Abstract: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.

Abstract: An apparatus for light diffraction and an organic light emitting diode (OLED) incorporating the light diffraction apparatus is disclosed. An apparatus for light diffraction may comprise an optional planarization layer, a transparent substrate, a waveguide layer. The planarization layer may have a refractive index of ns. The transparent substrate may have a refractive index of ng. The waveguide layer may have a refractive index nw distributed over of the transparent substrate. The waveguide layer may comprise a binding matrix, at least one nanoparticle. The waveguide layer may be interposed between the transparent substrate and the optional planarization layer.

Abstract: An optical integrated device includes a substrate a passive waveguide region and an active region. The active region and the passive waveguide region include a first mesa structure having an upper cladding portion formed of a same material as the upper cladding layer. The passive waveguide region includes a second spot size converter having the first mesa structure, a second mesa structure having a first core portion, a lower cladding portion, and a second core portion that are formed of same materials as the first core layer, the lower cladding layer, and the second core layer, respectively. The second mesa structure has a width wider than a width of the first mesa structure, and the width of the first mesa structure continuously changes along a longitudinal direction in which light is guided through the second core portion, the width being along a direction perpendicular to the longitudinal direction.

Abstract: A waveguide coupler includes a first waveguide and a second waveguide. The waveguide coupler also includes a connecting waveguide disposed between the first waveguide and the second waveguide. The connecting waveguide includes a first material having a first index of refraction and a second material having a second index of refraction higher than the first index of refraction.

Abstract: Provided are a coherent optical receiver and a fabrication method thereof, the coherent optical receiver including a substrate, signal and local input waveguides extending in a first direction parallel to a top surface of the substrate and configured to receive an optical signal, a first optical circuit element including a first optical waveguide connected to the signal input waveguide and a trench provided in one side of the first optical waveguide in parallel to the first direction, a second optical circuit element including a second optical waveguide connected to the first optical waveguide, a slit crossing the second optical waveguide, and a wavelength plate inserted to the slit, and third optical circuit elements connected to the second optical circuit element, wherein the first to third optical circuit elements are monolithically integrated in the substrate.

Abstract: An exemplary embodiment of the invention relates to an optical connector comprising a wave-guiding element and a lens device configured to transmit radiation between the wave-guiding element and at least one optical port of the connector, wherein the lens device comprises a first outer surface and a second outer surface opposite the first outer surface, wherein the first outer surface is connected to the wave-guiding element and forms at least one lens, and wherein a section of the second outer surface opposite said at least one lens forms said at least one optical port of the connector.

Abstract: A carrier substrate includes a first network of electrical connections and recess. An electronic chip is mounted to the carrier substrate within the recess. The electronic chip includes an integrated guide of optical waves and a second network of electrical connections. A end section of an elongate optical cable is mounted on one side of the electronic chip with a longitudinal guide of optical waves optically coupled to the integrated guide of optical waves. Electrical connection elements are interposed between a face of the electronic chip and a bottom wall of the recess, such that first connect pads of the first electrical connection network are connected to second connect pads of the second electrical connection network through the electrical connection elements.

Abstract: Structures for a polarization splitter and methods of fabricating a structure for a polarization splitter. First and second waveguide cores of the polarization splitter are located adjacent to each other in a coupling region. A third waveguide core is located over the second waveguide core in the coupling region. The third waveguide core is composed of a material having a variable refractive index.

Abstract: An integrated differential Electro-Absorption Modulator (EAM) device. The device includes a substrate, an electrical driver, and two EAM modules. The electrical driver circuit is configured overlying the substrate member and has one output electrically coupled to the first EAM module and the other output electrically coupled to the second EAM module. The first and second EAM modules have a first and a second output, respectively. A beam splitter can be configured to split an optical input into two optical outputs, each of which can be optically coupled to the optical inputs of the first and second EAM modules.

Abstract: A semiconductor module includes a photonic integrated circuit and a receptacle. The photonic integrated circuit includes a substrate, a waveguide disposed on the substrate, and a recess in the substrate and having a first width. The receptacle is bonded to a top surface of the substrate and aligning with the recess. The receptacle and the recess jointly form a cavity, and the receptacle has a second width greater than the first width. A method for manufacturing the semiconductor module is also disclosed.

