Abstract: An optical modulator includes: a ferroelectric substrate in which an input optical waveguide, a pair of branched optical waveguides, and an output optical waveguide are formed; a signal electrode that is formed in a vicinity of at least one of the pair of branched optical waveguides; a first protection member that is attached to an input end of the ferroelectric substrate in which the input optical waveguide is formed; and a second protection member that is attached to an output end of the ferroelectric substrate in which the output optical waveguide is formed. The first protection member and the second protection member have a Mohs hardness that is less than or equal to a Mohs hardness of the ferroelectric substrate, and are formed of a glass material that does not have a pyroelectric effect.

Abstract: An optical system can automatically lock an adjustable spectral filter to a first wavelength of an incoming light signal, and can automatically filter an additional incoming light signal at the first wavelength. A tunable filter can have a filtering spectrum with an adjustable peak wavelength and increasing attenuation at wavelengths away from the adjustable peak wavelength. The tunable filter can receive first input light, having a first wavelength, and can spectrally filter the first input light to form first output light. A detector can detect at least a fraction of the first output light. Circuitry coupled to the detector and the tunable filter can tune the tunable filter to maximize a signal from the detector and thereby adjust the peak wavelength to match the first wavelength. The tunable filter further can receive second input light and spectrally filter the second input light at the first wavelength.

Abstract: An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.

Abstract: The optical includes a waveguide positioned on a base and an optical component positioned on the base. The optical component is a light sensor that includes an active medium or a modulator that includes an active medium. The waveguide is configured to guide a light signal through the component such that the light signal is guided through the active medium. The device includes one or more heat control features selected from the group consisting of: placing one or more thermal conductors over a lateral side of a ridge of the active medium; extending thermal conductors from within the active component to a location outside of the active component, and tapering the ridge of the active medium within the perimeter of the active component.

Abstract: This disclosure provides planar waveguides with enhanced support and/or cooling. One or more endcaps could be disposed between coating/cladding layers at one or more ends of a core region, where the core region is doped with at least one active ion species and each endcap is not doped with any active ion species that creates substantial absorption at pump and signal wavelengths. A core region could include at least one crystal or crystalline material, and at least one cladding layer could include at least one glass. Different types of coolers could be disposed on or adjacent to different coating/cladding layers. Side claddings could be disposed on opposite sides of a planar waveguide, where the opposite sides represent longer sides of the waveguide. Endcaps and one or more coolers could be sealed to a housing, and coolant can flow through a substantially linear passageway along a length of the waveguide. One side of a planar waveguide could be uncooled.

Abstract: A large-scale switching system deployed as a global network or a large-scale data center includes a large number of access nodes (edge nodes) interconnected through optical or electronic rotators. The rotators are logically arranged in a matrix and each access node has a channel to each rotator in a respective row and a channel from each rotator of a respective column of the matrix. A dual timing circuit coupled to a diagonal rotator pair exchanges timing data with edge nodes connecting to the diagonal rotator pair to facilitate temporal alignment of data received at input ports of each rotator. Each access node has a path to each other access node traversing only one of the rotators. The rotators may be arranged into constellations of collocated rotators to facilitate connectivity of access nodes to rotators using wavelength-division-multiplexed links.

Abstract: A device and system for coupling optical vortex multiplexed light into and out of a photonic integrated circuit. The multi-mode forked grating coupler device comprises: (i) a multi-mode forked grating structure configured to receive at least one optical vortex multiplexed light beam, wherein the multi-mode forked grating structure comprises at least one forked region positioned amidst a plurality of grooves, wherein the forked region comprises a single groove forking into two grooves, wherein the single groove is noncontiguous with the two grooves, and wherein the plurality of grooves comprise a central bending region; (ii) an optical waveguide; and (iii) a tapered portion connecting the forked grating structure and the multi-mode optical “bus” waveguide.

Abstract: A coupling structure of optical components has a first optical component, a second optical component and a coupling solder layer. The first optical component has a lensed fiber, a first holder holding the lensed fiber and a first metal layer formed on a first connecting end face of the first holder. The second optical component has a waveguide, a second holder holding the waveguide and a second metal layer formed on a second connecting end face of the second holder. The coupling solder layer is in direct contact with both of the first metal layer and the second metal layer, and formed with solder.

