Abstract: An opto-electric hybrid board includes an electric circuit board in which electric wiring is formed on a front surface of an insulating layer, and an optical waveguide formed on the rear side of the electric circuit board. The optical waveguide and the electric circuit board are arranged so that left and right edges of the electric circuit board along a longitudinal direction of the optical waveguide overlap with left and right edges of the optical waveguide when viewed from above, or so that the left and right edges of the electric circuit board are on the inside of where the left and right edges of the optical waveguide are located. The opto-electric hybrid board is easy to handle owing to the reduced chance of the electric circuit board being damaged. The opto-electric hybrid board also does not cause misalignment of a core when used as a connector.

Abstract: A scavenging photodetection device (10) is provided. The scavenging photodetection device (10) includes an optical coupling portion (12) and a scavenging photodetection portion (14). The optical coupling portion (12) includes an optical coupler (16) configured to receive light from a light source, a plurality of light absorbers (18) arranged to absorb the light from the light source that is not collected by the optical coupler (16), and at least one primary input waveguide (20) optically coupled to the optical coupler (16) and configured to direct collected light to a photonic integrated circuit. The scavenging photodetection portion (14) includes a primary photodetector (22) configured to collect uncollected light from the optical coupling portion (12) to determine an alignment position of the photonic integrated circuit.

Abstract: Optical alignment of optical subassembly and optoelectronic device is achieved using an external source and an external receiver, passing optical signal through a passive waveguide in the optoelectronic device, via alignment reflective surface features provided on the optical subassembly. The optical subassembly is provided with a first alignment reflective surface directing alignment signal from the source to a grating coupler at the input of the waveguide, and a second alignment reflective surface directing to the receiver the alignment signal directed from a grating coupler at the output of the waveguide after the alignment signal has been transmitted from the input to the output through the waveguide.

Abstract: A card module includes a transceiver, multiple connector interfaces that are each matable with a system connector of a respective type, a detection mechanism and a switching component. The detection mechanism can detect any one of the multiple connector interfaces being mated with the system connector of the respective type. Based on the respective type of the mated system connector, the switching component implements a switch state to connected the mated system connector to the transceiver.

Abstract: A multimode interference device includes: man MMI semiconductor mesa having first and second end faces that are arranged in a direction of a first axis, and first and second side faces that extend in the direction of the first axis; first and second semiconductor mesas disposed apart from the first and second side faces, respectively; an embedding region covering the MMI semiconductor mesa and the first and second semiconductor mesas and having first and second openings at the first and second semiconductor mess, respectively; and first and second metal bodies making contact with the first and second semiconductor mesas through the first and second openings, respectively. The first and second end faces have multiple first ports and multiple second ports, respectively. The first semiconductor mesa, the MMI semiconductor mesa, and the second semiconductor mesa are arranged in a direction of a second axis intersecting the first axis.

Abstract: Some embodiments of the present disclosure describe an apparatus for III/V-Si taper coupling, including a III/V-Si taper coupler with one end to receive a laser beam where the one end has at least one surface at a non-perpendicular angle with respect to a direction of the laser beam, and where the at least one surface forms one or more tips at the one end of the III/V-Si taper coupler. The one end is positioned so that the one or more tips are outside the laser beam to reduce reflection of laser beam away from the one end of the III/V-Si taper coupler.

Abstract: In one example, a system for a cage assembly for an optical module includes a receptacle coupled to an interposer card, a number of rails coupled to the interposer card to align an optical module with the receptacle, and a mezzanine card coupled to the interposer card, wherein the optical module is utilized via the mezzanine card.

Abstract: The present invention is an integrated photonics platform is created through the application of a polymer and silicon dioxide mask, multiple anisotropic etchings with inductively-coupled plasma reactive-ion-etching and a brief isotropic silicon etching to produce a a T-shaped silicon base wafer. A silicon-on-insulator donor wafer is bonded to the silicon base wafer a silicon dioxide layer between the two wafers is removed, producing a finalized T-shaped optical waveguide. The T-shaped optical waveguide causes confinement of the optical mode in the upper region of the “T,” above the connection to the post. This shape prevents leakage of light into the silicon wafer.