Abstract: An apparatus comprises a substrate having a plateau region and a trench region, a metal layer over the plateau region, a semiconductor component over the trench region, wherein a gap is between the plateau region and the semiconductor component, an adhesion promoter layer over the plateau region, the semiconductor component and the gap, a dielectric layer over the adhesion promoter layer and a bonding interface formed between the adhesion promoter layer and the dielectric layer, wherein the bonding interface comprises a chemical structure comprising a first dielectric material of the adhesion promoter layer and a second dielectric material of the dielectric layer.

Abstract: A silicon modulator where the doping profile varies along the lateral and/or longitudinal position in the transition zones to achieve improved performance in terms of either optical attenuation or contact access resistance or both. A silicon-based modulator includes a waveguide core that is a PN junction region; a first transition zone that is a P-side region adjacent to the waveguide core and a first electrode; and a second transition zone that is an N-side region adjacent to the waveguide core on an opposite side as the first transition region and a second electrode; wherein a thickness of each of the first transition zone and the second transition zone is variable in any of a lateral direction, a longitudinal direction, and both the lateral direction and the longitudinal direction, each of the lateral direction and the longitudinal direction are relative to the waveguide core.

Abstract: Integrated circuits, wafer level integrated III-V device and CMOS driver device packages, and methods for fabricating products with integrated III-V devices and silicon-based driver devices are provided. In an embodiment, an integrated circuit includes a semiconductor substrate, a plurality of transistors overlying the semiconductor substrate, and an interlayer dielectric layer overlying the plurality of transistors with a metallization layer disposed within the interlayer dielectric layer. The plurality of transistors and the metallization layer form a gate driver circuit. The integrated circuit further includes a plurality of vias disposed through the interlayer dielectric layer, a gate driver electrode coupled to the gate driver circuit, a III-V device electrode overlying and coupled to the gate driver electrode, and a III-V device overlying and coupled to the III-V device electrode.

Abstract: In one embodiment an optoelectronic system can include a photonics interposer having a substrate and a functional interposer structure formed on the substrate, a plurality of through vias carrying electrical signals extending through the substrate and the functional interposer structure, and a plurality of wires carrying signals to different areas of the functional interposer structure. The system can further include one or more photonics device integrally formed in the functional interposer structure, and one or more prefabricated component attached to the functional interposer structure.

Abstract: A semiconductor integrated optical device includes a waveguide mesa having a first multilayer including a first core layer, a second multilayer including a second core layer, and a butt joint interface between the first core layer and the second core layer; a support having first to third regions; and a buried semiconductor region provided on the support. The first multilayer has a first mesa width on the first region. The second multilayer has a second mesa width on the second region. On the third region, the second multilayer has a waveguide portion having a third mesa width smaller than the first and the second mesa widths. The second core layer has a waveguide core thickness on the second region. In the waveguide portion, the second core layer has a core portion having a thickness different from the waveguide core thickness at a position away from the butt-joint interface.

Abstract: A light-emitting device having an upper surface, a lower surface opposite to the upper surface, and a first lateral surface, the upper surface serving as a light-emitting surface, the first lateral surface being adjacent and orthogonal to the upper surface, the first lateral surface serving as a mounting surface, the light-emitting device including: a pair of a first metal films disposed at the lower surface; and a pair of second metal films disposed at the first lateral surface; wherein an area of each of the second metal films is larger than an area of each of the first metal films.

Abstract: The present invention relates to a method to fabricate a tamper respondent assembly. The tamper respondent assembly includes an electronic component and an enclosure fully enclosing the electronic component. The method includes printing, by a 3-dimensional printer, a printed circuit board that forms a bottom part of the enclosure and includes a first set of embedded detection lines for detecting tampering events and signal lines for transferring signals between the electronic component and an external device. The electronic component is assembled on the printed circuit board, and a cover part of the enclosure is printed on the printed circuit board. The cover part includes a second set of embedded detection lines. Sensing circuitry can be provided for sensing the conductance of the first set of embedded detection lines and the second set of embedded detection lines to detect tampering events.