Abstract: Several embodiments of a system and method of an optical-frequency (OF) synthesizer are disclosed that produces an optical frequency (OF) tone derived from a dispersive resonator and phase-locking to a radio frequency (RF) tone to achieve high precision. Thus, the stability of the synthesized OF tone is related to the stability of the RF tone. A frequency control word provides for a wide range of programmability to the frequency of the output OF tone. The OF synthesizer establishes the absolute value of the optical frequency of its output tone by making use of a dispersive optical resonator and applying appropriate corrections obtained dynamically by interrogating the comb lines. The reference resonator defines a semi-dormant OF reference comb, wherein the lines of that reference comb are associated with the modes of the reference resonator. Several selected modes of this reference resonator are interrogated by locking the frequency of light emitted by lasers to those resonator modes.

Abstract: A planar optical device, comprised of sets of nanometer-scale holes milled into a thin metal or ceramic film of subwavelength thickness serves to form arbitrary waveform of light. The holes form a pattern, preferrably rings, of various sizes in order to achieve a given phase front of light due to photonic effect. When designed as a lens, the device focuses incident light into a tight focal spot. In symmetric design, the focusing property of the device does not depend on the incident polarization angle. The lens can be manufactured based on high-throughput fabrication methods and easily integrated with a chip or placed at the end of an optical fiber.

Abstract: An electro-optic device may include a substrate layer, and a first photonic layer over the substrate layer and having a first photonic device. The electro-optic device may include a second photonic layer over the first photonic layer and having a second photonic device. The electro-optic device may include a dielectric layer over the second photonic layer, and a first electrically conductive via extending through the dielectric layer and the second photonic layer to couple to the first photonic device, and a second electrically conductive via extending through the dielectric layer and coupling to the second photonic device. The electro-optic device may include a third electrically conductive via extending through the substrate layer, the second photonic layer, and the first photonic layer to couple to the substrate layer.

Abstract: The present application discloses a display panel and an angle-cutting circuit. The angle-cutting circuit includes the angle-cutting chip, the comparison module and the adjustment module, the adjustment module is coupled to the angle-cutting chip and the comparison module; the output terminal of the angle-cutting chip is used to output the angle-cutting voltage, the first input terminal of the comparison module is coupled to the output terminal of the angle-cutting chip to obtain the first voltage; the first voltage is compared to the preset threshold voltage in the comparison module, when the first voltage is less than the threshold voltage, a control signal is generated from the comparison module, and the lower limit value of the angle-cutting voltage is raised by the adjustment module according to the control signal. By the technology described above, the accuracy of angle-cutting voltage of the present application is increased, and improve product performance.

Abstract: An active-control optical resonator includes an oxide layer; a ring resonator arranged in a loop and positioned on the oxide layer; a tangential optical waveguide optically coupled to the ring resonator; a translatable body configured to selectively move into an evanescent field region of the ring resonator; a first electrode positioned on the translatable body, the first electrode comprising indium tin oxide; and a second electrode positioned between the oxide layer and the ring resonator.

Abstract: The present invention provides an optical modulator, which can be reduced in size with size reduction of an optical waveguide and electric wiring as compared to a conventional optical modulator. An optical modulator according to an embodiment includes a substrate; an optical waveguide provided on the substrate and configured to guide light; a modulation unit formed of part of the optical waveguide and configured to modulate the light; and electric wires provided on the substrate and configured to supply a high-frequency electric signal to the modulation unit. One end portion and another end portion of the optical waveguide are provided on a first end surface, one end portion of the electric wiring is provided along the first end surface, another end portion of the electric wiring is provided along a second end surface being different from the first end surface.

Abstract: An optoelectronic component including an optical waveguide, an integrated optical resonator, in which the waveguide or at least a portion of the waveguide is arranged, and a heat source which can increase the temperature of the resonator during operation. A web region adjoins laterally the waveguide when viewed in the longitudinal direction of the waveguide. The web region forms a jacket portion of the waveguide and has a smaller thickness than the waveguide. The heat source is thermally connected to the waveguide by means of the web region.