Abstract: Systems, devices, and methods of manufacturing optical engines and laser projectors that are well-suited for use in wearable heads-up displays (WHUDs) are described. Generally, the optical engines of the present disclosure integrate a plurality of laser diodes (e.g., 3 laser diodes, 4 laser diodes) within a single, hermetically or partially hermetically sealed, encapsulated package. Photonic integrated circuits having grating couplers thereon may be used to wavelength multiplex beams of light emitted by the plurality of laser diodes into a coaxially superimposed aggregate beam. Such optical engines may have various advantages over existing designs including, for example, smaller volumes, better manufacturability, faster modulation speed, etc. WHUDs that employ such optical engines and laser projectors are also described.

Abstract: The present invention is directed to a communication signal tracking system comprising an optical receiver including one or more delay line interferometers (DLIs) configured to demultiplex incoming optical signals and a transimpedance amplifier configured to convert the incoming optical signals to incoming electrical signals. The communication signal tracking system further includes a control module configured to calculate a bit-error-rate (BER) of the incoming electrical signals before forward-error correction decoding, and use the BER as a parameter for optimizing settings of the one or more DLIs in one or more iterations in a control loop and generating a back-channel data.

Abstract: The subject matter of the invention is a method for producing a lateral photodiode comprising a layer surmounted by a first pattern comprising an absorption region interposed between two contact regions. After encapsulation of the first pattern, a cavity is formed between the contact regions by etching through openings, and then filled with a material constituting the absorption region by lateral epitaxy of this material from the lateral walls of the cavity. According to one possibility, a first lateral epitaxy is effected in order to form a multiplication region, and then a second lateral epitaxy is effected in order to form a charge region before the lateral epitaxy of the material constituting the absorption region, so as to obtain a lateral avalanche photodiode having improved optical confinement. The lateral photodiode according to the invention has improved optical confinement.

Abstract: The embodiments of the present invention provide an optical waveguide and manufacturing method thereof, display substrate and display device. The optical waveguide comprises an optical fiber array arranged on a surface; each optical fiber in the optical fiber array has a cylindrical shape; the axis of each optical fiber is perpendicular to the surface. With the effect of limitation and mixing of the optical fibers, the intensity and color of the light from the optical waveguide are basically homogeneous in the whole emitting range, effectively improving the viewing angle characteristics of the display device, and solving the problem of uneven brightness and color bias in the range of viewing angle.

Abstract: An optical waveguide circuit device includes: an optical waveguide circuit including a cladding layer formed on a substrate and made from silica-based glass, and an optical waveguide formed within the cladding layer and made from silica-based glass; heaters formed over the cladding layer and the optical waveguide and configured to heat the optical waveguide; wiring line electrode layers formed over the cladding layer, each of the wiring line electrode layers being coupled to a corresponding heater of the heaters and configured to allow electrical power to be supplied to the coupled heater; and an insulating layer covering the cladding layer, the heaters, and the wiring line electrode layers. The wiring line electrode layers adjacent to each other in a plan view are formed in different wiring layers. The wiring line electrode layers adjacent to each other in the same wiring layer are spaced by at least a predetermined distance.

Abstract: A pulsed laser device includes: a semiconductor laser device that outputs laser light having a single wavelength; a semiconductor optical amplifier that receives the laser light output from the semiconductor laser device and amplifies the laser light to output; and a semiconductor-optical-amplifier driver that supplies a pulse-modulated semiconductor-optical-amplifier driving current to the semiconductor optical amplifier.

Abstract: A MEMS device includes a fixed supporting body forming a cavity, a mobile element suspended over the cavity, and an elastic element arranged between the fixed supporting body and the mobile element. First, second, third, and fourth piezoelectric elements are mechanically coupled to the elastic element, which has a shape symmetrical with respect to a direction. The first and second piezoelectric elements are arranged symmetrically with respect to the third and fourth piezoelectric elements, respectively. The first and fourth piezoelectric elements are configured to receive a first control signal, whereas the second and third piezoelectric elements are configured to receive a second control signal, which is in phase opposition with respect to the first control signal so that the first, second, third, and fourth piezoelectric elements deform the elastic element, with consequent rotation of the mobile element about the direction.

