CW) optical signal from the first light source utilizing the first modulator and modulate a second CW optical signal from the second light source utilizing the second modulator. The modulated signals may be communicated from the modulators to the PLC utilizing a first pair of grating couplers in the IC and combined in the PLC.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: November 6, 2018
    Assignee: Luxtera, Inc.
    Inventors: Brian Welch, Attila Mekis, Steffan Gloeckner
  • Patent number: 10109660
    Abstract: A laminated semiconductor device includes: a first semiconductor element provided with a photoelectric conversion region on its main surface; an extended portion extended outwardly from a side end surface of the first semiconductor element; a redistribution layer formed on a first surface of the extended portion; a second semiconductor element provided on the main surface of the first semiconductor element so as to extend to the extended portion from an outside of the photoelectric conversion region, the second semiconductor element being electrically connected to the first semiconductor element and the redistribution layer; and a first electrode pad formed on the redistribution layer and electrically connected to the second semiconductor element via the redistribution layer.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: October 23, 2018
    Assignee: PANASONIC CORPORATION
    Inventors: Shigefumi Dohi, Toshitaka Akahoshi
  • Patent number: 10107977
    Abstract: An optical transceiver comprising: an optical transmitter having plurality of light sources controllable to generate optical signals in different optical channels, an output aperture, an optical multiplexer that multiplexes optical signals generated by the light sources and transmits them to exit the transceiver from the output aperture; an optical receiver having a plurality of optical sensors, an input aperture for receiving optical signals in a plurality of optical channels, a demultiplexer that demultiplexes signals received at the input aperture, and directs signals received in different channels to different optical sensors of the plurality of optical sensors; and a QSFP compliant housing that houses the transmitter and receiver.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: October 23, 2018
    Assignee: COLORCHIP (ISRAEL) LTD.
    Inventors: David Brooks, Eli Arad
  • Patent number: 10109821
    Abstract: An apparatus for light diffraction and an organic light emitting diode (OLED) incorporating the light diffraction apparatus is disclosed. An apparatus for light diffraction may comprise an optional planarization layer, a transparent substrate, a waveguide layer. The planarization layer may have a refractive index of ns. The transparent substrate may have a refractive index of ng. The waveguide layer may have a refractive index nw distributed over of the transparent substrate. The waveguide layer may comprise a binding matrix, at least one nanoparticle. The waveguide layer may be interposed between the transparent substrate and the optional planarization layer.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: October 23, 2018
    Assignee: Corning Incorporated
    Inventors: David Eugene Baker, Li Liu, Pamela Arlene Maurey, Robert Adam Modavis, Daniel Aloysius Nolan, Wageesha Senaratne
  • Patent number: 10110402
    Abstract: A PAM4 signal generation apparatus is provided. The PAM4 signal generation apparatus includes a DFB, two EA modulators, an SOA, a PSR, a direct-current power source, two electrical-signal generators, and two amplitude-limiting amplifiers. The two electrical-signal generators and the two amplitude-limiting amplifiers are used to generate two NRZ electrical signals respectively, the DFB outputs two optical signals, the SOA amplifies an optical power of one of the optical signals, the two EA modulators use the NRZ electrical signals and the optical signals including “a large signal and a small signal” respectively to generate two NRZ optical signals respectively, and the two NRZ optical signals are multiplexed by the PSR to generate a PAM4 electrical signal. According to this apparatus, a linearity requirement is greatly lowered. PAM4 modulation is performed in an optical domain, and this prevents a PAM4 signal from being generated on an electrical signal.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: October 23, 2018
    Assignee: Hisilicon Optoelectronics Co., Limited
    Inventors: Hongmin Chen, Zhenwei Cui, Xi Huang
  • Patent number: 10107976
    Abstract: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: October 23, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventors: Daming Liu, John Zyskind
  • Patent number: 10101533
    Abstract: An integrated optical device fabricated in the back end of line process located within the vertical span of the metal stack and having one or more advantages over a corresponding integrated optical device fabricated in the silicon on insulator layer.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: October 16, 2018
    Assignee: Elenion Technologies, LLC
    Inventors: Ruizhi Shi, Michael J. Hochberg, Ari Jason Novack, Thomas Wetteland Baehr-Jones
  • Patent number: 10088698