Abstract: Optical alignment of optical subassembly and optoelectronic device is achieved using an external source and an external receiver, passing optical signal through a passive waveguide in the optoelectronic device, via alignment reflective surface features provided on the optical subassembly. The optical subassembly is provided with a first alignment reflective surface directing alignment signal from the source to a grating coupler at the input of the waveguide, and a second alignment reflective surface directing to the receiver the alignment signal directed from a grating coupler at the output of the waveguide after the alignment signal has been transmitted from the input to the output through the waveguide.

Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Abstract: Signal integrity in high-speed applications is dependent on both the underlying device performance and electronic packaging methods. The maturity of chip-on-board (COB) packaging technology using wire bonding makes it a cost beneficial option for the mass production of high-speed optical transceivers. However, wire bonding introduces parasitic inductance associated with the length of the bond wires that limits the scalability of the system for higher data throughput. A high-speed optical transceiver package according to a first proposed configuration minimizes packaging related parasitic inductance by vertically integrating components using flip-chip bonding. A high-speed optical transceiver package according to a second proposed configuration minimizes packaging related parasitic inductance with horizontal tiling of components using a chip carrier and flip-chip bonding.

Abstract: An optical waveguide element module decreases discontinuity of electrical connection between an optical waveguide element and a relay substrate, without wire-bonding using long wires. An edge shape L of the signal electrode side of the ground electrode is surrounded by two shapes (L1, L2). Shape L1 is obtained by connecting an input end of the control electrode to a location where a space between the ground electrodes becomes W2. Shape L2 is such that an impedance change of the control electrode from the input end to the location at which the space between the ground electrodes becomes W2 is constant or continuously changes. A space between grounding wires connecting the ground electrodes of the element and ground lines of the relay substrate is larger than a space between the ground electrodes. In an embodiment, a terminal substrate and an output end of the control electrode are connected.

Abstract: Optoelectronic packaging assemblies are provided that are useful for optical data, transfer In high performance computing applications, board to board in data centers, memory to CPU, switch/FPGA (field programmable gate array) for chip to chip interconnects, and memory extension. The packaging assemblies provide fine pitch flip chip interconnects and chip stacking assemblies with good thermo-mechanical reliability. Underfill dams and optical overhang regions and are provided for optical interconnection.

Abstract: Disclosed herein are techniques, methods, structures and apparatus that provide a silicon photonics multicarrier optical transceiver wherein both the transmitter and receiver are integrated on a single silicon chip and which generates a plurality of carriers through the effect of an on-chip modulator, amplifies the optical power of the carriers through the effect of an off-chip amplifier, and generates M orthogonal sets of carriers through the effect of an on-chip basis former.

Abstract: An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the programmable IC including a programmable fabric and the companion IC including application circuitry. The IC system further includes a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC, a second SiP IO circuit disposed in the companion IC, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit. The IC System further includes first aggregation and first dispersal circuits in the programmable IC coupled between the programmable fabric and the first SiP IO circuit. The IC system further includes second aggregation and second dispersal circuits in the companion IC coupled between the application circuitry and the second SiP IO circuit.

Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.

Abstract: Embodiments herein describe an apparatus for coupling a photonic chip with a plurality of optical fibers. In one embodiment, the apparatus comprises a first plurality of alignment features that correspond to a second plurality of alignment features associated with the photonic chip. Further, the apparatus comprises a plurality of grooves for receiving the plurality of optical fibers. In one embodiment, the apparatus comprises a plurality of waveguides for transmitting or receiving an optical signal. The plurality of waveguides is optically coupled to the photonic chip, as well as the plurality of optical fibers. In one embodiment, the plurality of waveguides is passively aligned with a second plurality of waveguides associated with the photonic chip.

Abstract: Provided is a mounting component for an optical fiber that allows a laser device and an optical fiber to be aligned with higher precision while providing protection for the laser device mounted on a substrate.