Abstract: When routing light on photonic integrated circuit (PIC) chips optical back-reflection and scattering can be highly detrimental to the desired application. Unused ports of optical devices, such as MMI, DC, Y-junction, PD, etc. are a cause for back-reflection and scattering, whereby the scattered light could get picked up by adjacent components, e.g. photodetectors. Management of stray light on the PIC is needed to prevent the undesired coupling between various components and to reduce noise. A dump taper may be used to guide and scatter stray light away from sensitive components or fully absorb the light while maintaining very low reflection from the taper. A doped dump taper may be used to passively absorb light reaching the unused port, thereby eliminating unwanted reflection and scattering. Alternatively, an undoped taper may be used to scatter light away from sensitive components while maintaining very low back-reflection.

Abstract: Optical alignment of an optical connector to input/output couplers of a photonic integrated circuit can be achieved by first actively aligning the optical connector successively to two loopback alignment features formed in the photonic chip of the PIC, optically unconnected to the PIC, and then moving the optical connector, based on precise knowledge of the positions of the loopback alignment features relative to the input/output couplers of the PIC, to a position aligned with the input/output couplers of the PIC and locking it in place.

Abstract: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

Abstract: An optical module that provides a bridge substrate for carrying a driving signal from a wiring substrate to a laser diode (LD) element is disclosed. The optical module provides a carrier, first and second assemblies, and the bridge substrate. The first assembly, which includes the LD element, stacks a first compensating substrate and a semiconductor substrate on the carrier, where the semiconductor substrate includes the LD element. The second assembly stacks a second compensating substrate and the wiring substrate on the carrier. The first compensating substrate is made of a material same with a material of the wiring substrate and has a thickness same with that of the wiring substrate. The second compensating substrate is made of a material same with a material of the semiconductor substrate and has a thickness same with that of the semiconductor substrate.

Abstract: A laser array includes a plurality of laser diodes arranged and electrically connected to one another on a surface of a non-native substrate. Respective laser diodes of the plurality of laser diodes have different orientations relative to one another on the surface of the non-native substrate. The respective laser diodes are configured to provide coherent light emission in different directions, and the laser array is configured to emit an incoherent output beam comprising the coherent light emission from the respective laser diodes. The output beam may include incoherent light having a non-uniform intensity distribution over a field of view of the laser array. Related devices and fabrication methods are also discussed.

Abstract: An optical system includes a laser die that includes a gain medium and multiple laser waveguides that are each configured to guide a different laser light signal through the gain medium. Each of the laser waveguides outputs a laser light signal at a wavelength. The laser waveguides are arranged in multiple candidate groups. Each candidate group includes multiple laser waveguides. The wavelength spacing of the laser waveguides is the same or substantially the same in different candidate groups.

Abstract: An electronic component-embedded substrate includes a first insulation layer having a quadrangular cavity formed therein, and an electronic component arranged in the cavity. The cavity has two adjacent first inner wall surfaces, protrusions protruding inward from the two first inner wall surfaces, respectively, and two adjacent inclined second inner wall surfaces arranged at opposite sides to the two first inner wall surfaces and inclined downward from an outer side toward an inner side. The electronic component is in contact with the protrusions of the cavity.

Abstract: An optical modulator includes a substrate, an optical waveguide, a control electrode applying a high frequency signal in order to modulate light waves propagating through the optical waveguide, and a relay substrate provided with a relay line to transfer the high frequency signal to the control electrode. The control electrode and the relay line together have a coplanar line structure inclusive of at least electrical connection portions of both the control electrode and the relay line. The control electrode includes an electrical connection portion and a routing portion positioned between the electrical connection portion and an active portion applying an electrical field to the optical waveguide. The routing portion has a coplanar line structure. A distance between ground electrodes sandwiching a signal electrode in the electrical connection portion of the control electrode is substantially equal to a distance between ground electrodes sandwiching a signal electrode of the routing portion.

Abstract: A 400 Gb/s transmitter is integrated on a silicon substrate. The transmitter uses four gain chips, sixteen lasers, four modulators to modulate the sixteen lasers at 25 Gb/s, and four multiplexers to produce four optical outputs. Each optical output can transmit at 100 Gb/s to produce a 400 Gb/s transmitter. Other variations are also described.