    Abstract: An optical device includes: an electro-optical element; a connector for input and output of an electric signal; a relay substrate electrically connecting the connector and the optical element; a pair of support parts supporting the relay substrate; and a housing accommodating the optical element, the relay substrate, and the pair of support parts, in which the optical element includes a substrate having an optical waveguide formed therein, and a modulation electrode formed on a surface of the substrate, the relay substrate includes a dielectric substrate, and a signal electrode and a ground electrode provided on one principal surface of the dielectric substrate, the signal electrode and the ground electrode are electrically connected to the modulation electrode and the connector, the support parts clamps the relay substrate, and an air gap is formed between the other principal surface of the relay substrate and an inner bottom surface of the housing.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: October 2, 2018
    Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
    Inventors: Yoshizumi Ishikawa, Shingo Takano
  • Patent number: 10090451
    Abstract: Described embodiments include photonic integrated circuits and systems with photonic devices, including thermal isolation regions for the photonic devices. Methods of fabricating such circuits and systems are also described.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: October 2, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Roy Meade, Gurtej Sandhu
  • Patent number: 10088627
    Abstract: A waveguide corner structure includes a plate on which mirrors are formed; and a waveguide member including waveguide cores and holes, each of the holes being drilled in a portion replacing an angular bent portion of corresponding waveguide cores. The plate is mounted on the waveguide member so that each of the mirrors is inserted in corresponding one of the holes for a change of a direction of a light beam at the portion of corresponding waveguide cores.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: October 2, 2018
    Assignee: International Business Machines Corporation
    Inventors: Jean Benoit Heroux, Hsiang Han Hsu
  • Patent number: 10088628
    Abstract: The optical waveguide element has a first optical waveguide core; and a second optical waveguide core. In the optical waveguide element, the first optical waveguide core includes a first coupling portion configured to propagate any one polarized wave of a TE polarized wave and a TM polarized wave of a kth-order mode, the other polarized wave of an hth-order mode, and the other polarized wave of a pth-order mode, and a first Bragg reflector connected to the first coupling portion. The second optical waveguide core includes a second coupling portion.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: October 2, 2018
    Assignees: Oki Electric Industry Co., Ltd., PHOTONICS ELECTRONICS TECHNOLOGY RESEARCH ASSOCIATION
    Inventors: Yousuke Oonawa, Hideaki Okayama
  • Patent number: 10082685
    Abstract: An optical system can automatically lock an adjustable spectral filter to a first wavelength of an incoming light signal, and can automatically filter an additional incoming light signal at the first wavelength. A tunable filter can have a filtering spectrum with an adjustable peak wavelength and increasing attenuation at wavelengths away from the adjustable peak wavelength. The tunable filter can receive first input light, having a first wavelength, and can spectrally filter the first input light to form first output light. A detector can detect at least a fraction of the first output light. Circuitry coupled to the detector and the tunable filter can tune the tunable filter to maximize a signal from the detector and thereby adjust the peak wavelength to match the first wavelength. The tunable filter further can receive second input light and spectrally filter the second input light at the first wavelength.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: September 25, 2018
    Assignee: Aurrion, Inc.
    Inventor: Robert Silvio Guzzon
  • Patent number: 10082683
    Abstract: An optical modulator includes: a ferroelectric substrate in which an input optical waveguide, a pair of branched optical waveguides, and an output optical waveguide are formed; a signal electrode that is formed in a vicinity of at least one of the pair of branched optical waveguides; a first protection member that is attached to an input end of the ferroelectric substrate in which the input optical waveguide is formed; and a second protection member that is attached to an output end of the ferroelectric substrate in which the output optical waveguide is formed. The first protection member and the second protection member have a Mohs hardness that is less than or equal to a Mohs hardness of the ferroelectric substrate, and are formed of a glass material that does not have a pyroelectric effect.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: September 25, 2018
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventors: Yoshihiko Yoshida, Masaharu Doi, Yoshinobu Kubota
  • Patent number: 10073230
    Abstract: An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: September 11, 2018
    Assignee: Arista Networks, Inc.