Abstract: The method comprises providing a semiconductor substrate, which has a main surface and an opposite further main surface, arranging a contact pad above the further main surface, forming a through-substrate via from the main surface to the further main surface at a distance from the contact pad and, by the same method step together with the through-substrate via, forming a further through-substrate via above the contact pad, arranging a hollow metal via layer in the through-substrate via and, by the same method step together with the metal via layer, arranging a further metal via layer in the further through-substrate via, the further metal via layer contacting the contact pad, and removing a bottom portion of the metal via layer to form an optical via laterally surrounded by the metal via layer.

Abstract: A semiconductor device includes a substrate, a two-dimensional (2D) material layer formed on the substrate and having a first region and a second region adjacent to the first region, and a source electrode and a drain electrode provided to be respectively in contact with the first region and the second region of the 2D material layer, the second region of the 2D material layer including an oxygen adsorption material layer in which oxygen is adsorbed on a surface of the second region.

Abstract: An optical modulator element includes first and second optical modulators, an optical input terminal, and a branch coupler. Each of the first and second optical modulators includes a pair of Mach-Zehnder waveguides, a first optical coupler to split rays from the branch coupler into the pair of Mach-Zehnder waveguides, and a second optical coupler to combine rays transmitted through the pair of Mach-Zehnder waveguides. The first and second optical modulators are disposed in such a manner that a traveling direction of rays propagating through the pair of Mach-Zehnder waveguides of the first optical modulator and a traveling direction of rays propagating through the pair of Mach-Zehnder waveguides of the second optical modulator are angled toward each other.

Abstract: A multi-channel tunable laser includes: a frequency selective optical multiplexer comprising: a plurality of channel terminals for receiving/transmitting light; a plurality of channel waveguide blocks, each channel waveguide block comprising at least one reflectively terminated channel waveguide; and an optical coupling element optically coupling the plurality of channel terminals with the plurality of channel waveguide blocks, each of the channel waveguides of the plurality of channel waveguide blocks having a different length; a plurality of channel paths, each channel path coupled to a respective channel terminal of the plurality of channel terminals and comprising a gain element, a phase element and a reflective element; and a plurality of optical tuners, each one configured to tune the channel waveguides of a respective channel waveguide block of the plurality of channel waveguide blocks.

Abstract: A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.

Abstract: An optical apparatus includes: a semiconductor optical device integrating an optical coupler, an optical element, and an electrical circuit; and a printed circuit board including a main body and a metal piece. The body has first and second openings. The first opening, the metal piece and the second opening are arranged in a direction of a first axis. The first and second openings extend from the front and back faces of the body along the direction to the first and second faces of the metal piece, respectively. The metal piece is supported by the body. The semiconductor optical device is mounted on the first face of the metal piece in the first opening. The body has a supporting face connecting the first side of the first opening with the second side of the second opening and supporting the second face of the metal piece in the first opening.

Abstract: Disclosed herein are OLED devices comprising waveguides including at least one waveguide layer comprising at least one inorganic nanoparticle and at least one binder and having an RMS surface roughness of less than about 20 nm. Lighting and display devices comprising such OLED devices are further disclosed herein as well as methods for making the waveguides.

Abstract: An optoelectronic device includes an integrated circuit including electronic devices formed on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the semiconductor substrate. A photonics layer is formed on the barrier layer. The photonics layer includes a core for transmission of light and a cladding layer encapsulating the core and including a different index of refraction than the core. The core is configured to couple light generated from a component of the optoelectronic device.

Abstract: An optical connector includes a board including an element that performs conversion between an electric signal and light, a first ferrule and a second ferrule that are butted against each other, an optical waveguide that optically connects the first ferrule with the element, and a guide that guides the optical waveguide disposed between the first ferrule and the element.

Abstract: In a high power optical system, a thermal waveguide including an optical material having an index of refraction sensitive to changes in temperature, the rectangular optical material having a first dimension and a second dimension in a horizontal plane and a third dimension in a vertical plane, the third dimension being approximately ten times smaller than the first and second dimension, at least one heat sink thermally coupled to the optical material to establish a one-dimensional thermal gradient across the third dimension of the optical material, the thermal gradient having a parabolic profile across the rectangular optical material, and wherein the optical material is configured to act as a waveguide when a laser beam having a power of greater than one watt is incident upon the optical material.