Abstract: A guide transition device including a light source designed to generate a light beam, a light input port on a first plane and coupled to receive the light beam from the light source, a light output port on a second plane different than the first plane, the light output port designed to couple a received light beam to output equipment and plane shifting apparatus coupled to receive the light beam from the light input port on the first plane and to shift or transfer the light beam to the second plane. The plane shifting apparatus is coupled to transfer the light beam to the light output port on the second plane.

Abstract: The present invention provides an optical transmitter and a light intensity monitoring method that provide reliable APC feedback for a semiconductor laser equipped with an SOA. The optical transmitter includes an SOA integrated EA-DFB having a DFB laser, an EA modulator connected to the DFB laser, and an SOA connected to the EA modulator. In the structure of the optical transmitter, a light detector part is disposed forward of the output end side of an SOA part. The light detector part changes part of an output light beam from the SOA part into an electric current and detects light, while guiding the remaining part of the output light beam to a waveguide. With the light detector part disposed forward for the SOA part, it is possible to feed back the output result from the SOA part. Hence, good APC is possible.

Abstract: Disclosed are a method and structure providing a silicon-on-insulator substrate on which photonic devices are formed and in which a core material of a waveguide is optically decoupled from a support substrate by a shallow trench isolation region.

Abstract: The present disclosure provides an optical waveguide capable of enhancing the suppression of crosstalk. This optical waveguide includes: under claddings; cores for light propagation arranged in side-by-side relation on surfaces of the respective under claddings; over claddings covering the cores; and a light absorbing part provided between adjacent ones of the cores and adjacent to light exit member connecting portions for connection to light exit members, the light exit member connecting portions being disposed in first end portions of the adjacent cores, the light absorbing part being in non-contacting relationship with the cores. The light absorbing part contains a light absorbing agent having an ability to absorb light exiting the light exit members. The optical waveguide is produced on a surface of a substrate.

Abstract: In one example embodiment, an integrated silicon photonic wavelength division demultiplexer includes an input waveguide, an input port, a plurality of output waveguides, a plurality of output ports, a first auxiliary waveguide, and a plurality of auxiliary waveguides. The input waveguide may be formed in a first layer and having a first effective index n1. The input port may be optically coupled to the input waveguide. The output waveguides may be formed in the first layer and may have the first effective index n1. Each of the output ports may be optically coupled to a corresponding output waveguide. The first auxiliary waveguide may be formed in a second layer below the input waveguide in the first layer. The first auxiliary waveguide may have a second effective index n2 and may have two tapered ends, and n2 may be higher than n1.

Abstract: A transimpedance amplifier and photodiode that has a bias voltage node established at a bias voltage and a ground node/plane that connects, over a short distance as compared to the prior art, to a photodiode and a transimpedance amplifier. The photodiode is in a substrate and configured to receive and convert an optical signal to an electrical current. The photodiode has an anode terminal and a cathode terminal which is connected to the bias voltage node. One or more capacitors in or on the substrate and connected between the bias node and the ground node. The transimpedance amplifier has an input connected to the anode terminal of the photodiode and an output that presents a voltage representing the optical signal to an output path. The transimpedance amplifier and the photodiode are both electrically connected in a flip chip configuration and the ground plane creates a coplanar waveguide.

Abstract: Improvements in extinguishing optical signals in silicon photonics may be achieved by supplying a test signal of a known characteristics to a Photonic Element (PE) to extinguish the test signal via a first phase shifter and intensity modulator on a first arm of the PE and a second phase shifter and intensity modulator on a second arm of the PE; sweeping through a plurality of voltages at the first intensity modulator to identify a first voltage that is associated with an extinction ratio at an output of the PE that satisfies an induced loss threshold and a second voltage that is associated with an induced loss in the test signal at the output of the PE that satisfies an extinction ratio threshold; and setting the PE to provide an operational voltage to the first intensity modulator based on the first voltage and the second voltage.