    Inventors: Robert Wilcox, Richard Hibbs, Warren Meggitt, Andreas Bechtolsheim, Jiayi Wu, Christophe Metivier
  • Patent number: 10067305
    Abstract: The optical includes a waveguide positioned on a base and an optical component positioned on the base. The optical component is a light sensor that includes an active medium or a modulator that includes an active medium. The waveguide is configured to guide a light signal through the component such that the light signal is guided through the active medium. The device includes one or more heat control features selected from the group consisting of: placing one or more thermal conductors over a lateral side of a ridge of the active medium; extending thermal conductors from within the active component to a location outside of the active component, and tapering the ridge of the active medium within the perimeter of the active component.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: September 4, 2018
    Assignee: Mellanox Technologies Silicon Photonics Inc.
    Inventor: Dazeng Feng
  • Patent number: 10070208
    Abstract: A large-scale switching system deployed as a global network or a large-scale data center includes a large number of access nodes (edge nodes) interconnected through optical or electronic rotators. The rotators are logically arranged in a matrix and each access node has a channel to each rotator in a respective row and a channel from each rotator of a respective column of the matrix. A dual timing circuit coupled to a diagonal rotator pair exchanges timing data with edge nodes connecting to the diagonal rotator pair to facilitate temporal alignment of data received at input ports of each rotator. Each access node has a path to each other access node traversing only one of the rotators. The rotators may be arranged into constellations of collocated rotators to facilitate connectivity of access nodes to rotators using wavelength-division-multiplexed links.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: September 4, 2018
    Inventor: Maged E. Beshai
  • Patent number: 10069270
    Abstract: This disclosure provides planar waveguides with enhanced support and/or cooling. One or more endcaps could be disposed between coating/cladding layers at one or more ends of a core region, where the core region is doped with at least one active ion species and each endcap is not doped with any active ion species that creates substantial absorption at pump and signal wavelengths. A core region could include at least one crystal or crystalline material, and at least one cladding layer could include at least one glass. Different types of coolers could be disposed on or adjacent to different coating/cladding layers. Side claddings could be disposed on opposite sides of a planar waveguide, where the opposite sides represent longer sides of the waveguide. Endcaps and one or more coolers could be sealed to a housing, and coolant can flow through a substantially linear passageway along a length of the waveguide. One side of a planar waveguide could be uncooled.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: September 4, 2018
    Assignee: Raytheon Company
    Inventors: Stephen H. McGanty, David M. Filgas, Christopher R. Koontz
  • Patent number: 10061084
    Abstract: A coupling structure of optical components has a first optical component, a second optical component and a coupling solder layer. The first optical component has a lensed fiber, a first holder holding the lensed fiber and a first metal layer formed on a first connecting end face of the first holder. The second optical component has a waveguide, a second holder holding the waveguide and a second metal layer formed on a second connecting end face of the second holder. The coupling solder layer is in direct contact with both of the first metal layer and the second metal layer, and formed with solder.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: August 28, 2018
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Seiichi Takayama, Kiyohiko Abe, Ryuji Fujii, Takashi Honda, Shi Xiong Chen, Osamu Harakawa
  • Patent number: 10061080
    Abstract: A device and system for coupling optical vortex multiplexed light into and out of a photonic integrated circuit. The multi-mode forked grating coupler device comprises: (i) a multi-mode forked grating structure configured to receive at least one optical vortex multiplexed light beam, wherein the multi-mode forked grating structure comprises at least one forked region positioned amidst a plurality of grooves, wherein the forked region comprises a single groove forking into two grooves, wherein the single groove is noncontiguous with the two grooves, and wherein the plurality of grooves comprise a central bending region; (ii) an optical waveguide; and (iii) a tapered portion connecting the forked grating structure and the multi-mode optical “bus” waveguide.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: August 28, 2018
    Assignee: Clarkson University
    Inventors: Christopher T. Nadovich, William D. Jemison
  • Patent number: 10050704