Abstract: A method of fabricating an optical device includes forming on a semiconductor substrate a first optical cavity, a second optical cavity, a first light guide and a second light guide. The first light guide has an input, and is optically coupled to the first optical cavity by a first coupling strength. In addition, the first light guide is optically coupled to the second optical cavity by a second coupling strength. The second light guide has an output, and is coupled to the second optical cavity by a third coupling strength. The first coupling strength is greater than the second coupling strength, and the third coupling strength is greater than the second coupling strength.

Abstract: A mounting structure for an electronic component and a method for mounting the electronic component are provided with a sufficient reinforcing effect for the relatively tall electronic component raised from a substrate. The mounting structure and the mounting method can easily respond to a change of the shape of the electronic component. In a mounting structure 1, a substrate 2 and an electronic component 4 raised on the substrate 2 are joined with bonding metal 3 and a reinforcing resin body 5 is bonded to the substrate 2 and the electronic component 4. The reinforcing resin body 5 includes a plurality of reinforcing resin layers 5a. The reinforcing resin layers 5a constituting the reinforcing resin body 5 are stacked in the height direction of the raised electronic component 4 along a side 4a of the electronic component 4 so as to be raised from the substrate 2.

Abstract: A technique relates to a qubit readout system. A cavity-qubit system has a qubit and a readout resonator and outputs a readout signal. A lossless superconducting circulator is configured to receive the microwave readout signal from the cavity-qubit system and transmit the microwave readout signal according to a rotation. A quantum limited directional amplifier amplifies the readout signal. A directional coupler is connected to and biases the amplifier to set a working point. A microwave bandpass filter transmits in a microwave frequency band by passing the readout signal while blocking electromagnetic radiation outside of the microwave frequency band. A low-loss infrared filter has a distributed Bragg reflector integrated into a transmission line. The low-loss filter is configured to block infrared electromagnetic radiation while passing the microwave readout signal. The low-loss infrared filter is connected to the microwave bandpass filter to receive input of the microwave readout signal.

Abstract: A semiconductor laser light source includes a semiconductor substrate formed of a first conductivity type semiconductor material, a lower cladding layer formed of the first conductivity type semiconductor material on the semiconductor substrate, a waveguide layer on the lower cladding layer, and an upper cladding layer formed of a second conductivity type semiconductor material on the waveguide layer. The waveguide layer includes a core area and rib areas thinner than the core area on either side of the core area. The core area has a quantum dot active layer, and the rib areas have no quantum dot layer. The waveguide layer forms a laser part having the core area with a constant width and a spot size converter having the core area with a taper width from a side adjacent to the laser part toward an end of the spot size converter.

Abstract: An imaging system comprises a matched pathlength combining waveguide array including input optical couplers for receiving light, combining waveguides for combining the light received from different input optical couplers and relaying the light to output optical couplers. A lens system is also provided for imaging the light from the output optical couplers. Compared to imaging systems, this imaging system can be much more compact. A standard imaging system requires a focal length at least equal to the aperture (width) of the lens. Because the aperture size of a lens determines the performance of a system (resolution and collected light) there is a limit to how compact a traditional high performance imaging system can be. In contrast, the present system removes that limitation because the minimum practical focal length is now determined by the size of the aperture of the outputs, which can be significantly smaller (by factors of more than 10×, typically).

Abstract: An optical waveguide device comprising: one or more photonic chips, the one or more photonic chips including: a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising an array of second components, each of the second components configured to receive an electrical input; the optical waveguide device further comprising: an integrated circuit; the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the integrated circuit is directly mounted onto the one or more photonic chips; and/or wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip.

Abstract: A TO can-type optical module for ultrahigh-speed communication including a laser diode chip for at least 5 Gbps. A substrate for transmitting a signal to a laser diode chip is formed by coupling an upper substrate (210) on which line patterns for transmission are formed, to a lower substrate (220) of which an upper surface has conductivity with the upper substrate (210) such that the optical module for ultrahigh-speed communication has single ended impedance of 25 ohms or differential ended impedance of 50 ohms. The substrate has a height of about 0.4 mm to which a laser diode chip, for ultrahigh-speed communication, is attached to enable an optical coupling between the laser diode chip, the lens, and the like, and may implement a hight-speed transmission line using a width of 0.6 mm or less thereby providing a substrate which is effectively embedded ina TO can-type package with a narrow mounting area.