Abstract: An optical detector system comprises a hermetic optoelectronic package, an optical bench installed within the optoelectronic package, a balanced detector system installed on the optical bench. The balanced detector system includes at least two optical detectors that receive interference signals. An electronic amplifier system installed within the optoelectronic package amplifies an output of at least two optical detectors. Also disclosed is an integrated optical coherence tomography system. Embodiments are provided in which the amplifiers, typically transimpedance amplifiers, are closely integrated with the optical detectors that detect the interference signals from the interferometer. Further embodiments are provided in which the interferometer but also preferably its detectors are integrated together on a common optical bench. Systems that have little or no optical fiber can thus be implemented.

Abstract: An optical connector for optical coupling a plurality of optical fibers to a photonic integrated circuit (PIC) comprises a plurality of fiber trenches; a plurality of tiled flat mirrors; and a plurality of optical focusing elements; wherein each of the plurality of fiber trenches adjoins a corresponding titled flat mirror of the plurality of titled flat mirrors; and wherein each of the plurality of titled flat mirrors is placed in proximity to a corresponding optical focusing element of the plurality of optical focusing elements.

Abstract: The objective of the present invention is to provide an optical modulator adapted for use with various modulating units and various modulation regions, and with which variability in optical losses is limited as far as possible.

Abstract: Embodiments herein describe a photonic chip which includes a coupling interface for evanescently coupling the chip to a waveguide on an external substrate. In one embodiment, the photonic chip includes a tapered waveguide that aligns with a tapered waveguide on the external substrate. The respective tapers of the two waveguides are inverted such that as the width of the waveguide in the photonic chip decreases, the width of the waveguide on the external substrate increases. In one embodiment, these two waveguides form an adiabatic structure where the optical signal transfers between the waveguides with minimal or no coupling of the optical signal to other non-intended modes. Using the two waveguides, optical signals can be transmitted between the photonic chip and the external substrate.

Abstract: A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.

Abstract: A semiconductor apparatus that comprises a package, an active device, and a passive device is disclosed. The package includes a metal base, a shell, and a lid. The active device is mounted of the metal base. The passive device is soldered on the metal base. The passive device includes an insulating substrate with a rectangular outer shape and a bottom electrode with a plane shape reflecting the rectangular outer shape of the insulating substrate. The insulating substrate is made of material with brittleness greater than that of the metal base. A feature of the invention is that the bottom electrode has cut corners.

Abstract: A 3D imaging optoelectronic module intended to be fixed to an image-forming device comprises: an optoelectronic sensor comprising a package with a chip electrically connected to a stack of at least one printed circuit board, the sensor and stack assembly molded in a resin and having faces according to Z with electrical interconnection tracks of the printed circuit boards. It comprises a thermally conductive rigid cradle in the form of a frame having a reference surface according to X, Y and: on a top surface: reference points intended to center and align the image-forming device in relation to the reference surface, fixing points to allow the fixing of the image-forming device, and an inner bearing surface having bearing points of the sensor adjusted to center and align the chip in relation to the reference surface.

Abstract: Multilevel leaky-mode optical elements, including reflectors, polarizers, and beamsplitters. Some of the elements have a plurality of spatially modulated periodic layers coupled to a substrate. For infrared applications, the optical elements may have a bandwidth larger than 600 nanometers.

Abstract: A photonic chip comprising a light guiding layer supported by a substrate and covered with an encapsulation layer. The chip has a front face on the side of the encapsulation layer and a back face on the side of the substrate. The light guiding layer includes a light guiding structure optically coupled to a vertical coupler configured to receive light from the waveguide and to form a light beam directed towards either the front face or the back face. The chip also comprises a collimation structure formed at least partly in the light guiding layer and an arrangement of one or several reflecting structures each on either the front face or on the back face. This arrangement is made so as to assure propagation of light between the vertical coupler and the collimation structure along an optical path with at least one fold.

Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.

Abstract: A containing device for affixing a plurality of optical transceivers is provided, wherein each of the optical transceivers includes a first surface and a second surface opposite to the first surface. The containing device includes a housing and a passage formed in the housing. The passage has a first abutting surface and a second abutting surface. The optical transceivers are disposed in the passage. When the containing device moves along a first direction relative to the optical transceivers, the first abutting surface contacts the first surfaces of the optical transceivers. When the containing device moves along a second direction relative to the optical transceivers, the second abutting surface contacts the second surfaces of the optical transceivers, wherein the first direction is opposite to the second direction.