    Abstract: Several embodiments of a system and method of an optical-frequency (OF) synthesizer are disclosed that produces an optical frequency (OF) tone derived from a dispersive resonator and phase-locking to a radio frequency (RF) tone to achieve high precision. Thus, the stability of the synthesized OF tone is related to the stability of the RF tone. A frequency control word provides for a wide range of programmability to the frequency of the output OF tone. The OF synthesizer establishes the absolute value of the optical frequency of its output tone by making use of a dispersive optical resonator and applying appropriate corrections obtained dynamically by interrogating the comb lines. The reference resonator defines a semi-dormant OF reference comb, wherein the lines of that reference comb are associated with the modes of the reference resonator. Several selected modes of this reference resonator are interrogated by locking the frequency of light emitted by lasers to those resonator modes.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: August 14, 2018
    Assignee: HRL Laboratories, LLC
    Inventor: Daniel Yap
  • Patent number: 10042115
    Abstract: An electro-optic device may include a substrate layer, and a first photonic layer over the substrate layer and having a first photonic device. The electro-optic device may include a second photonic layer over the first photonic layer and having a second photonic device. The electro-optic device may include a dielectric layer over the second photonic layer, and a first electrically conductive via extending through the dielectric layer and the second photonic layer to couple to the first photonic device, and a second electrically conductive via extending through the dielectric layer and coupling to the second photonic device. The electro-optic device may include a third electrically conductive via extending through the substrate layer, the second photonic layer, and the first photonic layer to couple to the substrate layer.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: August 7, 2018
    Assignee: STMICROELECTRONICS (CROLLES 2) SAS
    Inventors: Frédéric Boeuf, Charles Baudot
  • Patent number: 10043476
    Abstract: The present application discloses a display panel and an angle-cutting circuit. The angle-cutting circuit includes the angle-cutting chip, the comparison module and the adjustment module, the adjustment module is coupled to the angle-cutting chip and the comparison module; the output terminal of the angle-cutting chip is used to output the angle-cutting voltage, the first input terminal of the comparison module is coupled to the output terminal of the angle-cutting chip to obtain the first voltage; the first voltage is compared to the preset threshold voltage in the comparison module, when the first voltage is less than the threshold voltage, a control signal is generated from the comparison module, and the lower limit value of the angle-cutting voltage is raised by the adjustment module according to the control signal. By the technology described above, the accuracy of angle-cutting voltage of the present application is increased, and improve product performance.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: August 7, 2018
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventor: Dan Cao
  • Patent number: 10042091
    Abstract: A planar optical device, comprised of sets of nanometer-scale holes milled into a thin metal or ceramic film of subwavelength thickness serves to form arbitrary waveform of light. The holes form a pattern, preferrably rings, of various sizes in order to achieve a given phase front of light due to photonic effect. When designed as a lens, the device focuses incident light into a tight focal spot. In symmetric design, the focusing property of the device does not depend on the incident polarization angle. The lens can be manufactured based on high-throughput fabrication methods and easily integrated with a chip or placed at the end of an optical fiber.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: August 7, 2018
    Assignee: PURDUE RESEARCH FOUNDATION
    Inventors: Alexander Kildishev, Satoshi Ishii, Vladimir Shalaev
  • Patent number: 10031395
    Abstract: The present invention provides an optical modulator, which can be reduced in size with size reduction of an optical waveguide and electric wiring as compared to a conventional optical modulator. An optical modulator according to an embodiment includes a substrate; an optical waveguide provided on the substrate and configured to guide light; a modulation unit formed of part of the optical waveguide and configured to modulate the light; and electric wires provided on the substrate and configured to supply a high-frequency electric signal to the modulation unit. One end portion and another end portion of the optical waveguide are provided on a first end surface, one end portion of the electric wiring is provided along the first end surface, another end portion of the electric wiring is provided along a second end surface being different from the first end surface.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: July 24, 2018
    Assignees: FURUKAWA ELECTRIC CO., LTD., FUJITSU OPTICAL COMPONENTS LIMITED
    Inventors: Yusuke Saito, Takehito Tanaka
  • Patent number: 10031354
    Abstract: An active-control optical resonator includes an oxide layer; a ring resonator arranged in a loop and positioned on the oxide layer; a tangential optical waveguide optically coupled to the ring resonator; a translatable body configured to selectively move into an evanescent field region of the ring resonator; a first electrode positioned on the translatable body, the first electrode comprising indium tin oxide; and a second electrode positioned between the oxide layer and the ring resonator.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: July 24, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sonny Vo, Zhihong Huang, Chin-Hui Chen, Jason Scott Pelc, Marco Fiorentino