Abstract: A suspension board with circuit includes a metal supporting board, a conductor layer, a first insulating layer disposed between the metal supporting board and the conductor layer and having a first thickness, a second insulating layer having a second thickness in a portion disposed on the first insulating layer, and a pedestal disposed on the metal supporting board. The pedestal includes a first layer prepared from the same material as that of the first insulating layer and a second layer prepared from the same material as that of the second insulating layer. The thickness of the pedestal is different from any one of the first thickness, the second thickness, and the total sum of the first thickness and the second thickness.

Abstract: Embodiments include an optical apparatus and associated method of assembling. The optical apparatus comprises a substrate defining a first surface and a channel formed relative thereto, the substrate including one or more waveguides extending to a sidewall partly defining the channel, a plurality of first electrical contacts formed on the first surface. The optical apparatus further comprises a carrier member defining a second surface and at least a third surface, the second surface coupled with the first surface of the substrate. The optical apparatus further at least one optical component coupled with the second surface and at least partly disposed within the channel, wherein the at least one optical component is optically coupled with the one or more waveguides and electrically connected with the first electrical contacts via a plurality of second electrical contacts at the third surface of the carrier member.

Abstract: An optical module includes an optical waveguide; a lens sheet including a lens; a substrate on one surface of which at least one of a light emitting element and a light receiving element is mounted; a first adhesion film that adheres the optical waveguide and the lens sheet; a second adhesion film that adheres the lens sheet and the substrate; and an adhesive agent introducing area, provided at at least one of the first adhesion film and the second adhesion film, to which an adhesive agent is supplied.

Abstract: A semiconductor laser device includes: a semiconductor laser including a plurality of emission regions into which currents are injected to emit laser beams and first and second major surfaces opposite to each other; and a plurality of first wires bonded to the first major surface of the semiconductor laser, wherein the first major surface of the semiconductor laser has a first stripe region corresponding to one of the plurality of emission regions, and a second stripe region corresponding to another of the plurality of emission regions, and the number of the first wires bonded to the first stripe region is larger than the number of the first wires bonded to the second stripe region.

Abstract: A compact and highly efficient coupling structure for coupling between DFB-LD and Si PIC edge coupler with suppressed return loss may include a DFB-LD, a Si PIC comprising at least one input edge coupler and at least one output edge coupler, a silica cover lid disposed on the Si PIC and aligned edge to edge with the Si PIC, a single-mode fiber aligned to the at least one output edge coupler of the Si PIC, a lens disposed between the DFB-LD and the at least one input edge coupler of the Si PIC, and an isolator bonded to a facet of the at least one input edge coupler with a first volume of an index matching fluid. The lens may be configured to minimize a mismatch between an output spot size of the DFB-LD and a spot size of the at least one input edge coupler of the Si PIC.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to electrical and optical via connections on a same chip and methods of manufacture. The structure includes an optical through substrate via (TSV) comprising an optical material filling the TSV. The structure further includes an electrical TSV which includes a liner of the optical material and a conductive material filling remaining portions of the electrical TSV.

Abstract: A wafer structure includes a diffractive lens disposed on a backside of a wafer and coupled to a front side waveguide, the diffractive lens being configured to receive light and focus the light to the front side waveguide.

Abstract: Methods and systems for a chip-on-wafer-on-substrate assembly are disclosed and may include in an integrated optical communication system comprising an electronics die and a substrate. The electronics die is bonded to a first surface of a photonic interposer and the substrate is coupled to a second surface of the photonic interposer opposite to the first surface. An optical fiber and a light source assembly are coupled to the second surface of the interposer in one or more cavities formed in the substrate. The integrated optical communication system is operable to receive a continuous wave (CW) optical signal in the photonic interposer from the light source assembly; and communicate a modulated optical signal to the optical fiber from said photonic interposer. A mold compound may be on the first surface of the interposer and in contact with the electronics die. The received CW optical signal may be coupled to an optical waveguide in the photonic interposer using a grating coupler.