Abstract: The invention provides a device comprising a movable micromirror adapted to receive light from one or more light source(s) and manipulate the reflected light. The micromirror can be actuated electrothermally. In particular, the micromirror is adapted to do at least one of: (a) tipping along a first axis; (b) tilting along a second axis; (c) changing focal length (i.e., varifocal mode); and (d) elevating (i.e., piston mode). The invention also provides a system comprising at least one device comprising a movable micromirror and at least one light source. The invention can be used in smart lighting applications.

Abstract: Disclosed herein are OLED devices comprising waveguides including at least one waveguide layer comprising at least one inorganic nanoparticle and at least one binder and having an RMS surface roughness of less than about 20 nm. Lighting and display devices comprising such OLED devices are further disclosed herein as well as methods for making the waveguides.

Abstract: An optical module includes a lens sheet having at least one lens on one surface thereof, a substrate having at least one of a light emitter or a light receiver on one surface thereof, and an adhesive film configured to bond the lens sheet to the substrate, wherein a protrusion is formed on the lens sheet so as to surround the lens.

Abstract: A high-frequency optoelectronic module, that includes a first chip, a substrate and at least one optoelectronic unit. The first chip includes a set of high-frequency electrical IO interfaces. The at least one optoelectronic unit includes a group of high-frequency electrical IO interfaces and a group of high-frequency optical IO interfaces. The group of high-frequency optical IO interfaces is coupled to the group of high-frequency electrical IO interfaces. The substrate is coupled to the first chip and the at least one optoelectronic chip. The set of high-frequency electrical IO interfaces is coupled to the group of high-frequency electrical IO interfaces via a group of conductors. A length of each conductor of the group of conductors is of a scale that does not exceed a millimetric scale.

Abstract: An optical module includes a substrate on which an optical waveguide is provided; a housing that houses the substrate and includes a through path arranged on a side wall of the housing so as to extend in a direction that crosses the optical waveguide; a ferrule that houses an end portion of an optical fiber; and an optical path conversion element that is fixed on the ferrule, that is fixed on an end surface of the substrate on the end portion side of the optical waveguide, and that has a size smaller than a width of the substrate and a width of the ferrule along a longitudinal direction of the substrate. The end portion of the optical waveguide is arranged at a position close to the through path of the housing relative to a central portion in a width direction of the substrate.

Abstract: It is provided a circuit assembly, comprising at least one electronic circuit; at least one optical waveguide, wherein the core and the cladding of the optical waveguide are formed of an amorphous material; at least one carrier on which the optical waveguide is arranged; and at least one electro-optically active material layer electrically connected to the electronic circuit. The at least one electro-optically active material layer at least partially extends in the optical waveguide and the electrical connection between the electronic circuit and the at least one electro-optically active material layer is produced in that at least one electrical contact extends from the electronic circuit through at least one section of the cladding of the optical waveguide to the at least one electro-optically active material layer or is connected to a section of the electro-optically active material layer, which protrudes from the cladding of the optical waveguide.

Abstract: An optical modulator includes: an optical modulator chip having an optical waveguide having a bent waveguide portion that is bent between a light input end portion and a light output end portion, a bias electrode provided between the light input end portion and the bent waveguide portion along the optical waveguide, and a signal electrode provided between the bent waveguide portion and the light output end portion along the optical waveguide; a bias input terminal configured to input a bias voltage, the bias input terminal being electrically connected to the bias electrode, and a signal input terminal configured to input an electric signal, the signal input terminal being provided closer to a receiver configured to receive an electric signal than the bias input terminal and being electrically connected to the signal electrode.

Abstract: An arrayed waveguide grating based hybrid integrated laser has an adjustable external cavity. The waveguide includes a semiconductor gain die and an optical waveguide chip. The optical waveguide chip includes an arrayed waveguide grating and an arrayed waveguide reflection-controllable component. A resonant cavity is formed by the output end reflection-controllable arrayed waveguide grating chip and the semiconductor gain die. An output wavelength of the laser can be adjusted by changing a driving condition of the reflection-controllable component. The output wavelength is determined by a center wavelength of each channel of the arrayed waveguide grating.