Abstract: A photoelectric conversion module includes a circuit board; a photoelectric conversion element mounted on a first main surface of the circuit board; and an optical lens provided in an optical path between an end surface of an optical fiber and the photoelectric conversion element, wherein a part of the optical lens is inserted in a recessed portion formed in the first main surface of the circuit board.

Abstract: The present disclosure is generally directed to an optical transceiver that includes a multi-channel on-board ROSA arrangement that includes an optical demultiplexer, e.g., an arrayed waveguide grating (AWG) and an array of photodiodes disposed on a same substrate. The array of photodiodes may be optically aligned with an output port of the optical demultiplexer and be configured to detect channel wavelengths and output a proportional electrical signal to an amplification circuit, e.g., a transimpedance amplifier. Each of the photodiodes can include an integrated lens configured to increase the alignment tolerance between the demultiplexer and the light sensitive region such that relatively imprecise bonding techniques, e.g., die bonding, may be utilized while still maintaining nominal optical power.

Abstract: Disclosed herein are a photonic integrated circuit (PIC) including an edge coupler (EC) and method thereof. In some embodiments, the EC is optically coupled to a first waveguide at an inner end of the EC. In some embodiments, the PIC is in contact with an optical fiber at an outer end of the EC. The EC may include a plurality of waveguide cores located on a plurality of waveguide layers. The waveguide cores of the plurality of waveguide cores are located apart from each other and configured to adapt a mode size of a beam of light between a larger mode size at the outer end of the EC and a smaller mode size at the inner end of the EC.

Abstract: A lighting device includes a first light source unit having a first light source row made up of a plurality of light sources, and a first light source board, onto which the light sources making up the first light source row are mounted, a second light source unit having a second light source row made up of a plurality of light sources, and a second light source board, onto which the light sources making up the second light source row are mounted, and a light guide plate having a plate-like shape and having a first light-incident face where light emitted from the light sources is incident, and a second light-incident face disposed on an opposite side from the first light-incident face where light emitted from the light sources is incident.

Abstract: Provided is an optical module including an optical waveguide device through which multiple channel lightwaves are input and output, an optical transmission/reception unit disposed on one side of the optical waveguide device, an electronic IC disposed on one side of the optical transmission/reception unit and configured to drive the optical transmission/reception unit, a flexible printed circuit board (PCB) disposed on the optical transmission/reception unit and the electronic IC, a first solder ball between the optical transmission/reception unit and the flexible PCB and a second solder ball between the electronic IC and the flexible PCB.

Abstract: An optical waveguide is formed on a support member. A second cladding layer is formed on a surface of a first cladding layer so as to cover a core layer. An opening is opened at the second cladding layer-side, penetrates the second cladding layer and the core layer, and closed at the first cladding layer-side. The opening has a first surface and a second surface ranging from the opened side to the closed side. In a vertical section taken along a longitudinal direction of the core layer, a first angle between a perpendicular line drawn from an opening end of the first surface to the surface of the first cladding layer and the first surface, and a second angle between a perpendicular line drawn from an opening end of the second surface to the surface of the first cladding layer and the second surface are all acute angles.

Abstract: A method for manufacturing a waveguide aperture to block stray light from a facet of an integrated optical device include obtaining a wafer with one or more integrated optical devices formed thereon and with a cleaved facet; positioning a mask in front of the cleaved facet, thereby masking at least a portion of the waveguide aperture of at least one the one or more integrated optical devices; and applying a light-blocking coating to the cleaved facet with the mask masking the portion of each of the one or more integrated optical devices.

Abstract: Devices, systems, and methods for providing wireless personal area networks (PANs) and local area networks (LANs) using visible and near-visible optical spectrum. Various constructions and material selections are provided herein. According to one embodiment, a light-emitting diode (LED) includes a substrate, a carrier confinement (CC) region positioned over the substrate, and an active region position over the CC region. The CC region includes a first CC layer comprising aluminum gallium nitride and a second CC layer position over the first CC layer. The second CC layer also includes aluminum gallium nitride. The active region is configured to have a transient response time of less than 500 picoseconds (ps).