  • Patent number: 10025121
    Abstract: An optical waveguide element module decreases discontinuity of electrical connection between an optical waveguide element and a relay substrate, without wire-bonding using long wires. An edge shape L of the signal electrode side of the ground electrode is surrounded by two shapes (L1, L2). Shape L1 is obtained by connecting an input end of the control electrode to a location where a space between the ground electrodes becomes W2. Shape L2 is such that an impedance change of the control electrode from the input end to the location at which the space between the ground electrodes becomes W2 is constant or continuously changes. A space between grounding wires connecting the ground electrodes of the element and ground lines of the relay substrate is larger than a space between the ground electrodes. In an embodiment, a terminal substrate and an output end of the control electrode are connected.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: July 17, 2018
    Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
    Inventors: Kei Katou, Norikazu Miyazaki, Youichi Hosokawa
  • Patent number: 10025030
    Abstract: An optoelectronic component including an optical waveguide, an integrated optical resonator, in which the waveguide or at least a portion of the waveguide is arranged, and a heat source which can increase the temperature of the resonator during operation. A web region adjoins laterally the waveguide when viewed in the longitudinal direction of the waveguide. The web region forms a jacket portion of the waveguide and has a smaller thickness than the waveguide. The heat source is thermally connected to the waveguide by means of the web region.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: July 17, 2018
    Assignee: Technische Universitaet Berlin
    Inventors: Stefan Meister, Hanjo Rhee, Christoph Theiss, Aws Al-Saadi, Marvin Henniges, Muhammad Atif
  • Patent number: 10025045
    Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: July 17, 2018
    Assignee: Elenion Technologies, LLC
    Inventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
  • Patent number: 10025047
    Abstract: Signal integrity in high-speed applications is dependent on both the underlying device performance and electronic packaging methods. The maturity of chip-on-board (COB) packaging technology using wire bonding makes it a cost beneficial option for the mass production of high-speed optical transceivers. However, wire bonding introduces parasitic inductance associated with the length of the bond wires that limits the scalability of the system for higher data throughput. A high-speed optical transceiver package according to a first proposed configuration minimizes packaging related parasitic inductance by vertically integrating components using flip-chip bonding. A high-speed optical transceiver package according to a second proposed configuration minimizes packaging related parasitic inductance with horizontal tiling of components using a chip carrier and flip-chip bonding.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: July 17, 2018
    Assignee: Google LLC
    Inventors: Hong Liu, Ryohei Urata, Woon Seong Kwon, Teckgyu Kang
  • Patent number: 10025043
    Abstract: Optical alignment of optical subassembly and optoelectronic device is achieved using an external source and an external receiver, passing optical signal through a passive waveguide in the optoelectronic device, via alignment reflective surface features provided on the optical subassembly. The optical subassembly is provided with a first alignment reflective surface directing alignment signal from the source to a grating coupler at the input of the waveguide, and a second alignment reflective surface directing to the receiver the alignment signal directed from a grating coupler at the output of the waveguide after the alignment signal has been transmitted from the input to the output through the waveguide.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: July 17, 2018
    Assignee: NANOPRECISION PRODUCTS, INC.
    Inventors: Robert Ryan Vallance, Gregory L. Klotz, Rand D. Dannenberg
  • Patent number: 10014654
    Abstract: Optoelectronic packaging assemblies are provided that are useful for optical data, transfer In high performance computing applications, board to board in data centers, memory to CPU, switch/FPGA (field programmable gate array) for chip to chip interconnects, and memory extension. The packaging assemblies provide fine pitch flip chip interconnects and chip stacking assemblies with good thermo-mechanical reliability. Underfill dams and optical overhang regions and are provided for optical interconnection.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: July 3, 2018
    Assignee: Intel Corporation
    Inventors: Myung Jin Yim, Ansheng Liu, Valentin Yepanechnikov
  • Patent number: 10009106
    Abstract: Disclosed herein are techniques, methods, structures and apparatus that provide a silicon photonics multicarrier optical transceiver wherein both the transmitter and receiver are integrated on a single silicon chip and which generates a plurality of carriers through the effect of an on-chip modulator, amplifies the optical power of the carriers through the effect of an off-chip amplifier, and generates M orthogonal sets of carriers through the effect of an on-chip basis former.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: June 26, 2018
    Assignee: Acacia Communications, Inc.