Abstract: An optical waveguide mounting substrate includes a wiring substrate, and an optical waveguide mounted on the wiring substrate with an adhesive layer being interposed therebetween. The optical waveguide includes a first cladding layer, a core layer formed on a surface of the first cladding layer facing toward the wiring substrate, and a second cladding layer formed on the surface of the first cladding layer facing toward the wiring substrate so as to cover a periphery of the core layer. An opening is opened on the second cladding layer-side, penetrating the second cladding layer and the core layer, and closed on the first cladding layer-side, and a metal film is provided on an end face of the core layer in the opening. The second cladding layer faces the wiring substrate via the adhesive layer. A part of the adhesive layer is filled in the opening.

Abstract: A mini light emitting diode (LED) backlight and a method of manufacturing the same are disclosed. The mini LED backlight includes a backboard and a plurality of rectangular light boards provided with a plurality of mini LEDs arranged in an array, and the plurality of light boards are arranged in an array and spliced on the backboard. A seam is provided between two of the light boards adjacent to each other, and the backboard is provided with a plurality of grooves corresponding to the seams, and the plurality of seams and the plurality of grooves are filled with a cured adhesive. The method of manufacturing the corresponding mini LED backlight is further provided. The mini LED backlight and the method of manufacturing the same are capable of effectively improving the problem about dark lines between the light boards of the mini LED backlight.

Abstract: A device having a reinforcement layer and a method for producing a device are disclosed. In an embodiment a device includes a carrier plate, an electronic component, a shaped body and a reinforcement layer, wherein the electronic component is laterally enclosed by the shaped body, wherein, in a vertical direction, the electronic component is arranged between the carrier plate and the reinforcement layer, wherein the shaped body has a thermal expansion coefficient which is at least three times as large as a thermal expansion coefficient of the carrier plate and at least three times as large as a thermal expansion coefficient of the reinforcement layer, and wherein the carrier plate and the reinforcement layer adjoin the shaped body at least in places and are configured to reduce deformation of the shaped body in an event of temperature fluctuations.

Abstract: A system including optical devices is provided. The system includes a first substrate and a first device for optical communication. The first device has a first surface, a second surface opposite to the first surface, and a first side contiguous with the first surface and the second surface. Moreover, the first side is smaller than one of the first surface and the second surface in terms of area. The first device is attached at the first side thereof to the first substrate.

Abstract: Disclosed is an optical interconnection device that includes an alignment ferrule assembly formed from an alignment substrate and optical fibers. The optical interconnection device also has an alignment assembly formed by a planar support member with guide features. A receiving region resides between the guide features in which the alignment substrate is secured. An evanescent optical coupler can be formed using the optical interconnection device as a first device and another optical interconnection device as a second device. The second device is constituted by a planar lightwave circuit that operably supports waveguides and an adapter. The adapter of the second device is configured to engage the alignment assembly of the first device to place the optical fibers and the optical waveguides of the respective devices in evanescent optical communication.

Abstract: An integrated compact light engine configured in a on-board in-package optics assembly. The compact light engine includes a single substrate to integrate multiple optical-electrical modules. Each optical-electrical module includes an integrated optical transceiver based on silicon-photonics platform, in which a transmit path configured to output four light signals centered at four CWDM wavelengths and from four laser devices and to modulate the four light signals respectively by four modulators driven by a driver chip and to deliver a multiplexed transmission light. A receive path includes a photodetector to detect four input signals demultiplexed from an incoming light and a trans-impedance amplifier chip to process electrical signals converted from the four input signals detected. A multi-channel light engine is formed by co-integrating or co-mounting a switch device with multiple compact light engines on a common substrate member to provide up to 51.

Abstract: Example methods, devices, and systems for optical transmission are disclosed. An example method can comprise coupling a plurality of optical filters to a substrate. The method can comprise coupling a polymeric waveguide to the plurality of optical filters. The polymeric waveguide can be configured to guide a free space optical signal along the polymeric waveguide and communicate, via the plurality of optical filters, one or more components of the free optical space signal to an integrated chip.

Abstract: A multi-channel receiver optical sub assembly module for a fiber Bragg grating sensor according to an embodiment of the present invention includes a housing, a connection socket, an optical bench, a thermoelectric cooler, an arrayed waveguide grating chip, a photodiode array disposed on the optical bench and including a plurality of photodiode chips connected to the optical channels of the arrayed waveguide grating chip, and a printed circuit board which is connected to the other side of the housing while passing through the other side of the housing, of which a portion of a body is disposed on the optical bench, and which is connected to the photodiode array.

Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

Abstract: An electro-optical package. In some embodiments, the package includes an electronic integrated circuit module, a first electro-optical component, and a photonic integrated circuit. The first electro-optical component may be in a top surface of the photonic integrated circuit. The electronic integrated circuit module may have a top surface facing toward and overlapping both a portion of the first electro-optical component, and a portion of the photonic integrated circuit.

Abstract: Cable/line systems and related methods are provided. The cable/line systems include at least one central cable and an optical waveguide surrounding the cable. The optical waveguide includes an inner cladding, a core, and an outer cladding. Scattering structures are dispersed within the optical waveguide. The optical waveguide is configured to scatter light by way of the scattering structures away from the core to emit radial lighting along the length of the optical waveguide. The spectrum and/or luminance of the emitted light is controlled according to properties of the cable/line.

Abstract: A light source device includes a sub-mount, a semiconductor laser element flip chip mounted on the sub-mount, and a planar lightwave circuit (PLC) which is an optical member having a waveguide disposed on a substrate. The semiconductor laser element and the waveguide are arranged such that a light-emitting point of the semiconductor laser element and a core of the waveguide are substantially aligned. A light-reflecting surface is provided such that light emitted from the semiconductor laser element and propagating along a propagating direction in the planar lightwave circuit is reflected at the light-reflecting surface in a direction substantially normal to the propagating direction. A portion of the substrate of the planar lightwave circuit is removed at least in a predetermined range from an end opposite to a light incident surface of the planar lightwave circuit.

Abstract: Examples are disclosed that relate to producing a viewable image using a plurality of individually-addressable vertical cavity surface emitting lasers (VCSELs) arranged into an array. In one example, a display system comprises a light source comprising a plurality of VCSELs arranged into an array comprising one or more first color rows of VCSELs configured to produce a first color, one or more second color rows of VCSELs configured to produce a second color, and one or more third color rows of VCSELs configured to produce a third color. Each VCSEL in a given row has a coordinate that is staggered relative to a coordinate of each of the VCSELs in one or more rows adjacent to the given row. The display system also comprises a scanning system to direct light from at least a portion of the plurality of VCSELs to produce a viewable image.

Abstract: A fiber optic element of a fiber scanning system includes a motion actuator having longitudinal side members, an internal orifice, a first support region, a central region, and a second support region. The fiber optic element also includes a first fiber optic cable passing through the internal orifice and having a first fiber joint as well as a second fiber optic cable passing through the internal orifice. The second fiber optic cable has a second fiber joint disposed in the central region and spliced to the first fiber joint, a second coupling region, a light delivery region, and a light emission tip. The light delivery region is characterized by a first diameter and the light emission tip is characterized by a second diameter less than the first diameter.

Abstract: An optoelectronic apparatus is presented. In embodiments, the apparatus may include a package including a substrate with a first side and a second side opposite the first side, wherein the first side comprises a ball grid array (BGA) field. The apparatus may further include one or more integrated circuits (ICs) disposed on the first side of the substrate, inside the BGA field, that thermally interface with a printed circuit board (PCB), to which the package is to be coupled, one or more optical ICs coupled to the second side and communicatively coupled with the one or more ICs via interconnects provided in the substrate, wherein at least one of the optical ICs is at least partially covered by an integrated heat spreader (IHS), to provide dissipation of heat produced by the at least one optical IC.

Abstract: A multi-beam optical phased array on a single planar waveguide layer or a small number of planar waveguide layers enables building an optical sensor that performs much like a significantly larger telescope. Imaging systems use planar waveguides created using micro-lithographic techniques. These imagers are variants of “phased arrays,” common and familiar from microwave radar applications. However, there are significant differences when these same concepts are applied to visible and infrared light.

Abstract: An optoelectronic circuit having a substantially planar double-sided substrate, each side of which has a respective plurality of electrically conducting tracks and a respective plurality of planar optical waveguides. The substrate also has at least one via crossing the substrate in a manner that can be used to establish an optical path across the substrate, e.g., between optical waveguides located on different sides thereof. In an example embodiment, the electrically conducting tracks and planar optical waveguides are configured to operatively connect various optoelectronic devices and auxiliary electrical circuits attached to the two sides of the substrate using hybrid-integration technologies. In some embodiments, two or more of such double-sided substrates can be stacked and optically and electrically interconnected to create an integrated three-dimensional assembly.