    Inventor: Christopher Doerr
  • Patent number: 10002100
    Abstract: An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the programmable IC including a programmable fabric and the companion IC including application circuitry. The IC system further includes a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC, a second SiP IO circuit disposed in the companion IC, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit. The IC System further includes first aggregation and first dispersal circuits in the programmable IC coupled between the programmable fabric and the first SiP IO circuit. The IC system further includes second aggregation and second dispersal circuits in the companion IC coupled between the application circuitry and the second SiP IO circuit.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: June 19, 2018
    Assignee: XILINX, INC.
    Inventors: Alireza S. Kaviani, Pongstorn Maidee, Ivo Bolsens
  • Patent number: 10001600
    Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: June 19, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventors: Guoliang Li, Damien Lambert, Nikhil Kumar
  • Patent number: 9995881
    Abstract: Embodiments herein describe an apparatus for coupling a photonic chip with a plurality of optical fibers. In one embodiment, the apparatus comprises a first plurality of alignment features that correspond to a second plurality of alignment features associated with the photonic chip. Further, the apparatus comprises a plurality of grooves for receiving the plurality of optical fibers. In one embodiment, the apparatus comprises a plurality of waveguides for transmitting or receiving an optical signal. The plurality of waveguides is optically coupled to the photonic chip, as well as the plurality of optical fibers. In one embodiment, the plurality of waveguides is passively aligned with a second plurality of waveguides associated with the photonic chip.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: June 12, 2018
    Assignee: Cisco Technology, Inc.
    Inventors: Vipulkumar Patel, Mittu Pannala, Steven L. Moyer
  • Patent number: 9995889
    Abstract: Provided is a mounting component for an optical fiber that allows a laser device and an optical fiber to be aligned with higher precision while providing protection for the laser device mounted on a substrate.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: June 12, 2018
    Assignee: CITIZEN WATCH CO., LTD.
    Inventors: Kaoru Yoda, Masafumi Ide
  • Patent number: 9995894
    Abstract: The method comprises providing a semiconductor substrate, which has a main surface and an opposite further main surface, arranging a contact pad above the further main surface, forming a through-substrate via from the main surface to the further main surface at a distance from the contact pad and, by the same method step together with the through-substrate via, forming a further through-substrate via above the contact pad, arranging a hollow metal via layer in the through-substrate via and, by the same method step together with the metal via layer, arranging a further metal via layer in the further through-substrate via, the further metal via layer contacting the contact pad, and removing a bottom portion of the metal via layer to form an optical via laterally surrounded by the metal via layer.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: June 12, 2018
    Assignee: ams AG
    Inventors: Jochen Kraft, Karl Rohracher, Jordi Teva
  • Patent number: 9989830
    Abstract: An optical modulator element includes first and second optical modulators, an optical input terminal, and a branch coupler. Each of the first and second optical modulators includes a pair of Mach-Zehnder waveguides, a first optical coupler to split rays from the branch coupler into the pair of Mach-Zehnder waveguides, and a second optical coupler to combine rays transmitted through the pair of Mach-Zehnder waveguides. The first and second optical modulators are disposed in such a manner that a traveling direction of rays propagating through the pair of Mach-Zehnder waveguides of the first optical modulator and a traveling direction of rays propagating through the pair of Mach-Zehnder waveguides of the second optical modulator are angled toward each other.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: June 5, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yuichiro Horiguchi, Satoshi Nishikawa, Koichi Akiyama, Shusaku Hayashi, Yohei Hokama, Kentaro Enoki, Toshiyuki Tanaka
  • Patent number: 9991371
    Abstract: A semiconductor device includes a substrate, a two-dimensional (2D) material layer formed on the substrate and having a first region and a second region adjacent to the first region, and a source electrode and a drain electrode provided to be respectively in contact with the first region and the second region of the 2D material layer, the second region of the 2D material layer including an oxygen adsorption material layer in which oxygen is adsorbed on a surface of the second region.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: June 5, 2018
    Assignees: SAMSUNG ELECTRONICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Un Jeong Kim, Hyo Chul Kim, Young Geun Roh, Yeon Sang Park, Jae Gwan Chung, Si Young Lee, Young Hee Lee