Abstract: A photonic interconnect switch is formed by first and second linear optical waveguides that cross to form an intersection. First and second redirecting photonic ring resonators are coupled together in an intermediate optical coupling zone and are controllable with an electrical signal. The first ring resonator is coupled to the first optical waveguide in a first optical coupling zone. The second ring resonator is coupled to the second optical waveguide in a second optical coupling zone.

Abstract: A mobile terminal including a display panel; a front window provided on a front surface of the display panel; and a plurality of micro-holes in the front window arranged in an array pattern and spaced a preset distance apart from an outer edge area of the front window.

Abstract: A method for fabricating a light receiving device includes: preparing a first substrate product which includes a semiconductor region having a common semiconductor layer, a first semiconductor laminate for a photodiode, a second semiconductor laminate for a waveguide, and a butt-joint between the first semiconductor laminate and the second semiconductor laminate, the first laminate and the second semiconductor laminate being disposed on the common semiconductor layer; etching the first substrate product with a first mask to form a second substrate product having a photodiode mesa structure produced from the first semiconductor laminate and a preliminary mesa structure produced from the second semiconductor laminate; etching the second substrate product with the first mask and a second mask, formed on the photodiode mesa structure; to produce a waveguide mesa structure from the preliminary mesa structure, and the waveguide mesa structure having a height larger than that of the preliminary mesa structure.

Abstract: A ridge waveguide (10) according to the present invention includes a ridge part (11), the ridge part (11) being in contact with both a side (14) in a long-side direction and a side (15) in a short-side direction in a cross-sectional shape of the ridge waveguide. Further, an array antenna apparatus according to the present invention includes a feeder circuit formed by a ridge waveguide (10) including a ridge part (11), the ridge part (11) being in contact with both a side (14) in a long-side direction and a side (15) in a short-side direction in a cross-sectional shape of the ridge waveguide. In this way, it is possible to provide a ridge waveguide that can be easily manufactured.

Abstract: An integrated compact light engine configured in a on-board in-package optics assembly. The compact light engine includes a single substrate to integrate multiple optical-electrical modules. Each optical-electrical module includes an integrated optical transceiver based on silicon-photonics platform, in which a transmit path configured to output four light signals centered at four CWDM wavelengths and from four laser devices and to modulate the four light signals respectively by four modulators driven by a driver chipand to deliver a multiplexed transmission light. A receive path includes a photodetector to detect four input signals demultiplexed from an incoming light and a trans-impedance amplifier chip to process electrical signals converted from the four input signals detected. A multi-channel light engine is formed by co-integrating or co-mounting a switch device with multiple compact light engines on a common substrate member to provide up to 51.

Abstract: An electromagnetic (EM) energy conversion and measurement system and related methods are provided for converting a first EM energy (e.g., infrared) to a second EM energy (e.g., visible light) having at least a different wavelength or frequency than the first EM energy then using a detector to detect or measure the second EM energy. An array of conversion and detector assemblies each include a first section and a second section. Exemplary first sections can include at least one optical grade substrate formed with a first material (e.g., germanium) having a first index of refraction that refracts a first EM energy so as to change a frequency and propagation time of the first EM energy to produce a second EM energy. Exemplary second sections include an EM energy detector having an index of refraction that is the same as the first material.

Abstract: The present invention is directed to a communication signal tracking system comprising an optical receiver including one or more delay line interferometers (DLIs) configured to demultiplex incoming optical signals and a transimpedance amplifier configured to convert the incoming optical signals to incoming electrical signals. The communication signal tracking system further includes a control module configured to calculate a bit-error-rate (BER) of the incoming electrical signals before forward-error correction decoding, and use the BER as a parameter for optimizing settings of the one or more DLIs in one or more iterations in a control loop and generating a back-channel data.

Abstract: An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer/deserializer circuits, transceivers, clocking circuitry, and/or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electrically connected to the integrated switch ASIC.